LED lamp strip double-layer flexible substrate three-layer copper foil flip eutectic processing equipment and technology

Abstract

The invention relates to the technical field of integrated circuit manufacturing, in particular to LED lamp strip double-layer flexible substrate three-layer copper foil flip eutectic processing equipment and process, and the LED lamp strip double-layer flexible substrate three-layer copper foil flip eutectic processing equipment comprises a working platform, a control module, a rotating tower, a dust removal mechanism and a fan for providing negative pressure suction force for the dust removal mechanism; the working platform is used for conveying LED lamp strip double-layer flexible substrate products, a machining station is arranged on the working platform, and the dust removal mechanism is arranged near the working platform and located on a rotating path where the electrostatic adsorption mechanism rotates out of the machining station, so that dust and impurities are prevented from influencing the welding quality, and the product performance of the LED lamp strip is further improved. The control module determines the action switching logic of all the components, circulation operation among the mechanical arm, the electrostatic adsorption mechanism, the rotating tower and the working platform is achieved, the machining efficiency is improved, and the device is suitable for flip eutectic welding machining of the lamp strip multi-window welding area.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a flip-chip eutectic processing equipment and process for a double-layer flexible substrate and three-layer copper foil of LED light strip. Background Technology

[0002] With the rapid development of LED lighting technology, LED light strips, due to their advantages such as flexibility, easy installation, and uniform light emission, are widely used in decorative lighting, outdoor displays, smart homes, and many other fields. The core component of an LED light strip is a double-layer flexible substrate with a three-layer copper foil structure on its surface to improve conductivity and structural stability. The connection between the chip and the substrate uses a flip-chip eutectic bonding process, which features high welding precision, good heat dissipation, and strong connection reliability. This process is crucial for ensuring the lifespan and luminous effect of the LED light strip. Currently, the flip-chip eutectic bonding of the double-layer flexible substrate for LED light strips is mostly completed by automated equipment. A welding robot picks up the chip and places it onto a pre-reserved window on the upper flexible substrate, then uses eutectic heating to flip-chip bond the chip to the copper foil.

[0003] LED light strip products are transported to the processing station by conveying equipment. The windows on the strip are exposed. Before chip soldering, it cannot be guaranteed that dust will fall into the windows. If the chips are directly flip-chip bonded without any treatment, the current technology does not allow for a continuous dust pretreatment and eutectic bonding process. The intelligent control is not perfect and cannot effectively remove dust and impurities from the surface of the soldering window, which can lead to problems such as poor soldering and poor contact. Summary of the Invention

[0004] To address the above problems, the present invention provides the following technical solution: A flip-chip eutectic processing device for a double-layer flexible substrate and three-layer copper foil of LED light strip includes a working platform, a control module, a turret, a dust removal mechanism, and a fan that provides negative pressure suction to the dust removal mechanism. The working platform is used to transport the double-layer flexible substrate of the LED light strip and has a processing station on it. The welding window of the product can be moved to the processing station in sequence. A turret is installed next to the working platform. A motor is mounted on the turret. A robotic arm is installed at the power output end of the motor. A robotic hand is installed at one end of the robotic arm, and an electrostatic adsorption mechanism is installed at the other end at a 180-degree angle relative to the robotic hand. The dust removal mechanism is located near the working platform and on the rotation path of the electrostatic adsorption mechanism as it rotates out of the processing station. When a welding window of the product is moved to the processing station, the control module controls the motor to drive the robotic arm to rotate, so that the electrostatic adsorption mechanism rotates to the processing station and the robotic arm rotates to the loading station with a turret angle relative to the processing station. At the same time, the control module controls the robotic arm to grab the chip and the electrostatic adsorption mechanism to be energized to adsorb the dust in the welding window. After adsorption is completed, the control motor drives the turret to rotate 90 degrees, which drives the electrostatic adsorption mechanism to the dust removal mechanism and the robotic arm to rotate 90 degrees synchronously. The control also controls the electrostatic adsorption mechanism to de-energize and release dust, and the fan to start the dust removal mechanism to suck up dust under negative pressure. After cleaning, the turret is rotated 90 degrees again, which drives the electrostatic adsorption mechanism to the loading station and the robot arm to the processing station. The robot arm flips the chip to the corresponding welding window and performs eutectic welding. After welding is completed, the turret is controlled to rotate 90 degrees, which moves the robot arm to the dust removal mechanism and the electrostatic adsorption mechanism to the processing station. At the same time, the work platform is controlled to move the product by one step so that the next welding window is moved to the processing station. Then the turret rotation is controlled to reset, and the cycle is repeated.

[0005] Preferably, the inlet and outlet ends of the working platform are equipped with conveying rollers, the two conveying rollers are connected together by a drive, and the working platform is also equipped with an electric drive component that drives the conveying rollers to rotate, the electric drive component being controlled by the control module.

[0006] Preferably, the working surface of the working platform is embedded with a plurality of suction heads, the suction heads being flush with the working surface. The fan has two parts of pipeline, one part of which is connected to the suction heads and the other part of which is connected to the dust removal mechanism. A first solenoid valve is installed on one part of the pipeline and a second solenoid valve is installed on the other part of the pipeline. The first solenoid valve and the second solenoid valve are electrically controlled by a module.

