Integrated interconnect chassis and system based on vnx+ architecture

Abstract

The present disclosure provides a kind of based on the integrated interconnection cabinet and system of VNX+ architecture, the cabinet includes cabin assembly and heat dissipation fixed assembly, cabin assembly includes installation cabin and mounting bracket, installation cabin is equipped with transverse installation mouth, cavity and longitudinal installation mouth, mounting bracket is located in cavity and is connected to installation cabin;Mounting bracket is formed with receiving cavity;Heat dissipation fixed assembly includes cold plate component and tolerance heat conduction interface component, tolerance heat conduction interface component is formed with fixed tolerance groove, and fixed tolerance groove is communicated with receiving cavity.After completing installation power supply functional component and cold plate component, tolerance heat conduction interface component is used to fill the gap between cold plate component and power supply functional component, to play the role of filling gap and tolerance, simultaneously, the adhesion condition of each module and corresponding interface material can be checked, the risk of heat dissipation failure is avoided, and when maintaining, module can be replaced by only removing heat dissipation fixed assembly, thereby reduce the difficulty of module replacement, and the installation adaptability of module is good.

Description

Technical Field

[0001] This disclosure relates to the technical field of computer systems, and in particular to an integrated interconnect chassis and system based on the VNX+ architecture. Background Technology

[0002] VITA90, also known as VNX+, is a miniaturized, ruggedized, and modular standard optimized and upgraded by VITA (VMEbus International Trade Association) based on VITA74 (the original VNX standard). It is specifically designed for fields such as military and aerospace that have stringent requirements for environmental adaptability and performance, and its core solution is to address issues such as high-speed transmission and multi-type interface adaptation in embedded electronic systems in space-constrained scenarios.

[0003] Currently, the VNX architecture has different types of architectural modules, and some modules are highly customized, with their size far exceeding the module requirements of the VNX architecture. They cannot be adapted to the standardized framework, making it difficult to achieve interchangeable assembly of different models of VNX architecture modules with the same standard module. In other words, the installation adaptability of VNX architecture modules is poor, which increases the development cycle and production cost of system construction, as well as maintenance and repair costs. For example, the existing patent CN116381751A discloses a generalized missile-borne integrated electronic system. Similarly, the modules of the existing solutions do not meet the module requirements of the VNX+ architecture. Summary of the Invention

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a VNX+ architecture-based integrated interconnect chassis and system with better installation adaptability to VNX / VNX+ architecture modules.

[0005] The purpose of this disclosure is achieved through the following technical solution: A comprehensive interconnect chassis based on the VNX+ architecture, including a housing assembly and a heat dissipation mounting assembly. The cabin assembly includes a mounting cabin and a mounting frame. The mounting cabin has a lateral mounting opening, a cavity, and a longitudinal mounting opening. The mounting frame is located in the cavity and connected to the mounting cabin. The mounting frame forms a receiving cavity, which is connected to the lateral mounting opening and the longitudinal mounting opening respectively. The heat dissipation fixing assembly includes a cold plate component and a tolerance thermal interface component. The cold plate component is fixed to the mounting bracket. The tolerance thermal interface component is disposed on the inner wall of the cold plate component. The tolerance thermal interface component forms a fixed tolerance groove. The fixed tolerance groove communicates with the receiving cavity so that the fixed tolerance groove and the receiving cavity together form a receiving cavity. The receiving cavity is used to accommodate at least a portion of the structure of the power supply functional component.

[0006] In one embodiment, the cabin assembly further includes a hatch that covers the longitudinal mounting opening and is detachably connected to the mounting bracket.

[0007] In one embodiment, the hatch is connected to the mounting bracket by any of the following methods: snap-fit, fastening, or screwing.

[0008] In one embodiment, the mounting frame includes a base frame and a frame assembly. The base frame is located within the cavity and is fixedly connected to the mounting compartment. The base frame has a supporting fastener. The frame assembly is fixed to the base frame. The supporting fastener and the frame assembly together form the receiving cavity. The supporting fastener is used to support and fix the power supply functional component. The cold plate component is fixed to the frame assembly.

[0009] In one embodiment, the cold plate component includes a top cold plate and at least two side cold plates, each of the side cold plates and the top cold plate being fixedly installed on the frame assembly; the tolerance thermal interface component includes a top tolerance thermal interface plate and at least two side tolerance thermal interface plates, each of the side tolerance thermal interface plates being disposed on a corresponding side cold plate, and the top tolerance thermal interface plate being disposed on the top cold plate; each of the side tolerance thermal interface plates is used to abut against the side of the power function component; the top tolerance thermal interface plate is disposed opposite to the support fixing member, and the top tolerance thermal interface plate is used to abut against the top of the power function component.

[0010] In one embodiment, the frame assembly includes a first frame, a second frame, a first fixing rod, and a second fixing rod. The first frame and the second frame are fixed side by side to the base frame. The two ends of the first fixing rod are respectively connected to the first frame and the second frame, and the two ends of the second fixing rod are respectively connected to the first frame and the second frame, so that the first frame, the second frame, the first fixing rod, the second fixing rod, and the support fixing member together form the receiving cavity; the cold plate component is fixed to the first frame and the second frame respectively.

