Component crimping device and component crimping method

Abstract

The invention provides a component crimping device and a component crimping method capable of crimping components even on a large substrate. A component crimping device is provided with: a transport unit (60) that transports a substrate (3) to a reference position; a stage (37) on which the substrate transported by the transport unit is placed; a moving unit (substrate moving mechanism (31)) that moves the stage between a pressure-bonding position at which the component (5) is pressure-bonded to the substrate and a reference position; a crimping unit (crimping tool (34)) that crimps the component to the substrate placed on the stage at the crimping position; and a control unit (2a) that controls the transport unit, the moving unit, and the crimping unit, the control unit causing the transport unit and the moving unit to perform a first crimping operation in which the crimping unit performs crimping with respect to a component in a first region (3b) in the substrate, and a second crimping operation in which the crimping unit performs crimping with respect to a component in a second region (3c) different from the first region in the substrate. A position changing operation for changing the relative position of the substrate with respect to the stage is performed.

Description

Technical Field

[0001] This disclosure relates to a component crimping device and a component crimping method. Background Technology

[0002] Conventionally, in component pressing apparatus for substrate pressing components, a process is performed to place a component on an anisotropic conductive film (ACF) attached to the substrate. This apparatus performs the following process: after aligning the component held in the component holding device with the side edge of the substrate, it is attached to a given position and temporarily pressed.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-317784 Summary of the Invention

[0006] -The problem the invention aims to solve-

[0007] However, for large substrates that exceed the range of possible positioning of components based on component holding devices, it is currently impossible to press the components onto the side edges of the substrate.

[0008] Therefore, the purpose of this disclosure is to provide a component pressing device, etc., that can press components onto large substrates.

[0009] -Methods used to solve problems-

[0010] The component pressing apparatus disclosed herein includes: a transport unit for transporting a substrate to a reference position; a stage for holding the substrate transported by the transport unit; a moving unit for moving the stage between a pressing position for pressing a component onto the substrate and the reference position; a pressing unit for pressing a component onto the substrate placed on the stage at the pressing position; and a control unit for controlling the transport unit, the moving unit, and the pressing unit, wherein the control unit causes the transport unit and the moving unit to perform a position change operation between a first pressing operation and a second pressing operation, changing the relative position of the substrate with respect to the stage, wherein the first pressing operation causes the pressing unit to press the component onto a first region of the substrate, and the second pressing operation causes the pressing unit to press the component onto a second region of the substrate that is different from the first region.

[0011] The component pressing method disclosed herein is performed by a component pressing apparatus comprising: a transport unit for transporting a substrate to a reference position; a stage for holding the substrate transported by the transport unit; a moving unit for moving the stage between a pressing position for pressing a component onto the substrate and the reference position; and a pressing unit for pressing a component onto the substrate placed on the stage at the pressing position. In the component pressing method, the transport unit and the moving unit perform a position changing operation between a first pressing operation and a second pressing operation to change the relative position of the substrate with respect to the stage. The first pressing operation causes the pressing unit to press the component onto a first region of the substrate, and the second pressing operation causes the pressing unit to press the component onto a second region of the substrate that is different from the first region.

[0012] -Invention Effects-

[0013] According to this disclosure, a component pressing apparatus and the like can be provided that can press components onto large substrates.

[0014] Further advantages and effects of one aspect of this disclosure are clear from the specification and accompanying drawings. These advantages and / or effects are provided by several embodiments and features described in the specification and accompanying drawings, but it is not necessary to provide all of them in order to obtain one or more identical features. Attached Figure Description

[0015] Figure 1 This is a diagram showing the outline structure of the component assembly production line involved in the embodiment.

[0016] Figure 2 This is a top view of the component assembly production line in the implementation method.

[0017] Figure 3 It is a block diagram showing the computer and the various components controlled by the computer in the component assembly production line.

[0018] Figure 4 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0019] Figure 5 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0020] Figure 6 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0021] Figure 7 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0022] Figure 8 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0023] Figure 9 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0024] Figure 10 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0025] Figure 11 This is an explanatory diagram showing one step of the component crimping method according to the embodiment.

