Method for manufacturing case for electronic device, and electronic device

Abstract

Provided are: a method for manufacturing a case for an electronic device, which is capable of suppressing deterioration in appearance quality due to a microphone hole; and an electronic device. This method for manufacturing a case for an electronic device comprises: a step for forming a first hole part from the outer surface side of a wall part provided in a metal case member; a surface treatment step for performing a surface treatment on at least the outer surface of the wall part and the inner surface of the first hole part after the step for forming the first hole part; fixing a spacer member having a mounting surface for a microphone module to the inner surface of the wall portion by means of an adhesive member after the surface treatment step; and after the step of fixing the spacer member, forming a second hole portion having an inner diameter smaller than that of the first hole portion coaxially with the first hole portion so as to penetrate from the first hole portion to the mounting surface of the spacer member.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a housing for an electronic device equipped with a microphone module, and to an electronic device. Background Technology

[0002] Electronic devices such as laptop PCs may have microphone modules (see, for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent No. 7569427

[0004] The microphone module described above acquires sound information from outside the housing by creating a microphone hole that penetrates the wall of the housing component. Therefore, a tiny microphone hole is formed through the wall. There are cases where the housing component is made of metal. In this case, if the microphone hole is formed after a surface treatment such as anodizing is performed on the housing component, the inner surface of the microphone hole will be exposed with a metallic sheen, detracting from the appearance of the electronic device.

[0005] However, the microphone module needs to be tightly fitted to the inner surface of the wall through which the microphone hole is formed to ensure airtightness and prevent sound leakage between the inside and outside of the housing. However, there are cases where, depending on the shape of the inner surface of the housing component and the placement of the microphone module, it is impossible to ensure a flat surface on the inner surface of the housing component. In such cases, a spacer with a flat surface needs to be sandwiched between the wall and the microphone module. The spacer is, for example, a resin component. The spacer is fixed to the wall by an adhesive member, forming the microphone hole together with the wall. Therefore, the microphone hole of the spacer needs to be aligned with the microphone hole of the wall. Furthermore, since surface treatments such as anodizing are not possible after fixing the spacer with the adhesive member, the aforementioned metallic luster becomes even more problematic. Summary of the Invention

[0006] The present invention was made in view of the problems of the prior art, and aims to provide a method for manufacturing a housing for electronic devices and an electronic device that can suppress the degradation of appearance quality caused by the microphone hole.

[0007] The manufacturing method of the electronic device housing according to the first aspect of the present invention includes the following steps: forming a first hole from the outer surface side of a wall portion provided on a metal housing member; after forming the first hole portion, performing surface treatment on at least the outer surface of the wall portion and the inner surface of the first hole portion; after performing the surface treatment, fixing a spacer member having a mounting surface for a microphone module to the inner surface of the wall portion by an adhesive member; and after fixing the spacer member, forming a second hole portion with an inner diameter smaller than the first hole portion, coaxially with the first hole portion, in a manner that extends from the first hole portion to the mounting surface of the spacer member.

[0008] The electronic device according to the second aspect of the present invention comprises: a metal housing member having a wall portion and a microphone hole formed through the wall portion; a microphone module disposed on the inner surface side of the wall portion and acquiring sound information through the microphone hole; and a spacer member fixed to the inner surface of the wall portion by an adhesive member, and having a mounting surface for the microphone module on the side of the spacer member opposite to the wall portion side, wherein the microphone hole has: a first hole portion opening on the outer surface of the wall portion; and a second hole portion having an inner diameter smaller than the first hole portion and being formed coaxially with the first hole portion, and extending from the first hole portion to the mounting surface of the spacer member, wherein the housing member is surface treated at least on the outer surface of the wall portion and the inner surface of the first hole portion.

[0009] According to the above-described method of the present invention, it is possible to suppress the degradation of appearance quality caused by the microphone hole. Attached Figure Description

[0010] Figure 1 This is a schematic top view of an electronic device according to one embodiment, viewed from above.

