A Multi-Objective Optimization Intelligent PCB Material Selection Method and System

Abstract

This application relates to the field of printed circuit board (PCB) material selection optimization technology, and discloses a multi-objective optimization intelligent PCB material selection method and system, which is particularly applicable to the selection of PCB materials for integrated circuit design. The method includes: acquiring material attribute data of candidate PCB materials and selection requirement data corresponding to the target application scenario to construct a candidate material dataset; conducting risk assessment on candidate materials and filtering out materials that do not meet the basic application conditions; further screening based on performance adaptability, combined with economic data, supply guarantee data, and feasibility requirements; and comprehensively evaluating and ranking the PCB materials according to the risk assessment results, performance adaptability screening results, and economic assessment results to determine the PCB material selection results corresponding to the target application scenario. This application can improve the accuracy, stability, and feasibility of material selection.

Description

Technical Field

[0001] This application relates to the field of printed circuit board material selection and optimization technology. More specifically, this application relates to a multi-objective optimization intelligent PCB material selection method and system for integrated circuit supporting circuit board design scenarios. Background Technology

[0002] In the process of electronic circuit design and manufacturing, especially in the design, verification and implementation stages of supporting circuit boards after the completion of integrated circuit design, the selection of printed circuit board materials directly affects the stability of signal transmission, the level of thermal deformation control, the difficulty of processing and implementation, and the overall cost. In particular, in the application scenarios of high-frequency, high-speed, high-reliability electronic devices and supporting circuit boards for application-specific integrated circuits, different application tasks usually have different requirements for the transmission characteristics, environmental adaptability, structural stability, supply guarantee and implementation conditions of materials. Therefore, how to determine the suitable material from multiple candidate printed circuit board materials for the target application scenario has become a key issue in material selection.

[0003] In existing technologies, the selection of printed circuit board materials typically relies on manual experience, material handbook consultation, or direct comparison of a limited number of performance parameters. For material property data from different test reports, material libraries, or historical records, data is often simply summarized and directly used for comparison, lacking a unified approach to material property definitions, anomalies, and application requirements. This leads to inconsistencies in the basis for comparison between different candidate materials. When candidate materials have different data sources, measurement standards, or missing or conflicting data for parameters such as coefficient of thermal expansion, dielectric constant, dielectric loss factor, and stability rating, the subsequent comparison results are easily affected by the differences in the front-end data.

[0004] Meanwhile, in existing technologies, the assessment of material risk, performance matching, economic viability, and supply implementation is usually conducted in a fragmented manner, lacking a continuous screening strategy and a comprehensive ranking strategy centered around the target application scenario. Some solutions directly enter performance or cost comparisons before the basic suitability assessment of candidate materials has been completed, allowing candidate materials that already have risks of thermal deformation, transmission deviation, or insufficient stability to continue participating in subsequent comparisons, resulting in a distortion of the subsequent comparison range. For application scenarios such as application-specific integrated circuit supporting circuit boards, high-speed signal interconnect circuit boards, or high-reliability control circuit boards corresponding to integrated circuit design, if candidate materials do not have adaptability in terms of basic application conditions, it is difficult to guarantee the practical feasibility of the final result when conducting subsequent cost and supply comparisons.

[0005] Furthermore, existing technologies typically present comparison results from different dimensions separately, lacking a prioritization mechanism that focuses on the key requirements of the target, making it difficult to form a unified and stable multi-objective selection strategy. When transmission requirements, environmental requirements, structural requirements, cost requirements, and delivery requirements coexist, if the results cannot be hierarchically screened and comprehensively ranked according to the key requirements, the final selection results are prone to problems such as unclear ranking criteria, large fluctuations in conclusions, and insufficient correspondence between the selection results and the constraints of the target application scenario.

[0006] For example, when selecting materials for high-frequency circuit boards corresponding to application-specific integrated circuit (ASIC) designs, one candidate material may have low dielectric loss but a large thermal expansion response, while another candidate material may have slightly lower transmission performance but better structural stability, processing compatibility, and supply stability. Judging solely based on a single performance or cost metric can easily distort the range of candidate materials entering the final decision-making stage, leading to risks of structural deformation, transmission deviation, or delivery limitations in practical applications.

[0007] Therefore, there is an urgent need for a multi-objective optimization intelligent PCB material selection method and system to solve the technical problems in the existing technology when selecting printed circuit board materials for target application scenarios, such as inconsistent comparison of candidate materials, difficulty in timely screening of unsuitable materials, lack of hierarchical screening strategy and comprehensive ranking strategy, which lead to insufficient accuracy, stability and feasibility of the final selection results. Summary of the Invention

[0008] In order to overcome the above-mentioned defects of the prior art and to achieve the above objectives, this application provides the following technical solution: Firstly, this application discloses a multi-objective optimization method for intelligent selection of PCB materials, including: Obtain material property data of candidate printed circuit board materials and selection requirement data corresponding to the target application scenario, and construct a candidate material dataset based on the material property data and selection requirement data; Based on the candidate material dataset, risk assessment is performed on each candidate printed circuit board material to obtain the risk characterization results for each candidate printed circuit board material. Based on the risk characterization results, candidate printed circuit board materials that do not meet the basic application conditions are screened out to obtain the material risk assessment results. Based on the material risk assessment results and selection requirements data, the performance adaptability of each candidate printed circuit board material is screened to obtain a preliminary set of candidate materials that meet the performance requirements of the target application scenario. An economic evaluation was conducted based on the economic data corresponding to the preliminary candidate material set, and further screening was carried out by combining supply security data and the feasibility requirements corresponding to the target application scenario to obtain a refined candidate material set. Based on the risk assessment results, performance compatibility screening results, and economic evaluation results corresponding to the refined candidate material set, the multi-objective comprehensive evaluation results of each candidate printed circuit board material are determined, and they are ranked according to the multi-objective comprehensive evaluation results. Based on the ranking results, the selection results for printed circuit board materials corresponding to the target application scenario are determined.

[0009] Secondly, this application discloses a multi-objective optimized intelligent PCB material selection system, including: The candidate building module is used to obtain material property data of candidate printed circuit board materials and selection requirement data corresponding to the target application scenario, and to build a candidate material dataset based on the material property data and selection requirement data. The risk assessment module is used to conduct risk assessments on each candidate printed circuit board material based on the candidate material dataset, obtain the risk characterization results corresponding to each candidate printed circuit board material, and screen out candidate printed circuit board materials that do not meet the basic application conditions based on the risk characterization results, thereby obtaining the material risk assessment results. The performance screening module is used to screen the performance adaptability of each candidate printed circuit board material based on the material risk assessment results and selection requirements data, so as to obtain a preliminary set of candidate materials that meet the performance requirements of the target application scenario. The economic screening module is used to conduct economic evaluation based on the economic data corresponding to the preliminary candidate material set, and further screen the materials by combining supply security data and the feasibility requirements corresponding to the target application scenario to obtain a refined candidate material set. The comprehensive ranking module is used to determine the multi-objective comprehensive evaluation results of each candidate printed circuit board material based on the risk assessment results, performance adaptability screening results, and economic evaluation results corresponding to the refined candidate material set, and to rank them according to the multi-objective comprehensive evaluation results. The selection determination module is used to determine the selection results of printed circuit board materials corresponding to the target application scenario based on the sorting results.

[0010] Compared with related technologies, this application has the following advantages: This application acquires material property data of candidate printed circuit board materials and selection requirements data corresponding to target application scenarios, and constructs a candidate material dataset, so that the comparison of candidate materials is based on the unified and organized data. By organizing the material properties and selection requirements in the front end, the inconsistency problem caused by directly mixing and comparing material data from different sources can be reduced, thereby providing a consistent data foundation for subsequent risk assessment, performance screening and comprehensive ranking.

[0011] This application conducts risk assessments on each candidate printed circuit board material and eliminates those that do not meet the basic application conditions based on the risk characterization results. This allows candidate materials that do not meet the basic requirements of the target application scenario to be identified and excluded at the initial stage. By performing basic risk identification first and then proceeding to the subsequent comparison process, the interference of unsuitable candidate materials on subsequent performance and economic comparisons can be reduced, thereby improving the effectiveness of the subsequent screening scope and the reliability of the final selection results.

[0012] This application employs a performance compatibility screening process based on material risk assessment results and selection requirements data. Further screening is conducted by combining economic data, supply assurance data, and feasibility requirements, ensuring that transmission requirements, environmental requirements, structural requirements, cost requirements, and implementation requirements are integrated into a single, continuous processing chain. This multi-stage screening strategy transforms individual comparison results into a continuous decision-making basis for the target application scenario, thereby improving the selection process's adaptability to complex constraints and demonstrating the effectiveness of strategy optimization for PCB material selection scenarios.

[0013] This application determines the multi-objective comprehensive evaluation results based on the risk assessment results, performance adaptability screening results, and economic evaluation results corresponding to the refined candidate material set, and sorts them according to the multi-objective comprehensive evaluation results, so that different candidate materials form a unified priority order. By transforming the multi-dimensional comparison results into sortable comprehensive evaluation results, it can improve the problems of scattered sorting basis and unstable final conclusions in the prior art, thereby improving the clarity, consistency and verifiability of the selection results.

