Polishing pad forming macroscopically ordered abrasive pre-distribution and method of making same

Abstract

The present application relates to a kind of polishing pad of macroscopically ordered abrasive pre-distribution and its preparation method.Compared with prior art, by laying the groove of ordered distribution on the polishing pad body, solid abrasive is formed in the groove, the position distribution of abrasive particles can be fixed, and the fixed distribution of abrasive particles can also be maintained due to solid abrasive.The combination of traditional flow abrasive and polishing pad body is converted into the fixed combination of solid abrasive and polishing pad body by polishing the semiconductor workpiece with the flush solid abrasive and polishing pad body together, a stable contact interface between polishing pad and wafer surface is provided, the process fluctuation caused by the flow variability of traditional polishing pad is effectively reduced, more accurate control of material removal rate and higher wafer surface flatness are achieved, higher polishing removal rate and lower surface roughness can be achieved, and the polishing effect of polishing pad on semiconductor workpiece is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer grinding and polishing technology in semiconductors, and in particular to a polishing pad for forming a macroscopically ordered abrasive pre-distribution and its preparation method. Background Technology

[0002] With the development of artificial intelligence, the demand for computing power is increasing, and semiconductor chip manufacturing processes have entered the 3nm or even higher stages. Polishing pads are one of the core consumables in the Chemical Mechanical Polishing (CMP) process and a key technology for semiconductor wafer surface processing. CMP is a process that combines chemical etching and mechanical friction. Polishing pads bear the functions of mechanical friction and carrying polishing fluid, and their structure has a significant impact on the polishing effect.

[0003] Traditional polishing pads consist of a pad body and grooves formed on the pad body. These grooves allow polishing slurry containing abrasive particles to flow through. When polishing semiconductor workpieces with a traditional polishing pad, the polishing slurry, situated between the workpiece surface and the pad, polishes the workpiece. However, the slurry flows freely across the pad body and within the grooves, making it difficult to maintain a stable distribution of the abrasive particles in contact with the workpiece. This uneven distribution results in a poor polishing effect. Summary of the Invention

[0004] The purpose of this invention is to overcome the defects of the prior art and provide a polishing pad that forms a macroscopically ordered abrasive pre-distribution and its preparation method.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] According to the present invention, a polishing pad for forming a macroscopically ordered abrasive pre-distribution is characterized in that it includes a polishing pad body, wherein a plurality of grooves are formed on the polishing surface of the polishing pad body, the plurality of grooves are orderly distributed on the polishing surface of the polishing pad body, and the grooves are filled with solid abrasive material containing distributed abrasive particles, and the solid abrasive material is flush with the polishing surface of the polishing pad body.

[0007] Compared to existing technologies, this invention lays pre-distributed grooves on the polishing pad body, forming solid abrasive particles distributed within these grooves. This fixes the positional distribution of the abrasive particles, achieving a uniform and stable distribution of the solid abrasive. Furthermore, the abrasive particles remain in a fixed distribution due to the solid abrasive, transforming the traditional flow-oriented combination of abrasive and the polishing pad body into a fixed combination of solid abrasive and the polishing pad body. The flush solid abrasive and the polishing pad body work together to polish the semiconductor workpiece, providing a stable contact interface between the polishing pad and the wafer surface. This effectively reduces process fluctuations caused by the flow variability of traditional polishing pads, enabling more precise control of the material removal rate and higher wafer surface flatness. It achieves higher grinding removal rates and lower surface roughness, improving the polishing effect of the polishing pad on semiconductor workpieces. It is particularly suitable for advanced chip manufacturing nodes with extremely high flatness requirements, and it minimizes abrasive waste and polishing pad body wear. Additionally, the mass concentration, composition, groove shape, arrangement, and size distribution of the solid abrasive can be adaptively adjusted according to different semiconductor workpieces.

[0008] Preferably, the abrasive particles are injected into the slots and solidified to form the solid abrasive material.

[0009] Preferably, the solid abrasive further includes a polymer, the polymer and the abrasive particles are mixed to form an abrasive slurry, and the abrasive slurry is injected into the groove and cured to form the solid abrasive.

[0010] Preferably, the solid abrasive further includes sulfides, which are mixed in the abrasive slurry so that the abrasive slurry is fixed by sulfidation of the sulfides to form the solid abrasive.

[0011] Preferably, the abrasive slurry, the sulfide, and the grooves of the polishing pad body form a reactive fixation connection.