[0011] Figure 2 It is a top view schematically showing the internal structure of the first shell.

[0012] Figure 3A It is an enlarged exploded three-dimensional view of a portion of the shell components.

[0013] Figure 3B Is Figure 3A The diagram shows a perspective view of the housing component with spacer parts and a microphone module installed.

[0014] Figure 4 This is a schematic side sectional view of the first housing at the microphone module and its surrounding area.

[0015] Figure 5 It is about to be Figure 4A schematic side sectional view of the housing component before the second hole is machined.

[0016] Figure 6 This is a flowchart of a method for manufacturing a housing for an electronic device according to one embodiment.

[0017] Explanation of reference numerals in the attached figures

[0018] 10...Electronic device; 11...First housing; 18...Display panel; 20...Housing component; 21...Frame component; 24...Panel; 25...Vertical wall; 36...Microphone module; 40...Microphone element; 43...Gap member; 43a...Mounting surface; 43b...Fixing surface; 45...Adhesive component; 46...Microphone hole; 46a...First hole; 46b...Second hole; 48...Surface treatment. Detailed Implementation

[0019] Hereinafter, preferred embodiments of the manufacturing method of the housing for electronic devices and the electronic devices involved in the present invention will be described in detail with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic top view, taken from above, of the electronic device 10 according to one embodiment. (As shown) Figure 1 As shown, the electronic device 10 in this embodiment is a clamshell laptop PC, and the first housing 11 and the second housing 12 are connected by a hinge 14 to allow relative rotation. In this embodiment, an electronic device 10 based on a laptop PC is illustrated, but the electronic device can be, in addition to a laptop PC, a tablet PC, a display device, a smartphone, or a portable game console, etc.

[0021] The second housing 12 is a flat box and is adjacent to the first housing 11. The interior of the second housing 12 houses various electronic components, including a motherboard housing a CPU, storage devices, and battery devices. The keyboard 16 and touchpad 17 face the upper surface of the second housing 12.

[0022] The first housing 11 is a flat box that is thinner than the second housing 12. The first housing 11 houses a display panel 18. Hereinafter, the first housing 11 and its structural elements will be described using the direction of observation from the display surface 18a of the display panel 18 as a reference. The left-right direction will be referred to as X1 and X2, the up-down direction as Y1 and Y2, and the depth direction as Z1 and Z2. Sometimes the X1 and X2 directions are collectively referred to as the X direction, and the Y1 and Y2 directions and the Z1 and Z2 directions are also sometimes referred to as the Y direction and the Z direction.

[0023] The display surface 18a of the display panel 18 faces the Z1 side surface (front 11a) of the first housing 11. The first housing 11 has a housing member 20 forming a back surface 11b (Z2 side surface) and surrounding side surfaces 11c, and a frame member 21 forming the periphery of the front 11a. The frame member 21 is a frame-shaped member that surrounds the outer periphery of the display panel 18. The front 11a of the first housing 11, including the frame member 21, is covered by a glass plate 22. A hinge 14 connects to the Y2 side edge of the first housing 11.

[0024] The display panel 18 is composed of, for example, a liquid crystal display (LCD) or an organic EL display (OLED). The display panel 18 is constructed by stacking layers of glass, a liquid crystal layer, and a light guide plate, and fixing the outer peripheries of each layer together with double-sided tape, adhesive, or the like. A glass plate 22 covers the display surface 18a, forming a touch panel that receives touch operations on the display panel 18.

[0025] Figure 2 It is a top view schematically showing the internal structure of the first housing 11. Figure 2 The glass plate 22 is omitted from the illustration; the display panel 18 is shown only by its outline through double-dotted lines.