[0014] This application adopts a continuous process of "candidate construction, risk screening, performance screening, further screening based on economics, supply and feasibility, comprehensive evaluation and ranking, and selection determination" to ensure that the final printed circuit board material can simultaneously take into account the level of risk control, performance satisfaction, economic rationality and feasibility of implementation. Therefore, it is particularly suitable for application scenarios with high requirements for material selection strategies, such as high-frequency, high-speed, high-reliability electronic devices and application-specific integrated circuit supporting circuit boards for integrated circuit design. Attached Figure Description

[0015] Figure 1 A schematic diagram of the multi-objective optimization intelligent PCB material selection method provided in this application; Figure 2 A schematic diagram of the multi-objective optimized intelligent PCB material selection system module provided in this application. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] Example 1 Please see Figure 1 As shown, this embodiment provides a multi-objective optimized intelligent PCB material selection method, including the following steps: The goal is to acquire material property data of candidate printed circuit board materials and selection requirements data corresponding to target application scenarios, and to construct a candidate material dataset based on the material property data and selection requirements data. The purpose is to generate a candidate material dataset that can be used for subsequent risk assessment, performance adaptability screening, economic assessment and multi-objective comprehensive evaluation, so that each candidate printed circuit board material has a material property result and selection requirement result with clear source and uniform definition, and that abnormalities in material properties are identified and retained before entering the subsequent steps.

[0018] In some implementations, the steps for constructing a candidate material dataset include: Step 1011: Obtain the original material property data of the candidate printed circuit board materials, and organize them separately according to the candidate printed circuit board materials to generate an original material property record set. The original material property data comes from material databases, material specification documents, test reports, or existing material selection records, and is used to characterize the basic physical properties and transmission performance of the candidate printed circuit board materials. The original material property data includes at least the coefficient of thermal expansion, dielectric constant, dielectric loss factor, and material stability rating. When corresponding data exists, it also includes thickness adaptation information, heat resistance rating information, processing compatibility information, and supply status information. In the original material property record set, each candidate printed circuit board material corresponds to at least one set of original material property record items, and each original material property record item includes at least the candidate printed circuit board material identifier, property name, property value, unit of measurement, and data source description.

[0019] Step 1012: Perform attribute standardization processing on the original material attribute record set generated in step 1011 to generate a standardized attribute record item set. The attribute standardization processing includes: unifying the units of measurement for attribute values ​​with inconsistent units according to a preset unit conversion relationship; unifying the names of attribute items with different names but the same meaning according to a preset attribute correspondence relationship; and selecting records according to a preset retention order for the same candidate printed circuit board material when multiple sets of original material attribute record items exist. The preset retention order is determined sequentially according to the reliability of the data source, the order of detection time, and the completeness of the attribute. After attribute standardization processing, each original material attribute record item corresponds to a standardized attribute record item, and all standardized attribute record items together constitute a standardized attribute record item set. Each standardized attribute record item includes at least the candidate printed circuit board material identifier, the unified attribute name, the unified attribute value, and the unified measurement caliber.

[0020] Step 1013: Perform attribute anomaly determination processing on the standardized attribute record set to generate an attribute anomaly determination record set. The attribute anomaly determination processing includes: comparing the unified attribute values ​​in each standardized attribute record with the preset engineering allowable range of the corresponding attribute; comparing the value differences between attribute items with the same name corresponding to the same candidate printed circuit board material with the preset difference allowable range; and determining missing attribute items in the standardized attribute record; generating a value anomaly determination record when the unified attribute value exceeds the preset engineering allowable range of the corresponding attribute; generating a conflict anomaly determination record when the value differences between attribute items with the same name exceed the preset difference allowable range; and generating a missing item anomaly determination record when there are missing core attribute items required for subsequent risk assessment.

[0021] Step 1014: Based on the standardized attribute record set generated in Step 1012, merge the standardized attribute record items belonging to the same candidate printed circuit board material to generate a standardized material attribute result set. The merging method is as follows: using the candidate printed circuit board material identifier as the merging basis, combine and organize the thermal expansion coefficient, dielectric constant, dielectric loss factor, material stability rating, thickness adaptation information, heat resistance level information, processing compatibility information, and supply status information of the same candidate printed circuit board material to form the standardized material attribute result of the corresponding candidate printed circuit board material; output the standardized material attribute result set.

[0022] Step 1015: Based on the set of attribute anomaly judgment records generated in step 1013, summarize the anomaly judgments of each item belonging to the same candidate printed circuit board material to generate an attribute anomaly identification result set. The summarization method is as follows: based on the candidate printed circuit board material identification, classify and organize the value anomaly judgment records, conflict anomaly judgment records, and missing item anomaly judgment records. When a candidate printed circuit board material does not have any anomaly judgments, generate an attribute anomaly identification result without anomalies. When there is at least one anomaly judgment, generate an attribute anomaly identification result containing the anomaly type and the corresponding attribute item, and output the attribute anomaly identification result set.

[0023] Step 1016: Obtain the original selection requirement record set corresponding to the target application scenario; the original selection requirement record set comes from the design task book, application specifications, target product performance constraints or historical design schemes, and includes at least the operating frequency range, target transmission loss control requirements, ambient temperature range, deformation control requirements and cost control requirements; when there are corresponding constraints, it also includes stable operation requirements, procurement cycle requirements and supply guarantee requirements.

[0024] Step 1017: Perform requirement normalization processing on the original selection requirement record set to generate normalized selection requirement results. The requirement normalization processing includes: splitting the textual description requirements in the original selection requirement record set into transmission requirement items, environmental requirement items, structural requirement items, cost requirement items, stability requirement items, cycle requirement items, and supply requirement items; then, based on the design specifications, historical application data, and target application scenario constraints corresponding to each requirement item, determining the target range, allowable deviation range, and requirement item ranking results respectively; wherein, the target range is used to characterize the target control range of the corresponding requirement item, the allowable deviation range is used to characterize the range of changes outside the target control range but still acceptable, and the requirement item ranking results are used to characterize the order of comparison of each requirement item in subsequent comprehensive judgment and comprehensive evaluation; this step outputs the normalized selection requirement results.

[0025] Step 1018: Correspond the standardized material property result set generated in Step 1014, the attribute anomaly identification result set generated in Step 1015, and the standardized selection requirement result generated in Step 1017 to construct a candidate material dataset. During construction, each candidate printed circuit board material is taken as the basic processing object, and the corresponding standardized material property result, attribute anomaly identification result, and standardized selection requirement result are combined to form the material comparison record corresponding to the candidate printed circuit board material, and the candidate material dataset is output.

[0026] Based on the candidate material dataset, risk assessment is performed on each candidate printed circuit board material to obtain the risk characterization results corresponding to each candidate printed circuit board material. The purpose is to call the generated candidate material dataset to calculate and determine the thermal expansion risk, transmission deviation risk and stability risk of each candidate printed circuit board material under the target application scenario, and then combine the risk results into the subsequent basic application conditions to screen out the risk characterization results that are directly called.

[0027] In some implementations, the steps for obtaining the risk characterization results for each candidate printed circuit board material include: Step 2011: Read the candidate material dataset generated in step 1018, and split the material comparison record corresponding to each candidate printed circuit board material to generate a set of thermally related input items, a set of transmission-related input items, a set of stability-related input items, and a set of requirements comparison criteria. Among them, the set of thermally related input items includes at least the coefficient of thermal expansion and the ambient temperature range; the set of transmission-related input items includes at least the dielectric constant, the dielectric loss factor, and the operating frequency range; the set of stability-related input items includes at least the material stability rating and the result of property anomaly identification; and the set of requirements comparison criteria includes at least the deformation control requirements, the target transmission loss control requirements, the stable operation requirements, and the target range, allowable deviation interval, and requirement ranking results of the corresponding requirements.

[0028] Step 2012: Based on the set of thermally relevant input items and the set of requirements comparison criteria, generate thermal expansion response quantities for each candidate printed circuit board material. The generation method is as follows: first, determine the temperature difference amplitude corresponding to the target application scenario based on the ambient temperature range; then, multiply the thermal expansion coefficient by the temperature difference amplitude to obtain the thermal expansion response quantity. The thermal expansion response quantity is used to characterize the degree of thermal expansion change of the candidate printed circuit board material under temperature changes in the target application scenario. The thermal expansion response quantity is calculated as follows: ; In the formula, This is the thermal expansion response quantity; The coefficient of thermal expansion is the corresponding thermal expansion coefficient of the candidate printed circuit board material; The temperature difference amplitude corresponding to the target application scenario.

[0029] Step 2013: Based on the thermal expansion response and the deformation control requirements, target range, and allowable deviation range in the demand comparison set, generate thermally related deviation, thermally related comparison results, and thermally related risk results. The generation method is as follows: First, compare the thermal expansion response with the target range corresponding to the deformation control requirements to obtain the thermally related deviation; then compare the thermally related deviation with the allowable deviation range to generate the thermally related comparison results; when the thermal expansion response falls within the target range, the thermally related comparison results are determined to be compliant; when the thermal expansion response exceeds the target range but falls within the allowable deviation range, the thermally related comparison results are determined to be critically compliant; when the thermal expansion response exceeds the allowable deviation range, the thermally related comparison results are determined to be non-compliant; then, generate thermally related risk results based on the thermally related comparison results, where compliant corresponds to the pass level, critically compliant corresponds to the critical level, and non-compliant corresponds to the fail level.

[0030] Step 2014: Based on the set of transmission-related input items and the set of requirements comparison criteria generated in step 2011, generate a transmission comparison benchmark result. The transmission comparison benchmark result includes the target propagation delay range, the target loss range, and the transmission allowable deviation interval. The generation method is as follows: First, determine the frequency band category corresponding to the target application scenario based on the operating frequency range. Then, based on the frequency band category, the target transmission loss control requirements, and the transmission requirement items in the standardized selection requirement results, determine the target propagation delay range and the target loss range corresponding to the current frequency band category from the preset transmission requirement correspondence. Subsequently, generate the transmission allowable deviation interval based on the target propagation delay range, the target loss range, and the allowable deviation requirements corresponding to the transmission requirement items.