[0012] Preferably, the polymer is a polyurethane prepolymer, or a mixture of isocyanate and polyol;

[0013] The polishing pad is at least one of polyurethane and polyacrylic acid;

[0014] The sulfide includes a crosslinking agent or a chain extender, and the sulfidation temperature is 50℃-250℃ and the sulfidation time is 0.5h-36h.

[0015] Preferably, the abrasive particles include at least one of silicon dioxide, cerium dioxide, diamond, aluminum oxide, and zirconium dioxide;

[0016] And / or, the shape of the abrasive particles is at least one of spherical or polyhedral spheres;

[0017] And / or, the mass concentration of the solid abrasive is 0.1%-100%, and the mass concentration of the solid abrasive is the percentage of the mass of the abrasive particles to the total mass of the solid abrasive.

[0018] Preferably, the orderly distribution of the slots is a horizontal arrangement and / or a vertical arrangement;

[0019] And / or, the opening of the slot is circular.

[0020] Preferably, the diameter of the opening of the slot is 0.1~20mm;

[0021] And / or, the depth of the groove is 1% to 99% of the actual thickness of the polishing pad body;

[0022] And / or, the distance between the openings of adjacent slots is 1 to 100 times the diameter of the opening.

[0023] The present invention also provides a method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, for preparing any of the above-described polishing pads with a macroscopically ordered abrasive pre-distribution, comprising the following steps:

[0024] Step S1: Select the polishing pad body of the target material, and process the grooves on the polishing pad body in an orderly manner to lay the grooves on the polishing pad body.

[0025] Step S2: Clean the polishing pad body using a brush cleaning device to remove impurities from the grooves and the surface of the polishing pad body;

[0026] Step S3: Inject abrasive particles into each groove of the cleaned polishing pad body by liquid injection;

[0027] Step S4: Place the polishing pad body containing the injected abrasive particles in a preset temperature environment for a preset time to cure, so that the abrasive particles in the grooves are completely cured to form solid abrasive material.

[0028] Step S5: Use a grinding device to grind the surface of the polishing pad body to remove the solid abrasive material that exceeds the surface of the polishing pad body, so that the top of the solid abrasive material in the groove is flush with the surface of the polishing pad body. Attached Figure Description

[0029] Figure 1 This is a top view of the perforated polishing pad of the present invention;

[0030] Figure 2 This is a side view of the perforated polishing pad of the present invention;

[0031] Figure 3 A top view of the perforated polishing pad of the present invention after the abrasive slurry has been injected and cured;

[0032] Figure 4 This is a side view of the perforated polishing pad of the present invention after the abrasive slurry has been injected and cured.

[0033] Reference numerals: 1. Polishing pad body; 2. Groove; 3. Solid abrasive; 301. Abrasive particle; 302. Polymer. Detailed Implementation

[0034] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0035] This specification also provides an embodiment of a polishing pad for forming a macroscopically ordered abrasive pre-distribution, such as... Figure 1 and Figure 3 As shown, the device includes a polishing pad body 1. Multiple slots 2 are formed on the polishing surface of the polishing pad body 1. These slots 2 are arranged in an orderly manner on the polishing surface of the polishing pad body 1, and are filled with solid abrasive material 3 containing distributed abrasive particles 301. The solid abrasive material 3 is flush with the polishing surface of the polishing pad body 1. The solid abrasive material 3 containing the distributed abrasive particles 301 can be a silica abrasive column.

[0036] In one embodiment, such as Figure 3 and Figure 4 As shown, abrasive particles 301 are injected into the groove 2 and solidified to form solid abrasive material 3. It can be solidified from 100% mass concentration silica abrasive slurry (magma-like) to form solid abrasive material 3 with abrasive particles 301 distributed thereon; or it can be solid abrasive particles 301 bonded together with an adhesive and solidified to form solid abrasive material 3 with abrasive particles 301 distributed thereon.

[0037] In one embodiment, such as Figure 3 and Figure 4 As shown, the solid abrasive 3 also includes polymer 302. The polymer 302 and abrasive particles 301 are mixed to form an abrasive slurry. The abrasive slurry is injected into the groove 2 and cured to form the solid abrasive 3.

[0038] In one embodiment, such as Figure 3 and Figure 4 As shown, the solid abrasive 3 also includes sulfides, which are mixed in the abrasive slurry so that the abrasive slurry is fixed by sulfidation to form the solid abrasive 3.

[0039] In one embodiment, such as Figure 3 and Figure 4 As shown, the grinding slurry, sulfide, and the groove 2 of the polishing pad body 1 undergo a chemical reaction to become fixedly connected.

