Transparent cortical electrodes, their preparation method, acquisition system, and assembly system

Abstract

This disclosure presents a transparent cortical electrode, its fabrication method, acquisition system, and assembly system. The transparent cortical electrode comprises a basal layer, a conductive layer, a transparent conductive coating, and an insulating layer. The basal layer includes a transparent window region and a connection region, the window region being used to encapsulate a cranial opening. The conductive layer includes an electrode array formed on the window region, pads formed on the connection region, and leads electrically connecting the electrode array and the pads. The transparent conductive coating is formed on the electrode array for acquiring neural electrical signals. The insulating layer is made of a transparent material, covering the leads and exposing the transparent conductive coating. The transparent cortical electrode proposed in this disclosure enables seamless integration of neural electrical signal recording, cranial encapsulation, and neural imaging, allowing for simultaneous recording of neural electrical activity and neural imaging.

Description

Technical Field

[0001] This disclosure relates to the field of electrode technology, specifically to a transparent cortical electrode and its preparation method, acquisition system, and assembly system. Background Technology

[0002] In recent years, neuronal imaging technology and implantable neural electrode technology have jointly promoted the development of neural interface technology. Neural interface technology is not only useful for neuroscience research, but also provides treatment for patients with a variety of neurological diseases such as Parkinson's disease, spinal cord injury and stroke.

[0003] In the field of neuronal imaging technology, calcium imaging, as a representative technique, allows for the observation of individual cells in the living brain. Specifically, after removing a portion of the skull through craniotomy and replacing it with a transparent glass plate, a surgical method is developed to encapsulate it. This allows imaging and observation of the underlying cerebral cortex through the transparent glass. Further combining this with techniques such as calcium imaging allows visualization of the activity of cortical neurons. This technology enables researchers to record the activity of tens of thousands of neurons in the cerebral cortex with high spatial resolution; however, it is limited in temporal resolution, restricting its ability to observe rapid neural activity.

[0004] Implantable neural electrode technology provides neural signal sensing capabilities that complement neuronal imaging technology. Cortical electrode technology, for example, can record neuronal activity with high temporal resolution, thus enabling the observation and recording of faster and shorter neural activity phenomena. However, it is limited in terms of spatial resolution and the number of channels. Summary of the Invention

[0005] This disclosure provides a transparent cortical electrode for neuroelectric recording, cranial encapsulation, and compatible neuroimaging, as well as its preparation method, acquisition system, and assembly system.

[0006] In a first aspect, this disclosure provides a transparent cortical electrode for neuroelectric recording, cranial encapsulation, and compatible neuroimaging, comprising a basal layer, a conductive layer, a transparent conductive coating, and an insulating layer; the basal layer includes a transparent window region and a connection region, the window region being used to encapsulate a cranial opening; the conductive layer includes an electrode array formed on the window region, pads formed on the connection region, and leads electrically connecting the electrode array and the pads; the transparent conductive coating is formed on the electrode array for acquiring neuroelectric signals; the insulating layer is made of a transparent material, covering the leads and exposing the transparent conductive coating.

[0007] In some optional embodiments, the substrate layer is made of a rigid transparent material with a Mohs hardness of not less than 6H and a visible light transmittance of not less than 90%.

[0008] In some alternative embodiments, the rigid transparent material includes, but is not limited to, BF33 glass.

[0009] In some alternative implementations, the window area on the basal layer is a planar or curved structure that matches the shape of the skull opening, used to replace part of the skull.

[0010] In some alternative implementations, the connection area on the substrate layer is square (square or rectangular), and the pads are arranged side by side on the connection area, so that the connection area with the pads can be plugged into an external device.

[0011] In some alternative implementations, the linewidth of the conductive layer is smaller than the diameter of a brain nerve.

[0012] In some alternative implementations, the linewidth of the conductive layer is no greater than 2 μm.

[0013] In some alternative implementations, the thickness of the conductive layer is no greater than 500 nm.

[0014] In some alternative embodiments, the conductive layer is made of materials with a conductivity higher than 4.5 × 10⁻⁶. 7 Siemens / meter's metal materials composition includes, but is not limited to, gold.

[0015] In some alternative embodiments, the conductive layer is a transparent conductive material.

[0016] In some alternative embodiments, the electrode array includes multiple electrode sites, which are circular ring structures, perforated porous structures, or mesh structures.

[0017] In some alternative implementations, the diameter of the electrode site is no greater than 5 μm.

[0018] In some alternative implementations, the electrode array includes 32 electrode sites.

[0019] In some alternative embodiments, the transparent conductive coating is used to contact the cerebral cortex and may include a plurality of spaced-apart sensing units, each of which covers a plurality of electrode sites and is electrically connected to the plurality of electrode sites one-to-one.

[0020] In some alternative implementations, the electrode array includes multiple regions of different densities (with varying numbers of electrode sites per unit area in different regions) to match different cortical regions.

[0021] In some alternative embodiments, the transparent conductive coating includes a first transparent conductive coating formed on the electrode array and a second transparent conductive coating formed on the first transparent conductive coating, wherein the first transparent conductive coating and the second transparent conductive coating are made of different materials.

[0022] In some alternative embodiments, the first transparent conductive coating is located within the orthographic projection range of the second transparent conductive coating on the substrate layer.

[0023] In some alternative embodiments, the transparent conductive coating is a flexible material.

[0024] In some alternative embodiments, the flexible material used in the transparent conductive coating is selected from indium tin oxide, graphene, carbon nanotubes, transparent conductive hydrogels, and PEDOT and combinations thereof.

[0025] In some optional embodiments, the visible light transmittance of the transparent conductive coating is not less than 90%.

[0026] In some alternative embodiments, the transparent cortical electrode is configured to be connected and fixed to a fixation headpiece and the skull, the transparent cortical electrode being connected to the fixation headpiece through the connection area, and the transparent cortical electrode being connected to the skull through the edge of the window area.

[0027] In some alternative embodiments, the insulating layer is a flexible material.

[0028] In some alternative embodiments, the flexible material used for the insulating layer is selected from SU-8 photoresist and polyimide.

[0029] In some alternative embodiments, the insulating layer has an opening that exposes the electrode sites, and the transparent conductive coating is formed within the opening.

[0030] In some alternative embodiments, the top surface of the transparent conductive coating is substantially flush with the top surface of the insulating layer.

[0031] In some alternative embodiments, the visible light transmittance of the insulating layer is not less than 90%.

[0032] In some alternative embodiments, the insulating layer is formed with micro / nano structures to improve light transmittance.

[0033] In some alternative implementations, the electrode array and the pads are formed on the same side surface of the substrate, or on opposite sides of the substrate.

