Wafer basket

Abstract

The application discloses a wafer basket, and relates to the technical field of semiconductors. The wafer basket comprises a frame, a first supporting assembly, a second supporting assembly and a limiting assembly. Two side plates and two supporting parts are arranged to form a containing space, the supporting part is provided with an extension groove extending in the height direction, the first supporting assembly is located in the containing space and is mounted on the two side plates at two ends respectively, the second supporting assembly is located below the first supporting assembly and is mounted on the two side plates at two ends respectively, and the limiting assembly is movably arranged between the two side plates in the height direction. The first supporting assembly, the second supporting assembly and the limiting assembly are used in combination to place the first type of wafer, the second type of wafer and the third type of wafer respectively. The wafer basket provided by the application can be suitable for wafers of different specifications and has good versatility, so that the production cycle is effectively shortened, the production efficiency is improved, the production cost is reduced, the limiting effect can be ensured, and the wafers are prevented from being accidentally taken out.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a wafer basket. Background Technology

[0002] In the semiconductor manufacturing process, wafer baskets are needed for wafer transfer and storage. However, traditional wafer baskets are usually only suitable for wafers of specific specifications (fixed size and fixed shape). For wafers of different sizes, shapes, and irregular shapes, corresponding wafer baskets need to be manufactured according to their characteristics. This directly leads to longer production cycles, reduced production efficiency, increased production costs, and reduced economic benefits.

[0003] Therefore, designing and manufacturing a versatile wafer basket is particularly important, especially in semiconductor manufacturing. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer basket that is applicable to wafers of different specifications, has good versatility, thereby effectively shortening the production cycle, improving production efficiency, reducing production costs, improving economic benefits, and ensuring the limiting effect to prevent the wafer from accidentally falling out.

[0005] The present invention is achieved by the following technical solution.

[0006] A wafer flower basket, comprising:

[0007] The frame includes two oppositely arranged side plates and two support parts connecting the two side plates. The two side plates and the two support parts enclose a receiving space. The support parts have extension grooves that extend in the height direction.

[0008] The first support assembly is located within the accommodating space, and its two ends are respectively mounted on the two side plates. The first support assembly includes two first support members disposed opposite to each other and two stop plates located outside the first support members. The first support member has a first support groove, which can place a first type of wafer. The stop plates abut against the edge of the first type of wafer, and the first support groove cooperates with the extension groove to place a second type of wafer.

[0009] The second support assembly is located below the first support assembly, and its two ends are respectively mounted on the side plates. The second support assembly includes two second support members arranged opposite to each other. The second support members have second support grooves, and the second support grooves cooperate with the first support grooves to place the third type of wafer.

[0010] A limiting component is movably disposed between the two side plates along the height direction. The limiting component is located above the third type of wafer to limit the height of the third type of wafer.

[0011] Optionally, the first support groove has a first support point between itself and the third type of wafer, and the line connecting the two first support points passes through the center of the third type of wafer; the second support groove has a second support point between itself and the third type of wafer, and there is an angle θ between the line R connecting the second support point to the center of the third type of wafer and the line L connecting the two second support points.

[0012] Specifically, if the third type of wafer is a 4-inch circular wafer, then the range of L is 1 / 3R-R; if the third type of wafer is a 6-inch circular wafer, then the range of L is 1.3R-1.5R; if the third type of wafer is an 8-inch circular wafer, then the range of L is 1.6R-1.7R.

[0013] Optionally, when the height of the first type of wafer located in the first support groove is greater than the height of the stop plate, the ratio of the height of the stop plate to the height of the first type of wafer located in the first support groove is 0.5-0.8.

[0014] Optionally, the first support assembly further includes a support frame that is movable relative to the first support member;

[0015] When the height of the first type of wafer located in the first support groove is less than or equal to the height of the stop plate, the support frame is located above the first type of wafer.

