A crystal phase control device integrating grinding and polishing and structured light detection and a control method thereof

Abstract

This invention discloses a crystal phase control device and its control method integrating grinding, polishing, and structured light detection, belonging to the field of high-precision component processing and inspection technology. The device integrates grinding and polishing components, monitoring components, detection components, operation components, drying components, and storage components. Each unit is fixed to a preset workstation on a base, resulting in a compact and stable layout. The grinding and polishing components achieve automatic grinding and polishing, sandpaper replacement, and debris cleaning; the monitoring components monitor and control start and stop in real time; the detection components perform surface shape detection through multi-angle structured light imaging; the operation components automatically complete workpiece loading, unloading, transfer, and detection positioning; the drying components quickly dry the workpiece; and the storage components classify and store finished products and parts to be processed. This invention achieves integrated operation of the entire process of grinding, polishing, cleaning, drying, structured light detection, and storage, significantly reducing transfer links, significantly improving processing and inspection efficiency and accuracy, and exhibiting strong stability and practicality. It is suitable for high-precision integrated processing and inspection of high-reflectivity surface components.

Description

Technical Field

[0001] This invention relates to the field of high-precision component processing and inspection technology, and in particular to a crystal phase control device and control method that integrates grinding, polishing and structured light inspection. Background Technology

[0002] High-reflectivity surface component control devices are core equipment in fields such as crystal material processing, semiconductor wafer fabrication, and precision ceramic part processing. Currently, similar equipment in the industry generally adopts a separate design for functions such as grinding and polishing, inspection, drying, and storage. The coordination between each process largely relies on manual operation, with only a few devices achieving simple automation of a single process. Controllable processing accuracy, real-time inspection feedback, efficient workflow, and strong equipment adaptability are the core goals currently pursued in the field of high-reflectivity surface component processing.

[0003] However, the traditional split-type operation mode has many technical drawbacks: First, each process equipment operates independently, and the workpiece needs to be manually transferred and clamped multiple times, which can easily cause workpiece positioning deviations, directly affecting the flatness and processing accuracy of high-reflectivity surface components, making it difficult to meet the process requirements for high-precision, high-reflectivity surface component control; Second, the grinding and polishing process lacks real-time visual monitoring and dynamic parameter adjustment mechanisms, and the grinding and polishing effect can only be judged by post-processing inspection, which can easily lead to problems such as over-grinding and uneven polishing, resulting in a high rate of workpiece defects and increased processing costs; Third, the split-type equipment occupies space and is scattered in layout, which not only significantly occupies the production area, but also makes the operation process cumbersome and the connection efficiency low, making it difficult to improve the overall production efficiency; Fourth, there are many manual intervention links, which not only increases labor costs, but also makes it easy for human operation errors to affect the consistency of processing and inspection, making it difficult to achieve standardized operation.

[0004] Based on the above-mentioned technical problems, those skilled in the art urgently need to develop a crystal phase control device and its control method that integrates grinding, polishing, inspection, drying and other functional modules to achieve full-process operation control of high reflectivity surface components and greatly improve the overall efficiency of processing and inspection. Summary of the Invention

[0005] The purpose of this invention is to provide a crystal phase control device that integrates grinding, polishing, and structured light inspection. This device integrates grinding, polishing, inspection, and drying functions into a single unit, enabling full-process control of high-reflectivity surface components and significantly improving the overall efficiency of processing and inspection.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] This invention provides a crystal phase control device integrating grinding, polishing, and structured light detection, the control device comprising:

[0008] A base, fixed to the ground, having multiple mounting positions for installing grinding and polishing components to fix the grinding and polishing parts and to perform grinding and polishing; and...

[0009] A monitoring component is used to monitor the polishing process and can control the start and stop of the polishing component;

[0010] The detection component can capture images of the grinding and polishing process from multiple angles;

[0011] Operating components are used to pick up and photograph the polished parts for inspection;

[0012] The drying assembly is used to dry the polished parts after grinding and polishing.

[0013] The control device also includes:

[0014] A storage assembly placed on the upper surface of the base is used to store workpieces before and after grinding and polishing;

[0015] The controller is connected to the polishing component, monitoring component, detection component, operation component, and drying component, respectively, and is used for data transmission and control command transmission.

[0016] Furthermore, the base includes a bottom support plate; and,

[0017] Four support legs are connected to the four corners of the bottom support plate;

[0018] A top support plate is arranged at the upper end of the four support legs, and the top support plate is respectively provided with a first fixing bracket hole, a second fixing bracket hole, a third fixing bracket hole, a fourth fixing bracket hole, and a fifth fixing bracket hole; wherein,

[0019] The first mounting hole is used to fix the polishing assembly;

[0020] The second mounting hole is used to secure the monitoring component;

[0021] The third mounting hole is used to fix the detection component;

[0022] The fourth mounting hole is used to fix the operating component;

[0023] The fifth mounting hole is used to fix the drying assembly.

[0024] Furthermore, the polishing assembly includes a rotating base for the sandpaper disc; and,

[0025] A sandpaper disc is mounted on the rotating base of the sandpaper disc and is capable of rotating around the rotating base of the sandpaper disc.

[0026] A sandpaper changer is mounted on a sandpaper changing shaft to rotate and pick up different sizes of sandpaper. The sandpaper changing shaft is mounted on the base. The sandpaper changer is equipped with vacuum suction ports that are evenly distributed on the sandpaper changer and use suction to hold the sandpaper in place.

[0027] The lower polisher includes a lower polisher rotating shaft, a supporting hydraulic cylinder, and a water-blocking baffle. The lower polisher rotating shaft, the supporting hydraulic cylinder, and the supporting hydraulic cylinder are located inside the water-blocking baffle. The lower polisher rotating shaft and the supporting hydraulic cylinder are connected to the controller. The lower polisher rotating shaft can drive the sandpaper fixing disc to rotate. The supporting hydraulic cylinder can support the sandpaper fixing disc during sandpaper replacement. The water-blocking baffle is used to block wastewater during the polishing process from the lower polisher rotating shaft and the supporting hydraulic cylinder.

