Anti-slip chip mounting device for integrated circuit manufacturing

Abstract

The invention discloses an anti-slip surface mounting device for integrated circuit manufacturing, and relates to the technical field of integrated circuit production and processing, the anti-slip surface mounting device comprises a device base, the top of the device base is fixedly provided with an element migration device and an element box, and the top edge of the device base is provided with an operation groove; an operation groove is formed in the device base, anti-sliding devices are fixedly installed on the two sides of the inner wall of the operation groove, a first motor is fixedly installed on the outer surface of the device base through a support, an integrated circuit adsorption device is fixedly installed at the bottom of the device base, and the integrated circuit adsorption device penetrates through the device base and extends into the operation groove. According to the anti-slip chip mounting device for manufacturing the integrated circuit, by arranging the anti-slip device, after chip mounting is completed and the integrated circuit adsorption device is closed, the integrated circuit continues to be kept in the top groove of the anti-slip device, and the purpose of preventing the integrated circuit from falling off is achieved.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, specifically to a non-slip integrated circuit mounting device. Background Technology

[0002] With the continuous development of technology, integrated circuits are being used more and more frequently. From small items like mobile phones and computers to large items like excavators and production lines, integrated circuits are needed everywhere. Because of the increasing market demand for integrated circuits, more and more integrated circuit manufacturing instruments have been developed. In the process of integrated circuit manufacturing, the surface mounting of integrated circuits is also an indispensable step.

[0003] Currently available integrated circuit manufacturing surface mount equipment can mount electronic components onto integrated circuits. However, after mounting, the integrated circuit board may occasionally slip off the loosened integrated circuit board fixing device, resulting in mounting failure and seriously affecting work efficiency. Summary of the Invention

[0004] To achieve the above objectives, the present invention provides the following technical solution: a non-slip integrated circuit (IC) mounting device, comprising a base, a component transfer device and a component box fixedly mounted on the top of the base, a working groove formed at the top edge of the base, the component box and the working groove being located below the component transfer device, the component box being located at the edge of the working groove, anti-slip devices fixedly mounted on both sides of the inner wall of the working groove, a first motor fixedly mounted on the corner of the outer surface of the base via a bracket, an IC adsorption device fixedly mounted at the bottom of the base, the IC adsorption device penetrating the base and extending into the working groove, the IC adsorption device being located below the anti-slip devices, and support feet fixedly mounted at the four corners of the bottom of the base. The operator adjusts the gap between the anti-slip devices to suit the size of the IC to be mounted, and opens the IC adsorption device to adsorb the IC onto its top. By setting the anti-slip devices, after mounting is completed, closing the IC adsorption device will keep the IC within the groove at the top of the anti-slip device, thus preventing the IC from falling off.

[0005] Preferably, the component migration device includes a first optical rod, a first lead screw, and a second motor. Fixers are fixedly installed at both ends of the first optical rod. The bottom of the fixers is fixedly installed at the four corners of the top of the device base. The two ends of the first lead screw are rotatably installed between the fixers, and one end of the first lead screw passes through the fixer and extends to its other side to be fixedly connected to the output end of the first motor. The first lead screw is arranged parallel to the first optical rod.

[0006] Preferably, a first support column is slidably mounted on the outer surface of the first optical rod, and a second support column is drivenly mounted on the outer surface of the first lead screw, with the second support column parallel to the first support column. The second motor is fixedly mounted on the side of the second support column away from the first support column via a bracket. A second lead screw is rotatably mounted between the first and second support columns, with one end of the second lead screw passing through the second support column and extending to its other side, where it is fixedly connected to the output end of the second motor. A component adsorption device is drivenly mounted on the outer surface of the second lead screw. By setting up the component adsorption device, workers can adsorb the electronic components to be installed through the component adsorption device and then move them through the component transfer device, thus transporting the electronic components to the designated location of the integrated circuit.

[0007] Preferably, the component adsorption device includes a first displacement block, a straight rod, and a cylinder. The first displacement block is driven and mounted on the outer surface of a second lead screw. The cylinder is fixedly mounted on the top of the first displacement block via a bracket. The output end of the cylinder is fixedly connected to the top end of the straight rod. The straight rod passes through the first displacement block and extends to its other side. A first fixing block is fixedly mounted on the bottom of the outer surface of the straight rod. An adsorption pen is detachably mounted on the bottom of the first fixing block at the end away from the straight rod, and the adsorption pen passes through the first fixing block and extends to its other side. Through the operation of the cylinder, the adsorption pen can change its vertical position and adsorb electronic components using its adsorption function, thus enabling the installation of electronic components.

