Electronic device

Abstract

An electronic device according to an embodiment of the disclosure can include a frame including two conductive portions spaced apart from each other, a non-conductive member including a protruding portion interposed between the two conductive portions, a support member spaced apart inward from the frame, a conductive block disposed between the support member and the frame and extending from the support member toward the frame, a first recess formed in an inner surface of a first conductive portion between the two conductive portions facing the support member, and the conductive block being interposed in the first recess, and a second recess formed in one surface of the support member facing the first conductive portion, and the conductive block being interposed in the second recess.

Description

Technical Field

[0001] This disclosure relates to electronic devices, for example, to electronic devices including a frame support structure. Background Technology

[0002] With the significant advancements in information and communication technologies and semiconductor technology, the distribution and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are being developed to be portable and capable of communication.

[0003] Electronic devices can refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, or vehicle navigation systems. For example, such electronic devices can output stored information as sound or video.

[0004] With the increasing integration of electronic devices and the prevalence of ultra-high-speed, high-capacity wireless communication, various functions can now be integrated into single electronic devices such as mobile communication terminals. For example, not only communication functions but also entertainment functions such as gaming, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and calendar management or e-wallet functions are being integrated into single electronic devices. These devices have been miniaturized for easy portability. Summary of the Invention

[0005] An electronic device according to embodiments of the present disclosure may include: a frame including two conductive portions spaced apart from each other; a non-conductive member including a protrusion inserted between the two conductive portions; a support member spaced inwardly from the frame; a conductive block disposed between the support member and the frame and extending from the support member toward the frame; a first recess formed on an inner surface of the first conductive portion of the two conductive portions facing the support member, wherein the conductive block is inserted into the first recess; and a second recess formed on a surface of the support member facing the first conductive portion, wherein the conductive block is inserted into the second recess.

[0006] An electronic device according to embodiments of the present disclosure may include: a frame including two conductive portions spaced apart from each other; a non-conductive member including a protrusion inserted between the two conductive portions; a support member spaced inwardly from the two conductive portions; a conductive block protruding from one of the support member and the conductive portions and extending toward the other; and a recess formed in the other of the support member and the conductive portions, wherein the conductive block is inserted into the recess. Attached Figure Description

[0007] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0008] Figure 2 This is a perspective view showing the front surface of an electronic device according to an embodiment of the present disclosure.

[0009] Figure 3 This is an exploded perspective view showing the front side of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 4 The interior of a portion of an electronic device according to an embodiment of the present disclosure is shown.

[0011] Figure 5 It is shown Figure 4 A magnified view of a portion of it.

[0012] Figure 6a This is a perspective view showing the state in which the conductive block is separated from the recess when the non-conductive component is removed, according to an embodiment of the present disclosure.

[0013] Figure 6b It is shown Figure 6a A magnified view of a portion of it.

[0014] Figure 7 This is a view showing the state in which the conductive block is accommodated in the recess after the non-conductive components have been removed, according to an embodiment of the present disclosure.

[0015] Figure 8 This is a view showing the state in which the conductive block is accommodated in the recess after the non-conductive components have been removed, according to an embodiment of the present disclosure.

[0016] Figure 9 This is a view showing the conductive block from various directions according to embodiments of the present disclosure.

[0017] Figure 10 This is a view showing the conductive block from various directions according to embodiments of the present disclosure.

[0018] Figure 11 This is a view showing the state in which the conductive block is accommodated in the recess after the non-conductive components have been removed, according to an embodiment of the present disclosure.

[0019] Figure 12 This is a view showing the conductive block from various directions according to embodiments of the present disclosure.

[0020] Figure 13 This is a view showing the state in which the conductive block is accommodated in the recess after the non-conductive components have been removed, according to an embodiment of the present disclosure.

[0021] Figure 14This is a view showing the state in which the conductive block is separated from the recessed portion when the non-conductive component is removed, according to an embodiment of the present disclosure.

[0022] Figure 15 This is a view showing the state in which the conductive block is accommodated in the recess after the non-conductive components have been removed, according to an embodiment of the present disclosure.

[0023] Figure 16 This is a view showing the state in which the conductive block is separated from the recessed portion when the non-conductive component is removed, according to an embodiment of the present disclosure.

[0024] Figure 17 This is a view showing the state in which the conductive block is accommodated in the recess after the non-conductive components have been removed, according to an embodiment of the present disclosure. Detailed Implementation

[0025] The following description of the accompanying drawings provides an understanding of various exemplary implementations of the present disclosure, including the claims and their corresponding content. The specific embodiments disclosed in the following description require various specific details to aid understanding, but are considered as one of various embodiments. Therefore, those skilled in the art will understand that various changes and modifications can be made to the various implementations described in this disclosure without departing from the scope and spirit of this disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0026] The terms and words used in the following description and claims are not limited to their literal meaning, but are intended to clearly and consistently describe embodiments of this disclosure. Therefore, those skilled in the art will understand that the following description of various implementations of this disclosure is provided for descriptive purposes only and not for limiting the scope of this disclosure as defined in the claims and their equivalents.

[0027] It should be understood that, unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” include plural meanings. Therefore, as an example, “component surface” can be interpreted as including one or more surfaces of a component.

[0028] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0029] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In an embodiment, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to an embodiment, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) can be integrated into a single integrated component (e.g., display module 160).

[0030] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121, or may be configured to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as a part of the main processor 121.

[0031] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0032] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0034] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0035] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0037] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0040] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0045] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify or verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0046] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0047] Antenna module 197 can transmit or receive signals or power to or from external sources (e.g., external electronic devices). According to an embodiment, antenna module 197 may include an antenna comprising a radiator formed of a conductor or conductive pattern on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and external electronic devices via the selected at least one antenna. According to an embodiment, other components besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may be further formed as part of antenna module 197.

[0048] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0049] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0050] According to an embodiment, instructions or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of external electronic devices 102 or 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0051] The electronic device according to various embodiments of this disclosure can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0052] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0053] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0054] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0055] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0056] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0057] Figure 2 This illustrates an electronic device 101 according to an embodiment of the present disclosure (e.g., Figure 1 Front perspective view of the electronic device 101. Figure 2 The embodiments can be related to Figure 1 Implementation examples or Figures 3 to 13 Examples of combinations.

[0058] Reference Figure 2 According to the embodiment, the electronic device 101 (e.g., Figure 1 The electronic device 101 may include a housing 210, wherein the housing 210 includes a first surface (or front surface) 210A, a second surface (or rear surface) opposite to the first surface 210A, and a side surface 210C surrounding the space between the first surface 210A and the second surface. According to an embodiment, the first surface 210A may be formed at least partially from a substantially transparent front panel 202 (e.g., a glass panel including various coatings, or a polymer panel). The side surface 210C may be formed from a side structure 218 comprising metal and / or polymer, which is coupled to the front panel 202 and the rear panel 211.

[0059] Although not shown, the front panel 202 according to an embodiment of the present disclosure may include a region that curves towards the rear panel 211 at least a portion of its edge and extends seamlessly. In an embodiment, only one of the regions of the front panel 202 (or rear panel 211) that curve towards the rear panel 211 (or front panel 202) may be included in one edge of the first surface 210A. According to an embodiment, the front panel 202 or the rear panel 211 may have a substantially flat shape.

[0060] According to an embodiment, the electronic device 101 may include at least one of the following: a display 220, audio modules 203, 207, 214, a sensor module 204, a camera module 205, a key input device 217, a light-emitting element 206, and connector holes 208, 209. In an embodiment, the electronic device 101 may not include at least one of the components (e.g., the key input device 217 or the light-emitting element 206), or other components may be added.

[0061] For example, the display 220 may be visually exposed through a large portion of the front panel 202. In an embodiment, at least a portion of the display 220 may be visually exposed through the front panel 202 forming the first surface 210A or through a portion of the side surface 210C. In an embodiment, the edges of the display 220 may be formed to be substantially the same as the adjacent external shape of the front panel 202. In an embodiment (not shown), the spacing between the outer edge of the display 220 and the outer edge of the front panel 202 may be kept substantially uniform to provide a larger visual exposure area for the display 220.

[0062] In one embodiment (not shown), the screen display area of ​​the display 220 may have a recess or opening in a portion thereof, and at least one or more of the audio module 214, sensor module 204, camera module 205, and light-emitting device 206 may be aligned with the recess or opening. In another embodiment (not shown), at least one or more of the audio module 214, sensor module 204, camera module 205, fingerprint sensor (not shown), and light-emitting device 206 may be included on the rear surface of the screen display area of ​​the display 220. In another embodiment (not shown), the display 220 may be configured to be connected to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter for detecting a magnetic field type stylus.

[0063] According to embodiments of this disclosure, audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be disposed in the microphone hole 203. In embodiments, multiple microphones may be provided to detect the direction of sound. Speaker holes 207 and 214 may include an external speaker hole 207 and a telephone receiver hole 214. In embodiments, speaker holes 207 and 214 and microphone hole 203 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be placed without speaker holes 207 and 214.

[0064] According to embodiments of this disclosure, sensor module 204 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 101. Sensor module 204 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 210A of housing 210. The fingerprint sensor may be disposed on the second surface 210B or side surface 210C of housing 210 and the first surface 210A (e.g., display 220). Electronic device 101 may further include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] According to embodiments of this disclosure, camera module 205 may be disposed on a first surface 210A of electronic device 101. Camera device 205 may include one or more lenses, image sensors and / or image signal processors.

