Full-automatic online intelligent repair equipment

Abstract

The application discloses a full-automatic online intelligent repair equipment, which comprises a workbench; two ends of the top of the workbench are respectively provided with a repair station and a tin-pointing station, and the middle of the top of the workbench is further provided with a heat insulation frame; a lifting door is further installed on the heat insulation frame; the repair station comprises a first gantry frame installed on the top of the workbench, a repair device installed on the first gantry frame, a first transmission flow channel arranged in the first gantry frame and a feeding and tin-paste scraping mechanism arranged on one side of the first transmission flow channel; a lower heating temperature zone is further arranged in the first transmission flow channel. The application integrates automatic heating, dismounting, tin removing, tin pointing, 3D inspection, dipping, automatic visual alignment and other related functions, and has full-process full-automatic repair capability suitable for more types of devices.

Description

Technical Field

[0001] This invention relates to the field of automation technology, and in particular to a fully automatic online intelligent repair device. Background Technology

[0002] With the rapid development of electronic manufacturing technology towards high density, miniaturization, and multifunctionality, the complexity of printed circuit boards (PCBs) is increasing daily. This is manifested in the continuous shrinking of component sizes (such as micro-chip components like 01005 and 008004, and fine-pitch, bottom-array packaged devices like CSP, BGA, and QFN), extremely high assembly density, and the widespread application of multilayer boards and rigid-flex boards. This trend has significantly increased the value and technological content of PCB components, and correspondingly, the requirements for rework after failure have reached unprecedented levels.

[0003] Currently, PCB rework mainly relies on semi-automatic or manual operating platforms consisting of tools such as hot air workstations, soldering irons, and desoldering guns. Operators, relying on experience and visual observation, perform a series of steps including component positioning, heating, desoldering, pad cleaning (desoldering), applying flux or solder paste to new components, applying solder (tinning), and resoldering. This traditional model is inefficient, labor-intensive, and has the following drawbacks: 1) Insufficient alignment accuracy: For bottom solder joint devices such as BGA and CSP that are difficult to observe directly with the naked eye, manual alignment mainly relies on the operator's experience and limited optical assistance. The accuracy and repeatability are poor, and misalignment and bridging are very likely to occur, leading to rework failure or creating potential reliability hazards. 2) Thermal management and thermal damage risk: On complex PCBs, target components are often located near other temperature-sensitive components. Manual / semi-automatic heating makes it difficult to achieve precise and localized temperature control. Overheating can easily damage surrounding components and PCB substrates, while insufficient heating can lead to desoldering difficulties or cold soldering. The entire process depends on personnel skills and has poor uniformity. 3) Poor process consistency: From the cleanliness of desoldering and the amount of solder for soldering to the thin layer of flux applied, the quality of each step is highly dependent on the operator's skill and condition. This inconsistency directly affects the soldering quality, electrical connectivity and long-term reliability after rework, making it difficult to meet industrial-grade standards. 4) Inefficient and costly: High-precision rework requires experienced technicians, which is time-consuming and labor-intensive. At the same time, due to the aforementioned accuracy and consistency issues, the first-pass yield is low, which may cause secondary damage to valuable components or PCBs, further increasing the overall cost. 5) Functional discreteness and process fragmentation: Existing rework stations usually have a single function. The steps of desoldering, cleaning, coating, and mounting need to be transferred between different equipment or workstations and are manually handled and positioned. This not only increases the complexity and time of the process, but also introduces additional alignment errors and physical damage risks during multiple clamping.

[0004] Furthermore, the current rework of BGA chips primarily utilizes a conveyor chain to transport the PCB board. Heating mechanisms are installed both above and below the two conveyor frames on the conveyor line to heat the areas of the PCB board to be desoldered. During PCB rework, a lifting mechanism and a top limiting plate are required on the conveyor frame. After the PCB board is transported to its designated position, the lifting mechanism raises it to the bottom of the top limiting plate to secure it before desoldering, solder removal, and remounting. Currently, the lifting mechanism and the drive components of the top limiting plate on the BGA rework conveyor line are located inside the conveyor frame, within the heating zone. This prolonged exposure to high temperatures can easily damage the drive components, necessitating high-temperature resistance and the use of appropriate high-temperature resistant materials, thus increasing costs. Additionally, installing the drive components inside the conveyor frame occupies significant installation space, hindering the installation and maintenance of other components. Therefore, improvements are needed. Summary of the Invention

[0005] The purpose of this invention is to provide a fully automatic online intelligent rework equipment that integrates functions such as automatic heating and desoldering, desoldering, soldering, 3D inspection, dipping, and automatic visual alignment. It has the capability to perform fully automatic rework across the entire process for more types of components. Furthermore, the lifting and limiting drive mechanisms on the rework flow channel are all located outside the heating zone, giving the entire flow channel high-temperature resistance and compatibility with products of different sizes. At the same time, the high-temperature working area and the soldering working area are designed to be separated by partitions, with a separation device in place. That is, the two working areas are connected by an automatic edge-distance flow channel, and a lifting door separates the two areas, which can effectively protect the activity of the solder paste in the soldering working area.

[0006] To achieve the above objectives, the following technical solution is adopted: A fully automatic online intelligent rework equipment includes a workbench; a rework station and a soldering station are respectively provided at both ends of the top of the workbench, and a heat insulation frame is also provided in the middle of the top of the workbench; a lifting door is also installed on the heat insulation frame; the rework station includes a first gantry frame installed on the top of the workbench, a rework device installed on the first gantry frame, a first conveying channel arranged in the first gantry frame, and a feeding and solder paste scraping mechanism arranged on one side of the first conveying channel; a lower heating zone is also arranged in the first conveying channel.

[0007] Furthermore, the first transmission channel includes two parallel and spaced first transmission frames, and a transmission chain module is installed on the inner side of each first transmission frame; each first transmission frame is also equipped with a product lifting mechanism and an upper limit mechanism; a first blocking mechanism is also installed at one end of the inner side of one of the first transmission frames; the lower heating zone is arranged between the two first transmission frames; the product lifting mechanism includes a lifting drive assembly installed on the outside of the first transmission frame, and a lifting vertical plate arranged vertically on the inner side of the first transmission frame and connected to the lifting drive assembly; the upper limit mechanism includes an upper translation drive assembly installed on the outside of the first transmission frame, and an upper translation plate slidably arranged on the top of the first transmission frame and connected to the upper translation drive assembly; the lifting vertical plate is located below one side of the upper translation plate, and an upper pressure plate is also connected to one side of the upper translation plate.