[0008] Preferably, the adsorption pen includes a pen body and an adsorption tube. A pen tip is fitted onto the bottom of the outer surface of the pen body. A first spring is fixedly installed at the edge of the bottom of the pen body, and the other end of the first spring is fixedly installed on the bottom of the inner wall of the pen body. The outer surface of the adsorption tube is fixedly connected to the bottom of the pen tip. The adsorption tube passes through the bottom of the pen tip and extends into its inner cavity. An adsorption plate is fixedly installed on the bottom of the outer surface of the adsorption tube. By setting the first spring between the pen tip and the pen body, when the adsorption plate adsorbs electronic components and mounts them onto the surface of the integrated circuit, the pen tip will shift towards the pen tip when the adsorbed electronic components come into contact with the surface of the integrated circuit, thus achieving a buffering effect.

[0009] Preferably, the component box includes a box body, which is fixedly installed at the bottom of the device base. A component storage slot is formed on the upper surface of the box body. A second spring is fixedly installed on the inner wall of the component storage slot. A guide block is fixedly installed at the other end of the second spring. A buffer pad is fixedly installed on the side of the guide block away from the second spring. A box cover is rotatably installed at the edge of the upper surface of the box body via a pivot. A retrieval port is formed on the top of the box cover. By setting up the component box, operators can install multiple electronic components simultaneously, thus saving time in retrieving electronic components.

[0010] Preferably, the anti-slip device includes a second fixing block and a second optical rod. A second displacement block is fixedly installed at the bottom of the second fixing block, and the second displacement block is slidably installed on the outer surface of the second optical rod. Both ends of the second optical rod are fixedly installed on both sides of the inner wall of the working groove. A fixing groove is formed at the top edge of the second fixing block, and anti-slip pads are fixedly installed at the bottom and side walls of the fixing groove. By setting up the anti-slip device, the worker can adjust the anti-slip device to a gap range that matches the size of the integrated circuit to be mounted, and then use the integrated circuit adsorption device to adsorb it, thus preventing electronic components from slipping during the installation process.

[0011] Preferably, the integrated circuit adsorption device includes a miniature air pump, which is fixedly mounted on the bottom of the device base via a bracket. A variable cross-section suction channel is fixedly installed at the output end of the miniature air pump, extending through the device base and into the working slot. A suction cup is fixedly installed at the end of the variable cross-section suction channel away from the miniature air pump. When the worker finishes mounting the integrated circuit, the variable cross-section suction channel slows down the air backflow, thus preventing the integrated circuit from detaching from the top of the suction cup.

[0012] This invention provides a non-slip mounting device for integrated circuit manufacturing. It has the following advantages: (i) The anti-slip integrated circuit manufacturing chip mounting device, by setting an anti-slip device, ensures that after the chip mounting is completed and the integrated circuit adsorption device is turned off, the integrated circuit will continue to remain in the top groove of the anti-slip device, thus achieving the purpose of preventing it from falling off. (ii) The anti-slip integrated circuit manufacturing chip mounting device is equipped with a component adsorption device. The staff can adsorb the electronic components to be installed through the component adsorption device and then move them through the component transfer device. Therefore, the electronic components can be transported to the designated location of the integrated circuit. (III) The anti-slip integrated circuit manufacturing chip mounting device operates through a cylinder, and the adsorption pen can change its position up and down. It can adsorb electronic components through the adsorption function, thus enabling the installation of electronic components. (iv) The anti-slip integrated circuit manufacturing patch device operates by setting a first spring between the pen tip and the pen body. When the adsorption plate adsorbs electronic components and mounts them onto the surface of the integrated circuit, the pen tip will move in the direction of the pen tip when the electronic components adsorbed by the adsorption plate come into contact with the surface of the integrated circuit, thus achieving a buffering effect. (v) The anti-slip integrated circuit manufacturing chip mounting device, by setting up component boxes, allows workers to install multiple electronic components at the same time, thus saving time in retrieving electronic components. (vi) The anti-slip integrated circuit manufacturing chip mounting device, by setting an anti-slip device, allows the worker to adjust the anti-slip device to a gap range that matches the size of the integrated circuit to be mounted, and then use the integrated circuit adsorption device to adsorb it, thus ensuring that electronic components will not slip during the installation process. (vii) When the worker finishes placing the integrated circuit, the anti-slip integrated circuit manufacturing chip mounting device can slow down the air backflow speed by setting a variable cross-section air intake channel, thus achieving the purpose of preventing the integrated circuit from falling off the top of the suction cup. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the anti-slip integrated circuit manufacturing patch assembly according to the present invention; Figure 2 This is a schematic diagram of the overall bottom structure of the present invention; Figure 3 This is a schematic diagram of the component migration device of the present invention; Figure 4 This is a schematic diagram of the adsorption device of the present invention. Figure 5 This is a schematic diagram of the structure of the adsorption pen of the present invention; Figure 6 This is a schematic cross-sectional view of the structure of the adsorption pen of the present invention; Figure 7 This is a schematic diagram of the structural anatomy of the component box of the present invention; Figure 8 This is a schematic diagram of the component box of the present invention; Figure 9 This is a schematic diagram of the structure of the anti-slip device of the present invention; Figure 10 This is a schematic diagram of the anti-slip device of the present invention; Figure 11 This is a schematic diagram of the structural anatomy of the integrated circuit adsorption device of the present invention; Figure 12 This is a schematic diagram of the integrated circuit adsorption device of the present invention; Figure 13 This is a schematic cross-sectional view of the integrated circuit adsorption device of the present invention.