[0034] In a second aspect, this disclosure provides a method for preparing a transparent cortical electrode as described in the first aspect, comprising the following steps: preparing a basal layer, wherein the basal layer is divided into a window region and a connection region, at least the window region is transparent, and the window region is used to encapsulate a cranial opening; forming a patterned conductive layer on the basal layer, the conductive layer comprising an electrode array located on the window region; forming a patterned transparent conductive coating on the electrode array, the transparent conductive coating being used to acquire neural electrical signals; and forming an insulating layer on the basal layer, the insulating layer being made of a transparent material, the insulating layer covering the conductive layer and exposing the transparent conductive coating.

[0035] In some alternative embodiments, forming a patterned transparent conductive coating on the electrode array includes: after the electrode array is formed, forming a patterned first transparent conductive coating on the electrode array; and after the insulating layer is formed, forming a second transparent conductive coating covering the first transparent conductive coating at the openings of the insulating layer that expose the first transparent conductive coating. The step of forming a patterned first transparent conductive coating on the electrode array may include: sequentially depositing a peelable first photoresist and a second photoresist on the substrate layer; patterning the first photoresist and the second photoresist by photolithography and development; forming a patterned first transparent conductive material in the area of ​​the substrate layer not protected by the first photoresist and the second photoresist by sputtering process; and then removing the first photoresist and the second photoresist to form the first transparent conductive coating. The step of forming a second transparent conductive coating covering the first transparent conductive coating may include: depositing a whole layer of second transparent conductive material on the substrate layer; depositing a third photoresist on the second transparent conductive material and patterning the third photoresist by photolithography and development; etching the second transparent conductive material using a reactive ion etching process, and then removing the third photoresist, so that the remaining second transparent conductive material forms the second transparent conductive coating.

[0036] In some alternative embodiments, the method further includes: shaped and bending the basal layer to match the window area with the skull opening.

[0037] In some alternative embodiments, forming a patterned conductive layer on the substrate layer includes: depositing photoresist on the substrate layer, the photoresist including a peelable first photoresist deposited on the substrate layer and a second photoresist deposited on the first photoresist; patterning the photoresist by photolithography and development; sequentially depositing an adhesion layer and a metal layer on the substrate layer in an area not protected by the photoresist using a vapor deposition process; and removing the photoresist, leaving the adhesion layer and metal layer as the conductive layer.

[0038] In some alternative embodiments, the adhesion layer is, but is not limited to, chromium, with a thickness of less than 20 nm; the metal layer is, but is not limited to, gold, with a thickness of less than 200 nm.

[0039] In some alternative embodiments, forming an insulating layer on the substrate layer includes: depositing a layer of negative photoresist on the substrate layer; patterning the negative photoresist by photolithography and development; and processing the patterned negative photoresist using a high-temperature baking process to form the insulating layer.

[0040] Thirdly, this disclosure provides a neural signal acquisition system, comprising: a transparent cortical electrode as described in the first aspect, an imaging device, and an acquisition and recording device; the transparent cortical electrode includes a transparent conductive coating for contacting the cerebral cortex through the transparent conductive coating to acquire neural electrical signals; the imaging device is used to acquire neural imaging signals through a window area of ​​the transparent cortical electrode; and the acquisition and recording device is used to simultaneously record the neural electrical signals and the neural imaging signals.

[0041] In some optional embodiments, the acquisition and recording device is further configured to: record in real time the neural electrical signals continuously acquired by the transparent cortical electrodes, the neural electrical signals including time information; record in real time the neural imaging signals acquired at intervals by the imaging device, the neural imaging signals including timestamps; and align the timestamps with the time information in time to achieve synchronous recording of the neural electrical signals and the neural imaging signals.

[0042] In some optional embodiments, the acquisition and recording device is further configured to: fuse the neural electrical signals and the neural imaging signals into an image, and present it through a display device.

[0043] Fourthly, this disclosure provides an assembly system for a transparent cortical electrode, comprising: a transparent cortical electrode as described in the first aspect, a fixing headpiece, and an encapsulation material; the fixing headpiece is used to fix the transparent cortical electrode to a biological head; the transparent cortical electrode includes a window area for encapsulating an opening in the skull of the biological head; the encapsulation material is used to encapsulate and fix the gap between the skull opening, the transparent cortical electrode, and the fixing headpiece.

[0044] In some alternative embodiments, the encapsulation material includes medical tissue adhesive and / or dental cement.

[0045] In some alternative embodiments, the assembly system for the transparent cortical electrode further includes a fixing clamp configured to fix the fixing head, thereby fixing the transparent cortical electrode relative to an imaging device.

[0046] As described above, this disclosure presents a transparent cortical electrode for neural electrical recording, cranial encapsulation, and compatible neuroimaging, as well as its fabrication method, acquisition system, and assembly system. The beneficial effects achieved by this disclosure include, but are not limited to: The transparent cortical electrode disclosed herein has a basal layer that can be used to encapsulate skull openings, and its electrode array and transparent conductive coating can be used to acquire neural electrical signals. The window area of ​​its basal layer and the layers above it allow visible light to pass through, thus also serving as a neuronal imaging window to be compatible with neural imaging. Therefore, by combining the electrode and the neuronal imaging window, this disclosure avoids the obstruction of neural imaging by opaque areas on the electrode, enabling seamless integration of neural electrical signal recording, skull encapsulation, and neural imaging, and allowing for simultaneous recording of neural electrical activity and neural imaging. Attached Figure Description

[0047] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments, taken with reference to the accompanying drawings. The drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure. In the drawings: Figure 1 This is a three-dimensional structural schematic diagram of a transparent cortical electrode according to an embodiment of the present disclosure; Figure 2 yes Figure 1 A schematic diagram of the exploded structure of the transparent cortical electrode shown; Figure 3 yes Figure 2 A schematic diagram of the conductive layer of the transparent cortical electrode shown; Figure 4 yes Figure 2 A schematic diagram of the electrode array and transparent conductive coating of the transparent cortical electrodes shown. Figure 5 This is a schematic diagram illustrating the assembly and application of transparent cortical electrodes according to embodiments of the present disclosure; Figure 6 This is a schematic flowchart of a method for preparing a transparent cortical electrode according to an embodiment of the present disclosure; Figure 7 This is a schematic diagram of the hardware configuration of a computer system according to an embodiment of the present disclosure.

[0048] Figure label: 10-Transparent cortical electrode; 11-Basal layer; 111-Window area; 112-Connection area; 12-Conductive layer; 121-Electrode array; 122-Lead wire; 123-Pad; 13-Transparent conductive coating; 131-First transparent conductive coating; 132-Second transparent conductive coating; 14-Insulating layer; 20-Fixing headpiece; 30-Imaging device; 40-Acquisition and recording equipment; 700 - Computer system; 701 - Processing device; 702 - ROM; 703 - RAM; 704 - Bus; 705 - I / O interface; 706 - Input device; 707 - Output device; 708 - Storage device; 709 - Communication device. Detailed Implementation

[0049] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0050] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0051] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one component or part to another component or part shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0052] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content described herein, and are not intended to limit the implementation conditions of this disclosure. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effectiveness and purpose of this disclosure, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this disclosure's implementation.