[0066] According to embodiments of this disclosure, key input devices 217 may be disposed on the side surface 210C of the housing 210. In embodiments, the electronic device 101 may not include some or all of the aforementioned key input devices 217, and the un-included key input devices 217 may be implemented in another form, such as soft keys on the display 220. In embodiments, the key input devices may include a sensor module disposed on the second surface 210B of the housing 210.

[0067] The light-emitting device 206 may be disposed on, for example, a first surface 210A of the housing 210. The light-emitting device 206 may provide information, for example, about the state of the electronic device 101, in the form of light. In an embodiment, the light-emitting device 206 may provide a light source that interacts with, for example, a camera module 205. The light-emitting device 206 may include, for example, a light-emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0068] According to embodiments of the present disclosure, connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole (e.g., a headphone jack) 209, wherein the first connector hole 208 is capable of accommodating a connector (e.g., a USB connector) for sending / receiving power and / or data with an external electronic device, and the second connector hole 209 is capable of accommodating a connector for sending / receiving audio signals with an external electronic device.

[0069] Figure 3 This is an exploded perspective view showing the front side of an electronic device according to an embodiment of the present disclosure. Figure 3 The embodiments can be related to Figures 1 to 2Combinations of embodiments, or with Figures 4 to 13 Examples of combinations.

[0070] Reference Figure 3 Electronic device 101 (e.g., Figure 1 or Figure 2 The electronic device 101 may include a side structure 310, a first support member 311 (e.g., a bracket), and a front panel 320 (e.g., Figure 2 Front panel 202), display 330 (e.g., Figure 2 The display 220), at least one printed circuit board (or board assembly) 340a, 340b, battery 350, second support member 360 (e.g., rear housing), antenna, camera assembly 307, and rear plate 380 (e.g., Figure 2 (Rear panel 211). When multiple printed circuit boards 340a and 340b are included, the electronic device 101 may include at least one flexible printed circuit board 340c to electrically connect the different printed circuit boards. For example, printed circuit boards 340a and 340b may include a first circuit board 340a disposed above the battery 350 and a second circuit board 340b disposed below the battery 350, and the flexible circuit board 340c may electrically connect the first circuit board 340a and the second circuit board 340b.

[0071] According to embodiments, electronic device 101 may not include at least one of the components (e.g., the first support member 311 or the second support member 360), or other components may be added. At least one of the components of electronic device 101 may be combined with... Figure 1 or Figure 2 At least one of the components of the electronic device 101 is the same or similar, and will not be described again below.

[0072] At least a portion of the first support member 311 may be provided in a flat plate shape. In embodiments, the first support member 311 may be disposed inside the electronic device 101 to be connected to or integral with the side structure 310. The first support member 311 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). When the first support member 311 is at least partially formed of a metallic material, the side structure 310 or a portion of the first support member 311 may serve as an antenna. The display 330 may be bonded to one surface of the first support member 311, and printed circuit boards 340a and 340b may be bonded to the other surface of the first support member 311. A processor, memory, and / or interface may be mounted on the printed circuit boards 340a and 340b. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor central processor, or a communication processor.

[0073] In this embodiment, the front panel 320 can be attached to the support member 311 via an adhesive member. The front cover may be referred to as a "cover" or "front cover". The rear panel 380 may be referred to as a "cover" or "rear cover". The cover 380 may face the support member 311.

[0074] According to an embodiment, the first support member 311 and the side structure 310 can be collectively referred to as the front shell or housing 301. According to an embodiment, the housing 301 can generally be understood as a structure for accommodating, protecting, or housing printed circuit boards 340a and 340b or battery 350.

[0075] In embodiments, housing 301 can be understood to include structures that a user can visually or tactilely perceive from the outside of electronic device 101, such as side structures 310, front panel 320, and / or rear panel 380. Housing 301 may include side structures 310, a first support member 311, front panel 320, and rear panel 380. In embodiments, "front surface or rear surface of housing 301" may refer to... Figure 2 First surface 210A or Figure 2 The second surface 210B. In an embodiment, the first support member 311 may be provided on the front plate 320 (e.g., Figure 2 The first surface 210A) and the rear plate 380 (e.g., Figure 2 Between the second surface 210B, and can be used as a structure for placing electrical / electronic components such as printed circuit boards 340a and 340b or camera assembly 307.

[0076] In embodiments, the memory may include, for example, volatile memory or non-volatile memory.

[0077] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0078] The second support member 360 may include, for example, an upper support member 360a and a lower support member 360b. In an embodiment, the upper support member 360a, together with a portion of the first support member 311, may be configured to surround printed circuit boards 340a and 340b (e.g., the first circuit board 340a). For example, the upper support member 360a of the second support member 360 may be configured to face the first support member 311, wherein the first circuit board 340a is interposed between the upper support member 360a and the first support member 311 of the second support member 360.

[0079] In an embodiment, the lower support member 360b of the second support member 360 may be configured to face the first support member 311, wherein the second circuit board 340b is interposed between the lower support member 360b and the first support member 311. Circuit devices implemented in the form of integrated circuit chips or various electrical / electronic components (e.g., processors, communication modules, or memory) may be disposed on printed circuit boards 340a and 340b. According to an embodiment, printed circuit boards 340a and 340b may receive an electromagnetic shielding environment from the second support member 360. In an embodiment, the lower support member 360b may serve as a structure in which electrical / electronic components such as speaker modules and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors) may be disposed.

[0080] In embodiments, electrical / electronic components such as speaker modules and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors) can be disposed on an additional printed circuit board (not shown). For example, the lower support member 360b can be configured together with another portion of the first support member 311 to surround the additional printed circuit board. The speaker module or interface disposed on the additional printed circuit board (not shown) or the lower support member 360b can correspond to Figure 2 The audio module 207 or connector holes 208 and 309 are set.

[0081] Battery 350 may be a device for supplying power to at least one component of electronic device 101. Battery 350 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 350 may be disposed on a plane substantially the same as printed circuit boards 340a and 340b. Battery 350 may be integrally disposed within electronic device 101 or may be detachably disposed from electronic device 101.

[0082] Although not shown, the antenna may include a conductor pattern formed, for example, by direct laser forming on the surface of the second support member 360. In embodiments, the antenna may include a printed circuit pattern formed on the surface of a thin film. A thin-film antenna may be disposed between the rear panel 380 and the battery 350. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may perform short-range communication with, for example, an external device, or may wirelessly transmit or receive power required for charging. In embodiments of the invention, another antenna structure may be formed from a portion or combination of the side structure 310 and / or the first support member 311.

[0083] Figure 4 An electronic device (e.g., according to an embodiment of the present disclosure) is shown. Figure 3The interior of a part of the electronic device 101. (See reference...) Figure 4 The electronic device 101 according to embodiments of the present disclosure may include a body 400. The body 400 may include frames 410, 420, 430 and support members 450 spaced inwardly from the frames 410, 420, 430. The support members 450 may be referred to as support frames.

[0084] According to embodiments of this disclosure, the main body 400 may include frames 410, 420, and 430 spaced apart from each other. The frames 410, 420, and 430 may be sequentially arranged to form the periphery of the electronic device 101 (e.g., Figure 2 The side surface 210C and / or Figure 3 (Side structure 310). As an example, frames 410, 420, and 430 may extend relatively long along the periphery of electronic device 101. As another example, frames 410, 420, and 430 may be partially disposed in a region outside electronic device 101, or disposed inside a housing (not shown) that forms the appearance of electronic device 101.

[0085] According to embodiments of this disclosure, frames 410, 420, and 430 may be exposed to the outside of electronic device 101. Alternatively, frames 410, 420, and 430 may be covered by a non-conductive cover (not shown). As an example, frames 410, 420, and 430 may form the outer surface of electronic device 101. Frames 410, 420, and 430 may be referred to as outer frames.

[0086] According to embodiments of this disclosure, frames 410, 420, and 430 may include a first frame 410 and a second frame 420 and a third frame 430 extending to intersect with the first frame 410. The first frame 410 and the second frame 420 may intersect each other at a first edge 441. The first frame 410 and the third frame 430 may intersect each other at a second edge 442. As an example, the second frame 420 and the third frame 430 may be perpendicular to the first frame 430.

[0087] According to embodiments of this disclosure, frames 410, 420, and 430 may include at least one conductive portion. As an example, Figure 4 The illustration shows a first frame 410 comprising multiple conductive portions 411, 412. The second frame 420 and the third frame 430 may also comprise multiple conductive portions, similar to the first frame 410. In the following description, for ease of description, this disclosure will be primarily referred to in connection with the first frame 410 and its conductive portions 411, 412.

[0088] According to embodiments of this disclosure, frames 410, 420, and 430 may be disposed within internal components of the electronic device 101 (e.g., Figure 3 The internal components are surrounded by frames 410, 420, and 430. Frames 410, 420, and 430 protect the internal components from external impacts or foreign objects.

[0089] According to embodiments of this disclosure, the first frame 410 may include a first conductive portion 411 and a second conductive portion 412 spaced apart from each other. A protruding portion 510 of the non-conductive member 500 may be disposed between the first conductive portion 411 and the second conductive portion 412. The relationship between the conductive portions 411, 412 and the protruding portion 510 is described in detail below.