[0031] Step 2015: Based on the transmission-related input item set generated in Step 2011 and the transmission comparison benchmark result generated in Step 2014, generate the target frequency band dielectric constant result, propagation speed per unit length result, propagation delay value per unit length, and propagation delay deviation. The generation method is as follows: First, read the dielectric constant and operating frequency range corresponding to the current candidate printed circuit board material; when the operating frequency range corresponds to a single frequency band, directly determine the dielectric constant corresponding to that frequency band as the target frequency band dielectric constant result; when the operating frequency range covers multiple frequency bands, based on the transmission requirement item sorting result, select the dielectric constant corresponding to the main operating frequency band of the target application scenario from the dielectric constants corresponding to each frequency band, and determine it as the target frequency band dielectric constant result; then based on... The target frequency band dielectric constant result and the preset propagation speed correspondence are used to generate a propagation speed result per unit length. Then, based on the propagation speed result per unit length and the preset length conversion relationship, a propagation delay value per unit length is generated. The propagation delay value per unit length is used to characterize the signal propagation delay level of the current candidate printed circuit board material per unit transmission length in the target operating frequency band. The propagation delay value per unit length is then compared with the target propagation delay range generated in step 2014. When the propagation delay value per unit length falls within the target propagation delay range, a propagation delay deviation of zero deviation is generated. When the propagation delay value per unit length exceeds the target propagation delay range, a corresponding propagation delay deviation is generated based on the difference between the propagation delay value per unit length and the target propagation delay range.

[0032] Step 2016: Based on the transmission-related input item set generated in Step 2011 and the transmission comparison benchmark result generated in Step 2014, generate the target frequency band loss factor result, transmission loss value per unit length, and loss deviation. The generation method is as follows: First, read the dielectric loss factor and operating frequency range corresponding to the current candidate printed circuit board material; when the operating frequency range corresponds to a single frequency band, directly determine the dielectric loss factor corresponding to that frequency band as the target frequency band loss factor result; when the operating frequency range covers multiple frequency bands, select the dielectric loss factor corresponding to the main operating frequency band of the target application scenario from the dielectric loss factors corresponding to each frequency band according to the transmission requirement item sorting result. The dielectric loss factor is determined as the target frequency band loss factor result; then, based on the target frequency band loss factor result and the preset loss conversion relationship, a unit length transmission loss value is generated; the unit length transmission loss value is used to characterize the signal loss level of the current candidate printed circuit board material per unit transmission length in the target operating frequency band; then, the unit length transmission loss value is compared with the target loss range generated in step 2014; when the unit length transmission loss value falls within the target loss range, a loss deviation amount with zero deviation is generated; when the unit length transmission loss value exceeds the target loss range, a corresponding loss deviation amount is generated based on the difference from the target loss range.

[0033] Step 2017: Based on the propagation delay deviation generated in Step 2015, the loss deviation generated in Step 2016, and the sorting result of the transmission demand items in the demand comparison set, a transmission deviation is generated. The generation method is as follows: First, the combination order of the propagation delay deviation and the loss deviation is determined according to the sorting result of the transmission demand items. Then, the propagation delay deviation and the loss deviation are combined according to the preset transmission deviation combination rules. When both the propagation delay deviation and the loss deviation are zero deviation, the transmission deviation is determined to be zero deviation. When only one of the propagation delay deviation and the loss deviation is not zero deviation, the transmission deviation is determined to be that non-zero deviation. When neither the propagation delay deviation nor the loss deviation is zero deviation, the deviation with the highest sorting value is used as the main deviation, and the deviation with the lowest sorting value is used as the correction deviation. The transmission deviation is generated according to the preset transmission deviation combination rules.

[0034] Step 2018: Based on the transmission deviation and the transmission comparison benchmark result, generate transmission-related comparison results and transmission-related risk results. The generation method is as follows: First, compare the transmission deviation with the transmission allowable deviation range generated in step 2014 to generate transmission-related comparison results. When the transmission deviation falls within the target control range of the transmission allowable deviation range, the transmission-related comparison result is determined to be compliant. When the transmission deviation exceeds the target control range but falls within the transmission allowable deviation range, the transmission-related comparison result is determined to be critically compliant. When the transmission deviation exceeds the transmission allowable deviation range, the transmission-related comparison result is determined to be non-compliant. Then, generate transmission-related risk results based on the transmission-related comparison results, where compliance corresponds to the pass level, critical compliance corresponds to the critical level, and non-compliance corresponds to the fail level.

[0035] For example, for candidate printed circuit board material A, the coefficient of thermal expansion is read as 16×10^-6 / ℃. The ambient temperature range corresponding to the target application scenario is -20℃ to 80℃, so the temperature difference amplitude is 100℃. Based on this, the thermal expansion response is 0.0016. For the current application scenario, the target control range corresponding to the deformation control requirements can be set to 0 to 0.0015, and the acceptable variation range can cover up to 0.0018. Therefore, the thermal expansion response of candidate printed circuit board material A is higher than the target control range but does not exceed the acceptable variation range. Thus, the thermal correlation comparison result can be determined as critically compliant, and the thermal correlation risk result is further generated as critical level.

[0036] The dielectric constant of candidate printed circuit board material A in the main operating frequency band is read as 3.8. Based on the preset propagation speed correspondence, the propagation speed per unit length is generated, and further converted to a propagation delay value of 5.9 ns / m. For the current application scenario, the target propagation delay range can be set to, for example, 5.0 ns / m to 5.7 ns / m, then the propagation delay deviation of candidate printed circuit board material A is 0.2 ns / m.

[0037] The dielectric loss factor of candidate printed circuit board material A in the main operating frequency band is then read as 0.0032. Based on the preset loss conversion relationship, a transmission loss value per unit length of 0.18 dB / m is generated. For the current application scenario, the corresponding target loss range can be set to, for example, 0 to 0.15 dB / m, then the loss deviation of candidate printed circuit board material A is 0.03 dB / m.

[0038] When the ranking of transmission requirements indicates that propagation delay takes precedence over transmission loss, the deviation of propagation delay is used as the primary deviation, and the deviation of transmission loss is used as the corrective deviation. These two are combined to generate the transmission deviation. If this transmission deviation exceeds the target control range but remains within the allowable deviation range, the transmission-related comparison result is determined to be critically met, and the transmission-related risk result is generated as critical level. Thus, the thermal-related risk result and transmission-related risk result corresponding to candidate printed circuit board material A are clearly generated and used as inputs for subsequent stability risk assessment and comprehensive risk assessment.

[0039] Step 2019: Based on the set of stability-related input items and the set of requirements comparison criteria generated in Step 2011, generate the basic stability level value, anomaly correction value, stability level value, stability comparison result, and stability-related risk result. The generation method is as follows: First, determine the basic stability level value based on the material stability rating; then, determine whether to perform anomaly correction based on the attribute anomaly identification result; when the attribute anomaly identification result indicates the presence of value anomalies, conflict anomalies, or missing item anomalies, generate the anomaly correction value according to the anomaly correction rules corresponding to the stability work requirements; when the attribute anomaly identification result indicates no anomalies, the anomaly correction value is zero; subsequently, synthesize the basic stability level value and the anomaly correction value to generate the stability level value; the stability... The qualitative grade value is used to characterize the stability level of the current candidate printed circuit board material in meeting the stable operation requirements in the target application scenario. First, a basic stability grade value is determined based on the material stability rating. Then, based on the attribute anomaly identification results, it is determined whether there are value anomalies, conflict anomalies, or missing item anomalies. When at least one type of anomaly exists, the correction amount for each type of anomaly is determined according to the correction rules for the corresponding anomaly type, and the correction amounts for each type of anomaly are accumulated to obtain the anomaly correction value. When there are no anomalies, the anomaly correction value is zero. Subsequently, the basic stability grade value is corrected based on the anomaly correction value to generate a stability grade value. When the corrected result is lower than the preset minimum grade boundary, the stability grade value is determined as the minimum grade boundary value.

[0040] The stability level value is then compared with the target stability level range and the allowable deviation range corresponding to the stable working requirements to generate a stability comparison result. When the stability level value falls within the target stability level range, the stability comparison result is determined to be compliant. When the stability level value exceeds the target stability level range but falls within the allowable deviation range, the stability comparison result is determined to be critically compliant. When the stability level value exceeds the allowable deviation range, the stability comparison result is determined to be non-compliant. Based on the stability comparison result, stability-related risk results are then generated, where compliant corresponds to a pass level, critically compliant corresponds to a critical level, and non-compliant corresponds to a fail level.

[0041] Step 2020: Based on the heat-related risk results generated in Step 2013, the transmission-related risk results generated in Step 2018, and the stability-related risk results generated in Step 2019, as well as the ranking results of the demand items in the demand comparison set, a comprehensive risk result is generated. The generation method is as follows: First, the comparison order of the heat-related risk results, transmission-related risk results, and stability-related risk results is determined according to the ranking results of the demand items; when the top-ranked individual risk result is a failing grade, the comprehensive risk result is directly determined to be a failing grade; when there are no failing grades but at least one critical grade, the comprehensive risk result is determined to be a critical grade; when all individual risk results are passing grades, the comprehensive risk result is determined to be a passing grade.

[0042] Step 2021 involves merging and organizing the thermal expansion response quantity, thermal correlation deviation quantity, thermal correlation comparison results and thermal correlation risk results, propagation delay evaluation results and propagation delay deviation quantity, loss evaluation results and loss deviation quantity, transmission deviation quantity, transmission correlation comparison results and transmission correlation risk results, basic stability results, stability correction quantity, stability comparison quantity, stability comparison results and stability correlation risk results, and comprehensive risk results to generate a risk characterization result set.