[0014] In the diagram: 1. Device base; 2. Component transfer device; 21. First optical rod; 22. First lead screw; 23. Fixer; 24. First support column; 25. Second support column; 26. Second lead screw; 27. Component adsorption device; 271. First displacement block; 272. Straight rod; 273. First fixing block; 274. Adsorption pen; 2741. Pen body; 2742. Pen tip; 2743. Adsorption tube; 2744. First spring; 2745. Adsorption plate; 275. Cylinder; 28 1. Second motor; 3. Component box; 31. Box body; 32. Component storage slot; 33. Second spring; 34. Guide block; 35. Buffer pad; 36. Box cover; 37. Component retrieval port; 4. Working slot; 5. Anti-slip device; 51. Second fixing block; 52. Second displacement block; 53. Second light rod; 54. Fixing slot; 55. Anti-slip pad; 6. Integrated circuit adsorption device; 61. Miniature air pump; 62. Variable cross-section suction channel; 63. Suction cup; 7. Support foot; 8. First motor. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Please see Figure 1-6This invention provides a technical solution comprising a device base 1, characterized in that: a component migration device 2 and a component box 3 are fixedly installed on the top of the device base 1, the component migration device 2 being used for migrating electronic components, and the component box 3 for placing electronic components and for retrieval during installation; a working groove 4 is provided at the top edge of the device base 1, the component box 3 and the working groove 4 are both located below the component migration device 2, the component box 3 being located at the edge of the working groove 4; anti-slip devices 5 are fixedly installed on both sides of the inner wall of the working groove 4, the anti-slip devices 5 being used to prevent integrated circuits from slipping when placed; a first motor 8 is fixedly installed at the corner of the outer surface of the device base 1 via a bracket; an integrated circuit adsorption device 6 is fixedly installed at the bottom of the device base 1, and the integrated circuit adsorption device 6 penetrates the device base 1 and extends into the working groove 4, the integrated circuit adsorption device 6 being used to adsorb and fix integrated circuit boards, the integrated circuit adsorption device 6 being located below the anti-slip devices 5; and support feet 7 are fixedly installed at the four corners of the bottom of the device base 1. The staff adjusted the gap between the anti-slip devices 5 to fit the size of the integrated circuit to be mounted, and opened the integrated circuit adsorption device 6 to adsorb the integrated circuit on top. By setting the anti-slip devices 5, after the mounting is completed, the integrated circuit will continue to stay in the top groove of the anti-slip devices 5 after the integrated circuit adsorption device 6 is closed, thus achieving the purpose of preventing the integrated circuit from falling off.

[0017] The component migration device 2 includes a first optical rod 21, a first lead screw 22, and a second motor 28. Fixers 23 are fixedly installed at both ends of the first optical rod 21. The bottom of the fixers 23 is fixedly installed at the four corners of the top of the device base 1. The two ends of the first lead screw 22 are rotatably installed between the fixers 23. One end of the first lead screw 22 passes through the fixer 23 and extends to the other side to be fixedly connected to the output end of the first motor 8. The first lead screw 22 is arranged parallel to the first optical rod 21.

