Computing systems and electronic devices

Abstract

This invention relates to the field of heat dissipation, and discloses a computing system and electronic equipment, including: a housing with at least two enclosures inside, each enclosure containing an immersion medium; electrical connectors on the enclosure walls and electrical components immersed in the immersion medium inside the enclosures, the electrical components being electrically connected to the electrical connectors; a power supply module located outside the enclosures and electrically connected to the electrical connectors of each enclosure, the power supply module supplying power to the electrical components; and a fluid supply / return component located outside the enclosures and detachably connected to the enclosures, used to provide the immersion medium to the enclosures or to return the immersion medium, the power supply module and the fluid supply / return component being in thermally conductive contact. By separating the electrical components into multiple enclosures, independent maintenance is achieved without draining the fluid; the externally located power supply module and thermally coupled fluid supply / return component avoid heat accumulation, improve heat dissipation accuracy, eliminate the need for additional heat dissipation structures, simplify design, reduce costs, and enable independent operation and maintenance of the power supply and computing units, thereby improving maintenance efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more specifically to computing systems and electronic devices. Background Technology

[0002] In the field of electronic device heat dissipation, immersion liquid cooling is widely used due to its heat dissipation efficiency. Existing technologies typically integrate various electronic components of electronic devices into a sealed chamber and fill it with heat dissipation liquid to achieve overall heat dissipation.

[0003] However, when replacing or maintaining electronic components, all the coolant in the sealed chamber must be drained before the main sealing cover can be opened. The process is cumbersome, and draining and refilling the coolant takes a lot of time, reducing the maintenance efficiency and continuity of use of the equipment. Summary of the Invention

[0004] This invention provides a computing system and electronic device to solve or improve the problem of inconvenient replacement and maintenance of electronic devices in related technologies.

[0005] In a first aspect, the present invention provides a computing system, comprising: The housing has at least two boxes inside, each box being used to contain an immersion medium. The boxes have electrical connectors on their walls and electrical components immersed in the immersion medium inside, with the electrical components being electrically connected to the electrical connectors. A power supply module is located outside the enclosure and electrically connected to the electrical connector of each enclosure. The power supply module is used to supply power to the electrical components. The liquid supply and return component is located outside the housing and detachably connected to the housing. It is used to provide the housing with an immersion medium or to allow the immersion medium to flow back. The power supply module is in thermal contact with the liquid supply and return component.

[0006] In a second aspect, the present invention also provides an electronic device, including the computing system described above.

[0007] The computing system provided by this invention distributes electrical components in at least two independent enclosures. Each enclosure is independently equipped with an electrical connector and is uniformly connected to an external power supply. The supply and return fluid components are also detachably connected to the enclosures. When a single electrical component fails or needs to be replaced, only the supply and return fluid components of the corresponding enclosure need to be disassembled and sealed. There is no need to drain the immersion medium of the entire computing system. This simplifies the maintenance process, reduces the time spent draining and refilling the coolant, and improves equipment maintenance efficiency and continuity of use.

[0008] By independently placing the power supply module outside the enclosure, the heat generated by the power supply module itself can be prevented from being combined with the heat generated by the electrical components inside the enclosure. This prevents the local thermal environment inside the enclosure from deteriorating and ensures that each electrical component is always in a suitable immersion cooling condition, thus avoiding a reduction in the accuracy and efficiency of heat dissipation for the electrical components due to internal heat accumulation.

[0009] Meanwhile, the power supply module and the supply and return liquid components achieve thermal contact, and can directly achieve heat dissipation through the circulation of the immersion medium in the supply and return liquid components. There is no need to add an independent heat dissipation structure for the power supply module. This simplifies the overall structural design of the computing system, reduces the hardware cost and layout complexity of the system, and the heat dissipation efficiency of the medium circulation of the supply and return liquid components is far superior to conventional air cooling. It can quickly remove the heat generated by the power supply module, ensuring the operational stability and service life of the power supply module.

[0010] In addition, the external design of the power supply module makes its maintenance and operation independent of the electrical components inside the enclosure. When inspecting or replacing the power supply module, there is no need to contact the enclosure or the internal immersion medium, nor is there any need to interrupt the normal operation of the electrical components inside the enclosure. This further improves the maintenance flexibility and continuity of use of the entire electronic equipment. At the same time, the electrical connection layout between the power supply module and the electrical connectors of each enclosure is clearer after the power supply module is externalized, which also facilitates subsequent line maintenance, capacity expansion and other operations, improving the overall ease of operation and maintenance of the system.

[0011] The electronic device provided by the present invention incorporates the computing system provided by the present invention, and therefore incorporates all the advantages of the computing system described above. Attached Figure Description

[0012] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention; Figure 2 for Figure 1 The diagram shows the structure of the electronic device after the casing has been removed. Figure 3 This is a schematic diagram of the structure of the box provided in an embodiment of the present invention; Figure 4 for Figure 3 A structural schematic diagram of the box shown from another perspective; Figure 5 An exploded view of the housing assembly provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the internal structure of the box provided in an embodiment of the present invention; Figure 7 An exploded view of the assembly of the liquid inlet branch and the liquid return branch provided in an embodiment of the present invention; Figure 8 A schematic diagram of the installation status of the inlet branch and the return branch provided in an embodiment of the present invention; Figure 9 A schematic diagram illustrating the principle of the flow path of the immersion medium inside the box provided in an embodiment of the present invention; Figure 10 A schematic diagram illustrating the principle of liquid discharge from one outlet of the pulse regulating device provided in an embodiment of the present invention; Figure 11 for Figure 10 The schematic diagram shows the principle of liquid discharge from another outlet of the pulse regulator; Figure 12 This is a schematic diagram of the structure of the electrical connector for the housing provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of the structure of an electrical component provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of another electrical component provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of the structure of another electrical component provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of the structure of the first positioning member and the second positioning member provided in an embodiment of the present invention.

[0014] Explanation of reference numerals in the attached figures: 1. Enclosure; 101. Electrical connector; 1011. Power connector; 1012. Signal connector; 102. Media inlet; 103. Media outlet; 104. Inspection port; 2. Power supply module; 3. Fluid supply and return components; 4. Housing; 5. Liquid inlet branch; 501. Pulse regulating component; 5011. Main body; 5011a. Connecting port; 5011b. Base; 5011c. Cover; 5012. Liquid inlet chamber; 5013. Liquid outlet chamber; 5014. Liquid inlet; 5015. Liquid outlet; 5016. Guide block; 5016a. First strip structure; 5016b. Second strip structure; 5016c. End face; 5017. First flared structure; 5018. Second flared structure; 5019. Flow splitting structure; 5020. Separation structure; 502. Jet component; 503. Orifice plate; 504. Cold plate; 505. First connecting pipe; 6. Return liquid branch; 601. Liquid collecting device; 602. Second connecting pipe; 603. Isolation device; 7. Second positioning component; 8. Electrical components; 801. First heating element; 802. Second heating element; 803. Third heating element; 804. Memory; 805. Processor; 806. Acceleration module; 807. Network switching chip; 9. Mounting base; 10. First positioning element. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] In the field of electronic device heat dissipation, immersion liquid cooling is widely used due to its heat dissipation efficiency. Existing technologies typically integrate various electronic components of electronic devices into a sealed chamber and fill it with heat dissipation liquid to achieve overall heat dissipation.

[0017] However, when replacing or maintaining electronic components, all the coolant in the sealed chamber must be drained before the main sealing cover can be opened. The process is cumbersome, and draining and refilling the coolant takes a lot of time, reducing the maintenance efficiency and continuity of use of the equipment.

[0018] To address or improve the inconvenience of replacing and maintaining electronic devices in related technologies, this invention provides a computing system and an electronic device.

[0019] The following is combined Figures 1 to 16 This describes the computing system provided in the embodiments of the present invention.

[0020] Specifically, the computing system includes a casing 4, a housing 1, a power supply module 2, and a liquid supply and return component 3.

[0021] The casing 4 has at least two boxes 1 inside. For example, the casing 4 can be set as a chassis or a cabinet.

