A computer assembly robot and its usage method

By using a fully mechanical linkage and buffer positioning structure for computer assembly robots, the problems of low efficiency and wear in the insertion of memory modules and motherboards have been solved, realizing a highly efficient and automated memory module assembly process, and improving assembly efficiency and yield.

CN122077585APending Publication Date: 2026-05-26HANGZHOU XIAOYUAN TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HANGZHOU XIAOYUAN TECHNOLOGY CO LTD
Filing Date
2026-04-21
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing computer assembly equipment is inefficient and prone to wear and tear during the insertion of memory modules and motherboards, making it difficult to meet the demands of high-efficiency, high-quality production.

Method used

The computer assembly robot achieves integrated continuous operation of synchronous feeding, precise clamping, horizontal transfer, vertical pressing and motherboard clamping through the full mechanical linkage of the base, reciprocating lead screw, vertical guide mechanism and motherboard positioning mechanism. Combined with pneumatic grippers, spring buffers and rubber positioning blocks, it ensures accurate insertion, gentle force and stable motherboard.

Benefits of technology

It significantly improves the efficiency and yield of memory module assembly, avoids wear and tear on memory modules and motherboards, and achieves an efficient and automated assembly process.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention belongs to the field of computer assembly robot technology, specifically a computer assembly robot and its usage method. The robot includes a base, with a first conveyor and a second conveyor arranged adjacent to each other on the top outer wall of the base. A backplate is fixedly connected to the top outer walls of the first and second conveyors by screws. A servo motor is fixedly connected to one side of the backplate's outer wall by screws, and the output shaft of the servo motor is fixedly connected to a reciprocating lead screw via a coupling. A reciprocating moving block is screwed onto the outer wall of the reciprocating lead screw, and a first spring is fixedly connected to one side of the reciprocating moving block's outer wall. This invention achieves integrated continuous operation of synchronous feeding, precise clamping, horizontal transfer, vertical pressing, and motherboard clamping through the full mechanical linkage of the base, reciprocating lead screw, vertical guide mechanism, and motherboard positioning mechanism. The operation is uninterrupted and smooth, significantly shortening the assembly cycle and solving the problem of low efficiency in memory module assembly.
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Description

Technical Field

[0001] This invention relates to the field of computer assembly robot technology, and more particularly to a computer assembly robot and its usage method. Background Technology

[0002] Computer assembly is a core step in the computer manufacturing process, mainly including motherboard installation, memory module insertion, graphics card mounting, and wiring connections. Among these, the insertion and assembly of memory modules into the motherboard requires extremely high precision and efficiency. As a core storage component of the computer, memory modules must be precisely inserted into the motherboard slots, ensuring good contact while avoiding excessive pressure that could damage the gold fingers or the slot. With the increasing automation and large-scale production of computers, using automated robots to replace manual memory module insertion can effectively improve assembly speed, consistency, and yield, making them key equipment in modern intelligent computer manufacturing.