[0090] The electronic device 101 according to embodiments of the present disclosure may include at least one antenna module (e.g., Figure 1 Antenna module 197. Antenna module 197 may be supported by support member 450. Antenna module 197 may be electrically connected to conductive portions of frames 410, 420, 430. As an example, antenna module 197 may be electrically connected to conductive portions 411, 412 of the first frame 410. Conductive portions 411, 412 may be used as antenna elements to transmit radio waves to the outside.

[0091] According to embodiments of this disclosure, the body 400 may include support members 450 spaced inwardly (e.g., towards the center) from the frames 410, 420, 430 of the electronic device 101. Internal components of the electronic device 101 may be supported by the support members 450. The support members 450 may be at least partially conductive. The support members 450 may be referred to as the inner frame.

[0092] According to embodiments of this disclosure, the support member 450 can be directly connected to the frames 410, 420, 430 or integrally formed with the frames 410, 420, 430. Alternatively, a predetermined member can be inserted between the support member 450 and the frames 410, 420, 430 to connect them to each other. The support member 450 can be conductive. As an example, Figure 4 The first conductive portion 411 of the first frame 410 and the support member 450 are shown to be connected by the conductive block 600.

[0093] According to embodiments of this disclosure, a non-conductive component 500 may be disposed inside an electronic device 101. The non-conductive component 500 may include a first portion 540 disposed between the frames 410, 420, 430 and the support member 450, and at least one second portion 510, 520, 530. As an example, the non-conductive component 500 may be made of resin material.

[0094] According to embodiments of this disclosure, the coefficient of thermal expansion of the non-conductive component 500 and the coefficient of thermal expansion of the conductive portions 411 and 412 of the first frame 410 may be different from each other. Based on the same shape, the amount of thermal expansion of the non-conductive component 500 may be less than the amount of thermal expansion of the conductive portions 411 and 412 of the first frame 410.

[0095] According to embodiments of this disclosure, a first portion 540 may be disposed between the frames 410, 420, 430 and the support member 450. The first portion 540 may maintain the spacing between the frames 410, 420, 430 and the support member 450. The first portion 540 may prevent the frames 410, 420, 430 from denting inwards towards the electronic device 101 due to external impact. Alternatively, the first portion 540 may block the electrical connection between the frames 410, 420, 430 and the support member 450 in certain areas. The first portion 540 may be referred to as a buffer portion.

[0096] According to embodiments of this disclosure, second portions 510, 520, and 530 may be disposed between frames 410, 420, and 430. Second portions 510, 520, and 530 may be inserted between frames 410, 420, and 430. Second portions 510, 520, and 530 may be sandwiched between frames 410, 420, and 430. Second portions 510, 520, and 530 may be disposed in at least one of the conductive portions 411 and 412 of the first frame 410, between the first frame 410 and the second frame 420, and between the first frame 410 and the third frame 430.

[0097] According to embodiments of this disclosure, second portions 510, 520, and 530 may be disposed between frames 410, 420, and 430 and / or between conductive portions 411 and 412. Second portions 510, 520, and 530 may block electrical connections between frames 410, 420, and 430 and / or between conductive portions 411 and 412. Second portions 510, 520, and 530 may be referred to as protruding portions 510, 520, and 530.

[0098] According to embodiments of this disclosure, the protruding portions 510, 520, and 530 may be exposed to the outside of the electronic device 101. As an example, the protruding portions 510, 520, and 530 may form the outer surface of the electronic device 101.

[0099] According to embodiments of this disclosure, the electronic device 101 may include a conductive block 600 disposed between the frames 410, 420, 430 and the support member 450. As an example, Figure 4The conductive block 600 is shown disposed between the first frame 410 and the support member 450. In the following description, for ease of description, the conductive block 600 is described with respect to the first frame 410; this can also be applied to the second frame 420 and the third frame 430.

[0100] According to embodiments of this disclosure, the conductive block 600 may be positioned adjacent to the protrusion 510. The conductive block 600 may contact the first conductive portion 411 and the support member 450. The conductive block 600 may be supported by the support member 450. The conductive block 600 may extend in a direction from the interior of the electronic device 101 toward the exterior (e.g., the X-axis direction, the Y-axis direction). The conductive block 600 may extend from the support member 450 toward the first conductive portion 411 of the first frame 410. The conductive block 600 may minimize the indentation of the first conductive portion 411 toward the interior of the electronic device 101 due to external impacts, etc.

[0101] According to embodiments of this disclosure, the conductive block 600 may be covered by a non-conductive member 500. As an example, after the conductive block 600 is coupled to the first frame 410 and the support member 450, the non-conductive member 500 may be injected to cover the conductive block 600. When the injected non-conductive member 500 cures, the connection between the conductive block 600 and the first frame 410 and / or the connection between the conductive block 600 and the support member 450 can become secure.

[0102] According to embodiments of this disclosure, the conductive block 600 can be separately connected to the first frame 410 and the support member 450. Alternatively, the conductive block 600 can be integrally formed with the first frame 410 or the support member 450. The conductive block 600 can be part of the first conductive portion 411 of the first frame 410 or part of the support member 450.

[0103] Figure 5 It is shown Figure 4 A magnified view of a portion. (See reference) Figure 4 and Figure 5 According to embodiments of the present disclosure, the electronic device 101 may include bridge structures 413, 451 connecting the first frame 410 and the support member 450.

[0104] According to embodiments of the present disclosure, bridge structures 413, 451 may include a first bridge 413 formed on a first conductive portion 411 of the first frame 410 and a second bridge 451 formed on a support member 450.

[0105] According to embodiments of this disclosure, a first bridge 413 may protrude from a first conductive portion 411 toward a support member 450. The first bridge 413 may protrude from the inner surface of the first conductive portion 411 facing the support member 450. A second bridge 451 may protrude from the support member 450 toward the first conductive portion 411. The second bridge 451 may protrude from the region of the support member 450 facing the first conductive portion 411. The first bridge 413 and the second bridge 451 may protrude toward each other.

[0106] According to embodiments of this disclosure, the first bridge 413 may be positioned adjacent to the protrusion 510. The first bridge 413 may be positioned closer to the two opposite ends of the first conductive portion 411 than to the center of the first conductive portion 411. As an example, the first bridge 413 may be located at one end of the first conductive portion 411 that connects to the protrusion 510, or it may be spaced a predetermined distance from said end. The second bridge 451 may be spaced inwardly from the first bridge 413 toward the interior of the electronic device 101.

[0107] According to embodiments of this disclosure, the first bridge 413 may include a first recess 414. The first recess 414 may be formed on the inner side of the first bridge 413 adjacent to the second bridge 451. The second bridge 451 may include a second recess 452. The second recess 452 may be formed on the outer side of the second bridge 451 adjacent to the first bridge 413. The first recess 414 and the second recess 452 may face each other.

[0108] According to an embodiment of this disclosure, one end of the conductive block 600 may be located inside the first recess 414. This one end of the conductive block 600 may contact the inner side of the first recess 414. The other end of the conductive block 600 may be located inside the second recess 452. This other end of the conductive block 600 may contact the inner side of the second recess 452. The conductive block 600 may be inserted into the first recess 414 and the second recess 452.

[0109] According to embodiments of this disclosure, one end of the conductive block 600 may be spaced apart from the inner side of the first recess 414. A gap space may be formed between one end of the conductive block 600 and the inner side of the first recess 414. A gap space may be formed between the other end of the conductive block 600 and the inner side of the second recess 452.

[0110] According to embodiments of this disclosure, the conductive block 600 can extend from one end inserted into the first recess 414 to the other end inserted into the second recess 452. The conductive block 600 can extend along the length direction D1 from one end inserted into the first recess 414 to the other end inserted into the second recess 452. As an example, the conductive block 600 can extend straight.

[0111] According to embodiments of the present disclosure, the conductive portions 411 and 412 of the first frame 410 may include opposing surfaces 411s and 412s. The opposing surfaces 411s and 412s of the two conductive portions 411 and 412 may face each other. According to embodiments of the present disclosure, the protruding portion 510 of the non-conductive member 500 may be disposed between the two opposing surfaces 411s and 412s facing each other. The two opposing surfaces 411s and 412s facing each other may contact the protruding portion 510.

[0112] According to embodiments of this disclosure, the opposing surfaces 411s and 412s may extend along a direction from the interior of the electronic device 101 toward the exterior (e.g., the Y-axis direction). The opposing surfaces 411s and 412s may extend along the outer surfaces of the conductive portions 411 and 412 (e.g., ...). Figure 2 The side surface 210C extends in the direction facing it (e.g., the extension direction D2).

[0113] According to embodiments of this disclosure, two opposing surfaces 411s, 412s facing each other may extend smoothly, but may be formed at least partially rough, unlike in this disclosure. The surface shapes of the opposing surfaces 411s, 412s may be understood as unrelated to the concept of this disclosure.

[0114] According to embodiments of this disclosure, the non-conductive member 500 and the frame 410 can be in contact with each other. The non-conductive member 500 and the frame 410 can be coupled to each other. The non-conductive member 500 and the frame 410 can be attached to each other. As an example, by forming minute irregularities on the surface of the frame 410 (e.g., opposing surfaces 411s, 412s) with the aid of surface treatment, and then insert molding the non-conductive member 500, the non-conductive member 500 can be attached to the surface of the frame 410 without the intervention of adhesive members.