[0007] Preferably, two guide plates are symmetrically mounted on the working surface of the working platform along the material conveying direction, and a material conveying area for conveying LED light strip double-layer flexible substrate products is formed between the two guide plates.

[0008] Preferably, an electric cylinder is installed at one end of the robotic arm where the electrostatic adsorption mechanism is mounted, and the electrostatic adsorption mechanism is mounted on the actuating rod of the electric cylinder.

[0009] Preferably, the control module includes a central control unit, a position control unit, a drive control unit, and a signal processing unit that are electrically connected to each other. The signal processing unit is electrically connected to the position sensor in the position control unit, and is used to receive and process the detection signal from the position sensor, and then transmit the processed signal to the central control unit. The central control unit is used to receive the signal from the signal processing unit and output control commands to the position control unit and the drive control unit. The position control unit is used to control the start and stop of the conveyor and the rotation and positioning of the turret of the work platform according to the commands of the central control unit. The drive control unit is used to drive the robot arm, the electrostatic adsorption mechanism, and the fan to perform actions according to the commands of the central control unit, and to realize the coordinated operation between the components.

[0010] Preferably, the position sensor is provided on the work platform at the corresponding processing station and the position control unit. The position sensor is electrically connected to the control module and is used to detect whether the welding window of the LED strip double-layer flexible substrate product has reached the preset position of the processing station, and to feed back the detection signal to the control module. After receiving the detection signal, the control module controls the electric drive component on the work platform to stop conveying.

[0011] Preferably, the electrostatic adsorption mechanism includes an insulating mounting base, an electrostatic generator, and an electrode plate. The insulating mounting base is fixedly mounted on the actuating rod of the electric cylinder. The electrostatic generator is embedded in the insulating mounting base and protrudes towards one side of the processing station. The electrode plate is electrically connected to the electrostatic generator and to the drive control unit of the control module.

[0012] This invention also provides a flip-chip eutectic processing technology, using the aforementioned LED strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment, including the following process steps: Step S01. Start the processing equipment. The control module controls the reset of each component, so that the turret drives the robotic arm to rotate to the initial position: the electrostatic adsorption mechanism is in the non-processing station, and the robotic arm is in the loading station at a 180-degree angle to the turret relative to the processing station; place the LED light strip double-layer flexible substrate product on the work platform to prepare for feeding. Step S02. The control module controls the start of the work platform, which drives the product to move along the material conveying direction. At the same time, the control module controls the position sensor to detect the position of the product welding window in real time. When the first welding window moves to the preset position of the processing station, the position sensor transmits the detection signal to the control module, and the control module controls the work platform to stop conveying. Step S03. The control module controls the motor on the turret to drive the robotic arm to rotate, so that the electrostatic adsorption mechanism rotates to the top of the processing station and the robotic arm rotates to the loading station; the control module controls the electrostatic adsorption mechanism to be energized, and the electrode plate supplies power to the electrostatic generator, so that the electrostatic generator generates an electrostatic field to electrostatically adsorb dust and impurities on the surface of the welding window. Step S04. After dust removal is completed, the control module controls the electrostatic adsorption mechanism to be powered off, the turret rotates 90 degrees, and the electrostatic adsorption mechanism rotates to the dust removal mechanism; the control module controls the fan to start, the electrostatic adsorption mechanism is powered off to release dust, and the dust is sucked into the dust removal mechanism to complete the dust cleaning. Step S05. After the dust cleaning is completed, the control module controls the fan to stop working, controls the turret to rotate again, drives the electrostatic adsorption mechanism to rotate, and the robot arm moves synchronously to the top of the processing station; the robot arm adjusts the chip to the flip-chip position through the program, precisely aligns it with the welding window on the processing station, then performs the unloading action, flips the chip from the window onto the copper foil on the upper layer of the product, starts the eutectic welding assembly, and completes the flip-chip eutectic welding of the chip and the product; Step S06. After welding is completed, the control module controls the turret to rotate 90 degrees, which moves the robot arm to the dust removal mechanism and the electrostatic adsorption mechanism to the processing station. Then the control module controls the work platform to start, which moves the product one step, so that the next welding window moves to the processing station. This process is repeated until all welding is completed. Step S07. The control module starts the work platform and transports the processed product to the unloading station to complete the unloading; the control module controls the reset of each component to complete the entire processing flow.