[0022] Box 1 is used to contain the immersion medium, for example, reference Figure 1 and Figure 2 The illustration shows an example with four enclosures 1. An electrical connector 101 is provided on the wall of each enclosure 1, and an electrical component 8 is located inside the enclosure 1. At least a portion of the electrical component 8 is immersed in an immersion medium, and the electrical component 8 is electrically connected to the electrical connector 101. It should be noted that the dimensions of each enclosure 1 may be the same or different, the internal structure of each enclosure 1 may be the same or different, and the electrical components 8 inside each enclosure 1 may be the same or different.

[0023] For example, the enclosure 1 has a through mounting hole in its wall, and the electrical connector 101 is installed in the mounting hole, with one end facing the inside of the enclosure 1 electrically connected to the electrical component 8. The electrical connector 101 can be snapped, glued, or screwed to the enclosure 1, and the connection between the electrical connector 101 and the wall of the mounting hole can be sealed with glue or a sealant.

[0024] The power supply module 2 is located outside the enclosure 1 and is electrically connected to the electrical connector 101 of each enclosure 1 so as to be electrically connected to the electrical components 8 inside the enclosure 1 via the electrical connector 101. The power supply module 2 is used to supply power to each electrical component 8.

[0025] The supply and return fluid component 3 is located outside the housing 1 and is detachably connected to the housing 1. The supply and return fluid component 3 is used to provide the housing 1 with an immersion medium or to allow the immersion medium to return. The power supply module 2 is in thermally conductive contact with the supply and return fluid component 3 so that the supply and return fluid component 3 can absorb the heat generated by the power supply module 2. For example, the power supply module 2 can be in direct contact with the supply and return fluid component 3, or a thermally conductive layer or component can be provided between the power supply module 2 and the supply and return fluid component 3.

[0026] In this embodiment, the electrical components 8 are distributed in at least two independent enclosures 1. Each enclosure 1 is independently equipped with an electrical connector 101 and is uniformly connected to an external power supply. The supply and return fluid component 3 is also detachably connected to the enclosure 1. When a single electrical component 8 fails or needs to be replaced, only the supply and return fluid component 3 needs to be disassembled and sealed in the corresponding enclosure 1. There is no need to drain the immersion medium of the entire computing system, which simplifies the maintenance process, reduces the time loss of draining and refilling the coolant, and improves the equipment maintenance efficiency and continuity of use.

[0027] By independently placing the power supply module 2 outside the enclosure 1, the heat generated by the power supply module 2 during operation can be avoided from being superimposed on the heat generated by the electrical components 8 inside the enclosure 1. This prevents the local thermal environment inside the enclosure 1 from deteriorating and ensures that each electrical component 8 is always in a suitable immersion heat dissipation condition, thus avoiding the reduction in the accuracy and efficiency of heat dissipation for the electrical components 8 due to the accumulation of internal heat.

[0028] Meanwhile, the power supply module 2 and the supply and return liquid component 3 achieve thermal contact, and can directly dissipate heat through the circulation of the immersion medium in the supply and return liquid component 3. There is no need to add an independent heat dissipation structure for the power supply module 2. This simplifies the overall structural design of the computing system, reduces the hardware cost and layout complexity of the system, and the heat dissipation efficiency of the medium circulation of the supply and return liquid component 3 is far superior to conventional air cooling. It can quickly remove the heat generated by the power supply module 2, ensuring the operational stability and service life of the power supply module 2.

[0029] In addition, the external design of the power supply module 2 makes its maintenance and operation independent of the electrical components 8 inside the enclosure 1. When repairing or replacing the power supply module 2, there is no need to contact the enclosure 1 and the internal immersion medium, nor is there any need to interrupt the normal operation of the electrical components 8 inside the enclosure 1. This further improves the maintenance flexibility and continuity of use of the entire electronic equipment. At the same time, the electrical connection layout between the power supply module 2 and the electrical connectors 101 of each enclosure 1 is clearer after the power supply module 2 is externalized, which also facilitates subsequent line repair, capacity expansion and other operations, improving the overall operation and maintenance convenience of the system.

[0030] In addition, the detachable connection design between the housing 1 and the supply and return fluid components 3 further enhances the flexibility of system assembly, commissioning and maintenance.

[0031] In some embodiments of the present invention, the liquid supply and return component 3 is provided with an inlet channel and a return channel. For example, the inlet channel is used to communicate with the outlet of the cooling unit immersing the medium, and the return channel is used to communicate with the inlet of the cooling unit.

[0032] Furthermore, each tank 1 is connected to both the liquid inlet channel and the liquid return channel, that is, the tank 1 is connected in parallel between the liquid inlet channel and the liquid return channel. The liquid inlet channel is used to provide the immersion medium to the tank 1, and the liquid return channel allows the immersion medium in the tank 1 to flow back.

[0033] In this embodiment, the liquid supply and return component 3 has independent inlet and return channels. Each box 1 is simultaneously connected to both the inlet and return channels, so that all boxes 1 are arranged in parallel between the inlet and return channels. The inlet channel can supply the immersion medium into each box 1, while the return channel can discharge the immersion medium in each box 1 back, so as to realize the independent circulation and replenishment of the immersion medium in each box 1, ensuring that each box 1 can independently and uniformly obtain the immersion medium from the inlet channel.

[0034] Meanwhile, the heat medium generated by each can also flow back independently through the return liquid channel, avoiding problems such as uneven flow distribution, pressure drop accumulation, or insufficient terminal cooling.

[0035] Secondly, since each chamber 1 operates independently in the flow path, when maintenance is required on a particular chamber 1, it is only necessary to disconnect that chamber 1 from the inlet and outlet liquid channels. This allows for drainage, opening, and replacement operations without affecting the normal liquid supply and heat dissipation of other chambers 1. The remaining chambers 1 can continue to operate stably while submerged in the immersion medium, improving system availability and maintenance efficiency.

[0036] In some embodiments provided by the present invention, the side of the housing 1 where the electrical connector 101 is located is also provided with a medium inlet 102 and a medium outlet 103.

[0037] Specifically, both the medium inlet 102 and the medium outlet 103 are connected to the interior of the housing 1 and to the liquid supply and return component 3. For example, the medium inlet 102 is plugged into the liquid inlet channel, and the medium outlet 103 is plugged into the liquid return channel. For example, the medium inlet 102 is plugged into the liquid inlet channel via a quick-connect fitting, and the medium outlet 103 is plugged into the liquid return channel via a quick-connect fitting.

[0038] Electrical connector 101 is connected to power supply module 2, for example, electrical connector 101 and power supply module 2 are electrically connected by plugging.

[0039] In this embodiment, the electrical connector 101, the medium inlet 102, and the medium outlet 103 are centrally located on the same side of the enclosure 1 and all adopt a plug-in structure. When it is necessary to replace or maintain the electrical component 8 in a certain enclosure 1, the maintenance personnel only need to pull out the enclosure 1 to complete the power supply disconnection and the disconnection of the inlet and outlet of the immersion medium in one go. There is no need to deal with the electrical lines and liquid pipelines separately, nor is it necessary to operate back and forth on different sides of the enclosure 1.

[0040] During reinstallation, the power connection and immersion medium circulation path can be established simultaneously through a single alignment and push-in action. This not only shortens maintenance time but also reduces the risk of human error caused by numerous operating steps, such as missing power supply, leakage due to valves not being closed, or reversed pipeline connections.

[0041] refer to Figure 1 As shown, in some embodiments provided by the present invention, the computing system further includes a housing 4.

[0042] Specifically, the housing 4 has an opening for the entry and exit of the enclosure 1, and at least two enclosures 1 are arranged inside the housing 4 along a direction intersecting the axis of the opening. The power supply module 2 and the fluid supply / return component 3 are both located inside the housing 4 and opposite the opening. For example, the opening faces the front of the housing 4, and the enclosures 1 are arranged side-by-side or stacked vertically.

[0043] In this embodiment, the housing 1 is arranged along a direction intersecting with the opening axis, so that each housing 1 can be independently and linearly pulled out or pushed in from the front of the housing 4 without disassembling adjacent modules or other structural components, thereby improving the ease of operation and providing a physical basis for the rapid replacement or maintenance of a single housing 1.

