Aluminum-silicon shell embedded with high-thermal-conductivity material and preparation method thereof

By constructing a laser-sintered porous skeleton on the surface of a high thermal conductivity core material and combining it with an ultrasonic-assisted rheological die-casting process, the problem of low interfacial bonding strength in the composite preparation of high thermal conductivity materials and aluminum alloy matrices was solved. This enabled the preparation of an aluminum-silicon shell with high bonding strength and low thermal resistance, thereby improving the thermal conductivity and thermal cycling reliability of the composite material.

CN122121097APending Publication Date: 2026-05-29苏州金锐捷科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
苏州金锐捷科技有限公司
Filing Date
2026-02-10
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

In the existing process of preparing composite materials with aluminum alloy substrates, poor wettability, easy erosion of the interface layer due to high-speed filling of traditional die casting, and many micro-defects at the interface result in low interface bonding strength, high thermal resistance, and poor reliability of hot and cold cycles.

Method used

By constructing a laser-sintered porous framework on the surface of a high thermal conductivity core material and combining it with an ultrasonic-assisted rheological die casting process, a high-strength bond between heterogeneous materials is achieved by utilizing a low-melting-point eutectic inducer and ultrasonic thermal effect. The porous structure formed by laser under-sintering provides a mechanical interlocking space, and the ultrasonic wave drives the semi-solid slurry to penetrate deep into the pores of the framework to generate TiC chemical bonds, thereby reducing interfacial thermal resistance and improving density.

Benefits of technology

It achieves a high-strength bond between high thermal conductivity carbon-based materials and aluminum alloy matrix, significantly reduces interfacial thermal resistance, improves the overall thermal conductivity and thermal cycling reliability of the composite shell, avoids interfacial delamination and microscopic air gaps, and ensures the stability of the shell under thermal shock.

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Abstract

The application relates to the technical field of aluminum-silicon shell processing, and discloses an aluminum-silicon shell embedded with high-thermal-conductivity material and a preparation method thereof, which comprises an aluminum-silicon alloy base body and a high-thermal-conductivity core material embedded therein, and an interface transition layer is combined between the high-thermal-conductivity core material and the aluminum-silicon alloy base body; the interface transition layer is composed of a porous framework laser-sintered on the surface of the high-thermal-conductivity core material and the aluminum-silicon alloy base body filled in the pores of the porous framework; the porous framework is formed by laser-induced semi-sintering of mixed powder, and the components of the mixed powder include 15-25% of active component Ti powder in terms of mass percentage. By constructing the laser semi-sintered porous framework on the surface of the core material and combining the ultrasonic-assisted rheological die casting process, high-strength combination between heterogeneous materials is realized, and the carbide chemical bond generated by the in-situ reaction of the active titanium component in the powder and the carbon core material is combined, so that the technical problem of weak interface bonding force between the high-thermal-conductivity carbon-based material and the aluminum alloy base body is solved.
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