[0043] Based on the risk characterization results, candidate printed circuit board materials that do not meet the basic application conditions are screened out, and material risk assessment results are obtained. The purpose is to call the already generated risk characterization results to make a judgment on whether each candidate printed circuit board material meets the basic application conditions for entering the performance adaptability screening step, screen out candidate printed circuit board materials that do not meet the basic application conditions, and generate a set of material risk assessment results that can be directly called in subsequent steps.

[0044] In some implementation methods, the steps for obtaining material risk assessment results include: Step 3011: Read the risk characterization result set generated in step 2021 and the standardized selection requirement result generated in step 1017. Extract thermal expansion response, thermal-related risk result, transmission deviation, transmission-related risk result, stability comparison, stability-related risk result, comprehensive risk result, environmental requirement item, transmission requirement item, stable working requirement, corresponding target range, corresponding allowable deviation interval, and requirement item sorting result according to the candidate printed circuit board materials, and generate the basic application condition judgment input set.

[0045] Step 3012: Based on the basic application condition judgment input set generated in step 3011, generate thermal response judgment results, thermal-related basic judgment results, transmission deviation judgment results, transmission-related basic judgment results, stability judgment results, and stability-related basic judgment results. The generation method includes: comparing the thermal expansion response quantity with the target range and allowable deviation interval corresponding to the environmental requirement item to generate thermal response judgment results; then synthesizing the thermal response judgment results with the thermal-related risk results to generate thermal-related basic judgment results; simultaneously, comparing the transmission deviation quantity with the target range and allowable deviation interval corresponding to the transmission requirement item to generate transmission deviation judgment results; then synthesizing the transmission deviation judgment results with the transmission-related risk results to generate transmission-related basic judgment results; and comparing the stability level value with the target stability level interval and allowable stability deviation interval corresponding to the stable working requirements to generate stability judgment results; then synthesizing the stability judgment results with the stability-related risk results to generate stability-related basic judgment results. The thermal-related basic judgment results, transmission-related basic judgment results, and stability-related basic judgment results are all represented by three states: pass, critical pass, and fail.

[0046] Step 3013: Based on the thermal-related basic judgment results, transmission-related basic judgment results, and stability-related basic judgment results, as well as the requirement item ranking results and comprehensive risk results extracted in step 3011, generate a comprehensive judgment result for basic application conditions and an enhanced verification identifier result. The generation method includes: first, determining the comparison order of the thermal-related basic judgment results, transmission-related basic judgment results, and stability-related basic judgment results according to the requirement item ranking results; when the basic judgment result ranked first is "fail", the comprehensive judgment result for basic application conditions is directly determined to be "fail"; when there are no "fail" results but at least one "critical pass" result, continue to call the comprehensive risk result for review; when the comprehensive risk result corresponds to the "fail" level, the comprehensive judgment result for basic application conditions is determined to be "fail"; when the comprehensive risk result corresponds to the "critical" or "pass" level, the comprehensive judgment result for basic application conditions is determined to be "critical pass"; when all basic judgment results are "pass", the comprehensive judgment result for basic application conditions is determined to be "pass"; for candidate printed circuit board materials whose comprehensive judgment result for basic application conditions is "critical pass", an enhanced verification identifier result is generated.

[0047] Furthermore, to illustrate the comprehensive assessment process for basic application conditions, for example, for candidate printed circuit board material A, based on the aforementioned risk characterization results, its thermal-related risk result is determined to be critical, its transmission-related risk result is critical, and its stability-related risk result is deemed acceptable. After performing basic application condition assessment by combining environmental requirements, transmission requirements, and stable operating requirements, the resulting basic assessment results are: thermal-related risk is critically acceptable, transmission-related risk is critically acceptable, and stability-related risk is acceptable.

[0048] When the current application scenario's requirement ranking results show that transmission requirements, environmental requirements, and stability requirements are compared sequentially, and none of the three basic judgment results are failing, but there is a critical pass, the comprehensive risk result is then invoked for further review. If the comprehensive risk result corresponding to candidate printed circuit board material A is at the critical level, the comprehensive judgment result of the basic application conditions is determined to be critically pass, and an enhanced verification identifier result is generated; if the comprehensive risk result further deteriorates to the fail level, the comprehensive judgment result of the basic application conditions is determined to be fail, and the candidate printed circuit board material is removed in the subsequent screening process. This example illustrates that the comprehensive judgment result of the basic application conditions is not generated in isolation, but is formed by the combined effect of individual basic judgment results and the comprehensive risk result.

[0049] Step 3014: Based on the comprehensive judgment result of basic application conditions, perform basic application condition screening processing on the risk characterization result set to generate a risk retention material set. The processing method includes: when the comprehensive judgment result of basic application conditions is unsuccessful, the corresponding candidate printed circuit board material is removed from the risk characterization result set; when the comprehensive judgment result of basic application conditions is successful or critically successful, the corresponding candidate printed circuit board material is retained in the risk retention material set; for candidate printed circuit board materials that also correspond to enhanced verification label results, the enhanced verification label results are retained simultaneously during retention.

[0050] Step 3015: The risk retention material set, the comprehensive judgment result of basic application conditions and the enhanced verification identification result generated in step 3013, and the risk characterization result generated in step 2021 are merged and organized to generate a material risk assessment result set. In the material risk assessment result set, each candidate printed circuit board material corresponds to one material risk assessment result. Each material risk assessment result includes at least the candidate printed circuit board material identification, thermal expansion response, thermally related risk result, transmission deviation, transmission related risk result, stability comparison, stability related risk result, comprehensive risk result, comprehensive judgment result of basic application conditions, and enhanced verification identification result or no enhanced verification explanation result.

[0051] Step 3016: Perform a continuous verification on the material risk assessment result set to generate a verified material risk assessment result set; the continuous verification is used to check whether each candidate printed circuit board material in the material risk assessment result set has a risk characterization result, a comprehensive judgment result of basic application conditions, and an enhanced verification mark result or an unenhanced verification description result; this step outputs the verified material risk assessment result set.

[0052] Based on the material risk assessment results and selection requirements data, the performance adaptability of each candidate printed circuit board material is screened to obtain a preliminary candidate material set that meets the performance requirements of the target application scenario. The purpose is to call the generated material risk assessment result set and the generated standardized selection requirements results to screen the candidate printed circuit board materials that have been eliminated through basic application conditions for transmission adaptability, environmental adaptability and structural adaptability, and generate a preliminary candidate material set that can be directly called upon for subsequent economic evaluation.

[0053] In some implementations, the steps for obtaining a preliminary set of candidate materials that meets the performance requirements of the target application scenario include: Step 4011: Read the verified material risk assessment result set generated in step 3016, and simultaneously read the standardized selection requirement result generated in step 1017 and the standardized material attribute result set generated in step 1014; extract the candidate printed circuit board materials to be retained, thermal expansion response, thermally related risk results, transmission deviation, transmission-related risk results, stability comparison, stability-related risk results, comprehensive risk results, and enhanced verification identification results from the verified material risk assessment result set; extract transmission requirement items, environmental requirement items, structural requirement items, stable operation requirements, target range, allowable deviation range, and requirement item ranking results from the standardized selection requirement results; extract the thickness adaptation information and processing compatibility information corresponding to the candidate printed circuit board materials to be retained from the standardized material attribute result set; organize the aforementioned extracted results accordingly to generate a performance adaptability screening input set.

[0054] Step 4012: Based on the performance adaptability screening input set, generate transmission deviation comparison results and transmission adaptability comparison results for each candidate printed circuit board material. The generation method includes: first, calling the transmission deviation amount as the basic comparison amount for transmission, and comparing the transmission deviation amount with the target range and allowable deviation interval corresponding to the transmission requirement item to generate transmission deviation comparison results; when the transmission deviation amount falls within the target range, the transmission deviation comparison result is determined to be compliant; when the transmission deviation amount exceeds the target range but falls within the allowable deviation interval, the transmission deviation comparison result is determined to be critically compliant; when the transmission deviation amount exceeds the allowable deviation interval, the transmission deviation comparison result is determined to be non-compliant; then, calling the transmission-related risk results, and synthesizing the transmission deviation comparison results with the transmission-related risk results to generate transmission adaptability comparison results.

[0055] Step 4013: Based on the performance adaptability screening input set generated in step 4011, generate thermal expansion environment comparison results, stability environment comparison results, and environmental adaptability comparison results for each candidate printed circuit board material. The generation method includes: first, calling the thermal expansion response quantity and comparing it with the target range and allowable deviation interval corresponding to the environmental requirement item to generate thermal expansion environment comparison results; then, calling the stability level value and comparing it with the target stability level interval and allowable deviation interval corresponding to the stable working requirements to generate stability environment comparison results; wherein, when the stability level value falls within the target stability level interval, the stability environment comparison result is determined to be compliant; when the stability level value exceeds the target stability level interval but falls within the allowable deviation interval, the stability environment comparison result is determined to be critically compliant; when the stability level value exceeds the allowable deviation interval, the stability environment comparison result is determined to be non-compliant; subsequently, calling the thermal-related risk results and stability-related risk results, and synthesizing the thermal expansion environment comparison results, stability environment comparison results, thermal-related risk results, and stability-related risk results accordingly to generate environmental adaptability comparison results.

