Robot for simultaneous substrate transfer

Abstract

An exemplary substrate processing system may include a transfer area housing defining an internal volume. The sidewalls of the transfer area housing may define sealable inlets and outlets for providing and receiving substrates. The system may include a plurality of substrate supports disposed within the transfer area. The system may also include a transfer device having a central hub, the central hub including a first axis and a second axis concentric with and rotatable in the opposite direction to the first axis. The transfer device may include a first termination actuator coupled to the first axis. The first termination actuator may include a plurality of first arms. The transfer device may also include a second termination actuator coupled to the second axis. The second termination actuator may include a plurality of second arms, the number of which is equal to the number of first arms of the first termination actuator.

Description

[0001] This application is a divisional application of the invention patent application filed on July 7, 2020, with application number "202080048665.3" and invention title "Robot for Simultaneous Substrate Transfer".

[0002] Cross-reference to related applications

[0003] This application claims priority to U.S. Provisional Patent Application No. 62 / 873,400, filed July 12, 2019, the contents of which are incorporated herein by reference in their entirety for all purposes.

[0004] This technology relates to the following applications, all filed simultaneously on July 12, 2019, and entitled: “ROBOTFOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,432), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,458), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,480), “MULTI-LID STRUCTUREFOR SEMICONDUCTOR PROCESSING SYSTEMS” (US Provisional Application No. 62 / 873,518), and “HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS (High-density substrate processing systems and methods) (U.S. Provisional Application No. 62 / 873,503). Each of these applications is incorporated herein by reference in its entirety for all purposes. Technical Field

[0005] This technology relates to semiconductor processes and equipment. More specifically, this technology relates to substrate processing systems. Background Technology

[0006] Semiconductor processing systems typically utilize clustering tools to integrate multiple processing chambers together. This configuration can facilitate the execution of several sequential processing operations without removing the substrate from the controlled processing environment, or it can allow similar processes to be performed simultaneously on multiple substrates in varying chambers. These chambers may include, for example, degassing chambers, pretreatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etching chambers, metering chambers, and other chambers. The combination of chambers in the clustering tool, along with the operating conditions and parameters for running these chambers, is selected to fabricate specific structures using specific processing formulations and processes.

[0007] Clustering tools typically process multiple substrates by continuously passing them through a series of chambers and performing processing operations. The processing recipes and sequences are usually programmed into a microprocessor controller, which guides, controls, and monitors the processing of each substrate through the clustering tool. Once an entire wafer cassette has been successfully processed by the clustering tool, it can be transferred to another clustering tool or a standalone tool, such as a chemical mechanical polisher, for further processing.

[0008] Typically, robotic arms are used to transfer wafers through various processing and holding chambers. The amount of time required for each process and handling operation directly impacts the substrate yield per unit time. The substrate yield in cluster tooling can be directly related to the speed of the substrate handling robotic arm positioned within the transfer chamber. As processing chamber configurations further evolve, conventional wafer transfer systems may become insufficient.

[0009] Therefore, there is a need for improved systems and methods that can be used to efficiently boot substrates within cluster tool environments. These and other needs are addressed by this technology. Summary of the Invention

[0010] An exemplary substrate processing system may include a transmission area housing defining a transmission area. The sidewalls of the transmission area housing may define sealable inlets and outlets for providing and receiving substrates. The system may include a plurality of substrate supports disposed within the transmission area. The system may also include a transmission device. The transmission device may include a central hub including a first axis and a second axis extending about and concentric with the first axis. The second axis may rotate counter-rotate to the first axis. The transmission device may include a first termination actuator coupled to the first axis. The first termination actuator may include a plurality of first arms, the number of which is equal to the number of substrate supports among the plurality of substrate supports. The transmission device may also include a second termination actuator coupled to the second axis. The second termination actuator may include a plurality of second arms, the number of which is equal to the number of first arms of the first termination actuator.

[0011] In some embodiments, the plurality of substrate supports may include at least four substrate supports. A second terminal actuator may be vertically offset from a first terminal actuator along a central hub. The first terminal actuator may also include a plurality of first end members, each coupled to a separate first arm of a plurality of first arms. The second terminal actuator may also include a plurality of second end members, each coupled to a separate second arm of a plurality of second arms. Each first end member and each second end member may extend vertically to a similar plane extending orthogonally to the central hub. Each first end member and each second end member may define recessed ledges and railings. Each first end member and each second end member may be characterized by an arcuate outer profile. Each first end member may include a force-generating plunger configured to releasably engage a substrate against a corresponding second end member. The central hub may be vertically translated along a central axis of the central hub.

[0012] Some embodiments of this technology may include a method for transferring a substrate. The method may include receiving a substrate at a first substrate support within a transfer area of ​​a substrate processing system. The substrate processing system may include a transfer device. The transfer device may include a central hub comprising a first axis and a second axis extending about and concentric with the first axis. The transfer device may include a first termination actuator coupled to the first axis, and the first termination actuator may include a plurality of first arms. The transfer device may also include a second termination actuator coupled to a second axis, and the second termination actuator may include a plurality of second arms. The method may include rotating the first axis about a central axis of the central hub in a first direction. The method may include rotating the second axis about the central axis of the central hub in a second direction. The method may include engaging the substrate with a first arm of a plurality of first arms and a second arm of a plurality of second arms. The method may include rotating the first and second arms together about a central axis to reposition the substrate. The method may also include delivering the substrate to a second substrate support of the substrate processing system.

[0013] In some embodiments, the method may include disengaging the substrate from the transport device by rotating a first axis about a central axis in a second direction and rotating a second axis about the central axis in the first direction. The method may include lifting the substrate from a first substrate support by vertically translating the transport device within a transport region after substrate bonding. The method may include recessing the first substrate support from the substrate after substrate bonding. A first terminal actuator may include a plurality of first end members, each coupled to a separate first arm of a plurality of first arms. A second terminal actuator may include a plurality of second end members, each coupled to a separate second arm of a plurality of second arms. Each first end member and each second end member may define a recessed ledge and a railing. Bonding the substrate may include railings of the first end members of the first arm and railings of the second end members of the second arm extending below the outer edge of the substrate. The substrate handling system may include at least four substrates, and bonding the substrates may include simultaneously bonding at least four substrates to the first terminal actuator and the second terminal actuator. The method may further include delivering the substrate to an alignment hub positioned between the first substrate support and the second substrate support before delivering the substrate to the second substrate support.