[0008] Furthermore, an installation slot is provided in the middle of the outer side of the first transmission frame; a lifting slide plate is slidably connected in the installation slot; a guide slot hole extending through to the inner side of the first transmission frame is provided in the installation slot along the vertical direction, and a lifting connecting plate is also connected to one side of the lifting slide plate; one end of the lifting connecting plate is movably arranged through the guide slot hole; a connecting notch is provided at the bottom of the lifting vertical plate, and the lifting vertical plate is connected to one end of the lifting connecting plate through the connecting notch; the lifting drive assembly is connected to the lifting slide plate, and the lifting drive assembly is used to drive the lifting slide plate to rise and fall; a first slide rail assembly is arranged in the vertical direction on the inner wall of the installation slot, and the lifting slide plate is slidably connected to the first slide rail assembly; the lifting drive assembly includes a first motor horizontally installed at one end of the outer side of the first transmission frame, a first rotating rod connected to the output shaft of the first motor, a first gear installed on the first rotating rod, and a first rack connected in the vertical direction to the other side of the lifting slide plate and meshing with the first gear.

[0009] Furthermore, the mounting slot extends to the top of the first transmission frame, and a first support block is connected to the upper part of the inner wall of the mounting slot; a second slide rail assembly is mounted on the first support block in the horizontal direction, and the upper translation plate is slidably connected to the second slide rail assembly; the upper translation drive assembly includes a second motor mounted on the other side of the first transmission frame, a second rotating rod connected to the output shaft of the second motor, a second gear mounted on the second rotating rod, and a second rack connected in the horizontal direction to the bottom of the upper translation plate and meshing with the second gear.

[0010] Furthermore, two guide limiting plates are also installed on the top of the first transmission frame; the two guide limiting plates are arranged opposite to each other, and the upper translation plate is located between the two guide limiting plates; each guide limiting plate is also equipped with a guide limiting wheel, and the outer wall of the guide limiting wheel is provided with a guide limiting groove with an annular structure along its circumference; each of the bottom ends of the upper translation plate is connected to a guide connecting plate; one side of the guide connecting plate is provided with a guide part with a triangular prism structure, and the pointed corner of the guide part is inserted into the guide limiting groove.

[0011] Furthermore, the rework device includes a rework Y-axis motion module mounted on the first gantry, a rework X-axis motion module connected to the rework Y-axis motion module, and a rework X-axis motion seat connected to the rework X-axis motion module; a desoldering mechanism and a desoldering mechanism are mounted side by side on one side of the rework X-axis motion seat; an infrared temperature sensor is also mounted on one side of the rework X-axis motion seat between the desoldering mechanism and the desoldering mechanism; a rework CCD component is also connected to the bottom of the rework X-axis motion seat; the lower heating zone includes a heating frame, a heating lifting mechanism connected to the bottom of the heating frame, a lower heating component mounted inside the heating frame, a temperature zone X-axis motion module mounted on one side of the heating frame, a temperature zone Y-axis motion module connected to the temperature zone X-axis motion module, and a movable heating component connected to the temperature zone Y-axis motion module and located above the heating frame.

[0012] Furthermore, the soldering station includes a soldering gantry, a soldering device mounted on the soldering gantry, and a soldering channel mechanism arranged below the soldering device and connected to the first transmission channel; a soldering calibration component is also arranged on one side of the soldering channel mechanism; the soldering device includes a soldering Y-axis moving mechanism mounted on the soldering gantry, a soldering X-axis moving mechanism connected to the soldering Y-axis moving mechanism, and a soldering moving base connected to the soldering X-axis moving mechanism; a soldering mechanism and a 3D line scanning mechanism are mounted side by side on one side of the soldering moving base; a soldering head CCD is also installed on one side of the soldering moving base between the soldering mechanism and the 3D line scanning mechanism; the 3D line scanning mechanism includes a line scanning Z-axis mechanism mounted on one side of the soldering moving base, a line scanning lifting base connected to the line scanning Z-axis mechanism, a 3D line scanning camera mounted on the line scanning lifting base, and a laser height sensor mounted on one side of the line scanning lifting base.

[0013] Furthermore, the soldering flow channel mechanism includes two parallel and spaced soldering transfer frames, and a conveyor belt module is installed on the inner side of each soldering transfer frame; each soldering transfer frame is also equipped with a soldering lifting mechanism and a soldering limiting mechanism; a soldering blocking mechanism is also installed at one end of the inner side of one of the soldering transfer frames; the soldering limiting mechanism includes a limiting translation mechanism installed on the outer side of the soldering transfer frame, and a soldering translation plate slidably connected to the top of the soldering transfer frame and connected to the limiting translation mechanism; a soldering upper limit plate is also connected to the side of the soldering translation plate near the conveyor belt module; the soldering lifting mechanism includes a lifting drive assembly installed on the outer side of the soldering transfer frame, and a soldering lifting plate slidably connected to the inner side of the soldering transfer frame and connected to the lifting drive assembly; the soldering lifting plate is located below one side of the soldering upper limit plate.

[0014] Furthermore, the top of the solder transfer frame is provided with a first sliding groove along its width direction, and a first linear guide assembly is also arranged in the first sliding groove; the limiting translation mechanism includes a limiting translation cylinder installed on the outside of the solder transfer frame, and a limiting connecting plate connected to the limiting translation cylinder; the solder transfer plate is slidably arranged on the first linear guide assembly and connected to the limiting connecting plate; the lifting drive assembly includes a lifting rotary motor installed on the outside of the solder transfer frame, and a first drive wheel arranged on the inside of the solder transfer frame and connected to the output shaft of the lifting rotary motor; the inside of the solder transfer frame also has... Two first grooves are separated, and a first driving wheel is located between the two first grooves; a first connecting shaft is connected to the upper and lower parts of each first groove, and a first driven wheel is rotatably connected to each first connecting shaft; a first synchronous belt is wound between the two first driven wheels located in the same first groove; a first synchronous wheel is also installed on each of the two first connecting shafts located in the lower part of the first groove, and a second synchronous belt is wound between the two first synchronous wheels and the first driving wheel; a connecting slider is installed on one side of each first synchronous belt, and one side of the soldering lifting plate is connected to the two connecting sliders.

[0015] Furthermore, the soldering calibration assembly includes a calibration bracket; a calibration sensor and a calibration board are respectively installed at the top two ends of the calibration bracket, and a needle height measuring instrument is also installed in the middle of the top of the calibration bracket; a light-transmitting hole is opened on the calibration board, and a soldering lower CCD is arranged below the light-transmitting hole.