[0056] Step 4014: Based on the performance adaptability screening input set, generate structural deformation comparison results, structural basis comparison results, thickness adaptability comparison results, processing compatibility comparison results, supplementary structural comparison results, no-supplementary comparison explanation results, and structural adaptability comparison results for each candidate printed circuit board material; the generation methods include: First, the thermal expansion response is invoked, and the target structural stability range and allowable deviation range in the structural requirements are read. The thermal expansion response is used as a structural deformation comparison quantity. The structural deformation comparison quantity is used to characterize the degree of structural impact of the current candidate printed circuit board material on the board surface deformation and assembly stability due to thermal expansion changes in the target application scenario. Then, the structural deformation comparison quantity is compared with the target structural stability range and allowable deviation range to generate a structural foundation comparison result. When the structural deformation comparison quantity falls within the target structural stability range, the structural foundation comparison result is determined to be compliant. When the structural deformation comparison quantity exceeds the target structural stability range but falls within the allowable deviation range, the structural foundation comparison result is determined to be critically compliant. When the structural deformation comparison quantity exceeds the allowable deviation range, the structural foundation comparison result is determined to be non-compliant.

[0057] Next, thickness compatibility information and processing compatibility information corresponding to the current candidate printed circuit board material are extracted from the standardized material property result set, and target board thickness range, assembly constraints, and processing constraints are extracted from the structural requirements. When thickness compatibility information can be extracted, it is compared with the target board thickness range to generate a thickness compatibility comparison result. Specifically, when the thickness compatibility information covers the target board thickness range, the thickness compatibility comparison result is determined to be compliant; when the thickness compatibility information and the target board thickness range partially overlap but do not completely cover each other, the thickness compatibility comparison result is determined to be critically compliant; when the thickness compatibility information and the target board thickness range do not overlap, the thickness compatibility comparison result is determined to be non-compliant.

[0058] When processing compatibility information can be extracted, it is compared with processing constraints and assembly constraints to generate a processing compatibility comparison result. Specifically, if the processing compatibility information covers the processing constraints and assembly constraints corresponding to the target application scenario, the processing compatibility comparison result is determined to be compliant; if the processing compatibility information only covers some processing constraints or some assembly constraints, the processing compatibility comparison result is determined to be critically compliant; and if the processing compatibility information does not cover the processing constraints and assembly constraints corresponding to the target application scenario, the processing compatibility comparison result is determined to be non-compliant.

[0059] When both the thickness adaptation comparison result and the processing compatibility comparison result have been generated, the thickness adaptation comparison result and the processing compatibility comparison result are combined to generate a structural supplementary comparison result. Among them, when both the thickness adaptation comparison result and the processing compatibility comparison result are compliant, the structural supplementary comparison result is determined to be compliant; when neither of them is non-compliant but at least one is critically compliant, the structural supplementary comparison result is determined to be critically compliant; when either of them is non-compliant, the structural supplementary comparison result is determined to be non-compliant.

[0060] When thickness adaptation information and processing compatibility information cannot be extracted, a result without supplementary comparison description is generated. The result without supplementary comparison description is used to characterize that the current candidate printed circuit board material lacks supplementary attribute data for performing thickness adaptation comparison and processing compatibility comparison, and to explain that the structural adaptability of the current candidate printed circuit board material is determined only based on the basic structural comparison result. The result without supplementary comparison description includes at least the candidate printed circuit board material identifier, the type of missing supplementary attribute, and explanatory information on performing only the basic structural comparison.

[0061] Subsequently, the structural foundation comparison results are combined with the structural supplementary comparison results or the results without supplementary comparison descriptions to generate the structural adaptation comparison results. Among them, when there are structural supplementary comparison results, if both the structural foundation comparison results and the structural supplementary comparison results are compliant, the structural adaptation comparison results are determined to be compliant; if neither of them is non-compliant but at least one is critically compliant, the structural adaptation comparison results are determined to be critically compliant; if either of them is non-compliant, the structural adaptation comparison results are determined to be non-compliant.

[0062] When there is no supplementary structural comparison result but there is a result without supplementary comparison description, the basic structural comparison result is used as the structural adaptation comparison result, and the result without supplementary comparison description is associated with and saved with the structural adaptation comparison result.

[0063] For candidate printed circuit board materials with enhanced verification results, when performing structural basis comparison, thickness adaptation comparison, and processing compatibility comparison, the allowable deviation range of the structure is narrowed into a safe side allowable sub-range to improve the structural screening accuracy of critical candidate printed circuit board materials.

[0064] In step 4015, the structural adaptation comparison result is used to make a comprehensive judgment with the transmission adaptation comparison result and the environment adaptation comparison result to generate the performance adaptability screening result.

[0065] For example, for candidate printed circuit board material B, its thermal expansion response is read as 0.0014. The target structural stability range can be set to 0 to 0.0013, and the allowable deviation range can cover up to 0.0016. Then, the structural deformation comparison value corresponding to candidate printed circuit board material B is higher than the target structural stability range but does not exceed the allowable deviation range. Therefore, the structural basis comparison result is determined to be critically consistent.

[0066] The thickness compatibility information for candidate PCB material B is read, ranging from 0.8mm to 1.6mm. The current target board thickness range is 1.0mm to 1.2mm. Since the thickness compatibility information covers the target board thickness range, the thickness compatibility comparison result is determined to be compliant. Next, the processing compatibility information for candidate PCB material B is read. If it covers drilling and lamination requirements, but only partially covers surface treatment requirements, the processing compatibility comparison result is determined to be critically compliant.

[0067] If the thickness adaptation comparison result is compliant and the processing compatibility comparison result is critically compliant, the two are combined to generate a structural supplementary comparison result that is critically compliant; then the structural foundation comparison result and the structural supplementary comparison result are further combined to generate a structural adaptation comparison result that is critically compliant.

[0068] If the transmission compatibility comparison result corresponding to candidate printed circuit board material B is found to be compliant, the environmental compatibility comparison result is found to be compliant, and the overall risk result is at the pass level, then after comprehensively judging the three comparison results in step 4015, the performance compatibility screening result can be determined as pass, and candidate printed circuit board material B can be retained in the preliminary candidate material set. This example illustrates that the structural compatibility comparison result does not determine whether to retain the material alone, but rather the performance compatibility screening result is jointly determined by the transmission compatibility comparison result, the environmental compatibility comparison result, and the overall risk result.

[0069] Step 4015: Based on the transmission adaptation comparison results generated in step 4012, the environment adaptation comparison results generated in step 4013, the structural adaptation comparison results generated in step 4014, and the comprehensive risk results and requirement item ranking results extracted in step 4011, a performance adaptability screening result is generated. The generation method includes: first, determining the comparison order of the transmission adaptation comparison results, environment adaptation comparison results, and structural adaptation comparison results according to the requirement item ranking results; when the ranking result at the top is non-compliant, the performance adaptability screening result is directly determined to be unqualified; when there are no non-compliant results but at least one critical compliance result exists, the comprehensive risk result is called for review; when the comprehensive risk result corresponds to the pass level, the performance adaptability screening result is determined to be pass; when the comprehensive risk result corresponds to the critical level or the fail level, the performance adaptability screening result is determined to be unqualified; when all comparison results are compliant, the performance adaptability screening result is determined to be pass.

[0070] Step 4016: Based on the performance compatibility screening results, perform performance compatibility screening on the retained candidate printed circuit board materials extracted in step 4011 to generate a preliminary candidate material record set; when the performance compatibility screening result is passed, the corresponding candidate printed circuit board material is retained in the preliminary candidate material record set; when the performance compatibility screening result is failed, the corresponding candidate printed circuit board material is removed from the retained candidate printed circuit board materials.

[0071] Step 4017: The preliminary candidate material record set, the performance adaptability screening results generated in step 4015, the verified material risk assessment result set generated in step 3016, and the enhanced verification identifier result generated in step 3013 are linked and organized to generate a preliminary candidate material set; in the preliminary candidate material set, each candidate printed circuit board material corresponds to a preliminary candidate material record, and each preliminary candidate material record includes at least a candidate printed circuit board material identifier, a performance adaptability screening result, a corresponding material risk assessment result, and an enhanced verification identifier result or a result without enhanced verification.

[0072] Economic evaluations are conducted based on the economic data corresponding to the preliminary candidate material set. Further screening is performed by combining supply guarantee data and feasibility requirements corresponding to the target application scenario to obtain a refined candidate material set. The purpose is to further evaluate and screen each candidate printed circuit board material within the scope of preliminary candidate materials that have passed the performance adaptability screening, by combining economic data, supply guarantee data, and feasibility requirements corresponding to the target application scenario, and to generate a refined candidate material set that can be directly called upon in subsequent multi-objective comprehensive evaluations.

[0073] In some implementations, the steps for obtaining a refined candidate material set include: Step 5011: Read the preliminary candidate material set generated in step 4017, and extract the candidate printed circuit board material identifier, performance adaptability screening result, material risk assessment result, and enhanced verification identifier result corresponding to each preliminary candidate material record; simultaneously acquire the economic data, supply guarantee data, and feasibility requirements corresponding to the target application scenario corresponding to each candidate printed circuit board material; organize the aforementioned extraction and acquisition results to generate an economic screening input set.

[0074] Step 5012: Perform economic data normalization and supply guarantee data normalization on the economic screening input set to generate economic comparison basis results and supply comparison basis results. The economic data normalization process includes: unifying cost information from different sources into the same cost caliber, unifying processing complexity information into the same complexity caliber, and unifying the impact of procurement cycle into the same cycle impact caliber. Based on the unified cost caliber, unified complexity caliber, and unified cycle impact caliber, economic comparison basis results are formed for each candidate printed circuit board material. Each economic comparison basis result includes at least the candidate printed circuit board material identifier, standardized cost value, standardized processing complexity value, and standardized cycle impact value. The standardized processing of supply assurance data includes: converting supply stability information, delivery fluctuation information, and alternative source information into comparable supply assurance evaluation criteria, and forming supply comparison criteria for each candidate printed circuit board material based on the unified supply stability criteria, unified delivery fluctuation criteria, and unified alternative source criteria; wherein each supply comparison criteria includes at least the candidate printed circuit board material identifier, standardized supply stability value, standardized delivery fluctuation value, and standardized alternative source value.