[0028] A sandpaper fixing disc is connected to the rotating shaft of the lower polisher. The rotating shaft of the lower polisher drives the sandpaper fixing disc to rotate. The supporting hydraulic cylinder is connected to the bottom of the sandpaper fixing disc and can support the sandpaper fixing disc.

[0029] The sandpaper fixing vacuum suction port is located on the sandpaper fixing plate and is connected to a vacuum pump, which can fix the sandpaper on the sandpaper fixing plate by vacuum extraction.

[0030] The clean water spray pipe is located next to the sandpaper fixing plate and is connected to the clean water tank via a water pump. It is used to clean up the sandpaper debris during the sanding and polishing process.

[0031] The polishing fluid spray nozzle is located next to the sandpaper fixing plate and is connected to the polishing fluid tank via a water pump. It is used for pre-processing of the polishing parts before polishing.

[0032] The upper polishing disc is driven to rotate by the upper polishing rotating shaft, and can rotate the required polishing parts in the opposite direction to the sandpaper fixing disc. The upper polishing disc is provided with polishing through holes.

[0033] The upper polisher drive motor is used to drive the rotation of the upper polisher's rotating shaft during the polishing process, thereby rotating the upper polisher's grinding disc and realizing the polishing process. The upper polisher drive motor is connected to the controller.

[0034] A polishing and grinding fixture is used to fix the drive motor of the upper polishing and grinding device, and the lower end of the polishing and grinding fixture is fixed to the base.

[0035] A polishing part fixing cylinder is provided at the polishing through hole on the upper polishing disc and is used to fix the polishing part in the horizontal direction during the polishing process.

[0036] A hydraulic cylinder for fixing grinding and polishing parts is used to fix the grinding and polishing parts vertically during the grinding and polishing process;

[0037] A hydraulic cylinder fixing plate is connected to the housing of the upper grinding and polishing machine drive motor at the top and to the hydraulic cylinder for fixing the grinding and polishing parts at the bottom, which is used to fix the hydraulic cylinder for fixing the grinding and polishing parts during the grinding and polishing process.

[0038] The grinding and polishing waste liquid drain outlet is located at the lower part of the outer wall of the lower grinding and polishing device. It is used to discharge the grinding and polishing waste liquid during the grinding and polishing process. Its outer end can be connected to a water pipe to the final sewer outlet.

[0039] Furthermore, the monitoring component includes a monitoring robot base for fixing the monitoring robot, the monitoring robot base being fixed to the base;

[0040] Monitor the gripper for handling unexpected gripping operations;

[0041] A monitoring camera is used to monitor the entire grinding and polishing process. The monitoring camera is fixed to the monitoring robot gripper.

[0042] The first and second rotating axes of the monitoring robot are used to control the rotation of the robot.

[0043] The monitoring robot has a first support shaft and a second support shaft for controlling the swing of the robot; wherein the monitoring robot gripper is connected to the first rotating shaft of the monitoring robot, the first rotating shaft of the monitoring robot, the first support shaft of the monitoring robot, the second rotating shaft of the monitoring robot, and the second support shaft of the monitoring robot are connected in sequence, and the lower part of the second support shaft of the monitoring robot is connected to the base of the monitoring robot.

[0044] Control buttons, which are connected to the controller, are used to control the start and stop of the entire grinding and polishing process. The control buttons include an emergency stop button, a run button, and a reset button.

[0045] The main rotating axis of the monitoring robot is connected between the monitoring robot base and the second support axis of the monitoring robot, and is used to control the rotation of the entire robot.

[0046] Furthermore, the detection component includes a lamp panel robot base for fixing the lamp panel robot, the lamp panel robot base being fixed to the base;

[0047] The first, second, and third rotating axes of the lamp panel robot are used to control the rotation of the lamp panel robot.

[0048] The first support shaft and the second support shaft of the light panel robot are used to control the swing of the robot. The base of the light panel robot, the first rotating shaft of the light panel robot, the first supporting shaft of the light panel robot, the second rotating shaft of the light panel robot, the second supporting shaft of the light panel robot, and the third rotating shaft of the light panel robot are connected in sequence.

[0049] The magnetic suction head of the lamp panel robot is mounted on the third rotating axis of the lamp panel robot.

[0050] The light panel is magnetically fixed to the magnetic head of the light panel robot arm, and the light panel is configured as a light source that can project light onto the polished part.

[0051] A detection camera is used to photograph the polishing process;

[0052] A camera mounting bracket is used to fix the camera in place.

[0053] A camera fixing axis is used to connect the detection camera mounting bracket, and the detection camera mounting bracket is movable on the camera fixing axis;

[0054] The camera bracket base secures the camera mounting axis to the base, thus fixing the entire camera assembly.

[0055] The test result display screen, fixed on the test camera mounting bracket, can display photographic images to evaluate the polishing results;

[0056] The main rotating shaft of the light panel robot is connected between the base of the light panel robot and the first rotating shaft of the light panel robot; it is used to control the rotation of the entire robot.

[0057] Furthermore, the storage component includes a storage box and a storage box classification divider disposed therein;

[0058] The storage box uses a classification divider to categorize workpieces that have been polished and those that have not.

[0059] Furthermore, the operating component includes an operating hand base fixed to the base for securing the entire robotic arm; and,

[0060] The robotic arm gripper is used to pick up and photograph the workpieces during the entire grinding and polishing process.

[0061] The first and second rotating axes of the manipulator are used to rotate the manipulator.

[0062] The first support shaft and the second support shaft of the manipulator are used to realize the swing of the manipulator; wherein, the manipulator gripper, the first rotating shaft of the manipulator, the first support shaft of the manipulator, the second rotating shaft of the manipulator, and the second support shaft of the manipulator are connected in sequence;

[0063] The main rotating axis of the operating robot is connected between the operating robot base and the second support axis of the operating robot, and is used to control the rotation of the entire robot.