[0003] In existing computer assembly technology, automated memory module insertion equipment has significant shortcomings, making it difficult to meet the demands for high-efficiency, high-quality production: First, the assembly efficiency of memory modules and motherboards is low, and the process is mostly done in steps: first clamping, then moving, and then pressing down. The actions are not connected smoothly, and there is a lack of synchronous positioning and pressing structure. The assembly cycle of a single module is long and cannot be adapted to high-speed production lines. Secondly, the installation process can easily cause wear and tear on the memory modules. The lack of buffer protection and self-adaptive positioning structure during insertion can cause the gold fingers of the memory modules and the motherboard slots to be scratched, deformed or damaged due to uneven force and angle deviation. At the same time, the motherboard is not effectively fixed and is prone to shaking and displacement, which further aggravates the risk of wear and tear and leads to an increase in the product defect rate. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention provides a computer assembly robot and its usage method, which overcomes the shortcomings of the prior art and effectively solves the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A computer assembly robot and its method of use include a base. The top outer wall of the base is provided with a first conveyor and a second conveyor arranged adjacent to each other. The top outer walls of the first and second conveyors are fixedly connected to a back plate by screws. A servo motor is fixedly connected to one side outer wall of the back plate by screws. The output shaft of the servo motor is fixedly connected to a reciprocating lead screw by a coupling. A reciprocating moving block is screwed onto the outer wall of the reciprocating lead screw. A first spring is fixedly connected to one side outer wall of the reciprocating moving block. A trapezoidal block is fixedly connected to the bottom outer wall of the first spring. A sliding plate is slidably connected to the bottom of one side outer wall of the trapezoidal block. A mounting plate is welded to one side outer wall of the sliding plate. A pneumatic gripper for gripping memory modules is installed through the inner wall of the mounting plate. A vertical guide mechanism is provided on one side of the trapezoidal block, and a pressing block is welded to the bottom outer wall of the trapezoidal block, with a main board positioning mechanism provided at the bottom of the pressing block.

[0006] Preferably, a first guide rod is fixedly connected to one side of the outer wall of the reciprocating block, and the first guide rod is disposed through the other side of the inner wall of the trapezoidal block, with a first spring sleeved on the outside of the first guide rod.

[0007] Preferably, the vertical guide mechanism includes a wedge block, a limiting baffle, a connecting block, and a second spring. The wedge block is welded to both ends of the outer wall on the other side of the back plate, the limiting baffle is welded to one side of the outer wall of the wedge block, the connecting block is welded to the top outer wall of the slide plate, and two adjacent second springs are fixedly connected between the connecting block and the trapezoidal block. The wedge block and the trapezoidal block are in contact with each other, and the limiting baffle is tightly attached to one side of the outer wall of the slide plate.

[0008] Preferably, the motherboard positioning mechanism includes a second guide rod, a top plate, a lifting frame, a third spring, a fixing sleeve, a universal ball, and a rubber positioning block. The symmetrically distributed second guide rods are all fixedly connected to the top outer wall of the base by screws. The top plate is welded to the top outer wall of the second guide rods. The lifting frame extends through the outer wall of the second guide rods. The third spring is fixedly connected between the lifting frame and the top plate. The fixing sleeve extends through the peripheral outer wall of the lifting frame. The universal ball is rotatably connected to the bottom inner wall of the fixing sleeve. The rubber positioning block is adhered to the bottom outer wall of the universal ball. The pressure block is tightly attached to the top outer wall of the lifting frame.

[0009] Preferably, the first conveyor belt is equipped with memory module placement frames that are evenly distributed, and the second conveyor belt is equipped with motherboard placement frames that are evenly distributed.

[0010] Preferably, a first photoelectric sensor for monitoring the position of the motherboard is fixedly installed on the inner wall of one side of the lifting frame, and the first photoelectric sensor is located above the motherboard placement frame. A vertical plate is installed on the outer wall of the top of the base near the first conveyor, and a second photoelectric sensor for monitoring the position of the memory module is installed on the outer wall of the top of the vertical plate.

[0011] Preferably, a slide rail is provided on one side of the outer wall of the back plate above the reciprocating lead screw, and the reciprocating moving block is slidably connected to the bottom outer wall of the slide rail by a slider. A sliding groove is provided through the outer wall of the back plate, and the reciprocating moving block is provided through the inner wall of the sliding groove.

[0012] Preferably, a PLC controller is fixedly connected to one outer wall of the back plate by screws, and the PLC controller is electrically connected to the first conveyor, the second conveyor, the servo motor, the pneumatic gripper, the first photoelectric sensor, and the second photoelectric sensor via signal lines.