[0016] By adopting the above solution, the beneficial effects of the present invention are: 1) It integrates functions such as automatic heating desoldering, desoldering, soldering, 3D inspection, dipping, and automatic visual alignment, and has the ability to fully automate the entire process of rework to adapt to more types of devices. The lifting and limiting drive mechanisms on the rework flow channel are all located outside the heating zone, which makes the overall flow channel have high temperature resistance and can be compatible with products of different sizes. 2) The high-temperature working area and the soldering working area are designed to be separated and equipped with a separation device. That is, the two working areas are connected by an automatic edge flow channel and a lifting door is provided to separate the two areas, which can effectively protect the activity of solder paste in the soldering working area. 3) It is equipped with an automatic cleaning device for soldering nozzles and an automatic XYZ calibration device to ensure the stability of fully automatic soldering and effectively prevent nozzle clogging to ensure the solder removal effect. At the same time, it is equipped with a 3D line scan device, which can perform line scan before soldering to detect the solder removal effect and can perform comprehensive 3D height measurement of the area to be soldered to ensure the soldering effect. In addition, line scan can be performed after soldering to detect the soldering effect, avoiding the need for placement and soldering due to abnormal soldering effect, thus avoiding rework abnormalities. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention, omitting the frame and the upper cover; Figure 3 This is a schematic diagram of the rework station of the present invention; Figure 4 This is a schematic diagram of the rework device of the present invention; Figure 5 This is a schematic diagram of the feeding and solder paste scraping mechanism of the present invention; Figure 6 This is a schematic diagram of the structure of the lower heating temperature zone of the present invention; Figure 7 This is a schematic diagram of the structure of the first transmission channel of the present invention; Figure 8 This is a schematic diagram of the structure of the first transmission frame of the present invention; Figure 9 for Figure 8 A magnified structural diagram at point A; Figure 10 This is a partial exploded view of the first transmission channel of the present invention; Figure 11 This is a schematic diagram of the tin-plating station of the present invention; Figure 12 This is a schematic diagram of the soldering device of the present invention; Figure 13 This is a schematic diagram of the solder flow channel mechanism of the present invention; Figure 14 This is a schematic diagram of the solder transfer frame of the present invention; Figure 15 for Figure 14 A structural diagram from another perspective; Figure 16 This is a schematic diagram of the soldering calibration component of the present invention; The following are explanations of the labels in the attached diagram:1. Workbench; 2. Rework Station; 3. Soldering Station; 4. Heat Insulation Rack; 5. Lifting Door; 6. Frame; 7. Upper Cover; 21. First Gantry; 22. Rework Device; 23. First Transfer Channel; 24. Feeding and Solder Paste Scraping Mechanism; 25. Lower Heating Zone; 31. Soldering Gantry; 32. Soldering Device; 33. Soldering Channel Mechanism; 34. Soldering Calibration Component; 35. Needle Cleaning Component; 36. Pre-Soldering Component; 221. Rework Y-Axis Motion Module; 222. Rework X-Axis Motion Module; 223. Rework X-Axis Motion Seat; 224. Desoldering Mechanism; 225. Solder Removal Mechanism; 226. Infrared Temperature Sensor; 227. Rework CCD Component; 231. First Transfer Rack; 232. Product Lifting Mechanism; 233. Upper 234. Limiting mechanism; 235. Conveyor base plate; 236. Spacing adjustment mechanism; 237. First blocking mechanism; 248. First Z-axis motion module; 249. Z-axis lifting platform; 240. Solder paste scraping assembly; 241. Solder removal nozzle assembly; 242. Rework feeder; 243. Lower rework CCD; 244. Rework recycling platform; 255. Heating frame; 256. Moving heating element; 257. Lower heating element; 258. Temperature zone X-axis motion module; 259. Temperature zone Y-axis motion module; 320. Soldering Y-axis moving mechanism; 321. Soldering X-axis moving mechanism; 322. Soldering moving base; 323. Soldering mechanism; 324. Soldering mechanism; 325. 3D line scanning mechanism; 326. Soldering head CCD; 331. Soldering transfer frame; 332 333. Soldering lifting mechanism; 334. Soldering limiting mechanism; 345. Soldering blocking mechanism; 346. Calibration bracket; 347. Calibration sensor; 348. Calibration board; 349. Needle height gauge; 340. Lower CCD for soldering; 2311. Mounting slot; 2312. Lifting slide plate; 2313. Guide slot; 2314. First slide rail assembly; 2315. First support block; 2316. Second slide rail assembly; 2317. Guide limiting plate; 2318. Guide limiting wheel; 2319. Guide limiting groove; 2321. Lifting vertical plate; 2322. Connecting notch; 2323. First motor; 2324. First rotating rod; 2325. First gear; 2326. First rack; 2327. First bearing seat; 2331. Upper translation plate; 2332. Upper pressure plate; 2333. Second motor; 2334. Second rotating rod; 2335. Second gear; 2336. Second rack; 2337. Second bearing seat; 2338. Guide connecting plate; 2339. Guide part; 3241. Soldering Z-axis mechanism; 3242. Soldering lifting plate; 3243. Soldering valve assembly; 3251. Line scan Z-axis mechanism; 3252. Line scan lifting seat; 3253. 3D line scan camera; 3254. Laser height sensor; 3321. Soldering lifting plate; 3322. Lifting rotary motor; 3323. First driving wheel; 3324. First groove; 3325. First driven wheel; 3326. First synchronous belt; 3327. Second synchronous belt;3331. Soldering translation board; 3332. Soldering upper limit board; 3333. First linear guide assembly; 3334. Limiting translation cylinder. Detailed Implementation

[0018] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0019] Reference Figures 1 to 16 As shown, the present invention provides a fully automatic online intelligent rework equipment. In one embodiment, it includes a workbench 1; the top two ends of the workbench 1 are respectively provided with a rework station 2 and a soldering station 3, and a heat insulation frame 4 is also provided in the middle of the top of the workbench 1; a lifting door 5 is also installed on the heat insulation frame 4; the rework station 2 includes a first gantry frame 21 installed on the top of the workbench 1, a rework device 22 installed on the first gantry frame 21, a first transmission channel 23 arranged in the first gantry frame 21, and a feeding and solder paste scraping mechanism 24 arranged on one side of the first transmission channel 23; a lower heating zone 25 is also arranged in the first transmission channel 23.

[0020] In this embodiment, it also includes a frame 6 and an upper cover 7 that encloses the rework station 2 and the soldering station 3; continuing to refer to Figures 1 to 16 As shown, in this embodiment, the rework station 2 includes a rework Y-axis motion module 221 mounted on a first gantry 21, a rework X-axis motion module 222 connected to the rework Y-axis motion module 221, and a rework X-axis motion seat 223 connected to the rework X-axis motion module 222; a desoldering mechanism 224 and a desoldering mechanism 225 are mounted side-by-side on one side of the rework X-axis motion seat 223; an infrared temperature sensor 226 is also mounted on one side of the rework X-axis motion seat 223 between the desoldering mechanism 224 and the desoldering mechanism 225; and a rework C-axis motion module is also connected to the bottom of the rework X-axis motion seat 223. CD component 227; the product lifting mechanism 232 includes a lifting drive assembly installed on the outside of the first transmission frame 231, and a lifting vertical plate 2321 arranged vertically on the inside of the first transmission frame 231 and connected to the lifting drive assembly; the upper limit mechanism 233 includes an upper translation drive assembly installed on the outside of the first transmission frame 231, and an upper translation plate 2331 slidably arranged on the top of the first transmission frame 231 and connected to the upper translation drive assembly; the lifting vertical plate 2321 is located below one side of the upper translation plate 2331, and an upper pressure plate 2332 is also connected to one side of the upper translation plate 2331.