[0011] In one embodiment, the inner wall of the cold plate component is formed with an embedding groove, and the tolerance thermal interface component is installed in the embedding groove.

[0012] In one embodiment, the mounting bracket is welded or screwed to the mounting compartment.

[0013] In one embodiment, the installation compartment is cylindrical.

[0014] In one embodiment, the mounting bracket is provided with a mounting guide block, the mounting guide block is provided with a first mounting inclined surface, the cold plate component is provided with a mounting limiting block, the mounting limiting block is provided with a second mounting inclined surface, and the first mounting inclined surface abuts against the second mounting inclined surface.

[0015] A VNX+ architecture-based integrated interconnect system includes a power function component and a VNX+ architecture-based integrated interconnect chassis as described in any embodiment, wherein the power function component is installed inside the VNX+ architecture-based integrated interconnect chassis.

[0016] Compared with the prior art, this disclosure has at least the following advantages: The aforementioned integrated interconnect chassis based on the VNX+ architecture employs a heat dissipation fixing component to ensure contact between the heat dissipation fixing component and the power function component. Specifically, after the power function component and the cold plate component are installed, a tolerance-controlled thermal interface component is used to fill the gap between the cold plate component and the power function component, thus providing gap filling and tolerance. Furthermore, the fit between each module and its corresponding interface material can be inspected simply by removing the cover, mitigating the risk of heat dissipation failure. Subsequent maintenance only requires removing the cover and heat dissipation fixing component to replace the module, reducing the difficulty of module replacement. It exhibits good adaptability to the installation of VNX+ architecture modules, reducing the development cycle and production costs of system construction, as well as maintenance and repair costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an exploded view of the structure of a comprehensive interconnect system based on the VNX+ architecture in one embodiment; Figure 2 for Figure 1 The diagram shows a partial structural schematic of the cabin component in the integrated interconnect system based on the VNX+ architecture. Figure 3 for Figure 2 The diagram shows a structural schematic of the cabin assembly in which the cabin is installed. Figure 4 for Figure 2 The diagram shows the structure of the mounting bracket in the cabin assembly. Figure 5 for Figure 1The diagram shows the structure of the two side cold plates of the cold plate component of the heat dissipation fixing assembly in the integrated interconnect system based on the VNX+ architecture. Figure 6 for Figure 1 The diagram shows the structure of the power function component in a comprehensive interconnect system based on the VNX+ architecture. Figure 7 for Figure 6 The diagram shows the structural structure of the power supply functional components from another perspective; Figure 8 for Figure 1 The diagram shown is a partial structural schematic of a comprehensive interconnect system based on the VNX+ architecture, illustrating the specific structure of the guide sleeve and the guide components of the backplate part of the module. Figure 9 for Figure 8 A schematic diagram showing the matching of key entities at different positions in the structure with the corresponding key notches of the guide body. Figure 10 This is a schematic diagram of the specific structure of the power function component in one embodiment when using the basic version; Figure 11 This is a schematic diagram of the specific structure of the power function component in an embodiment when an advanced version is used; Figure 12 This is a schematic diagram of the specific structure of the power function component in one embodiment when using an extended version.

[0019] Figure label: 10. Integrated interconnection system based on VNX+ architecture; 100. Cabin assembly; 110. Mounting cabin; 1101. Lateral mounting port; 1102. Cavity; 1103. Longitudinal mounting port; 120. Mounting frame; 1201. Receiving cavity; 1202. First mounting guide block; 1203. Second mounting guide block; 120a. First mounting inclined surface; 120b. Second mounting inclined surface; 121. Base frame; 1211. Support fastener; 122. Frame assembly; 1221. First frame; 1222. Second frame; 1223. First fixing rod; 1224. Second fixing rod; 130. Cabin cover; 200. Heat dissipation fixing assembly; 210. Cold plate component; 2101. Lateral embedding groove; 2102. First mounting limiting block; 2103. Second mounting limiting block; 210a. Third mounting inclined surface; 210b. Fourth mounting inclined surface; 210c. First clearance notch; 210d. Second clearance notch; 211. Top cold plate; 212. Side cold plate; 220. Tolerance thermal interface component; 221. Top tolerance thermal interface plate; 222. Side tolerance thermal interface plate; 300. Power supply component; 310. Backplate component; 311. Backplate body; 3111. Plug-in slot; 312. Guide component; 3121. Guide body; 31211. Key notch; 3122. Guide base; 3123. Transition post; 3124. Locking fastener; 312a. Guide cone; 320. Interface communication component; 321. Interface module; 322. Filtering / signal enhancement module; 323. Connecting plate; 330. Module; 331. Guide sleeve; 3311. Mounting guide hole; 332. Key body; 400. Bracket. Detailed Implementation

