Semi-automatic probe contact tester

Abstract

The utility model relates to a semi -automatic probe contact test machine belongs to chip production test technical field, in order to solve the effective contact area between probe end and chip pad in long -term continuous use process is reduced significantly, the contact resistance between both is increased sharply and stability is poor, forms local concentrated heating, leads to the problem that the precision circuit, metal connection and semiconductor structure in chip interior are damaged by heat, the invention includes test platform and the mobile piece of installation in test platform one side, one side of mobile piece is provided with buffer seat, and the probe platform is installed in one side of buffer seat, the utility model is through setting up memory alloy in the electrically conductive cylinder, utilizes the characteristics that probe wear leads to contact resistance increase, local concentrated heating, makes memory alloy heat phase change and pulls the probe automatic retraction, and the contact of probe and chip pad is disconnected quickly, avoids the chip internal circuit and melts pad from high temperature burnout fundamentally, significantly improves the safety and reliability of chip test process.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing testing technology, specifically a semi-automatic probe contact testing machine. Background Technology

[0002] In the semiconductor chip manufacturing process, semi-automatic probe contact testers are key equipment for detecting chip electrical parameters, screening performance, and controlling finished product yield. Their working principle involves using precision probes on the equipment to establish stable mechanical contact and electrical conduction with the chip pads. This allows the test current and voltage output from the tester to be applied to the chip's internal circuitry, completing a series of electrical tests. This process screens out qualified chips, eliminates defective products, and ensures the quality and reliability of the chips upon delivery.

[0003] In current semi-automatic probe contact testing machines, during long-term continuous use, the probe tip will repeatedly contact, squeeze, and rub against the chip pads, inevitably resulting in wear, passivation, deformation, or oxidation. As the wear of the probe continues to intensify, the effective contact area between the probe tip and the chip pads decreases significantly, and the contact resistance between the two increases sharply and becomes less stable. When the test current passes through the poorly contacted probe and the chip, the current will generate a large amount of heat in the high contact resistance area, forming localized concentrated heating, which causes the temperature at the contact point between the probe and the chip to rise rapidly. The high temperature will be quickly conducted to the inside of the chip, causing thermal damage to the precision circuits, metal interconnects, and semiconductor structures inside the chip.

[0004] To address the above issues, a semi-automatic probe contact testing machine was proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a semi-automatic probe contact tester. By using this device, the problem mentioned above is solved: during long-term continuous use, the effective contact area between the probe tip and the chip pad is significantly reduced, the contact resistance between the two increases sharply and the stability deteriorates, resulting in localized concentrated heat generation, which leads to heat damage to the precision circuits, metal interconnects and semiconductor structures inside the chip.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A semi-automatic probe contact testing machine includes a test platform and a movable component mounted on one side of the test platform. A buffer seat is provided on one side of the movable component, and a probe station is mounted on the other side of the buffer seat. Several fixed cylinders are evenly arranged inside the probe station, and a support frame is fixedly installed inside each fixed cylinder. A sloping groove is formed on one side of the support frame. A rotating seat is rotatably connected inside each fixed cylinder. A driving component is also provided inside the fixed cylinder and is connected to the rotating seat. Two conductive cylinders of different heights are connected through the surface of the rotating seat. Each conductive cylinder has an elastic movable seat at one end, and both elastic movable seats are connected to the rotating seat. One of the elastic movable seats contacts the sloping groove. A probe is slidably engaged inside each conductive cylinder. An elastic component is also installed inside the conductive cylinder, with a shape memory alloy installed at one end, and the shape memory alloy is fixedly connected to the probe. A monitoring component is also installed inside the conductive cylinder, and the elastic component contacts the monitoring component. The monitoring component and the driving component are electrically connected via a controller.

[0007] Furthermore, the movable component includes an electric slide rail and an L-shaped plate disposed on one side of the electric slide rail. The electric slide rail is fixedly connected to the test platform, and the L-shaped plate is slidably connected to the test platform. An electric push rod is fixedly installed on one side of the L-shaped plate, and a push rod is slidably connected to one side of the L-shaped plate. The push rod is fixedly connected to the output end of the electric push rod. A support block is fixedly installed on the surface of the push rod. An L-shaped block is rotatably connected to one end of the support block, and the L-shaped block is rotatably connected to the L-shaped plate. An adjustment platform is slidably connected to one side of the L-shaped plate, and one end of the L-shaped block is rotatably connected to the adjustment platform. A support plate is fixedly installed on one side of the test platform, and a placement plate is slidably connected to one side of the support plate. Two clamping plates are fixedly installed on one side of the placement plate.