[0064] Furthermore, the drying assembly includes a dryer base for securing the entire dryer; and,

[0065] Dryer motor and dryer fan, wherein the dryer motor is used to drive the dryer fan to rotate;

[0066] A dryer fan bracket is used to fix the dryer fan.

[0067] The present invention provides a crystal phase control method integrating grinding, polishing, and structured light detection, which is implemented based on the above-mentioned control device. The control method includes the following steps:

[0068] Step 1: In the operating assembly, the operating robot gripper is moved by the operating robot base, the first rotating shaft of the operating robot, the first supporting shaft of the operating robot, the second rotating shaft of the operating robot, and the second supporting shaft of the operating robot. The operating robot gripper moves to the storage assembly and grips the polished parts. Then, the first rotating shaft of the operating robot, the first supporting shaft of the operating robot, the second rotating shaft of the operating robot, and the second supporting shaft of the operating robot manipulate the operating robot gripper to move to the polishing liquid spray pipe of the polishing assembly. The spray pipe is turned on to pre-treat the polished parts. Afterward, the robot is moved to the upper polisher of the polishing assembly, the gripper is released, and the polished parts fall into the polished parts fixing cylinder.

[0069] Step 2: The sandpaper is fixed in the vacuum suction port to fix the sandpaper of the lower polisher of the polishing assembly; the drive motor of the upper polisher of the polishing assembly is turned on, and the built-in hydraulic cylinder begins to extend and retract to press the polishing parts. Then the drive motor of the polisher and the lower polisher start, and the upper polisher and the lower polisher rotate in opposite directions to achieve full polishing of the polishing parts.

[0070] Step 3: Start the water spray nozzle. The water spray nozzle sprays out clean water to clean up the grinding and polishing debris.

[0071] Step 4: After polishing is completed, the polishing drive motor, lower polisher, sandpaper fixing vacuum suction port and clean water spray pipe of the polishing assembly are closed. The first rotating shaft, first supporting shaft, second rotating shaft and second supporting shaft of the operating robot in the operating assembly are used to move the operating robot gripper above the polished part. The operating robot gripper picks up the polished part and moves it to the front of the drying assembly. The dryer motor is started to dry the polished part.

[0072] Step 5: After drying is completed, the dryer motor is turned off. The first rotating axis, first supporting axis, second rotating axis, and second supporting axis of the operating robot are used to move the operating robot gripper to the front of the detection component. According to the position of the operating robot gripper, the position of the detection camera is fixed by the camera bracket base. The first rotating axis, first supporting axis, second rotating axis, second supporting axis, and third rotating axis of the lamp board robot are used to operate the magnetic suction head of the lamp board robot to adjust the relative position of the lamp board and the polished part so that the final image can be captured by the detection camera and the final image result is projected onto the detection result display screen.

[0073] Step Six: After the inspection is completed, operate the first rotating axis, the first supporting axis, the second rotating axis, and the second supporting axis of the robot to move the robot gripper above the storage assembly, release the robot gripper, and let the polished and inspected workpiece fall into the storage box.

[0074] In the above technical solution, the crystal phase control device and control method integrating grinding, polishing and structured light detection provided by the present invention have the following beneficial effects:

[0075] This invention discloses a crystal phase control device and its control method that integrates grinding, polishing, and structured light inspection. The device boasts high integration, combining grinding, polishing, and morphology inspection functions into a single design. This enables full-process control of high-reflectivity surface components, significantly improving processing and inspection efficiency. Each component is modularly installed in corresponding mounting holes on the base, resulting in a rational and stable structure that ensures precise execution of grinding, polishing, inspection, and drying processes. Equipped with multiple robotic arms and monitoring / detection elements, it achieves visualized monitoring and automated operation of the process, enhancing the control accuracy of high-reflectivity surface components. The coordinated operation of all functional components allows for integrated processing of grinding, polishing, cleaning, inspection, drying, and storage, reducing workpiece transfer steps, minimizing operational errors, and improving the overall stability and practicality of the equipment. Attached Figure Description

[0076] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0077] Figure 1 A three-dimensional structural schematic diagram of a crystal phase control device integrating grinding, polishing, and structured light detection provided in an embodiment of the present invention;

[0078] Figure 2A schematic diagram of the base structure in a crystal phase control device integrating grinding, polishing, and structured light detection provided in an embodiment of the present invention;

[0079] Figure 3 A schematic diagram of the grinding and polishing component structure in a crystal phase control device integrating grinding, polishing, and structured light detection provided in an embodiment of the present invention;

[0080] Figure 4 This is a schematic diagram of the internal structure of the lower polisher in a crystal phase control device that integrates polishing and structured light detection, provided in an embodiment of the present invention.

[0081] Figure 5 A schematic diagram of the monitoring component structure in a crystal phase control device integrating grinding, polishing, and structured light detection provided in an embodiment of the present invention;

[0082] Figure 6 This is a schematic diagram of the detection component structure in a crystal phase control device that integrates grinding, polishing, and structured light detection, as provided in an embodiment of the present invention.

[0083] Figure 7 A schematic diagram of the housing component structure in a crystal phase control device integrating grinding, polishing, and structured light detection provided in an embodiment of the present invention;

[0084] Figure 8 This is a schematic diagram of the operating components in a crystal phase control device that integrates grinding, polishing, and structured light detection, as provided in an embodiment of the present invention.

[0085] Figure 9 This is a schematic diagram of the drying component in a crystal phase control device that integrates grinding, polishing, and structured light detection, as provided in an embodiment of the present invention.

