A high-thermal-conductivity tooth-shaped structure heat plate and a heat dissipation device

Abstract

This application discloses a high thermal conductivity toothed vapor chamber and heat dissipation device, relating to an energy-saving heat exchanger. The vapor chamber includes an upper cover plate, a lower cover plate, and a flow guiding component; the upper and lower cover plates are joined to form a vacuum cavity; a heat dissipation working fluid is disposed within the vacuum cavity; the flow guiding component is disposed within the vacuum cavity to guide the liquid working fluid within the vacuum cavity to a preset position. The high thermal conductivity toothed vapor chamber proposed in this application, by incorporating a flow guiding component within the vapor chamber, can guide the condensed liquid working fluid to a preset position, thereby enhancing the heat dissipation capacity of the preset position and achieving uniform heat dissipation.

Description

Technical Field

[0001] This application relates to a high thermal conductivity toothed structure heat exchanger and heat dissipation device, which is applicable to the technical field of heat exchange. Background Technology

[0002] Vapor chambers are energy-saving heat exchange devices widely used in the computer industry for heat exchange. In existing vapor chambers, the heat dissipation medium inside absorbs heat and evaporates, then directly contacts the upper cover plate and condenses into liquid. This liquid drips directly onto the lower cover plate. Because the liquid is still very hot at this point, it fails to cool effectively, resulting in insufficient heat absorption during re-evaporation. This reduces heat transfer efficiency and also causes disordered flow of the heat dissipation medium.

[0003] Meanwhile, in existing heat spreaders, the condensed liquid easily flows from the upper cover to the lower cover, then permeates into the central heating area of ​​the lower cover, where it absorbs heat and evaporates again. In this cyclical heat dissipation process, the liquid evaporates at the edge of the central heating area, resulting in very little liquid reaching the central area and thus low heat dissipation efficiency and uneven overall heat dissipation. Summary of the Invention

[0004] The purpose of this application is to design a high thermal conductivity toothed structure heat exchanger and heat dissipation device, aiming to solve the problem of uniform heat dissipation of existing heat exchangers.

[0005] This application relates to a high thermal conductivity toothed structure heat exchanger, the heat exchanger includes an upper cover plate, a lower cover plate and a flow guiding component; the upper cover plate and the lower cover plate are joined to form a vacuum cavity; a heat dissipation working fluid is provided in the vacuum cavity; the flow guiding component is disposed in the vacuum cavity to guide the liquid working fluid in the vacuum cavity to a preset position.

[0006] In some embodiments, the flow guiding assembly includes a flow guiding plate and a flow guiding pipe; the flow guiding plate is sandwiched between an upper cover plate and a lower cover plate, and the flow guiding plate has a plurality of through holes, with a flow guiding element between the through holes and the upper cover plate; the flow guiding plate is inclined from its central position to the surrounding areas; the flow guiding pipe is disposed between the flow guiding plate and the lower cover plate, with one end of the flow guiding pipe connected to the periphery of the flow guiding plate and the other end of the flow guiding pipe extending to the central area of ​​the lower cover plate.

[0007] In some embodiments, the guide plate has an opening around its perimeter, and one end of the drainage tube has a liquid inlet hole, through which the drainage tube is connected to the opening.

[0008] In some embodiments, a plurality of support columns are provided between the upper cover plate and the lower cover plate; one end of the support column is disposed on the lower cover plate; the other end of the support column passes through the through hole and is disposed on the upper cover plate; and a flow guide is disposed on the support column.

[0009] In some embodiments, the flow guide includes a first flow guide ring and a second flow guide ring, which are respectively sleeved and fixed on the support column, and are connected by a connecting frame; a gap is provided between the first flow guide ring and the second flow guide ring; a gap is also provided between the flow guide plate and the second flow guide ring.

[0010] In some embodiments, the outer diameter of the second guide ring is larger than the outer diameter of the through hole; a retaining ring is provided in the circumferential direction of the through hole.

[0011] In some embodiments, a capillary mesh is also provided inside the vacuum chamber, and the capillary mesh is fitted together with the lower cover plate.

[0012] This application also proposes a heat dissipation device, including a heat spreader plate, wherein the heat spreader plate is the aforementioned high thermal conductivity toothed structure heat spreader plate.