[0044] When the housing 1 is pushed into the housing 4 through the opening, its electrical connector 101 facing the inside of the housing 4 connects to the power supply module 2 fixed inside the housing 4. At the same time, its medium inlet 102 and medium outlet 103 also connect to the corresponding interfaces on the supply and return liquid components 3 to complete the medium passage connection. Only a straight pushing action in one direction is needed to simultaneously establish power supply, signal communication, and the inlet and return channels for the immersion medium, without the need for additional wiring, piping, or manual locking operations.

[0045] Similarly, when replacing electrical component 8, maintenance personnel only need to pull out the faulty enclosure 1 along the original path. The entire process requires no tools, no multi-faceted operations, and no need to drain the immersion medium of the entire system, which can shorten the average repair time and improve the availability and service continuity of the system.

[0046] refer to Figure 12 As shown, in some embodiments provided by the present invention, at least one of the liquid supply / return component 3 and the power supply module 2 is provided with a first positioning member 10, and a second positioning member 7 is provided at a position opposite to the first positioning member 10 in the housing 1. The first positioning member 10 and the second positioning member 7 form a limit in the insertion / removal direction perpendicular to the housing 1. For example, the first positioning member 10 is a positioning hole, and the second positioning member 7 is a positioning post. Of course, the reverse is also possible, with the positioning post inserted into the positioning hole.

[0047] In this embodiment, since the electrical connector 101 typically contains high-density pins, and quick-connect fittings have high concentricity requirements, even slight misalignment can lead to insertion failure, seal failure, or even interface damage. By setting a positioning post and positioning hole in a direction perpendicular to the insertion / removal direction (i.e., lateral), the lateral sway or angular deviation of the housing 1 during insertion can be effectively constrained, guiding it to slide in along the correct trajectory and ensuring reliable insertion.

[0048] Secondly, the cooperation between the first positioning element 10 and the second positioning element 7 can also prevent the housing 1 from undergoing slight displacement due to vibration, thermal expansion and contraction, or fluctuations in medium pressure during operation. Even if the housing 4 is in a vibration environment such as during transportation, the rigid cooperation between the positioning elements can fix the housing 1 in the designed position, avoiding increased contact resistance, signal interruption, or leakage due to misalignment of the connector caused by loose electrical connections.

[0049] refer to Figure 12 As shown, in some embodiments provided by the present invention, an electrical connector 101 is disposed between a medium inlet 102 and a medium outlet 103.

[0050] Electrical connector 101 typically has a certain contact resistance, which may cause localized temperature rise under certain high-current operating conditions. In this embodiment, placing electrical connector 101 between the medium inlet 102 and the medium outlet 103 means that this area is always surrounded or adjacent to the flowing immersion medium. This facilitates heat dissipation of electrical connector 101 through heat conduction from the wall of housing 1 or the surrounding low-temperature environment, reducing the risk of temperature rise and improving the reliability and safety of long-term power supply.

[0051] refer to Figure 12 As shown, in some embodiments provided by the present invention, the electrical connector 101 is provided with second positioning members 7 on both sides.

[0052] In this embodiment, after the second positioning members 7 on both sides cooperate with the corresponding first positioning members 10 inside the housing 4, the freedom of the housing 1 in the horizontal direction can be effectively constrained, forcing it to advance along the ideal axis, ensuring that the electrical connector 101 and the power supply module 2 are accurately and smoothly connected.

[0053] Traditional servers typically integrate the 805 processor, graphics card, network card, etc., onto the same motherboard, which leads to mutual constraints in heat dissipation, power supply, and maintenance strategies.

[0054] This application divides modules according to function and packages them independently, realizing the decoupled deployment and flexible configuration of heterogeneous hardware, and the modular isolation can improve the convenience of maintenance.

[0055] Specifically, refer to Figures 13 to 15 As shown, in some embodiments provided by the present invention, the electrical component 8 is at least one of a computing module, an acceleration module, or a switching module. That is, the server node includes a computing module, an acceleration module, or a switching module, and the computing module, acceleration module, and switching module are disposed in corresponding enclosures 1.

[0056] Optionally, refer to Figures 13 to 15 As shown, the computing module includes a circuit board and a processor 805 and memory 804 disposed on the circuit board. The acceleration module includes a circuit board and an acceleration module 806 disposed on the circuit board, the acceleration module 806 being an AI acceleration chip. The switching module includes a circuit board and a network switching chip 807 disposed on the circuit board. Connectors can be integrated on each circuit board for electrical connection with electrical connectors 101 on the enclosure wall.

[0057] In this embodiment, the three high-power, high-heat-generating functional units—the computing module, the acceleration module, and the switching module—are each placed in an independent immersion enclosure 1, allowing for dynamic combination of module types and quantities according to actual business load requirements.

[0058] For example, in AI training scenarios, increase the proportion of acceleration modules, such as setting the number of acceleration modules to two or more. Alternatively, in data forwarding scenarios, strengthen the configuration of switching modules to improve resource utilization and system adaptability.

[0059] Furthermore, the computing module is sensitive to temperature fluctuations, the acceleration module may experience extremely high instantaneous power consumption, and the network switching chip 807 requires long-term stable operation. By separating these components, the flow rate of the immersion medium in the enclosure 1 can be optimized for each type of electrical component 8, avoiding energy waste or localized overheating and improving overall heat dissipation efficiency and energy efficiency ratio. For example, a flow regulating valve can be installed upstream of each medium inlet 102 to independently regulate the flow rate of the immersion medium in each enclosure 1.

[0060] In some embodiments provided by the present invention, the electrical connector 101 includes a power connector 1011 and a signal connector 1012.

[0061] The power connector 1011 and the signal connector 1012 are both electrically connected to the electrical components 8, and the power supply module 2 is electrically connected to the power connector 1011 and is used to supply power to each electrical component 8.

[0062] Furthermore, the computing system also includes a communication module. The communication module is electrically connected to the signal connector 1012 and is used to enable communication between the electrical components 8. The communication module also has thermal contact with the fluid supply / return component 3.

[0063] In this embodiment, by setting the power connector 1011 and the signal connector 1012 independently, electromagnetic interference between the power line and the signal line is avoided, the stability and accuracy of signal transmission are improved, and the smooth communication between the various electrical components is ensured.

[0064] In addition, the power connector 1011 and the signal connector 1012 are set independently, which makes the maintenance and troubleshooting of power supply and communication more targeted. For example, if the power supply is faulty, only the power supply and the power connector 1011 link need to be checked, and if the communication is faulty, only the communication module and the signal connector 1012 link need to be checked. There is no need to check mixed lines, which can reduce the difficulty of fault location and repair and improve maintenance efficiency.

[0065] In addition, the communication module and the supply and return liquid component 3 are in thermally conductive contact, which allows the supply and return liquid component 3 to carry away the heat of the communication module and avoid the problem of the communication module overheating.

[0066] In some embodiments provided by the present invention, the computing system further includes a housing, in which the power supply module 2 is installed and in thermal contact with the housing. For example, the power supply module 2 may be in direct contact with the housing, or it may be in thermal contact with the housing through a thermally conductive layer or a thermally conductive component. The housing is in thermal contact with the fluid supply and return component 3. Optionally, a first positioning element 10 is provided on the housing.

[0067] Furthermore, the communication module is also installed inside the housing, and the communication module is in thermal contact with the housing. For example, the communication module is in direct contact with the housing, or it can be in thermal contact with the housing through a thermally conductive layer or component.

[0068] In this embodiment, the outer casing provides physical protection for the power supply module 2 and the communication module, reducing the erosion of the power supply module 2 and the communication module by collisions, dust, and moisture, thereby improving the structural protection and service life of the power supply module 2 and the communication module. Furthermore, the heat generated by the power supply module 2 and the communication module can be transferred to the supply and return fluid component 3 through the outer casing. The heat is quickly dissipated by the immersion medium circulating within the supply and return fluid component 3, achieving efficient heat dissipation for the power supply module 2 and the communication module and preventing the accumulation of their own heat from affecting operational stability.

[0069] Furthermore, the supply and return liquid component 3 contains a low-temperature immersion medium, the temperature of which is much lower than the ambient temperature, providing excellent heat dissipation. By making the supply and return liquid component 3 thermally conductively contact the outer casing, it is equivalent to transforming the entire supply and return liquid component 3 into a heat sink, eliminating the need for additional fans, heat sinks, or independent liquid cooling plates 504. This simplifies the structure, reduces the number of components and potential failure points, and saves space in the casing 4, which is beneficial for high-density deployment.