[0053] It should be noted that, unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other. This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0054] As mentioned earlier, neuronal imaging techniques, such as calcium imaging, allow researchers to record the activity of tens of thousands of neurons in the cerebral cortex with high spatial resolution. However, this technique is limited in temporal resolution, restricting its ability to observe rapid neural activity. Implantable neural electrode technology, on the other hand, provides complementary neural signal sensing capabilities to neuronal imaging techniques. Represented by cortical electrodes, it can record neuronal activity with high temporal resolution, thus enabling the observation and recording of faster and transient neural activity phenomena. However, it is limited in spatial resolution and the number of channels.

[0055] Therefore, if the advantages of these two technologies can be combined, using cortical neural electrodes for craniotomy followed by skull encapsulation, and then imaging neurons through these electrodes, a more comprehensive observation of neuronal activity can be achieved. For this reason, designing transparent cortical electrodes that seamlessly integrate with the neuronal imaging window is a problem that urgently needs to be solved.

[0056] refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 These are, respectively, a three-dimensional structural schematic diagram and an exploded structural schematic diagram of a transparent cortical electrode according to an embodiment of this disclosure. Figure 1 and Figure 2 As shown, this disclosure provides a transparent cortical electrode for neural electrical recording, cranial encapsulation, and compatible neuroimaging. This transparent cortical electrode has multiple functions, including neural electrical signal recording, cranial encapsulation, and seamless integration with neuroimaging systems.

[0057] like Figure 1 and Figure 2As shown, the transparent cortical electrode 10 of this embodiment may include: a base layer 11, a conductive layer 12, a transparent conductive coating 13, and an insulating layer 14. The conductive layer 12 may further include an electrode array 121, leads 122, and pads 123.

[0058] The base layer 11 may include a transparent window area 111 for encapsulating the skull opening; the conductive layer 12 may include an electrode array 121 formed on the window area 111; a transparent conductive coating 13 is formed on the electrode array 121 for acquiring neural electrical signals; and the insulating layer 14 may be made of a transparent material, covering the conductive layer 12 and exposing the transparent conductive coating 13.

[0059] Furthermore, the base layer 11 may also include a connection region 112, and the conductive layer 12 may also include: a pad 123 formed on the connection region 112, and a lead 122 extending from the window region 111 to the connection region 112, the lead 122 being used to electrically connect the electrode array 121 and the pad 123; the insulating layer 14 covers the lead 122.

[0060] In some alternative implementations, the transparent cortical electrode 10 of this disclosure may also include other elements, such as a temperature sensing element disposed on the basal layer 11 and electrically connected to the lead 122, for monitoring (or regulating) the temperature of brain tissue and protecting neurons from thermal damage.

[0061] In application, the transparent cortical electrode 10 is disposed upside down at the opening of the skull of a living organism. A window region 111 is embedded in the opening of the skull, encapsulating it and replacing a portion of the skull. The transparent conductive coating 13 and the insulating layer 14 face inwards towards the skull, allowing the transparent conductive coating 13 to approach or contact the cerebral cortex of the organism's brain for acquiring neural signals. Since the window region 111 and its transparent conductive coating 13 and insulating layer 14 are all transparent, and the conductive layer 12 has a very fine linewidth, it has extremely high light transmittance. Therefore, it can be used with the imaging device of a neural imaging system, allowing the imaging device to acquire neural imaging signals through the window region 111. It is worth noting that, since the transparent cortical electrode 101 of this disclosure can replace a portion of the skull, it can also be referred to as an electronic skull.

[0062] The transparent cortical electrode 10 disclosed herein will now be described in further detail.

[0063] (a) Basal layer 11 Here, the basal layer 11 serves as the load-bearing portion of the entire transparent cortical electrode 10. It can be made of a partially transparent (at least the window area 111 is transparent) or fully transparent (both the window area 111 and the connecting area 112 are transparent) material with high hardness. Preferably, it is made of a material with a hardness not lower than that of the skull of common organisms, so as to better replace part of the skull.

[0064] In some alternative embodiments, the substrate 11 is formed of a rigid transparent material with a Mohs hardness of not less than 6H, or further not less than 6.5H, 7H, or 7.5H.

[0065] In some alternative embodiments, the substrate 11 is formed of a rigid transparent material with a visible light transmittance of not less than 90%, or further not less than 95%, or further not less than 99%.

[0066] In some alternative implementations, the rigid transparent material includes, but is not limited to, BF33 glass. BF33 glass is a high borosilicate glass with approximately 80% silicon dioxide and about 13% boron oxide. Glass has the property of emitting electromagnetic radiation when exposed to high-energy radiation; this property is known as fluorescence. The fluorescence of high borosilicate glass is far lower than that of ordinary glass, such as soda-lime glass. In the biological field, BF33 glass can be selected as needed to reduce the impact of fluorescence.

[0067] In some optional embodiments, the window region 111 of the base layer 11 is a planar or curved structure matching the shape of the skull opening, resembling a skull, and can be used to replace part of the skull. This disclosure does not limit the shape of the window region 111; the specific shape of the window region 111 can be the same as the skull opening, for example, it can be circular, elliptical, square, polygonal, trapezoidal, etc., or it can be a combination of the aforementioned shapes. For example, the shape of the window region 111 may include a trapezoid, which may have a gradually increasing width from the side away from the connecting region 112 to the side closer to the connecting region 112.

[0068] In some alternative embodiments, the edge of the window area 111 is designed with a groove or slot structure for engaging with the edge of the opening of the skull to improve the bonding strength with the skull.

[0069] In some alternative implementations, the connection area 112 of the base layer 11 can be designed in shape as needed, such as a square or other regular shape, so that, together with the solder pads 123 thereon, external physical and electrical connections can be easily achieved. For example, the connection area 112 can be configured to be connected and fixed with a fixing head.

[0070] In some alternative implementations, the thickness of the basal layer 11 can be designed to be comparable to the thickness of the skull, for example, 0.1 mm to 2 mm, or 0.2 mm to 1 mm, for example, about 0.5 mm.

[0071] In some alternative embodiments, the shape and size of the basal layer 11 can be customized according to the specific circumstances of the skull defect. It can be manufactured into the required shape and size through cutting and bending processes to accommodate different types of skull defects. This allows it to replace a portion of the skull after craniotomy and encapsulate the brain, thereby creating a transparent cranial window at the skull opening (capable of replacing a portion of the skull after craniotomy and matching the opening in the cerebral cortex to form a transparent cranial window). In this way, the basal layer 11 can be used to accommodate neuroimaging technologies and can support the conductive layer 12 and the insulating layer 14.

[0072] In some alternative implementations, laser cutting technology can be used when cutting the base layer 11 to achieve high precision and smooth cutting edges.