[0026] -Explanation of Figure Markers-

[0027] 1. Component assembly production line (component crimping device)

[0028] 1a, 1b, 1c bases

[0029] 2 Computers

[0030] 2a Control Department

[0031] 2b Storage Section

[0032] 3 substrate

[0033] 3a Edge

[0034] 3b First Area

[0035] 3C Second Region

[0036] 4 Electrode section

[0037] 5 components

[0038] 10 Board loading department

[0039] 11 platforms

[0040] Adsorption pores 11a, 23a, 37a, 49a, 51a

[0041] 20 Adhesive Part

[0042] 21, 41 Substrate moving mechanism

[0043] 22. Adhesion Mechanism

[0044] Platforms 23, 37, 49, and 51

[0045] 30 Temporary crimping section

[0046] 31. Substrate moving mechanism (moving part)

[0047] 32-component mounting mechanism

[0048] 33 Component Supply Department

[0049] 33a Supply reel

[0050] 33b Punching Section

[0051] 33c Movable Stage

[0052] 33d orbit

[0053] 34 Crimping tool (crimping part)

[0054] 35 Component Transfer Section

[0055] 36 Support section

[0056] 40 Formal crimping section

[0057] 42. Crimping mechanism

[0058] 50 Board unloading section

[0059] 60. Transport Department

[0060] 61 Mobile Base

[0061] 62A, 62B, 62C, 62D substrate handling mechanism

[0062] 63 Base

[0063] 64-arm unit

[0064] Lx Single-dot dashed line

[0065] Ly single-dot dashed line

[0066] P1 origin. Detailed Implementation

[0067] The component pressing apparatus according to the first aspect of this disclosure includes: a transport unit for transporting a substrate to a reference position; a stage for holding the substrate transported by the transport unit; a moving unit for moving the stage between a pressing position for pressing a component onto the substrate and the reference position; a pressing unit for pressing a component onto the substrate placed on the stage at the pressing position; and a control unit for controlling the transport unit, the moving unit, and the pressing unit, wherein the control unit causes the transport unit and the moving unit to perform a position change operation between a first pressing operation and a second pressing operation, changing the relative position of the substrate with respect to the stage, wherein the first pressing operation causes the pressing unit to press the component onto a first region of the substrate, and the second pressing operation causes the pressing unit to press the component onto a second region of the substrate that is different from the first region.

[0068] Therefore, since a position change operation is performed between the first and second pressing operations, the relative position of the substrate with respect to the stage is changed, allowing the second region of the substrate to be positioned on the stage within a range that can be moved to the pressing portion. In other words, the second region of the substrate, which could not be pressed with a component in the first pressing operation, becomes capable of being pressed with a component in the second pressing operation. Thus, even large substrates with a second region that could not be pressed with a component in the first pressing operation can be pressed with components.

[0069] In the component pressing device of the second method, as described in the first method, the control unit may perform the following actions as part of the position change operation: a first action, moving the stage on which the substrate is placed to the reference position via the moving part; a second action, after the first action, transferring the substrate from the stage to the transport unit; a third action, after the second action, moving the stage closer to the second region via the moving part; and a fourth action, after the third action, transferring the substrate from the transport unit to the stage.

[0070] Therefore, since the first action, the second action, the third action and the fourth action are executed sequentially in the position change operation, the change of the relative position of the substrate with respect to the stage can be performed smoothly.

[0071] The component pressing method disclosed in the third aspect is performed by a component pressing apparatus, which includes: a transport unit for transporting a substrate to a reference position; a stage for holding the substrate transported by the transport unit; a moving unit for moving the stage between a pressing position where the component is pressed onto the substrate and the reference position; and a pressing unit for pressing the component onto the substrate placed on the stage at the pressing position. In the component pressing method, the transport unit and the moving unit perform a position changing operation between a first pressing operation and a second pressing operation to change the relative position of the substrate with respect to the stage. The first pressing operation causes the pressing unit to press the component for a first region in the substrate, and the second pressing operation causes the pressing unit to press the component for a second region in the substrate that is different from the first region.

