Multilayer flow channel heat transfer device

Abstract

The utility model discloses a multilayer runner heat transfer device, including the heat conduction plate base plate and liquid cooling radiator, liquid cooling radiator is by liquid cooling heat dissipation base plate and is located on the heat exchange runner of liquid cooling heat dissipation base plate composition, the heat conduction plate base plate with the heat conduction plate base plate is connected, the heat exchange runner is by multilayer heat exchange board body of stacking in turn composition, be equipped with a plurality of channel holes on the heat exchange board body, and the channel hole of adjacent layer heat exchange board body is communicated to the left and / or front and back staggered, and the heat conduction plate base plate and liquid cooling heat dissipation base plate form the isothermal chamber, and the isothermal chamber is filled with working medium, the utility model discloses improve the heat dissipation performance of heat transfer device, especially applicable to the occasion of higher heat flux density, the heat exchange board body can be adapted to multiple scheme runner and working condition demand under the premise of not affecting the structural strength of heat transfer device, the utility model discloses compact structure, unit design, higher reliability, is applicable to a variety of industrial application scenarios.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a multi-layer flow channel heat transfer device. Background Technology

[0002] As electronic components become increasingly integrated, their heat flux density increases, requiring more efficient heat sinks to meet their environmental requirements. However, with further increases in heat flux density, even single-phase liquid cooling technology with cold plates becomes increasingly difficult to dissipate heat and control its temperature. Single-phase liquid cooling technology has poor horizontal heat diffusion to the perimeter of the liquid cooling plate, resulting in limited improvement in heat transfer capacity from increased area. In particular, heat dissipation at locations with high local heat flux can easily cause the temperature of local areas or even the entire heat source surface to exceed the required temperature range.

[0003] Existing heat transfer devices use plate-type liquid-cooled radiators with heat spreaders, such as... Figure 1 As shown, the heat spreader consists of a base plate and a cover plate, while the cold plate liquid cooler consists of a cold plate and heat exchange channels. The heating element is placed on the heat spreader, with the heat spreader positioned between the heating element and the cold plate. The heat from the heating element is first thermally expanded through the heat spreader to reduce its heat density, and then the heat spreader exchanges heat with the cold plate.

[0004] However, the existing technology has at least the following technical problems: 1) The cover plates of the cold plate and the heat spreader are generally welded together by soldering or brazing, so that the cold plate and the cover plates of the heat spreader are not atomically connected, and the thermal resistance has a certain degree, which will affect the heat dissipation performance of the heat dissipation device; 2) There is also a certain reliability risk in connecting the cover plates of the cold plate and the heat spreader by soldering or brazing; 3) The heat dissipation capacity of the cold plate liquid cooler with heat spreader still needs to be further improved. Utility Model Content

[0005] The technical problem to be solved by this utility model embodiment is to provide a multi-layer flow channel heat transfer device to improve heat dissipation performance.

[0006] To address the aforementioned technical problems, this utility model provides a multi-layer heat transfer device, comprising a heat spreader substrate and a liquid-cooled radiator. The liquid-cooled radiator consists of a liquid-cooled heat dissipation substrate and heat exchange channels disposed on the liquid-cooled heat dissipation substrate. The heat spreader substrate is connected to the heat spreader substrate, and the heat exchange channels are composed of multiple layers of heat exchange plates stacked sequentially. Each heat exchange plate has a plurality of channel holes, and the channel holes of adjacent heat exchange plates are staggered left and right and / or front and back to communicate with each other. A temperature equalization cavity is formed between the heat spreader substrate and the liquid-cooled heat dissipation substrate, and the temperature equalization cavity is filled with a working fluid.

[0007] Furthermore, the channel holes are composed of a single set of flow channel through holes or multiple sets of flow channel through holes. The channel holes on the heat exchange plate are arranged in an array with a row spacing and column spacing of a preset distance. The channel holes of adjacent heat exchange plate layers are staggered by a preset distance to the left and right and / or front and back.

[0008] Furthermore, the heat exchange plate is provided with corresponding positioning holes.

[0009] Furthermore, the heat exchange channel includes one or more non-flow sides, and the multi-layer heat exchange plates of the heat exchange channel are aligned on the non-flow sides.

[0010] Furthermore, the heat spreader substrate and the liquid cooling heat dissipation substrate, and the liquid cooling heat dissipation substrate and the heat exchange channel are connected by diffusion welding.

[0011] Furthermore, the temperature equalization cavity is equipped with several support columns.

[0012] Furthermore, the temperature equalization cavity has an evaporation capillary structure on the side near the heat equalization plate substrate and a condensation capillary structure on the side near the liquid-cooled radiator.

[0013] Furthermore, the liquid-cooled radiator also includes a cover that covers the liquid-cooled heat dissipation substrate, enclosing the heat exchange channels inside.