[0026] like Figure 2 As shown, the shell member 20 has a plate portion 24 and a vertical wall 25 erected from the outer periphery of the plate portion 24. The plate portion 24 is a rectangular plate and forms the back surface 11b of the first shell 11. The plate portion 24 may be, for example, a flat plate or a shallow dome-shaped plate that is slightly curved toward the back surface 11b. The vertical wall 25 is a wall portion that rises in the Z1 direction from the outer periphery of the plate portion 24 and forms each side surface 11c of the first shell 11. The Z1 side surface (upper end surface) of the vertical wall 25 becomes the bonding surface of the frame member 21. Figure 1 and Figure 2 Reference numeral 20a in the accompanying drawings refers to a protrusion extending approximately from the center of the Y1-side edge of the housing member 20 in the Y1 direction. The protrusion 20a enlarges the mounting space for the camera module 34 and microphone module 36, which will be described below. The protrusion 20a may be omitted.

[0027] The shell member 20 can be formed from metals such as aluminum alloy or magnesium. The shell member 20 can be formed into a plate portion 24 and a vertical wall 25 from such a metal sheet by, for example, machining or stamping. In this embodiment, the shell member 20, which consists of a plate portion 24 and a vertical wall 25, is formed by stamping an aluminum alloy metal sheet.

[0028] like Figure 2As shown, double-sided adhesive tape 26, bracket 28, wiring section 32, camera module 34, and microphone module 36 are installed on the inner side of the housing component 20.

[0029] The double-sided adhesive tape 26 is, for example, a pair of double-sided adhesive tapes arranged on the left and right sides and extending in the Y direction. The double-sided adhesive tape 26 is a part used to fix the display panel 18 relative to the housing member 20. The double-sided adhesive tape 26 adhesively fixes the back side of the display panel 18 opposite to the display surface 18a and the inner surface 24a of the plate portion 24 (the back side surface of the back side 11b) together.

[0030] For example, a pair of brackets 28 are provided along the left and right sides of the Y2 side edge of the first housing 11, and are respectively bonded and fixed to the inner surface 24a. The brackets 28 are metal parts for threaded connection of the hinges 14. The brackets 28 are electrically connected to the second housing 12 via the metal hinges 14.

[0031] like Figure 2 As shown, the wiring section 32 is constructed from a relatively wide flexible substrate. The wiring section 32 is mounted on the inner surface 24a of the plate section 24. The wiring section 32 is part of the wiring used to connect the camera module 34 and the microphone module 36 to the motherboard on the second housing 12 side. The wiring section 32 is a component obtained by combining the flexible substrate 34a of the camera module 34 (described below) with the flexible substrates 42 of each microphone module 36. A connector 32a for connection to a predetermined relay substrate is mounted at the Y2 side end of the wiring section 32. The wiring section 32 is connected to the motherboard via this relay substrate. Alternatively, the wiring section 32 may be directly connected to the motherboard without using a relay substrate.

[0032] The camera module 34 is a structure in which components such as a camera lens and an IRLED are mounted on a substrate (PCB). The camera lens is a camera capable of video recording, and an image sensor is mounted on the back side of a centrally located light-gathering lens. The IRLED is an infrared camera capable of facial recognition, etc. The camera module 34 is connected to the wiring section 32 via a flexible substrate 34a.

[0033] The microphone module 36 is configured with a pair of microphones arranged on the left and right sides to form a stereo microphone. Alternatively, only one microphone module 36 may be used. The left and right microphone modules 36 may differ in the shape of the flexible substrate 42 and the configuration of the microphone elements 40, as described below, but they may have the same or similar basic structure. Therefore, the left and right microphone modules 36 will not be distinguished below, but will be described uniformly with the same reference numerals.

[0034] Figure 3A It is an exploded perspective view of a portion of the shell component 20. Figure 3B Is Figure 3AThe diagram shows a perspective view of the housing component 20 with the spacer component 43 and microphone module 36 mounted on it. Figure 4 This is a schematic side cross-sectional view of the first housing 11 at the microphone module 36 and its surrounding area.