[0072] Therefore, since a position change operation is performed between the first and second pressing operations, the relative position of the substrate with respect to the stage is changed, allowing the second region of the substrate to be positioned on the stage within a range that can be moved to the pressing portion. In other words, the second region of the substrate, which could not be pressed with a component in the first pressing operation, becomes capable of being pressed with a component in the second pressing operation. Thus, even large substrates with a second region that could not be pressed with a component in the first pressing operation can be pressed with components.

[0073] (Implementation Method)

[0074] The embodiments will now be described in detail with reference to the accompanying drawings.

[0075] Furthermore, the embodiments described below are general or specific examples. The numerical values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection methods, steps, and order of steps shown in the following embodiments are examples and are not intended to limit this disclosure. Additionally, constituent elements in the following embodiments not described in the independent claims representing the highest-level concept are described as arbitrary constituent elements. Furthermore, the figures are schematic diagrams and not necessarily strictly illustrative. Also, in the figures, the same structural members are labeled with the same reference numerals.

[0076] [Overview of the component assembly production line]

[0077] Figure 1 This diagram illustrates the general structure of the component mounting production line 1 according to the embodiment. The component mounting production line 1 in this embodiment is a system for producing products such as display panels (i.e., mounting substrates) by mounting components 5 onto a substrate 3 such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. Furthermore, the components 5 are, for example, electronic components such as drive circuits. Additionally, the component mounting production line 1 is an example of the component pressing apparatus according to this disclosure.

[0078] like Figure 1 As shown, such a component assembly line 1 includes: a substrate loading section 10, an adhesive section 20, a temporary pressing section 30, a formal pressing section 40, and a substrate unloading section 50. The substrate loading section 10, adhesive section 20, temporary pressing section 30, formal pressing section 40, and substrate unloading section 50 are arranged in this order.

[0079] The substrate loading section 10 receives a rectangular substrate 3 loaded from an operator or other device on the upstream side. The substrate 3 is then loaded onto the adhesive section 20 on the downstream side.

[0080] The bonding section 20 receives the substrate 3 transferred from the substrate transfer section 10, and bonds ACF or the like as an adhesive member to each of the plurality of electrode sections 4 located around the periphery of the substrate 3. The substrate 3 with the adhesive member bonded thereto is then transferred to the temporary pressing section 30. Furthermore, the plurality of electrode sections 4 are, for example, each composed of a plurality of electrodes.

[0081] The temporary pressing section 30 receives the substrate 3 taken out from the bonding section 20, and attaches the component 5 to the part of the substrate 3 where the adhesive member is bonded, and performs temporary pressing. Then, the substrate 3 with the component 5 temporarily pressed on is moved out to the formal pressing section 40.

[0082] The formal pressing section 40 receives the substrate 3 from the temporary pressing section 30 and performs formal pressing (also known as hot pressing) on ​​the component 5 temporarily pressed onto the substrate 3. Then, the substrate 3 that has undergone formal pressing is moved to the substrate removal section 50.

[0083] The substrate removal section 50 receives the substrate 3 removed from the formal pressing section 40. The substrate 3 received in the substrate removal section 50 is then moved downstream.

[0084] In this way, the component assembly production line 1 performs a component assembly operation in which components 5 are installed in each of the multiple electrode sections 4 located around the substrate 3 being transported, and the substrate 3 with the components 5 installed is transported out from the substrate removal section 50 as a mounting substrate.

[0085] [Detailed Structure of the Component Assembly Production Line]

[0086] Figure 2 This is a top view of the component assembly production line 1 in the embodiment. Specifically, Figure 2 The structure of the component assembly line 1 is shown from above. Furthermore, in this embodiment, the transport direction of the substrate 3, i.e., the left-right direction, is referred to as the X-axis direction; the vertical direction, i.e., the up-down direction, is referred to as the Z-axis direction; and the direction perpendicular to both the X-axis and Z-axis directions, i.e., the depth direction, is referred to as the Y-axis direction. Additionally, the negative and positive X-axis directions correspond to the upstream and downstream sides of the substrate 3's transport direction, respectively; the negative and positive Z-axis directions correspond to the lower and upper sides of the vertical direction, respectively; and the negative and positive Y-axis directions correspond to the near-front and deep sides, or the front and rear sides, respectively, of the depth direction.