[0073] (ii) Conductive layer 12 Here, the conductive layer 12 is the part that realizes the electrical function, including the acquisition and transmission of neural electrical signals. In order to avoid affecting the light transmittance of the transparent cortical electrode 10, the conductive layer 12 can be made of a transparent conductive material, or it can be made of a non-transparent conductive material with an extremely thin width.

[0074] In some alternative embodiments, the linewidth of the conductive layer 12 can be smaller than the diameter of the brain nerve (neuron), thereby avoiding occlusion of the neuron during neural imaging. Typically, the diameter of a neuron is on the micrometer scale, therefore, the linewidth of the conductive layer 12 in this disclosure can be no greater than 5 μm, or no greater than 3 μm, or no greater than 2 μm, or no greater than 1 μm, or on the nanometer scale (e.g., 50 nm-500 nm).

[0075] Here, the linewidth of the conductive layer 12 can be understood as the linewidth of the lead 122, and / or the linewidth of the conductive layer 12 that forms the electrode array 121.

[0076] In some alternative embodiments, the thickness of the conductive layer 12 can be at the nanometer level, for example, no more than 500 nm, or even no more than 300 nm or 250 nm.

[0077] In some alternative embodiments, the conductive layer 12 may be made of a metallic material with good conductivity, for example, a material with a conductivity higher than 4.5 × 10⁻⁶. 7 The material is made of Siemens / meter metal. For example, the conductive layer 12 includes, but is not limited to, gold with high conductivity and high ductility. Further, gold with nanometer thickness (e.g., less than 10 nm) and transparent properties can be used.

[0078] In some alternative embodiments, the conductive layer 12 may also be made of a transparent conductive material, such as a transparent conductive polymer. This can further improve the transparency of the entire transparent cortical electrode 10.

[0079] In some alternative embodiments, the structure of the conductive layer 12 is optimized, for example, with linewidth and thickness at the nanometer level and line spacing at least greater than the diameter of one or two brain nerves (e.g., greater than 1 μm, 2 μm, 3 μm, or 5 μm), to achieve a better balance between conductivity and transmittance.

[0080] In some alternative embodiments, the conductive layer 12 may be surface treated to improve corrosion resistance and long-term stability.

[0081] In some alternative embodiments, the conductive layer 12 may be formed directly on the substrate layer 11.

[0082] In some alternative embodiments, a buffer layer may be included between the conductive layer 12 and the substrate layer 11. The coefficient of thermal expansion of the buffer layer may be between that of the conductive layer 12 and the substrate layer 11. The buffer layer can reduce the stress difference between the substrate layer 11 and the conductive layer 12. The buffer layer may be made of metal and may be formed by processes such as sputtering.

[0083] In some alternative implementations, electrode array 121 may include multiple electrode sites, distributed as needed. For example, electrode array 121 may include 32 electrode sites, such as... Figure 1 and Figure 2 As shown, the 32 electrode sites can be divided into 4 columns, with 8 sites in each column. Optionally, the four straight lines containing the 4 columns of electrode sites may not be parallel, but rather the spacing between them may gradually increase from the side away from the connection region 112 to the side closer to the connection region 112.

[0084] In some alternative implementations, refer to Figure 3 , Figure 3 yes Figure 2 A schematic diagram of the conductive layer 12 of the transparent cortical electrode 10 shown. Figure 3 As shown, the electrode sites of the electrode array 121 can be a ring structure, a hollow porous structure, or a mesh structure. Here, the linewidth of the ring, porous structure, or mesh structure can be no greater than 2 μm, no greater than 1 μm, or at the nanometer level (e.g., 50 nm-500 nm).

[0085] In some alternative embodiments, the diameter of the electrode sites of the electrode array 121 may be no greater than 5 μm, or no greater than 2 μm, or no greater than 1 μm, or no greater than 500 nm, or no greater than 100 nm.

[0086] In some alternative implementations, the electrode array 121 includes multiple regions of different densities, with varying numbers and distribution densities of electrode sites in different regions to adapt to the neuronal density and distribution in different areas of the cerebral cortex and to the neural network characteristics of different brain regions.

[0087] In some alternative implementations, the aperture size and distribution of the electrode sites of the electrode array 121 are optimized to minimize occlusion of neural imaging.

[0088] In some alternative implementations, the electrode array 121 is designed to allow for electrical stimulation to modulate the activity of specific neurons or neural networks.

[0089] In some alternative embodiments, the pads 123 may be arranged side by side on the connection area 112, thereby enabling the connection area 112 with the pads 123 to be plugged into an external device, so that the pads 123 can be better electrically connected and transmit signals to the external device.

[0090] In some alternative implementations, the number of pads 123 may be the same as the number of electrode sites in the electrode array 121, and they may correspond one-to-one and be connected by a lead 122.

[0091] In some alternative embodiments, the entire conductive layer 12 may have a tree-like structure, with its electrode array 121 resembling a tree crown shape, narrow at the top and wide at the bottom, the main body of its leads 122 being parallel to each other and close together, resembling a tree trunk, and its pads 123 being arranged sequentially, resembling tree roots.

[0092] In some alternative embodiments, the entire conductive layer 12 may be formed on the same side surface of the substrate layer 11.

[0093] In some other alternative embodiments, the electrode array 121 and the lead 122 may be formed on the same side surface of the substrate layer 11, the pad 123 may be formed on the opposite side surface of the substrate layer 11, and the conductive layer 12 may also include a via penetrating the substrate layer 11 to connect the pad 123 and the lead 122.

[0094] In some alternative embodiments, the entire conductive layer 12 may protrude from the surface of the substrate layer 11, or it may be embedded inside the substrate layer 11.

[0095] The conductive layer 12 of this embodiment has a linewidth of electrode array 121 and lead 122 that is smaller and thinner than the diameter of the neuron, and the electrode sites of electrode array 121 are circular, porous or grid structures. Therefore, it does not obstruct the neuron during neural imaging and can provide unobstructed observation and imaging capabilities.

[0096] (iii) Transparent conductive coating 13 Here, the transparent conductive coating 13 is used to contact the cerebral cortex to collect neural electrical signals and play the role of sensing biological signals.

[0097] Here, a transparent conductive coating 13 is formed on the electrode array 121. Because it is made of a transparent material, it does not obstruct neurons during neural imaging, and can provide unobstructed observation and imaging capabilities.

[0098] In some alternative embodiments, the visible light transmittance of the transparent conductive coating 13 is not less than 90%, or 95%, or 99%, to facilitate the passage of light signals, thereby aiding in the acquisition of neural imaging signals.

[0099] In some alternative embodiments, the transparent conductive coating 13 has anti-reflective properties to improve image quality.

[0100] In some alternative embodiments, the transparent conductive coating 13 may be surface treated to improve corrosion resistance and long-term stability.

[0101] In some alternative embodiments, the transparent conductive coating 13 may include a plurality of spaced-apart sensing units, each of which covers a plurality of electrode sites of the electrode array 121 and is electrically connected to the plurality of electrode sites one by one.