[0115] According to embodiments of this disclosure, the length direction D1 of the conductive block 600 may be inclined relative to the extending direction D2 of the opposing surfaces 411s and 412s. The length direction D1 of the conductive block 600 may be inclined relative to the extending direction D2 of the opposing surfaces 411s and 412s to move away from the protruding portion 510. Figure 5 Unlike the previous example, the length direction D1 of the conductive block 600 can be tilted relative to the extension direction D2 of the opposing surfaces 411s and 412s, so as to be closer to the protruding part 510.

[0116] According to embodiments of this disclosure, as the temperature rises (e.g., 80 degrees Celsius) during the manufacturing process of the electronic device 101 (e.g., drying), the support member 450, frame 410, conductive block 600, and non-conductive member 500 can extend. The support members 450, frame 410, conductive block 600, and non-conductive member 500 adjacent to each other can press against each other as they extend due to heat.

[0117] Unlike this disclosure, in the case where the support member 450, conductive block 600, and frame 410 are integrally formed (hereinafter, the first case), the expansion of the support member 450, conductive block 600, and frame 410 can be continuously increased, allowing the relative position of the conductive portion 411 with respect to the protrusion 510 to be significantly changed. Therefore, the protrusion 510 and the conductive portion 411, which are attached to each other, can be separated from each other.

[0118] However, in the case where the conductive block 600 is configured separately from the support 450 and the frame 410 and spaced apart from the first recess 414 and the second recess 452 to form a gap space as in this disclosure (hereinafter referred to as the second case), the degree of change in the relative position of the conductive portion 411 with respect to the protrusion 510 is reduced compared to the first case, thereby maintaining the connection between the protrusion 510 and the conductive portion 411.

[0119] According to embodiments of this disclosure, by positioning the length direction D1 of the conductive block 600 relative to the outer surface of the conductive portion 411 (e.g., ... Figure 2 The side surface 210C is tilted in a vertical direction, which can minimize the indentation of the conductive part 411 toward the inside of the electronic device 101 due to external impacts, etc.

[0120] According to embodiments of this disclosure, by tilting the length direction D1 of the conductive block 600 relative to the extension direction D2 of the opposing surfaces 411s and 412s, the indentation of the conductive portion 411 toward the interior of the electronic device 101 due to external impacts or the like can be minimized.

[0121] According to embodiments of this disclosure, by tilting the length direction D1 of the conductive block 600 relative to the extension direction D2 of the opposing surfaces 411s, 412s, the separation between the protruding portion 510 and the conductive portion 411 that are attached to each other can be minimized. For example, since the thermal expansion of the elongated conductive block 600 in the direction intersecting the length direction D1 (e.g., the extension direction D2 of the opposing surfaces 411s, 412s) is less than the thermal expansion in the length direction D1, the relative displacement difference between the conductive portion 411 and the protruding portion 510 can be minimized, thereby maintaining the connection (attachment) between the protruding portion 510 and the conductive portion 411.

[0122] Figure 6aThe illustration shows a state in which the non-conductive member 500 is removed and the conductive block 600 is separated from the recesses 414, 452, according to an embodiment of the present disclosure.

[0123] Reference Figure 6a Electronic devices according to embodiments of the present disclosure (e.g., Figure 2 and Figure 3 The electronic device 101 may include a first space 541 and a second space 511 in which non-conductive components 500 are arranged. The second space 511 may be located around the first space 541.

[0124] According to embodiments of this disclosure, the first portion 540 of the non-conductive member 500 (e.g., Figure 4 The first portion 540 can be disposed in the first space 541. The first space 541 can be the space between the frame 410 and the support member 450. The first portion 540 disposed in the first space 541 can support the frame 410 relative to the support member 450.

[0125] According to embodiments of this disclosure, the protruding portion 510 or the second portion 510 of the non-conductive member 500 may be disposed in the second space 511. The second space 511 may be the space between two opposing surfaces 411s and 412s facing each other. The protruding portion 510 disposed in the second space 511 may be inserted between the two opposing surfaces 411s and 412s.

[0126] According to embodiments of this disclosure, the first bridge 413 and the second bridge 451 may include opposing surfaces 413s and 451s facing each other. The two opposing surfaces 413s and 451s of the first bridge 413 and the second bridge 451 may be substantially parallel to each other.

[0127] According to embodiments of this disclosure, the opposing surfaces 413s of the first bridge 413 may face the interior of the electronic device 101. The opposing surfaces 413s of the first bridge 413 may be referred to as the inner surface 413s of the first bridge 413. The opposing surfaces 451s of the second bridge 451 facing the opposing surfaces 413s of the first bridge 413 may face the exterior of the electronic device 101. The opposing surfaces 451s of the second bridge 451 may be referred to as the outer surface 451s of the second bridge 451.

[0128] According to embodiments of the present disclosure, the first bridge 413 may include a side surface 417 intersecting with the opposing surface 413s. The side surface 417 of the first bridge 413 may be a portion of the periphery of the first bridge 413 with a protruding shape.

[0129] According to embodiments of this disclosure, the side surface 417 of the first bridge 413 may face the outer surface of the conductive portion 411 (e.g., Figure 2The direction perpendicular to the direction (e.g., Y-axis direction) facing the side surface 210C of the conductive portion 411 and the direction (e.g., X-axis direction) facing the opposite surface 411s of the conductive portion 411 is (e.g., Z-axis direction).

[0130] According to embodiments of this disclosure, the second bridge 451 may include a side surface 455 intersecting the opposing surface 451s. The side surface 455 of the second bridge 451 may be a portion of the periphery of the second bridge 451 with a protruding shape.

[0131] According to embodiments of this disclosure, the side surface 455 of the second bridge 451 may face substantially the same direction (e.g., the Z-axis direction) as the side surface 417 of the first bridge 413. As an example, the side surface 417 of the first bridge 413 and the side surface 455 of the second bridge 451 may face an electronic device (e.g., Figure 3 The front or rear of the electronic device 101. As an example, the front of the electronic device 101 may be the display of the electronic device 101 (e.g., Figure 3 The direction in which the display 330 faces. As an example, the back of the electronic device 101 can be the cover of the electronic device 101 (e.g., Figure 3 The direction in which the rear surface of the back cover (380) faces.

[0132] According to embodiments of this disclosure, a first recess 414 may be recessed from an opposing surface 413s of a first bridge 413. A second recess 452 may be recessed from an opposing surface 451s of a second bridge 451. As an example, the direction in which the first recess 414 is recessed from the opposing surface 413s and the direction in which the second recess 452 is recessed from the opposing surface 451s may be substantially parallel to each other.

[0133] According to embodiments of this disclosure, the first recess 414 may include a first opening 4141 formed in the opposing surfaces 413s of the first bridge 413. The second recess 452 may include a first opening 4521 formed in the opposing surfaces 451s of the second bridge 451. The first opening 4141 of the first recess 414 and the first opening 4521 of the second recess 452 may face each other. The first opening 4141 of the first recess 414 and the first opening 4521 of the second recess 452 may be spaced apart from each other in the longitudinal direction D1 of the conductive block 600.

[0134] According to embodiments of this disclosure, a first recess 414 may be recessed from a side surface 417 of a first bridge 413. A second recess 452 may be recessed from a side surface 455 of a second bridge 451. As an example, the direction in which the first recess 414 is recessed from the side surface 417 and the direction in which the second recess 452 is recessed from the side surface 455 may be substantially the same as each other.

[0135] According to an embodiment of the present disclosure, the first recess 414 may include a second opening 4142 formed in the side surface 417 of the first bridge 413. The second opening 4142 of the first recess 414 may communicate with the first opening 4141. The second opening 4142 may connect to the first opening 4141 at the edge of the opposing surface 413s of the first bridge 413.

[0136] According to embodiments of this disclosure, the second recess 452 may include a second opening 4522 formed in the side surface 455 of the second bridge 451. The second opening 4522 of the second recess 452 may communicate with the first opening 4521. The second opening 4522 may be connected to the first opening 4521 at the edge of the opposing surface 451s of the second bridge 451. The second opening 4522 of the second recess 452 may be spaced apart from the second opening 4142 of the first recess 414 in the longitudinal direction D1 of the conductive block 600.

[0137] According to an embodiment of this disclosure, one side of the conductive block 600 can be inserted into the interior of the first recess 414 through the second opening 4142 of the first recess 414. The other side of the conductive block 600 can be inserted into the interior of the second recess 452 through the second opening 4522 of the second recess 452.

[0138] According to embodiments of this disclosure, the first longitudinal end of the conductive block 600 (e.g., Figure 6b The end 614 of the conductive block 600 may be spaced apart from the inner surface 416 of the first recess 414. The second longitudinal end of the conductive block 600 (e.g., Figure 6b The end portion 615 may be spaced apart from the inner surface 454 of the second recess 452.

[0139] Figure 6b It is shown Figure 6a A magnified view of a portion. (See reference) Figure 6a and Figure 6b According to embodiments of the present disclosure, the conductive block 600 may include a first insertion portion 611 inserted into a first recess 414. At least a portion of the first insertion portion 611 may be inserted into the first recess 414.