[0087] The substrate loading section 10 includes a base 1a for placing the loaded substrate 3. A platform 11 for placing the substrate 3 is provided on the base 1a of the substrate loading section 10. The platform 11 moves up and down relative to the base 1a in the Z-axis direction. Furthermore, a plurality of suction holes 11a are provided on the upper surface of the platform 11. The platform 11 is used to vacuum-suction the substrate 3, which is brought in from the operator or other upstream device and placed on the platform 11, through the suction holes 11a by a suction device such as a pump (not shown), and holds it thereon.

[0088] The bonding section 20 is equipped with the function of bonding ACF, which serves as a bonding member, to the electrode section 4 of the substrate 3. The bonding section 20 includes a substrate moving mechanism 21 and a bonding mechanism 22.

[0089] The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis worktable movable in the X-axis direction, a Y-axis worktable movable in the Y-axis direction, a Z-axis worktable movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis worktable, Y-axis worktable, Z-axis worktable, and stage 23 are sequentially stacked on the base 1b from bottom to top.

[0090] The Y-axis worktable extends along the Y-axis direction and moves freely along the X-axis direction on the X-axis worktable. The Z-axis worktable moves freely along the Y-axis direction on the Y-axis worktable, causing the upper platform 23 to rise and fall along the Z-axis direction and rotate around the Z-axis.

[0091] In addition, a plurality of adsorption holes 23a are provided on the upper surface of the stage 23, and the stage 23 vacuum adsorbs and holds the substrate 3 placed on the upper surface. In this way, the substrate moving mechanism 21 adsorbs and holds the substrate 3, causing it to move in the horizontal plane (specifically, in the X-axis and Y-axis directions), rise and fall in the vertical direction (i.e., in the Z-axis direction), and rotate around the Z-axis.

[0092] The bonding mechanism 22 has, for example, two bonding mechanism units arranged along the X-axis direction above the base 1b. Each bonding mechanism unit has an ACF supply section for supplying ACF, an adhesive joint for bonding the ACF to the substrate 3, and an adhesive support platform disposed below the adhesive joint. These two bonding mechanism units respectively bond the ACF supplied from the ACF supply section to positions corresponding to the plurality of electrode sections 4 on the substrate 3 supported by the adhesive support platform by raising and lowering the adhesive joint.

[0093] The temporary pressing unit 30 performs a temporary pressing operation by mounting the component 5 on the area of ​​the substrate 3 where the ACF is bonded (i.e., the pressing target area) and temporarily pressing it. The temporary pressing unit 30 includes: a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transfer unit 35.

[0094] The substrate moving mechanism 31 has the same structure as the substrate moving mechanism 21 of the bonding part 20. Specifically, the substrate moving mechanism 31 has a stage 37 for holding the substrate 3. A plurality of adsorption holes 37a are provided on the upper surface of the stage 37. The substrate moving mechanism 31 uses the plurality of adsorption holes 37a to vacuum adsorb and hold the substrate 3 placed on the stage 37. In addition, the substrate moving mechanism 31 has the function of moving the stage 37 holding the substrate 3 in the horizontal plane, moving it up and down in the vertical direction, and rotating it about the Z-axis. Through the movement and rotation of the stage 37, the substrate moving mechanism 31 positions the area of ​​the substrate 3 held with ACF bonded above the support part 36 of the support stage of the component mounting mechanism 32.

[0095] The component supply unit 33 is configured to extend from the rear of the base 1b on the depth side (i.e., in the positive Y-axis direction) of the component mounting mechanism 32. For example, the component supply unit 33 includes a supply reel 33a for winding a tape carrier package (TCP) or other tape component on which the component 5 is assembled, a punching section 33b, a movable platform 33c, and a track 33d. Such a component supply unit 33 supplies the component 5 sequentially from the tape component through the operation of these components.

[0096] The component transfer unit 35 moves the component 5 supplied from the component supply unit 33 toward the crimping tool 34 included in the component mounting mechanism 32.

[0097] The component mounting mechanism 32 is mounted on the base 1b and includes a crimping tool 34 and a support 36.

[0098] The support portion 36 is a long strip-shaped member that supports the substrate 3 from below. In other words, the support portion 36 supports a predetermined portion of the substrate 3 held on the stage 37, i.e., the crimping target portion, from below. Furthermore, this crimping target portion is the portion of the substrate 3 where ACF is bonded.