[0102] In some alternative implementations, refer to Figure 4 , Figure 4 yes Figure 2 The diagram shows the structure of the electrode array 121 and the transparent conductive coating 13 of the transparent cortical electrode 10. Figure 4 As shown, the transparent conductive coating 13 may include a first transparent conductive coating 131 formed on the electrode array 121 and a second transparent conductive coating 132 formed on the first transparent conductive coating 131. Optionally, the first transparent conductive coating 131 and the second transparent conductive coating 132 may be made of different materials. Here, the first transparent conductive coating 131 may serve as a sensor for acquiring neural electrical signals; the second transparent conductive coating 132 may serve as an enhancer, further improving the ability to acquire neural electrical signals.

[0103] In some alternative embodiments, the transparent conductive coating 13 may be made of a material with high conductivity, low impedance, and high transmittance, including but not limited to ITO (indium tin oxide), graphene, CNT (carbon nanotubes), transparent conductive hydrogels, and PEDOT (poly(3,4-ethylenedioxythiophene)) and combinations thereof. For example, the first transparent conductive coating 131 may be ITO, and the second transparent conductive coating 132 may be PEDOT.

[0104] In some alternative embodiments, the first transparent conductive coating 131 is located within the orthographic projection area of ​​the second transparent conductive coating 132 onto the substrate 11. That is, the first transparent conductive coating 131 can have a larger area than the second transparent conductive coating 132 and cover the second transparent conductive coating 132, thereby improving the ability to acquire neural electrical signals.

[0105] In some optional embodiments, the transparent conductive coating 13 is a flexible material. Because in some optional embodiments, the transparent conductive coating 13 is located between the cerebral cortex and the basal layer 11 during application, the flexible material can act as a buffer, thereby protecting the cerebral cortex from impacts.

[0106] (iv) Insulation layer 14 Here, the insulating layer 14 is used to isolate the conductive layer 12 and prevent signal interference.

[0107] In some alternative embodiments, the insulating layer 14 may be a transparent insulating layer to achieve high light transmittance of the transparent cortical electrode 10. Further, the insulating layer 14 may be formed using a transparent insulating material compatible with micro / nano fabrication techniques (e.g., patterning via photolithography). For example, the insulating layer 14 may be selected from SU-8 photoresist and polyimide, etc.

[0108] In some alternative embodiments, the visible light transmittance of the insulating layer 14 is not less than 90%, or 95%, or 99%.

[0109] In some alternative embodiments, the insulating layer 14 can be a flexible material. Because the insulating layer 14 is located between the cerebral cortex and the basal layer 11 during application, the flexible material can act as a buffer, thereby protecting the cerebral cortex from impacts.

[0110] In some alternative implementations, the insulating layer 14 may be made of a material with self-healing properties so that it can automatically repair itself after minor damage, extending the lifespan of the entire transparent cortical electrode.

[0111] In some alternative embodiments, the insulating layer 14 may be plasma treated to improve insulation performance and chemical resistance.

[0112] In some alternative embodiments, the insulating layer 14 may have openings exposing the respective electrode sites of the electrode array 121, and the transparent conductive coating 13 may be formed within the openings. That is, the respective electrode sites of the electrode array 121 and the transparent conductive coating 13 may be exposed within the reserved openings of the insulating layer 14.

[0113] In some alternative embodiments, the top surface of the transparent conductive coating 13 may be substantially flush with the top surface of the insulating layer 14, so as not to damage the cerebral cortex due to unevenness.

[0114] In some alternative embodiments, the insulating layer 14 can be formed using micro / nano fabrication techniques and can have micro / nano structures for improving light transmittance. The micro / nano structures can also be configured to improve the efficiency of neural signal acquisition and reduce signal interference.

[0115] The above, combined with Figures 1 to 4 This disclosure describes a transparent cortical electrode 10 according to an embodiment of the present disclosure. The transparent cortical electrode 10 proposed in this disclosure has a basal layer that can be used to encapsulate a cranial opening (replacing part of the skull), an electrode array and a transparent conductive coating that can be used to acquire neural electrical signals, and a window area in its basal layer and its upper layers that allow visible light to pass through, thus also serving as a neuronal imaging window to be compatible with neural imaging. Therefore, by combining the electrode and the neuronal imaging window, this disclosure avoids the obstruction of neural imaging by opaque areas on the electrode, enabling seamless integration of neural electrical signal recording, cranial encapsulation, and neural imaging. By combining it with an imaging device, synchronous recording of neural electrical activity and neural imaging can be achieved.

[0116] refer to Figure 5 , Figure 5 This is a schematic diagram of the assembly and application of the transparent cortical electrode 10 according to an embodiment of the present disclosure.

[0117] like Figure 5 As shown, this disclosure provides an assembly system for transparent cortical electrodes, comprising: as... Figures 1 to 4 The transparent cortical electrode 10, the fixation headpiece 20, and the encapsulation material (not shown in the figure) are shown. The head-fixing component 20 is used to fix the transparent cortical electrode 10 to the biological head; The transparent cortical electrode 10 includes a window region 111, which is used to encapsulate the opening of the skull in the head of a biological organism. Encapsulation material is used to encapsulate and fix the gap between the skull opening, the transparent cortical electrode 10, and the fixation headpiece 20.

[0118] Here, the encapsulation materials include, but are not limited to, medical tissue adhesive and / or dental cement.

[0119] In some alternative implementations, the encapsulation material may be a biocompatible and / or transparent material.

[0120] In some alternative embodiments, the fixing head 20 may include a mechanical interface for fixing the transparent cortical electrode 10 and an optical interface for docking with the imaging device.

[0121] In some alternative implementations, the fixation headpiece 20 is designed to be adjustable to accommodate different skull structures.

[0122] In some alternative embodiments, the transparent cortical electrode 10 is configured to be connected and fixed to the fixation headpiece 20 and the skull, wherein the transparent cortical electrode 10 and the fixation headpiece 20 are connected together via a connection area 112, and the transparent cortical electrode 10 and the skull are connected together via the edge of a window area 111.

[0123] In some alternative embodiments, the assembly system further includes a fixing clamp (not shown) configured to fix the fixing head, thereby fixing the transparent cortical electrode 10 relative to the position of an imaging device.

[0124] The above, combined with Figure 5 The assembly system for the transparent cortical electrode of this disclosure is described. This assembly system uses a transparent cortical electrode 10 to replace part of the skull and fixes it to a fixation headpiece 20. The fixation headpiece 20 stabilizes the transparent cortical electrode 10 and fixes it to the brain. Combined with a matching imaging device, simultaneous recording of neural electrical activity and neural imaging can be achieved.