[0040] In one embodiment, such as Figure 3 and Figure 4 As shown, polymer 302 is a polyurethane prepolymer, or a mixture of isocyanate and polyol; the polishing pad is at least one of polyurethane and polyacrylic acid; the vulcanizate includes a crosslinking agent or chain extender, and the vulcanization temperature is 50℃-250℃ and the vulcanization time is 0.5h-36h. The vulcanization time and temperature are determined based on the mass concentration and composition of the solid abrasive 3.

[0041] In one embodiment, such as Figure 3 and Figure 4 As shown, the abrasive particles 301 include at least one of silicon dioxide, cerium dioxide, diamond, aluminum oxide, and zirconium dioxide; and / or, the shape of the abrasive particles 301 is at least one of spherical or polyhedral spherical; and / or, the mass concentration of the solid abrasive 3 is 0.1%-100%, wherein the mass concentration of the solid abrasive is the percentage of the mass of the abrasive particles to the total mass of the solid abrasive.

[0042] In one embodiment, such as Figure 1 and Figure 2 As shown, the orderly distribution of slots 2 is either horizontal or vertical; and / or, the opening shape of slots 2 is circular.

[0043] In one embodiment, such as Figure 1 and Figure 2 As shown, the diameter of the opening of the slot 2 is 0.1~20mm; and / or, the depth of the slot 2 is 1%~99% of the actual thickness of the polishing pad body 1; and / or, the distance between the openings of adjacent slots 2 is 1~100 times the diameter of the opening.

[0044] This specification also discloses a method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, used to prepare any of the polishing pads with a macroscopically ordered abrasive pre-distribution described in the above embodiments, such as... Figure 1 , Figure 3 and Figure 4 As shown, it includes the following steps:

[0045] Select a polishing pad of appropriate thickness and grooves, drill holes, and clean:

[0046] Step S1: Select the polishing pad body 1 of the target material, and process the grooves 2 on the polishing pad body 1 in an orderly manner so as to lay the grooves 2 on the polishing pad body 1.

[0047] The polishing pad material includes, but is not limited to, polyurethane polishing pads and polyacrylic polishing pads. The polishing pad is perforated with grooves 2 of a specific diameter and depth according to an optimal pattern, and these grooves are arranged in a specific pattern. During the perforation process, the grooves 2 are cylindrical in shape. The pattern distribution, diameter, and depth of the grooves 2 are, for example, as follows: the groove diameter is 0.1-100 mm, more preferably 0.1-20 mm; the groove depth is 1%-99% of the actual thickness of the polishing pad; and the distance between the grooves 2 is 1-100 times the diameter of the grooves 2.

[0048] Step S2: Clean the polishing pad body 1 using a brush cleaning device to remove impurities from the grooves 2 and the surface of the polishing pad body 1, thus cleaning the perforated polishing pad. During the cleaning process, the automated brush cleaning device cleans the impurities in the grooves 2 of the polishing pad, ensuring that there are no impurities or particles inside the grooves 2.

[0049] Select appropriate abrasive particles or abrasive slurry and inject them into each of the slots 2: Step S3: Inject abrasive particles 301 or abrasive slurry into each cavity 2 of the cleaned polishing pad body 1. The cleaned polishing pad containing the cavities 2 is injected with a certain mass concentration of abrasive slurry or particles into the cavities 2 via liquid injection. During the injection of abrasive particles or slurry into the cavities 2, the liquid is injected into each cavity 2 individually through the liquid injection head, and the injection level needs to be flush with the surface of the polishing pad. Abrasive particles or slurry include, but are not limited to, the following: materials include, but are not limited to, silicon dioxide, cerium dioxide, diamond, aluminum oxide, zirconium dioxide, etc. Shapes include, but are not limited to, spherical, polyhedral spherical, etc. The mass concentration of abrasive particles or slurry is 0.1%-100%.

[0050] One or more particle sizes are selected as abrasive particles; the particle size of the abrasive particles is selected to be 20-200 nm, and the material of the abrasive particles can be silicon dioxide, cerium dioxide, aluminum oxide, diamond, silicon nitride, silicon carbide, etc. The shape can be spherical, elliptical, or rod-shaped, etc.