[0016] Optionally, the first support member is provided with a rotating shaft, and the abutment frame is provided with an oblong hole adapted to the rotating shaft. The abutment frame can rotate along the rotating shaft and can move up and down along the oblong hole to have a release position and an abutment position.

[0017] When the support frame is in the supporting position, the top of the first type of wafer is supported by the support frame.

[0018] Optionally, the end of the first support member is provided with a stepped structure, the stepped structure including a first step, a second step located below the first step, and a connecting part connecting the first step and the second step;

[0019] When the holding frame is in the released position, the bottom of the holding frame can rotate around the pivot above the first step;

[0020] When the abutment frame is in the abutment position, the bottom of the abutment frame abuts against the connecting part.

[0021] Optionally, the first support has a tangential plane, and the abutment has an abutment surface for abutting the first type of wafer;

[0022] When the abutment frame is in the abutment position, the abutment surface is in close contact with the tangential plane.

[0023] Optionally, at least two sets of the second support components are provided, with at least two sets of the second support components arranged sequentially below the first support component.

[0024] Optionally, both the first support assembly and the second support assembly can move horizontally relative to the side plate.

[0025] Optionally, the side plate is provided with a plurality of guide grooves corresponding to the first support component and the second support component respectively, and both the first support component and the second support component can move along the corresponding guide grooves.

[0026] The wafer flower basket provided by this invention has the following beneficial effects:

[0027] The wafer basket provided by this invention comprises two side plates and two support portions forming an accommodating space. Each support portion has an extension groove extending in the height direction. A first support assembly is located within the accommodating space, with its two ends respectively mounted on the side plates. A second support assembly is located below the first support assembly, with its two ends also respectively mounted on the side plates. A limiting assembly is movably disposed between the side plates along the height direction. The first support assembly can hold a first type of wafer, such as a long, narrow wafer. The first support assembly, in conjunction with the extension groove, can hold a second type of wafer, such as a 12-inch square wafer and a 1-inch square wafer. The 2-inch circular wafer, with the first and second support components working together, can accommodate third-type wafers, such as 4-inch, 6-inch, and 8-inch circular wafers, offering good versatility. This effectively shortens the production cycle, improves production efficiency, reduces production costs, and enhances economic benefits. Furthermore, by incorporating a height-movable limiting component, which is always positioned above the third-type wafer, the relatively lightweight third-type wafer can be height-limited, preventing it from floating upwards in the liquid and accidentally detaching. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of a wafer basket provided in an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of the connection between the first support component and the second support component and the side plate in the wafer basket provided in an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the wafer basket provided in an embodiment of the present invention when placing a first type of wafer;

[0032] Figure 4This is a schematic diagram of the structure of the wafer basket provided in an embodiment of the present invention when placing a second type of wafer;

[0033] Figure 5 This is a schematic diagram of the structure of a wafer basket for placing a third type of wafer, provided in an embodiment of the present invention.

[0034] Figure 6 This is a schematic diagram of the connection between the first support component and the second support component and the side plate in the wafer basket provided in an embodiment of the present invention;

[0035] Figure 7 A cross-sectional view of the first support component in the wafer basket provided in an embodiment of the present invention;

[0036] Figure 8 A mathematical model diagram of placing various third-type wafers in a wafer basket when L = 1 / 3R, provided for embodiments of the present invention;

[0037] Figure 9 A mathematical model diagram of placing various third-type wafers in a wafer basket when L = 1 / 2R, provided for embodiments of the present invention;

[0038] Figure 10 This is a mathematical model diagram of a wafer basket for placing various third-type wafers when L=R, provided as an embodiment of the present invention.