[0013] The advantages of this invention compared to the prior art are: This invention, through the synergistic action of the control module and the positioning structure of the processing station, ensures precise alignment of the copper foil soldering layer between the chip and the product soldering window. Dust removal is performed before flip-chip eutectic soldering to reduce cold solder joints, improve the reliability of flip-chip eutectic soldering, and achieve high soldering quality. Modular control of the control module allows for the rational layout of the electrostatic adsorption mechanism and the dust removal mechanism, enabling precise adsorption and timely cleaning of dust in the soldering window, preventing dust impurities from affecting soldering quality, and further improving the performance of the LED light strip. The control module clearly defines the action switching logic of each component, enabling cyclical operation between the robotic arm, electrostatic adsorption mechanism, turret, and work platform, improving processing efficiency and adapting to flip-chip eutectic soldering processing in multi-window soldering areas of light strips. Attached Figure Description

[0014] Figure 1 A schematic diagram of an LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment provided for an embodiment of the present invention; Figure 2 The schematic diagram of the working principle of the LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment provided in the embodiment of the present invention includes LED light strip double-layer flexible substrate products. Figure 3 The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment provided for the embodiments of the present invention consists of... Figure 2 The resulting top view does not include the LED strip double-layer flexible substrate product. Figure 4 A schematic diagram of the internal electrostatic adsorption mechanism in the LED strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment provided for an embodiment of the present invention; Figure 5 A circuit flowchart of an LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment provided for an embodiment of the present invention.

[0015] In the diagram: 1. Working platform; 2. Control module; 3. Turret; 4. Dust removal mechanism; 5. Fan; 6. Robotic arm; 7. Robotic hand; 8. Electrostatic adsorption mechanism; 9. Conveying roller; 10. Suction head; 11. Pipeline; 12. First solenoid valve; 13. Second solenoid valve; 14. Guide plate; 15. Material conveying area; 16. Electric cylinder; 17. Central control unit; 18. Position control unit; 19. Drive control unit; 20. Signal processing unit; 21. Position sensor; 22. Insulating mounting base; 23. Electrostatic generator; 24. Electrode plate. Detailed Implementation

[0016] The above and other embodiments and advantages of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0017] In one implementation, such as Figures 1-5 As shown: This embodiment provides a flip-chip eutectic processing equipment for LED strip double-layer flexible substrate three-layer copper foil, including a work platform 1, a control module 2, a turret 3, a dust removal mechanism 4, and a fan 5 that provides negative pressure suction to the dust removal mechanism 4; the work platform 1 is used to transport LED strip double-layer flexible substrate products, and a processing station is provided on it, and the welding window of the product can be moved to the processing station in sequence; the turret 3 is installed on the side of the work platform 1, and a motor is installed on the turret 3. A robotic arm 6 is installed at the power output end of the motor. A robotic hand 7 is installed at one end of the robotic arm 6, and an electrostatic adsorption mechanism 8 is installed at the other end at a 180-degree position relative to the robotic hand 7; the dust removal mechanism 4 is located near the work platform 1 and is located on the rotation path of the electrostatic adsorption mechanism 8 as it rotates out of the processing station; The control logic of control module 2 is as follows: When a welding window of the product moves to the processing station, control module 2 controls the motor to drive the robotic arm 6 to rotate, causing the electrostatic adsorption mechanism 8 to rotate to the processing station and the robotic arm 7 to rotate to the loading station 180 degrees away from the turret 3 opposite to the processing station. At the same time, control the robotic arm 7 to grab the chip and the electrostatic adsorption mechanism 8 to be energized to adsorb the dust from the welding window. After adsorption is completed, control the motor to drive the turret 3 to rotate 90 degrees, causing the electrostatic adsorption mechanism 8 to move to the dust removal mechanism 4 and the robotic arm 7 to rotate 90 degrees synchronously. At the same time, control the electrostatic adsorption mechanism 8 to be de-energized to release the dust. 1. The fan 5 is started to cause the dust removal mechanism 4 to suck up dust under negative pressure. After cleaning, the turret 3 is controlled to rotate 90 degrees again, which drives the electrostatic adsorption mechanism 8 to rotate to the loading station and the robot arm 7 to rotate to the processing station. The robot arm 7 flips the chip to the corresponding welding window and performs eutectic welding. After welding, the turret 3 is controlled to rotate 90 degrees, which drives the robot arm 7 to the dust removal mechanism 4 and the electrostatic adsorption mechanism 8 to the processing station. At the same time, the work platform 1 is controlled to move the product by one step so that the next welding window is moved to the processing station. Then the turret 3 is controlled to rotate 90 degrees to reset and the cycle is repeated.

[0018] The work platform 1 is horizontally positioned for conveying LED strip double-layer flexible substrate products (hereinafter referred to as "products"). A turret 3 is installed beside the work platform 1, with its bottom fixedly connected to the ground or equipment frame. The turret 3 drives the robotic arm 6 to rotate, causing the robotic arms 7 at both ends of the robotic arm 6 to synchronously switch positions with the electrostatic adsorption mechanism 8. For example, when the electrostatic adsorption mechanism 8 rotates to the processing station, the robotic arm 7 rotates to the loading station. When the electrostatic adsorption mechanism 8 rotates to the processing station and is energized, it generates static electricity to adsorb any dust that may be present in the product window. At this time, the robotic arm 7 rotates to the loading station, where the chip is picked up under program control.