[0008] Furthermore, the buffer seat includes a base plate and several first springs disposed inside the base plate. The probe station is slidably connected to the base plate and fixedly connected to the several first springs. A damper is also installed inside the base plate, and one end of the damper is fixedly connected to the probe station.

[0009] Furthermore, a conductive slip ring is installed inside the fixed cylinder, and the elastic movable seat is in contact with the conductive slip ring.

[0010] Furthermore, the rotating seat includes a disc and a rotating ring fixed outside the disc, and the rotating ring is rotatably connected to the inside of the fixed cylinder. A rotating column is fixedly installed on one side of the disc, and the rotating column is rotatably connected to the inside of the fixed cylinder. A gear is fixedly installed on the surface of the rotating column. The driving component includes a frame plate and a toothed plate slidably connected inside the frame plate, and the toothed plate meshes with a gear. A protrusion is fixedly installed inside the frame plate, an electromagnet is fixedly installed on one side of the protrusion, and a magnet is fixedly installed on one side of the toothed plate. A second spring is installed at both ends of the frame plate, and a first arc-shaped block is fixedly installed at one end of the second spring. The first arc-shaped block is slidably connected to the frame plate and the toothed plate.

[0011] Furthermore, the conductive cylinder has two pairs of arc-shaped grooves inside.

[0012] Furthermore, the elastic movable seat includes a fixing ring fixed to the outer wall of the bottom of the conductive cylinder, a support rod fixedly installed at one end of the conductive cylinder and in contact with the conductive slip ring, a movable wheel fixedly installed at one end of the support rod, one movable wheel in contact with the surface of the support frame and the other movable wheel in contact with the surface of the inclined groove, a third spring fixedly installed on one side of the fixing ring and one end of the third spring fixedly connected to the disc.

[0013] Furthermore, a retaining ring is fixedly installed at one end of the probe, and the retaining ring is in contact with the inner wall of the conductive cylinder. Slider blocks are fixedly installed on both sides of the retaining ring, and both sliders are slidably connected to the inner wall of the conductive cylinder. A fourth spring is installed inside both sides of the retaining ring, and a second arc-shaped block is fixedly installed at one end of the fourth spring, and the second arc-shaped block is in contact with the arc-shaped groove.

[0014] Furthermore, the elastic element includes a connecting plate and a fifth spring fixed to one side of the connecting plate. The connecting plate is fixedly connected to the inner wall of the conductive cylinder. A contact plate is fixedly installed at one end of the fifth spring, and the contact plate is slidably connected to the inner wall of the conductive cylinder. The contact plate is in contact with the monitoring element.

[0015] Furthermore, the monitoring device includes a blocking ring and a laser sensor fixed to one side of the blocking ring. The blocking ring is fixedly connected to the inner wall of the conductive cylinder, and the contact plate is in contact with the blocking ring.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. By setting a shape memory alloy inside the conductive cylinder, the characteristic of increased contact resistance and localized concentrated heat caused by probe wear is utilized. The shape memory alloy undergoes a phase change upon heating and pulls the probe to automatically retract, quickly breaking the contact between the probe and the chip pad. This fundamentally avoids high-temperature burn-out of the chip's internal circuitry and melting of the pads, significantly improving the safety and reliability of the chip testing process.

[0017] 2. The shape memory alloy only activates when the probe wears or poor contact causes the local temperature to exceed the phase transition temperature. Under normal testing conditions, the heat generation and temperature are low, and the shape memory alloy remains stable, without affecting normal testing, thus achieving accurate differentiation between fault and normal states.

[0018] 3. When the shape memory alloy cools down and resets, it only squeezes the elastic element and no longer drives the probe to extend outward, thus avoiding repeated heating and damage to the chip caused by the worn probe contacting the chip again, and improving the stability of the protection structure.

[0019] 4. The spare probe and worn probe can be interchanged by rotating the rotating base 180°, realizing automatic and fast probe replacement without disassembling the probe station or stopping the machine for manual probe replacement, which greatly improves testing efficiency and equipment utilization. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Schematic diagram of the structure at point A in the middle; Figure 3 This is a schematic diagram of the fixed cylinder structure of the present invention; Figure 4 This is a schematic diagram of the moving part structure of the present invention; Figure 5 This is a schematic diagram of the buffer seat structure of the present invention; Figure 6 This is a schematic diagram of the rotating seat structure of the present invention; Figure 7 For the present invention Figure 6 Schematic diagram of the structure at point B; Figure 8 This is a schematic cross-sectional view of the frame plate structure of the present invention; Figure 9 This is a schematic diagram of the support frame structure of the present invention; Figure 10 This is a schematic diagram of the elastic movable seat structure of the present invention; Figure 11 This is a schematic diagram of the conductive cylinder structure of the present invention; Figure 12 For the present invention Figure 11 Schematic diagram of the structure at point C.

