An automatic glue applicator for flexible boards

Abstract

This application relates to the technical field of adhesive coating equipment, and in particular to an automatic adhesive coating machine for flexible boards, comprising a feeding and flipping mechanism, an adhesive dispensing module, a curing module, and a buffer module; the buffer module includes first and second tray collection modules, a tray cutting mechanism, and a conveying mechanism; the conveying mechanism is equipped with a liftable telescopic support device. The feeding and flipping mechanism includes a composite adsorption plate with magnetically adjustable suction cups. This application can maintain a non-contact gap between the telescopic support device and the side of the conveyed tray, effectively absorbing and compensating for the tilting margin after tray stacking, eliminating lateral pressure, and avoiding tray jamming and machine stoppage; the magnetically adjustable suction cups can achieve stepless adjustment of the adsorption point, adapting to flexible boards with different layouts and reducing changeover costs; the drawer-type defective product conveyor design enables unloading without stopping the machine. This application significantly improves the stability, versatility, and production efficiency of adhesive coating operations.

Description

Technical Field

[0001] This invention relates to the field of adhesive coating equipment technology, and more specifically, to an automatic adhesive coating machine for flexible boards. Background Technology

[0002] In the automated production process of electronic components, the adhesive application of flexible boards is a crucial step in ensuring product quality and production efficiency. Existing automatic adhesive application machines, to achieve high efficiency, typically integrate multiple dispensing modules on the same production line to apply adhesive to different parts of the workpiece, followed by adhesive curing via a curing module. Because the workpiece temperature is high after curing, it usually needs to enter a cooling buffer station before unloading. Inside the buffer station, workpieces are supported on trays and stacked, with the trays positioned by a locating tip on the top surface and a locating groove on the bottom surface of the upper tray. However, because the locating groove and locating tip usually use an interference fit to ensure positioning accuracy, the top tray is prone to significant tilting as the stack height increases. When the transport mechanism inserts from the side of the tray below the top tray, the side of the transport mechanism easily comes into contact with the tilted tray, generating lateral pressure. This causes the locating tip to press against the inner wall of the locating groove from the side, resulting in a significant increase in friction between the trays. In this situation, when the conveying mechanism lifts the top tray, it often mistakenly lifts the trays below as well, causing severe jamming and affecting the overall production cycle. Furthermore, flexible boards typically rely on multi-point suction cups for adsorption during handling or flipping. However, due to the varying distribution of electronic modules on different sizes of flexible boards, traditional fixed suction cups struggle to flexibly adjust the adsorption points according to product changes, resulting in poor versatility of existing equipment and an inability to meet the demands of flexible production with diverse varieties and small batches. Therefore, effectively solving the jamming problem caused by tilted tray stacking and improving the adaptability of the adsorption mechanism to different flexible boards has become a pressing technical challenge in the field of automated flexible board coating equipment. Summary of the Invention

[0003] The purpose of this application is to provide an automatic glue applicator for flexible boards to solve the above-mentioned technical problems.

[0004] The present invention adopts the following solution:

[0005] An automatic adhesive applicator for flexible boards includes: a feeding and flipping mechanism, at least one adhesive applicator module, a curing module, and a buffer module; wherein, The feeding and flipping mechanism is configured to receive the flexible plate workpiece to be processed, and to transport it to the processing position of the dispensing module through flipping and translation logic. The curing module is located downstream of the dispensing module to cure the adhesive on the flexible board. The buffer module includes a cyclically switchable tray to receive the flexible board conveyed by the curing module; it includes a first tray module and a second tray module, wherein: The first tray module includes a first tray stacking chamber for stacking empty trays, and a first lifting mechanism and a first support assembly are provided below the first tray stacking chamber; The second tray module includes a second tray stacking chamber for stacking full trays, and a second lifting mechanism and a second support assembly are provided below the second tray stacking chamber; A cutting mechanism is connected below the first stacked tray chamber and the second stacked tray chamber. The cutting mechanism is configured to transport the full material tray at the bottom of the second stacked tray chamber to the bottom of the first stacked tray chamber, and lift it into the first stacked tray chamber under the drive of the first lifting mechanism and the first support assembly. A cross-shaped transport mechanism is connected above the first and second stacked tray chambers. The transport mechanism includes synchronous belt mechanisms extending on opposite sides of the upper ends of the first and second stacked tray chambers. Each of the two synchronous belt mechanisms is equipped with a liftable telescopic support device. The telescopic support device is configured to lift the trays at the top of the first stacked tray chamber to a predetermined height and transport them to the top of the second stacked tray chamber for stacking. The end actuators of the two telescopic support devices can controllably maintain a non-contact gap with the side of the transported trays to avoid tilting allowance after the trays are stacked.