[0020] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments: Please see Figures 1 to 4This is an embodiment of the VNX+ architecture-based integrated interconnect system 10, which includes a VNX+ architecture-based integrated interconnect chassis. The VNX+ architecture-based integrated interconnect chassis includes a housing assembly 100 and a heat dissipation fixing assembly 200. The housing assembly 100 includes a mounting housing 110, a mounting bracket 120, and a cover 130. The mounting housing 110 has a horizontal mounting port 1101, a cavity 1102, and a vertical mounting port 1103. The mounting bracket 120 is located in the cavity 1102 and connected to the mounting housing 110. The mounting bracket 120 forms a receiving cavity 1201, which is connected to the horizontal mounting port 1101 and the vertical mounting port 1203. Mounting opening 1103; Cover 130 is provided over the longitudinal mounting opening 1103 and is detachably connected to the mounting bracket 120; Heat dissipation fixing assembly 200 includes a cold plate component 210 and a tolerance thermal interface component 220. The cold plate component 210 is fixed to the mounting bracket 120. The tolerance thermal interface component 220 is provided on the inner wall of the cold plate component 210. The tolerance thermal interface component 220 forms a fixed tolerance groove. The fixed tolerance groove communicates with the receiving cavity 1201 so that the fixed tolerance groove and the receiving cavity 1201 together form a receiving cavity. The receiving cavity is used to accommodate at least a part of the structure of the power function component 300, that is, the receiving cavity is used to accommodate part or all of the structure of the power function component 300. Specifically, after the cold plate component 210 is installed, the tolerance thermal interface component 220 faces the receiving cavity 1201 in multiple directions, so that the tolerance thermal interface component 220 forms a fixed tolerance groove, and the receiving cavity formed by the fixed tolerance groove and the receiving cavity 1201 is used to accommodate part or all of the structure of the power function component 300.

[0024] In this embodiment, during chassis assembly, the mounting bracket 120 can pass through the transverse mounting opening 1101 and be fixedly connected to the mounting compartment 110. Since the mounting bracket 120 has a receiving cavity 1201, the power function component 300 passes through the longitudinal mounting opening 1103 of the mounting compartment 110 and is installed within the mounting bracket 120. The power function component 300 can be installed in the mounting bracket 120 via plug-in, screw-in, or snap-fit ​​connections, and is located within the receiving cavity 1201. Finally, the heat dissipation fixing component 200 is installed so that the tolerance thermal interface component 220 of the heat dissipation fixing component 200 is in contact with the power function component 300. With zero contact, the heat generated during module operation is dissipated through the tolerance thermal interface component 220, the cold plate component 210, and finally the cover 130, sealing the longitudinal mounting opening 1103. To check the fit of the tolerance thermal interface component 220, simply remove the cover 130 for quick inspection. Similarly, replacing the tolerance thermal interface component 220 only requires removing the cold plate component 210. Likewise, replacing or maintaining the module only requires removing the cold plate component 210. Therefore, the assembly process of the VNX+ architecture-based integrated interconnect chassis in this solution is less complex, and subsequent module maintenance is correspondingly simplified.

[0025] In the above embodiments, the integrated interconnect chassis based on the VNX+ architecture uses a heat dissipation fixing component 200 to make contact with the power function component 300. Specifically, after the installation of the power function component 300 and the cold plate component 210 is completed, the tolerance thermal interface component 220 is used to fill the gap between the cold plate component 210 and the power function component 300, so as to fill the gap and provide tolerance. At the same time, the fit between each module and the corresponding interface material can be checked by simply removing the cover 130, avoiding the risk of heat dissipation failure. When maintenance is required in the future, the module can be replaced simply by removing the cover 130 and the heat dissipation fixing component 200, thereby reducing the difficulty of module replacement. It has good adaptability to the installation of VNX+ architecture modules, reducing the development cycle and production cost of system construction, as well as maintenance and repair costs.

[0026] like Figure 1 As shown, in one embodiment, the hatch 130 is connected to the mounting bracket 120 via any of the following methods: snap-fit, fastening, or screwing. This facilitates easy assembly and disassembly of the hatch 130. Furthermore, when it is necessary to check the fit of the tolerance thermal interface component 220, simply removing the hatch 130 is sufficient for inspection, thus reducing the difficulty of checking the fit of the tolerance thermal interface component 220. In this embodiment, the hatch 130 is detachably mounted to the mounting bracket 120 via a screw connection.

[0027] like Figure 1As shown, in one embodiment, the tolerance thermal interface component 220 is detachably mounted to the cold plate component 210. In a preferred embodiment, the tolerance thermal interface component 220 can be adhered to the cold plate component 210 by an adhesive backing on one side, so that when the heat dissipation fixing assembly 200 is disassembled or reassembled, the tolerance thermal interface component 220 is less likely to detach from the cold plate component 210, ensuring that the heat generated by the module during operation can be dissipated through the cold plate component 210.