[0086] Explanation of reference numerals in the attached figures:

[0087] 1. Base; 2. Polishing assembly; 3. Monitoring assembly; 4. Detection assembly; 5. Storage assembly; 6. Operation assembly; 7. Drying assembly;

[0088] 101. Bottom support plate; 102. Support leg; 103. Top support plate; 104. First fixing bracket hole; 105. Second fixing bracket hole; 106. Third fixing bracket hole; 107. Fourth fixing bracket hole; 108. Fifth fixing bracket hole;

[0089] 201. Sandpaper disc; 202. Sandpaper disc rotating base; 203. Sandpaper changer; 204. Sandpaper changing shaft; 205. Lower polisher; 206. Sandpaper fixing disc; 207. Sandpaper fixing vacuum suction port; 208. Clean water spray pipe; 209. Polishing liquid spray pipe; 210. Upper polisher disc; 211. Upper polisher drive motor; 212. Polishing fixing frame; 213. Polishing part fixing cylinder; 214. Polishing part fixing hydraulic cylinder; 215. Upper polisher rotating shaft; 216. Hydraulic cylinder fixing disc; 217. Polishing waste liquid drain outlet; 218. Water-blocking baffle; 219. Supporting hydraulic cylinder; 220. Lower polisher rotating shaft;

[0090] 301. Monitoring robot base; 302. Monitoring robot gripper; 303. Monitoring camera; 304. First rotating axis of the monitoring robot; 305. First support axis of the monitoring robot; 306. Second rotating axis of the monitoring robot; 307. Second support axis of the monitoring robot; 308. Emergency stop button; 309. Start button; 310. Reset button; 311. Main rotating axis of the monitoring robot;

[0091] 401. Base of the light panel robot; 402. First rotating axis of the light panel robot; 403. First supporting axis of the light panel robot; 404. Second rotating axis of the light panel robot; 405. Second supporting axis of the light panel robot; 406. Third rotating axis of the light panel robot; 407. Magnetic suction head of the light panel robot; 408. Light panel; 409. Detection camera; 410. Detection camera mounting bracket; 411. Camera mounting axis; 412. Camera bracket base; 413. Detection result display screen; 414. Main rotating axis of the light panel robot;

[0092] 501. Storage box; 502. Storage box categorization divider;

[0093] 601. Operating robot base; 602. Operating robot gripper; 603. Operating robot first rotation axis; 604. Operating robot first support axis; 605. Operating robot second rotation axis; 606. Operating robot second support axis; 607. Operating robot main body rotation axis;

[0094] 701. Dryer base; 702. Dryer motor; 703. Dryer fan frame; 704. Dryer fan. Detailed Implementation

[0095] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0096] See Figures 1-9 As shown;

[0097] This invention provides a crystal phase control device integrating grinding, polishing, and structured light detection, the control device comprising:

[0098] A base 1, fixed to the ground, has multiple mounting positions for mounting grinding and polishing components 2, used to fix the grinding and polishing parts and to perform grinding and polishing; and,

[0099] Monitoring component 3 is used to monitor the polishing process and can control the start and stop of the polishing component 2;

[0100] Detection component 4 is capable of capturing images of the grinding and polishing process from multiple angles;

[0101] Operation component 6 is used to pick up and photograph the polished parts for inspection;

[0102] Drying component 7 is used to dry the polished parts after polishing.

[0103] The control device also includes:

[0104] The storage assembly 5, placed on the upper surface of the base, is used to store the workpiece before and after grinding and polishing.

[0105] The controller is connected to the polishing component 2, the monitoring component 3, the detection component 4, the operation component 6, and the drying component 7, respectively, and is used for data transmission and control command transmission.

[0106] For further details of this embodiment, please refer to [link / reference]. Figure 2 As shown, the base 1 includes a bottom support plate 101, four support legs 102, and a top support plate 103. The first fixing hole 104 is used to fix the polishing assembly 2, allowing the sandpaper changing shaft 204 to only rotate, and to fix the polishing fixing frame 212, ensuring stable polishing. The second fixing hole 105 is used to fix the monitoring assembly 3 and the monitoring robot base 301. The third fixing hole 106 is used to fix the light panel robot base 401, the camera bracket base 412, and the detection result display screen 413 in the detection assembly 4. The fourth fixing hole 107 is used to fix the operating robot base 601. The fifth fixing hole 108 is used to fix the dryer base 701.

[0107] For further details of this embodiment, please refer to [link / reference]. Figure 3As shown, the polishing assembly 2 includes a sandpaper disc 201, a sandpaper disc rotating base 202, a sandpaper changer 203, a sandpaper changing shaft 204, a lower polisher 205, a sandpaper fixing plate 206, a sandpaper fixing vacuum suction port 207, a clean water spray pipe 208, a polishing liquid spray pipe 209, an upper polisher disc 210, an upper polisher drive motor 211, a polishing fixing frame 212, a polishing component fixing cylinder 213, a polishing component fixing hydraulic cylinder 214, an upper polisher rotating shaft 215, a hydraulic cylinder fixing plate 216, a polishing waste liquid drain outlet 217, a water-blocking baffle 218, a supporting hydraulic cylinder 219, and a lower polisher rotating shaft 220. The sandpaper disc 201 is fixed on the sandpaper disc rotating base 202 and can rotate around the sandpaper disc rotating base 202, facilitating the sandpaper changer 203 to pick up different types of sandpaper. The sandpaper changing shaft 204 is fixed on the base 1, allowing the sandpaper changer 203 to rotate around the shaft for sandpaper removal and replacement. The sandpaper changer 203 has vacuum suction ports evenly distributed on it, which hold the sandpaper in place. The lower polisher 205 includes a lower polisher rotating shaft 220, a supporting hydraulic cylinder 219, and a water baffle 218. The lower polisher rotating shaft 220 drives the sandpaper fixing plate 206 to rotate, and the supporting hydraulic cylinder 219 lifts the sandpaper fixing plate 206 during sandpaper replacement. The sandpaper fixing vacuum suction port 207 fixes the sandpaper to the sandpaper fixing plate 206 using a vacuum extraction method. The clean water spray pipe 208 is used to clean polishing debris during the polishing process. The polishing liquid spray pipe 209 is used for pre-processing the polished parts before polishing. The upper polisher disc 210 is driven to rotate by the upper polisher rotating shaft 215, responsible for rotating the required polishing parts in the opposite direction to the sandpaper fixing disc 206 to improve polishing efficiency. The upper polisher drive motor 211 drives the upper polisher disc 210 to rotate during the polishing process. The polishing fixing frame 212 is used to fix the entire polishing machine. The polishing part fixing cylinder 213 is used to fix the polishing parts horizontally during the polishing process to improve polishing efficiency. The polishing part fixing hydraulic cylinder 214 is used to fix the polishing parts vertically during the polishing process to improve polishing efficiency. The hydraulic cylinder fixing disc 216 is used to fix the polishing part fixing hydraulic cylinder 214 during the polishing process to ensure the stability of the polishing process and improve polishing efficiency. The polishing waste liquid drain outlet 217 is used to discharge polishing waste liquid during the polishing process; its outer end can be connected to a water pipe to the final sewer outlet. The lower grinding and polishing device 205 includes a lower grinding and polishing device rotating shaft 220, a supporting hydraulic cylinder 219, and a water-blocking baffle 218. The lower grinding and polishing device rotating shaft 220 and the supporting hydraulic cylinder are connected to the controller. The water-blocking baffle 218 forms an annular retaining ring inside the lower grinding and polishing device 205. The lower grinding and polishing device rotating shaft 220 and the supporting hydraulic cylinder 219 are located inside the water-blocking baffle 218.The lower polisher rotating shaft 220 is responsible for driving the sandpaper fixing plate 206 to rotate. The support hydraulic cylinder 219 is responsible for supporting the sandpaper fixing plate 206 during the sandpaper replacement process to facilitate the replacement of sandpaper. The water baffle 218 is used to block the wastewater during the polishing process from the lower polisher rotating shaft 220 and the support hydraulic cylinder to prevent mechanical failure.