[0019] The dust removal mechanism 4 is fixedly installed beside the work platform 1 and located on the rotation path of the electrostatic adsorption mechanism 8 after it rotates out of the processing station. This ensures that when the electrostatic adsorption mechanism 8 rotates to the dust removal mechanism 4, it can precisely align with the suction port of the dust removal mechanism 4. For example, if the dust removal mechanism 4 has a suction port, when the electrostatic adsorption mechanism 8 rotates from the processing station to the dust removal mechanism 4, its electrostatic adsorption surface is exactly aligned with the suction port. The dust removal mechanism 4 provides negative pressure suction, the electrostatic adsorption mechanism 8 is de-energized, the electrostatic adsorption fails, and the dust on the electrostatic adsorption surface is efficiently sucked away by the suction port. When the electrostatic adsorption mechanism 8 rotates from the processing station to the dust removal mechanism 4, the robot arm 7 rotates at an angle. When the electrostatic adsorption mechanism 8 rotates from the dust removal mechanism 4 to the loading station, the robot arm 7 will rotate to the processing station. At this time, the gripped chip is aligned with the dust-removed window, flipped onto the top copper foil, and eutectic bonding is completed.

[0020] The fan 5 is a power component that provides negative pressure suction, which can generate a stable negative pressure suction at the dust suction port, quickly sucking away the dust released by the electrostatic adsorption mechanism 8, and collecting the dust into the preset storage cavity for subsequent centralized processing.

[0021] Specific working principle: The double-layer flexible substrate of the LED light strip is placed on the work platform 1. The equipment is started, and the control module 2 controls the work platform 1 to start conveying the product. At the same time, the turret 3 is reset, so that the electrostatic adsorption mechanism 8 is in its initial position and the robot arm 7 is in the loading position. When the first welding window of the product moves to the processing position, the position sensor 21 of the work platform 1 detects the signal and feeds it back to the control module 2. The control module 2 controls the work platform 1 to stop conveying and at the same time controls the motor to drive the robot arm 6 to rotate, so that the electrostatic adsorption mechanism 8 moves to directly above the processing position and the robot arm 7 moves to the loading position 180 degrees away from the processing position relative to the turret 3. At this time, The robotic arm 7 starts and grabs a preset chip at the loading station. Simultaneously, the electrostatic adsorption mechanism 8 is energized, generating an electrostatic field to electrostatically adsorb dust from the welding window and the surface of the internal copper foil welding layer at the processing station. The adsorption time is, for example, 1-3 seconds. After the dust adsorption is complete, the electrostatic adsorption mechanism 8 sends a signal to the control module 2. The control module 2 then controls the motor to drive the turret 3 to rotate 90 degrees, moving the electrostatic adsorption mechanism 8 to the suction port of the dust removal mechanism 4. The robotic arm 7 rotates 90 degrees synchronously. At the same time, the control module 2 de-energizes the electrostatic adsorption mechanism 8, causing it to release the adsorbed dust, and starts the fan 5, creating negative pressure in the dust removal mechanism 4 to quickly suck up the released dust. Move along to complete the dust removal process. During this process, the product remains stationary, while the welding window remains at the processing station (the product is not fed at this time, awaiting the next instruction). After the dust removal is completed, the fan 5 stops working, and the control module 2 controls the motor to drive the turret 3 to rotate 90 degrees, moving the electrostatic adsorption mechanism 8 to the loading station and the robot arm 7 to directly above the processing station. The robot arm 7 precisely aligns the gripped chip with the welding window on the processing station in a flip-chip manner, then performs the unloading action and activates the eutectic welding assembly on the machine to complete the flip-chip eutectic welding of the chip and the welding window. After welding is completed, the control module 2 controls the motor to drive the turret 3 to rotate 90 degrees, moving the robot arm 7 to the loading station. The product is moved to the dust removal mechanism 4 and the electrostatic adsorption mechanism 8 is moved to the processing station. Then, the control module 2 controls the work platform 1 to start, and the product is moved one step, so that the next welding window of the product is moved to the processing station. After the new welding window is positioned, the control module 2 controls the motor to drive the turret 3 to rotate, which drives the electrostatic adsorption mechanism 8 to move to the processing station and the robot arm 7 to the loading station. The above steps are repeated to realize continuous cyclic processing until the copper foil welding layer in all welding windows on the product is completed and the chip is welded one by one. Finally, the control module 1 transports the processed product to the unloading station to complete the eutectic welding process of the entire product strip and multiple chips.

[0022] In another embodiment, the inlet and outlet ends of the working platform 1 are equipped with conveying rollers 9, the two conveying rollers 9 are connected together by a drive, and the working platform 1 is also equipped with an electric drive component that drives the conveying rollers 9 to rotate. The electric drive component is controlled by the control module 2.

[0023] The infeed and outfeed conveyor rollers 9 are only one transmission method for conveying products on the work platform 1. It can also be a multi-roller conveyor roller parallel arrangement, etc. (existing conveying technologies are not strictly limited in this invention). The electric drive component can be understood as a motor. The motor drives one of the conveyor rollers 9 to rotate, and this conveyor roller 9 drives the other conveyor roller 9 to rotate via belt drive. Here, the motor is controlled by the control module 2 to enable step-feeding of the product. For example, when the control module 2 needs to drive the product to step-feed, it outputs a control signal with a preset speed and rotation angle to the electric drive component. The motor rotates by one angle (servo motor), driving the aforementioned conveyor component to rotate by one angle, achieving precise step-feeding of the product and ensuring that after each step, the next welding window of the product can be precisely aligned with the processing station.