[0013] A method of using a computer assembly robot includes the following steps: S1: Loading and positioning: Place the memory module into the memory module placement box of the first conveyor and the motherboard into the motherboard placement box of the second conveyor. After the equipment is started, the first and second conveyors transport the memory module synchronously. The second photoelectric sensor detects that the memory module is in place and the first photoelectric sensor detects that the motherboard is in place. After the memory module is in place, the conveyor stops and the PLC controller prepares to execute the assembly instructions. S2: Memory module gripper: The PLC controller controls the pneumatic gripper to precisely grip the memory module in the memory module placement frame and maintain the gripper state after gripping. S3: Horizontal transfer: The servo motor drives the reciprocating screw to rotate, which in turn drives the reciprocating moving block to move horizontally along the slide rail. The trapezoidal block, slide plate and pneumatic gripper move synchronously to deliver the memory stick to the top of the motherboard. S4: Insertion and Positioning: The trapezoidal block contacts the wedge block and moves down along its inclined surface. Under the constraint of the limit baffle, the slide plate drives the pneumatic gripper to descend vertically. The first and second springs buffer and dampen the shock. The pneumatic gripper smoothly presses the memory module into the motherboard slot. At the same time, the lower pressure block squeezes the lifting frame to move down along the second guide rod. The third spring buffers the shock. The universal ball adapts to the motherboard plane. The rubber positioning block presses the motherboard around to complete the positioning. After the insertion is completed, all mechanisms reset and enter the next assembly cycle.

[0014] The beneficial effects of this invention are as follows: The computer assembly robot and its usage method of the present invention achieve integrated continuous operation of synchronous feeding, precise clamping, horizontal transfer, vertical pressing and motherboard clamping through the full mechanical linkage of the base, reciprocating lead screw, vertical guide mechanism and motherboard positioning mechanism. The operation is uninterrupted and smooth, which greatly shortens the assembly cycle and solves the problem of low efficiency in memory module assembly. The computer assembly robot and its usage method of the present invention, through the cooperation of a first conveyor, a second conveyor, a servo motor, a reciprocating screw and a pneumatic gripper, realizes synchronous conveying, automatic gripping and reciprocating transfer of dual production lines, fully automated operation, no need for manual intervention, precise positioning, stable transfer, and significantly improves assembly efficiency. The computer assembly robot and its usage method of the present invention, through the cooperation of the wedge block and trapezoid block of the vertical guide mechanism, converts horizontal motion into vertical downward motion, and with the flexible buffering of the first spring and the second spring, the pneumatic gripper descends vertically and smoothly, with precise insertion angle and gentle force, avoiding scratching and wear between the gold fingers of the memory module and the slot. The computer assembly robot and its usage method of the present invention achieve adaptive flexible clamping of the motherboard through the universal ball and rubber positioning block of the motherboard positioning mechanism, ensuring firm positioning without shaking. The third spring buffers and prevents crushing damage, fundamentally avoiding memory module wear caused by motherboard misalignment and improving the assembly yield. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a computer assembly robot and its usage method proposed in this invention, showing the pneumatic gripper picking up a memory module. Figure 2 This is a schematic diagram of the overall structure of a computer assembly robot and its usage method proposed in this invention, showing the pneumatic gripper holding a memory module and placing it on the motherboard. Figure 1 ; Figure 3 This is a schematic diagram of the overall structure of a computer assembly robot and its usage method proposed in this invention, showing the pneumatic gripper holding a memory module and placing it on the motherboard. Figure 2 ; Figure 4 This is a schematic diagram of the backplate connection structure of a computer assembly robot and its usage method proposed in this invention. Figure 1 ; Figure 5 This is a schematic diagram of the backplate connection structure of a computer assembly robot and its usage method proposed in this invention. Figure 2 ; Figure 6 This is a schematic diagram of the motherboard positioning mechanism of a computer assembly robot and its usage method proposed in this invention. Figure 7 This is a schematic diagram of the fixed sleeve, universal ball, and rubber positioning block structure of a computer assembly robot and its usage method proposed in this invention.

