Heat dissipation film, backboard assembly, display screen and electronic equipment

Abstract

The embodiment of the invention provides a heat dissipation film, a backboard assembly, a display screen and electronic equipment, and belongs to the technical field of heat dissipation. The heat dissipation film comprises a graphene layer and a plurality of first through holes. Wherein the graphene layer comprises a bending area and non-bending areas, and the two opposite sides, in the first direction, of the bending area are each connected with one non-bending area. The multiple first through holes are located in the bending area, and each first through hole penetrates through the graphene layer in the thickness direction of the heat dissipation film. Therefore, by reducing the stress in the bending process of the heat dissipation film, the heat dissipation film has high bending resistance.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation film, a backplate assembly, a display screen, and electronic equipment. Background Technology

[0002] As foldable electronic devices become increasingly thinner, the overall thickness of these devices is decreasing, leading to significant heat generation. In related technologies, foldable electronic devices incorporate a heat dissipation film laid on the surface of the mid-frame. However, this heat dissipation film has limited stretchability and is prone to breakage during the bending process of the foldable electronic device. Summary of the Invention

[0003] This application provides a heat dissipation film, a backplane assembly, a display screen, and an electronic device. By reducing the stress during the bending process of the heat dissipation film, the heat dissipation film has high bending resistance and avoids breakage.

[0004] In a first aspect, embodiments of this application provide a heat dissipation film, comprising: a graphene layer and a plurality of first through holes. The graphene layer includes bent regions and non-bent regions, with a non-bent region connected to each opposite side of the bent region in a first direction. The plurality of first through holes are all located in the bent regions, and each first through hole penetrates the graphene layer along the thickness direction of the heat dissipation film.

[0005] In this embodiment, due to the high thermal conductivity of graphene, the heat dissipation film possesses high thermal conductivity, enabling it to rapidly transfer heat from high-temperature areas to low-temperature areas. For example, when applied inside electronic devices, the heat dissipation film adheres to the back of the display screen, uniformly and rapidly transferring heat from the display screen to various parts of the device, ensuring the display screen temperature remains within a reasonable range and balancing the overall heat of the device. Furthermore, by providing a first through-hole in the bending area of ​​the graphene layer, the stress during the bending process of the heat dissipation film can be effectively reduced, improving the internal stress during bending and increasing the tensile strength and fatigue resistance of the heat dissipation film. This results in high bending resistance and prevents breakage at the bending points.

[0006] In one possible implementation, the orthographic projection of each first through-hole onto the reference plane lies within the orthographic projection of the bending region onto the reference plane, where the reference plane is the plane containing the first direction and the second direction. The thickness direction of the heat dissipation film is defined as the third direction, and the first direction, the second direction, and the third direction are mutually perpendicular.

[0007] In one possible implementation, the heat dissipation film further includes a plurality of first elastic elements, each corresponding to a first through hole, with each first elastic element filling the interior of the corresponding first through hole.

[0008] In this implementation, the first elastic element is made of an elastic material (such as elastic glue). Filling the first elastic element inside the first through hole can increase the tensile resilience at the bend of the heat dissipation film, thereby improving the tensile resilience performance of the heat dissipation film.

[0009] In one possible implementation, the first elastic element is made of at least one of the following materials: thermoplastic polyurethane elastomer, polydimethylsiloxane, acrylate, and epoxy resin, to increase the tensile resilience of the heat dissipation film.

[0010] In one possible implementation, the heat dissipation film further includes a protective layer comprising a first protective portion and a second protective portion. The first protective portion is a flexible protective portion, fixedly connected to the graphene layer and covering the bending areas. The second protective portion is fixedly connected to the graphene layer and corresponds one-to-one with the non-bending areas. Each second protective portion is attached to a corresponding non-bending area, and the second protective portion and the first protective portion are located on the same side of the graphene layer along a third direction. The first protective portion has a second protective portion connected to each of its opposite sides in the first direction.

[0011] In this implementation, the protective layer protects the graphene layer and prevents it from breaking or shedding when bent. Furthermore, when the flexible protective part is made of an elastic material, the tensile resilience of the heat dissipation film can be further increased to prevent breakage when bent.

[0012] In one possible implementation, the surface of the first protective part away from the graphene layer is flush with the surface of the second protective part away from the graphene layer, ensuring the flatness of the protective layer surface away from the graphene layer.

[0013] In one possible implementation, the heat dissipation film further includes a first elastic element filled in the first through hole, the first elastic element being an integral structure with the first protective part.

[0014] In this implementation, the first protective part and the first elastic element are both made of the same elastic material, and the first elastic element and the first protective part can be manufactured in one step using the same process. For example, an elastic adhesive can be applied to the bending area using a dispensing process to form the first protective part and the first elastic element.

[0015] In one possible implementation, at least one first through hole is a strip hole, the length of which is greater than its width, and the width direction of at least one strip hole is parallel to the first direction.

[0016] In this implementation, the length direction of the strip hole is perpendicular to the first direction, which is perpendicular to the axis of the rotating shaft assembly of the electronic device. Therefore, the length direction of the strip hole is parallel to the axis of the rotating shaft assembly of the electronic device, which can further reduce the internal stress of the graphene layer when it is bent and ensure the heat dissipation area of ​​the heat dissipation film.

[0017] In one possible implementation, the heat dissipation film includes multiple rows of through holes arranged side-by-side and spaced apart along a second direction, with each row including multiple first through holes arranged along a first direction. The thickness direction of the heat dissipation film is defined as a third direction, and the first, second, and third directions are mutually perpendicular.

[0018] In this implementation, by staggering the first through holes of multiple through hole rows, the total area of ​​the first through holes is reduced while the stress at the bending point is decreased when the heat dissipation film is bent.

[0019] In one possible implementation, the ratio of the total area occupied by all the first through holes on the surface of the bend to the surface area of ​​the bend is greater than or equal to 1 / 20 and less than or equal to 1 / 2.