[0006] Furthermore, the telescopic support device integrates a detection sensor, which is configured to monitor whether a follower tray exists below the telescopic support device.

[0007] Furthermore, the telescopic support device adopts a telescopic cylinder, and the extended end of the telescopic cylinder is connected to a transport support plate. The extension stroke of the transport support plate is adjustable to adapt to different tilt extension amounts after the material trays are stacked.

[0008] Furthermore, the telescopic support device includes a telescopic drive device and a transport support plate connected to the movable end of the telescopic drive device, and a proximity sensor is provided on the transport support plate. The proximity sensor is configured to detect the physical distance between the edge of the transport support plate and the side wall of the material tray in real time, so that the transport support plate and the side of the material tray are maintained within a set safe gap range.

[0009] Furthermore, the telescopic support device is connected to a lifting cylinder.

[0010] Furthermore, the cutting mechanism includes a lead screw assembly connected below the first stacked disc chamber and the second stacked disc chamber. A receiving disc is connected to the lead screw assembly via a nut seat. The receiving disc reciprocates linearly between the first stacked disc chamber and the second stacked disc chamber under the rotational drive of the lead screw.

[0011] Furthermore, the feeding and turning mechanism includes a turning component and an adsorption plate of the turning component. The adsorption plate includes a fixed adsorption plate and an adjustable adsorption plate. The fixed adsorption plate is provided with a plurality of fixed adsorption holes. The adjustable adsorption plate includes a metal magnetic plate parallel to the adjustable adsorption plate. The metal magnetic plate is provided with a plurality of magnetically adjustable suction cups to adjust the adsorption position at any coordinate position on the metal magnetic plate to adapt to different flexible plates.

[0012] Furthermore, the magnetically adjustable suction cup includes a suction cup body and a magnetic block connected to the end of the suction cup body. The magnetic block is used to adhere to the metal magnetic plate. An air inlet pipe is provided on the side of the suction cup body for connecting to a vacuum pipe.

[0013] Furthermore, the UV curing component is connected to a drawer-type defective product conveyor line, which is suspended on one side of the UV curing component via a pull-out rail, so that the drawer-type defective product conveyor line can be pulled out from the production line for unloading without stopping the machine.

[0014] Furthermore, the dispensing module includes a back adhesive application detection component, a back adhesive discharge and flipping component, a front adhesive application detection component, and a silver paste application component arranged in series along the workpiece conveying direction. The components are connected by a transmission track to achieve automated workpiece transfer.

[0015] The beneficial effects of this invention are as follows: First, this invention fundamentally eliminates the lateral squeezing force caused by the tilting of the stacked trays by configuring a telescopic support device with non-contact gap control function on the conveying mechanism. In traditional interference fit positioning structures, even a slight tilt can cause the positioning tip to generate huge positive pressure with the inner wall of the positioning groove, thus significantly increasing static friction and causing the tray to jam. This invention utilizes non-contact gap and adjustable telescopic stroke to ensure that the conveying support plate does not have any physical contact with the side wall of the tray during insertion, ensuring that the lifting force acts only in the vertical direction, greatly improving the operational stability of the buffer module and avoiding production line downtime caused by tray jamming.

[0016] Secondly, this invention employs a material feeding and adsorption structure combining adjustable magnetic suction cups and a metal magnetic guide plate, completely solving the problem of poor adaptability of fixed adsorption plates to product changes. The positions of electronic components on flexible plates are variable, and traditional equipment often requires custom-made, expensive adsorption plate molds for each product. This solution allows operators to manually or automatically rearrange the suction cup coordinates within minutes, achieving precise adsorption of flexible plates with arbitrary layouts. This significantly reduces changeover costs for enterprises and shortens the production cycle of new products.