[0021] In the diagram: 1. Test bench; 2. Moving part; 21. Electric slide rail; 22. L-shaped plate; 23. Electric push rod; 24. Push rod; 25. Support block; 26. L-shaped block; 27. Adjustment table; 28. Support plate; 29. ​​Placement plate; 291. Clamping plate; 4. Buffer seat; 41. Base plate; 42. First spring; 43. Damper; 5. Probe station; 6. Fixed cylinder; 61. Conductive slip ring; 7. Support frame; 8. Inclined groove; 9. Rotating seat; 91. Disc; 92. Rotating ring; 93. Rotating column; 94. Gear; 10. Driving part; 101. Frame plate; 102. Gear plate; 1 03. Protrusion; 104. Electromagnet; 105. Magnet block; 106. Second spring; 107. First arc-shaped block; 20. Conductive cylinder; 201. Arc-shaped groove; 30. Elastic moving seat; 301. Fixing ring; 302. Support rod; 303. Moving wheel; 304. Third spring; 40. Probe; 401. Snap ring; 402. Slider; 403. Fourth spring; 404. Second arc-shaped block; 50. Elastic element; 501. Connecting plate; 502. Fifth spring; 503. Contact plate; 60. Shape memory alloy; 70. Monitoring element; 701. Blocking ring; 702. Laser sensor. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] To address the technical problem that during long-term continuous use, the effective contact area between the probe 40 tip and the chip pads significantly decreases, leading to a sharp increase in contact resistance and deterioration in stability, resulting in localized heat concentration and thermal damage to the chip's internal precision circuits, metal interconnects, and semiconductor structures, such as... Figures 1-12 As shown, the following preferred technical solutions are provided: like Figures 1-3 and Figure 9 As shown, the semi-automatic probe contact tester includes a test platform 1 and a moving part 2 installed on one side of the test platform 1. A buffer seat 4 is provided on one side of the moving part 2, and a probe station 5 is installed on one side of the buffer seat 4. During the process of the probe station 5 approaching and making contact with the chip, the buffer seat 4 can absorb the impact and vibration during the movement, avoiding rigid collisions that could cause the chip to bend and deform during testing, thus improving test stability. Several fixed cylinders 6 are evenly arranged inside the probe station 5. Each fixed cylinder 6 forms an independent probe 40 mounting and driving unit, allowing for individual control and switching of each test point. This avoids the problem in traditional probe 40 rows where damage to one probe 40 affects the use of the entire row, improving the overall reliability and fault tolerance of the equipment. The fixed cylinder 6 contains... A support frame 7 is fixedly installed, and a sloping groove 8 is opened on one side of the support frame 7. A rotating seat 9 is rotatably connected inside the fixed cylinder 6. A driving component 10 is also provided inside the fixed cylinder 6, and the driving component 10 is connected to the rotating seat 9. Two conductive cylinders 20 of different heights are connected through the surface of the rotating seat 9. Each of the two conductive cylinders 20 is provided with an elastic movable seat 30 at one end, and both elastic movable seats 30 are connected to the rotating seat 9. One of the elastic movable seats 30 is in contact with the sloping groove 8. The elastic movable seat 30 can smoothly slide into or out of the sloping groove 8 during rotation, and automatically tighten and position itself under the action of elasticity, ensuring that the probe 40 is accurately positioned and has a consistent height after switching, avoiding loosening, displacement or poor contact, and improving the reliability of the test after switching.

[0024] The conductive cylinder 20 has a probe 40 that slides inside. In the initial working state, only the high probe 40 contacts the chip, while the low probe 40 is in a avoidance state. The high and low arrangement ensures that only one set of probes 40 contacts the chip at the same time, while the other set is on standby as a backup probe 40. When the working probe 40 wears out, it can be directly rotated to switch to the backup probe 40, which doubles the service life of the probe 40 at a single test point and reduces the frequency of consumable replacement. The rotating seat 9 is driven by the drive component 10 to rotate, which can quickly switch to the backup probe 40 after the probe 40 wears out. There is no need to manually disassemble the probe station 5 or stop the machine to replace the probe 40, which greatly shortens the maintenance time, improves the equipment utilization rate and chip testing efficiency, and reduces labor costs.