[0020] In this implementation, the total area of ​​the first through hole and the area of ​​the bending zone are limited to between 1 / 20 and 1 / 2, which improves the internal stress of the heat dissipation film while ensuring the heat dissipation area, effectively balancing the heat dissipation capacity and bending resistance of the heat dissipation film.

[0021] In one possible implementation, the heat dissipation film further includes an adhesive layer that is bonded to the graphene layer and stacked with the graphene layer in a third direction.

[0022] In this implementation, the adhesive layer serves as a connecting structure for the heat dissipation film. For example, the heat dissipation film is bonded to the display screen through the adhesive layer, thereby achieving a fixed connection between the heat dissipation film and the display screen.

[0023] In one possible implementation, the heat dissipation film further includes a second through-hole that penetrates the adhesive layer along the thickness direction.

[0024] In this implementation, the second through-hole penetrates the adhesive layer, which can further improve the stress at the bending point when the heat dissipation film is bent, enhance the bending resistance of the heat dissipation film, and prevent breakage.

[0025] In one possible implementation, the heat dissipation film further includes a plurality of second elastic elements, each corresponding to a second through hole, with each second elastic element filling the interior of the corresponding second through hole.

[0026] In this implementation, the second elastic element is made of an elastic material (e.g., elastic adhesive). Filling the interior of the second through hole with the second elastic element can increase the tensile resilience at the bend of the heat dissipation film, thereby improving the tensile resilience performance of the heat dissipation film.

[0027] In one possible implementation, along a third direction, the thickness of the bent region is greater than the thickness of the non-bent region, one side surface of the non-bent region is flush with one side surface of the bent region, and the other side surface of the non-bent region is spaced apart from the other side surface of the bent region.

[0028] In this implementation, the thickness of the bending area is greater than the thickness of the non-bending area, which can reduce the volume of the heat dissipation film.

[0029] In one possible implementation, the ratio of the area of ​​the folded region to the total area of ​​all non-folded regions is greater than or equal to 1 / 50 and less than or equal to 1 / 2.

[0030] Secondly, embodiments of this application provide a backplate assembly, which includes a backplate and a heat dissipation film as described in any of the first aspects, wherein the heat dissipation film is fixedly connected to one side of the backplate.

[0031] In one embodiment of this application, the display screen and the heat dissipation film are integrated by integrating the heat dissipation film onto the back panel of the display screen. The area of ​​the heat dissipation film can be set to a large area to increase the heat dissipation area of ​​the heat dissipation film and enable the heat dissipation film to have high heat dissipation capacity.

[0032] In one possible implementation, the backplate has a groove along the third direction on the side closest to the heat dissipation film. The heat dissipation film includes a graphene layer, the thickness of the bent area of ​​the graphene layer is greater than the thickness of the non-bent area of ​​the graphene layer, and the bent area is partially embedded inside the groove.

[0033] In this implementation, the bending area is partially embedded inside the groove, and the thickness of the bending area is greater than the thickness of the non-bending area, which makes the thickness of the heat dissipation film and the back plate stacked smaller, thus achieving a thinner back plate assembly design.

[0034] In one possible implementation, the graphene layer is fixedly connected to the backsheet.

[0035] In this implementation, the graphene layer can be directly connected to the backplate via hot pressing, which reduces the thermal resistance between the graphene layer and the backplate, further improving the heat dissipation effect of the heat dissipation film. Additionally, it allows for a further reduction in the stacking thickness of the heat dissipation film and the backplate.

[0036] In one possible implementation, the heat dissipation film includes a laminated adhesive layer and a graphene layer, with the opposite sides of the adhesive layer bonded to a backplate and the graphene layer, respectively.

[0037] In this implementation, the heat dissipation film is connected to the backplate through an adhesive layer, reducing the difficulty of assembling the heat dissipation film and the backplate.

[0038] Thirdly, embodiments of this application provide a display screen, which includes a display module and a backplate assembly as described in any of the second aspects, wherein the display module is located on the side of the backplate away from the heat dissipation film and is fixedly connected to the backplate.

[0039] Fourthly, according to an embodiment of this application, an electronic device includes a housing assembly and a display screen as described in the third aspect, the display screen being mounted on the housing assembly. The housing assembly includes a first housing, a second housing, and a pivot assembly connecting the first housing and the second housing, the first housing and the second housing being able to be relatively unfolded or folded relative to each other by movement of the pivot assembly.

[0040] In one possible implementation, the orthographic projection of the bending area of ​​the heat dissipation film onto the reference plane covers the orthographic projection of the rotating shaft assembly onto the reference plane. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of an electronic device unfolded according to an embodiment of this application;

[0042] Figure 2 This is a schematic diagram of an electronic device folded according to an embodiment of this application;

[0043] Figure 3 for Figure 1 A cross-sectional view of the display screen shown;

[0044] Figure 4 for Figure 3 A cross-sectional schematic diagram of the backplane assembly in the middle;

[0045] Figure 5 for Figure 4 A cross-sectional schematic diagram of the heat dissipation film shown.

[0046] Figure 6 for Figure 5 A top-view schematic diagram of the graphene layer in the image;

[0047] Figure 7 A top view schematic diagram showing another graphene layer cooperating with a first through hole, provided for an embodiment of this application;

[0048] Figure 8 A top view schematic diagram showing another example of a graphene layer cooperating with a first through-hole, provided in an embodiment of this application;

[0049] Figure 9 A top view schematic diagram of another first through hole provided in an embodiment of this application;

[0050] Figure 10 A top view schematic diagram illustrating another instance of a graphene layer engaging with a first through-hole, provided in an embodiment of this application;

[0051] Figure 11 A top view schematic diagram showing another example of a graphene layer cooperating with a first through-hole, provided in an embodiment of this application;

[0052] Figure 12 A cross-sectional schematic diagram of another heat dissipation film provided in an embodiment of this application;

[0053] Figure 13 A cross-sectional schematic diagram of another backplane assembly provided in an embodiment of this application;

[0054] Figure 14 A cross-sectional schematic diagram of another backplane assembly provided in an embodiment of this application;

[0055] Explanation of reference numerals in the attached figures:

[0056] 10. Heat dissipation film;

[0057] 11. Graphene layer; 11a. Bending region; 11b. Non-bending region;

[0058] 12. First through hole; 12a. First strip hole; 12b. Second strip hole;

[0059] 13. First elastic element; 14. First protective part; 15. Second protective part; 16. Adhesive layer; 17. Second through hole; 18. Protective layer; 19. Second elastic element;

[0060] 20. Back plate; 20a. Bending body; 20b. Non-bending body; 21. Groove; 22. Third through hole;

[0061] 100. Display screen; 100a. First screen area; 100b. Second screen area; 100c. Third screen area;

[0062] 110. Back panel assembly; 120. Display module;

[0063] 200. Housing assembly; 210. First housing; 220. Second housing; 230. Rotating shaft assembly;

[0064] X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0065] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0066] Figure 1 This is a schematic diagram of an electronic device unfolded according to an embodiment of this application. Figure 2 This is a schematic diagram of an electronic device folded according to an embodiment of this application.

[0067] This application provides an electronic device that is foldable and has an unfolded state (e.g., ...). Figure 1 (as shown) and folded state (as shown) Figure 2 As shown, it can change its shape by folding and unfolding to meet the needs of users in different scenarios. For example, it can be folded when carried to reduce the size of the electronic device; when in use, it can be unfolded to increase the size of the screen used for display or operation.

[0068] The electronic devices provided in this application can be foldable electronic products such as mobile phones, tablets, laptops, wearable devices, and virtual reality devices. This application uses a foldable mobile phone as an example for illustration.

[0069] See Figure 1 The electronic device includes a housing 200 and a display screen 100. The display screen 100 can be used for image display or as a virtual keyboard for information input, and it is mounted on the housing 200. The housing 200 supports the display screen 100 and allows the electronic device to switch between an unfolded and folded state.

[0070] In some embodiments, the electronic device may further include multiple components (not shown in the figures), which may be installed inside the housing device 200. These components may include, for example, a processor, internal memory, an external memory interface, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker, a receiver, a microphone, a headphone jack, a sensor module, buttons, a motor, an indicator, and a subscriber identification module (SIM) card interface. The electronic device may have more or fewer components than described above, may combine two or more components, or may have different component configurations. The various components may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits (ASICs).

[0071] For example, see [link to previous article] Figure 1 and Figure 2The housing assembly 200 includes a first housing 210, a second housing 220, and a pivot assembly 230. The first housing 210 and the second housing 220 are located on opposite sides of the pivot assembly 230, and the first housing 210 and the second housing 220 are fixedly connected to opposite sides of the pivot assembly 230, respectively. In practical implementation, the pivot assembly 230 can be fixedly connected to the first housing 210 and the second housing 220 by welding, bonding, or bolting. The first housing 210 and the second housing 220 can be relatively unfolded or folded by the movement of the pivot assembly 230. Furthermore, the first housing 210 and the second housing 220 can be used to install devices such as processors, batteries, and cameras.

[0072] In this embodiment of the application, see again Figure 1 The two ends of the display screen 100 are respectively mounted on the first housing 210 and the second housing 220. It should be noted that the display screen 100 is disposed on the same surface of the first housing 210, the second housing 220 and the pivot assembly 230, and the pivot assembly 230 can be used to support the display screen 100.

[0073] See also Figure 1 The display screen 100 may include a first screen area 100a, a second screen area 100b, and a third screen area 100c connected in sequence. The first screen area 100a is fixed on the first housing 210, and the third screen area 100c is fixed on the second housing 220. The first screen area 100a and the third screen area 100c can be fixed by means of adhesive bonding or other methods. The pivot assembly 230 is used to support the second screen area 100b.

[0074] In the embodiments of this application, see Figure 1 and Figure 2The hinge assembly 230 can switch between an unfolded state and a folded state. When the hinge assembly 230 is in the unfolded state, the first housing 210, the second housing 220, and the display screen 100 can be unfolded. At this time, the first housing 210 and the second housing 220 can be approximately 180° apart (a slight deviation is allowed, such as 165°, 177°, or 185°). The second screen area 100b of the display screen 100 can be unfolded, and the first screen area 100a and the third screen area 100c can be in the same plane (a slight deviation is allowed). When the hinge assembly 230 is in the folded state, the first housing 210, the second housing 220, and the display screen 100 can be folded. At this time, the first housing 210 and the second housing 220 can be completely closed to be parallel to each other (a slight deviation is allowed). The second screen area 100b of the display screen 100 is bent and deformed, and the first screen area 100a and the third screen area 100c can also be closed to be parallel to each other (a slight deviation is allowed). Of course, the hinge assembly 230 also has an intermediate state during the switching process between the unfolded state and the folded state. The electronic device can achieve the folding and unfolding of the electronic device by switching the unfolded state and the folded state of the hinge assembly 230, thereby causing the first housing 210, the second housing 220 and the display screen 100 to move accordingly.

[0075] It should be noted that the electronic device may include a hinge assembly 230 and a first housing 210 and a second housing 220 respectively fastened to opposite sides of the hinge assembly 230. The first housing 210 and the second housing 220 may be rotated toward each other to be stacked and rotated toward each other to be on the same plane (a slight deviation is allowed). At this time, the electronic device may be folded into two layers.

[0076] The electronic device may also include two or more first housings 210 arranged side by side, with a second housing 220 disposed between every two adjacent first housings 210. Each first housing 210 and its adjacent second housing 220 are connected by a pivot assembly 230. In this case, the electronic device can be folded into three or more layers. For example, the electronic device includes two first housings 210 and one second housing 220, with the second housing 220 disposed between the two first housings 210. The two sides of the second housing 220 are rotatably connected to one of the first housings 210 via a pivot assembly 230. Both first housings can rotate relative to the second housing 220 to face each other to be stacked, or the two first housings can rotate relative to the second housing 220 to face away from each other to be coplanar with the second housing 220 (a slight deviation is allowed). In this case, the electronic device can be folded into three layers.