[0014] Some embodiments of this technology may include a substrate processing system comprising a transmission region housing defining a transmission region. Sidewalls of the transmission region housing may define sealable inlets and outlets for providing and receiving substrates. The system may include a plurality of substrate supports disposed within the transmission region. The system may include a transmission device. The transmission device may include a central hub including a first axis and a second axis extending about and concentric with the first axis. The second axis may rotate independently of the first axis. The transmission device may include a first terminal actuator coupled to the first axis. The first terminal actuator may include a plurality of first arms extending radially outward from the central hub to the distal end of each of the plurality of first arms. Each first arm may be characterized by an arcuate shape extending along a first arcuate path to the distal end of each first arm. The transmission device may include a second terminal actuator coupled to a second axis. The second terminal actuator may include a plurality of second arms extending radially outward from the central hub to the distal end of each of the plurality of second arms. Each second arm may be characterized by an arcuate shape extending along a second arcuate path to the distal end of each second arm. The second arc path can be a mirror image of the first arc path about a transverse axis extending from the central axis perpendicular to the central hub.

[0015] In some embodiments, the first terminal actuator may include a plurality of first end members, each first end member coupled to a separate first arm of a plurality of first arms. The second terminal actuator may further include a plurality of second end members, each second end member coupled to a separate second arm of a plurality of second arms. The central hub may translate vertically along the central axis of the central hub.

[0016] Such technologies can offer numerous advantages over conventional systems and techniques. For example, the processing system can provide increased transmission speeds compared to conventional designs. Additionally, the processing system can accommodate transmission areas with multiple rows of substrates. These and other embodiments, along with their many advantages and features, are described in more detail below with reference to the accompanying drawings. Attached Figure Description

[0017] A further understanding of the nature and advantages of the disclosed technology can be achieved by referring to the remainder of the specification and the accompanying drawings.

[0018] Figure 1A A schematic top view of an exemplary processing system according to some embodiments of the present technology is illustrated.

[0019] Figure 1B A schematic partial cross-sectional view of an exemplary chamber system according to some embodiments of the present technology is illustrated.

[0020] Figure 2 The illustration shows a schematic perspective view of the transmission area of ​​an exemplary chamber system according to some embodiments of the present technology.

[0021] Figures 3A to 3B A schematic cross-sectional view of an exemplary transmission device according to some embodiments of the present technology is illustrated.

[0022] Figure 4 The illustration shows exemplary operation of a method for a transmission substrate according to some embodiments of the present technology.

[0023] Figures 5A to 5H The illustration shows a schematic top view of a substrate being transmitted according to some embodiments of the present technology.

[0024] Figures 6A to 6B The illustration shows a schematic diagram of a substrate base according to some embodiments of the present technology.

[0025] Several accompanying drawings are included as illustrative purposes. It should be understood that the drawings are for illustrative purposes only and should not be considered to be to scale unless specifically stated otherwise. Furthermore, as illustrative drawings are provided to aid understanding, and may not include all aspects or information compared to the actual representation, and may include exaggerated material for illustrative purposes.

[0026] In the accompanying drawings, similar parts and / or features may have the same reference numerals. Furthermore, various parts of the same type may be distinguished by adding a letter after the reference numeral to differentiate between similar parts. If only the first reference numeral is used in the description, the description applies to any of the similar parts having the same first reference numeral, regardless of the letter. Detailed Implementation

[0027] Substrate processing can include time-intensive operations for adding, removing, or otherwise modifying materials on wafers or semiconductor substrates. Efficient substrate movement can reduce queuing time and increase substrate throughput. To increase the number of substrates processed in a clustering tool, additional chambers can be incorporated into the host. While it is possible to continuously add transfer robots and processing chambers by lengthening the tool, this can become space-inefficient as the footprint of the clustering tool increases. Therefore, this technology can include clustering tools with an increased number of processing chambers within a defined footprint. To accommodate a limited footprint with respect to a transfer robot, this technology can increase the number of processing chambers laterally outward from the robot. For example, some conventional clustering tools may include one or two processing chambers positioned around a centrally located portion of the transfer robot to maximize the number of chambers radially surrounding the robot. This technology can be extended on this concept by laterally incorporating additional chambers as another column or another set of chambers. For example, this technology can be applied with clustering tools comprising three, four, five, six, or more processing chambers accessible at each of one or more robot entry and exit positions.

[0028] However, due to the addition of additional processing locations, it may no longer be feasible for the central robot to move in and out of these locations without additional transfer functionality at each location. Some conventional techniques may include wafer carriers on which the substrate is held during transfer. However, wafer carriers can cause thermal inhomogeneities and particulate contamination on the substrate. This technique overcomes these problems by combining a transfer section vertically aligned with the processing chamber region and a disc conveyor or transfer device that can operate in conjunction with the central robot to move in and out of the additional wafer locations. In some embodiments, this technique may not use a conventional wafer carrier and may transfer a specific wafer from one substrate support to a different substrate support within the transfer region. Although the remainder of the disclosure will conventionally identify specific structures that can employ this structure and method, such as a four-position transfer region, it will be readily understood that the system and method are equally applicable to any number of structures and elements that can benefit from the explained transfer functionality. Therefore, the technique should not be considered as limited to use only with any particular structure. Moreover, although exemplary tool systems will be described as providing the basis for this technique, it should be understood that this technique can be combined with any number of semiconductor processing chambers and tools that can benefit from some or all of the operations and systems described herein.