[0014] Furthermore, the cover is provided with an inlet and an outlet that are connected to the heat exchange channel. The inlet is provided with an inlet connector, and the outlet is provided with an outlet connector.

[0015] The beneficial effects of this invention are as follows: After the heat spreader plate is connected to the heating element, the heating element generates heat, and the working fluid in the heat spreader cavity exchanges heat with the heating element through the heat spreader plate. The working fluid can rapidly absorb the heat from the heating element and undergo a phase change to vaporize. The vapor then moves to the liquid-cooled heat dissipation plate in the low-temperature zone and condenses into liquid, releasing heat, thus achieving heat exchange with the liquid-cooled radiator. Compared to existing heat dissipation devices, the gap between the vapor and the cold plate is reduced by one layer of material and one layer of solder, allowing the heat of the working fluid in the heat spreader cavity to quickly expand to the liquid-cooled radiator. Furthermore, by reducing the thermal resistance between the vapor and the cold plate, the heat dissipation performance of the heat transfer device is improved, making it particularly suitable for applications with higher heat flux densities.

[0016] This invention can be designed based on temperature, pressure drop, heat exchange space, and heat exchange direction, and control requirements can be achieved by adjusting the thickness, opening size, and flow channel size of the heat exchange plate. The heat exchange plate of this invention can adapt to multiple flow channel schemes and operating conditions without affecting the structural strength of the heat transfer device; this invention has a compact structure, modular design, higher reliability, and is suitable for various industrial applications. Attached Figure Description

[0017] Figure 1 This is a partial structural cross-sectional view of an existing heat transfer device.

[0018] Figure 2 This is an assembly drawing of the multi-layer flow channel heat transfer device according to an embodiment of this utility model.

[0019] Figure 3 This is a partial structural cross-sectional view of the multi-layer flow channel heat transfer device according to an embodiment of the present invention.

[0020] Figure 4 This is a partial cross-sectional view of the heat exchange channel according to an embodiment of the present invention.

[0021] Figure 5 This is a top view schematic diagram of the heat exchange channel according to an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram of the structure of a heat exchange plate with a single set of flow channel through holes according to an embodiment of the present invention.

[0023] Figure 7 This is a schematic diagram of the structure of a heat exchange plate with multiple sets of flow channel through holes according to an embodiment of the present invention.

[0024] Figure 8 This is a three-dimensional structural diagram of a heat exchange channel with multiple sets of flow channel through holes according to an embodiment of this utility model.

[0025] Figure 9 This is a cross-sectional view of a multi-layer flow channel heat transfer device with capillary structure according to an embodiment of the present invention.

[0026] Figure 10 This is a cross-sectional view of a multi-layer flow channel heat transfer device with a cover, an inlet connector, and an outlet connector according to an embodiment of the present invention.

[0027] Explanation of icon numbers 1. Heat exchange plate substrate, 2. Liquid cooling heat dissipation substrate, 3. Heat exchange channel, 4. Heat exchange cavity, 5. Heat exchange plate body, 6. Channel hole, 7. Channel hole of adjacent layer, 8. Multiple sets of flow channel through holes, 9. Positioning hole, 10. Non-flow side, 11. Flow side, 12. Support column, 13. Evaporation zone capillary structure, 14. Condensation zone capillary structure, 15. Cover body, 16. Water inlet connector, 17. Water outlet connector, 21. Substrate, 22. Cover plate, 23. Cold plate. Detailed Implementation

[0028] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0031] Please refer to Figures 2 to 10 The multi-layer flow channel heat transfer device of this utility model embodiment includes a heat spreader substrate and a liquid-cooled radiator.

[0032] The liquid-cooled radiator consists of a liquid-cooled heat dissipation substrate and heat exchange channels disposed on the liquid-cooled heat dissipation substrate. A heat spreader substrate is connected to the heat spreader substrate. A temperature equalization cavity is formed between the heat spreader substrate and the liquid-cooled heat dissipation substrate, and the temperature equalization cavity is filled with a working fluid. After the heat spreader substrate of this invention is connected to the heating element, the heating element generates heat, and the working fluid in the temperature equalization cavity exchanges heat with the heating element through the heat spreader substrate. The working fluid can quickly absorb the heat from the heating element and undergo a phase change vaporization. The vapor then moves to the liquid-cooled heat dissipation substrate in the low-temperature zone and condenses into liquid, releasing heat, thus realizing heat exchange with the liquid-cooled radiator.

[0033] The heat exchange channel is composed of multiple layers of stacked heat exchange plates. Each heat exchange plate has several channels. The channels in adjacent heat exchange plate layers are staggered horizontally and / or vertically, connecting to form a heat dissipation channel for the working fluid to flow through. Figure 5 As shown, the channel holes in the top layer are connected to the channel holes in the adjacent layers. This invention can be designed according to temperature, pressure drop, heat exchange space, and heat exchange direction, and control requirements can be achieved by adjusting the thickness, opening size, and flow channel size of the heat exchange plate. The heat exchange plate of this invention can adapt to multiple flow channel schemes and operating conditions without affecting the structural strength of the heat transfer device.