[0025] The conductive cylinder 20 also houses an elastic element 50, with a shape memory alloy 60 attached to one end. The shape memory alloy 60 is fixedly connected to the probe 40. When wear of the probe 40 leads to increased contact resistance and localized overheating, the shape memory alloy 60 deforms under heat, causing the probe 40 to quickly retract into the conductive cylinder 20. This promptly separates the probe 40 from the chip pads, preventing continuous high-temperature conduction and damage to the chip's internal circuitry, thus achieving automatic overheat protection. The conductive cylinder 20 also houses a monitoring element 70, which is in contact with the elastic element 50. The monitoring element 70 and the driving element 10 are electrically connected through a controller. The monitoring element 70 is installed inside the conductive cylinder 20. The monitoring element 70 is in contact with the elastic element 50 and can detect the retraction action and wear status of the probe 40 in real time. The signal is transmitted to the controller (the controller is existing technology and is not shown in the figure). When the probe 40 is detected to retract due to overheating from wear, the chip is removed. The controller automatically controls the driving element 10 to complete the automatic switching of the probe 40. The controller needs to delay the trigger and wait for the chip to be removed before performing the rotation switching to avoid damage to the chip during the test.

[0026] During operation, the chip is first placed on the test stage 1 and positioned. The moving part 2 then moves the buffer seat 4 and probe station 5 to below the chip, and the height of the probe station 5 is adjusted to ensure stable contact between several high-positioned probes 40 and the chip pads. Subsequently, the chip and probes 40 are powered on, and a test current and signal are applied to complete the chip's electrical testing. During continuous testing, if a probe 40 experiences end wear or passivation due to prolonged use, the effective contact area between the probe 40 and the chip pads significantly decreases, and the contact resistance increases sharply. When the test current flows through, a large amount of heat is generated in the contact area, forming a localized high temperature. This high temperature is transferred along the probe 40 to the shape memory alloy 60. When the temperature reaches the phase transition temperature of the shape memory alloy 60, the shape memory alloy 60 undergoes a wave-like contraction deformation from its initial flat state, pulling the probe 40 back into the conductive cylinder 20. This causes the probe 40 end to quickly separate from the chip pads, cutting off the high-temperature generation circuit and preventing the continuous conduction of localized high temperatures from causing internal circuit burnout, pad melting, or test failure.

[0027] When probe 40 is in a normal and intact state, the contact resistance is small and the heat generation is low. The temperature is insufficient to trigger the phase change of shape memory alloy 60, and probe 40 remains in the extended state for normal testing. The shape memory alloy 60 will only activate when the probe 40 is worn, poor contact causes a sudden increase in contact resistance, or local overheating. This activates the automatic overheat protection mechanism, and the probe 40 retracts and engages with the inside of the conductive cylinder 20. Subsequently, the shape memory alloy 60 slowly returns to its initial shape as the temperature drops, but only compresses the elastic element 50, no longer causing the probe 40 to extend outward. This prevents the probe 40 from extending again and contacting the chip, thus preventing repeated heating and damage to the chip. After the monitoring element 70 detects the downward movement signal of the elastic element 50 and the probe 40, it transmits an electrical signal to the controller. After the chip is removed, the controller controls the drive element 10 to rotate, driving the rotating seat 9 to rotate 180°, thus swapping the positions of the two conductive cylinders 20 and the probe 40. The elastic moving seat 30, originally located in the inclined groove 8, rotates out, the worn probe 40 moves into the avoidance position, and the unused new probe 40 moves into the working position and re-engages with the inclined groove 8, completing the automatic switching between the worn probe 40 and the spare probe 40. The equipment can then immediately continue testing.

[0028] Therefore, by setting a shape memory alloy 60 inside the conductive cylinder 20, and utilizing the characteristics of increased contact resistance and localized concentrated heat caused by probe 40 wear, the shape memory alloy 60 undergoes a phase change upon heating, pulling the probe 40 to automatically retract and quickly disconnect the probe 40 from the chip pads. This fundamentally prevents high-temperature burnout of the chip's internal circuitry and melting of the pads, significantly improving the safety and reliability of the chip testing process. The shape memory alloy 60 only activates when probe 40 wears or poor contact causes localized temperatures to exceed the phase change temperature. Under normal testing conditions, the heat generation and temperature are low, and the shape memory alloy 60 remains stable, not affecting normal testing. This achieves accurate differentiation between fault and normal states. After retraction, the probe 40 engages with the conductive cylinder 20 for positioning. When the shape memory alloy 60 cools down and resets, it only squeezes the elastic element 50 and no longer drives the probe 40 to extend outward, thus avoiding repeated heating and damage to the chip caused by the worn probe 40 contacting the chip again, thereby improving the stability of the protection structure. Two conductive cylinders 20 and probes 40 of different heights are set on the rotating seat 9. When the monitoring element 70 detects that the probe 40 has retracted, the controller controls the drive element 10 to drive the rotating seat 9 to rotate 180°, which can complete the position exchange between the spare probe 40 and the worn probe 40, realizing the automatic and rapid replacement of the probe 40 without disassembling the probe station 5 or stopping the machine for manual needle replacement, greatly improving testing efficiency and equipment utilization.