[0021] The rework Y-axis motion module 221 and rework X-axis motion module 222 can use existing linear modules. The desoldering mechanism 224, the desoldering mechanism 225, and the rework CCD component 227 can use existing modules, or you can refer to the relevant content recorded in our company's previous BGA chip rework series patents. These include desoldering Z-axis, desoldering Z-axis, desoldering components (including linear motion module, weighing sensor, heating element, cylinder, laser displacement sensor, etc., whose main function is to heat and blow air to melt solder balls, and then remove the solder with a non-contact suction nozzle, and the cylinder cleans the solder residue on the suction nozzle, etc.), and desoldering components, etc., whose main functions are to disassemble, desolder, mount, and solder, etc. The rework CCD component 227 includes CCD telescopic Y-axis, CCD camera, CCD zoom drive axis, light source and prism, etc., whose main functions are CCD positioning of rework products, taking pictures and stitching images at the desoldering station for rapid production of desoldering paths, etc. (existing technology can be used).

[0022] Meanwhile, the lower heating zone 25 includes a heating frame 251, a heating lifting mechanism connected to the bottom of the heating frame 251, a lower heating component 253 (an array of heating bricks) installed in the heating frame 251, a zone X-axis motion module 254 installed on one side of the heating frame 251, a zone Y-axis motion module 255 connected to the zone X-axis motion module 254, and a movable heating component 252 (heating brick) connected to the zone Y-axis motion module 255 and located above the heating frame 251. The lower heating zone 25 can directly use existing heating devices, or refer to the relevant content recorded in the BGA chip repair series patents previously filed by our company. It includes a moving heating zone heating brick, a moving heating zone X-axis assembly, and a moving heating zone Y-axis assembly. Its main function is to move the moving heating zone forward, backward, left, and right to concentrate heating on the bottom of the PCB board and to preheat the PCB board as a whole to prevent local heat deformation. The heating lifting mechanism includes a reducer, stepper motor, guide rail, lead screw, photoelectric sensor, etc. Its main function is to lift and lower the heating zone.

[0023] In addition, the solder paste feeding mechanism 24 includes a first Z-axis motion module 241 and a Z-axis lifting platform 242 connected to the first Z-axis motion module 241. The top of the Z-axis lifting platform 242 is arranged from left to right as follows: a solder paste scraping assembly 243, a solder discharge nozzle assembly 244, a rework feeding platform 245, a lower rework CCD 246, and a rework recycling platform 247. The solder paste feeding mechanism 24 can directly use existing devices or refer to the relevant content recorded in the company's previously filed BGA chip rework series patents. It includes a stepper motor, guide rail, lead screw, photoelectric sensor, rodless cylinder, slide cylinder, feeding tray, waste tray, DIMM positioning fixture, solder dross collector, etc. Its main functions are to raise and lower the overall platform, scrape the solder paste evenly, feed new material, receive waste material, position the DIMM slot, and collect self-cleaning solder dross.

[0024] The working steps of rework station 2 are as follows: 1) Check the power supply and air supply of the equipment, turn on the air switch and the main power switch to power on the equipment, start the power supply of the working machine, and reset the whole machine; 2) For products with established formulas, loading can be performed directly (in offline mode, manual loading is performed, and PCBs with tooling can be directly loaded to the rework station, and the rework product information and location information can be obtained by scanning the code; in online mode, it can be directly connected to the upper equipment, and the PCBs with tooling are input from the upper equipment into this equipment, and the rework product and location information are transmitted into this equipment). 3) When the product enters the rework station working area from the flow channel, the first blocking mechanism 236 stops the product. After the product stops, the upper translation drive assembly drives the upper translation plate 2331 to move the upper pressure plate 2332 to the side above the product. Then, the lifting drive assembly drives the lifting vertical plate 2321 to rise, thereby lifting the product to the bottom of the upper pressure plate 2332 to limit and fix the product (to ensure the fixation and reference limit of the product during the rework process). 4) After the product is positioned in the rework station flow channel, the CCD in the rework head station component takes a picture to position it, achieving accurate visual positioning. After positioning, the rework head moves to above the position to be reworked and then descends to the set working height. At the same time, the lower infrared preheating temperature zone rises and falls to the set position, and the lower moving temperature zone moves to directly below the position to be reworked. 5) After the three heating devices reach their set working positions, they simultaneously run the pre-set temperature curve formula for desoldering heating; 6) After the heating temperature reaches the set temperature, the rework suction nozzle in the rework desoldering head lowers to pick up the device that has been heated and desoldered. The vacuum continuously monitors whether the desoldering is completed. After successful pickup, the head assembly moves to the rework recycling area and is placed in the recycling area. The desoldering work is completed. 7) After desoldering is completed, the desoldering head moves to the desoldering station and then descends to the set working height. The desoldering head is heated until the desoldering is stable. Then, the desoldering head performs desoldering according to the set desoldering path (if no desoldering path is set, the head CCD can take pictures of the desoldering area to quickly produce a desoldering path). During this process, the vacuum flow monitoring component of the desoldering head adjusts the height of the desoldering head nozzle in real time according to the vacuum value to achieve real-time non-contact desoldering to avoid damage to the product. At the same time, the entire desoldering head is under real-time monitoring by the weighing sensor, providing double protection to avoid product damage caused by contact desoldering. 8) After desoldering is completed, the overall heating device is cooled down. Crossflow fans are installed on both sides of the workstation. When the crossflow fans are turned on, they dissipate heat and cool down the product. The infrared temperature measuring device in the rework head continuously performs multi-point continuous cyclic temperature measurement on the product. When the temperature at multiple points stabilizes and drops to the set safe temperature, the heat dissipation is completed and the crossflow fans are turned off.

[0025] After the detinning process is completed, the product can be repaired using any of the following methods, depending on the actual coating process of the components being repaired: 1. Dipping (solder paste) + mounting + soldering, such as conventional BGA; 2. Tinning + mounting + soldering, such as DIMMs.

[0026] For scenario 1, the product does not need to proceed to the soldering station; it can continue at the rework station to complete the entire rework process, including dipping, mounting, and soldering. Scenario 2, however, requires the product to be moved to the soldering station for soldering before returning to the rework station for mounting and soldering. The process for scenario 1 is described below: 9) After the product has cooled down, the rework head moves to the feeding table to pick up the prepared OK components, moves to the high-precision solder paste / flux assembly for dipping, and then moves to the CCD at the bottom of the rework station to take pictures and recognize them, so as to realize the XY positioning and angle correction of the components on the nozzle. Then it moves to the mounting station, where the CCD at the head station takes pictures and recognizes the position and angle of the mounting station on the PCB. 10) After the PCB board and the components to be mounted are positioned and angled, the components are mounted. After mounting is completed, the three heating devices move to the set working position and simultaneously run the set temperature profile recipe for heating and reflow soldering. 11) After welding is completed, the product is cooled down. After cooling is completed, the material is unloaded. If the product is offline, an alarm will be triggered to prompt manual unloading. If the product is online, a signal will be sent to the downstream equipment. Based on the feedback signal from the downstream equipment, the product will be transported to the next workstation.

