An integrated circuit carrier device

Abstract

The utility model relates to the technical field of integrated circuit manufacturing discloses an integrated circuit bearing device, including integrated circuit positioning area, integrated circuit positioning area is provided with several groups, and integrated circuit positioning area evenly distributes in the upper of carrier, integrated circuit positioning area includes integrated circuit positioning groove, integrated circuit positioning groove both sides are provided with several groups of pin support groove, integrated circuit is placed in the upper of integrated circuit positioning groove, the utility model reduces the interval between the machine table vacuum source and integrated circuit, makes vacuum source and integrated circuit direct contact, reduces the vacuum loss caused by transmission, improves vacuum adsorption, makes the product more stable when operating, effectively improves the engineering capacity, and improves the benefit simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, specifically to an integrated circuit carrier device. Background Technology

[0002] In the field of integrated circuit manufacturing, the carrier device is a key piece of equipment for ensuring the stable operation of the production process. Current integrated circuit carrier designs generally employ a technology where the bottom surface of the integrated circuit does not directly contact the machine base, and vacuum is transferred through the carrier. However, this design has significant drawbacks. During vacuum transfer, substantial vacuum efficiency is lost, resulting in insufficient vacuum suction applied to the integrated circuit, leading to unstable adhesion. Insufficient vacuum not only triggers machine alarms, forcing frequent production line interruptions and drastically reducing production efficiency, but more seriously, it causes the first solder joint to not adhere to the second solder joint during soldering operations in a low-vacuum environment. This non-adhesion directly affects the electrical connection performance of the integrated circuit, leading to product malfunction, significantly lowering product yield, and increasing production costs. As integrated circuit manufacturing moves towards higher precision and higher integration, the requirements for the vacuum adhesion stability of the carrier device are becoming increasingly stringent. The technological bottlenecks of existing carriers have become a major factor restricting the efficient development of the industry, necessitating the development of new technological solutions to address these issues. Utility Model Content

[0003] The purpose of this utility model is to address the shortcomings of existing technologies by proposing an integrated circuit carrier device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: it includes an integrated circuit positioning area, wherein several groups of integrated circuit positioning areas are provided and are evenly distributed above the carrier; the integrated circuit positioning area includes an integrated circuit positioning groove; several groups of pin support grooves are provided on both sides of the integrated circuit positioning groove; and an integrated circuit is placed above the integrated circuit positioning groove.

[0005] As a further description of the above technical solution:

[0006] The pin support slots are symmetrically distributed on both sides of the integrated circuit positioning slot.

[0007] As a further description of the above technical solution:

[0008] The vehicle is provided with several sets of vehicle positioning holes on its upper part, and the vehicle positioning holes are symmetrically distributed on both sides of the vehicle.

[0009] As a further description of the above technical solution:

[0010] An anti-reverse hole is provided above one corner of the vehicle.

[0011] As a further description of the above technical solution:

[0012] Multiple sets of cover plate positioning holes are evenly distributed on the top of the vehicle.

[0013] As a further description of the above technical solution:

[0014] The integrated circuit positioning groove can be a hollow structure.

[0015] This utility model has the following beneficial effects:

[0016] By reducing the gap between the machine's vacuum source and the integrated circuit, the vacuum source and the integrated circuit can be in direct contact, reducing vacuum loss caused by transmission, improving vacuum adsorption force, and making the product more stable during operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of an integrated circuit carrier device proposed in this utility model.

[0018] Legend:

[0019] 1. Integrated circuit positioning area; 2. Pin support groove; 3. Integrated circuit positioning groove; 4. Integrated circuit; 5. Carrier positioning hole; 6. Anti-reverse hole; 7. Cover plate positioning hole. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1:

[0022] like Figure 1 As shown, this embodiment provides an integrated circuit carrier device, including: an integrated circuit positioning area 1, which is provided with several groups and is evenly distributed above the carrier. The integrated circuit positioning area 1 includes an integrated circuit positioning groove 3, and several groups of pin support grooves 2 are provided on both sides of the integrated circuit positioning groove 3. An integrated circuit 4 is placed on top of the integrated circuit positioning groove 3.