[0017] Third, this invention achieves "zero-downtime unloading" in the production process by introducing a drawer-type defective product conveyor structure. In high-speed automated production lines, downtime for cleaning leads to significant capacity losses. This solution utilizes the decoupling effect of the pull-out track, allowing the cleaning of defective products to be spatially separated from the dispensing and curing operations of the main production line, and to be performed in parallel in time, significantly improving the overall equipment uptime (OEE).

[0018] Fourth, this invention integrates full-chain automation functions from material feeding via flipping, multi-stage dispensing, real-time detection, curing to finished product recycling and buffering. Through the linear combination of multiple modules for back adhesive, front adhesive, and silver adhesive, coupled with precise visual inspection feedback, it ensures the accuracy and consistency of adhesive application. Simultaneously, the recycling and tray-cutting logic of the buffer module achieves automatic closed-loop management of empty and full trays, greatly reducing the frequency of manual intervention and lowering the labor intensity on the production floor. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall layout structure of an automatic glue coating machine for flexible boards according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the overall structure of the buffer module of an automatic glue applicator for flexible boards according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the bottom structure of the buffer module of an automatic glue applicator for flexible boards according to an embodiment of the present invention; Figure 4 This is a structural schematic diagram of the first lifting mechanism / second lifting mechanism of the buffer module of an automatic glue applicator for flexible boards according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the transport mechanism of the buffer module of an automatic glue applicator for flexible boards according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the feeding and turning mechanism of an automatic glue coating machine for flexible boards according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the magnetically adjustable suction cup structure of the feeding and turning mechanism of an automatic glue coating machine for flexible boards according to an embodiment of the present invention. Figure 8This is a schematic diagram of a drawer-type defective product production line structure of an automatic glue coating machine for flexible boards according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the material tray structure of an automatic glue coating machine for flexible boards according to an embodiment of the present invention; Figure 10 This is a schematic diagram of the product flow and operation route of an automatic glue coating machine for flexible boards according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the material tray flow path of the buffer module of an automatic glue applicator for flexible boards according to an embodiment of the present invention; Figure label: 1. Feeding and turning mechanism; 2. Dispensing module; 3. Curing module; 4. Buffer module; 5. First tray assembly module; 6. Second tray assembly module; 7. First tray stacking chamber; 8. Second tray stacking chamber; 9. First lifting mechanism; 10. First support assembly; 11. Tray cutting mechanism; 12. Transport mechanism; 13. Synchronous belt mechanism; 14. Telescopic support device; 15. Transport support plate; 16. Detection sensor; 17. Lifting cylinder; 18. Lead screw assembly; 19. Receiving tray; 20. Fixed adsorption plate 21. Adjustable suction plate; 22. Metal magnetic guide plate; 23. Magnetic adjustable suction cup; 24. Suction cup body; 241. Air inlet pipe interface; 25. Magnetic block; 26. Cleaning air port; 27. Drawer-type defective product production line; 28. Adhesive backing application detection component; 29. ​​Adhesive backing material discharge flipping component; 30. Positive adhesive application detection component; 31. Silver adhesive application component; 32. Proximity sensor; 33. Second lifting mechanism; 34. Second support component; 351. Positioning tip; 352. Positioning groove. Detailed Implementation

[0020] Combination Figures 1 to 11 As shown in the figure, this embodiment provides an automatic flexible board coating machine, whose overall structural layout aims to solve the high-precision requirements and automation bottlenecks in the dispensing, curing, and buffering processes of flexible circuit boards. The equipment consists of four core parts: a feeding and flipping mechanism 1, several dispensing modules 2, a curing module 3, and a buffer module 4. The feeding and flipping mechanism 1 is located at the beginning of the machine. It is configured to pick up the flexible board to be processed through vacuum adsorption logic, flip it to a set process angle, and then place it into the dispensing module 2. The dispensing module 2 adopts a linear assembly line layout and integrates multiple sets of targeted adhesive application components to complete the multi-layer adhesive coating task on both sides of the flexible board. The curing module 3 is located downstream of the dispensing module 2 and uses ultraviolet light or heat radiation to quickly bring the adhesive to a preset hardness. Finally, the buffer module 4 receives the cured finished product and uses a unique double-stacked tray circulation structure to automatically switch between empty and full trays, ensuring continuous operation of the production line without stopping the machine.