[0035] like Figures 2-4 As shown, the microphone module 36 is mounted on the Y1 side of the housing member 20 using a spacer member 43. In this embodiment, the microphone module 36 is mounted on the vertical wall 25 of the protrusion 20a, but it can also be mounted on other vertical walls 25. The microphone module 36 can also be mounted on the plate portion 24 using the spacer member 43. In this case, the microphone hole 46 described below penetrates the plate portion 24 in the Z direction, for example.

[0036] The housing member 20 in this embodiment is formed by stamping an aluminum alloy sheet as described above. The upright wall 25 rises from the edge of the plate portion 24. A bow-shaped contraction portion 20b is formed at the bend of the upright wall 25 and the plate portion 24, or in other words, at the root of the upright wall 25. The contraction portion 20b reduces the thickness of the first housing 11 in the Z-direction, further suppressing the exposure of sharp edges.

[0037] The inner surface 25a of such a wall 25 is formed by a curved surface along the contraction 20b, making it difficult to ensure a flat surface for the microphone module 36 to fit snugly. A spacer member 43 is fixed to the inner surface 25a of such a wall 25. The spacer member 43 ensures a flat mounting surface 43a for the microphone module 36 to fit snugly against the inner surface 25a of the wall 25.

[0038] The spacer member 43 is, for example, a resin component formed of PC / ABS. Alternatively, it may be formed from a machined metal component such as aluminum alloy. The spacer member 43 has a mounting surface 43a and a fixing surface 43b. The mounting surface 43a is a flat surface that allows the microphone module 36 to be mounted flush against the surface. The fixing surface 43b is a curved surface located opposite the mounting surface 43a and is fixed flush against the inner surface 25a of the contraction portion 20b. The fixing surface 43b can be fixed to the inner surface 25a by an adhesive member 45, such as an adhesive or double-sided adhesive tape. In this embodiment, an adhesive is used as the adhesive member 45.

[0039] The spacer member 43 may have a notch-shaped portion 43c at the corner of the Z1 side surface near the upright wall 25. The notch-shaped portion 43c is used for fixing the frame member 21.

[0040] like Figure 4As shown, a microphone hole 46 extending in the Y direction is formed through the vertical wall 25 and the spacer member 43. The microphone hole 46 is a through hole that communicates with the sound hole 40a of the microphone element 40 and transmits sound information from outside the first housing 11 to the microphone element 40.

[0041] The microphone hole 46 has a stepped shape formed by the continuous connection of a first hole portion 46a and a second hole portion 46b with different inner diameters. The first hole portion 46a opens on the outer surface 25b of the vertical wall 25. The first hole portion 46a may not penetrate the vertical wall 25 in the plate thickness direction (Y direction). In other words, the first hole portion 46a may have a deep surface (bottom surface) formed by a portion of the vertical wall 25. The second hole portion 46b extends from the deep surface of the first hole portion 46a to the mounting surface 43a of the spacer member 43. The second hole portion 46b may include a portion 46b1 that penetrates the vertical wall 25 on the deep side of the first hole portion 46a and a portion 46b2 that penetrates the spacer member 43. The holes 46a and 46b are formed coaxially, and the inner diameter of the second hole portion 46b is smaller than that of the first hole portion 46a.

[0042] like Figures 2-4 As shown, the microphone module 36 can have a microphone element 40 and a flexible substrate 42.

[0043] The microphone element 40 is, for example, a MEMS microphone with a diaphragm mounted on a substrate (PCB: Printed Circuit Board), or a MEMS microphone that shields the IC chip. The sound hole 40a forms an opening on the mounting surface 43a of the microphone element 40, and penetrates the flexible substrate 42. The sound hole 40a communicates with the microphone hole 46, which penetrates the spacer member 43 and the vertical wall 25. The sound hole 40a is the sound input portion of the microphone module 36 and communicates with the diaphragm inside the microphone element 40. The microphone element 40 is fixed to the inner surface 25a of the vertical wall 25 via the spacer member 43 and can acquire sound information from outside the first housing 11 through the microphone hole 46.