[0125] Continue to refer to Figure 5 This disclosure provides a neural signal acquisition system, including: Figures 1 to 4 The transparent cortical electrode 10, imaging device 30, and acquisition and recording device 40 are shown. Transparent cortical electrode 10 includes a transparent conductive coating 13, which is used to contact the cerebral cortex through the transparent conductive coating 13 to collect neural electrical signals; Imaging device 30 is used to acquire neural imaging signals through the window area 111 of transparent cortical electrode 10. The acquisition and recording device 40 is used to simultaneously record neural electrical signals and neural imaging signals.

[0126] In some alternative implementations, the data acquisition and recording device 40 is further used for: Real-time recording of neural electrical signals continuously acquired by transparent cortical electrodes, the neural electrical signals containing time information; The neural imaging signals acquired at intervals by the imaging device are recorded in real time, and the neural imaging signals include timestamps. By aligning the timestamps with the time information, synchronous recording of neural electrical signals and neural imaging signals can be achieved.

[0127] In some alternative implementations, the imaging device 30 may be an optical imaging device, a functional magnetic resonance imaging (fMRI) device, or a positron emission tomography (PET) device, etc.

[0128] In some alternative implementations, the acquisition and recording device 40 is further used to fuse neural electrical signals and neural imaging signals into an image.

[0129] In some alternative implementations, the acquisition and recording device 40 includes a biosignal amplification module for enhancing weak neural electrical signals acquired from neurons.

[0130] In some optional embodiments, the acquisition and recording device 40 includes a signal processing unit for converting, amplifying, and filtering the acquired neural electrical signals into digital signals for subsequent analysis and processing. Optionally, the signal processing unit may include an analog-to-digital converter, a signal amplifier, and a filter.

[0131] In some alternative implementations, the acquisition and recording device 40 includes a data correction module for eliminating data deviations caused by physiological noise, equipment errors, or other external factors.

[0132] In some optional implementations, the acquisition and recording device 40 includes a time synchronization module to ensure that the acquired neural electrical signals and neural imaging signals are precisely synchronized in time. Optionally, the precise synchronization includes synchronization at the millisecond level or even the microsecond level.

[0133] In some alternative implementations, the acquisition and recording device 40 may use a Global Positioning System (GPS) or an atomic clock as a time reference source to improve the accuracy of neural synchronization.

[0134] In some alternative implementations, the acquisition and recording device 40 may include a data fusion module for spatiotemporally aligning and comprehensively analyzing neural electrical signals and neural imaging signals to form fused data, thereby providing more comprehensive application activity information.

[0135] In some alternative implementations, the data acquisition and recording device 40 may include a data visualization module for fusing data to visualize it for the user in an intuitive way, such as 3D reconstruction, animation, or interactive charts.

[0136] In some alternative implementations, the acquisition and recording device 40 may include a user interface (e.g., a display device) for displaying data and allowing users to monitor neural electrical activity and imaging data in real time, and to perform interactive analysis and operation.

[0137] In some alternative implementations, the data acquisition and recording device 40 has an external data interface for communicating with external devices.

[0138] In some alternative implementations, the data acquisition and recording device 40 can communicate with external databases or other analytical tools to facilitate data storage, sharing, and further processing.

[0139] In some alternative implementations, the neural signal acquisition system of this disclosure also includes a power management module for providing stable and adjustable power to the various components of the system and ensuring power efficiency and safety during long-term recording.

[0140] In some alternative implementations, the neural signal acquisition system of this disclosure also includes a fault detection and alarm system for real-time monitoring of system status and issuing warnings when anomalies are detected, in order to provide security protection and data integrity.

[0141] In some alternative implementations, the neural signal acquisition system of this disclosure is designed to be portable for use in a variety of experimental and clinical settings.

[0142] The above, combined with Figure 5 The neural signal acquisition system disclosed herein is described. This neural signal acquisition system, by utilizing the transparent cortical electrode 10 of this disclosure, combines the advantages of implantable neural electrode technology and neuronal imaging technology, achieving seamless integration of neural electrodes and neuronal imaging. It can acquire neural electrical signals and record neuronal activity at high temporal resolution, and also acquire neural imaging signals and record the activity of tens of thousands of neurons in the cerebral cortex at high spatial resolution, thereby providing a more comprehensive observation of neuronal activity.

[0143] Continue to refer to Figure 5 This disclosure also provides a method for assembling transparent cortical electrodes for simultaneous recording of neural electrical activity and neuroimaging, the method comprising the following steps: (1) Remove part of the skull of the subject (organism, such as a human) through craniotomy to expose the cerebral cortex; (2) The transparent cortical electrode 10 of this disclosure is placed above the exposed cerebral cortex, replacing the removed skull; (3) A fixing head 20 is attached to the top or bottom of the transparent cortical electrode; here, the shape and structure of the fixing head 20 are not limited, as long as it can achieve the function of fixing the transparent cortical electrode 10 on the object of observation; for example, the fixing head 20 may have a hollow area corresponding to the skull opening, the transparent cortical electrode 10 is placed in the hollow area and embedded in the skull opening, and the edge of the transparent cortical electrode 10 may be connected to the top or bottom of the fixing head 20; (4) Use encapsulation materials, such as medical tissue adhesive and dental cement, to encapsulate the defective skull, transparent cerebral cortex electrode 10 and fixation head 20 in sequence; this can ensure the stability and reliability of the electrode. (5) When recording neural electrical activity and neural imaging simultaneously, the fixation headpiece 20 can be fixed on the matching fixation clamp to prevent the brain from shaking during imaging; (6) When recording neural electrical activity and neural imaging synchronously, a neural signal acquisition system can be used to record the timestamps of neural electrical signals and neural imaging signals at the same time, thereby aligning the neural electrical signals and neural imaging signals in time; by aligning the time of the two, precise synchronization of the two can be achieved.

[0144] This disclosure enables the transparent cortical electrode 10 to be tightly integrated with the cerebral cortex through the above assembly method, and allows for simultaneous recording during neural electrical activity and neural imaging, thereby providing a reliable tool for studying the nervous system.

[0145] refer to Figure 6 , Figure 6 This is a schematic flowchart of a method for fabricating a transparent cortical electrode according to an embodiment of the present disclosure. The fabrication method includes preparing a substrate layer, forming a metallic conductive layer, forming a first transparent conductive coating, photolithographically patterning an insulating layer, and forming a second transparent conductive coating. Figure 6 An exemplary fabrication process for the transparent cortical electrode provided in this disclosure is illustrated; however, it should be understood that the transparent cortical electrode of this disclosure is not limited to being fabricated using the following steps: Step 1: Prepare the base layer: This disclosure allows for a fabrication process that begins with a substrate made of a rigid, transparent material. The substrate may include, but is not limited to, a glass slide, such as BF33 glass. A clean BF33 glass slide can be taken, purged with nitrogen, and heated at 200 °C for 5 minutes to remove moisture, thus serving as the substrate.

[0146] Here, the base layer can be divided into window areas and connection areas, at least the window areas are transparent.

[0147] Step 2: Forming a conductive layer: This step involves forming (e.g., depositing) a metallic material on a substrate layer to create a patterned conductive layer.