[0070] In some embodiments provided by the present invention, the electrical component 8 includes a first heating element 801 and a second heating element 802. The power of the first heating element 801 is higher than that of the second heating element 802. The immersion medium flows through the first heating element 801 first and then through the second heating element 802. For example, the first heating element 801 includes, but is not limited to, a chip, and the second heating element 802 includes, but is not limited to, a memory 804.

[0071] In this embodiment, the high-power first heating element 801 can preferentially contact the cold immersion medium with a lower temperature, maximizing the initial heat dissipation capacity of the medium and quickly removing the large amount of heat generated by the high-power device. This avoids the problem of sudden temperature rise and heat accumulation in the high-power heating element due to untimely heat dissipation, ensuring its operational stability. Meanwhile, the low-power second heating element 802 only needs to contact the medium after heat exchange with the first heating element 801 to meet its heat dissipation requirements, and there will be no insufficient heat dissipation.

[0072] This sequential flow method allows the immersion medium to form an orderly heat exchange path within the housing 1, making the temperature field of the entire electrical component 8 more uniform, avoiding localized heat dissipation dead zones caused by turbulent medium flow, and improving the overall heat dissipation efficiency within the housing 1.

[0073] In some embodiments provided by the present invention, the housing 1 is provided with a liquid inlet branch 5.

[0074] Specifically, the inlet of the liquid inlet branch 5 is connected to the liquid supply and return component 3, that is, the inlet of the liquid inlet branch 5 is connected to the liquid supply and return component 3 through the medium inlet 102. The outlet of the liquid inlet branch 5 faces the first heating element 801, so as to guide the immersion medium to the first heating element 801, so that the immersion medium flows along the liquid inlet branch 5 to the first heating element 801 and exchanges heat with the first heating element 801, and then enters the housing 1 to immerse other heating elements.

[0075] The immersion medium is guided to the first heating element 801 through the liquid inlet branch 5, so that the high-power first heating element 801 can preferentially contact the cold immersion medium with a lower temperature, maximizing the use of the initial heat dissipation capacity of the medium, and then the immersion medium immerses and dissipates heat to the second heating element 802, making the temperature field of the entire electrical component 8 more uniform.

[0076] Furthermore, the liquid inlet branch 5 includes a pulse regulating element 501. The pulse regulating element 501 is disposed on the immersion medium conveying path of the liquid inlet branch 5 and is used to make the immersion medium form a pulse flow.

[0077] In this embodiment, the pulsed flow, through periodically varying velocity or pressure, creates dynamic disturbances on the surface of the heating element, effectively disrupting the thermal boundary layer, reducing thermal resistance, and thus improving the local convective heat transfer coefficient. Especially under sudden high-load conditions, the pulsed flow can quickly respond to surges in heat load, promptly removing instantaneously accumulated heat, preventing a sudden rise in chip temperature, and ensuring stable performance.

[0078] In addition, the pressure wave or medium oscillation generated by the pulse flow can promote the mixing and circulation of the medium inside the housing 1, reduce dead zones or heat retention areas, and make the temperature of the medium flowing through the second heating element 802 and other low-power devices more uniform, avoiding local overheating or uneven cooling, thereby improving the overall thermal stability of the board.

[0079] In some embodiments provided by the present invention, the pulse regulating element 501 can be configured as a solenoid valve, and the immersion medium can be formed into a pulse flow by periodically controlling the opening degree of the solenoid valve.

[0080] In this embodiment, by sending an electrical signal through an external controller, the switching frequency, opening duration, and opening size of the solenoid valve can be precisely adjusted, thereby flexibly controlling the frequency, amplitude, and waveform of the pulse flow. This allows the cooling intensity to be dynamically adjusted according to the real-time heat load of the electrical component 8, achieving adaptation between the pulse flow state and the heat dissipation requirements of the heat-generating component.

[0081] In some embodiments provided by the present invention, the pulse regulating member 501 has a liquid inlet 5014 and two liquid outlets 5015.

[0082] Specifically, the two liquid outlets 5015 are respectively oriented towards the corresponding first heating element 801. The pulse regulating element 501 is provided with an regulating structure, which is used to make the immersion medium entering through the liquid inlet 5014 flow alternately to the two liquid outlets 5015. That is, the regulating structure makes the two liquid outlets 5015 alternately discharge liquid, so that both liquid outlets 5015 form a pulse flow.

[0083] In this embodiment, the two liquid outlets 5015 are respectively oriented towards the corresponding first heating element 801. By adjusting the structure, a pulse flow is formed to alternately impact the heat sources on both sides. It is not necessary to configure a separate pulse adjustment structure for each first heating element 801, which can save layout space in the box 1 and improve space utilization. At the same time, it can realize the alternating enhanced cooling of multiple high heat flux density areas, and also promote the overall mixing of the immersion medium in the box 1 through periodic disturbance, avoiding local heat accumulation.

[0084] For example, the regulating structure could be a solenoid valve core, thereby allowing the two outlet ports 5015 to alternately connect with the inlet port 5014. Of course, the regulating structure is not limited to a solenoid valve core; see reference... Figures 8 to 11 As shown, in some embodiments provided by the present invention, the pulse regulating member 501 includes a main body 5011 and a chamber, and the regulating structure includes two flow guiding structures.

[0085] Specifically, the chamber is located within the main body 5011, and the chamber has a liquid inlet 5014 and two liquid outlets 5015. The liquid inlet 5014 is connected to the liquid supply and return component 3. The two liquid outlets 5015 are distributed on both sides of the axis of the liquid inlet 5014, and the two liquid outlets 5015 are respectively facing the corresponding first heating element 801.

[0086] Two flow guiding structures are located in the chamber and are distributed on both sides of the axis of the inlet 5014. The flow guiding structures are used to direct a portion of the immersion medium entering through the inlet 5014 to the outlet 5015 on the opposite side of the axis, while the other portion flows back to the outlet 5015 and flows to the opposite side of the axis of the inlet 5014.

[0087] The following reference Figure 10 and Figure 11 This paper introduces the principle of alternating liquid discharge from two outlets 5015. The pulse regulating element 501 provided in this embodiment is based on the Coanda Effect, which refers to the phenomenon that fluid tends to adhere to the surface of a solid and flow along its contour when flowing.

[0088] refer to Figure 10 When the immersion medium enters the chamber through the inlet 5014, it will naturally adhere to the wall of the guide structure and flow stably. Assuming that the immersion medium flows along the wall of the guide structure on the left, under the guiding effect of the guide structure, part of the immersion medium flows to the outlet 5015 on the opposite side of the axis of the inlet 5014, that is, it is discharged from the outlet 5015 on the right side, while the other part of the immersion medium flows back to the outlet 5015 and flows to the opposite side of the axis of the inlet 5014, that is, it flows to the right side of the inlet 5014, continuously disturbing the incoming flow at the inlet 5014.

[0089] When the disturbance accumulates to a critical point, the immersion medium will detach from the wall of the left guide structure and switch to the wall of the right guide structure under the action of the Coanda effect. The right guide structure will guide a part of the immersion medium to the outlet 5015 on the left and guide another part of the immersion medium to the inlet 5014.

[0090] By repeating the above process, the two outlets 5015 can alternately discharge liquid, so that both outlets 5015 form a continuous and stable periodic pulse flow.

[0091] In this embodiment, the pulse regulator 501 can achieve pulse flow without external power or control signals.

[0092] Specifically, utilizing the inherent instability of the medium within the chamber and the Coanda effect, it can spontaneously enter an oscillating state under constant inlet pressure. When the immersion medium enters the chamber through inlet 5014, due to structural asymmetry caused by minor disturbances or processing errors, it preferentially adheres to the wall of one side of the guide structure. Under the guidance, the main flow is directed to the outlet 5015 on the opposite side for discharge, while some backflow disturbs the inlet area. As the disturbance accumulates, the flow attachment point becomes unstable, the flow stream switches to the other side of the guide structure, and the outlet direction reverses accordingly. This cycle repeats, forming a self-sustaining periodic pulse output.