[0039] Icons: 100-Wafer basket; 110-Frame; 111-Side plate; 112-Support part; 113-Accommodation space; 114-Extension groove; 115-Matching groove; 116-Guide groove; 120-First support assembly; 121-First support member; 1211-Cut plane; 122-Stop plate; 123-First support groove; 124-Holding frame; 1241-Oval hole; 1242-Holding surface; 125-Hinge; 126-Step structure; 1261-First step; 1262-Connecting part; 1263-Second step; 130-Second support assembly; 131-Second support member; 132-Second support groove; 140-Limiting assembly; 141-Handle; 142-Limiting plate; 200-First type wafer; 300-Second type wafer; 400-Third type wafer. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0043] In the description of this invention, it should be noted that the terms "inner," "outer," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0044] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0045] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, features in the following embodiments can be combined with each other.

[0046] Please refer to Figure 1 This invention provides a wafer basket 100 for carrying wafers. It is applicable to wafers of different specifications, has good versatility, thereby effectively shortening the production cycle, improving production efficiency, reducing production costs, improving economic benefits, and ensuring a limiting effect to prevent the wafer from accidentally falling out.

[0047] The wafer basket 100 includes a frame 110, a first support assembly 120, a second support assembly 130, and a limiting assembly 140. The frame 110 includes two opposing side plates 111 and two support portions 112 connecting the two side plates 111. The two side plates 111 and the two support portions 112 enclose a receiving space 113 for placing the wafer. The support portions 112 have extension grooves 114 extending in the height direction.

[0048] In this embodiment, in order to facilitate the application of wafers of different specifications, both the first support component 120 and the second support component 130 can be moved in the horizontal direction relative to the side plate 111, so as to reasonably adjust the spacing between the first support component 120 and the second support component 130 as needed, thereby further improving the versatility of the wafer basket 100.

[0049] Specifically, the side plate 111 is provided with a plurality of guide grooves 116 corresponding to the first support component 120 and the second support component 130, respectively. Both the first support component 120 and the second support component 130 can move along the corresponding guide grooves 116. The guide grooves 116 are used to limit and guide the first support component 120 and the second support component 130 to ensure the stability of the sliding process of the first support component 120 and the second support component 130. However, it is not limited to this. In other embodiments, the side plate 111 can also be provided with a plurality of guide rails corresponding to the first support component 120 and the second support component 130, which can also achieve the function of limiting and guiding the first support component 120 and the second support component 130.

[0050] Please refer to the reference. Figures 2 to 7 The first support component 120 is located within the accommodating space 113, and its two ends are respectively mounted on the two side plates 111. The two side plates 111 work together to limit the position of the first support component 120.

[0051] The first support assembly 120 includes two first support members 121 disposed opposite to each other and two stop plates 122 located outside the first support members 121. The first support member 121 has a first support groove 123. Specifically, the first support member 121 includes a first support roller and sidewalls extending outward in the circumferential direction around the first support roller, and the aforementioned first support groove 123 is formed between a plurality of sidewalls and the first support roller.

[0052] In an optional embodiment, the first support groove 123 is capable of placing the first type of wafer 200, and the stop plate 122 abuts against the edge of the first type of wafer 200 to achieve reliable placement of the first type of wafer 200.

[0053] Specifically, the first type of wafer 200 includes elongated wafers. More specifically, the elongated wafers include elongated wafers with a height greater than the stop plate 122 and elongated wafers with a height less than the stop plate 122.

[0054] When the height of the elongated wafer located in the first support groove 123 is greater than the height of the stop plate 122, the top of the wafer does not reach the support portion 112, and therefore cannot extend into the extension groove 114. In order to improve the stability of such wafers in the wafer basket 100, in this embodiment, the ratio of the height of the stop plate 122 to the height of the first type of wafer 200 located in the first support groove 123 is limited to 0.5-0.8.

[0055] The ratio of the height of the stop plate 122 to the height of the first type of wafer 200 located in the first support groove 123 can effectively stop the first type of wafer 200, preventing it from moving along its length or even falling out of the first support groove 123.

[0056] Furthermore, since the height of the first type of wafer 200 is greater than the height of the stop plate 122, the weight of the first type of wafer 200 is relatively heavy. Therefore, there is no need to set a limiting structure above the first type of wafer 200, and the first type of wafer 200 can be kept in the first support groove 123 under the action of gravity.