[0024] In another embodiment, a plurality of suction heads 10 are embedded in the working surface of the working platform 1. The suction heads 10 are flush with the working surface. The fan 5 is provided with two parts of pipe 11. One part of the pipe 11 is connected to the suction heads 10, and the other part of the pipe 11 is connected to the dust removal mechanism 4. A first solenoid valve 12 is installed on one part of the pipe 11, and a second solenoid valve 13 is installed on the other part of the pipe 11. The first solenoid valve 12 and the second solenoid valve 13 are electrically controlled by the module 2.

[0025] Several suction heads 10 are evenly embedded in the working surface of the work platform 1, with the top of the suction head 10 flush with the working surface to avoid scratching or obstructing the transport of the LED light strip double-layer flexible substrate product. The distribution range of the suction heads 10 covers the processing station and surrounding area, ensuring uniform adsorption and fixation effect on the product. The two parts of the pipes 11 of the fan 5 are independently set and do not interfere with each other. The pipe 11 connecting the suction head 10 is used to provide negative pressure adsorption force for the suction head 10, and the pipe 11 connecting the dust removal mechanism 4 is used to provide negative pressure dust removal force for the dust removal mechanism 4. The first solenoid valve 12 is used to control the opening and closing of the pipe 11 connecting the suction head 10, and the second solenoid valve 13 is used to control the opening and closing of the pipe 11 connecting the dust removal mechanism 4. Both the first solenoid valve 12 and the second solenoid valve 13 are electrically connected to the drive control unit 19 of the control module 2 and are controlled by the on / off commands output by the control module 2.

[0026] The specific configuration principle is as follows: When the product's welding window moves to the processing station, the work platform 1 stops conveying, the control module 2 controls the first solenoid valve 12 to open and the second solenoid valve 13 to close, and simultaneously controls the fan 5 to start. The fan 5 provides negative pressure adsorption force to the suction head 10 through the corresponding pipeline 11. Several suction heads 10 simultaneously generate negative pressure, firmly adsorbing and fixing the product that has entered the processing station onto the work platform 1, ensuring accurate positioning of the product's welding window during subsequent electrostatic dust adsorption and chip flip-chip eutectic bonding processes; after the dust adsorption, chip bonding, and other processes are completed, the control module 2 controls the first solenoid valve 12 to open. When the pipe 11 connecting the suction head 10 is closed or disconnected, the suction head 10 stops providing negative pressure, releasing the product from adsorption and fixation, making it easier for the subsequent work platform 1 to transport the product to the next step. When the electrostatic adsorption mechanism 8 rotates to the dust removal mechanism 4 and dust cleaning is required, the control module 2 controls the second solenoid valve 13 to open and the first solenoid valve 12 to close. The fan 5 provides negative pressure suction to the dust removal mechanism 4 through the corresponding pipe 11, which, together with the electrostatic adsorption mechanism 8 de-energizing and releasing dust, completes the dust cleaning. This achieves the switching control between adsorption and dust removal functions, eliminating the need for additional drive equipment, simplifying the equipment structure, and reducing energy consumption.

[0027] In another embodiment, two guide plates 14 are symmetrically mounted on the working surface of the working platform 1 along the material conveying direction, and a material conveying area 15 for conveying LED light strip double-layer flexible substrate products is formed between the two guide plates 14.

[0028] The guide plate 14 structure is used to limit and guide the product during the conveying process, preventing lateral deviation and ensuring that the welding window of the product can be accurately moved to the processing station. Furthermore, with the cooperation of the suction head 10 fixing and the conveying roller 9 conveying structures, the accuracy of product conveying and positioning is further improved. Both guide plates 14 are vertically mounted on the working surface of the work platform 1, extending along the product conveying direction. Their length is adapted to the conveying length of the work platform 1, ensuring that the product is limited and guided throughout its entire journey from the inlet to the outlet.

[0029] In another embodiment, the robotic arm 6 is equipped with an electric cylinder 16 at one end where an electrostatic adsorption mechanism 8 is mounted, and the electrostatic adsorption mechanism 8 is mounted on the actuating rod of the electric cylinder 16.

[0030] First, an electric cylinder 16 is installed at one end of the robotic arm 6. Then, the electrostatic adsorption mechanism 8 is installed on the actuating rod of the electric cylinder 16. The position of the electrostatic adsorption mechanism 8 can be adjusted by the extension and retraction of the electric cylinder 16. The electric cylinder 16 is controlled by the control module 2. For example, when the electrostatic adsorption mechanism 8 moves to the processing station to treat the dust in the product window area, the control module 2 controls the electric cylinder 16 to drive the electrostatic adsorption mechanism 8 to move linearly during this processing time, thereby increasing the electrostatic adsorption area.