[0044] A microphone element 40 is mounted on the Y1 side end of a flexible printed circuit (FPC) 42. The flexible printed circuit 42 is a wiring component that connects the microphone element 40 to the wiring portion 32. The microphone element 40 is mounted on the end of the flexible printed circuit 42. This end is upright in the Z direction and is tightly fixed to the mounting surface 43a of the spacer member 43 by double-sided adhesive tape or adhesive.

[0045] like Figure 4As shown by the dashed line, the housing member 20 is surface-treated 48 at least on the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. Surface treatment 48 is, for example, anodizing or painting, for example, black. Surface treatment 48 is also applied to the outer surface (back surface 11b) of the plate portion 24. Alternatively, surface treatment 48 may also be applied to the inner surface 25a of the vertical wall 25 and the inner surface 24a of the plate portion 24.

[0046] Although details will be described below, in this embodiment, the microphone hole 46 has a first hole portion 46a formed before the surface treatment 48 is applied, and a second hole portion 46b formed after the surface treatment 48 is applied. Therefore, the inner surface of the first hole portion 46a is subjected to the surface treatment 48. On the other hand, the inner surface of the portion 46b1 formed at the metal vertical wall 25 in the second hole portion 46b is not subjected to the surface treatment 48, and the unprocessed surface of the aluminum alloy forming the vertical wall 25 is exposed.

[0047] like Figures 3A-4 As shown, the frame member 21 can be positioned on the Z1 side surface (upper end) of the vertical wall 25 and can be fixed relative to the vertical wall 25 by means of the adhesive member 45. The frame member 21 has a flat support surface 21a facing the Z1 side. The edge of the glass plate 22 is fixed to the support surface 21a by means of double-sided adhesive tape, adhesive or the like.

[0048] In the frame member 21, at the position overlapping with the spacer member 43, there is a recessed portion 21b that is recessed towards the Y1 side, including the support surface 21a. The spacer member 43 is received in the recessed portion 21b and is also fixed relative to the frame member 21 by the adhesive member 45. For the frame member 21, a protruding portion protruding below the support surface 21a is inserted into the notch-shaped portion 43c of the spacer member 43. This protruding portion is fixed relative to the spacer member 43 and the vertical wall 25 by the adhesive member 45.

[0049] like Figure 3B and Figure 4 As shown, the Z1 side surface (end face 43d) of the spacer member 43 is positioned one step lower than the support surface 21a towards the Z2 side. That is, there is also a possibility that the adhesive member 45, which fixes the frame member 21 to the spacer member 43, overflows towards the end face 43d before curing. Even in this case, because the end face 43d is lower than the support surface 21a, it prevents the overflowing adhesive member 45 from protruding towards the Z1 side from the support surface 21a and pressing against the glass plate 22.

[0050] Next, the manufacturing method of the first housing 11 will be described, focusing on the method of forming the microphone hole 46 and its surrounding parts.

[0051] Figure 5 It is about to be Figure 4A schematic side sectional view of the housing member 20 before the second hole 46b is machined. Figure 6 This is a flowchart of a method for manufacturing a housing for an electronic device according to one embodiment.

[0052] First of all, Figure 6 In step S1, a first hole 46a is formed in the vertical wall 25 of the housing member 20. In this embodiment, the first hole 46a is a concave hole that does not penetrate the vertical wall 25 (see reference). Figure 5 ).

[0053] In step S2, as Figure 5 As shown, a surface treatment 48 is applied to the surface of the housing member 20. The surface treatment 48 is applied to at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. As a result, the vertical wall 25 and the inner surface of the first hole 46a formed on the vertical wall 25 are subjected to the same surface treatment 48, and the first hole 46a is less noticeable in the appearance of the housing member 20.