[0093] Furthermore, the two liquid outlets 5015 are respectively directed towards the corresponding first heating element 801, and the pulsed flow alternately impacts the heat sources on both sides. This eliminates the need for a separate pulse adjustment structure for each first heating element 801, saving layout space within the housing 1 and improving space utilization. Simultaneously, it achieves alternating enhanced cooling of multiple high heat flux density areas and promotes overall mixing of the immersion medium within the housing 1 through periodic disturbance, preventing localized heat accumulation.

[0094] refer to Figures 10 to 11 As shown, in some embodiments provided by the present invention, the flow guiding structure includes a partition structure 5020 and a flow guiding block 5016. The partition structure 5020 can be configured as a partition block.

[0095] Two partition structures 5020 are respectively located on both sides of the axis of the inlet 5014, and together they divide the chamber into an inlet chamber 5012 and an outlet chamber 5013. The inlet 5014 communicates with the inlet chamber 5012, and the outlet 5015 communicates with the outlet chamber 5013. There is a gap between the two partition structures 5020, and the gap between the two partition structures 5020 forms a connecting port 5011a. The connecting port 5011a is arranged opposite to the inlet 5014, for example, the connecting port 5011a and the inlet 5014 are coaxial.

[0096] Two guide blocks 5016 are disposed in the liquid inlet chamber 5012, and the two guide blocks 5016 are respectively disposed on both sides of the axis of the liquid inlet 5014. There is a gap between the guide blocks 5016 and the inner wall of the liquid inlet chamber 5012. There is also a gap between the guide blocks 5016 and the partition structure 5020.

[0097] refer to Figures 10 to 11As shown, when the immersion medium enters the chamber from the inlet 5014, it naturally adheres to the wall of the guide block 5016 and flows stably. Assuming the immersion medium flows along the wall of the guide block 5016 on the left, under the guiding action of the guide block 5016, a portion of the immersion medium flows through the connecting port 5011a to the outlet 5015 on the opposite side of the axis, i.e., the outlet 5015 on the right, and is discharged. Another portion of the immersion medium, under the guiding action of the partition structure 5020 and the guide block 5016, flows back to the outlet 5015 along the gap between the guide block 5016 and the inner wall of the chamber, and flows towards the opposite side of the axis of the inlet 5014, i.e., towards the right side of the inlet 5014, continuously disturbing the incoming flow at the inlet 5014.

[0098] When the disturbance accumulates to a critical point, the immersion medium will detach from the wall of the left guide block 5016 and switch to the wall of the right guide block 5016 under the action of the Coanda effect. The right guide block 5016 and the partition structure 5020 guide a part of the immersion medium to the outlet 5015 on the left and guide another part of the immersion medium to the inlet 5014.

[0099] In this embodiment, the gap between the guide block 5016 and the inner wall of the chamber and the partition structure 5020 provides a controllable path for the backflow, ensuring that the disturbance acts continuously and directionally on the inlet 5014. The entire pulse generation process relies entirely on the dynamic characteristics of the medium itself, without the need for solenoid valves, motors or sensors, thus eliminating the risk of aging, corrosion or failure of electronic control components in the immersion environment.

[0100] refer to Figure 7 As shown, in some embodiments provided by the present invention, the main body 5011 includes a base 5011b and a cover 5011c. The chamber, inlet 5014, outlet 5015, and flow guiding structure are all disposed on the base 5011b. The cover 5011c is connected to the base 5011b and seals the chamber. For example, the cover 5011c is bonded, welded, or screwed to the base 5011b.

[0101] In this embodiment, the main functional structure is concentrated in the base 5011b, making its upper surface open to facilitate the processing of geometric features such as the chamber and the flow guiding structure using processes such as milling, laser cutting, or injection molding. The cover 5011c, as a planar component, is easier to manufacture. The combination of the two forms a complete sealed chamber, which can balance structural complexity and process feasibility.

[0102] refer to Figures 10 to 11 As shown, in some embodiments provided by the present invention, the flow guide block 5016 includes a first strip structure 5016a and a second strip structure 5016b.

[0103] The first strip structure 5016a extends along the axis of the inlet 5014, for example, the first strip structure 5016a is parallel to the axis of the inlet 5014. Correspondingly, the two first strip structures 5016a of the two guide blocks 5016 are spaced apart on both sides of the axis of the inlet 5014. The end of the first strip structure 5016a facing away from the inlet 5014 is opposite to the partition structure 5020 and has a gap.

[0104] The second strip structure 5016b is connected to the end of the first strip structure 5016a near the inlet 5014 and extends towards the axis of the inlet 5014, that is, the second strip structure 5016b extends towards the side of the first strip structure 5016a near the axis of the inlet 5014. For example, the second strip structure 5016b is perpendicular to the first strip structure 5016a. Accordingly, the two second strip structures 5016b of the two guide blocks 5016 are spaced apart on both sides of the axis of the inlet 5014.

[0105] In this embodiment, the first strip structure 5016a extends along the axis of the inlet 5014, providing a continuous adhesion wall along the axial direction for the immersion medium entering from the inlet 5014, ensuring stable adhesion during medium flow, laying the foundation for the realization of the Coanda effect, avoiding irregular diffusion of the medium, and ensuring the initial stability of pulse flow generation.

[0106] One end of the first strip structure 5016a facing away from the liquid inlet 5014 is opposite to the partition structure 5020 and has a gap, so that the immersion medium can flow along the first strip structure 5016a to the side wall of the partition structure 5020 near the liquid inlet chamber 5012. Under the guiding effect of the partition structure 5020, part of the immersion medium enters the corresponding liquid outlet 5015 through the connecting port 5011a, and the other part of the immersion medium enters the space between the first strip structure 5016a and the inner wall of the liquid inlet chamber 5012 for backflow.

[0107] In addition, the second strip structure 5016b extends along the axis of the inlet 5014 and is connected to the proximal end of the inlet 5014. It can provide initial guidance and restriction for the incoming flow at the inlet 5014, allowing the medium to accurately adhere to the wall of the guide block 5016 as soon as it enters the inlet chamber 5012. At the same time, it shortens the initial distance of the medium adhering to the wall and improves the sensitivity of flow state switching.

[0108] Simultaneously, the second strip structure 5016b extends towards the inlet 5014, allowing it to guide the returning immersion medium to the central region of the inlet 5014 and continuously apply lateral disturbance to the opposite side. As the disturbance accumulates, it eventually causes the main stream to detach from the original attachment surface, achieving a switch to the other side.

[0109] refer to Figures 10 to 11As shown, in some embodiments provided by the present invention, the end face 5016c of the second strip structure 5016b is inclined away from the first strip structure 5016a, and along the direction from the liquid inlet chamber 5012 to the liquid outlet chamber 5013, the end face 5016c gradually tilts away from the axis of the liquid inlet 5014.

[0110] In this embodiment, the inclined end face 5016c forms a directional guiding effect on the incoming flow of the liquid inlet 5014 through its own contour, causing the immersion medium to deflect towards the wall of the first strip structure 5016a on the same side. This ensures that the immersion medium can quickly and stably adhere to the wall of the first strip structure 5016a after entering the liquid inlet cavity 5012, avoiding the dispersion and irregular diffusion of the incoming flow, and better ensuring the effective triggering of the Coanda effect.

[0111] refer to Figures 10 to 11 As shown, in some embodiments provided by the present invention, the pulse adjustment member 501 further includes a first flared structure 5017.

[0112] Specifically, the first flared structure 5017 is located at one end of the connecting port 5011a near the liquid inlet chamber 5012, and along the direction from the liquid inlet chamber 5012 to the liquid outlet chamber 5013, the sidewalls of the first flared structure 5017 on both sides of the axis of the liquid inlet 5014 are close to each other.

[0113] In this embodiment, the sidewall of the first flared structure 5017 is inclined, which can gather and guide the medium flowing along the sidewall of the partition structure 5020 to the connecting port 5011a, causing the medium to converge and flow towards the outlet 5015 on the opposite side of the axis, avoiding the medium from dispersing and flowing back at the connecting port 5011a, increasing the effective medium flow rate to the outlet 5015, and ensuring the directional conveying effect to the first heating element 801.