[0021] Combination Figures 6 to 7As shown, in this embodiment, the feeding and turning mechanism 1 includes a turning component and an adsorption plate installed at its end. The adsorption plate includes a fixed adsorption plate 20 and an adjustable adsorption plate 21 connected to the front end of the fixed adsorption plate 20. The fixed adsorption plate 20 has several fixed adsorption holes opened in a standard matrix. These holes are connected to the vacuum pump station and configured to provide basic adsorption force for the standard-sized flexible plate. The adjustable adsorption plate 21 is composed of a highly flat metal magnetic guide plate 22. Several magnetically adjustable suction cups 23 are installed on the surface of the metal magnetic guide plate 22 through magnetic coupling. The magnetically adjustable suction cup 23 includes a suction cup body 24 made of aluminum alloy. A high-strength magnetic block 25 is embedded at the bottom of the suction cup body 24. The magnetic block 25 locks the suction cup body 24 at any coordinate position of the metal magnetic guide plate 22 through magnetic attraction. An air inlet pipe interface 241 is opened on the side of the suction cup body 24 for connecting to an external vacuum pipe. This magnetic design allows operators to flexibly move the suction cups on the metal magnetic guide plate 22 according to the actual layout of the electronic modules on the flexible board, avoiding protruding components or sensitive areas, thus enabling rapid adaptation to different models of flexible boards. Furthermore, a cleaning air port 26 is provided on the edge of the fixed suction plate 20. The cleaning air port 26 is connected to a high-pressure air source via a solenoid valve. During each flipping action, a high-pressure fan-shaped airflow is sprayed to remove residual impurities from the surface of the adjustable suction plate 21, ensuring suction accuracy. It is worth noting that the adjustable magnetic suction cup 23, which can move to any position, offers greater flexibility compared to existing structures that only allow linear adjustment. It can be adjusted at any coordinate position on the metal magnetic guide plate 22. Simultaneously, the lateral air intake interface eliminates the need for the vacuum tube to pass through the metal magnetic guide plate 22, resulting in a more compact structure, ease of use, and the ability to add or remove the required adjustable magnetic suction cups 23 as needed.

[0022] Combination Figure 1 As shown in this embodiment, in order to achieve complex multi-process adhesive application, the dispensing module 2 is equipped with a back adhesive application detection component 28, a back adhesive discharge and flipping component 29, a front adhesive application detection component 30, and a silver paste application component 31 arranged in series. The flexible board first completes the dispensing on its bottom surface at the back adhesive application detection component 28, and simultaneously performs visual verification of the adhesive width and continuity using an industrial camera. Subsequently, the back adhesive discharge and flipping component 29 uses a flipping mechanism to adsorb and perform a 180-degree flip, turning the flexible board so that its front side faces upwards. The front adhesive application detection component 30 then applies the main adhesive to the front side. Finally, the silver paste application component 31 applies conductive silver paste to specific solder joints or shielding areas. The components are connected via precision belt conveyors or guide rail slider mechanisms, and the entire line is synchronized via a PLC controller. It should be noted that each dispensing module 2 is equipped with a vision inspection system for position detection and dispensing result detection.

[0023] In this embodiment, the curing module 3 is equipped with a high-power UV lamp assembly. Considering yield control during production, a drawer-type defective product conveyor 27 is mounted on one side of the curing module 3 via a pull-out guide rail. When the vision inspection system determines that the current workpiece is an NG (not good) product, the handling robot can directly transport the workpiece to the drawer-type defective product conveyor 27. This conveyor uses an independent drive motor, and its support structure is configured to slide outwards along the pull-out guide rail. This allows operators to manually clean the drawer-type defective product conveyor 27 without stopping the main production line, and then push it back into its locking position, greatly improving the equipment's uptime.

[0024] Combination Figures 2 to 5 As shown, in this embodiment, the design of the cache module 4 focuses on solving the long-standing problem of tray jamming in the industry. The cache module 4 includes a first tray collection module 5 and a second tray collection module 6. The first tray collection module 5 has a first tray stacking chamber 7 for vertically stacking empty trays to be used; the second tray collection module 6 has a second tray stacking chamber 8 for stacking full trays of flexible boards conveyed from the curing module 3. A second lifting mechanism 33 and a second support component 34 are arranged below the second tray stacking chamber 8. The second support component 34 has the same structure and function as the first support component 10, and they are linked to lower the trays layer by layer. A first lifting mechanism 9 is arranged below the first tray stacking chamber 7. This mechanism is driven by a servo motor to lift the entire stack of trays upwards at a set step height. Pneumatic first support components 10 are arranged on both sides of the lifting platform. When the first lifting mechanism 9 lifts the trays to the predetermined height, the support claws of the first support components 10 extend inwards to support the bottom edge of the lowest tray.