[0029] Figure 1A The illustration shows a top view of one embodiment of a substrate processing tool or system 100 with deposition, etching, baking, and curing chambers according to some embodiments of the present technology. In the figure, a set of front-opening standard chambers 102 provide substrates of various sizes, which are received by robotic arms 104a and 104b within a factory interface 103 and placed into a load-locked or low-pressure holding region 106, and then delivered to one of the substrate processing regions 108 located in a chamber system or quad sections 109a-c, each of which may be a substrate processing system having a transport region fluidly coupled to multiple processing regions 108. Although a quad system is illustrated, it should be understood that platforms incorporating independent chambers, dual chambers, and other multi-chamber systems are also covered by the present technology. A second robotic arm 110, housed in transfer chamber 112, can be used to transfer a substrate wafer from holding region 106 to quadruple section 109 and back, and the second robotic arm 110 can be housed in the transfer chamber, with each quadruple section or processing system connectable to the transfer chamber. Each substrate processing region 108 can be configured to perform a number of substrate processing operations, including any number of deposition processes (including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition) as well as etching, pre-cleaning, annealing, plasma treatment, degassing, orientation, and other substrate processes.

[0030] Each quadruple section 109 may include a transfer area that can receive and deliver a substrate from a second robotic arm 110. The transfer area of ​​the chamber system may be aligned with a transfer chamber having the second robotic arm 110. In some embodiments, the transfer area may be laterally accessible to the robotic arm. In subsequent operations, components of the transfer section may vertically translate the substrate into the covered processing area 108. Similarly, the transfer area may also be operable for rotating the substrate between positions within each transfer area. The substrate processing area 108 may include any number of system components for depositing, annealing, curing, and / or etching a film of material on a substrate or wafer. In one configuration, two sets of processing areas (such as the processing areas in quadruple sections 109a and 109b) may be used for depositing material on the substrate, and a third set of processing chambers (such as the processing chambers or areas in quadruple section 109c) may be used for curing, annealing, or processing the deposited film. In another configuration, all three sets of chambers (such as all twelve chambers shown) may be configured to both deposit and / or cure films on the substrate.

[0031] As shown, the second robotic arm 110 may include two arms for simultaneously delivering and / or retrieving multiple substrates. For example, each quadruple section 109 may include two inlets 107 along a surface of the housing of the transfer area, which may be laterally aligned with the second robotic arm. The inlets and outlets may be defined along a surface adjacent to the transfer chamber 112. In some embodiments, such as those shown, the first inlet and outlet may be aligned with a first substrate support among the multiple substrate supports of the quadruple section. Additionally, the second inlet and outlet may be aligned with a second substrate support among the multiple substrate supports of the quadruple section. In some embodiments, the first substrate support may be adjacent to the second substrate support, and the two substrate supports may define a first row of substrate supports. As illustrated in the configuration, the second row of substrate supports may be positioned behind the first row of substrate supports, laterally outward from the transfer chamber 112. The two arms of the second robotic arm 110 may be spaced apart to allow both arms to simultaneously enter the quadruple section or chamber system to deliver or retrieve one or two substrates to substrate supports within the transfer area.

[0032] Any one or more of the described transfer regions can be combined with additional chambers separate from the manufacturing systems illustrated in different embodiments. It should be understood that processing system 100 can be considered as an additional configuration for chambers used for material film deposition, etching, annealing, and curing. Additionally, any number of other processing systems can be used in conjunction with this technology, which can be combined with transfer systems for performing any of specific operations such as substrate movement. In some embodiments, a processing system that can provide inlets and outlets to multiple processing chamber regions while maintaining a vacuum environment in various parts (such as the described holding and transfer regions) can allow operations to be performed in multiple chambers while maintaining a specific vacuum environment between discrete processes.

[0033] Figure 1B The illustration shows a schematic cross-sectional front view of one embodiment of an exemplary processing tool according to some embodiments of the present technology (such as through a chamber system). Figure 1B A cross-sectional view through any two adjacent processing regions 108 of any quadrant 109 can be illustrated. A front view may illustrate the configuration or fluid coupling of one or more processing regions 108 with the transfer region 120. For example, a continuous transfer region 120 may be defined by a transfer region housing 125. The housing may define an open internal space in which multiple substrate supports 130 may be disposed. For example, as... Figure 1A As shown, an exemplary processing system may include four or more substrate supports 130 distributed within a housing around a transmission region. As illustrated, the substrate supports may be bases, although many other configurations may also be used. In some embodiments, the bases may be vertically translatable between the transmission region 120 and a processing region covering the transmission region. The substrate supports may be vertically translatable along a path between a first and a second position within the chamber system along a central axis of the substrate support. Thus, in some embodiments, each substrate support 130 may be axially aligned with a covered processing region 108 defined by one or more chamber components.

[0034] An open transfer area provides the transfer device 135 (such as a disc conveyor belt) with the ability to engage and move substrates between various substrate supports (e.g., rotatably). The transfer device 135 can rotate about a central axis. This allows the substrate to be positioned for processing within any of the processing areas 108 within the processing system. The transfer device 135 may include one or more end actuators that can engage the substrate from above, below, or with the outer edge of the substrate to move about the substrate support. The transfer device can receive the substrate from a transfer chamber robot (such as the previously described robot 110). The transfer device can then rotate the substrate to alternate substrate supports to facilitate the delivery of additional substrates.

[0035] Once positioned and awaiting processing, the transfer device can position the terminal actuator or arm between the substrate supports, allowing the substrate supports to be lifted through the transfer device 135 and the substrate delivered into the processing area 108, which can be vertically offset from the transfer area. For example, and as shown, substrate support 130a can deliver the substrate into processing area 108a, while substrate support 130b can deliver the substrate into processing area 108b. This can occur with other two substrate supports and processing areas, as well as additional substrate supports and processing areas in embodiments that include additional processing areas. In this configuration, when operatively engaged, such as in a second position, to process the substrate, the substrate supports can define the processing area 108 at least partially from below, and the processing area can be axially aligned with the associated substrate support. The processing area can be defined from above by panel 140 and other cover stack components. In some embodiments, each processing area may have a separate cover stack component, although in some embodiments, the components may accommodate multiple processing areas 108. Based on this configuration, in some embodiments, each processing region 108 may be fluidly coupled to the transport region while being fluidly isolated from above from each other processing region within the chamber system or quadruple section.