[0114] For example, refer to Figure 10 As shown, the medium from the left is guided by the first flared structure 5017 and is directed more concentratedly and forcefully toward the liquid outlet 5015 on the right, rather than traveling straight or scattering along the axis of the connecting port 5011a.

[0115] At the same time, the guiding effect of the first flared structure 5017 and the separation structure 5020 is superimposed. The separation structure 5020 guides the medium to initially flow to the connecting port 5011a, and the first flared structure 5017 further precisely calibrates the flow direction of the medium, allowing the medium to smoothly enter the liquid outlet chamber 5013 along the designed trajectory and flow to the liquid outlet 5015 on the opposite side.

[0116] refer to Figures 10 to 11 As shown, in some embodiments provided by the present invention, the pulse adjustment member 501 further includes a second flared structure 5018.

[0117] Specifically, the second flared structure 5018 is located at one end of the connecting port 5011a near the liquid outlet chamber 5013, and along the direction from the liquid inlet chamber 5012 to the liquid outlet chamber 5013, the side walls of the second flared structure 5018 on both sides of the axis are far apart from each other.

[0118] In this embodiment, the first flaring structure 5017 first guides the medium to converge towards the connecting port 5011a and initially point towards the opposite liquid outlet 5015. The second flaring structure 5018 guides the medium a second time through the side wall on the opposite side, further calibrating the flow trajectory of the medium and preventing the medium from deflecting or dispersing at the junction of the connecting port 5011a and the liquid outlet 5013. This ensures that the medium flows accurately to the liquid outlet 5015 on the opposite side of the axis, guaranteeing the directional flow effect on the first heating element 801.

[0119] For example, refer to Figure 10 As shown, the medium from the left first contacts the left wall of the first flared structure 5017. This wall compresses and initially deflects the stream toward the central axis, causing it to begin moving toward the right outlet 5015.

[0120] Subsequently, the stream continues forward and impacts the wall on the right side of the second flared structure 5018. Although the wall expands outward as a whole, the medium adheres to the opposite wall under the influence of the Coanda effect and is further pushed towards the right outlet 5015 along its contour.

[0121] refer to Figures 10 to 11 As shown, in some embodiments provided by the present invention, the pulse regulating member 501 further includes a shunt structure 5019. For example, the shunt structure 5019 is configured as a shunt block.

[0122] Specifically, the diversion structure 5019 is located on the inner wall of the liquid outlet chamber 5013 and is opposite to the connecting port 5011a. Along the direction from the liquid outlet chamber 5013 to the liquid inlet chamber 5012, the side walls of the diversion structure 5019 on both sides of the axis of the liquid inlet 5014 are close to each other.

[0123] In this embodiment, because the sidewalls of the diversion structure 5019 converge towards the center on both sides of the axis, and its tip is located on the axis of the inlet 5014, the entire outlet chamber 5013 is physically divided into two independent flow channels, left and right. If the medium comes from the left guide path, is guided by the two-stage flaring structure and then shot to the right, it impacts the right slope of the diversion structure 5019 and is guided into the right outlet 5015. The reverse is also true.

[0124] This spatial separation mechanism, with the axis as the boundary, can prevent the fluids on the left and right sides from mixing or interfering in the liquid outlet chamber 5013, ensuring that each pulse corresponds to a single liquid outlet 5015, thus guaranteeing the independence and accuracy of dual heat source cooling.

[0125] In some embodiments provided by the present invention, the liquid inlet branch 5 further includes a jetting element 502 and an orifice plate 503.

[0126] The jetting component 502 has a cavity.

[0127] An orifice plate 503 is disposed in the cavity, dividing the cavity into a connecting cavity and a jet cavity. The connecting cavity is located downstream of the pulse regulating member 501 and communicates with the liquid outlet 5015 of the pulse regulating member 501. The jet cavity faces the first heating element 801. The orifice plate 503 is provided with multiple through-holes.

[0128] In this embodiment, after the pulse flow output by the pulse regulating component 501 enters the communicating cavity, it is limited and pressurized by multiple injection holes of the orifice plate 503 to form a high-speed jet. The periodic impact of the pulse combined with the strong scouring effect of the high-speed jet can more thoroughly break the thermal boundary layer on the surface of the first heating element 801, reduce the heat transfer thermal resistance, and significantly improve the efficiency of heat transfer from the heating element to the medium.

[0129] In addition, the multiple injection holes on the orifice plate 503 can disperse the pulse jet into multiple jets and spray them evenly onto the heating surface, avoiding problems such as local scouring and heat exchange dead zones. This ensures that the core heating area of ​​the heating element can be covered by the high-speed pulse medium, achieving overall uniform heat exchange and avoiding excessively high local temperatures.

[0130] In some embodiments provided by the present invention, a cold plate 504 is also provided inside the housing 1.

[0131] Specifically, a cold plate 504 is disposed between the jet cavity and the first heating element 801, and fins are provided on the surface facing the jet cavity. The surface of the cold plate 504 facing away from the jet cavity is used for thermally conductive contact with the first heating element 801. Optionally, an outlet is provided on the jet cavity so that the medium flowing through the cold plate 504 can flow out from the outlet to immerse and dissipate heat to other heating elements. The jet hole faces the gap between the fins.

[0132] In this embodiment, the jet in the jet cavity flows through the fins of the cold plate 504, thereby dissipating heat from the cold plate 504. The cold plate 504 is in direct thermal contact with the first heating element 801, achieving efficient heat conduction; while the fins on the surface of the cold plate 504 increase the heat exchange area between the cold plate 504 and the pulsed jet, and with the impact and scouring of the high-speed pulsed jet, the heat on the cold plate 504 can be quickly transferred to the immersion medium.

[0133] In addition, the multiple jets of the jetting component 502 directly impact the fin gaps, and combined with the periodic disturbance of the pulsed flow, can effectively break the thermal boundary layer on the fin surface, while allowing the medium to form turbulence between the fins, improving the convective heat transfer effect, and further enhancing the heat transfer speed and efficiency.

[0134] In addition, the cold plate 504, as a heat-conducting intermediate component, physically isolates the first heating element 801 from the jet medium, preventing the high-speed jet from directly impacting the heating element body and causing component vibration and wear, thus providing a protective effect for the heating element and extending its service life.

[0135] refer to Figures 6 to 7 As shown, both sides of the pulse regulating member 501 are provided with jetting members 502, and each jetting member 502 can be connected to the main body 5011 of the pulse regulating member 501. For example, the jetting member 502 is bonded, welded, screwed, or snapped to the main body 5011. Furthermore, the communicating cavity of each jetting member 502 is connected to the corresponding liquid outlet 5015.

[0136] In this embodiment, the alternating pulse streams from the liquid outlets 5015 on both sides of the pulse regulator 501 are respectively connected to the jet component 502 on the same side, which can simultaneously deliver high-speed pulse jets to the two first heating elements 801 inside the housing 1, realizing simultaneous directional and precise heat dissipation of the two high-power devices. There is no need to configure a separate pulse regulator and jet structure for each heating element, which can simplify the internal layout of the housing 1 and save installation space.

[0137] In some embodiments provided by the present invention, the liquid inlet branch 5 further includes a first connecting pipe 505.

[0138] The first connecting pipe 505 connects the supply and return liquid component 3 and the pulse regulating component 501. Specifically, the first connecting pipe 505 connects the medium inlet 102 of the housing 1 and the liquid inlet 5014 of the pulse regulating component 501.

[0139] In this embodiment, the medium inlet 102 is connected to the liquid inlet 5014 of the pulse regulating component 501 through the first connecting pipe 505. The installation position of the pulse regulating component 501 can be flexibly adjusted according to the actual layout of the heating element, cold plate 504 and jet component 502 in the housing 1, avoiding spatial interference from other components in the housing 1 and improving the integration and adaptability of each component of the liquid inlet branch 5 in the housing 1.

[0140] In some embodiments provided by the present invention, the housing 1 is also provided with a return liquid branch 6.

[0141] Specifically, the outlet of the return liquid branch 6 is connected to the supply and return liquid component 3, that is, the outlet of the return liquid branch 6 is connected to the medium outlet 103 of the housing 1. The inlet of the return liquid branch 6 is spaced apart on the side of the first heating element 801 away from the supply and return liquid component 3.