[0054] In step S3, as Figure 5 As shown, the fixing surface 43b of the spacer member 43 is fixed to the inner surface 25a of the vertical wall 25 by the adhesive member 45. At this time, the lower surface (Z2 side surface) of the spacer member 43 can also be fixed to the inner surface 24a of the plate portion 24 by the adhesive member 45. The spacer member 43 is fixed to the inner surface 25a at the depth side of the first hole portion 46a, thereby being positioned at the position overlapping with the first hole portion 46a in the Y direction.

[0055] In step S4, as Figure 5 As shown, a frame member 21 is fixed to the upright wall 25 and the spacer member 43. The frame member 21 is a frame-shaped member formed in a manner that surrounds the frame-shaped upright wall 25. As described above, the frame member 21 is configured such that the recessed portion 21b covers the spacer member 43.

[0056] In this embodiment, the frame member 21 is formed from a resin component made of the same PC / ABS as the spacer member 43. Therefore, since the spacer member 43 is integrally formed on a portion of the frame member 21, the number of components can be reduced. In this case, the fixing process of the spacer member 43 (step S3) and the fixing process of the frame member 21 (step S4) become the same process.

[0057] Depending on the type of electronic device, it is also conceivable that the housing for mounting the microphone module 36 is not the same as the housing for mounting the display panel 18. In this case, the frame member 21 is omitted, and step S4 is omitted.

[0058] In step S5, as Figure 5As shown, a second hole 46b is formed using a predetermined drilling tool T to construct the microphone hole 46. Examples of drilling tools T include machining tools such as drill bits and laser drilling machines. As described above, the inner diameter of the second hole 46b is smaller than the inner diameter of the first hole 46a. Therefore, the drilling tool T can drill the second hole 46b along a direction (Y2 direction) from the outer surface 25b side of the vertical wall 25 toward the deep surface of the first hole 46a. The second hole 46b is formed to penetrate the vertical wall 25 from the deep surface of the first hole 46a, and further penetrates the adhesive member 45 and the spacer member 43. Figure 5 Reference numeral 43e in the accompanying drawing is a countersunk recess. The recess 43e prevents burrs from protruding onto the mounting surface 43a when the second hole 46b is formed.

[0059] Through the above processes, the microphone hole 46 and its surrounding portion are formed relative to the housing member 20 constituting the first housing 11. The first housing 11 thus manufactured uses double-sided adhesive tape or similar materials to fix the microphone module 36 to the mounting surface 43a of the spacer member 43, connecting the sound hole 40a with the second hole 46b. Thus, the mounting of the microphone module 36 is completed. Subsequently, the first housing 11 is completed by appropriately mounting the bracket 28, the display panel 18, and the glass plate 22, etc.

[0060] As described above, the manufacturing method of the first housing 11 according to this embodiment includes the following steps: For a wall portion (vertical wall 25 in this embodiment) provided on a metal housing member 20, a first hole 46a is formed from the outer surface 25b side of the wall portion. The manufacturing method includes the following steps: After the step of forming the first hole 46a, a surface treatment 48 is performed on at least the outer surface 25b of the vertical wall 25 and the inner surface of the first hole 46a. The manufacturing method includes the following steps: After the step of performing the surface treatment 48, a spacer member 43 having a mounting surface 43a of a microphone module 36 is fixed to the inner surface 25a of the vertical wall 25 by an adhesive member 45. The manufacturing method includes the following steps: After the step of fixing the spacer member 43, a second hole 46b with an inner diameter smaller than the first hole 46a is formed coaxially with the first hole 46a, extending from the first hole 46a to the mounting surface 43a of the spacer member 43.