[0013] In some embodiments, the heat dissipation device further includes a heat sink with a cooling pipe assembly; the upper cover of the heat spreader is joined to the cooling pipe assembly; and the lower cover of the heat spreader is joined to the heat-generating element.

[0014] In some embodiments, the heat dissipation device further includes a heat dissipation housing with a fan mounted on it; a heat dissipation component is disposed on the heat dissipation housing.

[0015] The high thermal conductivity toothed structure heat sink and heat dissipation device proposed in this application have the following technical advantages: (1) The high thermal conductivity toothed structure heat exchange plate proposed in this application has a flow guiding component in the heat exchange plate so as to guide the condensed liquid working fluid to a preset position, thereby improving the heat dissipation capacity of the preset position and achieving uniform heat dissipation. (2) The high thermal conductivity toothed structure heat exchanger proposed in this application has a flow guiding component in the heat exchanger, so that the condensed liquid working fluid can undergo secondary cooling, avoiding the pure water that has just condensed from dripping directly back to the lower cover plate and reducing the heat dissipation effect. (3) The heat dissipation device proposed in this application, by designing cooling pipe assembly, heat dissipation component and heat dissipation plate to cooperate with each other to dissipate heat, makes the overall heat dissipation capacity of the heat dissipation device stronger and can effectively improve the heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a heat dissipation device according to this application. Figure 1 .

[0017] Figure 2 This is a schematic diagram of a heat dissipation device according to this application. Figure 2 .

[0018] Figure 3 This is an exploded view of a heat dissipation device according to this application.

[0019] Figure 4 This is a partially exploded view of a heat dissipation device according to this application. Figure 1 .

[0020] Figure 5 This is a partially exploded view of a heat dissipation device according to this application. Figure 2 .

[0021] Figure 6 This is a partially exploded schematic diagram of a heat dissipation device according to this application.

[0022] Figure 7 This is a cross-sectional view of the heat exchanger.

[0023] Figure 8 This is a schematic diagram of the interior of the top cover of the heat exchanger.

[0024] Figure 9 This is a schematic diagram of the structure of the deflector plate.

[0025] Figure 10 This is a schematic diagram of the copper pipe, guide plate, baffle, and guide ring assembly in the application.

[0026] Figure 11 Is it an application? Figure 7 Enlarged schematic diagram of part A in the middle.

[0027] In the diagram: 1. Heat sink housing; 2. Fan; 3. Heat sink component; 31. First heat sink component; 32. Second heat sink component; 33. Third heat sink component; 4. Cooling pipe assembly; 5. Heat spreader; 501. Top cover plate; 502. Guide plate; 503. Opening; 504. Through hole; 505. Baffle ring; 506. Drain pipe; 507. Liquid inlet hole; 508. Bottom cover plate; 509. Capillary mesh; 510. Support column; 511. First guide ring; 512. Connecting frame; 513. Second guide ring. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined with each other.

[0029] like Figure 7-11As shown, this application proposes a high thermal conductivity toothed structure heat spreader 5, which includes a cover plate and a flow guiding component. The cover plate includes an upper cover plate 501 and a lower cover plate 508, both of which are metal covers. The upper cover plate 501 and the lower cover plate 508 are joined to form a vacuum cavity. A heat dissipation working fluid, i.e., a heat-conducting medium, is provided inside the vacuum cavity, which can be pure water. Specifically, the flow guiding component is disposed inside the vacuum cavity to guide the liquid working fluid inside the vacuum cavity to a preset position, thereby uniformly dissipating heat to various preset positions within the vacuum cavity. The upper cover plate 501 of the heat spreader 5 of this application can contact other heat dissipation components for heat dissipation, while the lower cover plate 508 of the heat spreader 5 can be joined with a heat-generating element to dissipate heat from the heat-generating element. In this application, the preset positions within the vacuum cavity can be either a central heat-generating area or a locally high-heat-generating area, and can be flexibly designed according to the heat dissipation location. The high thermal conductivity toothed vapor chamber proposed in this application has a toothed outer contour of its cover plate. This design facilitates increased contact area, enhances local heat dissipation, and improves heat conduction with other heat-generating components. It also accelerates liquid-gas conversion, reduces disordered losses, and addresses the issue of instantaneous high temperatures in heat-generating components. Furthermore, the high thermal conductivity toothed vapor chamber incorporates a flow guiding component within the vapor chamber. This component directs the condensed liquid working fluid to a predetermined location, thereby improving the heat dissipation capacity at that location and achieving uniform heat dissipation.