[0031] In another embodiment, the control module 2 includes a central control unit 17, a position control unit 18, a drive control unit 19, and a signal processing unit 20 that are electrically connected to each other. The signal processing unit 20 is electrically connected to the position sensor 21 in the position control unit 18 and is used to receive and process the detection signal from the position sensor 21, and then transmit the processed signal to the central control unit 17. The central control unit 17 is used to receive the signal from the signal processing unit 20 and output control commands to the position control unit 18 and the drive control unit 19. The position control unit 18 is used to control the start and stop of the conveying of the work platform 1 and the rotation and positioning of the turret 3 according to the commands of the central control unit 17. The drive control unit 19 is used to drive the robot arm 7, the electrostatic adsorption mechanism 8, and the fan 5 to perform actions according to the commands of the central control unit 17, and to realize the coordinated operation between the components.

[0032] The core purpose of this control module 2 is to achieve precise division of labor and coordinated linkage of various functions, improve the accuracy and stability of equipment control, and adapt to the needs of fully automated collaborative operation. The position control unit 18 is matched with the position sensor 21 on the processing station. When the product is fed by stepping, it is used to detect the position of the product welding window in real time, and control the rotation angle of the turret 3 and the conveying status of the work platform 1 according to the position signal. The position sensor 21 transmits the detected analog signal to the signal processing unit 20. The signal processing unit 20 transmits the received signal to the central control unit 17, so that the central control unit 17 issues commands to each component. Each unit adopts existing mature circuit modules, and is integrated into the overall control process of the equipment only through reasonable electrical connection and logical coordination. The specific control principle and calculation method need not be elaborated.

[0033] For example, after receiving a signal, the central control unit 17, in conjunction with its preset control logic, outputs corresponding control commands to the position control unit 18 and the drive control unit 19 respectively. Upon receiving the command, the position control unit 18 precisely controls the start / stop and step distance of the conveyor on the work platform 1, while simultaneously controlling the rotation of the turret 3 motor to achieve precise positioning of the turret 3, ensuring that the electrostatic adsorption mechanism 8 and the robotic arm 7 can accurately move to their respective workstations. Upon receiving the command, the drive control unit 19 drives the robotic arm 7 to perform chip gripping and flip-chip welding actions, drives the electrostatic adsorption mechanism 8 to switch between power-on adsorption and power-off dust release, and drives the fan 5 to start / stop to coordinate with dust removal and suction head 10 adsorption. This synchronizes and coordinates the action sequence of each component, ensuring seamless connection between electrostatic adsorption, dust cleaning, chip welding, and product conveying processes, improving the equipment's operational efficiency and intelligence, and perfectly matching the actions of each component in the aforementioned "specific working principle."

[0034] In another embodiment, the electrostatic adsorption mechanism 8 includes an insulating mounting base 22, an electrostatic generator 23, and an electrode plate 24. The insulating mounting base 22 is fixedly mounted on the actuating rod of the electric cylinder 16. The electrostatic generator 23 is embedded in the insulating mounting base 22 and faces one side of the processing station. The electrode plate 24 is electrically connected to the electrostatic generator 23 and is electrically connected to the drive control unit 19 of the control module 2.

[0035] The insulating mounting base 22 is the carrier of the electrostatic adsorption mechanism 8 and also the connector for the action rod of the electric cylinder 16. The electrostatic generator 23 is embedded in the insulating mounting base 22 and serves as insulation. The bottom surface of the electrostatic generator 23 protrudes towards the side of the processing station and is attached to the window. When the drive control unit 19 receives the position signal, it provides current to the electrode plate 24, causing the electrostatic generator 23 to generate an electrostatic field to electrostatically adsorb dust in the window area.

[0036] It should be noted that parameters such as the power and specific shape of the robot arm 7 and the motor, which are not explicitly mentioned in this embodiment, can be flexibly selected from existing mature products according to actual processing needs. Their specific structures do not affect the protection scope of this invention, and are only shown in the figure in a schematic form. At the same time, the control logic of the control module 2 can be implemented by existing PLC programming. Its programming method is a conventional technical means for those skilled in the art and does not require additional modification.