[0075] Step 5013: Based on the economic screening input set and the economic comparison results, generate batch purchase cost value, processing resource occupancy value, and supply preparation cycle value for each candidate printed circuit board material. The generation method includes: generating a batch purchase cost value based on material acquisition cost information and batch purchase adjustment information, wherein the batch purchase cost value is used to characterize the material acquisition cost level of the current candidate printed circuit board material under the target purchase batch; generating a processing resource occupancy value based on processing complexity information and process implementation constraints, wherein the processing resource occupancy value is used to characterize the processing input level of the current candidate printed circuit board material under the target application scenario; and generating a supply preparation cycle value based on purchase cycle information and target delivery cycle requirements, wherein the supply preparation cycle value is used to characterize the preparation cycle level required for the current candidate printed circuit board material to meet the target delivery requirements.

[0076] Step 5014: Based on the bulk purchase cost, processing resource occupancy, and supply preparation cycle, as well as the feasibility requirements read in step 5011, generate cost comparison results, processing comparison results, cycle comparison results, and economic comparison results; the generation methods include: First, the bulk purchase cost is compared with the target cost range and allowable cost deviation range corresponding to the cost control requirements to generate a cost comparison result. When the bulk purchase cost falls within the target cost range, the cost comparison result is determined to be compliant. When the bulk purchase cost exceeds the target cost range but falls within the allowable cost deviation range, the cost comparison result is determined to be critically compliant. When the bulk purchase cost exceeds the allowable cost deviation range, the cost comparison result is determined to be non-compliant.

[0077] The processing resource occupancy value is then compared with the target processing range corresponding to the batch production compatibility requirements, and with the allowable deviation range corresponding to the process implementation constraints, to generate a processing comparison result. Specifically, when the processing resource occupancy value falls within the target processing range and meets the process implementation constraints, the processing comparison result is determined to be compliant. When the processing resource occupancy value exceeds the target processing range but falls within the allowable deviation range, and there is no violation of the process implementation constraints, the processing comparison result is determined to be critically compliant. When the processing resource occupancy value exceeds the allowable deviation range, or there is a violation of the process implementation constraints, the processing comparison result is determined to be non-compliant.

[0078] The supply preparation cycle value is then compared with the target cycle range and the allowable deviation range corresponding to the target delivery cycle requirement to generate a cycle comparison result. When the supply preparation cycle value falls within the target cycle range, the cycle comparison result is determined to be compliant. When the supply preparation cycle value exceeds the target cycle range but falls within the allowable deviation range, the cycle comparison result is determined to be critically compliant. When the supply preparation cycle value exceeds the allowable deviation range, the cycle comparison result is determined to be non-compliant.

[0079] The cost comparison results, processing comparison results, and cycle comparison results are then combined to generate the economic comparison result. The combination method is as follows: when all three results are in compliance, the economic comparison result is determined to be in compliance; when none of the three results are in non-compliance but at least one of them is critically in compliance, the economic comparison result is determined to be critically in compliance; when any one of the three results is in non-compliance, the economic comparison result is determined to be in non-compliance.

[0080] Step 5015: Generate economic evaluation results based on the economic comparison results. The generation method is as follows: when the economic comparison results fall within the target range, the economic evaluation results are determined to be of the preferred level; when the economic comparison results exceed the target range but fall within the allowable deviation range, the economic evaluation results are determined to be of the retainable level; when the economic comparison results exceed the allowable deviation range, the economic evaluation results are determined to be of the rejection level; for candidate printed circuit board materials with enhanced verification results, the narrowed allowable deviation range is used in the economic evaluation.

[0081] Step 5016: Based on the economic screening input set generated in step 5011 and the supply comparison results generated in step 5012, generate supply stability comparison results, delivery fluctuation comparison results, alternative source comparison results, supply security screening results, implementation condition comparison results, and feasibility screening results for each candidate printed circuit board material; the generation methods include: The supply stability information is compared with the target supply stability range and the allowable deviation range corresponding to the supply guarantee requirements to generate a supply stability comparison result. Specifically, when the supply stability information falls within the target supply stability range, the supply stability comparison result is determined to be compliant; when the supply stability information exceeds the target supply stability range but falls within the allowable deviation range, the supply stability comparison result is determined to be critically compliant; and when the supply stability information exceeds the allowable deviation range, the supply stability comparison result is determined to be non-compliant.

[0082] The delivery fluctuation information is compared with the target delivery fluctuation range and the allowable deviation range corresponding to the target delivery cycle requirement to generate a delivery fluctuation comparison result. Specifically, when the delivery fluctuation information falls within the target delivery fluctuation range, the delivery fluctuation comparison result is determined to be compliant; when the delivery fluctuation information exceeds the target delivery fluctuation range but falls within the allowable deviation range, the delivery fluctuation comparison result is determined to be critically compliant; and when the delivery fluctuation information exceeds the allowable deviation range, the delivery fluctuation comparison result is determined to be non-compliant.

[0083] The alternative source information is compared with the target alternative source range and the allowable deviation range of the alternative source corresponding to the supply redundancy requirement to generate an alternative source comparison result. Among them, when the alternative source information falls within the target alternative source range, the alternative source comparison result is determined to be compliant; when the alternative source information exceeds the target alternative source range but falls within the allowable deviation range of the alternative source, the alternative source comparison result is determined to be critically compliant; when the alternative source information exceeds the allowable deviation range of the alternative source, the alternative source comparison result is determined to be non-compliant.

[0084] The results of the supply stability comparison, delivery fluctuation comparison, and alternative source comparison are then combined to generate the supply security screening results. The supply security screening result is determined to be passed when all three results are compliant. The supply security screening result is determined to be critically passed when none of the three results are non-compliant but at least one of them is critically compliant. The supply security screening result is determined to be non-compliant when any one of the three results is non-compliant.

[0085] Then, read the processing compatibility information, supply status information, and procurement cycle information corresponding to the current candidate printed circuit board material to generate implementation condition results; the implementation condition results are used to characterize the implementation capability status of the current candidate printed circuit board material in meeting the batch production compatibility requirements and process implementation constraints in the target application scenario.

[0086] The implementation condition results are compared with the target implementation range corresponding to the batch production compatibility requirements and the allowable deviation range corresponding to the process implementation constraints to generate an implementation condition comparison result. Among them, when the implementation condition results simultaneously meet the batch production compatibility requirements and the process implementation constraints, the implementation condition comparison result is determined to be compliant; when the implementation condition results partially meet the batch production compatibility requirements and the process implementation constraints, but do not exceed the allowable deviation range, the implementation condition comparison result is determined to be critically compliant; when the implementation condition results fail to meet the batch production compatibility requirements or violate the process implementation constraints, the implementation condition comparison result is determined to be non-compliant.

[0087] Then, based on the comparison results of implementation conditions, a feasibility screening result is generated; whereby, when the comparison result of implementation conditions is compliant, the feasibility screening result is determined to be passed; when the comparison result of implementation conditions is critically compliant, the feasibility screening result is determined to be critically passed; when the comparison result of implementation conditions is non-compliant, the feasibility screening result is determined to be failed.

[0088] As another example, for candidate printed circuit board material C, after performance compatibility screening, its economic and supply assurance data are further analyzed. Assume that under the target purchase volume, the batch purchase cost of candidate printed circuit board material C is 420 yuan per square meter, the processing resource occupancy is 1.15, and the supply preparation cycle is 18 days. For the current application scenario, the corresponding target cost range can be set, for example, to 300 to 400 yuan per square meter, with an acceptable variation range covering up to 450 yuan per square meter; the corresponding target cycle range can be set, for example, to within 15 days, with an acceptable variation range covering up to within 20 days. Therefore, the cost comparison result for candidate printed circuit board material C is determined to be critically met, and the cycle comparison result is also determined to be critically met.

[0089] If, based on the constraints of the process implementation, it is determined that the processing resource occupancy value is still within the target processing range, then the processing comparison result is determined to be compliant. Further combining the cost comparison result, processing comparison result, and cycle comparison result, the economic comparison result can be determined to be critically compliant, thus generating an economic assessment result of retainable level.

[0090] Continue reading the supply stability information, delivery fluctuation information, and alternative source information for candidate printed circuit board material C. If the comparison results for supply stability information are compliant, delivery fluctuation information are critically compliant, and alternative source information are compliant, then the supply assurance screening result is determined to be critically passed. Then, combining processing compatibility information, supply status information, and procurement cycle information, implementation condition results are generated. If the implementation condition results meet mass production compatibility requirements and do not violate process implementation constraints, then the feasibility screening result is determined to be passed.

[0091] If the economic assessment result is "retainable", the supply assurance screening result is "critically passed", and the feasibility screening result is "passed", then candidate printed circuit board material C can be retained in step 5017 and enter the refined candidate material set. This example illustrates that the economic assessment result, the supply assurance screening result, and the feasibility screening result jointly determine whether a refined candidate material is retained.