[0140] According to embodiments of this disclosure, the first insertion portion 611 may include a first contact surface 616. The first contact surface 616 may be at least a portion of a side surface of the first insertion portion 611. The first contact surface 616 may contact at least a portion of the inner surface 416 of the first recess 414. The first contact surface 616 may extend along the length direction D1 of the conductive block 600.

[0141] According to embodiments of the present disclosure, the first insertion portion 611 may include a first end 614 located at an edge of the first insertion portion 611. The first end 614 may be spaced apart from the inner surface 416 of the first recess 414. The space between the first end 614 and the inner surface 416 of the first recess 414 may be empty or may receive a portion of the non-conductive member 500.

[0142] According to embodiments of the present disclosure, the conductive block 600 may include a second insertion portion 612 inserted into a second recess 452. At least a portion of the second insertion portion 612 may be inserted into the second recess 452.

[0143] According to embodiments of this disclosure, the second insertion portion 612 may include a second contact surface 617. The second contact surface 617 may be at least a portion of a side surface of the second insertion portion 612. The second contact surface 617 may contact at least a portion of the inner surface 454 of the second recess 452. The second contact surface 617 may extend along the length direction D1 of the conductive block 600.

[0144] According to embodiments of the present disclosure, the second insertion portion 612 may include a second end 615 located at an edge of the second insertion portion 612. The second end 615 may be spaced apart from the inner surface 454 of the second recess 452. The space between the second end 615 and the inner surface 454 of the second recess 452 may be empty or may receive a portion of the non-conductive member 500.

[0145] According to an embodiment of the present disclosure, the first end 614 of the conductive block 600 may be spaced apart from the inner surface 416 of the first recess 414, and the second end 615 of the conductive block 600 may be spaced apart from the inner surface 454 of the second recess 452.

[0146] According to embodiments of this disclosure, the first end 614 and the second end 615 of the conductive block 600 may be spaced apart from each other in the longitudinal direction D1 of the conductive block 600. The distance L1 between the first end 614 and the second end 615 in the longitudinal direction D1 of the conductive block 600 may be less than the distance L2 between the inner surface 416 of the first recess 414 and the inner surface 454 of the second recess 452 in the longitudinal direction D1 of the conductive block 600.

[0147] Unlike this disclosure, due to assembly tolerances and other factors that occur during the manufacturing process, there may be a situation where the first end 614 contacts the inner surface 416 of the first recess 14 and the second end 615 is spaced apart from the inner surface 454 of the second recess 452 (third case), or the first end 614 is spaced apart from the inner surface 416 of the first recess 14 and the second end 615 contacts the inner surface 454 of the second recess 452 (fourth case). Since the gap space for the thermal extension portion is formed together around the conductive block 600, the third and fourth cases are also included in the scope of this disclosure.

[0148] According to embodiments of this disclosure, the conductive block 600 may include a connecting portion 613 connecting the first insertion portion 611 and the second insertion portion 612. The connecting portion 613 may extend between the first recess 414 and the second recess 452. As an example, the connecting portion 613 may extend straight between the first recess 414 and the second recess 452.

[0149] According to embodiments of this disclosure, the height H1 of the contact surfaces 616 and 617 of the insertion portions 611 and 612 can be greater than the height H3 of the connecting portion 613. Therefore, the contact surface area between the contact surfaces 616 and 617 and the inner surfaces 416 and 454 of the recesses 414 and 452 can be increased, while minimizing the volume of the connecting portion 613.

[0150] According to embodiments of this disclosure, the height H3 of the contact surfaces 616, 617 and the connecting portion 613 may be a length defined in the insertion direction (e.g., the Z-axis direction) of the conductive block 600. Alternatively, the height H3 of the contact surfaces 616, 617 and the connecting portion 613 may be a length defined in the direction in which the first recess 14 is recessed from the side surface 417 of the first bridge 413 or in the direction in which the second recess 452 is recessed from the side surface 455 of the second bridge 451.

[0151] According to embodiments of the present disclosure, the height H1 of the first contact surface 616 of the first insertion portion 611 may be less than the depth H2 of the first recess 414 recessed from the side surface 417 of the first bridge 413. Similarly, according to embodiments of the present disclosure, the height of the second contact surface 617 of the second insertion portion 612 may be less than the depth of the second recess 452 recessed from the side surface 455 of the second bridge 451.

[0152] Figure 7 This is a view showing the state in which the conductive block 600 is accommodated in the recesses 414 and 452 after the non-conductive member 500 has been removed.

[0153] Reference Figure 7According to an embodiment of the present disclosure, the width of the first insertion portion 611 of the conductive block 600 can be equal to or greater than the width W2 of the second opening 4142 of the first recess 414. The first insertion portion 611 can be tightly inserted into the interior of the first recess 414 through the second opening 4142. The first insertion portion 611 can contact the inner surface 416 of the first recess 414.

[0154] According to an embodiment of the present disclosure, the width of the second insertion portion 612 of the conductive block 600 can be equal to or greater than the width W3 of the second opening 4522 of the second recess 452. The second insertion portion 612 can be tightly inserted into the interior of the second recess 452 through the second opening 4522 of the second recess 452. The second insertion portion 612 can contact the inner surface 454 of the second recess 452.

[0155] Figure 8 This is a view showing the state in which the conductive block 600 is accommodated in the recesses 414 and 452 after the non-conductive member 500 has been removed.

[0156] Reference Figure 7 and Figure 8 According to embodiments of this disclosure, a first gap space 415 may be formed between a first end 614 of the conductive block 600 and an inner surface 416 of a first recess 414. A second gap space 453 may be formed between a second end 615 of the conductive block 600 and an inner surface 454 of a second recess 452.

[0157] According to embodiments of this disclosure, a portion of the first portion 540 of the non-conductive member 500 may be accommodated within a first gap space 415 and a second gap space 453. The portion of the first portion 540 accommodated within the first gap space 415 and the second gap space 453 may buffer external forces acting on the conductive portion 411 of the frame 410.

[0158] According to embodiments of this disclosure, when the second bridge 451 extends due to high temperature, the size of the second gap space 453 can be reduced. When the conductive block 600 is exposed to high temperature, the second insertion portion 612 of the conductive block 600 can extend toward the second gap space 453. Therefore, when the second bridge 451 and the conductive block 600 extend due to high temperature, the size of the second gap space 453 decreases, minimizing the change in the relative position of the conductive block 600 with respect to the second bridge 451.

[0159] According to embodiments of this disclosure, when the first bridge 413 extends due to high temperature, the size of the first gap space 415 can be reduced. When the conductive block 600 is exposed to high temperature, the first insertion portion 611 of the conductive block 600 can extend toward the first gap space 415. Therefore, when the first bridge 413 and the conductive block 600 extend due to high temperature, the size of the first gap space 415 decreases, minimizing the change in the relative position of the first bridge 413 with respect to the conductive block 600.

[0160] According to embodiments of this disclosure, the conductive block 600 and the gap spaces 415, 453 can be disposed along the length direction D1 of the conductive block 600. When the conductive block 600 extends along the length direction D1 due to high temperature, the extended portion can be accommodated in the gap spaces 415, 453.

[0161] According to embodiments of this disclosure, the longitudinal ends 614, 615 of the conductive block 600 and the inner surfaces 416, 454 of the recesses 414, 452 may have corresponding shapes. The longitudinal ends 614, 615 of the conductive block 600 and the inner surfaces 416, 454 of the recesses 414, 452 may conformally fit together. As an example, if the longitudinal ends 614, 615 of the conductive block 600 are convex, then the inner surfaces 416, 454 of the recesses 414, 452 may be concave to correspond to them.

[0162] Figure 9 Views of the conductive block 1610 from various directions are shown according to embodiments of the present disclosure. (Refer to...) Figure 6a , Figure 6b and Figure 7 The descriptions of the components (conductive block 600, first insertion portion 611, second insertion portion 612, connecting portion 613) can also be applied to... Figure 9 The components shown with the same names (conductive block 1610, first insertion portion 1611, second insertion portion 1612, connecting portion 1613) are all valid as long as they do not contradict each other.

[0163] According to embodiments of this disclosure, the conductive block 1610 may include an insertion into the first recess (e.g., Figures 5 to 8 The first insertion portion 1611 is located in the first recess 414. The conductive block 1610 may include an insertion portion 1611 into the second recess (e.g., Figures 5 to 8 The second insertion portion 1612 in the second recess 452).

[0164] According to embodiments of this disclosure, the conductive block 1610 may include a connecting portion 1613 connecting the first insertion portion 1611 and the second insertion portion 1612. The connecting portion 1613 may connect the central portion of the first insertion portion 1611 and the central portion of the second insertion portion 1612. The central portion of the first insertion portion 1611 and the second insertion portion 1612 may be a predetermined portion including the center point of the first insertion portion 1611 and the second insertion portion 1612 and located inside the edge.

[0165] Figure 10 Views of the conductive block 2610 from various directions are shown according to embodiments of the present disclosure. Figure 11 This is a view showing the state in which the conductive block 2610 is accommodated in the recesses 2414, 2452 with the non-conductive member 500 removed, according to an embodiment of the present disclosure.