[0030] like Figure 7 , 9 As shown in Figures 10 and 11, in some embodiments, the flow guiding assembly includes a flow guiding plate 502 and a flow guiding pipe 506. The flow guiding plate 502 is sandwiched between the upper cover plate 501 and the lower cover plate 508, extending to the periphery of the vacuum cavity. The flow guiding plate 502 has a plurality of uniformly distributed through holes 504. After the lower cover plate 508 absorbs heat, the heat dissipation working fluid evaporates to form a gaseous working fluid. This gaseous working fluid can contact the upper cover plate 501 through the through holes 504, thereby forming condensate. A flow guiding element is provided between the through holes 504 and the upper cover plate 501, which can prevent the condensed liquid on the upper cover plate 501 from dripping from the through holes 504 onto the lower cover plate 508. Specifically, the flow guiding plate 502 is inclined from its central position outwards, which can effectively collect the condensate dripping onto the flow guiding plate 502 to its periphery. Preferably, as shown in Figure 1, the flow guiding plate 502 is inclined from its central position outwards, thus effectively collecting the condensate dripping onto the flow guiding plate 502 to its periphery. Figure 9As shown, the guide plate 502 consists of four inclined surfaces, allowing condensate to flow outwards. The guide plate 502 designed in this application allows condensate dripping onto it to undergo secondary cooling during its return flow, improving heat dissipation. The drainage tube 506 can be a capillary tube. Multiple drainage tubes 506 are disposed between the guide plate 502 and the lower cover plate 508, extending from the periphery of the vacuum chamber towards its central region. Specifically, one end of the drainage tube 506 is connected to the periphery of the guide plate 502, allowing liquid around the guide plate 502 to flow into the drainage tube 506; the other end of the drainage tube 506 extends to the central region of the lower cover plate 508, thereby allowing sufficient liquid to be drained into the central region, enhancing its heat dissipation capacity.

[0031] like Figure 7 , Figure 11 As shown, in some embodiments, the guide plate 502 is provided with an opening 503 around its periphery, and one end of the drainage pipe 506 is provided with a liquid inlet 507. The drainage pipe 506 is connected to the opening 503 through the liquid inlet 507, so that the liquid on the guide plate 502 can flow through the opening 503 to the liquid inlet 507, and then flow to the middle area.

[0032] like Figure 7 , 8 As shown in Figures 10 and 11, in some embodiments, a plurality of support columns 510 are provided between the upper cover plate 501 and the lower cover plate 508. These support columns 510 are preferably copper tubes or copper pillars. One end of each support column 510 is mounted on the lower cover plate 508 and also serves as a heat exchanger; the other end of each support column 510 passes through the through hole 504 and is mounted on the upper cover plate 501. A flow guide is provided on the support column 510.

[0033] like Figure 10 As shown, in some embodiments, the flow guide includes a first flow guide ring 511 and a second flow guide ring 513, wherein the first flow guide ring 511 and the second flow guide ring 513 are respectively sleeved and fixed on the support column 510, and the first flow guide ring 511 and the second flow guide ring 513 are connected by a connecting bracket 512. Specifically, a gap is provided between the first flow guide ring 511 and the second flow guide ring 513, and a gap is provided between the flow guide plate 502 and the second flow guide ring 513. The design of the above gaps can effectively improve the flowability of the heat dissipation working fluid after evaporation in the through hole 504, so that the gaseous working fluid can fully contact the upper cover plate 501, thereby improving the heat exchange efficiency.

[0034] like Figure 10As shown, in some embodiments, the outer diameter of the second guide ring 513 is larger than the outer diameter of the through hole 504. This design aims to prevent the liquid flowing in the second guide ring 513 from sliding onto the guide plate 502. Furthermore, a retaining ring 505 is provided circumferentially on the through hole 504. The retaining ring 505 can effectively prevent the liquid on the guide plate 502 from flowing out of the through hole 504, thereby unifying the flow around the guide plate 502.