[0092] Step 5017: Based on the economic evaluation results, supply assurance screening results, and feasibility screening results, further screening processing is performed on the preliminary candidate material set to generate a refined candidate material record set. When the economic evaluation result is at the elimination level, the corresponding candidate printed circuit board material is removed from the preliminary candidate material set. When the supply assurance screening result or the feasibility screening result is unsuccessful, the corresponding candidate printed circuit board material is removed from the preliminary candidate material set. When the economic evaluation result is at the preferred level or the retainable level, and both the supply assurance screening result and the feasibility screening result are passed or critically passed, the corresponding candidate printed circuit board material is retained in the refined candidate material record set.

[0093] Step 5018: The refined candidate material record set, the verified material risk assessment result set generated in step 3016, the performance adaptability screening result generated in step 4015, the economic assessment result generated in step 5015, the supply guarantee screening result generated in step 5016, and the feasibility screening result generated in step 5016 are linked and organized to generate a refined candidate material set; in the refined candidate material set, each candidate printed circuit board material corresponds to one refined candidate material record, and each refined candidate material record includes at least the candidate printed circuit board material identifier, the corresponding risk assessment result, the corresponding performance adaptability screening result, the corresponding economic assessment result, the corresponding supply guarantee screening result, and the corresponding feasibility screening result.

[0094] Based on the risk assessment results, performance adaptability screening results, and economic evaluation results corresponding to the refined candidate material set, the multi-objective comprehensive evaluation results of each candidate printed circuit board material are determined and ranked according to the multi-objective comprehensive evaluation results. The purpose is to conduct a unified evaluation of the refined candidate materials that have passed further screening, convert the risk control level, performance adaptability level, and economic level into comparable multi-objective comprehensive evaluation results, and generate ranking results accordingly.

[0095] In some implementations, the steps for generating the sorting results include: Step 6011: Read the set of refined candidate materials generated in step 5018, and extract the candidate printed circuit board material identifier, risk assessment result, performance adaptability screening result, economic assessment result, and demand item ranking result generated in step 1017 corresponding to each refined candidate material record, and generate a comprehensive evaluation input set.

[0096] Step 6012: Based on the comprehensive evaluation input set, generate risk contribution priority results for each candidate printed circuit board material. The generation method includes: reading the comprehensive risk results, thermally related risk results, transmission-related risk results, and stability-related risk results from the corresponding risk assessment results, and determining the risk comparison order according to the requirement item sorting results; when the comprehensive risk result corresponds to the pass level, and there are no critical or fail levels in the individual risk results, the risk contribution priority result is determined to be high priority; when the comprehensive risk result corresponds to the critical level, or there is at least one critical level in the individual risk results, the risk contribution priority result is determined to be medium priority; when the comprehensive risk result corresponds to the fail level, the risk contribution priority result is determined to be low priority.

[0097] Step 6013: Based on the comprehensive evaluation input set, generate performance contribution priority results for each candidate printed circuit board material. The generation method includes: reading the corresponding performance adaptability screening results, transmission adaptability comparison results, environmental adaptability comparison results, and structural adaptability comparison results. When the performance adaptability screening result is passed, and the transmission adaptability comparison results, environmental adaptability comparison results, and structural adaptability comparison results are all compliant, the performance contribution priority result is determined to be high priority. When the performance adaptability screening result is passed, but there is a critical compliance among the three comparison results, the performance contribution priority result is determined to be medium priority. When the performance adaptability screening result is not passed, the performance contribution priority result is determined to be low priority.

[0098] Step 6014: Based on the comprehensive evaluation input set, generate economic contribution priority results for each candidate printed circuit board material. The generation method includes: reading the corresponding economic evaluation results, supply guarantee screening results, and feasibility screening results; when the economic evaluation result is at the preferred level, and both the supply guarantee screening results and the feasibility screening results are passed, the economic contribution priority result is determined to be high priority; when the economic evaluation result is at the retainable level, and there are no failures in the supply guarantee screening results and the feasibility screening results, the economic contribution priority result is determined to be medium priority; when the economic evaluation result is at the elimination level, or there are failures in the supply guarantee screening results and the feasibility screening results, the economic contribution priority result is determined to be low priority.

[0099] Step 6015: Generate a multi-objective comprehensive priority result based on the risk contribution priority result, performance contribution priority result, economic contribution priority result, and the demand item ranking result extracted in step 6011. The generation method includes: first, determining the comparison order of the risk contribution priority result, performance contribution priority result, and economic contribution priority result according to the demand item ranking result; when the priority result ranked first is low priority, the multi-objective comprehensive priority result is directly determined as low priority; when there is no low priority but there is at least one medium priority, the multi-objective comprehensive priority result is determined as medium priority; when all priority results are high priority, the multi-objective comprehensive priority result is determined as high priority.

[0100] Step 6016: Based on the multi-objective comprehensive priority result, sort the candidate printed circuit board materials in the refined candidate material set to generate a sorted record set. The sorting method includes: first, sorting according to the priority order of the multi-objective comprehensive priority result; when multiple candidate printed circuit board materials have the same multi-objective comprehensive priority result, further sorting according to the priority result corresponding to the first-ranked demand item in the demand item sorting result; when there are still the same order after the sub-sorting, further sorting according to the priority corresponding to the economic contribution priority result.

[0101] The purpose of determining the printed circuit board material selection result corresponding to the target application scenario based on the sorting results is to call the already generated sorting results, determine the target candidate printed circuit board material from the refined candidate materials, and generate printed circuit board material selection results that include the selection object and selection basis.

[0102] In some implementations, this step includes: Step 7011: Read the sorted record set and extract the top-ranked candidate printed circuit board material identifiers, multi-objective comprehensive priority results, risk assessment results, performance adaptability screening results, and economic assessment results to generate the final selection judgment input set.

[0103] Step 7012: Based on the final selection judgment input set, determine the target candidate printed circuit board material and generate the target candidate printed circuit board material determination result; when there is only one candidate printed circuit board material in the first order of the sorted record set, determine the candidate printed circuit board material as the target candidate printed circuit board material; when there are multiple candidate printed circuit board materials in the first order of the sorted record set, continue to read the risk assessment result, performance adaptability screening result and economic assessment result of the corresponding candidate printed circuit board material, and review and compare the results of the corresponding demand items ranked first in the demand item sorting result to determine the target candidate printed circuit board material.

[0104] Step 7013: Based on the determination results of the target candidate printed circuit board materials and the final selection judgment input set, generate a selection basis record. The generation method includes: reading the multi-objective comprehensive priority results, risk assessment results, performance adaptability screening results, and economic assessment results corresponding to the target candidate printed circuit board materials, and associating and organizing the above results with the target candidate printed circuit board material identifier, sorting position, and corresponding target application scenario identifier to form a selection basis record. The selection basis record is used to characterize the sorting basis and evaluation basis for determining the target candidate printed circuit board materials as the final selection objects.

[0105] Furthermore, to illustrate the generation process of the multi-objective comprehensive evaluation results, the ranking record set, and the final selection results, for example, the refined candidate material set includes candidate printed circuit board material A, candidate printed circuit board material B, and candidate printed circuit board material C. Specifically, candidate printed circuit board material A has a high priority for risk contribution, a medium priority for performance contribution, and a medium priority for economic contribution; candidate printed circuit board material B has a high priority for risk contribution, a high priority for performance contribution, and a medium priority for economic contribution; and candidate printed circuit board material C has a medium priority for risk contribution, a high priority for performance contribution, and a high priority for economic contribution.

[0106] When the priority ranking results of the current application scenario indicate that risk control takes precedence over performance adaptation, and performance adaptation takes precedence over economy, after comprehensively considering the above priority results, the multi-objective comprehensive priority result corresponding to candidate printed circuit board material B can be determined as high priority, the multi-objective comprehensive priority result corresponding to candidate printed circuit board material A can be determined as medium priority, and candidate printed circuit board material C can be determined as medium priority due to its lower risk contribution priority result; when further sorting according to the multi-objective comprehensive priority result, candidate printed circuit board material B is in the first order.

[0107] In steps 7011 to 7014, the risk assessment results, performance compatibility screening results, and economic evaluation results corresponding to candidate printed circuit board material B are read, and a final selection judgment input set is generated. Since candidate printed circuit board material B is in a high position in the sorted record set, and its risk assessment results and performance compatibility screening results meet the requirements of the current application scenario, candidate printed circuit board material B is determined as the target candidate printed circuit board material, and its corresponding selection basis record and printed circuit board material selection result are further generated. This example illustrates that the final selection result is formed by the continuous transmission of the refined candidate material set, various priority results, sorted record set, and final selection judgment input set.

[0108] Step 7014: Merge the target candidate printed circuit board material determination results and selection basis records to generate printed circuit board material selection results corresponding to the target application scenario; the printed circuit board material selection results include at least the target candidate printed circuit board material identifier, corresponding sorting position, multi-target comprehensive priority result, and corresponding selection basis records.

[0109] Example 2 See Figure 2 As shown, this embodiment provides a multi-objective optimized intelligent PCB material selection system. Since this system uses the multi-objective optimized intelligent PCB material selection method in Embodiment 1, it has the same effect, which will not be repeated here. The system includes: The candidate building module is used to obtain material property data of candidate printed circuit board materials and selection requirement data corresponding to the target application scenario, and to build a candidate material dataset based on the material property data and selection requirement data. The risk assessment module is used to conduct risk assessments on each candidate printed circuit board material based on the candidate material dataset, obtain the risk characterization results corresponding to each candidate printed circuit board material, and screen out candidate printed circuit board materials that do not meet the basic application conditions based on the risk characterization results, thereby obtaining the material risk assessment results. The performance screening module is used to screen the performance adaptability of each candidate printed circuit board material based on the material risk assessment results and selection requirements data, so as to obtain a preliminary set of candidate materials that meet the performance requirements of the target application scenario. The economic screening module is used to conduct economic evaluation based on the economic data corresponding to the preliminary candidate material set, and further screen the materials by combining supply security data and the feasibility requirements corresponding to the target application scenario to obtain a refined candidate material set. The comprehensive ranking module is used to determine the multi-objective comprehensive evaluation results of each candidate printed circuit board material based on the risk assessment results, performance adaptability screening results, and economic evaluation results corresponding to the refined candidate material set, and to rank them according to the multi-objective comprehensive evaluation results. The selection determination module is used to determine the selection results of printed circuit board materials corresponding to the target application scenario based on the sorting results.