[0166] Reference Figure 6a , Figure 6b and Figure 7 The descriptions of the components (first bridge 413, first recess 14, opposing surfaces 413s, 451s, support member 450, second bridge 451, second recess 452, conductive block 600, first insertion portion 611, second insertion portion 612, connecting portion 613) can also be applied. Figure 10 and Figure 11 The components shown with the same names (first bridge 2413, first recess 2414, opposing surfaces 2413s, 2451s, support member 2450, second bridge 2451, second recess 2452, conductive block 2610, first insertion portion 2611, second insertion portion 2612, connecting portion 2613) are all valid as long as they do not contradict each other.

[0167] Reference Figure 10 and Figure 11 According to embodiments of the present disclosure, the conductive block 2610 may include a first insertion portion 2611 inserted into a first recess 2414. The end of the first insertion portion 2611 (e.g., Figure 8 The first end portion 614 may be spaced apart from the inner surface of the first recess 2414. The side surface of the first insertion portion 2611 (e.g., Figure 8 The first contact surface 616 can contact the inner surface of the first recess 2414.

[0168] According to embodiments of the present disclosure, the conductive block 2610 may include a second insertion portion 2612 inserted into a second recess 2452. The end of the second insertion portion 2612 (e.g., Figure 8 The second end portion 615 may be spaced apart from the inner surface of the second recess 2452. The side surface of the second insertion portion 2612 (e.g., Figure 8 The second contact surface 617 can contact the inner surface of the second recess 2452.

[0169] The conductive block 2610 according to an embodiment of the present disclosure may include a connecting portion 2613 connecting the first insertion portion 2611 and the second insertion portion 2612. The connecting portion 2613 can be bent from the first insertion portion 2611. The connecting portion 2613 can be bent from the second insertion portion 2612.

[0170] According to embodiments of this disclosure, the connecting portion 2613 may extend to intersect with the first insertion portion 2611. The connecting portion 2613 may extend to intersect with the second insertion portion 2612. The connecting portion 2613 may extend to intersect with a direction from the first recess 2414 toward the second recess 2452 or a direction from the second recess 2452 toward the first recess 2414.

[0171] According to embodiments of this disclosure, the first recess 2414 and the second recess 2452 may be spaced apart from each other in the length direction of the connecting portion 2613. The direction in which the first recess 2414 is recessed from the opposing surface 2413s may intersect with the length direction of the connecting portion 2613. The direction in which the second recess 2452 is recessed from the opposing surface 2451s may intersect with the length direction of the connecting portion 2613.

[0172] Figure 12 Views of the conductive block 3610 from various directions are shown according to embodiments of the present disclosure. Figure 13 This is a view showing the state in which the conductive block 3610 is accommodated in the recesses 3414, 3452 with the non-conductive member 500 removed, according to an embodiment of the present disclosure.

[0173] Reference Figure 6a , Figure 6b and Figure 7 The descriptions of the components (first bridge 413, first recess 414, opposing surfaces 413s, 451s, support member 450, second bridge 451, second recess 452, conductive block 600, first insertion portion 611, second insertion portion 612, connecting portion 613) can also be applied. Figure 12 and Figure 13 The components shown with the same names (first bridge 3413, first recess 3414, support member 3450, second bridge 3451, second recess 3452, conductive block 3610, first insertion portion 3611, second insertion portion 3612, connecting portion 3613) are all valid as long as they do not contradict each other.

[0174] Reference Figure 12 and Figure 13According to embodiments of the present disclosure, the conductive block 3610 may include a first insertion portion 3611 inserted into a first recess 3414. The first insertion portion 3611 may be partially spaced apart from the inner surface of the first recess 3414. The first insertion portion 3611 may partially contact the inner surface of the first recess 3414.

[0175] The conductive block 3610 according to an embodiment of the present disclosure may include a second insertion portion 3612 inserted into a second recess 3452. The second insertion portion 3612 may be partially spaced apart from the inner surface of the second recess 3452. The second insertion portion 3612 may partially contact the inner surface of the second recess 3452.

[0176] The conductive block 3610 according to an embodiment of the present disclosure may include a connecting portion 3613 connecting the first insertion portion 3611 and the second insertion portion 3612. The connecting portion 3613 may have a structure that is bent multiple times (e.g., twice).

[0177] According to embodiments of the present disclosure, the connecting portion 3613 may include a first portion 3613b spanning between the first bridge 3413 and the second bridge 3415. The first portion 3613b of the connecting portion 3613 may be substantially parallel to the first insertion portion 3611. The first portion 3613b of the connecting portion 3613 may be substantially parallel to the second insertion portion 3612. The first insertion portion 3611 and the second insertion portion 3612 may be spaced apart from each other in the length direction of the first portion 3613b of the connecting portion 3613.

[0178] According to embodiments of the present disclosure, the connecting portion 3613 may include a second portion 3613c that connects one side of the first portion 3613b and the first insertion portion 3611. The second portion 3613c of the connecting portion 3613 may be bent and extended from one side of the first portion 3613b. The first insertion portion 3611 may be bent and extended from the second portion 3613c of the connecting portion 3613.

[0179] According to embodiments of this disclosure, the connecting portion 3613 may include a third portion 3613a connecting the other side of the first portion 3613b and the second insertion portion 3612. The third portion 3613a of the connecting portion 3613 may be bent and extended from the other side of the first portion 3613b. The second insertion portion 3612 may be bent and extended from the third portion 3613a of the connecting portion 3613.

[0180] According to an embodiment of the present disclosure, a first recess 3414 may be formed in a first bridge 3413. The first recess 3414 may be recessed from a side surface 3413s of the first bridge 3413. According to an embodiment of the present disclosure, a second recess 3452 may be formed in a second bridge 3451. The second recess 3452 may be recessed from a side surface 3451s of the second bridge 3451.

[0181] According to embodiments of this disclosure, the direction in which the first recess 3414 is recessed from the side surface 3413s of the first bridge 3413 and the direction in which the second recess 3452 is recessed from the side surface 3451s of the second bridge 3451 can be substantially parallel. As an example, the direction in which the first recess 3414 is recessed from the side surface 3413s of the first bridge 3413 and the direction in which the second recess 3452 is recessed from the side surface 3451s of the second bridge 3451 can be opposite to each other.

[0182] According to an embodiment of this disclosure, the first insertion portion 3611 can be hooked into the first recess 3414. In the direction from the frame 410 toward the support member 3450, the first insertion portion 3611 can be hooked into the first recess 3414.

[0183] According to an embodiment of this disclosure, the second insertion portion 3612 can be hooked into the second recess 3452. The second insertion portion 3612 can be hooked into the second recess 3452 in the direction from the support member 3450 toward the frame 410.

[0184] Figure 14 This is a view showing the state in which the conductive block 4600 is separated from the recesses 4414 and 4452 after the non-conductive member 500 has been removed, according to an embodiment of the present disclosure. Figure 15 This is a view showing the state in which the conductive block 4600 is accommodated in the recesses 4414, 4452 with the non-conductive member 500 removed, according to an embodiment of the present disclosure.

[0185] Reference Figure 6a , Figure 6b and Figure 7 The descriptions of the components (conductive block 600, first insertion portion 611, second insertion portion 612, connecting portion 613, first recess 414, second recess 452, inner surface 416 of the first recess 414, and inner surface 454 of the second recess 452) can also be applied. Figure 14 and Figure 15 The components shown with the same names (conductive block 4600, first insertion portion 4611, second insertion portion 4612, connecting portion 4613, first recess 4414, second recess 4452, inner surface 4416 of first recess 4414, inner surface 4454 of second recess 4452) are all acceptable as long as they do not contradict each other.

[0186] Reference Figure 14 and Figure 15 According to embodiments of the present disclosure, the conductive block 4600 may include a first insertion portion 4611 inserted into a first recess 4414 and a second insertion portion 4612 inserted into a second recess 4452. The conductive block 4600 may include a connecting portion 4613 connecting the first insertion portion 4611 and the second insertion portion 4612. As an example, the conductive block 4600 may have an elongated strip shape.

[0187] According to embodiments of this disclosure, the inner surface 4416 of the first recess 4414 may have a shape corresponding to the outer surface of the first insertion portion 4611. The inner surface 4416 of the first recess 4414 may extend along the outer surface of the first insertion portion 4611. As an example, the inner surface 4416 of the first recess 4414 may extend substantially parallel to the outer surface of the first insertion portion 4611.

[0188] Figure 16 This is a view showing the state in which the conductive block 5600 is separated from the recesses 414 and 452 after the non-conductive member 500 has been removed, according to an embodiment of the present disclosure. Figure 17 This is a view showing the state in which the conductive block 5600 is accommodated in the recesses 414, 452 with the non-conductive member 500 removed, according to an embodiment of the present disclosure.

[0189] Reference Figure 6a , Figure 6b and Figure 7 The descriptions of the components (conductive block 600, first insertion portion 611, second insertion portion 612, connecting portion 613) can also be applied to... Figure 16 and Figure 17 The components shown with the same names (conductive block 5600, first insertion portion 5611, second insertion portion 5612, connection portion 5613) are all valid as long as they do not contradict each other.

[0190] Reference Figure 16 and Figure 17 According to embodiments of this disclosure, the conductive block 5600 may include a first insertion portion 5611 inserted into the first recess 414 and a second insertion portion 5612 inserted into the second recess 452. The conductive block 5600 may include a connecting portion 5613 connecting the first insertion portion 5611 and the second insertion portion 5612.