[0028] like Figure 1 and Figure 4 As shown, in one embodiment, the mounting frame 120 includes a base frame 121 and a frame assembly 122. The base frame 121 is located in the cavity 1102 and is fixedly connected to the mounting chamber 110. The base frame 121 has a support and fixing member 1211. The frame assembly 122 is fixed on the base frame 121. The support and fixing member 1211 and the frame assembly 122 together form a receiving cavity 1201. The support and fixing member 1211 is used to support and fix the power supply functional component 300. The cold plate component 210 is fixed to the frame assembly 122. It is understood that when installing the power function component 300, it first passes through the longitudinal mounting port 1103, then through the frame assembly 122, and is installed on the support fastener 1211. The power function component 300 is then installed on the support fastener 1211 through plug-in, snap-on, screw-in, or other means. At this time, the support fastener 1211 and the frame assembly 122 together form a receiving cavity 1201, so that the power function component 300 is located in the receiving cavity 1201. Furthermore, the installation of the power function component 300 will not interfere with the mounting compartment 110. When installing the heat dissipation fixing component 200, its cold plate component 210 is used to cover the frame assembly 122 and contacts the power function component 300 through the tolerance heat conduction interface component 220. Similarly, it will not interfere with the mounting compartment 110. In addition, the installation direction of the power function component 300 and the heat dissipation fixing component 200 is from top to bottom, thereby ensuring the ease of installation of the power function component 300.

[0029] Furthermore, such as Figure 1As shown, the cold plate component 210 includes a top cold plate 211 and at least two side cold plates 212, each side cold plate 212 and the top cold plate 211 being fixedly installed on the frame assembly 122; the tolerance thermal interface component 220 includes a top tolerance thermal interface plate 221 and at least two side tolerance thermal interface plates 222, each side tolerance thermal interface plate 222 being disposed on the corresponding side cold plate 212, and the top tolerance thermal interface plate 221 being disposed on the top cold plate 211; each side tolerance thermal interface plate 222 is used to abut against the side of the power function component 300, specifically, each side tolerance thermal interface plate 222... The thermal interface plate 222 is used to abut against different sides of the power function component 300; the top tolerance thermal interface plate 221 is arranged opposite to the support fixing member 1211, and the top tolerance thermal interface plate 221 is used to abut against the top of the power function component 300. Thus, when the module is working, the heat on the side is conducted to the side cold plate 212 through the side tolerance thermal interface plate 222 and dissipated, and the heat on the top is conducted to the top cold plate 212 through the top tolerance thermal interface plate 222 and dissipated, thereby achieving the effect of multi-directional heat dissipation to ensure that the temperature of each position of the module is uniform.

[0030] Furthermore, when installing the side cooling plate 212 and the top cooling plate 211, they can be installed by means of screws, wedge sliding, magnetic attraction, etc., thereby ensuring the convenience of disassembling and assembling the side cooling plate 212 and the top cooling plate 211.

[0031] In a preferred embodiment, there are two side cooling plates 212 and two side tolerance thermal interface plates 222. The top cooling plate 211 and the two side cooling plates 212 are respectively installed at different positions of the frame assembly 122. The two side tolerance thermal interface plates 222 are respectively used to abut against two opposite sides of the power function component 300, and the top tolerance thermal interface plate 221 is used to abut against the top of the power function component 300. The heat generated when the module is working can be dissipated to its sides and top, thereby further avoiding the impact of heat accumulation on the module's operating performance.

[0032] In this embodiment, after the two side cooling plates 212 and the top cooling plate 211 are installed, the two side tolerance thermal interface plates 222 and the top tolerance thermal interface plate 221 are all facing the receiving cavity to form a fixed tolerance groove.

[0033] Furthermore, such as Figure 1 , Figure 2 and Figure 4As shown, the frame assembly 122 includes a first frame 1221, a second frame 1222, a first fixing rod 1223, and a second fixing rod 1224. The first frame 1221 and the second frame 1222 are fixed side by side on the base frame 121. The two ends of the first fixing rod 1223 are respectively connected to the first frame 1221 and the second frame 1222, and the first fixing rod 1223 and the second fixing rod 1224 are spaced apart. The two ends of the second fixing rod 1224 are respectively connected to the first frame 1221 and the second frame 1222, so that the first frame 1221, the second frame 1222, the first fixing rod 1223, the second fixing rod 1224, and the support fixing member 1211 together form a receiving cavity 1201. The cold plate component 210 is fixed to the first frame 1221 and the second frame 1222. In this embodiment, two side cooling plates 212 are fixed to the first frame 1221 and the second frame 1222 respectively, and the top cooling plate 211 is connected to the first fixing rod 1223 and the second fixing rod 1224 respectively to cover the top of the entire frame assembly 122. It can be understood that the first frame 1221 and the second frame 1222 are arranged opposite to each other on the base frame 121 to form the left frame and the right frame respectively. Thus, the two side cooling plates 212 are installed on the left frame and the right frame respectively. The top of the first frame 1221, the top of the second frame 1222, the first fixing rod 1223 and the second fixing rod 1224 together form the top frame, and the top cooling plate 211 is installed on the top frame. In this way, when the module is working, the heat generated is dissipated by the side cooling plates 212 and the top cooling plate 211. The top tolerance thermal interface plate 221 and the two side tolerance thermal interface plates 222 all serve as heat dissipation transition mediums, so that the heat of the module can be dissipated in multiple directions, ensuring the operating performance of the module.