[0099] The crimping tool 34 holds the component 5 and crimps the component 5 onto the upper surface of the substrate 3 supported by the support portion 36. In other words, the crimping tool 34 is an example of a crimping portion that crimps the component 5 onto the crimping target area of ​​the substrate 3. Specifically, the crimping tool 34 moves up and down in the Z-axis direction, adsorbing (that is, picking up) the component 5 moved by the component transfer portion 35 from above. Furthermore, the crimping tool 34 temporarily crimps the component 5 onto the substrate 3 by mounting the adsorbed component 5 on the ACF and pressing it together with the substrate 3 against the support portion 36. The crimping tool 34 is fixed in both the X-axis and Y-axis directions. The position of this crimping tool 34 is referred to as the crimping position. Furthermore, the temporary crimping portion 30 may also include a mechanism that rotates the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0100] The formal pressing section 40 performs a formal pressing operation (also called a hot pressing operation) that formally presses (that is, heat-presses) the component 5, which is temporarily pressed onto the substrate 3 by the temporary pressing section 30, onto the substrate 3. In this way, the electrode section 4 and the component 5 formed on the substrate 3 are electrically connected via ACF. Such a formal pressing section 40 includes a substrate moving mechanism 41 and a pressing mechanism 42.

[0101] The substrate moving mechanism 41 has the same structure as the substrate moving mechanism 21 of the bonding portion 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of adsorption holes 49a are provided on the upper surface of the stage 49. The substrate moving mechanism 41 uses the plurality of adsorption holes 49a to vacuum adsorb and hold the substrate 3 placed on the stage 49. In addition, the substrate moving mechanism 41 has the function of moving the stage 49 holding the adsorbed substrate 3 in the horizontal plane, moving it up and down in the vertical direction, and rotating it about the Z-axis. Through the movement and rotation of the stage 49, the substrate moving mechanism 41 positions the area of ​​the adsorbed and held substrate 3 where the temporary pressing member 5 is attached above the pressing support portion of the pressing mechanism 42.

[0102] The crimping mechanism 42 presses the component 5 of the substrate 3 toward the crimping support side using a heated head. Thus, the component 5 is formally crimped, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via an ACF (Acoustic Coefficient of Form). In other words, the crimping mechanism 42 is an example of a crimping portion. The crimping mechanism 42 is fixed in both the X-axis and Y-axis directions.

[0103] The substrate removal unit 50 has the function of vacuum adsorbing the substrate 3 transported from the formal pressing unit 40 onto the stage 51 and holding it there. The substrate 3 held in the substrate removal unit 50 is moved to other downstream devices or removed from the stage 51 by an operator. The stage 51 moves up and down relative to the base 1c in the Z-axis direction. In addition, a plurality of adsorption holes 51a are provided on the upper surface of the stage 51, on which the stage 51 vacuum adsorbs and holds the substrate 3 transferred from the formal pressing unit 40.

[0104] The transport unit 60 is a device for transporting the substrate 3. Specifically, the transport unit 60 has the function of transferring (transferring) the substrate 3, which has been transported into the substrate transport unit 10, to the bonding unit 20, the temporary pressing unit 30, the formal pressing unit 40, and the substrate removal unit 50 in that order. The transport unit 60 is disposed in the area in front of the bonding unit 20, the temporary pressing unit 30, and the formal pressing unit 40 (i.e., in the negative Y-axis direction).

[0105] The transport unit 60 has a substrate transport mechanism 62A, substrate transport mechanism 62B, substrate transport mechanism 62C, and substrate transport mechanism 62D arranged sequentially from the upstream side on a movable base 61 extending along the X-axis direction throughout the bases 1a, 1b, and 1c. Each of the substrate transport mechanisms 62A to 62D has a base 63 and one or more arm units 64. In this embodiment, an example is shown where each of the substrate transport mechanisms 62A to 62D has two arm units 64. The base 63 is provided on the movable base 61 and can move freely along the X-axis direction. Two arm units 64 are arranged along the X-axis direction on the base 63. The arm units 64 vacuum-adsorb the substrate 3 from above.