[0037] This invention also provides a flip-chip eutectic processing technology, using the aforementioned LED strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment, including the following process steps: Step S01. Start the processing equipment. The control module 2 controls the reset of each component, so that the turret 3 drives the robotic arm 6 to rotate to the initial position: the electrostatic adsorption mechanism 8 is in the non-processing station, and the robotic arm 7 is in the loading station at a 180-degree angle to the turret 3 relative to the processing station; place the LED light strip double-layer flexible substrate product on the work platform 1 to prepare for feeding. Step S02. Control module 2 controls the start of work platform 1, which drives the product to move along the material conveying direction. At the same time, it controls position sensor 21 to detect the position of the product welding window in real time. When the first welding window moves to the preset position of the processing station, position sensor 21 transmits the detection signal to control module 2, and control module 2 controls work platform 1 to stop conveying. Step S03. Control module 2 controls the motor on turret 3 to drive the robotic arm 6 to rotate, so that the electrostatic adsorption mechanism 8 rotates to the top of the processing station and the robotic arm 7 rotates to the loading station; control module 2 controls the electrostatic adsorption mechanism 8 to be energized, and the electrode plate 24 supplies power to the electrostatic generator 23, so that the electrostatic generator 23 generates an electrostatic field to electrostatically adsorb dust and impurities on the surface of the welding window. Step S04. After dust removal is completed, control module 2 controls electrostatic adsorption mechanism 8 to de-energize, turret 3 rotates 90 degrees, and electrostatic adsorption mechanism 8 rotates to dust removal mechanism 4; control module 2 controls fan 5 to start, electrostatic adsorption mechanism 8 de-energizes and releases dust, and dust is sucked into dust removal mechanism 4 to complete dust cleaning. Step S05. After the dust cleaning is completed, the control module 2 controls the fan 5 to stop working, and controls the turret 3 to rotate again, driving the electrostatic adsorption mechanism 8 to rotate. The robot arm 7 moves synchronously to the top of the processing station. The robot arm 7 adjusts the chip to the flip-chip position through the program, precisely aligns it with the welding window on the processing station, and then performs the unloading action, flipping the chip from the window onto the copper foil on the upper layer of the product. The eutectic welding assembly is started to complete the flip-chip eutectic welding of the chip and the product. Step S06. After welding is completed, control module 2 controls turret 3 to rotate 90 degrees, driving robot arm 7 to move to dust removal mechanism 4 and electrostatic adsorption mechanism 8 to processing station; then control module 2 controls work platform 1 to start, driving product to move one step, so that the next welding window moves to processing station, and so on until all welding is completed. Step S07. Control module 2 controls the start of work platform 1 to transport the processed product to the unloading station and complete the unloading; control module 2 controls the reset of each component to complete the entire processing flow.

[0038] The above orientation references do not represent the specific orientations of each component in this implementation scheme. This implementation scheme is only for the convenience of describing the scheme and to make relative descriptions based on the orientations of the references. In reality, the specific orientations of each component are based on their actual installation and use, as well as the orientation descriptions that are customary to those skilled in the art. This is hereby stated.

[0039] The specific embodiments described above further illustrate the inventive purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, or improvements made by those skilled in the art within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A flip-chip eutectic processing equipment for LED light strips with double-layer flexible substrate and three-layer copper foil, characterized in that, The system includes a work platform (1), a control module (2), a turret (3), a dust removal mechanism (4), and a fan (5) that provides negative pressure suction to the dust removal mechanism (4). The work platform (1) is used to transport LED light strip double-layer flexible substrate products and has a processing station on it. The welding window of the product can be moved to the processing station in sequence. A turret (3) is installed on the side of the work platform (1). A motor is installed on the turret (3). A robotic arm (6) is installed at the motor power output end. A robotic hand (7) is installed at one end of the robotic arm (6), and an electrostatic adsorption mechanism (8) is installed at the other end at a 180-degree angle relative to the robotic hand (7). The dust removal mechanism (4) is located near the work platform (1) and is located on the rotation path of the electrostatic adsorption mechanism (8) as it rotates out of the processing station. When a welding window of the product is moved to the processing station, the control module (2) controls the motor to drive the robotic arm (6) to rotate, so that the electrostatic adsorption mechanism (8) rotates to the processing station and the robotic arm (7) rotates to the loading station 180 degrees away from the turret (3) opposite to the processing station. At the same time, the control module (2) controls the robotic arm (7) to grab the chip and the electrostatic adsorption mechanism (8) to be energized to adsorb the dust in the welding window. After adsorption is completed, the control motor drives the turret (3) to rotate 90 degrees, which drives the electrostatic adsorption mechanism (8) to the dust removal mechanism (4) and the robot (7) to rotate 90 degrees synchronously. The control also controls the electrostatic adsorption mechanism (8) to de-energize and release dust, and the fan (5) to start so that the dust removal mechanism (4) can suck dust under negative pressure. After cleaning, control the turret (3) to rotate 90 degrees again, drive the electrostatic adsorption mechanism (8) to rotate to the loading station, and the robot (7) to rotate to the processing station. The robot (7) flips the chip to the corresponding welding window and performs the dropping eutectic welding. After welding is completed, control the turret (3) to rotate 90 degrees, drive the robot (7) to the dust removal mechanism (4) and the electrostatic adsorption mechanism (8) to the processing station, and control the work platform (1) to transport the product to move one step so that the next welding window moves to the processing station. Then control the turret (3) to rotate 90 degrees to reset, and repeat the cycle.

2. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 1, characterized in that, The inlet and outlet ends of the working platform (1) are equipped with conveying rollers (9), the two conveying rollers (9) are connected together by a drive, and the working platform (1) is also equipped with an electric drive component that drives the conveying rollers (9) to rotate. The electric drive component is controlled by the control module (2).

3. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 1, characterized in that, The working surface of the working platform (1) is embedded with several suction heads (10), which are flush with the working surface. The fan (5) is provided with two parts of pipeline (11), one part of the pipeline (11) is connected to the suction head (10), and the other part of the pipeline (11) is connected to the dust removal mechanism (4). A first solenoid valve (12) is installed on one part of the pipeline (11), and a second solenoid valve (13) is installed on the other part of the pipeline (11). The first solenoid valve (12) and the second solenoid valve (13) are electrically controlled by the module (2).

4. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 3, characterized in that, Two guide plates (14) are symmetrically mounted on the working surface of the working platform (1) along the material conveying direction, and a material conveying area (15) for conveying LED light strip double-layer flexible substrate products is formed between the two guide plates (14).

5. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 4, characterized in that, The robotic arm (6) is equipped with an electric cylinder (16) at one end of the electrostatic adsorption mechanism (8), and the electrostatic adsorption mechanism (8) is mounted on the actuating rod of the electric cylinder (16).

6. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 5, characterized in that, The control module (2) includes a central control unit (17), a position control unit (18), a drive control unit (19), and a signal processing unit (20) that are electrically connected to each other. The signal processing unit (20) is electrically connected to the position sensor (21) in the position control unit (18) and is used to receive and process the detection signal of the position sensor (21) and then transmit the processed signal to the central control unit (17). The central control unit (17) is used to receive the signal from the signal processing unit (20) and output control commands to the position control unit (18) and the drive control unit (19). The position control unit (18) is used to control the start and stop of the conveying of the work platform (1) and the rotation and positioning of the turret (3) according to the command of the central control unit (17). The drive control unit (19) is used to drive the robot (7), the electrostatic adsorption mechanism (8), and the fan (5) to perform actions according to the command of the central control unit (17) and realize the collaborative operation between the components.

7. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 6, characterized in that, The position sensor (21) is provided on the work platform (1) at the corresponding processing station and on the position control unit (18). The position sensor (21) is electrically connected to the control module (2) and is used to detect whether the welding window of the LED strip double-layer flexible substrate product has reached the preset position of the processing station and to feed back the detection signal to the control module (2). After receiving the detection signal, the control module (2) controls the electric drive component on the work platform (1) to stop conveying.

8. The LED light strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment according to claim 7, characterized in that, The electrostatic adsorption mechanism (8) includes an insulating mounting base (22), an electrostatic generator (23), and an electrode plate (24). The insulating mounting base (22) is fixed on the actuating rod of the electric cylinder (16). The electrostatic generator (23) is embedded in the insulating mounting base (22) and protrudes towards one side of the processing station. The electrode plate (24) is electrically connected to the electrostatic generator (23) and is electrically connected to the drive control unit (19) of the control module (2).

9. A flip-chip eutectic processing technology, using the LED strip double-layer flexible substrate three-layer copper foil flip-chip eutectic processing equipment as described in claim 8, characterized in that, The process includes the following steps: Step S01. Start the processing equipment. The control module (2) controls each component to reset, so that the turret (3) drives the robotic arm (6) to rotate to the initial position: the electrostatic adsorption mechanism (8) is in the non-processing station, and the robotic arm (7) is in the loading station at a 180-degree angle to the turret (3) relative to the processing station; place the LED light strip double-layer flexible substrate product on the work platform (1) to prepare for feeding; Step S02. The control module (2) controls the work platform (1) to start, driving the product to move along the material conveying direction, and at the same time controls the position sensor (21) to detect the position of the product welding window in real time; when the first welding window moves to the preset position of the processing station, the position sensor (21) transmits the detection signal to the control module (2), and the control module (2) controls the work platform (1) to stop conveying; Step S03. The control module (2) controls the motor on the turret (3) to drive the robotic arm (6) to rotate, so that the electrostatic adsorption mechanism (8) rotates to the top of the processing station and the robotic arm (7) rotates to the loading station; the control module (2) controls the electrostatic adsorption mechanism (8) to be energized, and the electrode plate (24) supplies power to the electrostatic generator (23), so that the electrostatic generator (23) generates an electrostatic field to electrostatically adsorb dust and impurities on the surface of the welding window; Step S04. After dust removal is completed, the control module (2) controls the electrostatic adsorption mechanism (8) to be de-energized, the turret (3) rotates 90 degrees, and the electrostatic adsorption mechanism (8) rotates to the dust removal mechanism (4); the control module (2) controls the fan (5) to start, the electrostatic adsorption mechanism (8) is de-energized to release dust, and the dust is sucked into the dust removal mechanism (4) to complete the dust cleaning. Step S05. After the dust cleaning is completed, the control module (2) controls the fan (5) to stop working, and controls the turret (3) to rotate again, driving the electrostatic adsorption mechanism (8) to rotate. The robot (7) moves synchronously to the top of the processing station. The robot (7) adjusts the chip to the flip position through the program, precisely aligns it with the welding window on the processing station, and then performs the unloading action, flipping the chip from the window onto the copper foil on the upper layer of the product. The eutectic welding assembly is started to complete the flip-chip eutectic welding of the chip and the product. Step S06. After welding is completed, the control module (2) controls the turret (3) to rotate 90 degrees, which drives the robot (7) to move to the dust removal mechanism (4) and the electrostatic adsorption mechanism (8) to the processing station; then the control module (2) controls the work platform (1) to start, which drives the product to move one step, so that the next welding window moves to the processing station, and so on until all welding is completed. Step S07. The control module (2) controls the work platform (1) to start, transport the processed product to the unloading station, and complete the unloading; the control module (2) controls each component to reset, and completes the entire processing flow.

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