[0036] In some embodiments, panel 140 may serve as an electrode for a system for generating localized plasma within processing region 108. As shown, each processing region may utilize or incorporate a separate panel. For example, panel 140a may be included to define processing region 108a from above, and panel 140b may be included to define processing region 108b from above. In some embodiments, a substrate support may serve as a companion electrode for generating capacitively coupled plasma between the panel and the substrate support. Depending on the volume geometry, pumping liner 145 may define processing region 108 at least partially radially or laterally. Similarly, a separate pumping liner may be used for each processing region. For example, pumping liner 145a may define processing region 108a at least partially radially, and pumping liner 145b may define processing region 108b at least partially radially. In embodiments, partition 150 may be positioned between cover 155 and panel 140, and may again include a separate partition to facilitate fluid distribution within each processing region. For example, partitions 150a may be included for distribution toward processing area 108a, and partitions 150b may be included for distribution toward processing area 108b.

[0037] The cover 155 may be a separate component for each processing region, or it may include one or more common aspects. In some embodiments, such as those shown, the cover 155 may be a single component defining a plurality of orifices 160 for delivering fluid to the respective processing regions. For example, the cover 155 may define a first orifice 160a for delivering fluid to processing region 108a, and the cover 155 may define a second orifice 160b for delivering fluid to processing region 108b. When additional processing regions are included within each portion, additional orifices may be defined for the additional processing regions within said portion. In some embodiments, each quadruple portion 109 or a multi-processing region portion that can accommodate more or fewer than four substrates may include one or more remote plasma units 165 for delivering plasma effluent into the processing chamber. In some embodiments, a separate plasma unit may be combined for each chamber processing region, although in some embodiments, fewer remote plasma units may be used. For example, as shown, a single remote plasma unit 165 may be used for multiple chambers, such as two, three, four or more chambers, up to all chambers of a particular quadruple portion. In embodiments of this technology, conduits can extend from the remote plasma unit 165 to each orifice 160 for delivering plasma effluent for processing or cleaning.

[0038] As indicated, processing system 100, or more specifically, a quadruple or chamber system combined with system 100 or other processing systems, may include a transmission area located below the processing chamber region shown. Figure 2 The illustration shows a schematic isometric view of an exemplary substrate processing system 200 according to some embodiments of the present technology. The illustrated system may include a transmission area housing 205 defining an internal volume or transmission area, which may include multiple components. The transmission area may additionally be at least partially comprised of a processing chamber (such as...) Figure 1A The processing chamber (shown as a quadrilateral 109) is defined from above. The sidewalls of the transfer area housing may define one or more access points 207 through which substrates can be delivered and retrieved (e.g., via the second robotic arm 110 as described above). In some embodiments, the access point 207 may be a slit valve or other sealable access point, including a door or other sealing mechanism to provide an airtight environment within the transfer area housing 205. Although two such access points 207 are illustrated, it should be understood that in some embodiments, only a single access point 207 may be included. It should also be understood that the substrate processing system 200 can be sized to accommodate any substrate size, including substrates of 200 mm, 300 mm, 450 mm, or larger or smaller, including substrates characterized by any number of geometries or shapes.

[0039] Within the housing 205 of the transmission area, there may be a plurality of substrate supports 210 positioned around the volume of the transmission area. Although four substrate supports are illustrated, it should be understood that embodiments of the present invention similarly cover any number of substrate supports. For example, according to embodiments of the present invention, more than or about three, four, five, six, eight or more substrate supports 210 may be accommodated in the transmission area. In some embodiments, the second robotic arm 110 may deliver substrates to one or both of substrate supports 210a or 210b via inlet / outlet 207, and may deliver substrates directly to a transmission device within the transmission area. Similarly, the second robotic arm 110 may retrieve substrates from these locations. A lifting rod 212 may protrude from the substrate support 210 and may allow the robotic arm to move under the substrate. In some embodiments, the lifting rod may be fixed to the substrate support, or fixed in a location where the substrate support may be recessed below it, or the lifting rod may additionally be raised or lowered via the substrate support. The substrate support 210 may be vertically translatable and, in some embodiments, may extend to a processing chamber (such as processing chamber 108) positioned above the transmission area housing 205.

[0040] The transfer area housing 205 can provide an inlet / outlet for the alignment system 215, which may include an aligner that extends through a hole in the transfer area as shown, and can operate in conjunction with a laser, camera, or other monitoring device protruding or transmitted through an adjacent hole, and can determine whether the translated substrate is correctly aligned. The transfer area housing 205 may also include a transfer device 220, which can operate in various ways to position and move substrates between various substrate supports. Although exemplary operation will be described below, in one example, the transfer device 220 can move substrates on substrate supports 210a and 210b to substrate supports 210c and 210d, which may allow additional substrates to be delivered into the transfer area.

[0041] The transmission device 220 may include a central hub 225, which may include one or more shafts extending into the transmission area. Coupled to the central hub may be a first terminal actuator 230 and a second terminal actuator 235. The first terminal actuator 230 may include a plurality of first arms 233 extending radially or laterally outward from the central hub. Similarly, the second terminal actuator 235 may include a plurality of second arms 237 extending radially or laterally outward from the central hub. Although illustrated with a central body having arms extending therefrom, each of the terminal actuators may additionally include a separate arm, each coupled to the central hub 225. Any number of arms may be included in embodiments of the art. In some embodiments, the number of first arms 233 may be similar to or equal to the number of substrate supports 210 included in the chamber, and the number of second arms 237 may be similar to or equal to the number of first arms 233. Thus, as shown, for four substrate supports, the transmission device 220 may include four arms for each of the first and second terminal actuators. The arm can be characterized by any number of shapes and profiles, such as straight profiles and curved profiles as shown in the figure. Although any profile can be used, in some embodiments, a curved profile can accommodate a substrate, and in some embodiments, the substrate can be circular.

[0042] When in use, the arcuate profile of the first arm of the first terminal actuator may be characterized by a specific arcuate profile extending along the edge of each first arm to the distal end of the first arm. Similarly, the second arm of the second terminal actuator may also be characterized by a specific arcuate profile extending along the edge of each second arm to the distal end. However, the arcuate profile of the second arm may be opposite to or a mirror image of the arcuate profile of the first arm, and the arcuate profile of the second arm may accommodate the opposite edges of the substrate being transmitted. A mirror image may be an axis extending radially or laterally outward from the central hub between the first arm of the first terminal actuator and the second arm of the second terminal actuator, such as an axis perpendicular to the central axis extending vertically through the central hub. Therefore, in some embodiments, the second terminal actuator may be an inverted version of the first terminal actuator, as shown in the figure.