[0077] Figure 3 for Figure 1 A cross-sectional view of the display screen 100 shown.

[0078] like Figure 3 As shown, the display screen 100 includes a display module 120 and a back panel assembly 110. The display module 120 has a display side and a back side. The display side is the side of the display module 120 that displays the operating interface or screen, and the back side is the side of the display module 120 that is opposite to the display side. The back panel assembly 110 is located on the back side of the display module 120 and is connected to the display module 120.

[0079] Among them, the display module 120 is a flexible screen, which can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a MiniLED display, a MicroLED display, a Micro-OLED display, a quantum dot light-emitting diode (QLED) display, etc.

[0080] The backplane assembly 110 provided in this application will be described in detail below with reference to specific embodiments.

[0081] Example 1

[0082] like Figure 3 As shown, the backplate assembly 110 includes a backplate 20 and a heat dissipation film 10. The heat dissipation film 10 is fixedly connected to one side of the backplate 20, and the display module 120 is located on the side of the backplate 20 away from the heat dissipation film 10 and is fixedly connected to the backplate 20. Therefore, the heat dissipation film 10 and the display module 120 are located on opposite sides of the backplate 20. The backplate 20 supports the display module 120 and increases its structural rigidity. The heat dissipation film 10 transfers heat from high-temperature areas inside the electronic device to low-temperature areas, for example, transferring the heat generated by the display module 120 to various parts of the device body in a timely manner, thus achieving a heat dissipation effect that balances the overall heat of the electronic device.

[0083] The material of the back panel 20 may include, but is not limited to, carbon fiber, titanium alloy, polyethylene terephthalate (PET), etc.

[0084] Figure 4 for Figure 3 A cross-sectional schematic diagram of the back panel assembly 110.

[0085] like Figure 4 As shown, the back panel 20 includes a bent body 20a and a non-bent body 20b. A non-bent body 20b is connected to each of the opposite sides of the bent body 20a. The bent body 20a is located in the second screen area 100b, and a non-bent body 20b is respectively disposed in the first screen area 100a and the third screen area 100c.

[0086] During the bending process of the display screen 100, at least a portion of the back plate 20 bends along with the display screen 100. Therefore, the portion of the back plate 20 that bends along with the display screen 100 is defined as a bent body 20a, and the portion of the back plate 20 that does not bend along with the display screen 100 is defined as a non-bending body 20b.

[0087] In one embodiment, the stiffness of the bent body 20a of the back plate 20 located in the second screen area 100b is less than the stiffness of the non-bent body 20b located in the first screen area 100a and the third screen area 100c. That is, the stiffness of the bent body 20a of the back plate 20 located in the second screen area 100b is smaller, and the stiffness of the non-bent body 20b of the back plate 20 located in the first screen area 100a and the third screen area 100c is larger. This allows the display screen 100 to balance structural stiffness and high flatness, while the second screen area 100b of the display screen 100 can also be bent smoothly.

[0088] In one embodiment, the back panel 20 is shaped like a bamboo book and is composed of multiple strips connected sequentially by a flexible material, which allows the display screen 100 to have both high structural rigidity and the ability to be bent smoothly. In another embodiment, the bending body 20a of the back panel 20 is provided with multiple third through holes 22. By providing the third through holes 22, the rigidity of the bending body 20a is reduced, which allows the display screen 100 to have both high structural rigidity and the ability to be bent smoothly.

[0089] It is understandable that a portion of the heat dissipation film 10 is located in the second screen area 100b, and another portion of the heat dissipation film 10 is located in the first screen area 100a and the third screen area 100c. The portion of the heat dissipation film 10 located in the second screen area 100b will bend as the display screen 100 is bent.

[0090] See Figure 3 The heat dissipation film 10 is attached to the side of the back plate 20 away from the display module 120. The heat dissipation film 10 can cover the entire or most of the back plate 20, making the heat dissipation area of ​​the heat dissipation film 10 a large area design, so that the heat dissipation film 10 has a high heat dissipation capacity. It can be understood that the larger the area of ​​the front projection of the heat dissipation film 10 on the back plate 20, the better the heat dissipation effect of the heat dissipation film 10.

[0091] In this embodiment, for ease of description, the thickness direction of the heat dissipation film 10 is defined as the third direction Z, and the first direction X, the second direction Y, and the third direction Z are mutually perpendicular, that is, the first direction X is perpendicular to the second direction Y, the second direction Y is perpendicular to the third direction Z, and the third direction Z is perpendicular to the first direction X. It should be noted that the thickness direction mentioned in this disclosure is defined as the thickness direction of the heat dissipation film 10 in its flat, unfolded state. The heat dissipation film 10 in its flat, unfolded state has a unique and definite thickness direction, as referenced... Figure 3 Arrow Z indicates the direction. In practical applications, the heat dissipation film 10 can be in a folded or bent state. For example, the heat dissipation film 10 has two non-bent areas 11b overlapping each other in a folded state. In the folded state, the bent area 11a can remain flat or be partially bent (for example, the bent area 11a can have a teardrop-shaped outline). The embodiments of this application do not limit the specific usage form of the heat dissipation film 10.

[0092] In one embodiment, the length direction of the heat dissipation film 10 is defined as the first direction X, and the width direction of the heat dissipation film 10 is defined as the second direction Y. In another embodiment, the width direction of the heat dissipation film 10 is defined as the first direction X, and the length direction of the heat dissipation film 10 is defined as the second direction Y.

[0093] like Figure 4 As shown, the heat dissipation film 10 includes a graphene layer 11, an adhesive layer 16, a protective layer 18, and a plurality of first through holes 12. The protective layer 18, graphene layer 11, and adhesive layer 16 are sequentially stacked along the third direction Z. The protective layer 18 is fixedly connected to the graphene layer 11, and the opposite sides of the adhesive layer 16 are respectively bonded to the back plate 20 and the graphene layer 11. Due to the high thermal conductivity of graphene, the heat dissipation film 10 possesses high thermal conductivity. The protective layer 18 protects the graphene layer 11 and prevents it from breaking or shedding debris when bent.