[0029] To address the technical problem of needing to immediately replace worn probe 40, which is inconvenient for emergency handling and reduces testing efficiency and equipment utilization, such as... Figures 4-12 As shown, the following preferred technical solutions are provided: like Figure 4As shown, the movable component 2 includes an electric slide rail 21 and an L-shaped plate 22 disposed on one side of the electric slide rail 21. The electric slide rail 21 is fixedly connected to the test platform 1, and the L-shaped plate 22 is slidably connected to the test platform 1. An electric push rod 23 is fixedly installed on one side of the L-shaped plate 22, and a push rod 24 is slidably connected to one side of the L-shaped plate 22. The push rod 24 is fixedly connected to the output end of the electric push rod 23. A support block 25 is fixedly installed on the surface of the push rod 24. An L-shaped block 26 is rotatably connected to one end of the support block 25, and the L-shaped block 26 is rotatably connected to the L-shaped plate 22. An adjustment platform 27 is slidably connected to one side of the L-shaped plate 22, and one end of the L-shaped block 26 is rotatably connected to the adjustment platform 27. A support plate 28 is fixedly installed on one side of the test platform 1, and a placement plate 29 is slidably connected to one side of the support plate 28. Two card plates 291 are fixedly installed on one side of the placement board 29. During operation, the chip is first inserted between the two card plates 291 on the placement board 29 to complete the positioning and fixation of the chip. Then, the L-shaped board 22 is moved by the electric slide rail 21, so that the probe station 5 is moved below the corresponding test position of the chip. Then, the electric push rod 23 is activated, which drives the push rod 24 to move horizontally. The push rod 24 drives the support block 25 to move synchronously. The support block 25 drives the L-shaped block 26 to rotate around the L-shaped board 22. The end of the L-shaped block 26 away from the support block 25 rotates upward, which in turn drives the adjustment stage 27 to move slowly and steadily upward a short distance on the surface of the L-shaped board 22. Finally, the probe station 5 moves upward, so that the probe 40 makes gentle contact with the chip pad, and the height adjustment before testing is completed.

[0030] like Figure 5 As shown, the buffer seat 4 includes a base plate 41 and several first springs 42 disposed inside the base plate 41. The probe station 5 is slidably connected to the base plate 41 and fixedly connected to the several first springs 42. A damper 43 is also installed inside the base plate 41. The damper 43 can cooperate with the first springs 42 to suppress the rebound and shaking of the first springs 42, so that the probe station 5 quickly becomes stable after contacting the chip, without shaking or bouncing, ensuring stable contact and uniform pressure between the probe 40 and the chip pad, improving the consistency and accuracy of the test signal. One end of the damper 43 is fixedly connected to the probe station 5. The several first springs 42 play an elastic buffering role at the moment the probe station 5 contacts the chip, absorbing rigid impact and vibration, avoiding hard collision between the probe 40 and the chip pad, preventing chip displacement, pad damage, and bending and breakage of the probe 40.

[0031] like Figure 10 As shown, a conductive slip ring 61 is installed inside the fixed cylinder 6. The elastic movable seat 30 is in contact with the conductive slip ring 61. The conductive slip ring 61 can maintain a dynamic, continuous and stable electrical connection when the rotating seat 9 drives the conductive cylinder 20 and the probe 40 to rotate and switch, so that the probe 40 is always reliably energized during the rotation process. This fundamentally avoids the problems of entanglement, twisting, pulling and breaking that are easy to occur in traditional direct wire connection, and ensures stable transmission of test signals.

[0032] like Figure 6 As shown, the rotating base 9 includes a disk 91 and a rotating ring 92 fixed outside the disk 91. The rotating ring 92 is rotatably connected to the inside of the fixed cylinder 6. A rotating column 93 is fixedly installed on one side of the disk 91 and is rotatably connected to the inside of the fixed cylinder 6. The rotating ring 92 is rotatably connected to the inside of the fixed cylinder 6. The rotating column 93 is further rotatably engaged with the fixed cylinder 6 to form a double rotating support structure. A gear 94 is fixedly installed on the surface of the rotating column 93.