[0057] When the height of the elongated wafer located in the first support groove 123 is less than the height of the stop plate 122, reference Figure 3 As shown, due to their small size and light weight, these wafers are easily buoyed and move upwards or sway in a liquid environment. To prevent these wafers from floating due to buoyancy, in this embodiment, the first support assembly 120 further includes a support frame 124 that can move relative to the first support member 121. The support frame 124 is located above the first type of wafer 200, that is, the first type of wafer 200 passes between the support frame 124 and the first support member 121, and its side abuts against the stop plate 122. At this time, the support frame 124 limits the height of the first type of wafer 200 to prevent the first type of wafer 200 from coming out of the first support groove 123 upwards, and the stop plate 122 limits the length of the first type of wafer 200 to prevent the first type of wafer 200 from coming out of the first support groove 123 horizontally.

[0058] In an optional embodiment, the first support member 121 is provided with a rotating shaft 125, and the abutment frame 124 is provided with an oblong hole 1241 adapted to the rotating shaft 125. The oblong hole 1241 extends vertically, and the abutment frame 124 is rotatable along the rotating shaft 125 and can move up and down along the oblong hole 1241 to have a release position and an abutment position. Specifically, when the rotating shaft 125 of the abutment frame 124 moves to the upper limit position relative to the oblong hole 1241, the abutment frame 124 is in the release position; when the rotating shaft 125 of the abutment frame 124 moves to the lower limit position relative to the oblong hole 1241, the abutment frame 124 is in the abutment position.

[0059] Furthermore, when the abutment frame 124 is in the abutment position, and the height of the first type of wafer 200 located in the first support groove 123 is less than or equal to the height of the stop plate 122, the upper part of the first type of wafer 200 abuts against the abutment frame 124, and the abutment frame 124 presses the first type of wafer 200 into the first support groove 123 to further improve the limiting effect.

[0060] Preferably, the end of the first support member 121 is provided with a stepped structure 126. The stepped structure 126 includes a first step 1261, a second step 1263 located below the first step 1261, and a connecting portion 1262 connecting the first step 1261 and the second step 1263. The rotating shaft 125 is located directly above the second step 1263. When the holding frame 124 is in the released position, the bottom of the holding frame 124 can rotate around the rotating shaft 125 above the first step 1261 to press or release the first type of wafer 200. When the holding frame 124 is in the holding position, the bottom of the holding frame 124 simultaneously abuts against the connecting portion 1262 and the second step 1263. At this time, the connecting portion 1262 and the second step 1263 together limit the holding frame 124 to prevent the holding frame 124 from continuing to rotate.

[0061] In an optional embodiment, the first support 121 has a tangential plane 1211, and the abutment 124 has an abutment surface 1242 for abutting the first type of wafer 200. When the abutment 124 is in the abutment position, the abutment surface 1242 is in close contact with the tangential plane 1211. At this time, the first support 121 can further limit the abutment 124 through the cooperation of the tangential plane 1211 and the abutment surface 1242, so as to prevent the abutment 124 from continuing to rotate and improve stability.

[0062] In an optional embodiment, the first support groove 123, in cooperation with the extension groove 114, can also accommodate a second type of wafer 300 to achieve reliable placement of the second type of wafer 300. Specifically, the second type of wafer 300 includes 12-inch circular wafers and 12-inch square wafers. It should be noted that the height of both the 12-inch circular wafer and the 12-inch square wafer is greater than or equal to the distance between the support portion 112 and the first support assembly 120. During placement, the second type of wafer 300 is inserted downwards from the extension groove 114, so that the sidewalls of the second type of wafer 300 are close to the extension groove 114, and the bottom of the second type of wafer 300 extends into the first support groove 123, thereby achieving stable support for the second type of wafer 300. It should be noted that, regardless of whether it is a 12-inch circular wafer or a 12-inch square wafer, due to its relatively heavy weight, the buoyancy it experiences in a liquid environment is much less than its weight, so it will not float. Therefore, the second type of wafer 300 does not require height-direction limitation.