[0018] A first support column 24 is slidably mounted on the outer surface of the first guide rod 21. A second support column 25 is drivenly mounted on the outer surface of the first lead screw 22, and the second support column 25 is arranged parallel to the first support column 24. The second motor 28 is fixedly mounted on the side of the second support column 25 away from the first support column 24 via a bracket. A second lead screw 26 is rotatably mounted between the first support column 24 and the second support column 25. One end of the second lead screw 26 passes through the second support column 25 and extends to the other side, where it is fixedly connected to the output end of the second motor 28. A component adsorption device 27 is drivenly mounted on the outer surface of the second lead screw 26. This component adsorption device 27 can install electronic components. By setting up the component adsorption device 27, the operator can adsorb the electronic components to be installed through the component adsorption device 27, and then move them through the component transfer device 2, thus transporting the electronic components to the designated location of the integrated circuit.

[0019] The component adsorption device 27 includes a first displacement block 271, a straight rod 272, and a cylinder 275. The first displacement block 271 is throttle-mounted on the outer surface of a second lead screw 26. The cylinder 275 is fixedly mounted on the top of the first displacement block 271 via a bracket. The output end of the cylinder 275 is fixedly connected to the top end of the straight rod 272. The straight rod 272 passes through the first displacement block 271 and extends to its other side. A first fixing block 273 is fixedly mounted on the bottom of the outer surface of the straight rod 272. An adsorption pen 274 is detachably mounted on the bottom of the first fixing block 273 at the end away from the straight rod 272, and the adsorption pen 274 passes through the first fixing block 273 and extends to its other side. This adsorption pen 274 is used to adsorb electronic components. By operating the cylinder 275, the adsorption pen 274 can change its vertical position and adsorb electronic components through its adsorption function, thus enabling the installation of electronic components.

[0020] The adsorption pen 274 includes a pen body 2741 and an adsorption tube 2743. A pen tip 2742 is fitted onto the bottom of the outer surface of the pen body 2741. A first spring 2744 is fixedly installed at the edge of the bottom of the pen body 2741. The other end of the first spring 2744 is fixedly installed on the bottom of the inner wall of the pen body 2741. The outer surface of the adsorption tube 2743 is fixedly connected to the bottom of the pen tip 2742. The adsorption tube 2743 penetrates the bottom of the pen tip 2742 and extends into its inner cavity. An adsorption plate 2745 is fixedly installed on the bottom of the outer surface of the adsorption tube 2743. The adsorption plate 2745 is used to increase the contact area between the bottom of the adsorption tube 2743 and the electronic components to prevent them from slipping. By setting a first spring 2744 between the pen tip 2742 and the pen body 2741, when the adsorption plate 2745 adsorbs electronic components and mounts them onto the surface of the integrated circuit, the pen tip 2742 will shift in the direction of the pen tip 2742 when the electronic components adsorbed by the adsorption plate 2745 come into contact with the surface of the integrated circuit, thus achieving a buffering effect.

[0021] Please see Figure 7-8 This invention provides a technical solution: the component box 3 includes a box body 31, which is fixedly installed at the bottom of the device base 1. A component storage slot 32 is formed on the upper surface of the box body 31. A second spring 33 is fixedly installed on the inner wall of the component storage slot 32. A guide block 34 is fixedly installed at the other end of the second spring 33. The guide block 34 can continuously push electronic components to one end through the pushing force of the second spring 33. A buffer pad 35 is fixedly installed on the side of the guide block 34 away from the second spring 33. The buffer pad 35 can alleviate the impact force between the guide block 34 and the electronic components. A box cover 36 is rotatably installed at the edge of the upper surface of the box body 31 via a pivot. A retrieval port 37 is formed on the top of the box cover 36 for retrieving electronic components. By setting up the component box 3, operators can install multiple electronic components simultaneously, thus saving time in retrieving electronic components.

[0022] Please see Figure 9-10This invention provides a technical solution: the anti-slip device 5 includes a second fixing block 51 and a second optical rod 53. A second displacement block 52 is fixedly installed at the bottom of the second fixing block 51. The second displacement block 52 is slidably installed on the outer surface of the second optical rod 53. The two ends of the second optical rod 53 are fixedly installed on both sides of the inner wall of the working groove 4. A fixing groove 54 is provided at the top edge of the second fixing block 51. Anti-slip pads 55 are fixedly installed at the bottom and side walls of the fixing groove 54. The anti-slip pads 55 can increase the friction between the electronic components and the anti-slip device 5. By setting the anti-slip device 5, the operator can adjust the anti-slip device 5 to a gap range that matches the size of the integrated circuit to be mounted, and then use the integrated circuit adsorption device 6 to adsorb it. Therefore, the electronic components can be prevented from slipping during the installation process.