[0033] like Figures 6-8 As shown, the driving component 10 includes a frame plate 101 and a toothed plate 102 slidably connected inside the frame plate 101, with the toothed plate 102 meshing with a gear 94. A protrusion 103 is fixedly installed inside the frame plate 101, an electromagnet 104 is fixedly installed on one side of the protrusion 103, and a magnet 105 is fixedly installed on one side of the toothed plate 102. Second springs 106 are installed at opposite ends inside the frame plate 101, and a first arc-shaped block 107 is fixedly installed at one end of each second spring 106, slidably connected to the frame plate 101 and the toothed plate 102. The controller controls the electromagnet 104 to be energized, and the electromagnet 104 generates magnetism after being energized, pushing the magnet 105 under the action of magnetic repulsion. The magnet 105 moves the toothed plate 102 along the inside of the frame plate 101. During the movement of the toothed plate 102, the gear 94 meshing with the toothed plate 102 is driven to rotate. The gear 94 drives the disc 91 and the rotating ring 92 to rotate synchronously through the rotating column 93. This causes the disc 91 to drive the two conductive cylinders 20 and the probe 40 at different heights to rotate, realizing the position switching between the worn probe 40 and the spare probe 40. When the toothed plate 102 moves to the designated position, the electromagnet 104 is de-energized. The second spring 106 inside the frame plate 101 cooperates with the first arc surface block 107 to realize the locking of the toothed plate 102 at different positions, improving the stability of the toothed plate 102. Conversely, the operation can attract the toothed plate 102 to the initial position.

[0034] like Figures 10-12As shown, the conductive cylinder 20 has two pairs of arc-shaped grooves 201 inside. The probe 40 can be fixed in different positions by engaging with the two pairs of arc-shaped grooves 201 at different locations. The elastic movable seat 30 includes a fixing ring 301 fixed to the outer wall of the bottom of the conductive cylinder 20. A support rod 302 is fixedly installed at one end of the conductive cylinder 20, and the support rod 302 is in contact with the conductive slip ring 61. A movable wheel 303 is fixedly installed at one end of the support rod 302. The support rod 302 is made of conductive material, while the movable wheel 303 is made of insulating material to avoid short circuits and signal interference during rolling conductivity. One movable wheel 303 is in contact with the surface of the support frame 7, and the other movable wheel 303 is in contact with the surface of the inclined groove 8. The support rod 302 is always in contact with the conductive slip ring 61, ensuring that the probe 40 forms a stable electrical path with the external test circuit through the support rod 302 and the conductive slip ring 61, achieving uninterrupted power supply during rotation. A third spring is fixedly installed on one side of the fixing ring 301. 304, and one end of the third spring 304 is fixedly connected to the disk 91. In the initial working state, one moving wheel 303 is in contact with the surface of the support frame 7, and the other moving wheel 303 is embedded in the inclined groove 8. The third spring 304 pushes the moving wheel 303 to fit tightly with the support frame 7 and the inclined groove 8 through elastic force, so as to achieve precise positioning of the conductive cylinder 20 and the probe 40, and ensure that the contact height and pressure between the working probe 40 and the chip pad are stable. When the monitoring component 70 detects that the probe 40 is worn and retracts, it drives the disk 91 to rotate. The two moving wheels 303 roll along the surface of the support frame 7 and the surface of the inclined groove 8, respectively. When the rotating seat 9 rotates 180° to complete the switching of the probe 40, the moving wheel 303 that was originally in contact with the support frame 7 rotates into the inclined groove 8, and the moving wheel 303 that was originally embedded in the inclined groove 8 rotates into the surface of the support frame 7. The snap-fit ​​of the toothed plate 102 ensures that the position of the spare probe 40 is accurate and the contact is stable after switching, so as to ensure that the test is carried out normally.

[0035] like Figure 12As shown, a retaining ring 401 is fixedly installed at one end of the probe 40, and the retaining ring 401 contacts the inner wall of the conductive cylinder 20. Slider blocks 402 are fixedly installed on both sides of the retaining ring 401, and both sliders 402 are slidably connected to the inner wall of the conductive cylinder 20. A fourth spring 403 is installed inside both sides of the retaining ring 401. A second arc-shaped block 404 is fixedly installed at one end of the fourth spring 403, and the second arc-shaped block 404 contacts the arc-shaped groove 201. During operation, when the probe 40 is in its normal working state, the second arc-shaped blocks 404 on both sides of the retaining ring 401, under the elastic force of the fourth spring 403, engage with one of the pairs of arc-shaped grooves 201 inside the conductive cylinder 20. Combined with the guiding action of the sliders 402, this keeps the probe 40 stably in the extended working position, ensuring the probe... The probe 40 has stable and uniform contact with the chip pads, ensuring normal testing. When the probe 40 wears down due to prolonged use, the contact resistance with the chip pads increases and local high temperatures are generated. The high temperature is transferred to the shape memory alloy 60, which contracts in a wave-like shape when heated, thus pulling the probe 40 downward into the conductive cylinder 20. When the probe 40 moves, it drives the retaining ring 401 and the second arc surface blocks 404 on both sides to move downward simultaneously. At this time, the arc surface groove 201 on the inner wall of the conductive cylinder 20 will exert a squeezing force on the arc surface of the second arc surface block 404, forcing the second arc surface block 404 to compress the fourth spring 403 and separate from the corresponding arc surface groove 201. As the shape memory alloy 60 continues to contract, the probe 40 continues to move downward.