[0142] The second heating element 802 is located between the first heating element 801 and the inlet of the return liquid branch 6, so that after the immersion medium flows through the first heating element 801, it immerses the second heating element 802 and enters the inlet of the return liquid branch 6.

[0143] In this embodiment of the invention, a return liquid branch 6 is provided inside the housing 1, the outlet of which is connected to the supply and return liquid component 3, while the inlet is arranged on the side of the first heating element 801 away from the supply and return liquid component 3. At the same time, the second heating element 802 is placed between the first heating element 801 and the inlet of the return liquid branch 6, thereby forming a clear and orderly medium flow path.

[0144] Specifically, the immersion medium enters from the inlet branch 5, firstly to enhance the cooling of the high-power first heating element 801, and then flows naturally to the second heating element 802 located downstream. After completing the immersion cooling, it finally flows into the return branch 6 through the inlet of the return branch 6 and returns to the supply and return component 3.

[0145] This configuration allows the immersion medium to be actively guided to be used in a "high-to-low" order based on the difference in heat load. This ensures that the medium with the lowest temperature and the strongest heat exchange capacity is used first to serve the key components that need the most heat dissipation, while the medium after absorbing heat can still effectively meet the cooling needs of low-power devices, thereby improving cooling efficiency and energy utilization.

[0146] In some embodiments provided by the present invention, the return branch 6 includes a liquid collecting element 601 and a second connecting pipe 602.

[0147] Specifically, the liquid collecting component 601 is located on the side of the first heating element 801 away from the liquid supply and return component 3. The liquid collecting component 601 is a hollow shell and has multiple collection holes.

[0148] The second connecting pipe 602 is connected between the liquid collecting component 601 and the liquid supply and return component 3, that is, the second connecting pipe 602 is connected between the liquid collecting component 601 and the medium outlet 103 of the tank 1.

[0149] In this embodiment, the liquid collecting component 601, through its multiple collecting holes, can uniformly collect the submerged medium that has completed its cooling task over a large area. Specifically, the multiple collecting holes on the liquid collecting component 601 form a distributed suction port, which can expand the return liquid range and ensure that the medium in the tank 1 can be efficiently captured and discharged, thereby improving the overall uniformity and thoroughness of drainage. The second connecting pipe 602 can guide the submerged medium in the liquid collecting component 601 to the supply and return liquid component 3.

[0150] In some embodiments provided by the present invention, the housing 1 is provided with an isolation element 603.

[0151] Specifically, the spacer 603 divides the interior of the housing 1 into a first chamber and a second chamber. For example, the spacer 603 can be sealed to the inner wall of the housing 1 using sealant or a sealing element.

[0152] The first chamber is equipped with an electrical connector 101, which is connected to the liquid supply and return component 3. That is, the first chamber is equipped with a medium inlet 102 and a medium outlet 103, which are connected to the liquid supply and return component 3.

[0153] The second chamber is equipped with a third heating element 803 of the electrical component 8, and the isolation element 603 is in thermal contact with the third heating element 803. Optionally, the isolation element 603 can be configured as an isolation plate or an isolation cover, and the third heating element 803 can be in direct contact with the isolation element 603, or in contact through a thermally conductive layer or thermally conductive component.

[0154] Furthermore, the housing 1 is provided with an inspection port 104 that communicates with the second chamber, so that the third heating element 803 can be installed or removed through the inspection port 104.

[0155] Optionally, the third heating element 803 includes a network card or memory 804. The third heating element 803 can be communicatively connected to the first heating element 801 or the second heating element 802 via a connector, which includes, but is not limited to, wires and circuit boards. The connector passes through the isolator 603 and is sealed to the isolator 603, for example, the connector and the isolator 603 can be sealed together with sealant or a sealing element.

[0156] In this embodiment, the first chamber serves as an immersion cooling zone, accommodating the high-power first heating element 801 and the second heating element 802, and is equipped with an electrical connector 101, a medium inlet 102 and a medium outlet 103, which are directly connected to the external liquid supply and return component 3 to achieve fully immersion-type high-efficiency heat dissipation.

[0157] The second chamber serves as a non-immersion area to house the third heating element 803. The third heating element 803 has relatively low heat generation and a high insertion / removal frequency. The enclosure 1 is specifically equipped with an access port 104 that connects to the second chamber, allowing operation of the third heating element 803 without draining the entire immersion medium of the enclosure 1 or disassembling the high-power module in the first chamber. Maintenance personnel can directly access the third heating element 803 simply by opening the access port 104, simplifying the high-frequency maintenance process.

[0158] Furthermore, the heat generated by the third heating element 803 is conducted to the isolation element 603 through thermally conductive contact. Since one side of the isolation element 603 faces the low-temperature immersion medium in the first chamber, it is effectively cooled, thereby removing the heat from the third heating element 803 through indirect liquid cooling. This ensures both the ease of maintenance of the third heating element 803 and makes full use of the high heat dissipation capacity of the immersion environment, achieving a balance between convenience and heat dissipation performance.

[0159] Optionally, the liquid collecting component 601 and the insulating component 603 are in thermally conductive contact. For example, the liquid collecting component 601 and the insulating component 603 can be configured as an integral structure. Alternatively, the liquid collecting component 601 and the insulating component 603 can be in direct contact or in contact through a thermally conductive layer or a thermally conductive component.

[0160] In this embodiment, when the liquid collecting component 601 and the isolation component 603 are in thermally conductive contact, the heat of the third heating component 803 can be actively absorbed by the isolation component 603. The liquid collecting component 601 is equivalent to the cold plate 504 of the third heating component 803. The heat of the third heating component 803 can be carried away by the return medium that continuously flows through the inside of the liquid collecting component 601, which adds forced convection heat dissipation capability to the cooling path and improves the cooling efficiency of the third heating component 803.

[0161] In some embodiments provided by the present invention, reference is made to Figure 5 As shown, the inspection port 104 of the housing 1 can be used as an installation port, or, refer to... Figure 6 As shown, an installation port, independent of the inspection port 104, can also be provided on the surface of the housing 1. The installation port can be sealed by a sealing plate. Specifically, the installation port can be used to install electrical components 8, liquid inlet branch 5, or liquid return branch 6.

[0162] Furthermore, the computing system also includes a mounting base 9, on which electrical components 8 are mounted. Specifically, the mounting base 9 can be installed inside the housing 1 through a mounting port and is snap-fitted or screwed to the housing 1.

[0163] Accordingly, the liquid inlet branch 5 and the liquid return branch 6 can be arranged in the housing 1 before the electrical component 8 is installed, or they can be arranged in the housing 1 after the electrical component 8 is installed. Alternatively, the liquid inlet branch 5 and the liquid return branch 6 can also be arranged on the mounting base 9 and arranged in the housing 1 at the same time as the electrical component 8.

[0164] The mounting base 9, pre-installed with electrical components 8, is inserted into the housing 1 through the mounting port and secured by snap-fit ​​or screw-fit, enabling rapid installation and replacement. This avoids assembling components one by one within the confined space of the housing 1, improving production efficiency and on-site maintenance speed. Simultaneously, the liquid inlet branch 5 and liquid return branch 6 can be pre-installed inside the housing 1, integrated into the mounting base 9 and installed along with the electrical components 8, or placed after the electrical components 8 are installed. This provides the system with a high degree of flexibility in assembly sequence, adapting to the needs of different manufacturing processes or maintenance scenarios.

[0165] An electronic device is also provided in an embodiment of the present invention.

[0166] Specifically, electronic devices include computing systems as described above.

[0167] It should be noted that electronic devices include computing systems, and therefore possess all the advantages of computing systems mentioned above, so this will not be elaborated further.

[0168] Optionally, the electronic device may be a server system, including a server. The server includes at least two electrical components 8, each housed within a corresponding enclosure 1.

[0169] Specifically, if electrical component 8 includes a computing module, an acceleration module, or a switching module, then the server includes a computing module, an acceleration module, and a switching module, and the computing module, acceleration module, and switching module are disposed in the corresponding enclosure 1.