[0023] Please see Figure 11-13 This invention provides a technical solution: The miniature air pump 61 is fixedly installed at the bottom of the device base 1 by a bracket. A variable cross-section suction channel 62 is fixedly installed at the output end of the miniature air pump 61. The variable cross-section suction channel 62 passes through the device base 1 and extends into the working groove 4. A suction cup 63 is fixedly installed at the end of the variable cross-section suction channel 62 away from the miniature air pump 61. The suction cup 63 is used to adsorb integrated circuit boards. When the worker finishes mounting the integrated circuit, the variable cross-section suction channel 62 can slow down the air backflow speed, thus preventing the integrated circuit from falling off the top of the suction cup 63.

[0024] In use, the operator places the integrated circuit on top of the suction cup 63 and adjusts the spacing between the second fixing blocks 51 to fit the size of the integrated circuit. The micro air pump 61 is turned on to create a vacuum between the suction cup 63 and the integrated circuit. Then, the power supply of the first motor 8, the second motor 28 and the cylinder 275 is turned on, and the suction pen 274 is turned on. The electronic components placed in the component box 3 are adsorbed and extracted by the component adsorption device 27, and installed in the corresponding position on the integrated circuit board by the component transfer device 2. After the placement is completed, the component transfer device 2 is restored, the power supply of the first motor 8, the second motor 28 and the cylinder 275 is turned off, and air is then injected between the integrated circuit board and the suction cup 63 by the micro air pump 61. The integrated circuit will then fall into the fixing groove 54 of the anti-slip device 5. The operator then turns off the cylinder 275 and removes the integrated circuit after placement.

[0025] In the electronic component adsorption section, the operator turns on the power of the adsorption pen 274 and uses the adsorption pen 274 to remove the electronic component from the component box 3. During the process, when the electronic component adsorbed by the adsorption plate 2745 comes into contact with the surface of the integrated circuit, the pen tip 2742 will move in the direction of the pen tip 2742 to prevent the integrated circuit board from being crushed. After the placement is completed, the power of the adsorption pen 274 is turned off.

[0026] In the electronic component storage section, before the surface mount technology (SMT) operation, the operator opens the cover 36 of the component box 3, places the electronic components to be surface mounted into the component storage slot 32, and then closes the cover 36. When the electronic components need to be retrieved, they are retrieved through the retrieval port 37 at the top of the cover 36. The second spring 33 and the guide block 34 continuously push the electronic components in the component storage slot 32 toward the retrieval port 37.

[0027] For the anti-slip part, the staff adjusts the distance between the second fixing blocks 51 to match the size of the integrated circuit to be mounted, and then uses the integrated circuit adsorption device 6 to adsorb it. When the integrated circuit is mounted, it will fall into the fixing groove 54 after it falls off the bottom of the suction cup 63.

[0028] In the integrated circuit board adsorption section, the operator places the integrated circuit board on top of the suction cup 63 and turns on the power of the micro air pump 61 to create a vacuum between the integrated circuit board and the suction cup 63, preventing the integrated circuit board from moving during the placement process. After placement is completed, the micro air pump 61 releases air into the gap between the integrated circuit board and the suction cup 63, causing the integrated circuit board to detach. The operator then removes the completed integrated circuit board and disconnects the power of the micro air pump 61.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A non-slip integrated circuit manufacturing chip mounting device, comprising a device base (1), characterized in that: The top of the device base (1) is fixedly installed with a component transfer device (2) and a component box (3). A working groove (4) is opened at the top edge of the device base (1). The component box (3) and the working groove (4) are both located below the component transfer device (2). The component box (3) is located at the edge of the working groove (4). Anti-slip devices (5) are fixedly installed on both sides of the inner wall of the working groove (4). A first motor (8) is fixedly installed at the corner of the outer surface of the device base (1) by a bracket. An integrated circuit adsorption device (6) is fixedly installed at the bottom of the device base (1). The integrated circuit adsorption device (6) penetrates the device base (1) and extends into the working groove (4). The integrated circuit adsorption device (6) is located below the anti-slip device (5). Support feet (7) are fixedly installed at the four corners of the bottom of the device base (1).