[0191] According to embodiments of this disclosure, the first recess 414 may include an inner surface 416 and an adjacent surface 418. The inner surface 416 and the adjacent surface 418 of the first recess 414 may face the outer surface of the first insertion portion 5611. The distance between the adjacent surface 418 and the outer surface of the first insertion portion 5611 may be less than the distance between the inner surface 416 and the outer surface of the first insertion portion 5611.

[0192] As an example, adjacent surfaces 418 may contact the outer surface of the first insertion portion 5611 to support the first insertion portion 5611, and a gap space may be formed between the inner surface 416 and the outer surface of the first insertion portion 5611 (e.g., Figure 8 (First gap space 415). As another example, due to assembly tolerances or machining tolerances, adjacent surfaces 418 may be slightly (e.g., 0.01 mm) spaced apart from the first insertion portion 5611.

[0193] According to embodiments of this disclosure, the inner surface 416 of the first recess 414 can be located along the length of the conductive block 5600 (e.g., Figure 5 The conductive block 600 is spaced apart from the first insertion portion 5611 along its length direction D1. The adjacent surface 418 of the first recess 414 may be spaced apart from the first insertion portion 5611 along the insertion direction of the conductive block 5600 (e.g., the -Z direction).

[0194] According to embodiments of this disclosure, a third recess 419 may be formed in an adjacent surface 418 of the first recess 414. The third recess 419 may be recessed from the adjacent surface 418 in the insertion direction (e.g., the -Z direction) of the conductive block 600. The third recess 419 may be recessed along the length direction of the conductive block 5600 (e.g., along the length direction of the conductive block 5600). Figure 5 The conductive block 600 extends elongatedly in the longitudinal direction (D1). The third recess 419 may have a shape conformally matching the first connecting portion 5614 of the conductive block 5600.

[0195] According to embodiments of the present disclosure, the second recess 452 may include an inner surface 454 and an adjacent surface 456. The inner surface 454 and the adjacent surface 456 of the second recess 452 may face the outer surface of the second insertion portion 5612. The distance between the adjacent surface 456 and the outer surface of the second insertion portion 5612 may be less than the distance between the inner surface 454 and the outer surface of the second insertion portion 5612.

[0196] As an example, adjacent surfaces 456 may contact the outer surface of the second insertion portion 5612 to support the second insertion portion 5612, and a gap space may be formed between the inner surface 454 and the outer surface of the second insertion portion 5612 (e.g., Figure 8(Second gap space 453). As another example, due to assembly tolerances or machining tolerances, adjacent surfaces 456 may be slightly (e.g., 0.01 mm) spaced apart from the second insertion portion 5612.

[0197] According to embodiments of this disclosure, the inner surface 454 of the second recess 452 can be located along the length of the conductive block 5600 (e.g., Figure 5 The conductive block 600 is spaced apart from the second insertion portion 5612 along its length direction D1. The adjacent surface 456 of the second recess 452 may be spaced apart from the second insertion portion 5612 along the insertion direction of the conductive block 5600 (e.g., the -Z direction).

[0198] According to embodiments of this disclosure, a fourth recess 457 may be formed in an adjacent surface 456 of the second recess 452. The fourth recess 457 may be recessed from the adjacent surface 456 in the insertion direction (e.g., the -Z direction) of the conductive block 600. The fourth recess 457 may be recessed along the length direction of the conductive block 5600 (e.g., along the length direction of the conductive block 5600). Figure 5 The conductive block 600 extends elongatedly in the longitudinal direction D1. The fourth recess 457 may have a shape that conformally matches the second connecting portion 5615 of the conductive block 5600.

[0199] According to embodiments of this disclosure, the conductive block 5600 may include a first connecting portion 5614 protruding from the first insertion portion 5611 in one direction (e.g., the -Z direction). As an example, the first connecting portion 5614 may protrude from the lower surface of the first insertion portion 5611 adjacent to the first recess 414. The first connecting portion 5614 may be inserted into a third recess 419. The first connecting portion 5614 may be press-fitted into the third recess 419.

[0200] According to embodiments of this disclosure, at least a portion of the outer surface of the first connecting portion 5614 can be in close contact with the inner surface of the third recess 419. As an example, in the longitudinal direction of the conductive block 5600 (e.g., Figure 5 Along the length direction D1 of the conductive block 600, the first connecting portion 5614 and the third recess 419 may be slightly spaced apart (e.g., 0.01 mm) due to machining tolerances. Therefore, the portion of the first connecting portion 5614 that extends due to heat can be accommodated inside the third recess 419.

[0201] According to embodiments of this disclosure, the first connecting portion 5614 may extend elongatedly along the length of the conductive block 5600. The width of the elongated first connecting portion 5614 may be smaller than the width of the first insertion portion 5611.

[0202] According to embodiments of the present disclosure, the conductive block 5600 may include a second connecting portion 5615 projecting from the second insertion portion 5612 in one direction (e.g., the -Z direction). As an example, the second connecting portion 5615 may project from the lower surface of the second insertion portion 5612 adjacent to the second recess 452. The second connecting portion 5615 may be inserted into a fourth recess 457. The second connecting portion 5615 may be press-fitted into the fourth recess 457.

[0203] According to embodiments of this disclosure, at least a portion of the outer surface of the second connecting portion 5615 can be in close contact with the inner surface of the fourth recess 457. As an example, in the longitudinal direction of the conductive block 5600 (e.g., Figure 5 Along the length direction D1 of the conductive block 600, the second connecting portion 5615 and the fourth recess 457 may be slightly spaced apart (e.g., 0.01 mm) due to machining tolerances. Therefore, the portion of the second connecting portion 5615 that extends due to heat can be accommodated inside the fourth recess 457.

[0204] According to embodiments of this disclosure, the second connecting portion 5615 may extend elongatedly along the length direction of the conductive block 5600. The width of the elongated second connecting portion 5615 may be smaller than the width of the second insertion portion 5612.

[0205] Electronic devices composed of multiple components (e.g., antennas) may be exposed to high temperatures during manufacturing processes (e.g., drying). In such cases, during the exposure of multiple components to high temperatures or subsequent cooling, problems such as misalignment of the components or separation of the components may occur due to the constraint relationships between the components and / or differences in the coefficients of thermal expansion of the materials. Therefore, research is underway to improve the quality of electronic devices.

[0206] The problem to be solved in this disclosure is to minimize the relative displacement difference caused by the thermal expansion of two interconnected components.

[0207] The problem to be solved in this disclosure is to improve the quality of electronic devices by minimizing the separation of two interconnected components due to thermal expansion.

[0208] The problems to be solved in this disclosure are not limited to those described above, and can be identified in various ways without departing from the concept and scope of this disclosure.

[0209] Electronic devices according to various embodiments of the present disclosure can minimize the relative displacement difference that occurs when two interconnected components extend due to heat by forming a gap space for accommodating portions that extend due to heat.

[0210] Electronic devices according to various embodiments of the present disclosure can minimize the separation of two interconnected components due to thermal expansion by providing a configuration that extends in a direction inclined relative to the extension direction of the connection surfaces of two interconnected components and a gap space to accommodate the extension portion.

[0211] Electronic devices according to various embodiments of the present disclosure can minimize separation between two interconnected components by designing them such that the directions of greater expansion of two interconnected components intersect.

[0212] The effects that can be obtained in this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

[0213] An electronic device according to an embodiment of the present disclosure may include a frame 410, the frame 410 including two conductive portions 411, 412 spaced apart from each other.

[0214] An electronic device according to an embodiment of the present disclosure may include a non-conductive member 500, the non-conductive member 500 including a protrusion 510 inserted between two conductive portions 411, 412.

[0215] Electronic device 101 according to embodiments of the present disclosure may include support members 450, 2450 spaced inwardly from frame 410.

[0216] Electronic device 101 according to embodiments of the present disclosure may include conductive blocks 600, 2600 disposed between support member 450 and frame 410.

[0217] Conductive blocks 600, 2600 according to embodiments of the present disclosure can extend from support member 450 toward frame 410.

[0218] An electronic device 101 according to an embodiment of the present disclosure may include first recesses 414, 2414 formed on the inner surfaces 413s, 2413s of the first conductive portion 411 facing the support member 450 of the two conductive portions 411, 412, wherein conductive blocks 600, 2600 are inserted into the first recesses 414, 2414.

[0219] Electronic device 101 according to embodiments of the present disclosure may include second recesses 452, 2452 formed on a surface 451s, 2451s of a support member 450 facing a first conductive portion 411, wherein conductive blocks 600, 2600 are inserted into the second recesses 452, 2452.

[0220] According to an embodiment of this disclosure, the conductive block 600 can extend from the first recess 414 to the second recess 452.

[0221] According to embodiments of the present disclosure, at least one of the two longitudinal ends 614, 615 of the conductive block 600 may be spaced apart from the inner surfaces 416, 454 of the first recess 414 and the second recess 452.

[0222] According to embodiments of this disclosure, the side surfaces 616 and 617 of the conductive block 600 can contact the inner surface of the first recess 414 and the inner surface of the second recess 454.

[0223] According to embodiments of this disclosure, the support member 450 may be conductive.