[0106] Substrate transport mechanisms 62A to 62D move to substrate transfer positions where substrates 3 held above by stages 11, 23, 37, 49, and 51 are vacuum-adsorbed, and receive or transfer substrates 3 from the moving stages 11, 23, 37, 49, and 51. For example, substrate transport mechanism 62A receives substrate 3 placed on stage 11 of substrate loading section 10 and transfers it to stage 23 of bonding section 20. Alternatively, substrate transport mechanism 62B receives substrate 3 from stage 23 of bonding section 20 and transfers it to stage 37 of temporary pressing section 30. Alternatively, substrate transport mechanism 62C receives substrate 3 from stage 37 of temporary pressing section 30 and transfers it to stage 49 of formal pressing section 40. Alternatively, substrate transport mechanism 62D receives substrate 3 from stage 49 of formal pressing section 40 and transfers it to stage 51 of substrate unloading section 50.

[0107] Figure 3 This is a block diagram showing the computer and the various components controlled by the computer in the component assembly production line 1.

[0108] like Figure 3 As shown, the component assembly line 1 includes a computer 2. This computer 2 is communicatively connected to, for example, the bonding section 20, the temporary pressing section 30, the formal pressing section 40, and the transport section 60 via control lines, and controls these sections. The computer 2 includes a control unit 2a and a storage unit 2b.

[0109] The storage unit 2b stores various data required for component installation operations, such as the size of the substrate 3, the types of components 5 mounted on the substrate 3, their mounting positions, mounting directions, and timing for transferring the substrate 3, as well as the control program executed by the control unit 2a. The storage unit 2b is implemented using read-only memory (ROM) or random access memory (RAM), etc.

[0110] The control unit 2a controls the substrate moving mechanism 21 of the bonding unit 20, the substrate moving mechanism 31 of the temporary pressing unit 30, the substrate moving mechanism 41 of the formal pressing unit 40, and the transport unit 60, and performs a substrate transfer operation to move the substrate 3 between each unit to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is carried out synchronously between each unit.

[0111] For example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 21 by controlling the bonding unit 20, and changes the spacing of multiple bonding joints by the head moving motor, so that the bonding unit 20 performs the bonding operation of bonding ACF to the substrate 3 by the bonding mechanism 22.

[0112] Additionally, for example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 31 by controlling the temporary pressing unit 30, so that the component mounting mechanism 32 performs temporary pressing of the component 5 onto the substrate 3. In addition, the control unit 2a moves the component 5 temporarily pressed onto the substrate 3 toward the component mounting mechanism 32 by controlling the component supply unit 33 and the component transfer unit 35.

[0113] In addition, for example, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate moving mechanism 41 by controlling the formal pressing unit 40, so that the pressing mechanism 42 performs formal pressing on the component 5 temporarily pressed onto the substrate 3.

[0114] Such a control unit 2a is implemented, for example, by a control program stored in a storage unit 2b for controlling the various parts and mechanisms of the component assembly production line 1, and a processor such as a central processing unit (CPU) that executes the control program.

[0115] [Component crimping method]

[0116] Next, the component crimping method involved in the implementation method will be described. Figures 4 to 11 This is an explanatory diagram illustrating each step of the component crimping method according to the embodiment. In this embodiment, the operation in the temporary crimping section 30 is illustrated, but the same operation can also be performed in the formal crimping section 40. The component crimping method is executed by controlling each section through the control unit 2a.

[0117] exist Figure 4 The image shows the state after the substrate 3 has been placed on the stage 37 of the temporary pressing section 30 by the substrate transport mechanism 62B. In this state, the stage 37 is positioned at a reference position. The reference position is the origin P1 of the temporary pressing section 30 (at... Figure 4The reference position is the intersection of the single-dot dashed lines Lx and Ly. Specifically, at the reference position, the center of the stage 37 viewed from above is approximately the same as the origin P1. Furthermore, the center of the crimping tool 34 in the X-axis direction is positioned in the positive Y-axis direction of the origin P1.