[0110] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1. A multi-objective optimization-based intelligent PCB material selection method, characterized in that, include: Obtain material property data of candidate printed circuit board materials and selection requirement data corresponding to the target application scenario, and construct a candidate material dataset based on the material property data and selection requirement data; Based on the candidate material dataset, risk assessment is performed on each candidate printed circuit board material to obtain the risk characterization results for each candidate printed circuit board material. Based on the risk characterization results, candidate printed circuit board materials that do not meet the basic application conditions are screened out to obtain the material risk assessment results. Based on the material risk assessment results and selection requirements data, the performance adaptability of each candidate printed circuit board material is screened to obtain a preliminary set of candidate materials that meet the performance requirements of the target application scenario. An economic evaluation was conducted based on the economic data corresponding to the preliminary candidate material set, and further screening was carried out by combining supply security data and the feasibility requirements corresponding to the target application scenario to obtain a refined candidate material set. Based on the risk assessment results, performance compatibility screening results, and economic evaluation results corresponding to the refined candidate material set, the multi-objective comprehensive evaluation results of each candidate printed circuit board material are determined, and they are ranked according to the multi-objective comprehensive evaluation results. Based on the ranking results, the selection results for printed circuit board materials corresponding to the target application scenario are determined.

2. The multi-objective optimization intelligent PCB material selection method according to claim 1, characterized in that, Methods for constructing candidate material datasets include: Obtain the original material property data of candidate printed circuit board materials and generate an original material property record set; Perform attribute standardization processing on the original material attribute record set to generate a set of standardized attribute record items; perform attribute anomaly detection processing on the set of standardized attribute record items to generate a set of attribute anomaly identification results; Generate a standardized material property result set based on the standardized attribute record set; Obtain the original selection requirement record set corresponding to the target application scenario, and perform requirement normalization processing on the original selection requirement record set to generate normalized selection requirement results; By associating the standardized material property result set, the property anomaly identification result set, and the standardized selection requirement result, a candidate material dataset is constructed.

3. The multi-objective optimization intelligent PCB material selection method according to claim 2, characterized in that, Methods for obtaining risk characterization results for each candidate printed circuit board material include: Read the candidate material dataset and generate a set of thermally relevant input items, a set of transport-related input items, a set of stability-related input items, and a set of requirements comparison criteria; generate thermal expansion response quantities based on the thermally relevant input item set and the set of requirements comparison criteria, and generate thermally relevant risk results based on the thermal expansion response quantities; Based on the set of transmission-related input items and the set of demand comparison criteria, a transmission comparison benchmark result is generated. Based on the transmission comparison benchmark result, the propagation delay deviation and loss deviation are generated. Based on the propagation delay deviation and loss deviation, the transmission deviation is generated. Based on the transmission deviation, a transmission-related risk result is generated. Stability level values ​​are generated based on the set of stability-related input items and the set of requirements for comparison, and stability-related risk results are generated based on the stability level values. A comprehensive risk result is generated based on the results of thermal-related risks, transport-related risks, and stability-related risks. A risk characterization result is then generated based on the thermal expansion response, thermal-related risk results, transport deviation, transport-related risk results, stability level value, stability-related risk results, and comprehensive risk result.

4. The multi-objective optimization intelligent PCB material selection method according to claim 3, characterized in that, Methods for obtaining material risk assessment results include: Read the risk characterization results and selection requirements data; based on the risk characterization results and selection requirements data, determine the basic application conditions of candidate printed circuit board materials and generate the basic application conditions determination results; based on the basic application conditions determination results, perform screening processing on candidate printed circuit board materials to generate risk-retained materials; Based on the risk retention materials, the results of the basic application condition assessment, and the risk characterization results, the material risk assessment results are obtained by merging and organizing them.

5. The multi-objective optimization intelligent PCB material selection method according to claim 4, characterized in that, Methods for obtaining a preliminary set of candidate materials that meet the performance requirements of the target application scenario include: The system reads material risk assessment results, standardized selection requirements results, and standardized material property results. It extracts transmission deviation, transmission-related risk results, thermal expansion response, stability grade value, thermal-related risk results, and stability-related risk results from the material risk assessment results; it extracts transmission requirement items, environmental requirement items, and structural requirement items from the standardized selection requirements results; and it extracts thickness compatibility information and processing compatibility information from the standardized material property results. Based on the transmission deviation, transmission-related risk results, and transmission requirement items, it generates transmission compatibility comparison results. An environmental adaptability comparison result is generated based on the thermal expansion response, stability level value, thermal-related risk results, stability-related risk results, and environmental requirements. The structural adaptation comparison results are generated based on thermal expansion response, thickness adaptation information, processing compatibility information, and structural requirements. Based on the transmission adaptation comparison results, environmental adaptation comparison results, and structural adaptation comparison results, performance adaptability screening results are generated, and candidate printed circuit board materials are screened based on the performance adaptability screening results to obtain a preliminary candidate material set.

6. The multi-objective optimization intelligent PCB material selection method according to claim 1, characterized in that, Methods for obtaining a refined candidate material set include: Read the preliminary candidate material set and obtain the economic data, supply guarantee data and feasibility requirements for the target application scenarios for each candidate printed circuit board material; Based on relevant economic data, generate bulk purchase cost, processing resource occupancy, and supply preparation cycle values. Then, generate economic comparison results based on these values, and finally generate economic assessment results based on the economic comparison results. Supply assurance screening results are generated based on supply assurance data, and feasibility screening results are generated based on the implementation conditions and feasibility requirements of the candidate printed circuit board materials. Based on the results of the economic assessment, supply security screening, and feasibility screening, the preliminary candidate material set was further screened to obtain a refined candidate material set.

7. The multi-objective optimization intelligent PCB material selection method according to claim 1, characterized in that, The methods for determining the multi-objective comprehensive evaluation results of each candidate printed circuit board material include: Read the set of candidate refining materials; generate risk contribution priority results based on the risk assessment results corresponding to the set of candidate refining materials. Based on the performance compatibility screening results corresponding to the refining candidate material set, generate performance contribution priority results; based on the economic evaluation results corresponding to the refining candidate material set, generate economic contribution priority results. Based on the results of risk contribution priority, performance contribution priority, and economic contribution priority, the multi-objective comprehensive evaluation results of each candidate printed circuit board material are determined.

8. The multi-objective optimization intelligent PCB material selection method according to claim 7, characterized in that, Methods for ranking based on multi-objective comprehensive evaluation results include: According to the priority order corresponding to the multi-objective comprehensive evaluation results, the candidate printed circuit board materials in the refined candidate material set are sorted. When multiple candidate printed circuit board materials have the same multi-objective comprehensive evaluation results, they are further sorted according to the priority results of the first-ranked demand item in the demand item ranking results. If there are still records with the same ranking after the sub-sorting, they are further sorted according to the priority corresponding to the economic contribution priority result to obtain a sorted record set.

9. The multi-objective optimization intelligent PCB material selection method according to claim 8, characterized in that, Methods for determining the selection of printed circuit board materials for a target application scenario include: Read the sorted record set and generate the final selection input set based on the top-ranked candidate printed circuit board material identifiers, multi-objective comprehensive priority results, risk assessment results, performance adaptability screening results, and economic assessment results; The target candidate printed circuit board materials are determined based on the final selection judgment input set, and the target candidate printed circuit board materials determination results are generated. The selection criteria record is generated based on the results of the determination of target candidate printed circuit board materials and the final selection judgment input set; Based on the results of the determination of target candidate printed circuit board materials and the selection criteria, the selection results of printed circuit board materials corresponding to the target application scenario are determined according to the ranking results.

10. A multi-objective optimization intelligent PCB material selection system, used to implement the multi-objective optimization intelligent PCB material selection method according to any one of claims 1-9, characterized in that, The system includes: The candidate building module is used to obtain material property data of candidate printed circuit board materials and selection requirement data corresponding to the target application scenario, and to build a candidate material dataset based on the material property data and selection requirement data. The risk assessment module is used to conduct risk assessments on each candidate printed circuit board material based on the candidate material dataset, obtain the risk characterization results corresponding to each candidate printed circuit board material, and screen out candidate printed circuit board materials that do not meet the basic application conditions based on the risk characterization results, thereby obtaining the material risk assessment results. The performance screening module is used to screen the performance adaptability of each candidate printed circuit board material based on the material risk assessment results and selection requirements data, so as to obtain a preliminary set of candidate materials that meet the performance requirements of the target application scenario. The economic screening module is used to conduct economic evaluation based on the economic data corresponding to the preliminary candidate material set, and further screen the materials by combining supply security data and the feasibility requirements corresponding to the target application scenario to obtain a refined candidate material set. The comprehensive ranking module is used to determine the multi-objective comprehensive evaluation results of each candidate printed circuit board material based on the risk assessment results, performance adaptability screening results, and economic evaluation results corresponding to the refined candidate material set, and to rank them according to the multi-objective comprehensive evaluation results. The selection determination module is used to determine the selection results of printed circuit board materials corresponding to the target application scenario based on the sorting results.

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