[0027] 12) Under operating condition 2, after the product has cooled down, the lifting door 5 between the two workstations is lowered, and the fixture with the PCB is transported from the rework station flow channel to the soldering station flow channel. When the product is transported to the fixed working area of ​​the soldering station flow channel, the lifting door 5 is raised (sensors are initially installed at the ports of both flow channels near the lifting door 5 to ensure that the lifting door 5 is closed only after the product has been completely transported), and then the soldering action begins. The specific soldering process is described below.

[0028] In a preferred embodiment, an installation slot 2311 is provided at the center of the outer side of the first transmission frame 231; a lifting slide plate 2312 is slidably connected in the installation slot 2311; a guide slot 2313 is provided in the installation slot 2311 along the vertical direction, extending to the inner side of the first transmission frame 231; a lifting connecting plate is also connected to one side of the lifting slide plate 2312; one end of the lifting connecting plate is movably arranged through the guide slot 2313; a connecting notch 2322 is provided at the bottom of the lifting vertical plate 2321, and the lifting vertical plate 2321 is connected to one end of the lifting connecting plate through the connecting notch 2322; the lifting drive assembly is connected to the lifting slide plate 2312, and the lifting drive assembly is used to drive the lifting slide plate 2312 to rise and fall.

[0029] In this embodiment, the first transmission channel 23 further includes two transmission base plates 234 and a spacing adjustment mechanism 235; two first transmission frames 231 are provided, and the bottom ends of one first transmission frame 231 are fixedly connected to one transmission base plate 234, while the bottom ends of the other first transmission frame 231 are slidably connected to one transmission base plate 234; the spacing adjustment mechanism 235 is connected to the other first transmission frame 231, and the spacing adjustment mechanism 235 is used to drive the other first transmission frame 231 to move, thereby adjusting the spacing between the two first transmission frames 231. The spacing adjustment mechanism 235 includes a motor and a lead screw. The lead screw is connected to another first transmission frame 231 via a nut. Driven by the motor, the first transmission frame 231 can be moved via the lead screw, thereby adjusting the spacing between the two first transmission frames 231 to accommodate the transmission of products of different sizes and improve the versatility of the flow channel. At the same time, each transmission chain module on the first transmission frame 231 may include a transmission chain and a transmission motor for driving the transmission chain to operate, thereby transmitting products. Alternatively, in some other embodiments, a transmission motor may be set on one of the first transmission frames 231, and the two transmission chain modules are connected via a drive shaft. One end of the drive shaft is connected to the output shaft of the transmission motor. Thus, driven by the transmission motor, the two transmission chain modules can be driven to operate via the drive shaft, thereby transmitting products.

[0030] In addition, a first blocking mechanism 236 is installed on the inner end of one of the first transmission frames 231. The first blocking mechanism 236 is used to stop the product. In this embodiment, the first blocking mechanism 236 includes a motor, a lead screw and a blocking push plate. Driven by the motor, the blocking push plate is moved by the lead screw to stop the product. In this embodiment, the driving components of the lifting and upper pressure plate 2332, namely the upper translation driving component and the lifting driving component, are both located on the outside of the transmission frame, outside the heating zone. This makes the flow channel have high temperature resistance properties, which can improve the service life of the driving components. At the same time, it can further save installation space, making the overall structure more compact and convenient for the installation and maintenance of other components.

[0031] Furthermore, this solution employs a slotted transition transmission mechanism, which, while ensuring transmission functionality, achieves the separation of the hot zone and the normal temperature zone through physical isolation. The guide slot 2313 serves as a mechanical interface, allowing the lifting connecting plate to move vertically. Simultaneously, it forms a narrow channel, effectively blocking heat conduction into the mounting slot 2311, thereby preventing the upper translation drive assembly and the lifting drive assembly from operating in a high-temperature environment. During operation, the lifting slide plate 2312 is driven to move up and down within the mounting slot 2311. Through the rigid connecting plate, the motion is transmitted to the lifting vertical plate 2321 inside the first transmission frame 231, which then lifts the product. In addition, a connection notch 2322 is provided at the bottom of the lifting vertical plate 2321. The design of the connection notch 2322 provides installation tolerance space, facilitating the assembly and positioning of the lifting vertical plate 2321 and the lifting connecting plate, while also providing adjustment margin to accommodate processing errors.

[0032] Preferably, in this embodiment, the inner wall of the mounting slot 2311 is provided with a first slide rail assembly 2314 in the vertical direction, and the lifting slide plate 2312 is slidably connected to the first slide rail assembly 2314; the lifting drive assembly includes a first motor 2323 horizontally mounted on one side of the first transmission frame 231, a first rotating rod 2324 connected to the output shaft of the first motor 2323, a first gear 2325 mounted on the first rotating rod 2324, and a first rack 2326 vertically connected to the other side of the lifting slide plate 2312 and meshing with the first gear 2325.

[0033] In this embodiment, the first motor 2323 outputs rotational motion, which is transmitted to the first gear 2325 via the first rotating rod 2324. The first gear 2325 meshes with the first rack 2326, converting the rotational motion into linear motion, thereby driving the lifting slide plate 2312 to rise and fall along the first slide rail assembly 2314. The lifting slide plate 2312 is connected to the lifting vertical plate 2321 via the lifting connecting plate, thereby driving the lifting vertical plate 2321 to rise and fall. The gear-rack transmission method ensures the lifting vertical plate 2321 can rise and fall. To improve the stability of the rotation of the first rotating rod 2324, the lifting drive assembly preferably includes two first bearing seats 2327; the two first bearing seats 2327 are arranged opposite to each other, wherein one first bearing seat 2327 is connected to one end in the mounting slot 2311, and the other first bearing seat 2327 is connected to one end outside the first transmission frame 231; each first bearing seat 2327 is equipped with a first bearing, and both ends of the first rotating rod 2324 are respectively connected to a first bearing.

[0034] In one embodiment, the mounting slot 2311 extends to the top of the first transmission frame 231, and a first support block 2315 is connected to the upper part of the inner wall of the mounting slot 2311; a second slide rail assembly 2316 is mounted on the first support block 2315 in a horizontal direction, and an upper translation plate 2331 is slidably connected to the second slide rail assembly 2316; the upper translation drive assembly includes a second motor 2333 mounted on the other side of the first transmission frame 231, a second rotating rod 2334 connected to the output shaft of the second motor 2333, a second gear 2335 mounted on the second rotating rod 2334, and a second rack 2336 connected in a horizontal direction to the bottom of the upper translation plate 2331 and meshing with the second gear 2335. The first support block 2315 extends from the inner wall of the mounting slot 2311 to provide a mounting platform for the upper translation plate 2331. The second motor 2333 drives the upper translation plate 2331 to move horizontally along the second slide rail assembly 2316 through a similar gear-rack mechanism, thereby driving the upper pressure plate 2332 to move to the side above the product to limit the product.