[0034] In one embodiment, the inner wall of the cold plate component 210 has an embedding groove, and the tolerance thermal interface component 220 is installed in the embedding groove. In a preferred embodiment, the tolerance thermal interface component 220 is interference-fitted against the inner wall of the embedding groove to further prevent the tolerance thermal interface component 220 from detaching from the cold plate component 210. When the module is working, the tolerance thermal interface component 220 is not affected by the heat generated by the module and always maintains contact with the cold plate component 210 and the module to prevent detachment. In this embodiment, as... Figure 5As shown, the embedding slot includes a top embedding slot and at least two side embedding slots 2101, wherein each side embedding slot 2101 is formed on a corresponding side cold plate 212, and the top embedding slot is formed on a top cold plate 211. At least two side tolerance thermal interface plates 222 are interference-fitted to the inner wall of the corresponding side embedding slot 2101, and the top tolerance thermal interface plate 221 is interference-fitted to the inner wall of the top embedding slot. Thus, when the module is working, the side tolerance thermal interface plates 222 and the top tolerance thermal interface plates 221 are not affected by the heat generated by the module, and always remain in contact with the cold plate component 210 and the module to prevent them from falling off, thus ensuring the heat dissipation effect in multiple directions when the module generates heat, thereby ensuring the operating performance of the module.

[0035] Furthermore, the top surface of the side tolerance thermal interface plate 222 protrudes from the side embedding groove 2101, and the top surface of the top tolerance thermal interface plate 221 protrudes from the top embedding groove, so as to better ensure the fit between the side tolerance thermal interface plate 222 and the power function component 300, and better ensure the fit between the top tolerance thermal interface plate 221 and the power function component 300. The thickness of the side tolerance thermal interface plate 222 and the top tolerance thermal interface plate 221 can be adjusted according to the specification requirements of the module to ensure the fit between the side tolerance thermal interface plate 222 and the top tolerance thermal interface plate 221 and the power function component 300, so that this solution has high adaptability to modules of different specifications.

[0036] like Figures 2 to 4 As shown, in one embodiment, the mounting bracket 120 is welded or screwed to the mounting compartment 110. It is understood that the mounting compartment 110 and the mounting bracket 120 can be separate components. Thus, when assembling the mounting compartment 110 and the mounting bracket 120, the mounting bracket 120 passes through the transverse mounting opening 1101 of the mounting compartment 110, and then the mounting compartment 110 and the mounting bracket 120 are connected by welding or screwing. The assembly steps of the mounting compartment 110 and the mounting bracket 120 are relatively simple. In this embodiment, the mounting bracket 120 is screwed to the mounting compartment 110.

[0037] In one embodiment, the mounting housing 110 is cylindrical. In other embodiments, the mounting housing 110 may also be, but is not limited to, a polygonal prism shape. Further, the cylindrical mounting housing 110 has a diameter of less than or equal to 127 mm to minimize the integrated interconnect chassis based on the VNX+ architecture of this solution.

[0038] Furthermore, such as Figure 1As shown, the integrated interconnect chassis based on the VNX+ architecture also includes a bracket 400, on which the mounting compartment 110 is mounted so that the bracket 400 supports the compartment assembly 100. Further, the bracket 400 has a limiting groove, in which the mounting compartment 110 is located. The limiting groove has a semi-circular cross-section to prevent the cylindrical mounting compartment 110 from rolling; however, the cross-section of the limiting groove can also be U-shaped.

[0039] like Figure 1 , Figure 4 and Figure 5 As shown, in one embodiment, the mounting bracket 120 is provided with a mounting guide block having a first mounting inclined surface, and the cold plate component 210 has a mounting limiting block having a second mounting inclined surface. The first mounting inclined surface abuts against the second mounting inclined surface. In this embodiment, the first mounting inclined surface is inclined downward toward the receiving cavity 1201, and the second mounting inclined surface is also inclined downward toward the receiving cavity 1201. The first mounting inclined surface and the second mounting inclined surface are parallel, so that the cold plate component 210 abuts against the first mounting inclined surface of the mounting bracket 120 through its second mounting inclined surface. Furthermore, after the cold plate component 210 is installed in the mounting bracket 120, the first mounting inclined surface and the second mounting inclined surface cooperate to guide the cold plate component 210 toward the receiving cavity 1201, preventing it from falling off during initial installation.

[0040] In this embodiment, the mounting limiting block is located on at least two side cold plates 212; the mounting guide block is located on the frame assembly 122.