[0043] The first terminal actuator 230 may additionally include a plurality of first end pieces 240. Each first end piece 240 may be coupled to a single first arm among a plurality of first arms 233. Similarly, the second terminal actuator 235 may additionally include a plurality of second end pieces 242. Each second end piece 242 may be coupled to a single second arm among a plurality of second arms 237. Each end piece may also be characterized by an arcuate outer profile to accommodate a circular or other arcuate substrate. The end pieces will be described in more detail below and may be used to contact the substrate during transmission or movement. The end pieces and the terminal actuator may be made of or comprise a variety of materials including conductive and / or insulating materials. In some embodiments, materials may be coated or plated to withstand contact with precursors or other chemicals that may enter the transmission area from the covered processing chamber.

[0044] Additionally, materials can be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support is operable to heat a substrate disposed on the support. The substrate support can be configured to increase the surface or substrate temperature to greater than or about 100°C, greater than or about 200°C, greater than or about 300°C, greater than or about 400°C, greater than or about 500°C, greater than or about 600°C, greater than or about 700°C, greater than or about 800°C, or higher. Any of these temperatures can be maintained during operation, and therefore components of the transmission device 220 may be exposed to any of these specified or covered temperatures. Therefore, in some embodiments, any material can be selected to accommodate the temperature range and may include materials such as ceramics and metals, which may be characterized by relatively low coefficients of thermal expansion or other beneficial properties. The component couplings can also be adapted to operate in high-temperature and / or corrosive environments. For example, when both the end effector and the end piece are ceramic, the coupling may include crimp fittings, snap-fit ​​fittings, or other fittings that may not contain additional materials such as bolts, which may expand and contract with temperature and potentially cause the ceramic to crack. In some embodiments, the end piece may be continuous with the end effector and may be integrally formed with the end effector. Any number of other materials that can facilitate or resist operation during operation may be utilized and are similarly covered by this technology.

[0045] The transmission device 220 may include multiple components and configurations that can facilitate movement of the terminal actuator, as will be further described below. Figures 3A to 3B The illustration shows a schematic cross-sectional view of an exemplary transmission device 220 according to some embodiments of the present technology, although it should be understood that any other configuration providing the independent rotational motion to be described is similarly covered by the present technology.

[0046] The central hub 225 may include a first axis 310 and a second axis 320, the second axis 320 being axially aligned with the first axis 310. For example, the first axis 310 and the second axis 320 may be concentric about a central axis extending vertically through the central hub. In some embodiments, the first axis 310 may extend through the second axis 320 or aspects thereof. Figure 3A As shown, the first axis 310 and the second axis 320 may be coaxial, although the two axes may be coupled to separate motors or drive systems. As shown, the first axis 310a may be coupled to a first drive system 312a, which may include a motor and allow rotation about a central axis. The first drive system 312a may cause the first terminal actuator 230 to rotate about the central axis in a first direction or in a second direction opposite to the first direction. Similarly, the second axis 320a may be coupled to a second drive system 314a, which may independently allow the second terminal actuator 235 to rotate about the central axis in either the first or second direction. In some embodiments, a vertical translation driver 325 may be included, which may allow the transmission device to translate vertically along the central axis. In some embodiments, this may facilitate lifting the substrate from a substrate support or a lifting rod, although in some embodiments, the lifting rod and / or substrate support may be used to raise and lower the substrate, and the transmission device 220 may not include a vertical drive mechanism.

[0047] Figure 3B Another embodiment of the transmission device 220 is illustrated, which can utilize a gearbox to facilitate reverse rotation of the first shaft 310b relative to the second shaft 320b. For example, the second shaft 320b can be coupled to a gearbox 330, which includes a gear set 332 having a first gear coupled to the first shaft 310b. As will be readily understood, driving the first gear in a first direction using a first drive system 312b will produce reverse rotation in an opposite gear, which can be coupled to the second shaft 320b and a second end effector 235. Additionally, a second drive system 314b can be coupled to components to rotate the gearbox and the first shaft together, which will facilitate the common rotation of the end effector. The figures also illustrate an optional vertical translation actuator 325, which can linearly move the transmission device up and down as described above. It should be understood that... Figures 3A to 3B This is merely an illustration of any number of configurations and components that can be used to independently rotate the first and second axes, thereby providing individual control of the first and second end actuators. Therefore, in some embodiments, the first and second axes can rotate together about a central axis, or the two axes can rotate in opposite directions relative to the other axis. This operation will be described in more detail below.

[0048] As shown in the two figures, in some embodiments, the first end effector 230 and the second end effector 235 may be vertically offset from each other along a central pivot. In some embodiments, this may cause associated components (such as the first end member and the second end member) to be offset. Therefore, the present technology can further modify the first end member and the second end member to accommodate the vertical offset of the first end effector and the second end effector, as will be further described below.

[0049] Figure 4 Exemplary operations in a method 400 of a transmission substrate according to some embodiments of the present technology are illustrated. For example, method 400 may be performed in one or more transmission systems, such as system 200, which may be incorporated into processing system 100. The method may include a plurality of optional operations as shown, which may or may not be particularly related to some embodiments of the method according to the present technology. Method 400 describes Figures 5A to 5H The operations illustrated in Figure 5 will be described in conjunction with the operations of method 400. It should be understood that Figure 5 is only a partial schematic diagram with limited details, and in some embodiments, the system may include more or less substrate supports and other components, as well as any alternative structural aspects that may still benefit from this technology.