[0118] like Figure 4 As shown, the substrate 3 is positioned relative to the stage 37 located at the reference position, biased towards the negative X-axis direction and the positive Y-axis direction. This state is designated as the first placement state. In the first placement state, multiple ACFs are arranged along the X-axis direction at the edge 3a of the substrate 3, which protrudes from the stage 37 in the positive Y-axis direction. Here, at the edge 3a of the substrate 3, the area opposite to the stage 37 is designated as the first region 3b, and the area in the edge 3a other than the first region 3b is designated as the second region 3c.

[0119] Area 3b is in Figure 4 The region 3b in the first mounting state is a longer area along the X-axis, enclosed by a double-dotted line. This first region 3b is included within the movable range of the stage 37, which is implemented by the substrate moving mechanism 31, and is positioned directly below the crimping tool 34. In other words, in the first mounting state, when the stage 37 is moved by the substrate moving mechanism 31, the first region 3b is positioned directly below the crimping tool 34. Therefore, the ACF within the first region 3b in the first mounting state moves directly below the crimping tool 34 by moving the stage 37 via the substrate moving mechanism 31.

[0120] The second area 3c is in Figure 4 The area marked with dotted shades is the region located in the negative X-axis direction of the first region 3b. The second region 3c in the first mounting state is a region that will not be positioned directly below the crimping tool 34 even if the stage 37 is moved by the substrate moving mechanism 31. Therefore, the ACF within the second region 3c in the first mounting state will not move directly below the crimping tool 34 even if the stage 37 is moved by the substrate moving mechanism 31.

[0121] The control unit 2a controls the substrate moving mechanism 31, moving the stage 37 in the first placement state to sequentially position the ACFs in the first region 3b directly below the crimping tool 34. This position is the crimping position of the substrate 3 crimping member 5. Whenever each ACF in the first region 3b is positioned directly below the crimping tool 34, the control unit 2a controls the component mounting mechanism 32 to temporarily crimp the component 5 onto the ACF using the crimping tool 34. This process of temporarily crimping the component 5 onto the ACFs in the first region 3b is an example of the first crimping operation.

[0122] exist Figure 5The diagram shows the state in which the ACF at its end in the negative X-axis direction within the first region 3b is positioned directly below the crimping tool 34 during the first crimping operation. When temporary crimping is applied to the ACF, the control unit 2a performs a position change operation. A position change operation refers to the operation of changing the relative position of the substrate 3 with respect to the stage 37. As a position change operation, the control unit 2a executes the first, second, third, and fourth actions in that sequence.

[0123] In the first operation, the control unit 2a controls the substrate moving mechanism 31, such as... Figure 6 As shown, the stage 37 is restored from the pressing position to the reference position. In other words, the substrate moving mechanism 31 is an example of a moving part that moves the stage 37 between the pressing position and the reference position.

[0124] In the second operation, after the first operation, the control unit 2a performs the transfer of the substrate 3 from the stage 37 to the transport unit 60. Specifically, the control unit 2a controls the substrate transport mechanism 62C of the transport unit 60, such as... Figure 7 As shown, a substrate 3 in a first mounting state is received from the stage 37, causing the substrate 3 to move from the stage 37 in the positive Z-axis direction and float up. Figure 7 In the diagram, the substrate 3, which is floating from the stage 37, is shown in dashed lines. The control unit 2a controls the substrate transport mechanism 62C to keep the substrate 3 stationary so that its position in the X-axis and Y-axis directions remains unchanged.

[0125] In the third action, after the second action, the control unit 2a uses the substrate moving mechanism 31 to bring the stage 37 closer to the second region 3c. Specifically, the control unit 2a controls the substrate moving mechanism 31, such as... Figure 8 As shown, the stage 37 is moved in the negative X-axis direction, thereby bringing it closer to the second region 3c of the substrate 3, which is in a state of floating off the stage 37. As a result, the relative position of the substrate 3 and the stage 37 is changed.

[0126] In the fourth operation, after the third operation, the control unit 2a performs the transfer of the substrate 3 from the transport unit 60 to the platform 37. Specifically, the control unit 2a controls the substrate transport mechanism 62C of the transport unit 60, such as... Figure 9 As shown, the substrate 3 is moved in the negative Z-axis direction and placed on the stage 37. This state is designated as the second placement state. Compared to the first placement state, the relative position of the substrate 3 and the stage 37 is changed in the second placement state. The second region 3c of the substrate 3 is included in the region that can be positioned directly below the pressing tool 34, which is within the movable range realized by the stage 37 of the substrate moving mechanism 31. Thus, the position change operation is completed.

