An integrated PXI chassis system with ultra-high performance CPU controller

Abstract

The application relates to the technical field of PXIe test systems, in particular to an integrated PXI chassis system integrated with an ultra-high-performance CPU controller. In the integrated PXI chassis system: a card slot module is used for clamping a PXIe module card, and the card slot module and a power supply module are arranged in a front end of a box body in a top-bottom sequence; a bottom plate is arranged on a bottom surface in the box body; the power supply module is arranged on a front side of the bottom plate; a mainboard is arranged on a rear side of the bottom plate, and an IO panel of the mainboard extends to an opening of a back side panel of the box body; a radiator is arranged above a CPU of the mainboard; a heat dissipation opening of the radiator faces the back side panel; a first air vent is arranged on the back side panel; a first cooling fan is arranged on an inner wall of the back side panel and located at a gathering position of the first air vent; and a connecting piece is arranged at one end of the card slot module facing the back side panel, so that the plugged PXIe module card is electrically connected with the mainboard, and the heat dissipation effect of the mainboard is enhanced, and a CPU with high computing capacity is supported.

Description

Technical Field

[0001] This invention relates to the field of PXIe testing system technology, and more particularly to an integrated PXI chassis system with an integrated ultra-high performance CPU controller. Background Technology

[0002] In existing PXI chassis, the slots for installing PXI controllers and PXIe module cards are typically arranged side-by-side. For example, in a 17-slot PXI chassis, slot 1 is generally used for the PXI controller, and slots 2-16 are generally used for PXIe module cards, with the 17 slots usually evenly spaced. While this structure allows for easy replacement of different PXI controller models as needed, the PXI controller and PXIe module cards must be placed side-by-side. The limited space occupied by the PXI controller prevents the placement of high-performance heatsinks. Since the PXI controller provides the primary computing power to the PXI chassis, its relatively weak cooling system cannot support high-performance CPUs, resulting in limited computing power in existing PXI chassis and an inability to run complex algorithms.

[0003] Therefore, there is a need to provide a PXI chassis system with high computing power. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides an integrated PXI chassis system that integrates an ultra-high-performance CPU controller.

[0005] The present invention provides an integrated PXI chassis system with an integrated ultra-high performance CPU controller, including a chassis, card slot module, motherboard, heat sink, power supply module, base plate, and connectors;

[0006] The card slot module is used to hold the PXIe module card, and it is arranged in the front end of the housing along with the power module in an upper-lower sequence.

[0007] The base plate is disposed on the bottom surface inside the box body;

[0008] The power module is located on the front side of the base plate;

[0009] The motherboard is located on the rear side of the base plate, and its I / O panel extends to the opening of the rear panel of the enclosure.

[0010] The heatsink is located above the CPU on the motherboard;

[0011] The heat dissipation vents of the radiator face the rear panel;

[0012] A first ventilation hole is provided on the back side panel;

[0013] A first cooling fan is provided on the inner wall of the back panel at the point where the first ventilation holes converge.

[0014] The connector is located at one end of the card slot module facing the back panel, and is used to establish an electrical connection between the inserted PXIe module card and the motherboard.

[0015] In one possible implementation, the card slot module includes an upper card slot structure and a lower card slot structure that are integrally formed respectively;

[0016] The upper slot structure is located on the top of the housing and is positioned opposite to the lower slot structure.

[0017] The lower slot structure is located in the middle of the box body.

[0018] In one possible implementation, a screen is provided on the front side panel of the enclosure.

[0019] In one possible implementation, the screen is a touch screen.

[0020] In one possible implementation, the card slot module has a 16-slot structure.

[0021] In one possible implementation, the left side panel, top side panel, and right side panel of the housing are integrally designed bent components.

[0022] In one possible implementation, the left and right panels are provided with second ventilation holes in the middle part near the rear end, and a second cooling fan is provided on the inner wall of each panel at the convergence point of the second ventilation holes.

[0023] In one possible implementation, third ventilation holes are provided on the upper and lower sides of the left and right panels, respectively.

[0024] In one possible implementation, the height of the enclosure is 5U.

[0025] In one possible implementation, the heat sink is an air-cooled heat sink.

[0026] The technical solution provided by this invention has at least the following beneficial effects:

[0027] By positioning the card slot module and power supply module vertically at the front of the enclosure, with the base plate on the bottom surface of the enclosure, the power supply module on the front side of the base plate, and the motherboard on the rear side of the base plate, a heatsink is placed above the CPU on the motherboard, with the heatsink's vents facing the rear panel. A first ventilation hole is provided on the rear panel, and a first cooling fan is placed on the inner wall of the rear panel at the convergence point of the first ventilation hole, thereby enhancing the heat dissipation effect on the motherboard and supporting high-performance CPUs. Attached Figure Description

[0028] Figure 1 An exploded view of the integrated PXI chassis system with an integrated ultra-high performance CPU controller provided in an embodiment of the present invention.