[0016] In the diagram: 1. Base; 2. First conveyor; 3. Second conveyor; 4. Back plate; 5. Servo motor; 6. Reciprocating lead screw; 7. Reciprocating moving block; 8. First spring; 9. Trapezoidal block; 10. First guide rod; 11. Slide plate; 12. Mounting plate; 13. Pneumatic gripper; 14. Vertical guide mechanism; 141. Wedge block; 142. Limiting baffle; 143. Connecting block; 144. Second spring; 15. Pressing block; 16. Mainboard positioning mechanism; 161. Second guide rod; 162. Top plate; 163. Lifting frame; 164. Third spring; 165. Fixing sleeve; 166. Universal ball; 167. Rubber positioning block; 17. Memory module placement frame; 18. Mainboard placement frame; 19. First photoelectric sensor; 20. Vertical plate; 21. Second photoelectric sensor; 22. Slide rail; 23. Slide groove; 24. PLC controller. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] Reference Figures 1-7 Example 1: A computer assembly robot and its usage method, comprising a base 1, with a first conveyor 2 and a second conveyor 3 arranged adjacently on the top outer wall of the base 1, and a back plate 4 fixedly connected to the top outer wall of the first conveyor 2 and the second conveyor 3 by screws, a servo motor 5 fixedly connected to one side outer wall of the back plate 4 by screws, and a reciprocating screw 6 fixedly connected to the output shaft of the servo motor 5 by a coupling, a reciprocating moving block 7 screwed onto the outer wall of the reciprocating screw 6, a first spring 8 fixedly connected to one side outer wall of the reciprocating moving block 7, a trapezoidal block 9 fixedly connected to the bottom outer wall of the first spring 8, a sliding plate 11 slidably connected to the bottom of one side outer wall of the trapezoidal block 9, and a mounting plate 12 welded to one side outer wall of the sliding plate 11, with a pneumatic gripper 13 for gripping memory modules installed through the inner wall of the mounting plate 12.

[0019] Through the above scheme, the base 1 provides a stable support foundation. The first conveyor 2 and the second conveyor 3 are MT60 belt conveyors, which work in an intermittent synchronous conveying mode to transport memory modules and motherboards respectively. The back plate 4 provides a mounting carrier for the transmission components. The servo motor 5 is an MS-80ST-M02430 servo motor, which works in a forward and reverse reciprocating drive mode to drive the reciprocating screw 6 to rotate. The reciprocating screw 6 drives the reciprocating moving block 7 to move horizontally back and forth. The first spring 8 is a YT-10 compression spring, which works in a flexible buffer mode to provide buffer pressure. The trapezoidal block 9 is used to cooperate with the vertical guide mechanism 14 to achieve downward pressure. The slide plate 11 drives the pneumatic gripper 13 to slide vertically. The pneumatic gripper 13 is an MHC2-10D pneumatic gripper, which works in a bidirectional synchronous clamping mode to accurately and stably clamp the memory module and prevent it from slipping and being damaged.

[0020] In this embodiment, the cooperation of the first conveyor 2, the second conveyor 3, the servo motor 5, the reciprocating screw 6 and the pneumatic gripper 13 enables synchronous conveying, automatic gripping and reciprocating transfer of the two production lines. The entire process is automated, requiring no manual intervention, with precise positioning and smooth transfer, significantly improving assembly efficiency.

[0021] In embodiment 2, a vertical guide mechanism 14 is provided on one side of the trapezoidal block 9. The vertical guide mechanism 14 includes a wedge block 141, a limiting baffle 142, a connecting block 143, and a second spring 144. The wedge block 141 is welded to both ends of the outer wall of the other side of the back plate 4. The limiting baffle 142 is welded to one side of the outer wall of the wedge block 141. The connecting block 143 is welded to the top outer wall of the slide plate 11. Two adjacent second springs 144 are fixedly connected between the connecting block 143 and the trapezoidal block 9. The wedge block 141 and the trapezoidal block 9 are in close contact with each other, and the limiting baffle 142 is tightly attached to one side of the outer wall of the slide plate 11.