[0108] For further details of this embodiment, please refer to... Figure 4 As shown, the monitoring component 3 includes a monitoring robot base 301, a monitoring robot gripper 302, a monitoring camera 303, a first rotating axis 304, a first supporting axis 305, a second rotating axis 306, a second supporting axis 307, an emergency stop button 308, a start button 309, a reset button 310, and a main rotating axis 311 for the monitoring robot body. The monitoring robot base 301 is used to fix the monitoring robot. The monitoring robot gripper 302 is used to handle unexpected situations. The monitoring camera 303 is used to inspect the entire polishing process. The first and second rotating axes 304 and 306 control the rotation of the robot, while the first and second supporting axes 305 and 307 control the swing of the robot. The emergency stop button 308, start button 309, and reset button 310 control the start and stop of the entire polishing process. The main rotating axis 311 controls the rotation of the entire robot.

[0109] For further details of this embodiment, please refer to... Figure 5As shown, the detection module 4 includes a light panel robot base 401, a first rotating axis 402, a first supporting axis 403, a second rotating axis 404, a second supporting axis 405, a third rotating axis 406, a magnetic head 407, a light panel 408, a detection camera 409, a detection camera mounting bracket 410, a camera fixing axis 411, a camera bracket base 412, a detection result display screen 413, and a light panel robot body rotating axis 414. The light panel robot base 401 is used to fix the light panel robot. The first rotating axis 402, the second rotating axis 404, and the third rotating axis 406 are used to control the rotation of the light panel robot. The first supporting axis 403 and the second supporting axis 405 are used to control the swing of the robot. The light panel 408 serves as a light source, projecting light onto the polished part for observation of the polishing process. The inspection camera 409 is used to capture the polishing process. The inspection camera mount 410 is used to secure the inspection camera 409. The camera mounting axis 411 is used to control the movement of the inspection camera mount 410. The camera bracket base 412 is used to secure this camera assembly, ensuring image stability. The inspection result display screen 413 displays the photographic results on the screen, facilitating the evaluation of the polishing results. The main body rotation axis 414 of the light panel robot is used to control the rotation of the entire robot.

[0110] For further details of this embodiment, please refer to... Figure 6 As shown, the storage component 5 includes a storage box 501 and a storage box sorting divider 502. The storage box 501 is used to hold workpieces that have been polished and those that have not yet been polished. The storage box sorting divider 502 is used to sort the workpieces that have been polished and those that have not yet been polished.

[0111] For further details of this embodiment, please refer to... Figure 7 As shown, the operating component 6 includes a robot arm base 601, a robot arm gripper 602, a first rotating axis 603, a first supporting axis 604, a second rotating axis 605, a second supporting axis 606, and a main rotating axis 607. The robot arm base 601 is used to fix the entire robot arm. The robot arm gripper 602 is used to pick up and photograph the workpiece during the polishing process. The first and second rotating axes 603 and 605 are used to rotate the robot arm. The first and second supporting axes 604 and 606 are used to swing the robot arm. The main rotating axis 607 controls the rotation of the entire robot arm.

[0112] For further details of this embodiment, please refer to... Figure 8As shown, the drying assembly 7 includes a dryer base 701, a dryer motor 702, a dryer fan bracket 703, and a dryer fan 704. The dryer base 701 is used to fix the entire dryer. The dryer motor 702 is used to drive the dryer fan 704 to rotate, thereby achieving the drying effect on the polished parts. The dryer fan bracket 703 is used to fix the dryer fan 704.

[0113] The working process of this invention is as follows:

[0114] Normal working process: The operating robot in the operating component 6 is fixed by the operating robot base 601. The movement of the entire robot is achieved by the first rotating shaft 603, the first supporting shaft 604, the second rotating shaft 605, and the second supporting shaft 606 of the operating robot. First, the robot is moved to the storage component 5, and the operating robot gripper 602 is used to grip the polished parts. Then, the operating robot is moved to the polishing liquid spray nozzle 209 by the first rotating shaft 603, the first supporting shaft 604, the second rotating shaft 605, and the second supporting shaft 606 of the operating robot. The spray nozzle is turned on to pre-treat the polished parts. After that, the robot is moved to the upper polishing disc 210, the gripper is released, and the polished parts fall into the upper polishing disc.