[0050] Figure 5A The substrate processing system 500 described above may be illustrated and may include any of the features and aspects of the aforementioned substrate processing system 200, including any of the drive components previously discussed with respect to FIG. 3, and any other drive components as will be understood to be similarly covered by the present technology. Additionally, system 500 may be illustrated having a plurality of substrates 501 disposed within a chamber, for example, placed on a substrate support 510 as shown. The figures may illustrate the configuration of the present technology after the initial operation of method 400, which may include receiving substrates at a first substrate support 510a at operation 405 (e.g., via an inlet / outlet using a robot as described above). The robot may deliver one, two, or more substrates into a transfer area 505 to a substrate support near an inlet / outlet or slit valve. Transfer device 520 may rotate two substrates to opposing substrate supports and may deliver two additional substrates. It should be understood that the same process can be performed with any number of substrates, including delivering one substrate at a time into the processing chamber. Figure 5A As can be illustrated, after the four substrates have been positioned in the transmission area, the transmission device 520 can be positioned in a recessed configuration.

[0051] The transfer process can involve rotating the transfer device in various ways. For example, to join the substrate, the method may include rotating a first axis of the central hub in a first direction about the central axis of the central hub at operation 410. Before, after, or simultaneously, the method may include rotating a second axis in a second direction about the central axis of the second hub at operation 415. As previously described, the second direction may be a rotation opposite to the first direction. The rotation may continue until the first arm 533 of the first terminal actuator 530 and the second arm 537 of the second terminal actuator 535 join the substrate at operation 420, as... Figure 5B As shown.

[0052] Depending on whether the transmission device has vertical movement capability, movement and engagement may or may not include raising or lowering one or both of the substrate or the transmission device. Additionally, in some embodiments, engaging the substrate may include one or more operations encompassing passive engagement and active engagement. For example, as will be further explained below, the end members of the first and second end members may include various forms of facilitating engagement. In one form of passive engagement, the end members may define recessed ledges and railings on which the substrate may be placed. Thus, for such a configuration of end members, the first and second arms may rotate counter-rotate toward the substrate until the railing of each end member extends below the edge of the substrate. In an active engagement form, one or both of the end members may physically and / or forcibly engage the substrate, including compressing or clamping the substrate between the end members. When more than one substrate is engaged into the transmission area, as... Figure 5B As shown, substrates can be joined simultaneously. Because the arms can be equidistantly distributed around the central hub, the arms can be configured to join all substrates together.

[0053] Once the substrate has been engaged by the transfer device, one or more substrates can be completely transferred between the substrate support and the transfer device. For example, in some embodiments, the transfer device can lift the substrate in optional operation 425 and can raise the substrate from the substrate support or lifting rod on which the substrate can be placed. This can be done, for example, by vertically translating the transfer device. In some embodiments, the substrate support may be recessed away from one or more substrates to complete the transfer.

[0054] After the transfer to the transfer device is completed, the substrate can be rotated between substrate supports for further processing in different chambers, or the substrate can be delivered to a substrate support that can be accessed by a transfer robot (such as the second robotic arm 110 described above). Translation of one or more substrates can occur at operation 430, and as... Figure 5CAs shown in the figures. Although the figures illustrate counterclockwise rotation, it should be understood that in the embodiments, the substrate can rotate in either direction about the central axis. The rotational translation of the substrate can be performed by rotating the first arm 533 and the second arm 537 at a common rate to maintain the bonding of the substrate 501. As shown, the common rotation can occur along a second direction about the central axis. Therefore, the direction of rotation of the first axis can be reversed, while the rotation of the second axis can continue in the same direction as the direction used for bonding. Of course, if the substrate is translated along the first direction, the direction of axis rotation will also be reversed.

[0055] As previously described, the substrate processing system according to embodiments of the present technology may have a monitoring and alignment system, including an alignment hub 540 positioned between each pair of substrate supports. An additional access port 542 may allow a camera or laser to strike the substrate to identify misalignment, which may be based on recesses or other identifiers on the substrate. In some embodiments, an optional alignment operation may be performed on each substrate in the substrate at optional operation 435. In some embodiments, such as Figure 5D As shown, when the substrate has already been translated on the alignment device, the transfer device can release the substrate onto the aligner. Depending on how many substrates are to be transferred, one or more aligners can protrude into the transfer area and receive the substrates. Alignment adjustments can be made, and the transfer device can re-engage the substrates.

[0056] in addition, Figure 5D The diagram illustrates one aspect of a transfer region that accommodates the rotation of a substrate through a chamber. As shown, during rotation, the substrate can pass through a zenith position between adjacent substrate supports. Although the transfer region 505 can be linear, the rotation path can be elliptical or circular, as shown. In some embodiments, the transfer region 505 can be large enough to extend beyond the rotation path. However, in some embodiments, the transfer region 505 may include a receiving portion along the path, where a recess 550 may be formed in the wall of the transfer region to limit or prevent collisions between the translated substrate 501 and the wall of the transfer region. In some embodiments, such recesses 550 may be formed in each wall of the transfer region.

[0057] like Figure 5E As shown, the transfer device can continue to rotate the substrate 501 toward the substrate support to which it will be delivered. Although the transfer to an adjacent substrate support is illustrated in a counterclockwise direction, it should be understood that delivery to any other substrate support can be similarly performed in any rotational direction. At operation 440, the substrate 501 can be delivered to the second substrate support 510b, as... Figure 5FAs shown. Once delivered, the transfer device can detach the substrate from the transfer device. Again, the substrate can be lowered using the transfer device and / or the substrate support, or the lifting rod of the substrate support can engage the substrate to receive it from the transfer device.

[0058] Disengagement may also include rotating the first and second shafts in the opposite direction to the original movement to engage them. For example, as... Figure 5G As shown, the first axis is rotatable in the second direction, while the second axis is rotatable in the first direction, so that the first arm 533 of the first terminal actuator and the second arm 537 of the second terminal actuator are separated from each other and moved away from the substrate. Figure 5H As shown, the arm can be rotated into a recessed configuration to avoid interaction with the substrate support during further processing. Additionally, when the alignment hub 540 is included, such a position allows the arms of the first and second end actuators to be aligned on the alignment hub 540; for example, this can provide protection for the alignment hub to prevent particle buildup.