[0036] When the second arc-shaped block 404 moves to the position of another pair of arc-shaped grooves 201 inside the conductive cylinder 20, the fourth spring 403 elastically resets, pushing the second arc-shaped block 404 into the pair of arc-shaped grooves 201, realizing the retraction and positioning of the probe 40, so that the end of the probe 40 is completely separated from the chip pad, avoiding continuous damage to the chip due to high temperature. At the same time, after the probe 40 retracts, it is locked by the other pair of arc-shaped grooves 201 and the second arc-shaped block 404. Even if the shape memory alloy 60 cools down and returns to its initial shape, since the elastic force of the fourth spring 403 is greater than the elastic force of the elastic element 50, the shape memory alloy 60 will only squeeze the elastic element 50 when it cools down and returns to its initial shape, and will not drive the probe 40 back to the initial working position, preventing the probe 40 from contacting the chip again and generating high temperature again.

[0037] like Figure 11As shown, the elastic element 50 includes a connecting plate 501 and a fifth spring 502 fixed to one side of the connecting plate 501. The connecting plate 501 is fixedly connected to the inner wall of the conductive cylinder 20. A contact plate 503 is fixedly installed at one end of the fifth spring 502, and the contact plate 503 is slidably connected to the inner wall of the conductive cylinder 20. The contact plate 503 is in contact with the monitoring element 70. The shape memory alloy 60 gradually cools down as the temperature drops and returns to its initial flat shape. During this process, the shape memory alloy 60 will generate a pushing force on the contact plate 503, which will then squeeze the fifth spring 502 to cause it to elastically contract. However, since the elastic force of the fourth spring 403 is greater than that of the fifth spring 502, the contraction of the fifth spring 502 cannot overcome the pressing force of the fourth spring 403 on the second arc block 404, and cannot push the probe 40 to move upward. Therefore, when the shape memory alloy 60 resets, it will only squeeze the fifth spring 502 and will not drive the probe 40 back to the initial working position, thereby preventing the worn probe 40 from contacting the chip again and generating high temperature again, and achieving reliable locking of the probe 40 after retraction.

[0038] The monitoring component 70 includes a blocking ring 701 and a laser sensor 702 fixed to one side of the blocking ring 701. When the shape memory alloy 60 moves the retaining ring 401, the laser sensor 702 can quickly capture the displacement signal and accurately feedback that the probe 40 has completed the retraction and locking state, avoiding the problems of monitoring lag and signal misjudgment. The blocking ring 701 is fixedly connected to the inner wall of the conductive cylinder 20, and the contact plate 503 is in contact with the blocking ring 701.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semi-automatic probe contact testing machine, comprising a test table (1) and a movable component (2) mounted on one side of the test table (1), characterized in that: A buffer seat (4) is provided on one side of the movable part (2), and a probe station (5) is installed on one side of the buffer seat (4). Several fixed cylinders (6) are evenly arranged inside the probe station (5). A support frame (7) is fixedly installed inside the fixed cylinder (6). An inclined groove (8) is opened on one side of the support frame (7). A rotating seat (9) is rotatably connected inside the fixed cylinder (6). A driving part (10) is also provided inside the fixed cylinder (6), and the driving part (10) is connected to the rotating seat (9) in a transmission connection. Two conductive cylinders (20) of different heights are connected through the surface of the rotating seat (9). An elastic movable seat is provided at one end of each of the two conductive cylinders (20). (30), and both elastic moving seats (30) are connected to the rotating seat (9), and one of the elastic moving seats (30) is in contact with the inclined groove (8). The probe (40) is slidably engaged inside the conductive cylinder (20). An elastic element (50) is also installed inside the conductive cylinder (20). A memory alloy (60) is installed at one end of the elastic element (50), and the memory alloy (60) is fixedly connected to the probe (40). A monitoring element (70) is also installed inside the conductive cylinder (20), and the elastic element (50) is in contact with the monitoring element (70). The monitoring element (70) and the driving element (10) are electrically connected through the controller.