[0148] First, set the first photoresist: spin-coat a layer of non-polar, peelable photoresist (LOR3A) as the release agent, and spin coat the photoresist at 4000 rpm for 60 seconds and bake at 180°C for 5 minutes.

[0149] Setting up the second photoresist: Spin-coat a layer of AZ601 positive resist onto the photoresist (LOR3A) using the following spin-coating conditions: 4000 rpm for 60 seconds, followed by baking at 115°C for 2 minutes. After spin-coating, perform photolithography using a hard contact mode with an exposure dose of 180 mJ / cm². After photolithography, develop the photoresist using ZX-238 developer for 55 seconds, then rinse with water and dry with nitrogen. Through photolithography and development, the photoresist patterning is completed.

[0150] Next, after setting the patterned photoresist, an adhesion layer and a metal layer are sequentially formed by vapor deposition, for example, sequentially depositing 10 nm of chromium (Cr) and 100 nm of gold (Au). The image is then immersed in NMP (N-methylpyrrolidone) to remove the photoresist. After one day, the residual gold (Au) on the surface is blown off, and the NMP and residual gold (Au) are washed away with isopropanol to obtain the conductive metal layer. Optionally, the adhesion layer is chromium with a thickness of less than 20 nm; the metal layer is gold with a thickness of less than 200 nm.

[0151] Here, the patterned conductive layer formed on the substrate may include an electrode array located in the window area, pads located in the connection area, and leads extending from the window area to the connection area, the leads being used to connect the array and the pads.

[0152] Step 3: Forming the first transparent conductive coating (ITO): This step involves forming (e.g., depositing) a patterned first transparent conductive coating (e.g., ITO) on reserved metal conductive sites (i.e., electrode sites) for acquiring (sensing) biological neural signals.

[0153] First, set the first photoresist: spin-coat a layer of photoresist (LOR3A) as the release agent, and spin coat the photoresist at 4000 rpm for 60 seconds and bake at 180°C for 5 minutes.

[0154] Set the second photoresist: Spin coat another layer of AZ601 positive resist onto the photoresist (LOR3A), and spin coat the resist under the following conditions: 4000 rpm for 60 seconds and bake at 115°C for 2 minutes.

[0155] Next, after setting up the photoresist (i.e., after homogenization), photolithography is performed using a hard contact mode with an exposure dose of 180 mJ / cm². After photolithography, development is carried out using ZX-238 developer for 55 seconds, followed by rinsing with water and drying with nitrogen. Through photolithography and development, the photoresist patterning is completed.

[0156] Then, a patterned transparent conductive material, such as sputtered ITO, is formed using a sputtering process and immersed in NMP overnight. One day later, the residual ITO on the surface is blown off, and the NMP and residual ITO are washed away with isopropanol, leaving ITO to form the first transparent conductive coating.

[0157] In some alternative implementations, radio frequency magnetron sputtering technology can be used during the sputtering of ITO to improve uniformity and adhesion.

[0158] Here, the first transparent conductive coating is formed and covers the electrode array of the conductive layer.

[0159] Step 4: Prepare the insulating layer: This step involves photolithographically patterning an insulating layer on the conductive layer reserved as leads to isolate the conductive layer.

[0160] The substrate layer obtained in step 3 is heated at 180 ℃ for 5 minutes to remove moisture. A layer of SU82000.5 negative photoresist is then spin-coated onto it under the following conditions: 3000 rpm for 60 seconds, pre-baking at 65 ℃ for 2 minutes, and pre-baking at 95 ℃ for 2 minutes. After spin-coating, photolithography is performed using a hard contact mode with an exposure time of 70 seconds. After photolithography, the substrate is post-baked at 65 ℃ for 2 minutes and then at 95 ℃ for 2 minutes. Development is then performed using propylene glycol methyl ether acetate (PGMEA) for 1 minute. The substrate is then transferred to fresh propylene glycol methyl ether acetate (PGMEA) and developed for 10-15 seconds. It is then rinsed with PG Developer, transferred to isopropanol for cleaning, rinsed with isopropanol, dried with nitrogen, and baked at 180 ℃ for 30 minutes to obtain a patterned SU8 photoresist as an insulating layer.

[0161] Here, the negative photoresist is patterned through photolithography and development; the patterned negative photoresist is then processed using a high-temperature baking process to form an insulating layer. The formed insulating layer covers the conductive layer and has openings that expose the first transparent conductive coating.

[0162] Step 5: Forming the second transparent conductive coating (PEDOT): This step involves forming (e.g., depositing) a patterned second transparent conductive coating (e.g., PEDOT) on the reserved metal conductive sites (i.e., electrode sites) for sensing, to further enhance the ability to acquire biological neural signals.

[0163] A transparent conductive material, such as a PEDOT:PSS solution, is spin-coated onto the surface of the structure obtained in step 4 to form a thin film. The film is baked at 110°C for 1 hour and then soaked in deionized water overnight to remove excess PSS and low molecular weight compounds. The formed film is patterned using AZ601 photoresist through photolithography and development to protect the portions of PEDOT that need to be retained. Subsequently, the PEDOT:PSS layer is etched using reactive ion etching with CF4 and O2 gases (5 sccm and 50 sccm flow rates, respectively) at a pressure of 60 mTorr and a power of 150 W to obtain patterned PEDOT, forming a second transparent conductive coating.

[0164] Here, a second transparent conductive coating is formed at the opening of the insulating layer that exposes the first transparent conductive coating, and the second transparent conductive coating covers the first transparent conductive coating.

[0165] In some optional embodiments, the above method may further include the following steps: cutting and bending the basal layer to match its window area with the skull opening, so as to better fit the cerebral cortex, thereby obtaining a transparent cortical electrode that conforms to a portion of the skull shape. This step may be performed after step 1 or after step 5, and this disclosure is not limiting.

[0166] It should be noted that the patterning in the above steps can be based on, for example... Figures 1 to 4 The pattern of the transparent cortical electrode shown is determined, and the pattern of the transparent cortical electrode can be determined according to actual needs.

[0167] The above, combined with Figure 6 The preparation method according to embodiments of this disclosure is described. Regarding the flowcharts of the methods according to embodiments of this disclosure, certain operations are described as different steps performed in a certain order. Such flowcharts are illustrative and not restrictive. Some steps described herein may be grouped together and performed in a single operation, some steps may be divided into multiple sub-steps, and some steps may be performed in an order different from that shown herein.

[0168] The following is for reference. Figure 7 It shows a schematic diagram of the structure of a computer system 700 suitable for implementing the acquisition and recording device of the present disclosure. Figure 7 The computer system 700 shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments of this disclosure.