2. The anti-slip surface mount device for integrated circuit manufacturing according to claim 1, characterized in that: The component migration device (2) includes a first optical rod (21), a first lead screw (22), and a second motor (28). Fixers (23) are fixedly installed at both ends of the first optical rod (21). The bottom of the fixers (23) is fixedly installed at the four corners of the top of the device base (1). The two ends of the first lead screw (22) are rotatably installed between the fixers (23), and one end of the first lead screw (22) passes through the fixer (23) and extends to the other side to be fixedly connected to the output end of the first motor (8). The first lead screw (22) is arranged parallel to the first optical rod (21).

3. The anti-slip surface mount device for integrated circuit manufacturing according to claim 2, characterized in that: The first optical rod (21) is slidably mounted with a first support column (24), and the first lead screw (22) is driven to be mounted with a second support column (25) on its outer surface. The second support column (25) is arranged parallel to the first support column (24). The second motor (28) is fixedly mounted on the side of the second support column (25) away from the first support column (24) by a bracket. The first support column (24) and the second support column (25) are rotatably mounted with a second lead screw (26). One end of the second lead screw (26) passes through the second support column (25) and extends to the other side to be fixedly connected to the output end of the second motor (28). The outer surface of the second lead screw (26) is driven to be mounted with an element adsorption device (27).

4. The anti-slip bonding device for integrated circuit manufacturing according to claim 3, characterized in that: The element adsorption device (27) includes a first displacement block (271), a straight rod (272), and a cylinder (275). The first displacement block (271) is driven and mounted on the outer surface of the second lead screw (26). The cylinder (275) is fixedly mounted on the top of the first displacement block (271) by a bracket. The output end of the cylinder (275) is fixedly connected to the top end of the straight rod (272). The straight rod (272) passes through the first displacement block (271) and extends to its other side. A first fixing block (273) is fixedly mounted on the bottom of the outer surface of the straight rod (272). An adsorption pen (274) is detachably mounted on the bottom of the first fixing block (273) away from the straight rod (272), and the adsorption pen (274) passes through the first fixing block (273) and extends to its other side.

5. The anti-slip bonding device for integrated circuit manufacturing according to claim 4, characterized in that: The adsorption pen (274) includes a pen body (2741) and an adsorption tube (2743). A pen tip (2742) is fitted onto the bottom of the outer surface of the pen body (2741). A first spring (2744) is fixedly installed at the edge of the bottom of the pen body (2741). The other end of the first spring (2744) is fixedly installed on the bottom of the inner wall of the pen body (2741). The outer surface of the adsorption tube (2743) is fixedly connected to the bottom of the pen tip (2742). The adsorption tube (2743) penetrates the bottom of the pen tip (2742) and extends to its inner cavity. An adsorption plate (2745) is fixedly installed on the bottom of the outer surface of the adsorption tube (2743).

6. The anti-slip bonding device for integrated circuit manufacturing according to claim 1, characterized in that: The component box (3) includes a box body (31), which is fixedly installed at the bottom of the device base (1). A component storage slot (32) is provided on the upper surface of the box body (31). A second spring (33) is fixedly installed on the inner wall of the component storage slot (32). A guide block (34) is fixedly installed on the other end of the second spring (33). A buffer pad (35) is fixedly installed on the side of the guide block (34) away from the second spring (33). A box cover (36) is rotatably installed at the edge of the upper surface of the box body (31) via a rotating shaft. A component retrieval port (37) is provided on the top of the box cover (36).

7. The anti-slip bonding device for integrated circuit manufacturing according to claim 1, characterized in that: The anti-slip device (5) includes a second fixing block (51) and a second light rod (53). A second displacement block (52) is fixedly installed at the bottom of the second fixing block (51). The second displacement block (52) is slidably installed on the outer surface of the second light rod (53). The two ends of the second light rod (53) are fixedly installed on both sides of the inner wall of the working groove (4). A fixing groove (54) is opened at the top edge of the second fixing block (51). Anti-slip pads (55) are fixedly installed at the bottom and side wall of the fixing groove (54).

8. The anti-slip surface mount device for integrated circuit manufacturing according to claim 1, characterized in that: The integrated circuit adsorption device (6) includes a micro air pump (61), which is fixedly installed at the bottom of the device base (1) by a bracket. A variable cross-section suction channel (62) is fixedly installed at the output end of the micro air pump (61). The variable cross-section suction channel (62) passes through the device base (1) and extends into the working groove (4). A suction cup (63) is fixedly installed at the end of the variable cross-section suction channel (62) away from the micro air pump (61).

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