[0051] The above-mentioned abrasive particles are mixed with polymer 302 in a one-step process. Specifically, a certain mass fraction of isocyanate, a certain mass fraction of oligomeric polyol, and a certain mass fraction of abrasive particles are taken and thoroughly mixed at 200 rpm-1000 rpm in a nitrogen-filled atmosphere for 0.5 h-6 h. Subsequently, a crosslinking agent or chain extender is added and mixed evenly. The above abrasive slurry is then injected into the pores of the polishing pad by injection.

[0052] In the one-step mixing process, the isocyanate can be toluene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), isophorone diisocyanate (IPDI), etc., with a dosage of 10-250 parts. The polyol can be polyester polyol, polyether polyol, and polyolefin polyol, etc., with a dosage of 10-200 parts. The mass fraction of the grinding particles is 2%-40% of the total mass. The mixing time is 0.5h-6h. The chain extender can be diammonium phosphate chain extender, alcohol chain extender, etc., with a dosage of 3-100 parts.

[0053] Alternatively, the abrasive particles can be mixed with polymer 302 using a prepolymer method. Specifically, one or more prepolymers with a certain isocyanate group (NCO) content and a certain mass fraction of abrasive particles are mixed thoroughly in a nitrogen-filled atmosphere at a speed of 200-1000 rpm for 0.5-6 hours. Then, a crosslinking agent or chain extender (diamine chain extender, alcohol chain extender, etc.) is added and mixed evenly. The resulting abrasive slurry is then injected into the pores of the polishing pad. In the prepolymer method, the NCO content of the polyurethane prepolymer is 4%-12%, the mass fraction of the abrasive particles is 2%-40% of the total mass, and the mixing time is 0.5-6 hours.

[0054] After injecting abrasive particles, the material is cured and polished. Step S4: Place the polishing pad body 1, into which the abrasive particles 301 are injected, in a preset temperature environment for a preset time to cure, so that the abrasive particles 301 in the groove 2 are completely cured to form solid abrasive material 3.

[0055] A polishing pad infused with a certain concentration of abrasive particles or slurry is vulcanized at a specific temperature for a certain period of time to ensure complete curing of the particles or slurry. During the curing process, the polishing pad infused with a certain concentration of abrasive particles or slurry undergoes vulcanization at a temperature of 50℃-250℃ for a time of 1h-36h.

[0056] The grinding slurry obtained by the one-step method is injected into the cavity 2 and then cured at a temperature of 50℃-200℃ for 0.5h-24h. The grinding slurry obtained by the prepolymer method is injected into the cavity 2 and then cured at a temperature of 50℃-250℃ for 0.5-36h.

[0057] Step S5: Use a grinding device to grind the surface of the polishing pad body 1, remove the solid abrasive 3 that exceeds the surface of the polishing pad body 1, so that the top of the solid abrasive 3 in the groove 2 is flush with the surface of the polishing pad body 1, so as to grind the solidified abrasive particles that are higher than the surface of the polishing pad flat by using the grinding device.

[0058] During the polishing process, the polishing equipment is used to smooth out the solidified abrasive that protrudes after surface curing, ensuring that the top of the solidified abrasive in the groove 2 is flush with the surface of the polishing pad.

[0059] This invention also provides a method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, such as... Figure 1 , Figure 3 and Figure 4 As shown, it includes the following steps:

[0060] Step 1: Drill holes in the polyurethane polishing pad with a hole diameter of 0.1mm and a hole depth of 1% of the polishing pad thickness. The distance between the slots 2 is 1 times the hole diameter.

[0061] Step 2: Clean the polishing pad after drilling to ensure that there are no impurities in the groove 2.

[0062] Select appropriate abrasive particles or slurry and inject them into each cavity 2 one by one:

[0063] Step 3: Inject a 2% (w / w) concentration of silica abrasive slurry into the cleaned polishing pad containing slot 2 using a liquid injection method. Use abrasive particles with a diameter of 20nm, made of silica particles, and spherical in shape.

[0064] In the one-step method, the isocyanate can be toluene diisocyanate (TDI), and the dosage is 10 parts. The polyol can be a polyester polyol, and the dosage is 10 parts. The mass fraction of the ground particles is 2% of the total mass. The mixing time is 0.5 h. The chain extender is a diammonium phosphate chain extender, and the dosage is 3-100 parts. The curing is carried out at 50℃ for 0.5 h. In the prepolymer method, the NCO content of the polyurethane prepolymer is 4%, the mass concentration of the ground particles is 2%, and the mixing time is 0.5 h.

[0065] After injecting abrasive particles, the material is cured and polished.

[0066] Step 4: Curl the polishing pad containing abrasive particles or slurry at 50°C for 0.5 hours or 1 hour to ensure that the abrasive particles or slurry are completely cured.