[0022] Through the above scheme, the vertical guide mechanism 14 converts the horizontal movement into the vertical pressing movement. The wedge block 141 adopts an inclined guide to make the trapezoidal block 9 descend smoothly. The limit baffle 142 limits the slide plate 11 to ensure that the vertical movement does not deviate. The connecting block 143 connects the slide plate 11 and the second spring 144. The second spring 144 adopts a YW-08 type compression spring, which works by elastic reset and buffering to reduce insertion impact, avoid rigid contact between the memory module and the slot causing wear, and improve insertion safety.

[0023] In this embodiment, the wedge block 141 of the vertical guide mechanism 14 cooperates with the trapezoidal block 9 to convert the horizontal movement into a vertical downward pressing movement. With the flexible buffering of the first spring 8 and the second spring 144, the pneumatic gripper 13 descends vertically and smoothly, with precise insertion angle and gentle force, avoiding scratching and wear between the gold fingers of the memory module and the slot.

[0024] In embodiment three, a lower pressure block 15 is welded to the bottom outer wall of the trapezoidal block 9, and a main board positioning mechanism 16 is provided at the bottom of the lower pressure block 15. The main board positioning mechanism 16 includes a second guide rod 161, a top plate 162, a lifting frame 163, a third spring 164, a fixing sleeve 165, a universal ball 166, and a rubber positioning block 167. The symmetrically distributed second guide rods 161 are all fixedly connected to the top outer wall of the base 1 by screws, and the top plate 162 is welded to the second guide rods 161. On the top outer wall of 1, the lifting frame 163 is installed through the outer wall of the second guide rod 161, the third spring 164 is fixedly connected between the lifting frame 163 and the top plate 162, the fixing sleeve 165 is installed through the peripheral outer wall of the lifting frame 163, the universal ball 166 is rotatably connected to the bottom inner wall of the fixing sleeve 165, and the rubber positioning block 167 is bonded to the bottom outer wall of the universal ball 166. The pressing block 15 is tightly attached to the top outer wall of the lifting frame 163.

[0025] With the above scheme, the lowering block 15 presses down with the trapezoidal block 9 to drive the lifting frame 163 to move downward. The second guide rod 161 guides the lifting frame 163 to move vertically. The third spring 164 adopts a TB-12 type buffer spring, which works by applying pressure flexibly to prevent excessive pressure from damaging the motherboard. The fixing sleeve 165 is equipped with a universal ball 166, which can achieve multi-angle adaptive adjustment. The rubber positioning block 167 is made of wear-resistant silicone material, which flexibly presses the motherboard without damaging the surface. It works with the universal ball 166 to adaptively fit the motherboard plane, ensuring that the motherboard is stable and does not wobble, and avoiding wear of the memory module due to displacement.

[0026] In this embodiment, the motherboard is adaptively and flexibly pressed by the universal ball 166 and the rubber positioning block 167 of the motherboard positioning mechanism 16, and the positioning is firm and does not shake. The third spring 164 buffers and prevents pressure damage, thus avoiding the wear of memory modules caused by motherboard misalignment and improving the assembly yield.

[0027] A first guide rod 10 is fixedly connected to one side of the outer wall of the reciprocating block 7, and the first guide rod 10 is installed through the other side of the inner wall of the trapezoidal block 9. The first spring 8 is sleeved on the outside of the first guide rod 10.

[0028] With the above solution, the first guide rod 10 adopts a chrome-plated optical axis to guide the trapezoidal block 9 to move vertically, prevent wobbling and deviation, ensure that the pneumatic gripper 13 is accurately aligned with the memory module insertion position, and improve assembly accuracy.

[0029] The first conveyor 2 has memory module placement frames 17 installed on its conveyor belt at equal intervals, and the second conveyor 3 has motherboard placement frames 18 installed on its conveyor belt at equal intervals.