[0094] Figure 5 for Figure 4 A cross-sectional schematic diagram of the heat dissipation film 10 is shown. Figure 6 for Figure 5 A top view of graphene layer 11 in the diagram. Figure 7 This is a top view schematic diagram showing another graphene layer 11 cooperating with the first through hole 12, provided in an embodiment of this application. Figure 8 This is a top view schematic diagram illustrating the interaction between the graphene layer 11 and the first through-hole 12, as provided in an embodiment of this application. Figure 9 This is a top view of another first through hole 12 provided in an embodiment of this application.

[0095] See Figure 5 and Figure 6The graphene layer 11 includes a bent region 11a and a non-bent region 11b. The bent region 11a is connected to a non-bent region 11b on each of its opposite sides in the first direction X. The orthographic projection of the bent region 11a onto the reference plane covers the orthographic projection of the rotating shaft assembly 230 onto the reference plane, which is the plane containing the first direction X and the second direction Y.

[0096] In this embodiment, the division between the bending area 11a and the non-bending area 11b is not specifically limited. In one embodiment, during the bending process of the display screen 100, the portion of the heat dissipation film 10 that bends is defined as the bending area 11a, and the portion of the heat dissipation film 10 that does not bend is defined as the non-bending area 11b. In another embodiment, the portion of the heat dissipation film 10 located within the second screen region 100b can also be defined as the bending area 11a, and the portion of the heat dissipation film 10 located within the first screen region 100a and the third screen region 100c can be defined as the non-bending area 11b. In yet another embodiment, the portion of the orthographic projection of the heat dissipation film 10 on the reference plane that covers the orthographic projection of the hinge assembly 230 on the reference plane is defined as the bending area 11a, and the remaining area is defined as the non-bending area 11b.

[0097] In some embodiments, the ratio of the area of ​​the bent region 11a to the total area of ​​all non-bent regions 11b is greater than or equal to 1 / 50 and less than or equal to 1 / 2. In other embodiments, the ratio of the area of ​​the bent region 11a to the total area of ​​all non-bent regions 11b may also be less than 1 / 50.

[0098] See Figure 5 and Figure 6 Each first through-hole 12 penetrates the graphene layer 11, and the orthographic projection of each first through-hole 12 on the reference plane is located inside the orthographic projection of the bending region 11a on the reference plane. Therefore, all first through-holes 12 are located within the bending region 11a. By providing first through-holes 12 in the bending region 11a of the graphene layer 11, the stress during the bending process of the heat dissipation film 10 can be effectively reduced, thereby improving the internal stress of the heat dissipation film 10 during bending, increasing the tensile strength at break and fatigue strength of the heat dissipation film 10, enhancing the bending resistance of the heat dissipation film 10, and preventing breakage at the bending point of the heat dissipation film 10.

[0099] In one possible implementation, at least one first through hole 12 is a strip-shaped hole, for example... Figures 6 to 8 As shown, all the first through holes 12 are strip-shaped holes, and the length of the strip-shaped hole is greater than its width. At least one strip-shaped hole has its width direction parallel to the first direction X, for example... Figure 6As shown, the width direction of all the strip holes is parallel to the first direction X. Since the first direction X is perpendicular to the axis of the rotating shaft assembly 230 and perpendicular to the length direction of the strip holes, the length direction of the strip holes is parallel to the axis of the rotating shaft assembly 230, which can further reduce the stress inside the bending area 11a when the graphene layer 11 is bent, and can ensure the heat dissipation area of ​​the heat dissipation film 10.

[0100] It should be noted that the more slots there are, the better the effect of improving the stress of the heat dissipation film 10.

[0101] The specific shape of the slot is not limited here. In one embodiment, such as... Figure 6 As shown, the strip-shaped hole is a strip-shaped runway hole. In another embodiment, as... Figure 9 As shown, the shape of the strip hole can also be a dumbbell-shaped hole.

[0102] In one implementation, see Figure 6 The heat dissipation film 10 includes multiple rows of through holes, which are arranged side-by-side and spaced apart along the second direction Y. Each row of through holes includes multiple first through holes 12 arranged along the first direction X. Thus, the first through holes 12 of the multiple rows of through holes are staggered in the first direction X, which reduces the total area of ​​the first through holes 12 and decreases the stress at the bending point when the heat dissipation film 10 is bent.

[0103] Of course, in another embodiment, besides staggering the first through holes 12 of two adjacent through hole rows, such as... Figure 7 As shown, the heat dissipation film 10 includes multiple through-hole rows, which are arranged along the second direction Y. The first through-holes 12 of adjacent through-hole rows are arranged alternately along the first direction X, and the first through-holes 12 of adjacent through-hole rows have an overlapping area in the first direction X.

[0104] In one implementation, see further. Figure 6 or Figure 7 In each through-hole row, the plurality of first through holes 12 can be arranged at equal intervals along the first direction X. In another embodiment, see [reference needed]. Figure 8 The multiple first through holes 12 in each through hole column can also be arranged non-equally along the first direction X.

[0105] It should be noted that the arrangement of the multiple first through holes 12, in addition to... Figures 6 to 8 Besides the arrangement shown, there are other possible arrangements, which will not be elaborated on here.

[0106] In addition to being a strip-shaped hole, the first through hole 12 can also be a circular hole, a rectangular hole, a diamond-shaped hole, etc. In one embodiment, all the first through holes 12 can have the same shape (e.g., Figure 6(As shown). In another embodiment, all the first through holes 12 have different shapes. In yet another embodiment, some of the first through holes 12 have the same shape and others have different shapes; that is, the graphene layer 11 has at least two different shapes of first through holes 12, for example... Figure 10 As shown, one portion of the first through hole 12 is a strip-shaped hole, and the other portion of the first through hole 12 is a circular hole. Wherein, Figure 10 This is a top view schematic diagram showing another graphene layer and a first through hole provided in an embodiment of this application.

[0107] Figure 11 This is a top view schematic diagram of another graphene layer and a first through hole provided in an embodiment of this application.