[0067] Step 5: Use a grinding device to grind the solidified abrasive particles that are higher than the surface of the polishing pad until they are smooth.

[0068] This invention also provides a method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, such as... Figure 1 , Figure 3 and Figure 4 As shown, it includes the following steps:

[0069] Step 1: Drill holes in the polyurethane polishing pad with a hole diameter of 10mm and a hole depth of 50% of the polishing pad thickness. The distance between the slots 2 is 50 times the hole diameter.

[0070] Step 2: Clean the polishing pad after drilling to ensure that there are no impurities in the groove 2.

[0071] Select appropriate abrasive particles or slurry and inject them into each cavity 2 one by one:

[0072] Step 3: Inject 50% by mass concentration silica abrasive into the cleaned polishing pad containing the groove 2 through liquid injection.

[0073] The abrasive particles have a particle size of 100 nm and are made of cerium dioxide particles. They are ellipsoidal in shape. The isocyanate can be diphenylmethane diisocyanate (MDI), used in an amount of 100 parts. The polyol is a polyether polyol, used in an amount of 100 parts. The abrasive particles account for 50% of the total mass. The mixing time is 4 hours. The chain extender is an alcohol-based chain extender, used in an amount of 60 parts. The mixture is vulcanized at 150°C for 20 hours. In the prepolymer method, the NCO content of the polyurethane prepolymer is 6%, the abrasive particle mass concentration is 50%, and the mixing time is 3 hours.

[0074] After injecting abrasive particles, the material is cured and polished.

[0075] Step 4: Curl the polishing pad containing abrasive particles or slurry at 150°C for 3 or 20 hours to ensure that the abrasive particles or slurry are completely cured.

[0076] Step 5: Use a grinding device to grind the solidified abrasive particles that are higher than the surface of the polishing pad until they are smooth.

[0077] This invention also provides a method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, such as... Figure 1 , Figure 3 and Figure 4 As shown, it includes the following steps:

[0078] Step 1: Drill holes in the polyurethane polishing pad with a hole diameter of 20mm and a hole depth of 99% of the polishing pad thickness. The distance between the slots 2 is 100 times the hole diameter.

[0079] Step 2: Clean the polishing pad after drilling to ensure that there are no impurities in the groove 2.

[0080] Select appropriate abrasive particles or slurry and inject them into each cavity 2 one by one:

[0081] Step 3: Inject 100% mass concentration silica abrasive slurry (magma-like) into the cleaned polishing pad containing slot 2 through liquid injection.

[0082] After injecting abrasive particles, the material is cured and polished.

[0083] Step 4: Curl the polishing pad containing abrasive particles or slurry at 250°C for 36 hours to ensure that the abrasive particles or slurry are completely cured.

[0084] Step 5: Use a grinding device to grind the solidified abrasive particles that are higher than the surface of the polishing pad until they are smooth.

[0085] This invention also provides a method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, such as... Figure 1 , Figure 3 and Figure 4 As shown, the difference from the above embodiment is that: in step 3, abrasive particles with a particle size of 200 nm are used, and the material of the abrasive particles is alumina particles. The shape is rod-shaped. The isocyanate can be isophorone diisocyanate (IPDI), etc., and the amount is 250 parts. The polyol can be polyolefin polyol, etc., and the amount is 200 parts. The mass fraction of the abrasive particles is 40% of the total mass. The mixing time is 6 hours. The chain extender is an alcohol chain extender, and the amount is 100 parts. The curing is carried out at 250°C for 36 hours. In the prepolymer method, the NCO content of the polyurethane prepolymer is 12%, the mass concentration of the abrasive particles is 40%, and the mixing time is 6 hours.

[0086] This invention belongs to the field of semiconductor polishing pads and relates to a method for preparing a photolithographically ordered solidified abrasive polishing pad. The main purpose is to pre-add abrasive to the polishing pad to achieve a higher abrasive removal rate and lower surface roughness. The invention first designs a groove pattern (2) for the polyurethane polishing pad, and then drills holes in the polishing pad according to the pattern. After drilling, the polishing pad is cleaned, and then a high-concentration abrasive solution is injected into the grooves (2). The polishing pad containing the high-concentration abrasive solution is then subjected to secondary vulcanization to solidify the abrasive. Finally, the surface is polished to remove the solidified abrasive exceeding the surface of the polishing pad.