[0063] The second support assembly 130 is located within the accommodating space 113 and is disposed below the first support assembly 120. Both ends of the second support assembly 130 are respectively mounted on two side plates 111, and the two side plates 111 work together to define the position of the second support assembly 130. The second support assembly 130 includes two opposing second support members 131, each having a second support groove 132. Specifically, similar to the first support member 121, the second support member 131 includes a second support roller and sidewalls extending circumferentially outward around the second support roller, with the aforementioned second support groove 132 formed between several sidewalls and the second support roller.

[0064] In an optional embodiment, the second support groove 132 cooperates with the first support groove 123 to place the third type of wafer 400, thereby achieving reliable placement of the third type of wafer 400. Specifically, the third type of wafer 400 is an 8-inch circular wafer, a 6-inch circular wafer, a 4-inch circular wafer, or an irregular wafer (e.g., a quarter-circular wafer). The diameter of the 4-inch circular wafer is approximately 100mm, the diameter of the 6-inch circular wafer is approximately 150mm, and the diameter of the 8-inch circular wafer is approximately 200mm, with an error of ±0.5mm for each.

[0065] After multiple verifications by the inventors, it was found that the position of the support point when the second support component 130 supports the third type of wafer 400 is related to the stability of the third type of wafer 400. When the second support component 130 is within a preset range from the first support component 120 (determined by the distance between the two second support points as described below), the stability of the third type of wafer 400 is optimal.

[0066] For ease of description, in this embodiment, a first support point A is provided between the first support groove 123 and the third type wafer 400, and the line connecting the two first support points A passes through the center O of the third type wafer 400. A second support point B is provided between the second support groove 132 and the third type wafer 400. The line connecting the two second support points B is L, and the line connecting the second support point B and the center O of the third type wafer 400 is R. An angle θ exists between R and L. Specifically, if the third type of wafer is a 4-inch circular wafer, then the range of L is 1 / 3R-R; if the third type of wafer is a 6-inch circular wafer, then the range of L is 1.3R-1.5R; if the third type of wafer is an 8-inch circular wafer, then the range of L is 1.6R-1.7R.

[0067] It should be noted that in a 4-inch circular wafer, L ranges from 1 / 3R to R, where R is the radius of the 4-inch wafer; in a 6-inch circular wafer, L ranges from 1.3R to 1.5R, where R is the radius of the 6-inch wafer; and in a 6-inch circular wafer, L ranges from 1.6R to 1.7R, where R is the radius of the 8-inch wafer.

[0068] Please refer to Figure 8 In one specific embodiment, when the distance L between the two second support points B on the 4-inch circular wafer is 1 / 3R, the included angle θ on the 4-inch circular wafer is approximately 80°; by moving the first support component 120 and the second support component 130 in the horizontal direction, when the distance L between the two second support points B on the 6-inch circular wafer is 1.3R, the included angle θ on the 6-inch circular wafer is approximately 47°; by moving the first support component 120 and the second support component 130 in the horizontal direction again, when the distance L between the two second support points B on the 8-inch circular wafer is 1.6R, the included angle θ on the 8-inch circular wafer is approximately 38°.

[0069] Please refer to Figure 9 In another specific embodiment, when the distance L between the two second support points B on the 4-inch circular wafer is 1 / 2R, the included angle θ on the 4-inch circular wafer is approximately 70°; when the first support component 120 and the second support component 130 are moved horizontally, when the distance L between the two second support points B on the 6-inch circular wafer is 1.4R, the included angle θ is approximately 45°; when the first support component 120 and the second support component 130 are moved horizontally again, when the distance L between the two second support points B on the 8-inch circular wafer is 1.63R, the included angle θ on the 8-inch circular wafer is approximately 35°.