2. The semi-automatic probe contact testing machine according to claim 1, characterized in that: The movable component (2) includes an electric slide rail (21) and an L-shaped plate (22) disposed on one side of the electric slide rail (21). The electric slide rail (21) is fixedly connected to the test platform (1), and the L-shaped plate (22) is slidably connected to the test platform (1). An electric push rod (23) is fixedly installed on one side of the L-shaped plate (22), and a push rod (24) is slidably connected to one side of the L-shaped plate (22). The push rod (24) is fixedly connected to the output end of the electric push rod (23), and a surface of the push rod (24) is fixedly mounted with... Support block (25), one end of support block (25) is rotatably connected to L-shaped block (26), and L-shaped block (26) is rotatably connected to L-shaped plate (22). Adjustment table (27) is slidably connected to one side of L-shaped plate (22), and one end of L-shaped block (26) is rotatably connected to adjustment table (27). Support plate (28) is fixedly installed on one side of test table (1), and placement plate (29) is slidably connected to one side of support plate (28). Two clamping plates (291) are fixedly installed on one side of placement plate (29).

3. The semi-automatic probe contact testing machine according to claim 1, characterized in that: The buffer seat (4) includes a base plate (41) and several first springs (42) disposed inside the base plate (41). The probe station (5) is slidably connected to the base plate (41) and fixedly connected to several first springs (42). A damper (43) is also installed inside the base plate (41), and one end of the damper (43) is fixedly connected to the probe station (5).

4. The semi-automatic probe contact testing machine according to claim 1, characterized in that: The fixed cylinder (6) is equipped with a conductive slip ring (61), and the elastic moving seat (30) is in contact with the conductive slip ring (61).

5. The semi-automatic probe contact testing machine according to claim 4, characterized in that: The rotating seat (9) includes a disc (91) and a rotating ring (92) fixed outside the disc (91). The rotating ring (92) is rotatably connected to the inside of the fixed cylinder (6). A rotating column (93) is fixedly installed on one side of the disc (91). The rotating column (93) is rotatably connected to the inside of the fixed cylinder (6). A gear (94) is fixedly installed on the surface of the rotating column (93). The driving component (10) includes a frame plate (101) and a toothed plate (102) slidably connected inside the frame plate (101). The toothed plate (102) meshes with a gear (94). A protrusion (103) is fixedly installed inside the frame plate (101). An electromagnet (104) is fixedly installed on one side of the protrusion (103). A magnet block (105) is fixedly installed on one side of the toothed plate (102). A second spring (106) is installed at both ends of the frame plate (101). A first arc surface block (107) is fixedly installed at one end of the second spring (106). The first arc surface block (107) is slidably connected to the frame plate (101) and to the toothed plate (102).

6. The semi-automatic probe contact testing machine according to claim 1, characterized in that: The conductive cylinder (20) has two pairs of arc-shaped grooves (201) inside.

7. The semi-automatic probe contact testing machine according to claim 5, characterized in that: The elastic movable seat (30) includes a fixed ring (301) fixed to the bottom outer wall of the conductive cylinder (20), a support rod (302) fixedly installed at one end of the conductive cylinder (20), and the support rod (302) is in contact with the conductive slip ring (61). A movable wheel (303) is fixedly installed at one end of the support rod (302), one of the movable wheels (303) is in contact with the surface of the support frame (7), and the other movable wheel (303) is in contact with the surface of the inclined groove (8). A third spring (304) is fixedly installed on one side of the fixed ring (301), and one end of the third spring (304) is fixedly connected to the disc (91).

8. The semi-automatic probe contact testing machine according to claim 6, characterized in that: A retaining ring (401) is fixedly installed at one end of the probe (40). The retaining ring (401) is in contact with the inner wall of the conductive cylinder (20). Slider blocks (402) are fixedly installed on both sides of the retaining ring (401). Both sliders (402) are slidably connected to the inner wall of the conductive cylinder (20). A fourth spring (403) is installed inside both sides of the retaining ring (401). A second arc surface block (404) is fixedly installed at one end of the fourth spring (403), and the second arc surface block (404) is in contact with the arc surface groove (201).

9. The semi-automatic probe contact testing machine according to claim 1, characterized in that: The elastic element (50) includes a connecting plate (501) and a fifth spring (502) fixed on one side of the connecting plate (501). The connecting plate (501) is fixedly connected to the inner wall of the conductive cylinder (20). A contact plate (503) is fixedly installed at one end of the fifth spring (502), and the contact plate (503) is slidably connected to the inner wall of the conductive cylinder (20). The contact plate (503) is in contact with the monitoring element (70).

10. The semi-automatic probe contact testing machine according to claim 9, characterized in that: The monitoring device (70) includes a blocking ring (701) and a laser sensor (702) fixed on one side of the blocking ring (701). The blocking ring (701) is fixedly connected to the inner wall of the conductive cylinder (20), and the contact plate (503) is in contact with the blocking ring (701).

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