[0025] In this embodiment, the conveying mechanism 12 spans above the first stacked tray chamber 7 and the second stacked tray chamber 8. The core of this mechanism consists of two symmetrically arranged synchronous belt mechanisms 13, and the sliders of the synchronous belt mechanisms 13 are equipped with telescopic support devices 14 that can be raised and lowered in the vertical direction.

[0026] One implementation of the telescopic support device 14 is to use a telescopic cylinder combined with a lifting guide rail. A transport support plate 15 is connected to the end of the telescopic cylinder. In another embodiment, a telescopic drive device with controllable stroke (e.g., a linear motor) can be used in conjunction with the lifting cylinder 17 for control. This embodiment uses a telescopic drive device with controllable stroke as an example, where the telescopic drive device is connected to the lifting cylinder 17.

[0027] Combination Figures 1 to 9As shown, in actual operation, due to the fit tolerance between the positioning tip 351 and the positioning groove 352 between the trays, when the trays are stacked too high, the top tray often tilts by several millimeters. To avoid lateral compression caused by traditional rigid insertion, this invention integrates a proximity sensor 32 on the transport support plate 15. The proximity sensor 32 monitors the relative distance between the front end of the transport support plate 15 and the side wall of the tray in real time. Based on the analog signal fed back by the proximity sensor 32, the PLC controller dynamically adjusts the stroke of the telescopic cylinder or adjusts the air pressure through the proportional valve, so that when the transport support plate 15 enters the support position under the tray, its side edge and the side of the tray always maintain a non-contact gap of 0.5mm to 1.5mm. This technical solution eliminates lateral positive pressure through physical space compensation, ensuring that the vertical upward lifting force will not be converted into frictional force that causes the positioning pin to jam. In addition, the telescopic support device 14 also integrates a photoelectric detection sensor 16, whose optical axis passes horizontally through the space below the transport support plate 15. If the lower tray rises due to adhesion while the uppermost tray is being moved, the light path of the detection sensor 16 will be blocked, and the system will immediately trigger an emergency brake, effectively preventing mechanical impact caused by the simultaneous handling of both trays.

[0028] In this embodiment, the cutting mechanism 11 is located at the bottom of the two stacked tray chambers. Its structure includes a laterally arranged lead screw assembly 18 and a receiving tray 19 mounted on the lead screw nut. The receiving tray 19 is configured to shuttle horizontally between the first stacked tray chamber 7 and the second stacked tray chamber 8. When the full tray at the bottom of the second stacked tray chamber 8 needs to be circulated, the second lifting mechanism 33 lowers the tray stack onto the receiving tray 19. Then, the cutting mechanism 11 drives the receiving tray 19 to transport the tray to directly below the first stacked tray chamber 7, where the first lifting mechanism 9 lifts it and re-embeds it into the first stacked tray chamber 7, realizing the closed-loop automatic circulation of the tray.

[0029] Combination Figure 10 and Figure 11 As shown, the complete operating principle and process of the flexible board automatic gluing machine provided by this invention in a practical application scenario are as follows: Step S1: Feeding and Flexible Adsorption Operation. The flexible board to be processed is conveyed from the previous process to the pick-up position of the feeding and flipping mechanism 1. According to the CAD layout of the current product, the operator pre-arranges the magnetically adjustable suction cups 23 on the metal magnetic guide plate 22. The flipping component drives the adsorption plate to descend, and the vacuum negative pressure generated by the magnetically adjustable suction cups 23 firmly picks up the flexible board. The adsorption plate then rises and rotates 180 degrees, placing the flexible board smoothly on the starting track of the dispensing module 2. During the process of the adsorption plate returning to the pick-up position, the cleaning air port 26 sprays high-pressure gas to blow away the electrostatic dust on the metal magnetic guide plate 22.

[0030] Step S2: Multi-stage dispensing and inspection. The flexible board enters the back adhesive application and inspection component 28. The dispensing head performs back adhesive dispensing according to the preset trajectory coordinates, and the vision system determines in real time whether the width of the adhesive strip is within the error range. After passing the inspection, the workpiece enters the back adhesive output and flipping component 29 to complete the flipping. Subsequently, the front adhesive application and inspection component 30 performs the coating of the front main adhesive, and the silver paste application component 31 completes the application of silver paste at specific circuit shielding points.

