Processing methods for printed circuit boards

Abstract

The present invention provides a method for processing printed circuit boards, comprising: preparing an acidic oxidizing agent solution, wherein the acidic oxidizing agent solution comprises ferrous oxide, nitric acid, and hydrochloric acid; placing the printed circuit board in the acidic oxidizing agent solution and controlling the immersion temperature and immersion time; and removing the printed circuit board and cleaning it. This processing method is highly efficient and effective, reducing surface corrosion and environmental pollution.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a method for processing printed circuit boards. Background Technology

[0002] With the continuous development of electronic technology, printed circuit boards (PCBs) have become an indispensable part of modern electronic products. PCB surface treatment is a crucial step, as its quality directly affects the PCB's performance and reliability. One of the most common problems encountered during production is PCB surface oxidation. Currently, PCB surface treatment primarily employs chemical methods. However, improving processing efficiency, reducing surface corrosion, and minimizing environmental pollution have been long-standing research topics in the industry.

[0003] It is necessary to provide an improved method for processing printed circuit boards to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide an improved method for processing printed circuit boards, which is highly efficient, effective, reduces surface corrosion, and lowers environmental pollution.

[0005] To achieve the above objectives, the printed circuit board processing method of the present invention includes the following steps:

[0006] An acidic oxidizing agent solution is prepared, the acidic oxidizing agent solution comprising: ferrous oxide, nitric acid, and hydrochloric acid;

[0007] The printed circuit board was placed in the acidic oxidant solution, and the immersion temperature and immersion time were controlled; and

[0008] Remove the printed circuit board and clean it.

[0009] Compared with existing technologies, this invention prepares a specific acidic oxidant solution, immerses the printed circuit board in the solution, and controls the immersion temperature and time to effectively clean oxides and other substances on the printed circuit board. This significantly reduces surface corrosion, achieves ideal treatment results, greatly shortens the treatment time, and does not cause environmental pollution, making it suitable for widespread application in the field.

[0010] Preferably, the hydrochloric acid has a volume percentage concentration of 15-20%.

[0011] Preferably, the volume percentage concentration of the nitric acid is 8-12%.

[0012] Preferably, the mass ratio of the ferrous oxide, the nitric acid, and the hydrochloric acid is 5:1:3.

[0013] Preferably, the immersion temperature is 30-45°C.

[0014] Preferably, the soaking time is 15-25 minutes.

[0015] Preferably, the cleaning is performed using deionized water at a temperature of 25-35°C. Detailed Implementation

[0016] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific implementation methods of this application are described in detail below with reference to some embodiments. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0017] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0018] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0019] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0020] The method for processing printed circuit boards according to the present invention will be further described below with reference to embodiments, but this does not limit the present invention. The method of the present invention aims to provide an improved method for processing printed circuit boards, which is highly efficient, effective, reduces surface corrosion, and lowers environmental pollution.

[0021] An acidic oxidizing agent solution is prepared, the acidic oxidizing agent solution comprising: ferrous oxide, nitric acid, and hydrochloric acid;

[0022] The printed circuit board was placed in the acidic oxidant solution, and the immersion temperature and immersion time were controlled; and

[0023] Remove the printed circuit board and clean it.

[0024] This invention prepares a specific acidic oxidant solution, immerses printed circuit boards in the solution, and controls the immersion temperature and time to effectively clean oxides and other substances on the printed circuit boards. This significantly reduces surface corrosion, achieves ideal treatment results, greatly shortens the treatment time, and does not cause environmental pollution, making it suitable for widespread application in the field.

[0025] In a specific embodiment, an acidic oxidant solution is first prepared. Specifically, ferrous oxide, nitric acid, and hydrochloric acid are used as raw materials and prepared in a specific ratio. In this application, dilute hydrochloric acid and dilute nitric acid are used. Preferably, the volume percentage concentration of hydrochloric acid is 15-20%, and the volume percentage concentration of nitric acid is 8-12%, to reduce environmental pollution while ensuring treatment effectiveness. Preferably, the mass ratio of ferrous oxide, nitric acid, and hydrochloric acid is 5:1:3, and the prepared acidic oxidant solution has good cleaning effect.

[0026] The immersion process for printed circuit boards involves placing the circuit boards in an acidic oxidizing solution, with optimized control of the immersion temperature and time. Specifically, to ensure effective cleaning, the solution temperature is 30-45℃. Preferably, the immersion time is 15-25 minutes, significantly shortening the processing time.

[0027] After soaking, remove the printed circuit board and clean it. Use clean water or deionized water to clean the PCB surface, ensuring no residue remains. The cleaning temperature should be 25-35℃.

[0028] Therefore, this invention effectively cleans oxides and other substances from printed circuit boards by preparing a specific acidic oxidant solution, immersing the printed circuit board in the solution, and controlling the immersion temperature and time. This significantly reduces surface corrosion, achieves ideal treatment results, greatly shortens the treatment time, and does not pollute the environment, making it suitable for widespread application in the field.

[0029] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A method for processing printed circuit boards, characterized in that... Includes the following steps: An acidic oxidizing agent solution is prepared, the acidic oxidizing agent solution comprising: ferrous oxide, nitric acid, and hydrochloric acid; The printed circuit board was placed in the acidic oxidant solution, and the immersion temperature and immersion time were controlled; and Remove the printed circuit board and clean it.

2. The method for processing printed circuit boards as described in claim 1, characterized in that, The hydrochloric acid has a volume percentage concentration of 15-20%.

3. The method for processing printed circuit boards as described in claim 1, characterized in that: The volume percentage concentration of the nitric acid is 8-12%.

4. The method for processing printed circuit boards as described in claim 1, characterized in that, The mass ratio of the ferrous oxide, the nitric acid, and the hydrochloric acid is 5:1:

3.

5. The method for processing printed circuit boards as described in claim 1, characterized in that, The soaking temperature is 30-45℃.

6. The method for processing printed circuit boards as described in claim 1, characterized in that, The soaking time is 15-25 minutes.

7. The method for processing printed circuit boards as described in claim 1, characterized in that: The cleaning process uses deionized water at a temperature of 25-35℃.