[0041] In one embodiment, such as Figure 4 and Figure 5As shown, the installation limiting block includes a first installation limiting block 2102 and a second installation limiting block 2103. The first installation limiting block 2102 is disposed on one side of the cold plate 212, and the second installation limiting block 2103 is disposed on the other side of the cold plate 212. The installation guide block includes a first installation guide block 1202 and a second installation guide block 1203. The first installation guide block 1202 is disposed on the first frame 1221, and the second installation guide block 1203 is disposed on the second frame 1222. The first installation inclined surface includes a first... The installation includes a first installation inclined surface 120a and a second installation inclined surface 120b, wherein the first installation inclined surface 120a is disposed on the first installation guide block 1202, and the second installation inclined surface 120b is disposed on the second installation guide block 1203; the second installation inclined surface includes a third installation inclined surface 210a and a fourth installation inclined surface 210b, wherein the third installation inclined surface 210a is disposed on the first installation limiting block 2102, and the fourth installation inclined surface 210b is disposed on the second installation limiting block 2103. Thus, when installing one side of the cold plate 212, the third mounting inclined surface 210a of the first mounting limiting block 2102 cooperates with the first mounting inclined surface 120a of the first mounting guide block 1202 of the first frame 1221, so that the cold plate 212 on one side moves closer to the first frame 1221, thereby playing a preliminary limiting role and making it less likely to fall off. Similarly, when installing the other side of the cold plate 212, the fourth mounting inclined surface 210b of the second mounting limiting block 2103 cooperates with the second mounting inclined surface 120b of the second mounting guide block 1203 of the second frame 1222, so that the cold plate 212 on the other side moves closer to the second frame 1222, also playing a preliminary limiting role and making it less likely to fall off. This ensures the smooth installation of the two side cold plates 212 and also ensures the fit of the corresponding side tolerance heat conduction interface plate 222 after the side cold plates 212 are installed.

[0042] Furthermore, the first mounting inclined surface 120a and the second mounting inclined surface 120b are arranged opposite to each other, and the third mounting inclined surface 210a and the fourth mounting inclined surface 210b are arranged opposite to each other.

[0043] In this embodiment, there are two of each of the following: the first installation guide block 1202, the second installation guide block 1203, the first installation limiting block 2102, and the second installation limiting block 2103. The two first installation guide blocks 1202 are arranged opposite to each other, the two second installation guide blocks 1203 are arranged opposite to each other, the two first installation limiting blocks 2102 are arranged opposite to each other, and the two second installation limiting blocks 2103 are arranged opposite to each other. The corresponding number of the first installation tilting surface 120a, the second installation tilting surface 120b, the third installation tilting surface 210a, and the fourth installation tilting surface 210b are all two.

[0044] Furthermore, the cold plate component 210 has a clearance notch, which is adjacent to a mounting limit block, and the mounting guide block abuts against the inner wall of the clearance notch to prevent the installed cold plate component 210 from shifting in the horizontal direction. Even further, combined with... Figure 4 and Figure 5 As shown, the clearance notch includes a first clearance notch 210c and a second clearance notch 210d. The first clearance notch 210c is formed on one side of the cold plate 212, and the second clearance notch 210d is formed on the other side of the cold plate 212. The first mounting guide block 1202 abuts against the first clearance notch 210c of one side of the cold plate 212, and the second mounting guide block 1203 abuts against the second clearance notch 210d of the other side of the cold plate 212 to prevent the two side cold plates 212 from shifting in the horizontal direction after installation.

[0045] In this embodiment, there are two first avoidance gaps 210c and two second avoidance gaps 210d. The two first avoidance gaps 210c are arranged opposite each other, and the two second avoidance gaps 210d are arranged opposite each other.

[0046] like Figure 1 As shown, the integrated interconnect system 10 based on the VNX+ architecture disclosed herein also includes a power function component 300, which is installed in the integrated interconnect chassis based on the VNX+ architecture, wherein part or all of the structure of the power function component 300 is located within a receiving cavity.

[0047] like Figure 6 and Figure 7 As shown, in one embodiment, the power function component 300 includes a backplate component 310 and an interface communication component 320. The communication transceiver terminal of the backplate component 310 is electrically connected to the communication terminal of the interface communication component 320. The backplate component 310 is used to mount a module 330, which includes, but is not limited to, a power module and a function module. The interface communication component 320 passes through the horizontal mounting port 1101 and is connected to the mounting frame 120. The backplate component 310 passes through the vertical mounting port 1103 and is connected to the interior of the mounting frame 120. The backplate component 310 is located in the receiving cavity 1201. It can be understood that when installing the backplate component 310 and the interface communication component 320, the interface communication component 320 is installed horizontally to be fixed on the mounting frame 120, and the backplate component 310 is installed vertically to be fixed on the mounting frame 120. The backplate component 310 is located in the receiving cavity 1201. The two components do not interfere with each other during installation, thereby improving the convenience of component installation.

[0048] In this embodiment, after the mounting compartment 110 and the mounting frame 120 are assembled, the interface communication component 320 is mounted on the mounting frame 120 through the horizontal mounting port 1101, that is, it is mounted horizontally on the mounting frame 120. The back plate component 310 and the cold plate component 210 are both mounted on the mounting frame 120 through the longitudinal mounting port 1103, that is, they are mounted longitudinally on the mounting frame 120.