[0061] According to this manufacturing method, the microphone hole 46 of the metal housing member 20 is processed in two stages: a first hole 46a and a second hole 46b. The first hole 46a is formed before the surface treatment 48, and the second hole 46b is formed after the surface treatment 48. Thus, the housing member 20 maintains a state where the inner surface of the first hole 46a, which opens onto the outer surface 25b, has been surface treated 48. On the other hand, the metallic luster produced by the metal forming the housing member 20 is exposed on the inner surface of the second hole 46b. However, the second hole 46b has a smaller diameter than the first hole 46a and is located deep within the first hole 46a. Therefore, even when the metallic luster is exposed on the inner surface of the second hole 46b, the situation where the metallic luster is more prominent on the appearance of the first housing 11 is suppressed. As a result, according to this manufacturing method, it is possible to suppress the degradation of the appearance quality of the first housing 11 caused by the microphone hole 46.

[0062] In this manufacturing method, the process of fixing the spacer member 43 with the adhesive member 45 is performed after the surface treatment 48 and before the formation of the second hole 46b. This prevents the adhesive member 45 used to fix the spacer member 43 from peeling off during the surface treatment 48. Furthermore, even if the spacer member 43 is made of resin, this prevents potential deformation due to the anodized surface treatment 48. Further, this manufacturing method forms the second hole 46b after fixing the spacer member 43 with the adhesive member 45. This allows the second hole 46b to smoothly extend from the vertical wall 25 to the spacer member 43 without any step difference. That is, it prevents misalignment of the microphone hole 46 at the vertical wall 25 portion and the spacer member 43 portion.

[0063] In this embodiment, for example, the inner diameter of the first hole 46a is approximately 1.2 mm, and the inner diameter of the second hole 46b is approximately 0.8 mm. This more effectively suppresses the situation where the surface treatment 48 on the inner surface of the first hole 46a is damaged by the drilling tool T during the formation of the second hole 46b, thus exposing the metallic luster. The inner diameters of the holes 46a and 46b are not limited to this. Furthermore, it is preferable that the inner diameter of the first hole 46a is, for example, 0.2 mm or more larger than the inner diameter of the second hole 46b. This more effectively suppresses the damage to the surface treatment 48 of the first hole 46a during the construction of the second hole 46b using a conventional drilling tool T.

[0064] Preferably, the first hole 46a is formed without penetrating the vertical wall 25, and the second hole 46b is formed to penetrate from the vertical wall 25 remaining at the depth side of the first hole 46a to the spacer member 43. This prevents the adhesive member 45 from leaking into the first hole 46a when the spacer member 43 is fixed. Consequently, it prevents the adhesive member 45 from clogging the first hole 46a or contaminating the surface treatment 48 provided on the inner surface of the first hole 46a.

[0065] Preferably, the depth of the first hole 46a is greater than the depth of the portion 46b1 formed at least at the vertical wall 25 in the second hole 46b. If the depth of the portion 46b1 with metallic luster is made smaller than the depth of the first hole 46a, the metallic luster will be less noticeable on the appearance of the first housing 11.

[0066] Furthermore, the electronic device 10 according to this embodiment includes: a metal housing member 20, which has a microphone hole 46 formed through a wall portion (vertical wall 25 in this embodiment); a microphone module 36 that acquires sound information through the microphone hole 46; and a spacer member 43, which is fixed to the inner surface 25a of the vertical wall 25 by an adhesive member 45, and has a mounting surface 43a on the side opposite to the vertical wall 25. The microphone hole 46 has: a first hole portion 46a that opens into the outer surface 25b of the vertical wall 25; and a second hole portion 46b that has an inner diameter smaller than the first hole portion 46a and is formed coaxially with the first hole portion 46a, and extends from the first hole portion 46a to the mounting surface 43a of the spacer member 43. The housing member 20 is surface treated 48 at least on the outer surface 25b of the vertical wall 25 and the inner surface of the first hole portion 46a.