[0029] Figure 2 This is a second-view exploded structural diagram of an integrated PXI chassis system with an integrated ultra-high-performance CPU controller provided in an embodiment of the present invention.

[0030] Figure 3 A first-view perspective three-dimensional structural diagram of an integrated PXI chassis system with an integrated ultra-high performance CPU controller provided in an embodiment of the present invention;

[0031] Figure 4 This is a first partial structural diagram illustrating the mating relationship of the card slot module provided in an embodiment of the present invention;

[0032] Figure 5 This is a second partial structural diagram illustrating the mating relationship of the card slot module provided in an embodiment of the present invention;

[0033] Figure 6 A schematic diagram of the internal structure of an integrated PXI chassis system with an integrated ultra-high performance CPU controller provided in an embodiment of the present invention;

[0034] In the attached diagram, 10 is the enclosure; 11 is the card slot module; 12 is the motherboard; 13 is the heat sink; 14 is the power supply module; 15 is the base plate; 16 is the connector; 17 is the PXIe module card; 18 is the screen; 101 is the rear panel; 102 is the front panel; 103 is the left panel; 104 is the top panel; 105 is the right panel; 111 is the upper card slot structure; 112 is the lower card slot structure; 113 is the bracket; 121 is the I / O panel; 1011 is the first ventilation hole; 1012 is the first cooling fan; 1031 is the second ventilation hole; 1032 is the second cooling fan; and 1033 is the third ventilation hole. Detailed Implementation

[0035] To enhance understanding of the present invention, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. These embodiments are only used to explain the invention and do not limit the scope of protection of the invention.

[0036] Please refer to Figures 1 to 6 The present invention provides an integrated PXI chassis system with an integrated ultra-high performance CPU controller, including a chassis 10, a card slot module 11, a motherboard 12, a heat sink 13, a power supply module 14, a base plate 15, and connectors 16.

[0037] The card slot module 11 is used to hold the PXIe module card 17, which is arranged in the front end of the housing 10 in the order of top and bottom with the power module 14.

[0038] The bottom plate 15 is disposed on the bottom surface inside the housing 10;

[0039] The power module 14 is disposed on the front side of the base plate 15;

[0040] The motherboard 12 is located on the rear side of the base plate 15, and its I / O panel 121 extends to the opening of the back panel 101 of the housing 10.

[0041] The heat sink 13 is disposed above the CPU of the motherboard 12;

[0042] The heat dissipation vent of the radiator 13 faces the back panel 101;

[0043] A first ventilation hole 1011 is provided on the back panel 101;

[0044] A first cooling fan 1012 is provided on the inner wall of the back panel 101 at the point where the first ventilation holes 1011 converge.

[0045] The connector 16 is disposed at one end of the card slot module 11 facing the back panel 101, and is used to establish an electrical connection between the inserted PXIe module card 17 and the motherboard 12.

[0046] In this embodiment, the housing 10 is used to accommodate components such as the card slot module 11, motherboard 12, heat sink 13, power supply module 14, base plate 15, and connector 16. After the PXIe module card 17 is inserted into the card slot module 11, it establishes an electrical connection with the motherboard 12 through the connector 16. The motherboard 12 in this application occupies a large space in the housing 10 and can be configured with a high-performance CPU controller (hereinafter referred to as CPU). The large amount of heat generated by the high-performance CPU during operation can be efficiently dissipated by the heat sink 13. The heat dissipated by the heat sink 13 can be discharged from the housing 10 through the first ventilation hole 1011 by the first cooling fan 1012. The heat sink 13 can be a conventional air-cooled heat sink or a water-cooled heat sink. The card slot module 11 can adopt a 4-slot structure, a 10-slot structure, a 16-slot structure, etc., which can be selected according to the actual implementation needs. The rear panel 101 has multiple first ventilation holes 1011, which can converge to form an exhaust vent that matches the airflow of the first cooling fan 1012, thereby enhancing heat dissipation. The rear panel 101 may also have a power button and a power connector, which is located inside the chassis 10 and connected to the power module 14 via a power cable. The I / O panel 121 can have standard I / O interfaces. The power connector connects to the power module 14 to supply external power, which in turn provides operating voltage to the motherboard 12, the connected PXIe module card 17, and other components.

[0047] In one possible implementation, such as Figure 4 and Figure 5 The card slot module 11 includes an upper card slot structure 111 and a lower card slot structure 112 that are integrally formed.

[0048] The upper slot structure 111 is disposed on the top of the housing 10 and is disposed opposite to the lower slot structure 112;

[0049] The lower slot structure 112 is located in the middle of the housing 10.

[0050] In this embodiment, both the upper slot structure 111 and the lower slot structure 112 can be integrally formed from aluminum material through milling. The upper slot structure 111 and the lower slot structure 112 can be fixed between the left side panel 103 and the right side panel 105 of the housing 10 by a pair of brackets 113. The brackets 113 can be 90° angle bent structures. It should be noted that although the upper slot structure 111 and the lower slot structure 112 perform the same function as the existing structure assembled from guide rails (i.e., guide channels, generally plastic parts) and crossbeams—namely, for inserting the PXIe module card 17—the integrally formed structure (aluminum parts) has better stability and stronger vibration resistance compared to the existing assembled structure.