[0049] Furthermore, such as Figures 6 to 8 As shown, the backplane component 310 includes a backplane body 311 and several guide members 312. The communication transceiver end of the backplane body 311 is electrically connected to the communication end of the interface communication component 320. The backplane body 311 has several insertion slots 3111, each of which is used to install a corresponding module 330, such as a power module, a filter module, a core board COME / QMC module, an input / output (I / O) module, etc. The multiple guide members 312 are arranged side by side with the insertion slots 3111. Specifically, every two guide members 312 are arranged side by side with the corresponding insertion slots 3111. The module 330 has a guide sleeve 331 (not shown in the attached figure). (View perspective) The guide sleeve 331 has a mounting guide hole 3311. When installing the module 330, the guide member 312 can pass through the mounting guide hole 3311. With the cooperation of the guide member 312 and the mounting guide hole 3311, the power-connecting part of the module 330 is aligned with the insertion slot 3111, and then the module 330 is inserted into the back plate body 311. This achieves the effect of preventing incorrect insertion. Furthermore, the guide member 312 has a guide cone 312a. Thus, when installing the module 330, the function of the guide cone 312a is to guide the module 330 to be inserted in the correct direction, thereby further avoiding the module 330 from shifting during the installation process, and thus reducing the installation difficulty of the module 330.

[0050] In this embodiment, the backplane main body 311 and the interface communication component 320 adopt a high-speed bus, secondary power supply and control bus with the VNX+ standard protocol; it can support the use of commercial power supply modules, filter modules, core board COME / QMC modules and IO modules that conform to the VNX+ standard, realize the rapid construction of the system, reduce the development cycle and production cost, and have excellent maintainability.

[0051] Furthermore, such as Figures 6 to 8As shown, the backplate body 311 has a through hole. Each guide member 312 includes a guide body 3121, a guide base 3122, a transition post 3123, and a locking fastener 3124. The transition post 3123 passes through the through hole, and the guide base 3122 is fixed to the backplate body 311 by the locking fastener 3124. The guide body 3121 and the guide base 3122 are rotatably connected. The guide body 3121 has a key notch 31211, which allows the orientation angle of the key notch 31211 to be flexibly changed. The module 330 has a key entity 332, which is located on the inner wall of the mounting guide hole 3311 in one direction, such as 0°, 90°, 180°, 270°, etc. The position of the key entity 332 is... Different modules can be adapted to various modules 330 by rotating the guide body 3121 to adjust the orientation of the key notch 31211 to a specified angle, thus supporting the anti-misinsertion effect of multiple types of modules 330 and further improving the installation adaptability of the modules 330. Specifically, each insertion slot 3111 corresponds to two guide bodies 3121, which can rotate to flexibly change the orientation angle of the corresponding key notch 31211. Depending on the position of the key entity 332 of different modules 330, such as 0°, 90°, 180°, 270°, and so on, the anti-misinsertion function of 16 types of modules can be realized. The effect diagram of the matching of the key notch 31211 and the key entity 332 during insertion is shown in the figure. Figure 9 As shown. In this embodiment, the guide cone 312a is provided on the guide body 3121.

[0052] In one embodiment, the number of plug-in slots 3111 is multiple and variable. Thus, when more or fewer modules are needed, a specified number of plug-in slots 3111 can be flexibly designed on the backplane body 311 to meet actual requirements. In a specific embodiment, for the basic version design, three plug-in slots 3111 can be designed, one for a power module and the other two for functional modules, such as I / O modules and computing / control modules. The specific structure is as follows... Figure 10 As shown; for the advanced design, four connector slots 3111 can be designed, one of which is used to insert the power module, and the other three connector slots 3111 are used to insert functional modules, such as filter modules, core board COME / QMC modules, and I / O modules. The specific structure is as follows. Figure 11As shown; for the extended version design, eight plug-in slots 3111 can be designed. One plug-in slot 3111 is used to plug in the power supply module, another plug-in slot 3111 is used to plug in the data exchange module, such as a switch module for providing high-speed data exchange, and the remaining six are used to plug in functional modules, such as filtering modules, core board COME / QMC modules, I / O modules, signal amplification modules, etc. The specific structure is as follows. Figure 12 As shown. It should be noted that the above scheme is only an example and not a functional limitation. The number of the designed plug slots 3111 can be adjusted according to the actual situation.

[0053] like Figure 6 and Figure 7 As shown, in one embodiment, the interface communication component 320 includes an interface module 321, a filtering / signal enhancement module 322, and a connection board 323. The input / output terminals of the interface module 321 are electrically connected to the interface communication terminals of the connection board 323. The filtering / signal enhancement module 322 is electrically connected to the processing terminal of the connection board 323. The data communication terminal of the connection board 323 is electrically connected to the data communication transceiver terminal of the backplane component 310, specifically to the data communication transceiver terminal of the backplane body 311. It can be understood that when the module interacts with other devices or modules through the interface module 321, the connection board 323 acts as a data transmission carrier for data interaction between different devices or modules. The filtering / signal enhancement module 322 is used to enhance signal strength, eliminate external signal noise, filter out interference signals, and ensure the authenticity and effectiveness of data transmission between modules. In this embodiment, the connecting plate 323 is a flexible interconnect rigid-flex plate, which makes the flexible part more flexible and its length adjustable, thereby flexibly adjusting the distance between the interface module 321 and the backplane body 311 to adapt to the current specification of the mounting bracket 120. Thus, this solution has high compatibility with the installation of the backplane component 310 and the interface communication component 320.