[0035] Meanwhile, to improve the stability of the rotation of the second rotating rod 2334, preferably, the upper translation drive assembly further includes two second bearing seats 2337; the two second bearing seats 2337 are arranged opposite to each other, wherein one second bearing seat 2337 is connected to the other end inside the mounting slot 2311, and the other second bearing seat 2337 is connected to the other end outside the first transmission frame 231; each second bearing seat 2337 is equipped with a second bearing, and both ends of the second rotating rod 2334 are respectively connected to a second bearing.

[0036] In one embodiment, two guide limiting plates 2317 are also installed on the top of the first transmission frame 231; the two guide limiting plates 2317 are arranged opposite to each other, and the upper translation plate 2331 is located between the two guide limiting plates 2317; each guide limiting plate 2317 is also equipped with a guide limiting wheel 2318, and the outer wall of the guide limiting wheel 2318 is provided with a guide limiting groove 2319 in a ring structure along its circumference in the middle; each of the bottom ends of the upper translation plate 2331 is connected to a guide connecting plate 2338; one side of the guide connecting plate 2338 is provided with a guide part 2339 in a triangular prism structure, and the pointed corner of the guide part 2339 is inserted into the guide limiting groove 2319.

[0037] In this embodiment, a precision guiding principle combining rolling guidance and wedge self-locking is adopted. The guide limiting wheel 2318 provides rolling contact, significantly reducing motion resistance compared to sliding friction. The guide limiting groove 2319 and the triangular prism guide portion 2339 form a V-shaped groove track fit (the upper and lower inclined surfaces of the pointed corner of the guide portion 2339 contact the top and bottom inner walls of the guide limiting groove 2319, respectively; the top and bottom of the guide limiting groove 2319 are provided with corresponding inclined guide surfaces). Utilizing the geometric characteristics of the triangular prism, the following functions can be achieved: Automatic centering: The symmetry of the guide limit groove 2319 enables the upper translation plate 2331 to automatically adjust to the center position when subjected to eccentric load; Clearance elimination: By controlling the fit clearance between the triangular prism tip and the guide limiting groove 2319, or by using elastic pre-tightening, transmission clearance can be eliminated and positioning accuracy improved; Multi-directional constraints: The sidewall of the guide limiting groove 2319 restricts the lateral displacement of the guide connecting plate 2338, and the top surface restricts the vertical jump, ensuring that the upper translation plate 2331 can only move longitudinally.

[0038] In one embodiment, the soldering station 3 includes a soldering gantry 31, a soldering device 32 mounted on the soldering gantry 31, and a soldering channel mechanism 33 arranged below the soldering device 32 and connected to the first transmission channel 23; a soldering calibration component 34 is also arranged on one side of the soldering channel mechanism 33; the soldering device 32 includes a soldering Y-axis moving mechanism 321 mounted on the soldering gantry 31, a soldering X-axis moving mechanism 322 connected to the soldering Y-axis moving mechanism 321, and a soldering moving base 323 connected to the soldering X-axis moving mechanism 322; the soldering moving base 323... A soldering mechanism 324 and a 3D line scanning mechanism 325 are installed side by side on one side of the soldering moving base 323; a soldering head CCD 326 is also installed on one side of the soldering moving base 323 between the soldering mechanism 324 and the 3D line scanning mechanism 325; the 3D line scanning mechanism 325 includes a line scanning Z-axis mechanism 3251 installed on one side of the soldering moving base 323, a line scanning lifting base 3252 connected to the line scanning Z-axis mechanism 3251, a 3D line scanning camera 3253 installed on the line scanning lifting base 3252, and a laser height sensor 3254 (which performs height measurement function) installed on one side of the line scanning lifting base 3252.

[0039] In this embodiment, the Y-axis moving mechanism 321 and the X-axis moving mechanism 322 for soldering can be existing linear modules. A 3D line scan camera 3253 is installed, which can perform line scanning before soldering to detect the desoldering effect and perform comprehensive 3D height measurement of the area to be soldered to ensure the soldering effect. Simultaneously, line scanning can be performed after soldering to detect the soldering effect, avoiding rework caused by abnormal soldering results during mounting and soldering. Furthermore, the soldering mechanism 324 includes a Z-axis soldering mechanism 3241 installed on one side of the soldering moving base 323, a soldering lifting plate 3242 connected to the Z-axis soldering mechanism 3241, and a soldering valve assembly 3243 installed on the soldering lifting plate 3242. Its main function is to perform soldering. The soldering head CCD 326 has three main functions: first, CCD positioning before soldering; second, taking pictures of the soldering area and quickly generating the soldering path; and third, detecting the effect of pre-soldering.

[0040] In a preferred embodiment, a soldering calibration component 34, a nozzle cleaning component 35 (using an existing module), and a pre-soldering component 36 (using an existing module) are also arranged on one side of the soldering flow channel mechanism 33. The soldering calibration component 34 includes a calibration bracket 341. A calibration sensor 342 and a calibration plate 343 are respectively installed at the top two ends of the calibration bracket 341, and a nozzle height gauge 344 is also installed in the middle of the top of the calibration bracket 341. A passage is provided on the calibration plate 343. Below the light-passing aperture, a CCD 345 for soldering is arranged. The soldering calibration component 34 is mainly used for fully automatic precision calibration of the soldering nozzle. The nozzle cleaning component 35 includes a cleaning lint-free cloth, a winding drive, and a suction nozzle cylinder assembly. Its main function is to automatically clean the soldering nozzle. The pre-soldering component 36 is mainly used to facilitate pre-soldering of the soldering nozzle. Then, the CCD 326 on the soldering head detects the effect of the pre-soldering. After the detection is qualified, the formal soldering action is performed, thereby improving the soldering quality.