[0051] In one possible implementation, a screen 18 is provided on the front panel 102 of the housing 10.

[0052] In this embodiment, screen 18 can be used to display various data during the operation of the integrated PXI chassis system. Screen 18 is electrically connected to motherboard 12, and motherboard 12 can transmit various types of data that need to be displayed to screen 18.

[0053] In one possible implementation, the screen 18 is a touch screen.

[0054] In this embodiment, screen 18 is a touch screen, which can realize human-computer interaction and improve the user experience.

[0055] In one possible implementation, the card slot module 11 has a 16-slot structure.

[0056] In this embodiment, the 16-slot card slot module 11 has 16 slots, which can simultaneously connect 16 PXIe module cards 17. Each PXIe module card 17 can communicate with the motherboard 12.

[0057] In one possible implementation, the left side panel 103, the upper side panel 104, and the right side panel 105 of the housing 10 are integrally designed bent parts.

[0058] In this embodiment, the use of an integrally designed bending component can further improve the vibration resistance of the integrated PXI chassis system.

[0059] In one possible implementation, the left side panel 103 and the right side panel 105 are respectively provided with second ventilation holes 1031 near the middle of the rear end, and a second cooling fan 1032 is respectively provided on the inner wall of each of them at the convergence point of the second ventilation holes 1031.

[0060] In this embodiment, a plurality of second ventilation holes 1031 are provided on the left side panel 103 and the right side panel 105. The plurality of second ventilation holes 1031 can be arranged in a circular air vent. The circular air vent is adjacent to the second cooling fan 1032, which facilitates the second cooling fan 1032 to exhaust the heat inside the housing 10 to the external environment.

[0061] In one possible implementation, third ventilation holes 1033 are respectively provided on the upper and lower sides of the left side panel 103 and the right side panel 105.

[0062] In this embodiment, a plurality of third ventilation holes 1033 are provided on the left side panel 103 and the right side panel 105. The plurality of third ventilation holes 1033 can be gathered into rectangular ventilation openings on the upper and lower sides of the left side panel 103 and the right side panel 105 respectively, which facilitates airflow inside the enclosure 10 and improves the heat dissipation efficiency of the integrated PXI chassis system with integrated ultra-high performance CPU controller.

[0063] In one possible implementation, the height of the housing 10 is 5U.

[0064] In one possible implementation, the heat sink 13 is an air-cooled heat sink.

[0065] The above embodiments should not limit the present invention in any way. All technical solutions obtained by equivalent substitution or equivalent conversion fall within the protection scope of the present invention.

Claims

1. An integrated PXI chassis system with an integrated ultra-high-performance CPU controller, characterized in that, Includes the chassis, card slot module, motherboard, heat sink, power supply module, base plate, and connectors; The card slot module is used to hold the PXIe module card, and it is arranged in the front end of the housing along with the power module in an upper-lower sequence. The base plate is disposed on the bottom surface inside the box body; The power module is located on the front side of the base plate; The motherboard is located on the rear side of the base plate, and its I / O panel extends to the opening of the rear panel of the enclosure. The heatsink is located above the CPU on the motherboard; The heat dissipation vents of the radiator face the rear panel; A first ventilation hole is provided on the back side panel; A first cooling fan is provided on the inner wall of the back panel at the point where the first ventilation holes converge. The connector is located at one end of the card slot module facing the back panel, and is used to establish an electrical connection between the inserted PXIe module card and the motherboard.

2. The integrated PXI chassis system according to claim 1, characterized in that, The card slot module includes an upper card slot structure and a lower card slot structure that are integrally formed; The upper slot structure is located on the top of the housing and is positioned opposite to the lower slot structure. The lower slot structure is located in the middle of the box body.

3. The integrated PXI chassis system according to claim 2, characterized in that, A screen is provided on the front side panel of the enclosure.

4. The integrated PXI chassis system according to claim 3, characterized in that, The screen is a touch screen.

5. The integrated PXI chassis system according to claim 1, characterized in that, The card slot module has a 16-slot structure.

6. The integrated PXI chassis system according to claim 1, characterized in that, The left side panel, top side panel, and right side panel of the box are a single bent component.

7. The integrated PXI chassis system according to claim 6, characterized in that, The left and right panels each have a second ventilation hole in the middle part near the rear end, and a second cooling fan is respectively provided on the inner wall of each panel at the convergence point of the second ventilation hole.

8. The integrated PXI chassis system according to claim 6, characterized in that, The left and right panels each have a third ventilation hole on their upper and lower sides.

9. The integrated PXI chassis system according to claim 1, characterized in that, The height of the enclosure is 5U.

10. The integrated PXI chassis system according to claim 1, characterized in that, The radiator is an air-cooled radiator.

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