[0087] Unlike traditional porous polishing pads, the macroscopically ordered pre-distributed polishing pad of this invention has regularly arranged grooves 2 filled with abrasive particles on its surface. This design aims to provide a stable and consistent contact interface between the polishing head and the wafer surface, thereby achieving more precise control over the material removal rate and higher wafer surface flatness. This technology effectively reduces process fluctuations caused by the variability of the porous structure of traditional polishing pads, and is particularly suitable for advanced chip manufacturing nodes with extremely high flatness requirements.

[0088] This invention is the first to achieve a polishing pad with pre-distributed abrasive material through a method of injecting abrasive particles into slots 2. The macroscopically ordered abrasive pre-distributed polishing pad prepared by this invention combines a "traditional polishing pad + abrasive slurry" approach, and the ordered abrasive pre-distribution also possesses the characteristics of a solidified abrasive polishing pad. The macroscopically ordered abrasive pre-distributed polishing pad prepared by this invention allows for the design of the slots 2, their size, and arrangement to meet different polishing needs, primarily in terms of increasing removal rate, reducing roughness, and improving defects. The macroscopically ordered abrasive pre-distributed polishing pad prepared by this invention can be solidified using different types of abrasive particles depending on the object being polished.

[0089] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A polishing pad that forms a macroscopically ordered abrasive pre-distribution, characterized in that, The device includes a polishing pad body, on which a plurality of grooves are formed. The plurality of grooves are arranged in an orderly manner on the polishing surface of the polishing pad body, and the grooves are filled with solid abrasive material containing distributed abrasive particles. The solid abrasive material is flush with the polishing surface of the polishing pad body.

2. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claim 1, characterized in that, The abrasive particles are injected into the slots and solidify to form the solid abrasive material.

3. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claim 2, characterized in that, The solid abrasive also includes a polymer, which is mixed with the abrasive particles to form an abrasive slurry. The abrasive slurry is injected into the slot and solidified to form the solid abrasive.

4. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claim 3, characterized in that, The solid abrasive also includes sulfides, which are mixed in the abrasive slurry so that the abrasive slurry is fixed by sulfidation of the sulfides to form the solid abrasive.

5. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claim 4, characterized in that, The grinding slurry, the sulfide, and the grooves of the polishing pad body form a reactive, fixed connection.

6. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claim 5, characterized in that, The polymer is a polyurethane prepolymer, or a mixture of isocyanate and polyol; The polishing pad is at least one of polyurethane and polyacrylic acid; The sulfide includes a crosslinking agent or a chain extender, and the sulfidation temperature is 50℃-250℃ and the sulfidation time is 0.5h-36h.

7. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claims 1-6, characterized in that, The abrasive particles include at least one of silicon dioxide, cerium dioxide, diamond, aluminum oxide, and zirconium dioxide; And / or, the shape of the abrasive particles is at least one of spherical or polyhedral spheres; And / or, the solid abrasive mass concentration is 0.1%-100%, and the solid abrasive mass concentration is the percentage of the mass of the abrasive particles to the total mass of the solid abrasive.

8. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to any one of claims 1 to 6, characterized in that, The slots are arranged in an orderly manner, either horizontally or vertically. And / or, the opening of the slot is circular.

9. The polishing pad for forming a macroscopically ordered abrasive pre-distribution according to claim 8, characterized in that, The diameter of the opening of the slot is 0.1~20mm; And / or, the depth of the groove is 1% to 99% of the actual thickness of the polishing pad body; And / or, the distance between the openings of adjacent slots is 1 to 100 times the diameter of the opening.

10. A method for preparing a polishing pad with a macroscopically ordered abrasive pre-distribution, characterized in that, The method for preparing the polishing pad with macroscopically ordered abrasive pre-distribution as described in any one of claims 1 to 9 comprises the following steps: Step S1: Select the polishing pad body of the target material, and process the grooves on the polishing pad body in an orderly manner to lay the grooves on the polishing pad body. Step S2: Clean the polishing pad body using a brush cleaning device to remove impurities from the grooves and the surface of the polishing pad body; Step S3: Inject abrasive particles into each cavity of the cleaned polishing pad body; Step S4: Place the polishing pad body containing the injected abrasive particles in a preset temperature environment for a preset time to cure, so that the abrasive particles in the grooves are completely cured to form solid abrasive material. Step S5: Use a grinding device to grind the surface of the polishing pad body to remove the solid abrasive material that exceeds the surface of the polishing pad body, so that the top of the solid abrasive material in the groove is flush with the surface of the polishing pad body.

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