[0059] As previously mentioned, the transmission device may include passive or active bonding of substrates with different end-piece configurations. Figures 6A to 6B The accompanying drawings illustrate schematic diagrams of substrate bases according to some embodiments of the present technology. The drawings may include any aspect of the previously described system or transmission apparatus and may illustrate additional aspects of the previously illustrated components. Although the drawings may illustrate examples of both passive and active engagement, it should be understood that any number of variations may also be used and are similarly covered by the present technology.

[0060] Figure 6A An end view, such as at the distal end of the transmission device 600, is illustrated. The illustration may include the distal end of the first arm 633 of the first terminal actuator 630 and the distal end of the second arm 637 of the second terminal actuator 635. As previously described, the first terminal actuator 630 and the second terminal actuator 635 may be vertically offset from each other along a central pivot. Although the first terminal actuator 630 is illustrated above the second terminal actuator 635, it should be understood that these components may be inverted. As previously described, a first end member 640 may be coupled to the first arm 633 of the first terminal actuator 630, and a second end member 642 may be coupled to the second arm 637 of the second terminal actuator 635. Figure 6AThe illustration shows a passive bonding of substrate 601, in which a support surface is provided on which the substrate can be placed. Each of a first end member 640 and a second end member 642 may define a recessed ledge, the recessed ledge including a balustrade portion extending toward the associated end member for substrate support. The first end member 640 may define a balustrade 641 extending toward the associated second end member 642, and the second end member 642 may define a balustrade 643 extending toward the associated first end member 640. The balustrades may together form a wafer support surface around the two outer or radial edges of substrate 601.

[0061] Although in some embodiments the first and second end members may be similar components, in other embodiments the two components may be modified to account for vertical offset of the end effector. For example, despite vertical offset of the end effector, the first and second end members may extend vertically through the central axis of the central hub to a similar horizontal plane. Therefore, the first and second end members can compensate for the vertical offset to maintain or create a substantially planar surface for substrate support. Thus, the first end member 640 may extend vertically further than the second end member 642 to account for the offset. Therefore, through this accommodation, railings 641 and 643 can be aligned substantially along the horizontal plane.

[0062] Figure 6B Active engagement can be illustrated, which facilitates faster translation because the substrate may not move easily in active engagement. The illustration may show a transmission device 650 for supporting the substrate 651. Components of the device may include the distal end of the first arm 663 of the first terminal actuator 660 and the distal end of the second arm 667 of the second terminal actuator 665. Again, as previously stated, the first terminal actuator 660 and the second terminal actuator 665 may be vertically offset from each other along a central pivot, and although the first terminal actuator 660 is illustrated above the second terminal actuator 665, it should be understood that these components may be inverted. A first end member 670 may be coupled to the first arm 663 of the first terminal actuator 660, and a second end member 672 may be coupled to the second arm 667 of the second terminal actuator 665.

[0063] and Figure 6AUnlike other end pieces, the first end piece 670 and the second end piece 672 can be configured to contact the edge region of the substrate 651. The second end piece 672 can be configured to abut the surface of the end piece to receive the substrate and can include a material configured to support the contact between the substrate and the end piece within the environmental conditions of the transmission area. The first end piece 670 can be configured to apply force to the substrate 651 to mechanically, electrically, or otherwise place the substrate against the second end piece. For example, the first end piece 670 can include a spring-loaded or similar physical coupling plunger that can mechanically or otherwise force the substrate against the second end piece, and the first end piece 670 can include a roller 674 or other components for direct contact with the substrate. Additionally, the force-generating end piece can provide electrical coupling, for example, by electrostatically engaging the substrate along component 674; this electrical coupling can be conductive or can facilitate coupling. In such a configuration, with the first terminal actuator coupled to the inner shaft or the first axis, electrical wires can be delivered through the first axis of the central hub and led out to the first end piece 670 of each first arm without affecting any other components of the central hub. Any number of additional mechanical forces or attractive forces can be applied during transport within the substrate handling system to releasably bond the substrate.

[0064] This technology includes a substrate processing system that can accommodate additional substrate supports that, otherwise as previously described, might not be accessible to a centrally located transfer robot. By incorporating a transfer device according to an embodiment of this technology, multiple substrate supports can be utilized and accessed during substrate processing. When the transfer device includes a first and a second end effector as described throughout this technology, movements for engaging, transferring, and disengaging from the substrate can be performed along the outer edge of the substrate, which facilitates avoidance of lifting rods along the interior of the substrate supports. The system can also provide increased transfer speeds by maintaining the arms of the end effectors in external contact and recessed positions relative to the substrate.

[0065] In the foregoing description, numerous details have been set forth for illustrative purposes in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to those skilled in the art that certain embodiments may be practiced without some of these details or with the others.

[0066] Several embodiments have been disclosed, and those skilled in the art will recognize that various modifications, alternative constructions, and equivalents can be used without departing from the spirit of the embodiments. Furthermore, to avoid unnecessarily obscuring the art, many well-known processes and elements have not been described. Therefore, the above description should not be considered as limiting the scope of the art. Additionally, methods or processes may be described as sequential or step-by-step, but it should be understood that operations may be performed simultaneously or in a different order than those listed.

[0067] Where a range of values ​​is provided, it should be understood that, unless the context explicitly indicates otherwise, every intermediate value between the upper and lower limits of the range, up to the smallest portion of the lower limit unit, is also specifically disclosed. Any narrower range between any stated or unstated intermediate values ​​within the stated range, as well as any other stated or intermediate values ​​within the stated range, are covered. The upper and lower limits of those smaller ranges may be independently included in or excluded from the range, and each range in which any, neither, or both of the limits are included is also covered within this art, limited by any specifically excluded limits in the stated range. Where the stated range includes one or both of the limits, the range excluding one or both of those limits is also included.

[0068] As used herein and in the appended claims, the singular forms “a,” “an,” and “the” include plural references unless the context clearly indicates otherwise. Thus, for example, a reference to “substrate” includes a reference to a plurality of such substrates, and a reference to “arm” includes a reference to one or more arms and their equivalents known to those skilled in the art, and so on.

[0069] Furthermore, when used in this specification and the appended claims, the terms “comprise(s)”, “comprising”, “contain(s)”, “containing”, “include(s)”, and “including” are intended to specify the presence of the stated feature, integer, component, or operation, but they do not exclude the presence or addition of one or more other features, integers, components, operations, actions, or groups.