[0023] In this embodiment, the integrated circuit 4 is placed on the integrated circuit positioning slot 3, and the pins are placed in the pin support slot 2. The machine vacuum source acts directly on the bottom surface of the integrated circuit 4 through the hollowed-out integrated circuit positioning slot 3, which reduces the gap between the vacuum source and the integrated circuit 4, reduces vacuum loss, enhances vacuum adsorption force, and ensures stable operation of the integrated circuit 4.

[0024] Specifically, the pin support slot 2 has 6 sets, which are symmetrically distributed on both sides of the integrated circuit positioning slot 3.

[0025] In this embodiment, the symmetrically distributed pin support slots 2 provide stable support for the pins of the integrated circuit 4, and together with the integrated circuit positioning slots 3, enable the integrated circuit 4 to be accurately positioned, ensuring that the integrated circuit 4 is placed accurately and that the pins are subjected to uniform force, thereby further improving the stability of the operation.

[0026] Example 2:

[0027] Specifically, there are 20 sets of vehicle positioning holes 5 on the top of the vehicle, and the vehicle positioning holes 5 are symmetrically distributed on both sides of the vehicle.

[0028] It should be noted that when the carrier is sent into the machine tool track, the positioning pin on the track is inserted into the positioning hole 5 of the carrier to achieve precise positioning of the carrier in the track, ensuring that the carrier is fixed in position on the machine tool track, so that the integrated circuit positioning area 1 corresponds accurately with the working area of ​​the machine tool.

[0029] Specifically, an anti-reverse hole 6 is provided above one corner of the vehicle to detect the direction of the vehicle when it is sent into the track.

[0030] In this embodiment, when the vehicle is sent into the track, the anti-reverse detection device of the machine detects the shape and position of the anti-reverse hole 6 to determine whether the direction of the vehicle is correct, so as to prevent the vehicle from being sent into the track in the opposite direction and avoid operational errors and equipment damage caused by incorrect direction.

[0031] Specifically, three sets of cover plate positioning holes 7 are evenly distributed on the top of the vehicle, which are used for positioning and cooperating with the vehicle.

[0032] In this embodiment, the positioning pin on the cover plate is inserted into the positioning hole 7 of the cover plate to achieve precise positioning and matching between the cover plate and the carrier, ensuring that the cover plate is installed in an accurate position, and playing a protective and auxiliary role for the carrier and integrated circuit 4 during operation.

[0033] Specifically, the integrated circuit positioning groove (3) can be a hollow structure.

[0034] In this embodiment, the hollow structure allows the bottom surface of the integrated circuit to directly contact the base of the machine, and the vacuum of the machine acts directly on the bottom surface of the integrated circuit, improving the vacuum adsorption force and making the product more stable.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit carrier device, characterized in that: The integrated circuit positioning area (1) includes several groups of integrated circuit positioning areas (1) and is evenly distributed above the carrier. The integrated circuit positioning area (1) includes an integrated circuit positioning groove (3). Several groups of pin support grooves (2) are provided on both sides of the integrated circuit positioning groove (3). An integrated circuit (4) is placed above the integrated circuit positioning groove (3).

2. The integrated circuit carrier device according to claim 1, characterized in that: The pin support slots (2) are symmetrically distributed on both sides of the integrated circuit positioning slots (3).

3. An integrated circuit carrier device according to claim 2, characterized in that: The vehicle is provided with several sets of vehicle positioning holes (5) on its upper part, and the vehicle positioning holes (5) are symmetrically distributed on both sides of the vehicle.

4. An integrated circuit carrier device according to claim 3, characterized in that: An anti-reverse hole (6) is provided above one corner of the vehicle.

5. An integrated circuit carrier device according to claim 4, characterized in that: Multiple sets of cover plate positioning holes (7) are evenly distributed on the top of the vehicle.

6. An integrated circuit carrier device according to claim 1, characterized in that: The integrated circuit positioning groove (3) can be a hollow structure.

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