[0224] According to embodiments of the present disclosure, conductive blocks 600, 2600 may include first insertion portions 611, 2611 inserted into first recesses 414, 2414.

[0225] According to embodiments of the present disclosure, conductive blocks 600, 2600 may include second insertion portions 612, 2612 inserted into second recesses 454, 2454.

[0226] According to embodiments of the present disclosure, conductive blocks 600, 2600 may include connecting portions 613, 2613 located outside the first recesses 414, 2414 and the second recesses 454, 2454.

[0227] According to embodiments of the present disclosure, connecting portions 613 and 2613 can connect to first insertion portions 611 and 2611 and second insertion portions 612 and 2612.

[0228] According to embodiments of the present disclosure, the first recess 414 may have a shape corresponding to the first insertion portion 611.

[0229] According to embodiments of the present disclosure, the second recess 454 may have a shape corresponding to the second insertion portion 612.

[0230] According to an embodiment of the present disclosure, the width of the connecting portion 613 may be less than the width of the side surface 616 of the first insertion portion 611 that contacts the inner surface of the first recess 414.

[0231] According to an embodiment of the present disclosure, the width of the connecting portion 613 may be less than the width of the side surface 617 of the second insertion portion 612 that contacts the inner surface of the second recess 452.

[0232] According to an embodiment of the present disclosure, the connecting portion 613 may extend along the direction of the first recess 414 recessed from the inner surface 413s of the first conductive portion 411.

[0233] According to an embodiment of the present disclosure, the connecting portion 613 may extend along the second recess 452 in the direction of the recess from a surface 451s of the support member 450.

[0234] According to an embodiment of the present disclosure, the connecting portion 2613 may extend to intersect with the direction in which the first recess 2414 is recessed from the inner surface 2413s of the first conductive portion 411.

[0235] According to an embodiment of the present disclosure, the connecting portion 2613 may extend to intersect with the direction in which the second recess 2452 is recessed from a surface 2451s of the support member 2450.

[0236] According to embodiments of this disclosure, the first recess 414 and the second recess 452 may face each other.

[0237] According to embodiments of the present disclosure, frame 410 may include a first bridge 413 projecting toward support member 450.

[0238] According to embodiments of the present disclosure, the first bridge 413 may include a first recess 414.

[0239] According to embodiments of the present disclosure, the support member 450 may include a second bridge 451 projecting toward the frame 410.

[0240] According to embodiments of this disclosure, the second bridge 451 may be spaced apart from the first bridge 413.

[0241] According to an embodiment of the present disclosure, the second bridge 451 may have a second recess 452 formed therein.

[0242] According to an embodiment of the present disclosure, one side 4142 of the first recess 414 may be open, thereby partially exposing the conductive block 600.

[0243] According to an embodiment of the present disclosure, one side 4522 of the second recess 452 may be open, thereby partially exposing the conductive block 600.

[0244] According to embodiments of the present disclosure, the direction in which the first recess 414 is recessed from the inner surface 413s and the direction in which the second recess 452 is recessed from a surface 451s of the support member 450 can be parallel to each other.

[0245] According to an embodiment of the present disclosure, the direction in which the first recess 2414 is recessed from the inner surface 2413s may intersect with the direction from the first recess 2414 toward the second recess 2452.

[0246] According to an embodiment of the present disclosure, the direction in which the second recess 2451 is recessed from a surface 2451s of the support member 2450 may intersect with the direction from the first recess 2414 toward the second recess 2452.

[0247] According to an embodiment of the present disclosure, the protruding portion 510 of the non-conductive member 500 may be disposed between two opposing surfaces 411s, 412s of two conductive portions 411, 412 facing each other.

[0248] According to an embodiment of the present disclosure, the length direction D1 of the conductive block 600 may be tilted relative to the opposing surface 411s of the first conductive portion 411 including the first recess 414.

[0249] According to an embodiment of the present disclosure, the longitudinal direction D1 of the conductive block 600 may be tilted away from the opposing surface 411s of the first conductive portion 411 including the first recess 414.

[0250] Electronic device 101 according to embodiments of the present disclosure may include a conductive block 600 that protrudes from one of a support member 450 and a conductive portion 411 and extends toward the other.

[0251] An electronic device 101 according to an embodiment of the present disclosure may include recesses 414, 452 formed in another of the support member 450 and the conductive portion 411, wherein a conductive block 600 is inserted into the recesses 414, 452.

[0252] The accompanying figures referencing above include X, Y, and Z coordinate axes with the same orientation. The coordinate axes included in each figure are for ease of description, and the direction of each axis (X-axis, Y-axis, and Z-axis) does not have a directional characteristic such as forward / backward, up / down, or left / right. The direction of each axis can be understood as +X, +Y, and +Y directions, and the opposite direction can be understood as -X, -Y, and -Z directions.

[0253] While this disclosure has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the following claims.

Claims

1. An electronic device comprising: The frame (410) includes two conductive portions (411, 412) spaced apart from each other. The non-conductive component (500) includes a protrusion (510) inserted between the two conductive portions (411, 412). Supporting members (450, 2450) are spaced inward from the frame (410); Conductive blocks (600, 2600) are disposed between the support member (450; 2450) and the frame (410), the conductive blocks (600; 2600) extending from the support member (450; 2450) toward the frame (410); A first recess (414, 2414) is formed on the inner surface (413s, 2413s) of the first conductive portion (411) of the two conductive portions (411, 412) facing the support member (450, 2450), wherein the conductive blocks (600, 2600) are inserted into the first recess (414, 2414); and The second recess (452, 2452) is formed on a surface (451s, 2451s) of the support member (450; 2450) facing the first conductive portion (411), wherein the conductive block (600, 2600) is inserted into the second recess (452, 2452).

2. The electronic device according to claim 1, wherein: The conductive block (600) extends from the first recess (414) to the second recess (452). At least one of the two longitudinal ends (614, 615) is spaced apart from the inner surfaces (416, 454) of the first recess (414) and the second recess (452).

3. The electronic device according to claim 1 or 2, wherein: The side surfaces (616, 617) of the conductive block (600) contact the inner surfaces of the first recess (414) and the second recess (454), and The support member (450) is conductive.

4. The electronic device according to any one of claims 1 to 3, in, The conductive blocks (600, 2600) include: The first insertion portion (611, 2611) is inserted into the first recess (414, 2414); The second insertion portion (612, 2612) is inserted into the second recess (454, 2454); and The connecting portions (613, 2613) are located outside the first recess (414, 2414) and the second recess (454, 2454), and the connecting portions (613, 2613) connect the first insertion portion (611, 2611) and the second insertion portion (612, 2612).

5. The electronic device according to any one of claims 1 to 4, wherein: The first recess (414) has a shape corresponding to the shape of the first insertion portion (611), and The second recess (454) has a shape corresponding to the shape of the second insertion portion (612).

6. The electronic device according to any one of claims 1 to 5, in, The width of the connecting portion (613) is less than the width of the side surface (616) of the first insertion portion (611) that contacts the inner surface of the first recess (414) and the width of the side surface (617) of the second insertion portion (612) that contacts the inner surface of the second recess (452).

7. The electronic device according to any one of claims 1 to 6, in, The connecting portion (613) extends along the direction in which the first recess (414) is recessed from the inner surface (413s) of the first conductive portion (411) or along the direction in which the second recess (452) is recessed from the surface (451s) of the support member (450).

8. The electronic device according to any one of claims 1 to 7, in, The connecting portion (2613) extends in a direction that intersects with the direction in which the first recess (2414) is recessed from the inner surface (2413s) of the first conductive portion (411) and the direction in which the second recess (2452) is recessed from one surface (2451s) of the support member (2450).

9. The electronic device according to any one of claims 1 to 8, in, The first recess (414) and the second recess (452) face each other.

10. The electronic device according to any one of claims 1 to 9, in, The frame (410) includes a first bridge (413) projecting toward the support member (450), a first recess (414) formed in the first bridge (413), and The support member (450) includes a second bridge (451) protruding toward the frame (410), the second bridge (451) being spaced apart from the first bridge (413), and a second recess (452) being formed in the second bridge (451).

11. The electronic device according to any one of claims 1 to 10, in, One side (4142) of the first recess (414) is open, thereby partially exposing the conductive block (600). The second recess (452) has an opening on one side (4522) that exposes part of the conductive block (600).

12. The electronic device according to any one of claims 1 to 11, in, The direction in which the first recess (414) is recessed from the inner surface (413s) is parallel to the direction in which the second recess (452) is recessed from one surface (451s) of the support member (450).

13. The electronic device according to any one of claims 1 to 12, in, The direction in which the first recess (2414) is recessed from the inner surface (2413s) or the direction in which the second recess (2451) is recessed from the one surface (2451s) of the support member (2450) intersects the direction from the first recess (2414) toward the second recess (2452).

14. The electronic device according to any one of claims 1 to 13, wherein: The protruding portion (510) of the non-conductive member (500) is disposed between two opposing surfaces (411s, 412s) of the two conductive portions (411, 412) facing each other, and The longitudinal direction D1 of the conductive block 600 is inclined relative to the opposing surface 411s of the first conductive portion 411 including the first recess 414.

15. The electronic device according to any one of claims 1 to 14, in, The longitudinal direction (D1) of the conductive block (600) is tilted away from the opposing surface (411s) of the first conductive portion (411), which includes the first recess (414).

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