[0034] In one implementation, the channel holes consist of a single set of flow channel through holes or multiple sets of flow channel through holes. The channel holes on the heat exchange plate are arranged in an array with a preset row spacing and column spacing. The channel holes of adjacent heat exchange plate layers are staggered left and right and / or front and back by a preset distance. The flow channel through holes are preferably oblong, with the oblong holes of a single set of flow channel through holes inclined at 45°. Multiple sets of flow channel through holes form an X-shaped channel hole.

[0035] In one implementation, the heat exchange plate is provided with corresponding positioning holes. The multi-layer heat exchange plate is positioned through the positioning holes, which facilitates assembly and production.

[0036] In one embodiment, the heat exchange channel includes one or more non-flowing sides, and the multi-layer heat exchange plates of the heat exchange channel are aligned on the non-flowing side. The working fluid in the heat exchange channel enters / exits on the flowing side. This utility model facilitates single-sided entry and single-sided exit, single-sided entry and multiple-sided exit, or multiple-sided entry and single-sided exit of the working fluid in the heat exchange channel. It has a compact structure, modular design, is easy to maintain, and is suitable for various industrial applications.

[0037] In one embodiment, the heat spreader substrate and the liquid cooling heat dissipation substrate, as well as the liquid cooling heat dissipation substrate and the heat exchange channel, are connected by diffusion welding, resulting in better thermal conductivity and sealing performance.

[0038] In one implementation, a plurality of support pillars are provided inside the heat spreader cavity. The support pillars are spaced apart and support the heat spreader substrate and the liquid cooling heat dissipation substrate, thereby increasing strength, dividing the heat spreader cavity, and improving the overall heat dissipation efficiency.

[0039] In one implementation, an evaporation capillary structure is provided on the side of the heat exchanger near the heat exchanger substrate, and a condensation capillary structure is provided on the side near the liquid-cooled heat sink. The evaporation capillary structure enables the working fluid to rapidly absorb heat from the heating element and undergo a phase change and vaporization; the condensation capillary structure enables the vaporized working fluid to rapidly condense into a liquid and release heat, quickly exchanging heat with the liquid-cooled heat sink substrate.

[0040] In one embodiment, the liquid-cooled radiator further includes a cover. The cover fits onto the liquid-cooled heat dissipation substrate, forming a sealed cavity between the cover and the substrate, with the heat exchange channels located inside the sealed cavity. The cover is provided with an inlet and an outlet that communicate with both heat exchange channels; the inlet is provided with an inlet connector, and the outlet is provided with an outlet connector.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-layer flow channel heat transfer device, comprising a heat spreader substrate and a liquid-cooled radiator, characterized in that, The liquid-cooled heat sink consists of a liquid-cooled heat sink substrate and heat exchange channels disposed on the liquid-cooled heat sink substrate. The heat exchange plate substrate is connected to the heat exchange plate substrate. The heat exchange channels are composed of multiple layers of heat exchange plates stacked sequentially. The heat exchange plates are provided with a number of channel holes. The channel holes of adjacent heat exchange plates are staggered left and right and / or front and back to communicate with each other. A temperature equalization cavity is formed between the heat exchange plate substrate and the liquid-cooled heat sink substrate. The temperature equalization cavity is filled with working fluid.

2. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, The channel holes are composed of a single set of flow channel through holes or multiple sets of flow channel through holes. The channel holes on the heat exchange plate are arranged in an array with a row spacing and column spacing of a preset distance. The channel holes of adjacent heat exchange plate layers are staggered by a preset distance to the left and right and / or front and back.

3. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, The heat exchange plate is provided with corresponding positioning holes.

4. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, The heat exchange channel includes one or more non-flow sides, and the multi-layer heat exchange plates of the heat exchange channel are aligned on the non-flow sides.

5. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, The heat spreader substrate and the liquid cooling heat dissipation substrate are connected by diffusion welding, and the liquid cooling heat dissipation substrate and the heat exchange channel are connected by diffusion welding.

6. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, Several support columns are installed inside the temperature equalization chamber.

7. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, An evaporation capillary structure is provided on the side of the heat spreader near the heat spreader substrate, and a condensation capillary structure is provided on the side of the liquid-cooled radiator.

8. The multi-layer flow channel heat transfer device as described in claim 1, characterized in that, The liquid-cooled radiator also includes a cover that covers the liquid-cooled heat dissipation substrate and encloses the heat exchange channels inside.

9. The multi-layer flow channel heat transfer device as described in claim 8, characterized in that, The cover is provided with an inlet and an outlet that are connected to the heat exchange channel. The inlet is provided with an inlet connector and the outlet is provided with an outlet connector.

Images