[0031] Step S3: Controlled Curing and Defective Product Separation. The flexographically coated sheet enters curing module 3, where it hardens under controlled UV irradiation at a constant temperature. If a product is marked as defective by the vision system during the dispensing stage, it is transferred to the drawer-type defective product conveyor line 27. Operators are configured to directly pull open the drawer-type support, remove the defective product for analysis without interfering with the main line operation, and then push the support back, ensuring production continuity.

[0032] Step S4: Precision Buffering and Non-Contact Handling Operation. Qualified finished flexible boards are fed into the loading position of the buffer module 4 and loaded into a tray. The first lifting mechanism 9 within the first tray assembly 5 lifts the entire stack of empty trays upwards by one tray height. The synchronous belt mechanism 13 of the handling mechanism 12 drives the telescopic support device 14 to move above the first tray chamber 7. The lifting cylinder drives the handling support plate 15 to descend to the support plane below the uppermost tray, and the telescopic drive device drives the handling support plate 15 to extend horizontally. At this time, the proximity sensor 32 senses the position of the tray sidewall and feeds back the distance signal to the PLC. The PLC precisely controls the telescopic stroke through a closed-loop control algorithm, allowing the handling support plate 15 to be precisely inserted into the bottom of the tray without contacting its sidewall. Subsequently, the handling mechanism 12 lifts the empty tray, separating the top tray from the bottom tray, and horizontally transports it above the second tray chamber 8, lowering it and stacking it on top of the existing trays in the second tray chamber 8.

[0033] Step S5: Bottom Tray Cycle Switching Operation. As production continues, full trays gradually accumulate in the second tray chamber 8. When the preset stacking quantity is reached, the tray cutting mechanism 11 is activated, and the receiving tray 19, driven by the lead screw assembly 18, moves to the bottom of the second tray chamber 8 to receive the bottom tray released by the second lifting mechanism 33. The receiving tray 19 then moves laterally to the bottom of the first tray chamber 7, where the first lifting mechanism 9 lifts it to the empty tray storage area, completing a full tray cycle. When a tray containing workpieces is lifted from the bottom of the first tray chamber 7 to the top, the workpieces can be removed from the tray by a handling robot, and an empty tray is formed again for transport to the second tray chamber 8. This process allows the cured and heated workpieces to cool down.

[0034] This invention achieves fully automated operation of the flexible board gluing process through the precise coordination of the aforementioned mechanisms. In particular, by introducing non-contact gap control logic, it completely eliminates the downtime risk caused by mechanical interference in automated production lines. The extension of the transport support plate 15 is configured with adjustable parameters, allowing the equipment to be configured to adapt to trays of different wall thicknesses and materials, greatly expanding the equipment's process applicability. Simultaneously, the composite adsorption plate structure, through the flexible combination of magnetic blocks 25 and metal magnetic guide plates 22, reduces the changeover time from several hours to several minutes, significantly lowering the changeover cost in small-batch, multi-variety production modes.

[0035] During the high-speed operation of the buffer module 4, the detection sensor 16 performs a logic self-check during each lifting action to ensure that there are no foreign objects or excess material stuck under the transport support plate 15. This multi-sensor redundancy design, combined with a precise mechanical feedback loop, constructs a highly stable and intelligent production closed loop. The decoupling design of the curing module 3 and the drawer-type defective product conveyor 27 further enhances the system's fault tolerance to abnormal operating conditions.

[0036] In summary, this invention not only innovates in mechanical structure but also solves several technical challenges in the field of automated adhesive coating for flexible circuit boards through sensor feedback and dynamic displacement compensation in control logic. It provides a highly efficient, versatile, and reliable automated solution for the precision packaging of flexible circuit boards through specific technologies such as magnetic positioning, non-contact gap handling, and drawer-type offline unloading. The tight connections between components and the seamless motion logic fully demonstrate the deep integration of advanced mechanical design and industrial automation control. Through this end-to-end automation optimization, the production efficiency of the automated adhesive coating machine for flexible circuit boards is more than twice that of traditional equipment, while significantly reducing maintenance costs and failure rates.