[0169] like Figure 7As shown, the computer system 700 may include a processing device (e.g., a central processing unit, a graphics processing unit, etc.) 701, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 702 or a program loaded from a storage device 708 into a random access memory (RAM) 703. The RAM 703 also stores various programs and data required for the operation of the computer system 700. The processing device 701, ROM 702, and RAM 703 are interconnected via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0170] Typically, the following devices can be connected to I / O interface 705: input devices 706 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, etc.; output devices 707 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 708 including, for example, magnetic tapes, hard disks, etc.; and communication devices 709. Communication device 709 allows computer system 700 to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 7 A computer system 700 with various electronic devices is shown; however, it should be understood that it is not required to implement or possess all of the devices shown. More or fewer devices may be implemented or possessed alternatively.

[0171] In particular, according to embodiments of this disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this disclosure include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication device 709, or installed from storage device 708, or installed from ROM 702. When the computer program is executed by processing device 701, it performs the aforementioned functions of the acquisition and recording device in the neural signal acquisition system of embodiments of this disclosure.

[0172] It should be noted that the computer-readable medium described in this disclosure can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this disclosure, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In this disclosure, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.

[0173] The aforementioned computer-readable medium may be included in the aforementioned acquisition and recording device; or it may exist independently and not assembled into the electronic device.

[0174] The aforementioned computer-readable medium carries one or more programs, which, when executed by the acquisition and recording device, cause the acquisition and recording device to perform the aforementioned functions of the acquisition and recording device in the neural signal acquisition system of this disclosure embodiment.

[0175] Computer program code for performing the operations of this disclosure can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0176] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block, or combination of blocks, in the block diagrams and / or flowcharts may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0177] The units described in the embodiments of this disclosure can be implemented in software or hardware. The names of the units are not, in some cases, intended to limit the specific unit.

[0178] The above description is merely a preferred embodiment of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features disclosed in this disclosure that have similar functions.

Claims

1. A transparent cortical electrode, characterized in that, For use in neural electrical recording, cranial encapsulation, and compatible neural imaging, the transparent cortical electrode comprises a basal layer, a conductive layer, a transparent conductive coating, and an insulating layer; The base layer includes a transparent window area and a connection area, the window area being used to enclose the skull opening; The conductive layer includes an electrode array formed on the window area, pads formed on the connection area, and leads electrically connecting the electrode array and the pads; The transparent conductive coating is formed on the electrode array for collecting neural electrical signals; The insulating layer is made of a transparent material, covers the lead wire, and exposes the transparent conductive coating.

2. The transparent cortical electrode according to claim 1, characterized in that, The base layer is made of a rigid transparent material with a Mohs hardness of not less than 6H and a visible light transmittance of not less than 90%. The window area on the base layer is a planar or curved structure that matches the shape of the skull opening and is used to replace part of the skull; the connection area on the base layer is square, and the pads are arranged side by side on the connection area, so that the connection area with the pads can be plugged into an external device.

3. The transparent cortical electrode according to claim 1, characterized in that, The conductive layer is made of materials with a conductivity higher than 4.5 × 10⁻⁶. 7 The conductive layer is made of Siemens / meter metal material, and the linewidth of the conductive layer is smaller than the diameter of a brain nerve, and the linewidth of the conductive layer is no greater than 2μm.

4. The transparent cortical electrode according to claim 1, characterized in that, The electrode array includes multiple electrode sites, which are circular ring structures, hollow porous structures, or mesh structures; and the electrode array includes multiple regions of different densities to match different regions of the cerebral cortex.

5. The transparent cortical electrode according to claim 4, characterized in that, The transparent conductive coating is used to contact the cerebral cortex and includes multiple spaced-apart sensing units, each of which covers multiple electrode sites and is electrically connected to each electrode site in a one-to-one correspondence; the visible light transmittance of the transparent conductive coating is not less than 90%. The transparent conductive coating includes a first transparent conductive coating formed on the electrode array and a second transparent conductive coating formed on the first transparent conductive coating. The first transparent conductive coating and the second transparent conductive coating are made of different materials. The transparent conductive coating is a flexible material selected from indium tin oxide, graphene, carbon nanotubes, transparent conductive hydrogels, and PEDOT and combinations thereof.

6. The transparent cortical electrode according to claim 4, characterized in that, The insulating layer is a flexible material selected from SU-8 photoresist and polyimide, and has a visible light transmittance of not less than 90%. The insulating layer has an opening that exposes the electrode site, and the transparent conductive coating is formed in the opening.

7. The transparent cortical electrode according to claim 1, characterized in that, The transparent cortical electrode is configured to be connected and fixed to the headpiece and the skull. The transparent cortical electrode is connected to the headpiece through the connection area, and the transparent cortical electrode is connected to the skull through the edge of the window area.

8. A method for preparing a transparent cortical electrode, used to prepare the transparent cortical electrode as described in claim 1, characterized in that, Includes the following steps: Prepare a basal layer, which is divided into a window area and a connection area, wherein at least the window area is transparent and is used to encapsulate the skull opening; A patterned conductive layer is formed on the substrate layer, the conductive layer including an electrode array located on the window region; A patterned transparent conductive coating is formed on the electrode array, and the transparent conductive coating is used to acquire neural electrical signals; An insulating layer is formed on the substrate layer. The insulating layer is made of a transparent material and covers the conductive layer while exposing the transparent conductive coating. In addition, the base layer is shaped by cutting and bending to make the window area match the opening of the skull; The formation of a patterned transparent conductive coating on the electrode array includes: After the electrode array is formed, a patterned first transparent conductive coating is formed on the electrode array; After the insulating layer is formed, a second transparent conductive coating is formed at the opening of the insulating layer that exposes the first transparent conductive coating, covering the first transparent conductive coating.

9. A neural signal acquisition system, characterized in that, include: The transparent cortical electrode, imaging device, and acquisition and recording device as described in claim 1; The transparent cortical electrode includes a transparent conductive coating, which is used to contact the cerebral cortex through the transparent conductive coating to collect neural electrical signals; The imaging device is used to acquire neural imaging signals through the window area of ​​the transparent cortical electrode; The acquisition and recording device is used to: record in real time the neural electrical signals continuously acquired by the transparent cortical electrode, the neural electrical signals including time information; record in real time the neural imaging signals acquired at intervals by the imaging device, the neural imaging signals including timestamps; align the timestamps with the time information in time to achieve synchronous recording of the neural electrical signals and the neural imaging signals; and fuse the neural electrical signals and the neural imaging signals into an image and present it through a display device.

10. An assembly system for transparent cortical electrodes, characterized in that, include: The transparent cortical electrode, the fixing head, the fixing clamp, and the encapsulation material as described in claim 1; The fixing headpiece is used to fix the transparent cortical electrode to the biological head; The fixing clamp is configured to fix the fixing head piece, so that the transparent cortical electrode is fixed relative to the position of an imaging device; The transparent cortical electrode includes a window region for encapsulation at the skull opening of the biological head; The encapsulation material is used to encapsulate and fix the gap between the skull opening, the transparent cortical electrode, and the fixation headpiece. The encapsulation material includes medical tissue adhesive and / or dental cement.

Images