Ultra-small-caliber ceramic chopper machining method based on femtosecond laser and application of ultra-small-caliber ceramic chopper machining method

By combining femtosecond laser cold processing and AI adaptive control with composite path planning and gas protection, the problems of thermal and mechanical damage in ceramic chopping tool processing have been solved, realizing high-precision, long-life ultra-small diameter ceramic chopping tool processing to meet the performance requirements of advanced semiconductor packaging.

CN122071131APending Publication Date: 2026-05-22GUANGZHOU TIANSONG MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202610165660.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-05
Publication Date
2026-05-22

AI Technical Summary

Technical Problem

Existing technologies cannot effectively process ultra-small diameter ceramic wedges, resulting in problems such as thermal damage, mechanical damage, directional heat accumulation, and unreasonable path planning. These issues make it difficult to meet the comprehensive performance requirements of advanced semiconductor packaging for tip diameter, surface roughness, geometric accuracy, and service life.

Method used

Employing a femtosecond laser cold processing mechanism, combined with a specific process parameter window, a spiral layering and contour offset path planning algorithm, and an AI adaptive closed-loop control strategy that integrates coaxial vision and spectral monitoring, stable processing of composite geometries is achieved through six-axis linkage scanning etching, with inert gas protection and simultaneous debris removal.

Benefits of technology

High-precision machining of composite ceramic chopping tools with a tip diameter ≤50μm has been achieved. The surface is free of molten recast layer, heat-affected zone, and obvious micro-cracks. The surface roughness and geometric accuracy are superior to industry standards, and the service life is greatly improved, making it suitable for advanced semiconductor packaging requirements.

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Abstract

The invention discloses a femtosecond laser-based ultra-small-caliber ceramic chopper processing method and application thereof, relates to the technical field of laser processing, guarantees the processing basic precision by optimizing a blank preparation and fixing mode, realizes accurate removal of materials through beam shaping and parameter adaptation, and improves the processing precision of the ultra-small-caliber ceramic chopper. The forming precision of a complex three-dimensional structure is guaranteed through six-axis linkage scanning and path optimization, secondary damage is avoided through inert gas protection and synchronous chipping removal, machining consistency and stability are guaranteed through AI self-adaptive closed-loop control, and therefore machining of the composite structure ceramic chopper with the tip diameter smaller than or equal to 50 micrometers is stably achieved. The surface of a processed product is free of a fused recasting layer, a heat affected zone and obvious microscopic cracks, the surface roughness and geometric accuracy are superior to those of the mainstream standard of the industry, the service life is greatly prolonged, the performance requirement of advanced semiconductor packaging is perfectly met, and a brand new technical path is provided for efficient and precise manufacturing of the ultra-small-caliber ceramic chopper.
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