[0115] When the upper polisher drive motor 211 is turned on, the built-in hydraulic cylinder begins its extension and retraction process, clamping the polishing parts. Subsequently, the polisher drive motor 211 and the lower polisher 205 start, with the upper and lower polishers rotating in opposite directions to achieve thorough polishing of the parts. Simultaneously, the sandpaper fixing vacuum suction port 207 and the water spray pipe 208 are activated, spraying water to clean up polishing debris. The sandpaper fixing vacuum suction port 207 also secures the sandpaper in the lower polisher.

[0116] After polishing is completed, the polishing drive motor 211, the lower polishing device 205, the sandpaper fixing vacuum suction port 207, and the water spray pipe 208 are closed. The operating robot in the operating component 6 is moved above the polished part by the first rotating shaft 603, the first supporting shaft 604, the second rotating shaft 605, and the second supporting shaft 606 of the operating robot. The operating robot clamp 602 clamps the polished part. After clamping, it is moved to the front of the drying component 7, and the dryer motor 702 is started to dry the polished part.

[0117] After drying is complete, the dryer motor 702 is turned off. The first rotating axis 603, the first supporting axis 604, the second rotating axis 605, and the second supporting axis 606 of the operating robot are used to move the robot to the front of the detection module 4. The light panel robot base 401 secures the light panel robot. The detection camera mounting bracket 410, camera mounting axis 411, and camera bracket base 412 secure the detection camera 409 to its position. The operation of the first rotating axis 603, the first supporting axis 604, and the second supporting axis 606 of the operating robot... The second rotating axis 605, the second support axis 606 of the operating robot, and the first rotating axis 402, first support axis 403, second rotating axis 404, second support axis 405, and third rotating axis 406 of the lamp board robot are used to operate the lamp board robot and adjust the relative position of the lamp board 408 and the polished part so that the final image can be captured by the detection camera 409 and projected onto the detection result display screen 413, so that the monitoring component 3 can observe whether the result meets the requirements.

[0118] After the inspection is completed, the first rotating axis 603, the first supporting axis 604, the second rotating axis 605, and the second supporting axis 606 of the robot arm are operated to move the robot arm above the storage assembly 5, and the gripper 602 of the robot arm is released, so that the workpiece that has been polished and inspected falls into the storage box.

[0119] Sandpaper replacement process: The upper polisher drive motor 211 starts, raising the upper polisher disc 210 to a certain height to facilitate the replacement of the bottom sandpaper. The internal hydraulic cylinder of the lower polisher 205 starts, lifting the sandpaper fixing disc 206, while the sandpaper fixing vacuum suction port 207 stops working, preparing for sandpaper replacement; the sandpaper replacement shaft 204 starts, rotating the sandpaper changer 203 above the sandpaper fixing disc 206, activating the sandpaper fixing vacuum suction port of the sandpaper changer 203 to pick up the sandpaper to be replaced from the sandpaper fixing disc 206, then the sandpaper replacement shaft 204 starts, rotating the sandpaper changer 203 to the replacement position that matches the sandpaper changer 203, the sandpaper disc rotating base 202 starts rotating, causing the sandpaper disc 201 holding the waste sandpaper to rotate to the replacement position that matches the sandpaper changer 203, and the sandpaper fixing vacuum suction port of the sandpaper changer 203 closes, completing the replacement process. Waste sandpaper falls into the sandpaper tray 201, which holds the waste sandpaper. Then, the sandpaper tray rotating base 202 starts to rotate, causing the sandpaper tray 201 to rotate to the replacement position that matches the sandpaper changer 203. Then, the sandpaper changing shaft 204 starts, activating the sandpaper fixing vacuum suction port of the sandpaper changer 203 to pick up the required sandpaper. Subsequently, the sandpaper changing shaft 204 starts, rotating the sandpaper changer 203 above the sandpaper fixing tray 206. The sandpaper fixing vacuum suction port of the sandpaper changer 203 closes, and the sandpaper falls onto the sandpaper fixing tray 206. The sandpaper fixing vacuum suction port 207 starts, adsorbing the replaced sandpaper. Finally, the sandpaper changing shaft 204 starts, rotating the sandpaper changer 203 back to the initial position.

[0120] The working process of monitoring component 3: The monitoring robot is fixed by the base 301. The first rotating axis 304, the first support axis 305, the second rotating axis 306, and the second support axis 307 of the monitoring robot control the horizontal and vertical movement and rotation of the monitoring robot. By monitoring the movement of the robot during the polishing process and the sandpaper replacement process, and in conjunction with the monitoring camera 303 attached to the monitoring robot, the entire process can be monitored. If a problem is detected in the working process, the first rotating axis 304 and the first support axis 305 of the monitoring robot will activate. The second rotating axis 306 of the robotic arm and the second support axis 307 of the monitoring robotic arm control the monitoring robotic arm to move above the emergency stop button 308. The monitoring robotic arm gripper 302 then presses the emergency stop button 308, terminating the work process. Then, the first rotating axis 304, the first support axis 305, the second rotating axis 306, and the second support axis 307 of the monitoring robotic arm control the monitoring robotic arm to complete the repair of the malfunction. After the repair is completed, the monitoring robotic arm is moved above the start button 309, and the monitoring robotic arm gripper 302 presses the start button 309 to resume work. After the entire work process is completed, the first rotating axis 304, the first support axis 305, the second rotating axis 306, and the second support axis 307 of the monitoring robotic arm control the monitoring robotic arm to reset.