[0127] Next, the control unit 2a controls the substrate moving mechanism 31, such as... Figure 10 As shown, the stage 37, which is in the second loading state, is moved to the reference position.

[0128] Next, the control unit 2a controls the substrate moving mechanism 31, such as... Figure 11 As shown, the stage 37 in the second mounting state is moved, thereby positioning the ACF in the second region 3c directly below the crimping tool 34 (crimping position). Then, the control unit 2a controls the component mounting mechanism 32 to temporarily crimp the component 5 onto the ACF in the second region 3c using the crimping tool 34. This process of temporarily crimping the component 5 onto the ACF in the second region 3c is an example of a second crimping operation.

[0129] [Effects, etc.]

[0130] As described above, according to this embodiment, a position change operation is performed between the first pressing operation and the second pressing operation, and the relative position of the substrate 3 with respect to the stage 37 is changed. Therefore, the second region 3c of the substrate 3 can be positioned on the stage 37 within a range that allows it to move to the pressing tool 34. In other words, the second region 3c of the substrate 3, which could not be pressed with the component 5 in the first pressing operation, becomes capable of pressing with the component 5 in the second pressing operation. Therefore, even for a large substrate 3 having a second region 3c that could not be pressed with the component 5 in the first pressing operation, the component 5 can also be pressed.

[0131] In particular, during the position change operation, the first action, the second action, the third action, and the fourth action are executed sequentially, thus enabling the smooth execution of the change in the relative position of the substrate 3 with respect to the stage 37.

[0132] (other)

[0133] The component crimping device and the like have been described above based on the embodiments described above; however, this disclosure is not limited to these embodiments. Various modifications conceived by those skilled in the art to the above embodiments can also be included within the scope of this disclosure, provided they do not depart from its spirit.

[0134] For example, in the above embodiments, the substrate 3 is a liquid crystal panel, and the component 5 is temporarily pressed and then formally pressed onto the liquid crystal panel. However, the substrate 3 may also be a substrate other than a liquid crystal panel.

[0135] Industrial availability

[0136] This disclosure can be applied, for example, to component pressing apparatuses for pressing components onto substrates.

Claims

1. A component crimping device, comprising: The transport unit moves the substrate to the reference position; A stage for holding the substrate transported by the transport unit; The moving part moves the stage between the pressing position where the component is pressed onto the substrate and the reference position; The crimping section, at the crimping position, crimps the component onto the substrate placed on the stage; and The control unit controls the conveying unit, the moving unit, and the pressing unit. The control unit performs the following processing: Between the first pressing operation and the second pressing operation, the conveying unit and the moving unit perform a position change operation to change the relative position of the substrate with respect to the stage. The first pressing operation causes the pressing unit to press the component in a first region of the substrate, and the second pressing operation causes the pressing unit to press the component in a second region of the substrate that is different from the first region.

2. The component crimping device according to claim 1, wherein, As part of the location change operation, the control unit performs the following actions: The first action is to move the stage on which the substrate is placed to the reference position by means of the moving part; The second action, following the first action, involves transferring the substrate from the platform to the transport unit. The third action, following the second action, involves moving the platform closer to the second region via the moving part; and The fourth action is to transfer the substrate from the transport unit to the platform after the third action.

3. A component crimping method, performed by a component crimping device, The component crimping device includes: The transport unit moves the substrate to the reference position; A stage for holding the substrate transported by the transport unit; The moving part moves the stage between the pressing position where the component is pressed onto the substrate and the reference position; and The crimping section crimps the component onto the substrate placed on the stage at the crimping position. In the component crimping method described above. Between the first pressing operation and the second pressing operation, the conveying unit and the moving unit perform a position change operation to change the relative position of the substrate with respect to the stage. The first pressing operation causes the pressing unit to press the component in a first region of the substrate, and the second pressing operation causes the pressing unit to press the component in a second region of the substrate that is different from the first region.

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