[0108] In the above description, all the first through holes 12 have the same size; however, all the first through holes 12 may also have different sizes, or at least some of the first through holes 12 may have different sizes. For example... Figure 11 As shown, the plurality of first through holes 12 include a first strip hole 12a and a second strip hole 12b. The length of the first strip hole 12a is greater than the length of the second strip hole 12b, and the width of the first strip hole 12a is greater than the width of the second strip hole 12b. The length direction of the first strip hole 12a is perpendicular to the first direction X, and the length direction of the second strip hole 12b is parallel to the first direction X.

[0109] In one possible implementation, the ratio of the total area occupied by all the first through holes 12 on the surface of the bending region 11a to the surface area of ​​the bending region 11a is greater than or equal to 1 / 20 and less than or equal to 1 / 2. The surface of the bending region 11a can be the surface of the heat dissipation film 10 facing away from the back plate 20, or it can be the surface of the heat dissipation film 10 facing the back plate 20. By limiting the total area of ​​the first through holes 12 to the area of ​​the bending region 11a between 1 / 20 and 1 / 2, the internal stress of the heat dissipation film 10 is improved while ensuring the heat dissipation area, effectively balancing the heat dissipation capacity and bending resistance of the heat dissipation film 10.

[0110] It should be noted that, in some embodiments, the ratio of the total area of ​​all first through holes 12 to the area of ​​the bending region 11a may be greater than or equal to 1 / 20, or less than 1 / 20.

[0111] Among some possible implementations, see [link to relevant documentation]. Figure 5As shown, the heat dissipation film 10 also includes a plurality of first elastic elements 13, each corresponding to a first through hole 12, and each first elastic element 13 filling the interior of the corresponding first through hole 12. The first elastic element 13 is made of an elastic material (e.g., elastic rubber). Filling the interior of the first through hole 12 with the first elastic element 13 can increase the tensile resilience at the bending point of the heat dissipation film 10, thereby improving the tensile resilience performance of the heat dissipation film 10.

[0112] like Figure 5 As shown, the first elastic member 13 completely fills the first through hole 12. However, in some embodiments, the first elastic member 13 may also partially fill the first through hole 12.

[0113] The specific material of the first elastic element 13 is not limited here. For example, the first elastic element 13 can be an elastic adhesive, and the material of the elastic adhesive can include at least one of the following materials: thermoplastic polyurethane elastomer (TPU), polydimethylsiloxane (PDMS), acrylate and epoxy resin, so as to increase the tensile resilience of the heat dissipation film 10.

[0114] In one possible implementation, such as Figure 5 As shown, the heat dissipation film 10 also includes a second through hole 17, which penetrates the adhesive layer 16. The orthographic projection of the second through hole 17 on the reference plane is located inside the orthographic projection of the bending region 11a on the reference plane. By having the second through hole 17 penetrate the adhesive layer 16, the stress at the bending point of the heat dissipation film 10 can be further improved when it is bent, thereby enhancing the bending resistance of the heat dissipation film 10 and preventing breakage.

[0115] The second through hole 17 can be a circular hole, a rectangular hole, a diamond-shaped hole, a strip-shaped hole, etc. In addition, all the second through holes 17 can have the same shape, or different shapes, or some can be the same and others can be different.

[0116] In one implementation, such as Figure 5 As shown, the first through hole 12 and the second through hole 17 correspond one-to-one, each second through hole 17 is connected to its corresponding second through hole 17, and the orthographic projection of each first through hole 12 on the reference plane at least partially overlaps with the orthographic projection of its corresponding second through hole 17 on the reference plane. In another embodiment, each first through hole 12 corresponds to at least two second through holes 17, each second through hole 17 is connected to its corresponding second through hole 17, and the orthographic projection of each first through hole 12 on the reference plane at least partially overlaps with the orthographic projection of its corresponding second through hole 17 on the reference plane. In yet another embodiment, the orthographic projections of the first through hole 12 and the second through hole 17 on the reference plane do not overlap.

[0117] like Figure 5As shown, the first through hole 12 and the second through hole 17 correspond one-to-one, and the corresponding first through hole 12 and second through hole 17 have the same shape. For example, the first through hole 12 and the second through hole 17 are both strip holes, and the diameters of the first through hole 12 and the second through hole 17 are the same. In this case, the orthographic projections of the first through hole 12 and the second through hole 17 on the reference plane overlap. Of course, in some embodiments, the corresponding first through hole 12 and the second through hole 17 may not have the same shape, and / or the corresponding first through hole 12 and the second through hole 17 may not have the same diameter.

[0118] It should be noted that, in addition to the second through-hole 17, the heat dissipation film 10 also has other features in some scenarios, such as... Figure 12 As shown, the heat dissipation film 10 may also not have the second through hole 17. Wherein, Figure 12 This is a cross-sectional schematic diagram of another heat dissipation film 10 provided in an embodiment of this application.

[0119] Among some possible implementations, see [link to relevant documentation]. Figure 5 As shown, the heat dissipation film 10 also includes a plurality of second elastic elements 19, each corresponding to a second through hole 17, with each second elastic element 19 filling the interior of the corresponding second through hole 17. The second elastic elements 19 are made of an elastic material (e.g., elastic adhesive). Filling the interior of the second through holes 17 with the second elastic elements 19 can increase the tensile resilience at the bends of the heat dissipation film 10, thereby improving the tensile resilience performance of the heat dissipation film 10.

[0120] like Figure 5 As shown, the second elastic member 19 completely fills the second through hole 17. However, in some embodiments, the second elastic member 19 may also partially fill the second through hole 17.

[0121] The specific material of the second elastic element 19 is not limited here. For example, the material of the second elastic element 19 is acrylic resin, epoxy resin, etc., to increase the tensile resilience of the heat dissipation film 10.

[0122] In some scenarios, when the first through hole 12 and the second through hole 17 correspond one-to-one and are connected, the first elastic element 13 and the second elastic element 19 correspond one-to-one and are connected. Furthermore, the corresponding first elastic element 13 and the second elastic element 19 can be an integral structure, which can shorten the manufacturing process of the heat dissipation film 10 and help improve the production efficiency of the heat dissipation film 10.