[0121] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A crystal phase control device integrating grinding, polishing, and structured light detection, characterized in that, The control device includes: A base (1), fixed to the ground, having multiple fixing positions on which polishing components (2) are respectively installed for fixing polishing parts and performing polishing; and, The monitoring component (3) is used to monitor the polishing process and can control the start and stop of the polishing component (2); The detection component (4) is capable of capturing images of the polishing process from multiple angles; Operating component (6) is used to pick up and photograph the polished parts for inspection; The drying component (7) is used to dry the polished parts after grinding and polishing. The control device also includes: The storage assembly (5) placed on the upper surface of the base (1) is used to store the workpiece before and after grinding and polishing; The controller is connected to the polishing component (2), the monitoring component (3), the detection component (4), the operation component (6), and the drying component (7) respectively, and is used for data transmission and control command transmission.

2. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The base (1) includes a bottom support plate (101); and, Four support legs (102) are connected to the four corners of the bottom support plate (101). A top support plate (103) is arranged on the upper end of the four support legs (102), and the top support plate (103) is provided with a first fixing bracket hole (104), a second fixing bracket hole (105), a third fixing bracket hole (106), a fourth fixing bracket hole (107), and a fifth fixing bracket hole (108); wherein, The first fixing hole (104) is used to fix the polishing assembly (2); The second mounting hole (105) is used to fix the monitoring component (3); The third mounting hole (106) is used to fix the detection component (4); The fourth mounting hole (107) is used to fix the operating component (6). The fifth mounting hole (108) is used to fix the drying assembly (7).

3. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The polishing assembly (2) includes a sandpaper disc rotating base (202); and, A sandpaper disc (201) is disposed on the sandpaper disc rotating base (202) and is capable of rotating around the sandpaper disc rotating base (202); A sandpaper changer (203) is mounted on a sandpaper changer shaft (204) to achieve rotation, and is capable of picking up different sizes of sandpaper, and the sandpaper changer shaft (204) is mounted on the base (1); The lower polisher (205) includes a lower polisher rotating shaft (220), a supporting hydraulic cylinder (219), and a water-blocking baffle (218). The lower polisher rotating shaft (220) and the supporting hydraulic cylinder (219) are located inside the water-blocking baffle (218). The lower polisher rotating shaft (220) and the supporting hydraulic cylinder (219) are connected to the controller. The lower polisher rotating shaft (220) can drive the sandpaper fixing plate (206) to rotate. The supporting hydraulic cylinder (219) can support the sandpaper fixing plate (206) during the sandpaper replacement process. The water-blocking baffle (218) is used to block the wastewater in the polishing process outside the lower polisher rotating shaft (220) and the supporting hydraulic cylinder (219). The sandpaper fixing disc (206) is connected to the lower polisher rotating shaft (220) of the lower polisher (205). The lower polisher rotating shaft (220) drives the sandpaper fixing disc (206) to rotate. The supporting hydraulic cylinder (219) is connected to the bottom of the sandpaper fixing disc (206) and can support the sandpaper fixing disc (206). The sandpaper fixing vacuum suction port (207) is located on the sandpaper fixing plate (206) and is connected to a vacuum pump. It can fix the sandpaper on the sandpaper fixing plate (206) by vacuum extraction. A clean water spray pipe (208) is set next to the sandpaper fixing plate (206) and connected to a clean water tank via a water pump. It is used to clean up sanding debris during the sanding process. The polishing liquid spray pipe (209) is located next to the sandpaper fixing plate (206) and is connected to the polishing liquid tank via a water pump. It is used for pre-processing of the polishing parts before polishing. The upper polisher grinding disc (210) is driven to rotate by the upper polisher rotating shaft (215), and can rotate the required polishing parts in the opposite direction to the sandpaper fixing disc (206). The upper polisher grinding disc (210) is provided with polishing through holes. The upper polisher drive motor (211) is used to drive the rotation of the upper polisher rotating shaft (215) during the polishing process to realize the rotation of the upper polisher grinding disc (210) and realize the polishing process. The upper polisher drive motor (211) is connected to the controller. The grinding and polishing fixing frame (212) is used to fix the upper grinding and polishing drive motor (211), and the lower end of the grinding and polishing fixing frame (212) is fixed to the base (1). A polishing part fixing cylinder (213) is provided at the polishing through hole on the polishing disc (210) of the upper polisher, and is used to fix the polishing part in the horizontal direction during the polishing process; A hydraulic cylinder (214) for fixing the polishing parts vertically during the polishing process; The hydraulic cylinder fixing plate (216) is connected to the housing of the upper grinding and polishing drive motor (211) at the top and to the fixed grinding and polishing part hydraulic cylinder (214) at the bottom, which is used to fix the fixed grinding and polishing part hydraulic cylinder (214) during the grinding and polishing process; The grinding and polishing waste liquid drain outlet (217) is located on the lower part of the outer wall of the lower grinding and polishing device (205) and is used to discharge the grinding and polishing waste liquid during the grinding and polishing process. Its outer end can be connected to a water pipe to the final sewer outlet.

4. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The monitoring component (3) includes a monitoring robot base (301) for fixing the monitoring robot, and the monitoring robot base (301) is fixed to the base (1). A monitoring robotic gripper (302) is used to handle gripping operations in case of emergencies; A monitoring camera (303) is used to monitor the entire polishing process. The monitoring camera (303) is fixed on the monitoring robot gripper (302). The first rotating axis (304) and the second rotating axis (306) of the robot arm are monitored for controlling the rotation of the robot arm; The monitoring robot has a first support shaft (305) and a second support shaft (307) for controlling the swing of the robot. The monitoring robot gripper (302) is connected to the monitoring robot's first rotating shaft (304). The monitoring robot's first rotating shaft (304), the monitoring robot's first support shaft (305), the monitoring robot's second rotating shaft (306), and the monitoring robot's second support shaft (307) are connected in sequence. The lower part of the monitoring robot's second support shaft (307) is connected to the monitoring robot's base (301). Control buttons, which are connected to the controller, are used to control the start and stop of the entire polishing process. The control buttons include an emergency stop button (308), a run button (309), and a reset button (310). The main rotating shaft (311) of the monitoring robot is connected between the monitoring robot base (301) and the second support shaft (307) of the monitoring robot, and is used to control the rotation of the entire robot.

5. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The detection component (4) includes a lamp panel robot base (401) for fixing the lamp panel robot, and the lamp panel robot base (401) is fixed to the base (1). The first rotating axis (402), the second rotating axis (404), and the third rotating axis (406) of the lamp panel robot are used to control the rotation of the lamp panel robot. The first support shaft (403) and the second support shaft (405) of the lamp panel robot are used to control the swing of the robot. The lamp panel robot base (401), the first rotating shaft (402), the first support shaft (403), the second rotating shaft (404), the second support shaft (405), and the third rotating shaft (406) of the lamp panel robot are connected in sequence. The magnetic suction head (407) of the lamp panel robot is mounted on the third rotating axis (406) of the lamp panel robot; The lamp panel (408) is magnetically fixed to the magnetic head (407) of the lamp panel robot arm, and the lamp panel (408) is configured as a light source that can project light onto the polished part; A detection camera (409) is used to photograph the polishing process; A camera mounting bracket (410) is used to fix the camera (409). A camera fixing axis (411) is used to connect the detection camera mounting bracket (410), and the detection camera mounting bracket (410) is movable on the camera fixing axis (411); The camera bracket base (412) fixes the camera fixing shaft (411) to the base (1) and is used to fix the entire camera assembly; The test result display screen (413) is fixed on the test camera mounting bracket (410) and can display photographic images to evaluate the polishing results; The main rotating shaft (414) of the light panel robot is connected between the base (401) of the light panel robot and the first rotating shaft (402) of the light panel robot; it is used to control the rotation of the entire robot.

6. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The storage component (5) includes a storage box (501) and a storage box classification divider (502) disposed therein; The storage box classification partition (502) is used to classify and process workpieces that have been polished and those that have not.

7. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The operating component (6) includes an operating hand base (601) fixed to the base (1) for fixing the entire robotic arm; and, The robotic arm gripper (602) is used to pick up and photograph the polished parts during the entire polishing process. The first rotating axis (603) and the second rotating axis (605) of the manipulator are used to realize the rotation of the manipulator; The first support shaft (604) and the second support shaft (606) of the manipulator are used to realize the swing of the manipulator; wherein, the manipulator gripper (602), the first rotating shaft (603), the first support shaft (604), the second rotating shaft (605), and the second support shaft (606) of the manipulator are connected in sequence; The main rotating shaft (607) of the operating robot is connected between the operating robot base (601) and the second support shaft (606) of the operating robot, and is used to control the rotation of the entire robot.

8. The crystal phase control device integrating grinding, polishing, and structured light detection according to claim 1, characterized in that, The drying assembly (7) includes a dryer base (701) for securing the entire dryer; and, Dryer motor (702) and dryer fan (704), wherein the dryer motor (702) is used to drive the dryer fan (704) to rotate; Dryer fan bracket (703) is used to fix the dryer fan (704).

9. A method for controlling crystal phase integrating grinding, polishing, and structured light detection, implemented based on the control device described in any one of claims 1 to 8, characterized in that, The control method includes the following steps: Step 1: In the operating component (6), the operating robot base (601), the first rotating shaft (603), the first supporting shaft (604), the second rotating shaft (605), and the second supporting shaft (606) of the operating robot move the operating robot gripper (602) to the storage component (5). The operating robot gripper (602) then grips the polished part, and subsequently the operating robot... The first rotating shaft (603), the first supporting shaft (604), the second rotating shaft (605), and the second supporting shaft (606) of the manipulator manipulate the manipulator gripper (602) to move to the polishing liquid spray pipe (209) of the polishing assembly (2), open the spray pipe, pre-treat the polished parts, and then manipulate the manipulator to move to the upper polisher (210) of the polishing assembly (2), release the gripper, and let the polished parts fall into the polished parts fixing cylinder (213); Step 2: The sandpaper is fixed in the vacuum suction port (207) to fix the sandpaper in the lower polisher (205) of the polishing assembly (2); the upper polisher drive motor (211) of the polishing assembly (2) is turned on, and the built-in hydraulic cylinder begins to extend and retract, pressing the polishing parts. Then the polisher drive motor (211) and the lower polisher (205) are started, and the upper polisher (210) and the lower polisher (205) rotate in opposite directions, thereby achieving full polishing of the polishing parts. Step 3: Start the water spray pipe (208), and spray water from the water spray pipe (208) to clean the grinding and polishing debris; Step 4: After the polishing is completed, the polishing drive motor (211), lower polisher (205), sandpaper fixing vacuum suction port (207) and water spray pipe (208) of the polishing assembly (2) are closed. The operating assembly (6) is operated by the first rotating shaft (603), the first supporting shaft (604), the second rotating shaft (605), and the second supporting shaft (606) of the operating manipulator to move the operating manipulator gripper (602) above the polished part. The operating manipulator gripper (602) clamps the polished part and moves it to the front of the drying assembly (7). The dryer motor (702) is started to dry the polished part. Step 5: After drying is completed, the dryer motor (702) is turned off. The first rotating axis (603), the first supporting axis (604), the second rotating axis (605), and the second supporting axis (606) of the operating robot manipulate the operating robot gripper (602) to move to the front of the detection component (4). According to the position of the operating robot gripper (602), the position of the detection camera (409) is fixed by the camera bracket base (412). The first rotating axis (402), the first supporting axis (403), the second rotating axis (404), the second supporting axis (405), and the third rotating axis (406) of the lamp board robot manipulate the lamp board robot magnetic head (407) to adjust the relative position of the lamp board (408) and the polished part so that the final image can be captured by the detection camera (409) and the final image result is projected onto the detection result display screen (413). Step 6: After the inspection is completed, the first rotating axis (603), the first supporting axis (604), the second rotating axis (605), and the second supporting axis (606) of the operating robot manipulate the operating robot gripper (602) to move above the storage assembly (5), release the operating robot gripper (602), and let the workpiece that has been polished and inspected fall into the storage box (501).

Images