Modular replaceable industrial computer motherboard assembly
By using modularly designed water-cooling and shock-absorbing components, the heat dissipation and shock absorption problems of industrial control computer motherboard modules in autonomous vehicles are solved, achieving efficient heat dissipation and stable operation, and improving the safety and stability of autonomous driving.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ADVANTECH CHINA
- Filing Date
- 2026-02-27
- Publication Date
- 2026-05-29
AI Technical Summary
Traditional industrial control computer motherboard modules have insufficient heat dissipation efficiency in autonomous vehicles and lack effective shock protection mechanisms, leading to CPU frequency reduction and easy damage, which affects the safety and stability of autonomous driving.
It adopts a modular design, combining water-cooled heat dissipation components, shock-absorbing components, and air interaction components. It uses a flexible circulating bag for heat dissipation and initial cushioning, a hydraulic shock absorber for secondary cushioning, and a fan to assist in heat dissipation, thereby improving heat dissipation efficiency and stability.
It improves the stability of the industrial control computer motherboard module and the safety of automatic driving, ensures that the CPU does not reduce its frequency, and enhances the module's shock resistance and ease of replacement.
Smart Images

Figure CN122111187A_ABST