[0123] In one possible implementation, see [link to previous section] Figure 5The protective layer 18 may include a first protective portion 14 and a second protective portion 15. The first protective portion 14 is a flexible protective portion, fixedly connected to the graphene layer 11 and covering the bending region 11a. The second protective portion 15 is fixedly connected to the graphene layer 11 and corresponds one-to-one with the non-bending regions 11b. Each second protective portion 15 is attached to its corresponding non-bending region 11b. The second protective portion 15 and the first protective portion 14 are located on the same side of the graphene layer 11 along the third direction Z. A second protective portion 15 is connected to each opposite side of the first protective portion 14 in the first direction X.

[0124] During the bending process of the heat dissipation film 10, the first protective part 14 can deform to ensure that the heat dissipation film 10 is bent. In addition, when the flexible protective part is made of an elastic material, the tensile resilience of the heat dissipation film 10 can be further increased to prevent the heat dissipation film 10 from breaking when bent.

[0125] It should be noted that, in addition to covering the bending area 11a, in some embodiments, the first protective part 14 may also cover a portion of the non-bending area 11b. Therefore, the orthographic projection of the bending area 11a onto the reference plane at least partially overlaps with the orthographic projection of the first protective part 14 onto the reference plane.

[0126] In one embodiment, the first protective part 14 and the second protective part 15 can be made of the same material. In another embodiment, the first protective part 14 and the second protective part 15 can also be made of different materials. When the first protective part 14 and the second protective part 15 are made of the same material, they can be manufactured using the same process, which helps to improve the production efficiency of the heat dissipation film 10. Alternatively, when the first protective part 14 and the second protective part 15 are made of the same material, they can also be an integral structure.

[0127] The material of the first protective part 14 can be thermoplastic polyurethane elastomer (TPU), polydimethylsiloxane (PDMS), acrylate, epoxy resin, or other elastic adhesives. The material of the second protective part 15 can be polyethylene terephthalate (PET), polyimide (PI), or other similar materials.

[0128] In some embodiments, such as Figure 5 As shown, the surface of the first protective part 14 away from the graphene layer 11 is flush with the surface of the second protective part 15 away from the graphene layer 11, ensuring the flatness of the surface of the protective layer 18 away from the graphene layer 11.

[0129] In the actual implementation, the surfaces of the first protective part 14 away from the graphene layer 11 and the second protective part 15 away from the graphene layer 11 are not absolutely flat, and a certain error can be allowed. For example, if the distance between the surfaces of the first protective part 14 away from the graphene layer 11 and the second protective part 15 away from the graphene layer 11 in the third direction Z is less than or equal to 10 μm, they can be considered to be flush.

[0130] When the first through hole 12 is filled with the first elastic element 13, such as Figure 5 As shown, the first elastic element 13 and the first protective part 14 may be made of the same or different materials. In some embodiments, the first elastic element 13 and the first protective part 14 may be an integral structure, and both the first protective part 14 and the first elastic element 13 may be made of the same elastic material. The first elastic element 13 and the first protective part 14 may be manufactured in one step using the same process, for example, by applying elastic adhesive to the bending area 11a using a dispensing process to form the first protective part 14 and the first elastic element 13.

[0131] Example 2

[0132] Figure 13 This is a cross-sectional schematic diagram of another backplane assembly 110 provided in an embodiment of this application. Figure 14 This is a cross-sectional schematic diagram of another backplane assembly 110 provided in an embodiment of this application.

[0133] Figure 13 and Figure 4 The difference lies in the structure of the graphene layer 11 and the structure of the backplate 20. Specifically, as... Figure 13 As shown, the graphene layer 11 is fixedly connected to the backplate 20. Along the third direction Z, the thickness of the bent region 11a is greater than the thickness of the non-bent region 11b. One surface of the non-bent region 11b is flush with one surface of the bent region 11a, and the other surface of the non-bent region 11b is spaced apart from the other surface of the bent region 11a. Therefore, the cross-sectional shape of the graphene layer 11 parallel to the third direction Z and the first direction X is similar to a "T". The backplate 20 has a groove 21 along the third direction Z near the heat dissipation film 10, and a portion of the bent region 11a is embedded inside the groove 21.

[0134] like Figure 13 As shown, no adhesive layer 16 is provided between the graphene layer 11 and the backplate 20. The graphene layer 11 is directly connected to the backplate 20, which can reduce the thermal resistance between the graphene layer 11 and the backplate 20 and improve the heat dissipation effect of the heat dissipation film 10. Furthermore, removing the adhesive layer 16... Figure 4Compared to the back panel assembly 110 shown, the thickness of the back panel assembly 110 can be reduced. Furthermore, by making the thickness of the bending region 11a greater than the thickness of the non-bending region 11b, and by using the groove 21 to accommodate the portion of the bending region 11a that protrudes from the non-bending region 11b in the third direction Z, the thickness of the back panel assembly 110 can be further reduced.

[0135] In some embodiments, the graphene layer 11 can be fixedly connected to the back plate 20 by hot pressing, thereby achieving a direct connection between the graphene layer 11 and the back plate 20.

[0136] In one implementation, such as Figure 13 As shown, the groove 21 is provided on the bent body 20a. In another embodiment, a portion of the groove 21 is provided on the bent body 20a, and another portion of the groove 21 is provided on the non-bent body 20b.

[0137] It should be noted that when the backplate 20 is provided with the groove 21, the graphene layer 11, in addition to being directly connected to the backplate 20, is in some embodiments, such as... Figure 14 As shown, the graphene layer 11 can also be fixedly connected to the back plate 20 through the adhesive layer 16. In this case, a portion of the adhesive layer 16 is disposed inside the groove 21.

[0138] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. The term "multiple" refers to at least two. The term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation film (10), characterized in that, include: The graphene layer (11) includes a bent region (11a) and a non-bent region (11b), wherein the bent region (11a) is connected to a non-bent region (11b) on opposite sides in a first direction (X); Multiple first through holes (12) are located in the bending region (11a), and each first through hole (12) penetrates the graphene layer (11) along the thickness direction of the heat dissipation film (10).