[0041] In one embodiment, the solder dispensing flow channel mechanism 33 includes two parallel and spaced solder dispensing transfer frames 331, and a conveyor belt module is installed on the inner side of each solder dispensing transfer frame 331; each solder dispensing transfer frame 331 is also equipped with a solder dispensing lifting mechanism 332 and a solder dispensing limiting mechanism 333; a solder dispensing blocking mechanism 334 is also installed at one inner end of one of the solder dispensing transfer frames 331; the solder dispensing limiting mechanism 333 includes a limiting translation mechanism installed on the outer side of the solder dispensing transfer frame 331, and a sliding connecting mechanism. A soldering transfer plate 3331 is attached to the top of the soldering transfer frame 331 and connected to the limiting translation mechanism; a soldering upper limit plate 3332 is also connected to the side of the soldering transfer plate 3331 near the conveyor belt module; the soldering lifting mechanism 332 includes a lifting drive assembly installed on the outside of the soldering transfer frame 331, and a soldering lifting plate 3321 slidably connected to the inside of the soldering transfer frame 331 and connected to the lifting drive assembly; the soldering lifting plate 3321 is located below one side of the soldering upper limit plate 3332. After the PCB board is transported to its position, the soldering blocking mechanism 334 stops it. Then, the limiting translation mechanism drives the soldering upper limit plate 3332 to move to the upper side of the PCB board. Subsequently, the lifting drive assembly drives the soldering lifting plate 3321 to lift the PCB board to the bottom of the soldering upper limit plate 3332 to limit and fix it, thereby facilitating subsequent soldering operations. At the same time, a spacing adjustment mechanism 235 is also provided, which is connected to one of the soldering transmission frames 331 and can drive it to move, thereby adjusting the spacing between the two soldering transmission frames 331 to adapt to the transmission of products of different specifications and sizes.

[0042] In a preferred embodiment, the top of the solder transfer frame 331 is provided with a first sliding groove along its width direction, and a first linear guide assembly 3333 is arranged within the first sliding groove; the limiting translation mechanism includes a limiting translation cylinder 3334 installed on the outside of the solder transfer frame 331, and a limiting connecting plate connected to the limiting translation cylinder 3334; the solder transfer plate 3331 is slidably arranged on the first linear guide assembly 3333 and connected to the limiting connecting plate. The limiting translation cylinder 3334 can drive the limiting plate to translate via the limiting connecting plate, while the first linear guide assembly 3333 provides a guiding function to ensure the stability of its movement.

[0043] Meanwhile, the lifting drive assembly includes a lifting rotary motor 3322 mounted on the outside of the solder transfer frame 331, and a first drive wheel 3323 arranged on the inside of the solder transfer frame 331 and connected to the output shaft of the lifting rotary motor 3322; two first grooves 3324 are also spaced apart on the inside of the solder transfer frame 331, and the first drive wheel 3323 is located between the two first grooves 3324; a first connecting shaft is connected to the upper and lower parts of each first groove 3324, and each first connecting shaft Each of the first driven wheels 3325 is rotatably connected to the first driven wheel 3325 located in the same first groove 3324. A first synchronous belt 3326 is also wound between the two first driven wheels 3325 located in the same first groove 3324. A first synchronous wheel is also installed on each of the two first connecting shafts located in the lower part of the first groove 3324. A second synchronous belt 3327 is also wound between the two first synchronous wheels and the first driving wheel 3323. A connecting slider is installed on one side of each of the first synchronous belts 3326. One side of the soldering lifting plate 3321 is connected to the two connecting sliders.

[0044] The lifting rotary motor 3322 can drive the first drive wheel 3323 to rotate, which in turn drives the first synchronous wheels at both ends to rotate synchronously through the second synchronous belt 3327, which in turn drives the first synchronous belt 3326 to move, and then drives the soldering lifting plate 3321 to rise and fall through the connecting slider. This synchronous belt transmission mechanism combined with the double slider drive method can ensure that the soldering lifting plate 3321 rises and falls smoothly. At the same time, the lifting rotary motor 3322 is arranged on the outside of the transmission frame, which does not occupy the inner space, saving space and facilitating maintenance. In order to further improve the stability of the soldering lifting plate 3321, a second linear guide assembly is also arranged on the inner side of the soldering transmission frame 331 along the vertical direction, and the soldering lifting plate 3321 is slidably arranged on the second linear guide assembly.

[0045] Following the above-mentioned working condition 2, the working process of the tin-plating station 3 is as follows: 13) After the product enters the working area of ​​the soldering station from the flow channel, the soldering lifting mechanism 332 and the soldering limiting mechanism 333 cooperate with each other to lift and limit the product, ensuring the fixation and reference limit of the product during the soldering process; 14) The CCD326 on the soldering head takes pictures of the product to achieve precise visual positioning of the soldering area. Then, a 3D line scan is performed to perform 3D detection of the solder removal effect. At the same time, the entire plane of the area to be soldered is measured in 3D to prepare for subsequent soldering. If the solder removal effect is not good, an alarm will be triggered for manual intervention. If the solder removal effect is good, the subsequent soldering work will be carried out according to the 3D height measurement of the entire plane. 15) The soldering head moves to the self-cleaning device for automatic soldering cleaning, then performs XYZ positioning calibration on the soldering head, then moves to the pre-soldering station for pre-soldering, then moves the head CCD to the pre-soldering station for photo inspection to ensure uniform soldering, and then moves the head to the soldering station for precision soldering according to the set soldering parameters. 16) After the soldering is completed, the head 3D line scan camera 3253253 performs a 3D line scan on the soldering position to detect the soldering effect. If the soldering effect is NG, an alarm will be triggered for manual intervention. If the soldering effect is OK, the lifting door 5 will be lowered and the tooling with the product will be transported back to the rework station through the soldering flow channel. 17) After the product is transported back to the rework station work area, it is then positioned, mounted, and soldered according to the above rework station 2 workflow. Since the corresponding tinning work has already been carried out in this case, the DIPPING process is not required. After mounting and soldering are completed, the unloading process is carried out.

[0046] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automatic online intelligent repair device, characterized in that, The device includes a workbench; a rework station and a soldering station are respectively provided at both ends of the top of the workbench, and a heat insulation frame is also provided in the middle of the top of the workbench; a lifting door is also installed on the heat insulation frame; the rework station includes a first gantry frame installed on the top of the workbench, a rework device installed on the first gantry frame, a first conveying channel arranged in the first gantry frame, and a feeding and soldering paste scraping mechanism arranged on one side of the first conveying channel; a lower heating zone is also arranged in the first conveying channel.

2. The fully automatic online intelligent rework equipment according to claim 1, characterized in that, The first transmission channel includes two parallel and spaced first transmission frames, and a transmission chain module is installed on the inner side of each first transmission frame; each first transmission frame is also equipped with a product lifting mechanism and an upper limit mechanism; a first blocking mechanism is also installed at one end of the inner side of one of the first transmission frames; the lower heating zone is arranged between the two first transmission frames; the product lifting mechanism includes a lifting drive assembly installed on the outside of the first transmission frame, and a lifting vertical plate arranged vertically on the inner side of the first transmission frame and connected to the lifting drive assembly; the upper limit mechanism includes an upper translation drive assembly installed on the outside of the first transmission frame, and an upper translation plate slidably arranged on the top of the first transmission frame and connected to the upper translation drive assembly; the lifting vertical plate is located below one side of the upper translation plate, and an upper pressure plate is also connected to one side of the upper translation plate.