[0054] Compared with the prior art, this disclosure has, but is not limited to, the following advantages: The aforementioned integrated interconnect chassis based on the VNX+ architecture employs a heat dissipation fixing component 200 to allow contact between the heat dissipation fixing component 200 and the power function component 300. Specifically, after the installation of the power function component 300 and the cold plate component 210 is completed, the tolerance thermal interface component 220 is used to fill the gap between the cold plate component 210 and the power function component 300, thereby playing a role in filling the gap and providing tolerance. At the same time, the fit between each module and the corresponding interface material can be checked simply by removing the cover 130, avoiding the risk of heat dissipation failure. When maintenance is required in the future, the module can be replaced simply by removing the cover 130 and the heat dissipation fixing component 200, thereby reducing the difficulty of module replacement. It has good adaptability to the installation of modules in the VNX+ architecture, reducing the development cycle and production cost of system construction, as well as maintenance and repair costs.

[0055] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A comprehensive interconnect chassis based on the VNX+ architecture, characterized in that, include: The cabin assembly includes a mounting cabin and a mounting frame. The mounting cabin has a lateral mounting port, a cavity, and a longitudinal mounting port. The mounting frame is located in the cavity and connected to the mounting cabin. The mounting frame forms a receiving cavity, which is respectively connected to the lateral mounting port and the longitudinal mounting port. A heat dissipation fixing assembly includes a cold plate component and a tolerance thermally conductive interface component. The cold plate component is fixed to the mounting bracket. The tolerance thermally conductive interface component is disposed on the inner wall of the cold plate component. The tolerance thermally conductive interface component forms a fixed tolerance groove. The fixed tolerance groove communicates with the receiving cavity so that the fixed tolerance groove and the receiving cavity together form a receiving cavity. The receiving cavity is used to accommodate at least a portion of the structure of the power supply functional component.

2. The integrated interconnect chassis based on the VNX+ architecture according to claim 1, characterized in that, The cabin assembly also includes a hatch that covers the longitudinal mounting opening and is detachably connected to the mounting bracket.

3. The integrated interconnect chassis based on the VNX+ architecture according to claim 2, characterized in that, The hatch is connected to the mounting bracket by any of the following methods: snap-fit, fastening, or screwing.

4. The integrated interconnect chassis based on the VNX+ architecture according to claim 1, characterized in that, The mounting frame includes a base frame and a frame assembly. The base frame is located inside the cavity and is fixedly connected to the mounting compartment. The base frame has a support and fixing member. The frame assembly is fixed to the base frame. The support and fixing member and the frame assembly together form the receiving cavity. The support and fixing member is used to support and fix the power supply functional component. The cold plate component is fixed to the frame assembly.

5. The integrated interconnect chassis based on the VNX+ architecture according to claim 4, characterized in that, The cold plate component includes a top cold plate and at least two side cold plates, each of which is fixedly installed on the frame assembly; the tolerance thermal interface component includes a top tolerance thermal interface plate and at least two side tolerance thermal interface plates, each of which is disposed on a corresponding side cold plate, and the top tolerance thermal interface plate is disposed on the top cold plate; each of which is used to abut against the side of the power function component; the top tolerance thermal interface plate is disposed opposite to the support fixing member, and the top tolerance thermal interface plate is used to abut against the top of the power function component.

6. The integrated interconnect chassis based on the VNX+ architecture according to claim 4, characterized in that, The frame assembly includes a first frame, a second frame, a first fixing rod, and a second fixing rod. The first frame and the second frame are fixed side by side on the base frame. The two ends of the first fixing rod are respectively connected to the first frame and the second frame, and the two ends of the second fixing rod are respectively connected to the first frame and the second frame, so that the first frame, the second frame, the first fixing rod, the second fixing rod, and the support fixing member together form the receiving cavity; the cold plate component is respectively fixed to the first frame and the second frame.

7. The integrated interconnect chassis based on the VNX+ architecture according to claim 1, characterized in that, The inner wall of the cold plate component has an embedded groove, and the tolerance thermal interface component is installed in the embedded groove.

8. The integrated interconnect chassis based on the VNX+ architecture according to claim 1, characterized in that, The mounting bracket is welded or screwed to the mounting compartment; and / or The installation compartment is cylindrical.

9. The integrated interconnect chassis based on the VNX+ architecture according to claim 1, characterized in that, The mounting bracket is provided with a mounting guide block, the mounting guide block having a first mounting inclined surface, the cold plate component having a mounting limiting block, the mounting limiting block having a second mounting inclined surface, and the first mounting inclined surface abutting against the second mounting inclined surface.

10. A comprehensive interconnect system based on the VNX+ architecture, characterized in that, It includes a power supply functional component and a VNX+-based integrated interconnect chassis as described in any one of claims 1-9, wherein the power supply functional component is installed within the VNX+-based integrated interconnect chassis.

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