[0030] With the above solution, the memory module placement frame 17 and the motherboard placement frame 18 adopt a positioning slot design to fix the positions of the memory module and the motherboard respectively, prevent displacement during transportation, ensure accurate clamping and insertion positioning, and improve assembly consistency.

[0031] A first photoelectric sensor 19 for monitoring the position of the motherboard is fixedly installed on the inner wall of one side of the lifting frame 163, and the first photoelectric sensor 19 is located above the motherboard placement frame 18. A vertical plate 20 is installed on the outer wall of the top of the base 1 near the first conveyor 2, and a second photoelectric sensor 21 for monitoring the position of the memory module is installed on the outer wall of the top of the vertical plate 20.

[0032] With the above scheme, both the first photoelectric sensor 19 and the second photoelectric sensor 21 adopt E3Z-D61 type photoelectric switches, which operate in the form of diffuse reflection detection. They respectively detect whether the motherboard and memory module are in place in real time, and transmit the signal to the PLC controller 24 to achieve accurate positioning and automatic start and stop, avoid no-operation and misoperation, and improve the level of automation.

[0033] A slide rail 22 is provided on one side of the outer wall of the back plate 4 above the reciprocating lead screw 6, and the reciprocating moving block 7 is slidably connected to the bottom outer wall of the slide rail 22 by a slider. A slide groove 23 is provided through the outer wall of the back plate 4, and the reciprocating moving block 7 is provided through the inner wall of the slide groove 23.

[0034] Through the above scheme, the slide rail 22 adopts the MGN15 type linear slide rail 22, which supports the reciprocating moving block 7 to move smoothly horizontally, reduces friction and shaking, ensures a smooth transfer process, and prevents the memory stick from shaking and shifting.

[0035] A PLC controller 24 is fixedly connected to one outer wall of the back plate 4 by screws, and the PLC controller 24 is electrically connected to the first conveyor 2, the second conveyor 3, the servo motor 5, the pneumatic gripper 13, the first photoelectric sensor 19 and the second photoelectric sensor 21 through signal lines.

[0036] Through the above solution, the PLC controller 24 adopts the FX3U-16MT programmable controller, which operates in the mode of logic program control. It centrally controls the entire process of conveying, clamping, transferring, pressing, and positioning, realizing automated linkage operation and improving assembly efficiency and stability.

[0037] A method of using a computer assembly robot includes the following steps: S1: Loading and positioning: Place the memory module into the memory module placement box 17 of the first conveyor 2, and place the motherboard into the motherboard placement box 18 of the second conveyor 3. After the equipment is started, the first conveyor 2 and the second conveyor 3 transport synchronously. The second photoelectric sensor 21 detects that the memory module is in place, and the first photoelectric sensor 19 detects that the motherboard is in place. After the motherboard is in place, the conveyor stops, and the PLC controller 24 prepares to execute the assembly instructions. S2: Memory module clamping: PLC controller 24 controls the pneumatic gripper 13 to precisely clamp the memory module in the memory module placement frame 17 and maintain the clamping state after the clamping is completed. S3: Horizontal transfer: Servo motor 5 drives reciprocating screw 6 to rotate, which drives reciprocating moving block 7 to move horizontally along slide rail 22. Trapezoidal block 9, slide plate 11 and pneumatic gripper 13 are transferred synchronously to send the memory stick to the top of the motherboard. S4: Insertion and Positioning: Trapezoidal block 9 contacts wedge block 141 and moves down along its inclined surface. Under the constraint of limit baffle 142, slide plate 11 drives pneumatic gripper 13 to descend vertically. First spring 8 and second spring 144 buffer and dampen shock. Pneumatic gripper 13 smoothly presses memory module into motherboard slot. At the same time, pressing block 15 squeezes lifting frame 163 to move down along second guide rod 161. Third spring 164 buffers. Universal ball 166 adapts to motherboard plane. Rubber positioning block 167 presses the motherboard around to complete positioning. After insertion, all mechanisms reset and enter the next assembly cycle.