[0067] According to such an electronic device 10, the microphone hole 46 is formed in two stages: a first hole portion 46a and a second hole portion 46b. The electronic device 10 undergoes a surface treatment 48 at least on the outer surface 25b of the vertical wall 25 and the inner surface of the first hole portion 46a. Therefore, the housing member 20 constituting the electronic device 10 can be manufactured by forming the second hole portion 46b deep within the first hole portion 46a after the surface treatment 48 is applied. Thus, even if the luster of the metal forming the housing member 20 is exposed at the inner surface of the second hole portion 46b, the luster of the metal can be suppressed from becoming prominent on the appearance of the first housing 11. As a result, the electronic device 10 can suppress the degradation of the appearance quality of the first housing 11 caused by the microphone hole 46.

[0068] Furthermore, the present invention is not limited to the above-described embodiments, and it is self-evident that it can be freely modified within the scope of the spirit of the present invention.

Claims

1. A method for manufacturing a housing for an electronic device, characterized in that, It has the following processes: For a wall portion provided on a metal housing component, a first hole portion is formed from the outer surface side of the wall portion; After the process of forming the first hole, at least the outer surface of the wall and the inner surface of the first hole are subjected to surface treatment; After the surface treatment process is performed, the spacer with the microphone module mounting surface is fixed to the inner surface of the wall by an adhesive component; as well as After the process of fixing the spacer member, a second hole with a smaller inner diameter than the first hole is formed coaxially with the first hole, extending from the first hole to the mounting surface of the spacer member.

2. The method for manufacturing a housing for an electronic device according to claim 1, characterized in that, In the process of forming the first hole, the first hole is formed in a manner that does not penetrate the wall portion. In the process of forming the second hole, the second hole is formed in such a way that it extends from the wall portion located at the deep side of the first hole to the spacer member.

3. The method for manufacturing a housing for an electronic device according to claim 2, characterized in that, The depth of the first hole is greater than the depth of at least the portion of the second hole formed at the wall portion.

4. The method for manufacturing a housing for an electronic device according to any one of claims 1 to 3, characterized in that, The shell member has a plate portion and upright walls rising from the edge portion of the plate portion. The wall portion is the vertical wall.

5. The method for manufacturing a housing for an electronic device according to claim 4, characterized in that, The shell component is formed by stamping a metal plate to create the plate portion and the vertical wall.

6. The method for manufacturing a housing for an electronic device according to claim 4, characterized in that, The housing for the electronic device is a housing that houses the display panel. The process includes the following steps: after the step of fixing the spacer member and before the step of forming the second hole, a frame member for supporting the edge of the surface plate covering the surface of the display panel is fixed to the wall and the spacer member by an adhesive member.

7. An electronic device, characterized in that, have: A metal housing component having a wall portion through which a microphone hole is formed; A microphone module, disposed on the inner surface of the wall portion, acquires sound information through the microphone hole; and A spacer component, which is fixed to the inner surface of the wall portion by an adhesive member, and has a mounting surface for the microphone module on the side opposite to the wall portion. The microphone hole has: The first hole opens on the outer surface of the wall portion; and The second hole has a smaller inner diameter than the first hole and is formed coaxially with the first hole, extending from the first hole to the mounting surface of the spacer member. The housing component is surface treated at least on the outer surface of the wall portion and the inner surface of the first hole portion.

8. The electronic device according to claim 7, characterized in that, The first hole does not penetrate the wall portion. The second hole extends from the wall portion located at the deep side of the first hole to the spacer member.

9. The electronic device according to claim 7 or 8, characterized in that, The surface treatment was not performed on the inner surface of the second hole.

10. The electronic device according to claim 7 or 8, characterized in that, The shell member has a plate portion and upright walls rising from the edge portion of the plate portion. The wall portion is the vertical wall.

11. The electronic device according to claim 10, characterized in that, have: The display panel is supported by the housing component; Surface panel, which covers the surface of the display panel; and A frame member, which is fixed relative to the upright wall and the spacer member by an adhesive member, and supports the edge of the surface plate.

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