Claims

1. A substrate processing system, comprising: A transmission area housing that defines a transmission area, wherein the sidewalls of the transmission area housing define sealable inlets and outlets for providing and receiving substrates; Multiple substrate supports are disposed within the transmission area; as well as Transmission device, the transmission device comprising: A central hub, comprising a first axis and a second axis extending around and concentric with the first axis, wherein the second axis rotates counter-rotatingly to the first axis. A first terminal actuator, coupled to the first shaft, includes a plurality of first arms, the number of which is equal to the number of substrate supports among the plurality of substrate supports, wherein: The first terminal actuator further includes a plurality of first terminal elements; and Each of the plurality of first end members includes a first contact member on the lateral surface of the bonding substrate, and A second terminal actuator, coupled to the second shaft, includes a plurality of second arms, the number of which is equal to the number of first arms of the first terminal actuator, wherein: The second terminal actuator further includes a plurality of second end members; and Each of the plurality of second end members includes a second contact member that engages the lateral surface of the substrate.

2. The substrate processing system of claim 1, wherein each first contact member includes a roller.

3. The substrate processing system as described in claim 1, wherein: Each first contact component includes a conductive material; Each first contact member is coupled to one or more electrical wires; and Each first contact member generates an electrostatic force to bond the substrate.

4. The substrate processing system of claim 3, wherein one or more electrical wires extend through the first axis.

5. The substrate processing system of claim 1, wherein each first contact member and each second contact member extends vertically to a similar plane extending orthogonally to the central hub.

6. The substrate processing system of claim 1, wherein the first terminal actuator and the second terminal actuator are vertically offset from each other along the central pivot.

7. The substrate processing system of claim 1, wherein each of the plurality of first end members includes a spring-loaded plunger coupled to a corresponding first contact member of the first contact member.

8. The substrate processing system of claim 1, wherein each first end member is configured to releasably engage the edge of the substrate against a corresponding second end member.

9. The substrate processing system of claim 1, wherein the central hub is vertically translated along the central axis of the central hub.

10. A method for transmitting a substrate, the method comprising: A substrate is received at a first substrate support within the transmission area of ​​a substrate processing system, the substrate processing system including a transmission device, the transmission device comprising: The central hub includes a first axis and a second axis, the second axis extending around and concentric with the first axis. A first terminal actuator, coupled to the first shaft, includes a plurality of first arms, wherein: The first terminal actuator further includes a plurality of first terminal elements; and Each of the plurality of first end members includes a first contact member on the lateral surface of the bonding substrate, and A second terminal actuator, coupled to the second shaft, includes a plurality of second arms, the number of which is equal to the number of first arms of the first terminal actuator, wherein: The second terminal actuator further includes a plurality of second end members; and Each of the plurality of second end members includes a second contact member that engages the lateral surface of the substrate; The first axis is rotated about the central axis of the central hub in a first direction; The second axis is rotated in a second direction about the central axis of the central hub; The lateral surface of the substrate is engaged with the first contact member of the first corresponding arm of the plurality of first arms and the second contact member of the second corresponding arm of the plurality of second arms; The first and second corresponding arms are rotated together about the central axis to reposition the substrate; and The substrate is delivered to the second substrate support of the substrate processing system.

11. The method for a transmission substrate as claimed in claim 10, further comprising: The substrate is disengaged from the transmission device by rotating the first axis about the central axis in the second direction and rotating the second axis about the central axis in the first direction.

12. The method for a transmission substrate as claimed in claim 10, further comprising: After the substrate is joined, the substrate is lifted from the first substrate support by vertically translating the transmission device within the transmission area.

13. The method for a transmission substrate as claimed in claim 10, further comprising: After the substrate is joined, the first substrate support is recessed from the substrate.

14. The method of transmitting a substrate as claimed in claim 10, wherein engaging the lateral surface of the substrate comprises applying an electrostatic force to the substrate via the first contact member of the first corresponding arm.

15. The method of transmitting a substrate as claimed in claim 14, wherein the lateral surface of the substrate includes a spring-loaded plunger coupled to the first contact member of the first corresponding arm to mechanically apply force to press the lateral surface of the substrate against the second contact member of the second arm.

16. The method for transmitting a substrate as claimed in claim 10, wherein the substrate processing system includes at least one substrate, and wherein bonding the substrate includes simultaneously bonding at least four substrates using the first terminal actuator and the second terminal actuator.

17. The method for a transmission substrate as claimed in claim 10, further comprising: Before delivering the substrate to the second substrate support, the substrate is delivered to an alignment hub located between the first substrate support and the second substrate support.

18. A substrate processing system, comprising: A transmission area housing that defines a transmission area, wherein the sidewalls of the transmission area housing define sealable inlets and outlets for providing and receiving substrates; Multiple substrate supports are disposed within the transmission area; as well as Transmission device, the transmission device comprising: A central hub, comprising a first axis and a second axis extending around and concentric with the first axis, wherein the second axis is rotatable independently of the first axis. A first terminal actuator, coupled to the first shaft, includes a plurality of first arms extending radially outward from the central pivot to the distal end of each of the plurality of first arms, wherein: Each first arm is characterized by an arcuate shape extending along a first arcuate path to the distal end of each first arm; The first terminal actuator further includes a plurality of first terminal elements; and Each of the plurality of first end members includes a first contact member on the lateral surface of the bonding substrate, and A second terminal actuator, coupled to the second shaft, includes a plurality of second arms extending radially outward from the central pivot to the distal end of each of the plurality of second arms, wherein: The second terminal actuator further includes a plurality of second end pieces; Each of the plurality of second end members includes a second contact member that engages the lateral surface of the substrate; Each second arm is characterized by an arcuate shape extending along the second arcuate path to the distal end of each second arm; and The second arcuate path is a mirror image of the first arcuate path about a transverse axis extending from the central axis perpendicular to the central axis.

19. The substrate processing system of claim 18, wherein the central hub is vertically translatable along the central axis of the central hub.

20. The substrate processing system of claim 18, wherein the plurality of substrate supports comprises at least four substrate supports.

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