[0038] Working principle: After the equipment is started, the first conveyor 2 transports memory modules and the second conveyor 3 transports motherboards in a synchronous operation. After the second photoelectric sensor 21 detects that the memory module has arrived and the first photoelectric sensor 19 detects that the motherboard has arrived, the conveyors stop. The PLC controller 24 controls the pneumatic gripper 13 to clamp the memory module in the memory module placement frame 17. The servo motor 5 drives the reciprocating screw 6 to rotate, which in turn drives the reciprocating moving block 7 to move horizontally along the slide rail 22, sending the memory module to the top of the motherboard. After trapezoidal block 9 contacts wedge block 141, it descends along the inclined plane. Under the constraint of limit baffle 142, slide plate 11 drives pneumatic gripper 13 to descend vertically. First spring 8 and second spring 144 buffer and dampen shock, allowing the memory module to be smoothly and accurately inserted into the motherboard slot. At the same time, pressure block 15 presses down lifting frame 163, third spring 164 buffers, and universal ball 166 and rubber positioning block 167 flexibly press the motherboard to prevent displacement and shaking. After insertion is completed, servo motor 5 reverses, each mechanism resets under the action of springs, pneumatic gripper 13 releases, and enters the next assembly cycle.

[0039] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A computer assembly robot, comprising a base (1), characterized in that, The base (1) has a first conveyor (2) and a second conveyor (3) arranged adjacent to each other on the top outer wall. The top outer walls of the first conveyor (2) and the second conveyor (3) are fixedly connected to a back plate (4) by screws. The outer wall of one side of the back plate (4) is fixedly connected to a servo motor (5) by screws. The output shaft of the servo motor (5) is fixedly connected to a reciprocating screw (6) by a coupling. The outer wall of the reciprocating screw (6) is screwed with a reciprocating moving block (7). The outer wall of one side of the reciprocating moving block (7) is fixedly connected to a first spring (8). The bottom outer wall of the first spring (8) is fixedly connected to a trapezoidal block (9). The bottom of one side of the outer wall of the trapezoidal block (9) is slidably connected to a slide plate (11). The outer wall of one side of the slide plate (11) is welded with a mounting plate (12). The inner wall of the mounting plate (12) is through-mounted with a pneumatic gripper (13) for gripping memory sticks. A vertical guide mechanism (14) is provided on one side of the trapezoidal block (9), and a pressing block (15) is welded to the bottom outer wall of the trapezoidal block (9), and a main board positioning mechanism (16) is provided at the bottom of the pressing block (15).

2. The computer assembly robot according to claim 1, characterized in that, The reciprocating moving block (7) has a first guide rod (10) fixedly connected to one side of its outer wall, and the first guide rod (10) is installed through the other side of the trapezoidal block (9) on its inner wall. The first spring (8) is sleeved on the outside of the first guide rod (10).

3. The computer assembly robot according to claim 1, characterized in that, The vertical guide mechanism (14) includes a wedge block (141), a limiting baffle (142), a connecting block (143), and a second spring (144). The wedge block (141) is welded to both ends of the outer wall of the other side of the back plate (4), the limiting baffle (142) is welded to the outer wall of one side of the wedge block (141), the connecting block (143) is welded to the top outer wall of the slide plate (11), and two adjacent second springs (144) are fixedly connected between the connecting block (143) and the trapezoidal block (9). The wedge block (141) and the trapezoidal block (9) are in contact with each other, and the limiting baffle (142) is in close contact with the outer wall of one side of the slide plate (11).