2. The heat dissipation film (10) according to claim 1, characterized in that, The orthographic projection of each of the first through holes (12) on the reference plane is located inside the orthographic projection of the bending area (11a) on the reference plane. The reference plane is the plane containing the first direction (X) and the second direction (Y). The thickness direction of the heat dissipation film (10) is defined as the third direction (Z). The first direction (X), the second direction (Y) and the third direction (Z) are perpendicular to each other.

3. The heat dissipation film (10) according to claim 1 or 2, characterized in that, The heat dissipation film (10) also includes a plurality of first elastic elements (13), each of which corresponds to a first through hole (12), and each first elastic element (13) fills the interior of the corresponding first through hole (12).

4. The heat dissipation film (10) according to claim 3, characterized in that, The material of the first elastic element (13) includes at least one of the following materials: thermoplastic polyurethane elastomer, polydimethylsiloxane, acrylate and epoxy resin.

5. The heat dissipation film (10) according to any one of claims 1-4, characterized in that, The heat dissipation film (10) further includes a protective layer (18), the protective layer (18) comprising: The first protective part (14) is a flexible protective part, which is fixedly connected to the graphene layer (11) and covers the bending area (11a). The second protective part (15) is fixedly connected to the graphene layer (11) and corresponds one-to-one with the non-bending area (11b). Each second protective part (15) is attached to the corresponding non-bending area (11b). The second protective part (15) and the first protective part (14) are located on the same side of the graphene layer (11) along the thickness direction. The first protective part (14) is connected to a second protective part (15) on each of its opposite sides in the first direction (X).

6. The heat dissipation film (10) according to claim 5, characterized in that, The surface of the first protective part (14) away from the graphene layer (11) is flush with the surface of the second protective part (15) away from the graphene layer (11).

7. The heat dissipation film (10) according to claim 5 or 6, characterized in that, The heat dissipation film (10) further includes a first elastic element (13) filled in the first through hole (12), and the first elastic element (13) and the first protective part (14) are an integral structure.

8. The heat dissipation film (10) according to any one of claims 1-7, characterized in that, At least one of the first through holes (12) is a strip hole, the length of which is greater than its width, and the width direction of at least one of the strip holes is parallel to the first direction (X).

9. The heat dissipation film (10) according to any one of claims 2-8, characterized in that, The heat dissipation film (10) includes multiple through-hole columns, which are arranged side-by-side and spaced apart along the second direction (Y). Each through-hole column includes multiple first through-holes (12) arranged along the first direction (X). The thickness direction of the heat dissipation film (10) is defined as the third direction (Z), and the first direction (X), the second direction (Y), and the third direction (Z) are perpendicular to each other.

10. The heat dissipation film (10) according to any one of claims 1-9, characterized in that, The ratio of the total area occupied by all the first through holes (12) on the surface of the bending region (11a) to the area of ​​the surface of the bending region (11a) is greater than or equal to 1 / 20 and less than or equal to 1 / 2.

11. The heat dissipation film (10) according to any one of claims 1-10, characterized in that, The heat dissipation film (10) further includes an adhesive layer (16), which is bonded to the graphene layer (11) and is stacked with the graphene layer (11) along the thickness direction.

12. The heat dissipation film (10) according to claim 11, characterized in that, The heat dissipation film (10) further includes a second through hole (17), which penetrates the adhesive layer (16) along the thickness direction.

13. The heat dissipation film (10) according to claim 12, characterized in that, The heat dissipation film (10) also includes a plurality of second elastic elements (19), each of which corresponds to a second through hole (17), and each second elastic element (19) fills the interior of the corresponding second through hole (17).

14. The heat dissipation film (10) according to any one of claims 1-13, characterized in that, Along the thickness direction, the thickness of the bent region (11a) is greater than the thickness of the non-bent region (11b). One side surface of the non-bent region (11b) is flush with one side surface of the bent region (11a), and the other side surface of the non-bent region (11b) is spaced apart from the other side surface of the bent region (11a).

15. A backplate assembly (110), characterized in that, It includes a back plate (20) and a heat dissipation film (10) as described in any one of claims 1-14, wherein the heat dissipation film (10) is fixedly connected to one side of the back plate (20).

16. The backplane assembly (110) according to claim 15, characterized in that, The back plate (20) has a groove (21) on the side near the heat dissipation film (10). The heat dissipation film (10) includes a graphene layer (11). The thickness of the bent area (11a) of the graphene layer (11) is greater than the thickness of the non-bent area (11b) of the graphene layer (11). A portion of the bent area (11a) is embedded inside the groove (21).

17. The backplane assembly (110) according to claim 16, characterized in that, The graphene layer (11) is fixedly connected to the back plate (20).

18. The backsheet assembly (110) according to claim 15 or 16, characterized in that, The heat dissipation film (10) includes an adhesive layer (16) and a graphene layer (11) stacked together. The opposite sides of the adhesive layer (16) are respectively bonded to the back plate (20) and the graphene layer (11).

19. A display screen (100), characterized in that, Includes a display module (120) and a backplate assembly (110) as described in any one of claims 15-18, wherein the display module (120) is located on the side of the backplate (20) away from the heat dissipation film (10) and is fixedly connected to the backplate (20).

20. An electronic device, characterized in that, It includes a housing assembly (200) and a display screen (100) as claimed in claim 19, the display screen (100) being mounted on the housing assembly (200); The housing device (200) includes a first housing (210), a second housing (220), and a pivot assembly (230). The pivot assembly (230) connects the first housing (210) and the second housing (220). The first housing (210) and the second housing (220) can be relatively unfolded or relatively folded by the movement of the pivot assembly (230).

21. The electronic device according to claim 20, characterized in that, The orthographic projection of the bending area (11a) of the heat dissipation film (10) onto the reference plane covers the orthographic projection of the rotating shaft assembly (230) onto the reference plane.

Images