[0170] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A computing system, comprising: include: The housing (4) has at least two boxes (1) inside, the boxes (1) are used to contain the immersion medium, the boxes (1) have electrical connectors (101) on their walls and electrical components (8) that are at least partially immersed in the immersion medium inside, and the electrical components (8) are electrically connected to the electrical connectors (101). A power supply module (2) is located outside the enclosure (1) and electrically connected to the electrical connector (101) of each enclosure (1). The power supply module (2) is used to supply power to the electrical components (8). The liquid supply and return component (3) is located outside the housing (1) and is detachably connected to the housing (1). It is used to provide the housing (1) with an immersion medium or to allow the immersion medium to flow back. The power supply module (2) is in thermal contact with the liquid supply and return component (3).

2. The computing system of claim 1, wherein, The housing (1) is provided with a medium inlet (102) and a medium outlet (103) on one side of the electrical connector (101). The medium inlet (102) and the medium outlet (103) are both connected to the interior of the housing (1) and connected to the liquid supply and return component (3). The electrical connector (101) is connected to the power supply module (2).

3. The computing system of claim 2, wherein, The housing (4) is provided with an opening for the box (1) to enter and exit, and at least two boxes (1) are arranged in the housing (4) along a direction intersecting the axial direction of the opening; The power supply module (2) and the liquid supply and return component (3) are both located inside the housing (4) and are opposite to the opening.

4. The computing system of claim 2, wherein, At least one of the liquid supply and return component (3) and the power supply module (2) is provided with a first positioning component (10), and the housing (1) is provided with a second positioning component (7) at a position opposite to the first positioning component (10). The first positioning component (10) and the second positioning component (7) form a limit in the insertion and removal direction perpendicular to the housing (1).

5. The computing system of claim 1, wherein, The electrical component (8) is at least one of a computing module, an acceleration module, or a switching module, and the computing module, the acceleration module, and the switching module are disposed in the corresponding housing (1).

6. The computing system of claim 1, wherein, The electrical connector (101) includes a power connector (1011) and a signal connector (1012). Both the power connector (1011) and the signal connector (1012) are electrically connected to the electrical components (8). The power supply module (2) is electrically connected to the power connector (1011). The computing system also includes a communication module, which is electrically connected to the signal connector (1012) and is used to realize the communication connection between the electrical components (8). The communication module is in thermal contact with the fluid supply and return component (3).

7. The computing system of any of claims 1-6, wherein, The electrical component (8) includes a first heating element (801) and a second heating element (802). The power of the first heating element (801) is higher than that of the second heating element (802). The immersion medium flows through the first heating element (801) first and then through the second heating element (802).

8. The computing system according to claim 7, characterized in that, The box (1) contains: Liquid inlet branch (5), the inlet of which is connected to the liquid supply and return component (3), and the outlet of which is directed toward the first heating element (801) to guide the immersion medium to the first heating element (801). The liquid inlet branch (5) includes a pulse regulating element (501), which is located on the immersion medium conveying path of the liquid inlet branch (5) and is used to make the immersion medium form a pulse flow.

9. The computing system according to claim 8, characterized in that, The pulse regulating member (501) has an inlet (5014) and two outlets (5015), with the two outlets (5015) facing the corresponding first heating element (801). The pulse regulating member (501) is provided with an regulating structure to allow the immersion medium entering through the inlet (5014) to flow alternately to the two outlets (5015).

10. The computing system according to claim 9, characterized in that, The pulse modulator (501) includes: Main body (5011); The chamber is located inside the main body (5011) and is provided with the liquid inlet (5014) and two liquid outlets (5015), with the two liquid outlets (5015) distributed on both sides of the axis of the liquid inlet (5014); The adjustment structure includes two flow guiding structures, which are located in the chamber and distributed on both sides of the axis. The flow guiding structures are used to allow a portion of the immersion medium entering through the inlet (5014) to flow to the outlet (5015) on the opposite side of the axis, and another portion to flow back to the outlet (5015) and flow to the opposite side of the axis.

11. The computing system according to claim 10, characterized in that, The flow guiding structure includes a partition structure (5020) and a flow guiding block (5016). The two partition structures (5020) are respectively located on both sides of the axis and together divide the chamber into an inlet chamber (5012) and an outlet chamber (5013). The inlet port (5014) is connected to the inlet chamber (5012), and the outlet port (5015) is connected to the outlet chamber (5013). A connecting port (5011a) is formed between the two partition structures (5020) opposite to the inlet port (5014). Two flow guide blocks (5016) are disposed in the liquid inlet chamber (5012) and are respectively disposed on both sides of the axis, and there is a gap between the flow guide block (5016) and the partition structure (5020) and the inner wall of the liquid inlet chamber (5012).

12. The computing system according to claim 11, characterized in that, The pulse modulator (501) further includes at least one of the following: The first flared structure (5017) is located at one end of the connecting port (5011a) near the liquid inlet chamber (5012), and along the direction from the liquid inlet chamber (5012) to the liquid outlet chamber (5013), the side walls of the first flared structure (5017) on both sides of the axis are close to each other. The second flared structure (5018) is located at one end of the connecting port (5011a) near the liquid outlet chamber (5013) and along the direction from the liquid inlet chamber (5012) to the liquid outlet chamber (5013). The side walls of the second flared structure (5018) on both sides of the axis are far apart from each other. The diversion structure (5019) is located on the inner wall of the liquid outlet chamber (5013) and is opposite to the connecting port (5011a). Along the direction from the liquid outlet chamber (5013) to the liquid inlet chamber (5012), the side walls of the diversion structure (5019) on both sides of the axis are close to each other.

13. The computing system according to claim 11, characterized in that, The flow guide block (5016) includes: The first strip structure (5016a) extends along the said axis; The second strip structure (5016b) is connected to the end of the first strip structure (5016a) near the liquid inlet (5014) and extends toward the axis.

14. The computing system according to claim 13, characterized in that, The second strip structure (5016b) is inclined away from the end face (5016c) of the first strip structure (5016a), and along the direction from the liquid inlet chamber (5012) to the liquid outlet chamber (5013), the end face (5016c) gradually tilts away from the axis.

15. The computing system according to any one of claims 8-14, characterized in that, The liquid inlet branch (5) also includes: The jetting component (502) has a cavity; An orifice plate (503) is disposed in the cavity and divides the cavity into a connecting cavity and a jet cavity. The connecting cavity is disposed downstream of the pulse regulating member (501), and the jet cavity is directed toward the first heating member (801).

16. The computing system according to claim 15, characterized in that, The box (1) is also equipped with: A cold plate (504) is disposed between the jet cavity and the first heating element (801), and fins are provided on the surface facing the jet cavity. The surface of the cold plate (504) away from the jet cavity is used for thermal contact with the first heating element (801).

17. The computing system according to any one of claims 8-14, characterized in that, The liquid inlet branch (5) also includes: The first connecting pipe (505) is connected between the supply and return liquid component (3) and the pulse regulating component (501).

18. The computing system according to claim 7, characterized in that, The box (1) is also equipped with: The return liquid branch (6) has an outlet connected to the supply and return liquid component (3), and the inlet of the return liquid branch (6) is spaced apart on the side of the first heating element (801) away from the supply and return liquid component (3). The second heating element (802) is located between the first heating element (801) and the inlet of the return liquid branch (6) so that after the immersion medium flows through the first heating element (801), it immerses the second heating element (802) and enters the inlet of the return liquid branch (6).

19. The computing system according to claim 18, characterized in that, The return fluid branch (6) includes: A liquid collecting component (601) is disposed on the side of the first heating element (801) away from the liquid supply and return component (3). The liquid collecting component (601) is a hollow shell and has multiple collection holes. The second connecting pipe (602) is connected between the liquid collecting component (601) and the liquid supply and return component (3).

20. The computing system according to any one of claims 1-6, 8-14, and 18-19, characterized in that, The box (1) contains: The isolator (603) divides the interior of the housing (1) into a first chamber and a second chamber. The first chamber is provided with the electrical connector (101) and is connected to the liquid supply and return component (3). The second chamber is provided with the third heating element (803) of the electrical component (8). The isolator (603) is in thermal contact with the third heating element (803). The housing (1) is provided with an inspection port (104) connected to the second chamber.

21. An electronic device, characterized in that, include: The computing system as described in any one of claims 1-20.

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