4. A computer assembly robot according to claim 1, characterized in that, The mainboard positioning mechanism (16) includes a second guide rod (161), a top plate (162), a lifting frame (163), a third spring (164), a fixing sleeve (165), a universal ball (166), and a rubber positioning block (167). The symmetrically distributed second guide rods (161) are all fixedly connected to the top outer wall of the base (1) by screws. The top plate (162) is welded to the top outer wall of the second guide rods (161). The lifting frame (163) is installed through the base. On the outer wall of the second guide rod (161), the third spring (164) is fixedly connected between the lifting frame (163) and the top plate (162), the fixing sleeve (165) is installed through the periphery of the lifting frame (163), the universal ball (166) is rotatably connected to the bottom inner wall of the fixing sleeve (165), the rubber positioning block (167) is bonded to the bottom outer wall of the universal ball (166), and the pressure block (15) is tightly attached to the top outer wall of the lifting frame (163).

5. A computer assembly robot according to claim 1, characterized in that, The first conveyor (2) has memory stick placement frames (17) that are evenly distributed on its conveyor belt, and the second conveyor (3) has motherboard placement frames (18) that are evenly distributed on its conveyor belt.

6. A computer assembly robot according to claim 4, characterized in that, The lifting frame (163) has a first photoelectric sensor (19) for monitoring the position of the motherboard fixedly installed on one side of the inner wall. The first photoelectric sensor (19) is located above the motherboard placement frame (18). A vertical plate (20) is installed on the top outer wall of the base (1) near the first conveyor (2). A second photoelectric sensor (21) for monitoring the position of the memory module is installed on the top outer wall of the vertical plate (20).

7. A computer assembly robot according to claim 1, characterized in that, The outer wall of the back plate (4) is provided with a slide rail (22) above the reciprocating screw (6), and the reciprocating moving block (7) is slidably connected to the bottom outer wall of the slide rail (22) by a slider. A slide groove (23) is provided through the outer wall of the back plate (4), and the reciprocating moving block (7) is provided through the inner wall of the slide groove (23).

8. A computer assembly robot according to claim 1, characterized in that, The outer wall of the back plate (4) is fixedly connected to a PLC controller (24) by screws, and the PLC controller (24) is electrically connected to the first conveyor (2), the second conveyor (3), the servo motor (5), the pneumatic gripper (13), the first photoelectric sensor (19), and the second photoelectric sensor (21) via signal lines.

9. A method of using a computer assembly robot, comprising the computer assembly robot according to any one of claims 1-8, characterized in that, Includes the following steps: S1: Loading and positioning: Place the memory stick into the memory stick placement box (17) of the first conveyor (2), and place the motherboard into the motherboard placement box (18) of the second conveyor (3). After the equipment is started, the first conveyor (2) and the second conveyor (3) transport synchronously. The second photoelectric sensor (21) detects that the memory stick is in place, and the first photoelectric sensor (19) detects that the motherboard is in place. After the motherboard is in place, the conveyor stops, and the PLC controller (24) prepares to execute the assembly instructions. S2: Clamping memory sticks: The PLC controller (24) controls the pneumatic gripper (13) to precisely clamp the memory sticks in the memory stick placement frame (17) and maintain the clamping state after the clamping is completed; S3: Horizontal transfer: The servo motor (5) drives the reciprocating screw (6) to rotate, which drives the reciprocating moving block (7) to move horizontally along the slide rail (22). The trapezoidal block (9), the slide plate (11) and the pneumatic gripper (13) are transferred synchronously to send the memory stick to the top of the motherboard. S4: Insertion and Positioning: The trapezoidal block (9) contacts the wedge block (141) and moves down along its inclined surface. Under the constraint of the limiting baffle (142), the slide plate (11) drives the pneumatic gripper (13) to descend vertically. The first spring (8) and the second spring (144) buffer and dampen the shock. The pneumatic gripper (13) smoothly presses the memory stick into the motherboard slot. At the same time, the pressing block (15) squeezes the lifting frame (163) to move down along the second guide rod (161). The third spring (164) buffers the shock. The universal ball (166) adapts to the motherboard plane. The rubber positioning block (167) presses the motherboard around to complete the positioning. After the insertion is completed, each mechanism resets and enters the next assembly cycle.