3. The fully automatic online intelligent rework equipment according to claim 2, characterized in that, An installation slot is provided in the middle of the outer side of the first transmission frame; a lifting slide plate is slidably connected in the installation slot; a guide slot hole is provided in the installation slot along the vertical direction, extending to the inner side of the first transmission frame, and a lifting connecting plate is also connected to one side of the lifting slide plate; one end of the lifting connecting plate is movably arranged through the guide slot hole; a connecting notch is provided at the bottom of the lifting vertical plate, and the lifting vertical plate is connected to one end of the lifting connecting plate through the connecting notch; a lifting drive assembly is connected to the lifting slide plate, and the lifting drive assembly is used to drive the lifting slide plate to rise and fall; a first slide rail assembly is arranged in the vertical direction on the inner wall of the installation slot, and the lifting slide plate is slidably connected to the first slide rail assembly; the lifting drive assembly includes a first motor horizontally installed at one end of the outer side of the first transmission frame, a first rotating rod connected to the output shaft of the first motor, a first gear installed on the first rotating rod, and a first rack connected in the vertical direction to the other side of the lifting slide plate and meshing with the first gear.

4. The fully automatic online intelligent repair equipment according to claim 3, characterized in that, The mounting slot extends to the top of the first transmission frame, and a first support block is connected to the upper part of the inner wall of the mounting slot; a second slide rail assembly is mounted on the first support block in the horizontal direction, and the upper translation plate is slidably connected to the second slide rail assembly; the upper translation drive assembly includes a second motor mounted on the other side of the first transmission frame, a second rotating rod connected to the output shaft of the second motor, a second gear mounted on the second rotating rod, and a second rack connected in the horizontal direction to the bottom of the upper translation plate and meshing with the second gear.

5. The fully automatic online intelligent rework equipment according to claim 4, characterized in that, Two guide limiting plates are also installed on the top of the first transmission frame; the two guide limiting plates are arranged opposite to each other, and the upper translation plate is located between the two guide limiting plates; each guide limiting plate is also equipped with a guide limiting wheel, and the outer wall of the guide limiting wheel is provided with a guide limiting groove with an annular structure along its circumference; each of the bottom ends of the upper translation plate is connected to a guide connecting plate; one side of the guide connecting plate is provided with a guide part with a triangular prism structure, and the pointed corner part of the guide part is inserted into the guide limiting groove.

6. The fully automatic online intelligent rework equipment according to claim 1, characterized in that, The rework device includes a rework Y-axis motion module mounted on a first gantry, a rework X-axis motion module connected to the rework Y-axis motion module, and a rework X-axis motion seat connected to the rework X-axis motion module; a desoldering mechanism and a desoldering mechanism are mounted side by side on one side of the rework X-axis motion seat; an infrared temperature sensor is also mounted on one side of the rework X-axis motion seat between the desoldering mechanism and the desoldering mechanism; a rework CCD component is also connected to the bottom of the rework X-axis motion seat; the lower heating zone includes a heating frame, a heating lifting mechanism connected to the bottom of the heating frame, a lower heating component mounted inside the heating frame, a temperature zone X-axis motion module mounted on one side of the heating frame, a temperature zone Y-axis motion module connected to the temperature zone X-axis motion module, and a movable heating component connected to the temperature zone Y-axis motion module and located above the heating frame.

7. The fully automatic online intelligent rework equipment according to claim 1, characterized in that, The soldering station includes a soldering gantry, a soldering device mounted on the soldering gantry, and a soldering channel mechanism arranged below the soldering device and connected to the first transmission channel; a soldering calibration component is also arranged on one side of the soldering channel mechanism; the soldering device includes a soldering Y-axis moving mechanism mounted on the soldering gantry, a soldering X-axis moving mechanism connected to the soldering Y-axis moving mechanism, and a soldering moving base connected to the soldering X-axis moving mechanism; a soldering mechanism and a 3D line scanning mechanism are mounted side by side on one side of the soldering moving base; a soldering head CCD is also installed on one side of the soldering moving base between the soldering mechanism and the 3D line scanning mechanism; the 3D line scanning mechanism includes a line scanning Z-axis mechanism mounted on one side of the soldering moving base, a line scanning lifting base connected to the line scanning Z-axis mechanism, a 3D line scanning camera mounted on the line scanning lifting base, and a laser height sensor mounted on one side of the line scanning lifting base.

8. The fully automatic online intelligent repair equipment according to claim 7, characterized in that, The soldering flow channel mechanism includes two parallel and spaced soldering transfer frames, and a conveyor belt module is installed on the inner side of each soldering transfer frame. Each soldering transfer frame is also equipped with a soldering lifting mechanism and a soldering limiting mechanism. A soldering blocking mechanism is also installed at one end of the inner side of one of the soldering transfer frames. The soldering limiting mechanism includes a limiting translation mechanism installed on the outer side of the soldering transfer frame, and a soldering translation plate slidably connected to the top of the soldering transfer frame and connected to the limiting translation mechanism. A soldering upper limit plate is also connected to the side of the soldering translation plate near the conveyor belt module. The soldering lifting mechanism includes a lifting drive assembly installed on the outer side of the soldering transfer frame, and a soldering lifting plate slidably connected to the inner side of the soldering transfer frame and connected to the lifting drive assembly. The soldering lifting plate is located below one side of the soldering upper limit plate.

9. The fully automatic online intelligent rework equipment according to claim 8, characterized in that, The top of the solder transfer frame has a first sliding groove along its width, and a first linear guide assembly is arranged within the first sliding groove; the limiting translation mechanism includes a limiting translation cylinder installed on the outside of the solder transfer frame, and a limiting connecting plate connected to the limiting translation cylinder; the solder transfer plate is slidably arranged on the first linear guide assembly and connected to the limiting connecting plate; the lifting drive assembly includes a lifting rotary motor installed on the outside of the solder transfer frame, and a first drive wheel arranged on the inside of the solder transfer frame and connected to the output shaft of the lifting rotary motor; the inside of the solder transfer frame is also spaced apart. The device has two first grooves, with a first driving wheel located between the two first grooves. Each first groove has a first connecting shaft connected to its upper and lower parts, and each first connecting shaft has a first driven wheel rotatably connected to it. A first synchronous belt is wound between the two first driven wheels located in the same first groove. Each of the two first connecting shafts located in the lower part of the first groove has a first synchronous wheel installed on it, and a second synchronous belt is wound between the two first synchronous wheels and the first driving wheel. A connecting slider is installed on one side of each first synchronous belt, and one side of the soldering lifting plate is connected to the two connecting sliders.

10. The fully automatic online intelligent rework equipment according to claim 9, characterized in that, The soldering calibration assembly includes a calibration bracket; a calibration sensor and a calibration board are respectively installed at the top two ends of the calibration bracket, and a needle height measuring instrument is also installed in the middle of the top of the calibration bracket; a light-transmitting hole is opened on the calibration board, and a soldering lower CCD is arranged below the light-transmitting hole.

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