[0037] It should be understood that the above are merely preferred embodiments of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention.

[0038] The accompanying drawings used in the above embodiments only illustrate certain embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

Claims

1. An automatic glue applicator for flexible boards, characterized in that, include: The system includes a feeding and turning mechanism, a minimum-point adhesive module, a curing module, and a buffer module; among which, The feeding and flipping mechanism is configured to receive the flexible plate workpiece to be processed, and to transport it to the processing position of the dispensing module through flipping and translation logic. The curing module is located downstream of the dispensing module to cure the adhesive on the flexible board. The buffer module is equipped with a cyclically switchable tray to receive the flexible board conveyed by the curing module; it includes a first tray module and a second tray module, wherein: The first tray module includes a first tray stacking chamber for stacking empty trays, and a first lifting mechanism and a first support assembly are provided below the first tray stacking chamber; The second tray module includes a second tray stacking chamber for stacking full trays, and a second lifting mechanism and a second support assembly are provided below the second tray stacking chamber; A cutting mechanism is connected below the first stacked tray chamber and the second stacked tray chamber. The cutting mechanism is configured to transport the full material tray at the bottom of the second stacked tray chamber to the bottom of the first stacked tray chamber, and lift it into the first stacked tray chamber under the drive of the first lifting mechanism and the first support assembly. A cross-shaped transport mechanism is connected above the first and second stacked tray chambers. The transport mechanism includes synchronous belt mechanisms extending on opposite sides of the upper ends of the first and second stacked tray chambers. Each of the two synchronous belt mechanisms is equipped with a liftable telescopic support device. The telescopic support device is configured to lift the trays at the top of the first stacked tray chamber to a predetermined height and transport them to the top of the second stacked tray chamber for stacking. The end actuators of the two telescopic support devices can controllably maintain a non-contact gap with the side of the transported trays to avoid tilting allowance after the trays are stacked.

2. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The telescopic support device is equipped with a detection sensor, which is configured to monitor whether there is a follow-up material tray below the telescopic support device.

3. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The telescopic support device uses a telescopic cylinder, and the extended end of the telescopic cylinder is connected to a transport support plate. The extension stroke of the transport support plate is adjustable to accommodate different tilt extension amounts after the material trays are stacked.

4. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The telescopic support device includes a telescopic drive device and a transport support plate connected to the movable end of the telescopic drive device. A proximity sensor is provided on the transport support plate. The proximity sensor is configured to detect the physical distance between the edge of the transport support plate and the side wall of the tray in real time, so that the transport support plate and the side of the tray are maintained within a set safe gap range.

5. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The telescopic support device is connected to a lifting cylinder.

6. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The cutting mechanism includes a lead screw assembly connected below the first stacked disc chamber and the second stacked disc chamber. A receiving disc is connected to the lead screw assembly via a nut seat. The receiving disc reciprocates linearly between the first stacked disc chamber and the second stacked disc chamber under the rotational drive of the lead screw.

7. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The feeding and turning mechanism includes a turning component and an adsorption plate of the turning component. The adsorption plate includes a fixed adsorption plate and an adjustable adsorption plate. The fixed adsorption plate is provided with a plurality of fixed adsorption holes. The adjustable adsorption plate includes a metal magnetic plate parallel to the adjustable adsorption plate. The metal magnetic plate is provided with a plurality of magnetically adjustable suction cups to adjust the adsorption position at any coordinate position on the metal magnetic plate to adapt to different flexible plates.

8. The automatic adhesive applicator for flexible boards according to claim 7, characterized in that, The magnetic adjustable suction cup includes a suction cup body and a magnetic block connected to the end of the suction cup body. The magnetic block is used to adhere to the metal magnetic plate. An air inlet pipe is provided on the side of the suction cup body for connecting to a vacuum tube.

9. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The UV curing component is connected to a drawer-type defective product production line, which is suspended on one side of the UV curing component via a pull-out rail, so that the drawer-type defective product production line can be pulled out from the production line for unloading without stopping the machine.

10. The automatic adhesive applicator for flexible boards according to claim 1, characterized in that, The dispensing module includes a back adhesive application detection component, a back adhesive discharge and flipping component, a front adhesive application detection component, and a silver paste application component arranged in series along the workpiece conveying direction. The components are connected by a transmission track to achieve automated workpiece transfer.

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