[0070] Please refer to Figure 10In another specific embodiment, when the distance L between the two second support points B on the 4-inch circular wafer is R, the included angle θ on the 4-inch circular wafer is approximately 60°; when the first support component 120 and the second support component 130 are moved horizontally, when the distance L between the two second support points B on the 6-inch circular wafer is 1.5R, the included angle θ is approximately 40°; when the first support component 120 and the second support component 130 are moved horizontally again, when the distance L between the two second support points B on the 8-inch circular wafer is 1.7R, the included angle θ on the 8-inch circular wafer is approximately 30°.

[0071] It should be noted that, in other embodiments, the height between the first support component 120 and the second support component 130, as well as the distance L between the two second support points B, can be adjusted according to actual needs.

[0072] Please continue to refer to Figure 1 and Figure 6 In another embodiment, to improve the stability of the wafer support, at least two sets of second support components 130 are provided, with the two sets of second support components 130 sequentially disposed below the first support component 120. For ease of description, the upper second support component 130 is defined as the first set of second support components 130, and the lower second support component 130 is defined as the second set of second support components 130. The second set of second support components 130 has the same structure as the first set of second support components 130.

[0073] At this point, any two or three sets of the first support component 120, the first set of second support components 130, and the second set of second support components 130 can work together to achieve more stable support for the third type of wafer 400. For example, the first support component 120 and the second set of second support components 130 can be used to place an 8-inch circular wafer, or the first support component 120 can be used in conjunction with the first set of second support components 130 and the second set of second support components 130 to place an 8-inch circular wafer, etc. It should be noted that the distance between the two sets of second support components 130 and the range of horizontal movement of each set of second support components 130 can be limited according to the actual situation.

[0074] Furthermore, in order to prevent the third type of wafer 400 from floating due to liquid buoyancy in the liquid environment, the limiting component 140 is movably disposed between the two side plates 111 along the height direction. The limiting component 140 is located above the third type of wafer 400 to limit the height of the third type of wafer 400, preventing the relatively light third type of wafer 400 from being lifted by liquid buoyancy in the liquid and thus accidentally falling out of the wafer basket 100.

[0075] Furthermore, the limiting assembly 140 includes a handle 141 and a limiting plate 142 connected to each other. The handle 141 is for holding, and the limiting plate 142 is for limiting the third type of wafer 400. Specifically, the side plate 111 has a mating groove 115 along its height direction, and the limiting plate 142 is slidably disposed in the mating groove 115. The limiting plate 142 can slide relative to the mating groove 115, and the mating groove 115 can guide and limit the limiting plate 142 to realize the position adjustment function of the limiting plate 142. This allows the limiting plate 142 to limit the third type of wafer 400 of different sizes and shapes, preventing the third type of wafer 400 from moving around within the frame 110.

[0076] In this embodiment, the limiting plate 142 has a threaded hole (not shown), and the frame 110 has multiple through holes (not shown). These through holes are spaced apart sequentially along a first direction. A screw (not shown) selectively passes through one of the through holes and engages with the threaded hole to fix the relative position of the limiting plate 142 and the frame 110, thereby fixing the relative position of the limiting component 140 and the frame 110. This allows for both detachable connection of the limiting component 140 and position adjustment of the limiting component 140, making it convenient and practical.

[0077] The wafer basket 100 provided in this embodiment of the invention comprises two side plates 111 and two support portions 112 forming an accommodating space 113. Each support portion 112 has an extension groove 114 extending in the height direction. A first support assembly 120 is located within the accommodating space 113, with its two ends respectively mounted on the side plates 111. A second support assembly 130 is located below the first support assembly 120, with its two ends respectively mounted on the side plates 111. A limiting assembly 140 is movably disposed between the side plates 111 along the height direction. The first support assembly 120, the second support assembly 130, and the limiting assembly 140 are used together to respectively place a first type of wafer 200, a second type of wafer 300, and a third type of wafer 400. Compared with the prior art, the wafer basket 100 provided by this invention is applicable to wafers of different specifications, has good versatility, thereby effectively shortening the production cycle, improving production efficiency, reducing production costs, improving economic benefits, and ensuring the limiting effect to prevent the wafer from accidentally detaching.

