A hot pressing sintering apparatus for packaging high-power semiconductor devices

Abstract

This invention discloses a hot-pressing sintering apparatus for high-power semiconductor device packaging, relating to the field of semiconductor device packaging technology. It includes a body, on which energy equipment and a controller are mounted. A base plate is located on top of the body, and a top plate is located above the base plate. A lower support platform is located at the upper end of the base plate, and an upper pressure head that cooperates with the lower support platform is located above the lower support platform. The apparatus also includes: an annular gas curtain generating component, disposed at the upper end of the base plate and surrounding the lower support platform; and a fixing frame, disposed on the side wall of the body. This invention, through innovative design of the annular gas curtain generating component, sealing exhaust component, and waste gas heat recovery component, achieves comprehensive optimization of atmosphere, cavity cleanliness maintenance, and energy consumption. While improving the sintering quality and reliability of high-power semiconductor devices, it also considers energy conservation and environmental protection, possessing good engineering application prospects and market promotion value.

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