[0078] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wafer flower basket, characterized in that, include: The frame includes two oppositely arranged side plates and two support portions connecting the two side plates. The two side plates and the two support portions enclose a receiving space. The support portions have extension slots extending in the height direction. A first support assembly is located within the accommodating space, and its two ends are respectively mounted on the two side plates. The first support assembly includes two first support members disposed opposite to each other and two stop plates located outside the first support members. The first support member has a first support groove, which can place a first type of wafer. The stop plates abut against the edge of the first type of wafer, and the first support groove cooperates with the extension groove to place a second type of wafer. The second support assembly is located below the first support assembly, and its two ends are respectively mounted on the two side plates. The second support assembly includes two second support members disposed opposite to each other. The second support member has a second support groove, which cooperates with the first support groove to place a third type of wafer. A limiting component is movably disposed between the two side plates along the height direction, the limiting component being located above the third type of wafer to limit the height of the third type of wafer.

2. The wafer basket according to claim 1, characterized in that, The first support groove has a first support point between itself and the third type of wafer, and the line connecting the two first support points passes through the center of the third type of wafer; the second support groove has a second support point between itself and the third type of wafer, and there is an included angle θ between the line R connecting the second support point to the center of the third type of wafer and the line L connecting the two second support points. Specifically, if the third type of wafer is a 4-inch circular wafer, then the range of L is 1 / 3R-R; if the third type of wafer is a 6-inch circular wafer, then the range of L is 1.3R-1.5R; if the third type of wafer is an 8-inch circular wafer, then the range of L is 1.6R-1.7R.

3. The wafer basket according to claim 1, characterized in that, When the height of the first type of wafer located in the first support groove is greater than the height of the stop plate, the ratio of the height of the stop plate to the height of the first type of wafer located in the first support groove is 0.5-0.

8.

4. The wafer basket according to claim 1, characterized in that, The first support assembly further includes a support frame that is movable relative to the first support member; When the height of the first type of wafer located in the first support groove is less than or equal to the height of the stop plate, the abutment is located above the first type of wafer.

5. The wafer basket according to claim 4, characterized in that, The first support member is provided with a rotating shaft, and the abutment frame is provided with an oblong hole adapted to the rotating shaft. The abutment frame can rotate along the rotating shaft and can move up and down along the oblong hole to have a release position and an abutment position. When the support frame is in the supporting position, the upper part of the first type of wafer abuts against the support frame.

6. The wafer basket according to claim 5, characterized in that, The first support member has a stepped structure at its end, the stepped structure including a first step, a second step located below the first step, and a connecting part connecting the first step and the second step; When the abutment is in the released position, the bottom of the abutment can rotate around the pivot above the first step; When the abutting frame is in the abutting position, the bottom of the abutting frame abuts against the connecting part.

7. The wafer basket according to claim 5, characterized in that, The first support member has a tangential plane, and the abutment has an abutment surface for abutting the first type of wafer; When the abutment frame is in the abutment position, the abutment surface is in close contact with the tangential plane.

8. The wafer basket according to any one of claims 1-7, characterized in that, The second support component is provided in at least two sets, and at least two sets of the second support components are arranged sequentially below the first support component.

9. The wafer basket according to any one of claims 1-7, characterized in that, Both the first support assembly and the second support assembly can move horizontally relative to the side plate.

10. The wafer basket according to claim 9, characterized in that, The side plate is provided with a plurality of guide grooves corresponding to the first support component and the second support component respectively, and both the first support component and the second support component can move along the corresponding guide grooves.

Images