[0035] like Figure 7 As shown, in some embodiments, a capillary mesh 509 is also provided inside the vacuum chamber. This capillary mesh 509 is fitted together with the lower cover plate 508, which can achieve sufficient heat exchange and improve heat dissipation efficiency. Specifically, some of the condensate around the guide plate 502 flows back along the inner walls of the upper cover plate 501 and the lower cover plate 508 to the periphery of the capillary mesh 509 on the lower cover plate 508 and permeates towards the center, so that the condensate can flow evenly throughout the entire capillary mesh 509, thereby making the heat dissipation effect more uniform.

[0036] like Figure 7 As shown, in some embodiments, the upper surface of the upper cover 501 is a planar structure, which facilitates contact and heat dissipation with other heat dissipation components. The lower cover 508 has a concave cavity structure, which is beneficial for storing heat dissipation fluid and also facilitates the installation of the capillary mesh 509.

[0037] The working principle of the high thermal conductivity toothed heat spreader proposed in this application is as follows: The GPU, the heat-generating component, is attached to the lower cover plate 508 of the heat spreader, forming a good heat-conducting surface. When the GPU operates, it generates heat. The lower cover plate 508 conducts this heat to the pure water inside the GPU, causing the water to absorb heat and evaporate. The evaporated water flows upward through the through-hole 504 and contacts the upper cover plate 501, forming condensate. Under gravity, the condensate flows along the first guide ring 511 and the second guide ring 513 to the guide plate 502, and then flows down around the perimeter of the guide plate 502. Part of the condensate passes through the opening 503 into the liquid inlet 507, and then flows along the drainage pipe 506 to the middle part of the capillary mesh 509. Another part of the condensate flows along the inner wall of the upper cover plate 501 to the lower cover plate 508. This part of the condensate first flows to the periphery of the capillary mesh 509 and then gradually penetrates towards the center, eventually flowing evenly across the entire capillary mesh 509. The condensate directly absorbs heat and cools down during its flow.

[0038] This application also proposes a heat dissipation device, including a heat spreader plate, wherein the heat spreader plate is the aforementioned high thermal conductivity toothed structure heat spreader plate.

[0039] like Figure 1-6As shown, in some embodiments, the heat dissipation device further includes a heat sink 3, on which a cooling pipe assembly 4 is provided. The cooling pipe assembly 4 contains a heat dissipation medium, which can exchange heat with the heat sink 3. The heat sink 3 includes a first heat sink 31, a second heat sink 32, and a third heat sink 33, which can be joined together for easy installation of the cooling pipe assembly 4. Preferably, the heat sink 3 has a finned structure to improve heat dissipation efficiency. The upper cover 501 of the heat spreader 5 is joined to the cooling pipe assembly 4 to achieve contact heat exchange. The lower cover 508 of the heat spreader 5 is joined to a heat-generating component, which can be various high-power components, specifically a GPU.

[0040] like Figure 1-6 As shown, in some embodiments, the heat dissipation device further includes a heat dissipation housing 1, on which a fan 2 is mounted; a heat dissipation component 3 is disposed on the heat dissipation housing 1; the fan 2 is capable of dissipating heat from the heat dissipation component 3. The heat dissipation component 3 is made of a heat dissipation material, specifically aluminum or copper.

[0041] Although the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit this application. Any person skilled in the art to which this application pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of patent protection of this application shall still be determined by the scope defined in the appended claims.

Claims

1. A high thermal conductivity toothed heat spreader, characterized in that, The heat spreader (5) includes an upper cover plate (501), a lower cover plate (508), and a flow guiding component; the upper cover plate (501) and the lower cover plate (508) are joined to form a vacuum cavity; a heat dissipation working fluid is provided in the vacuum cavity; the flow guiding component is disposed in the vacuum cavity to guide the liquid working fluid in the vacuum cavity to a preset position.

2. The high thermal conductivity toothed heat spreader according to claim 1, characterized in that, The flow guiding assembly includes a flow guiding plate (502) and a flow guiding pipe (506); the flow guiding plate (502) is sandwiched between the upper cover plate (501) and the lower cover plate (508), and the flow guiding plate (502) is provided with a plurality of through holes (504), and a flow guiding element is provided between the through holes (504) and the upper cover plate (501); the flow guiding plate (502) is inclined from its middle position to the surrounding area; the flow guiding pipe (506) is disposed between the flow guiding plate (502) and the lower cover plate (508), one end of the flow guiding pipe (506) is connected to the periphery of the flow guiding plate (502), and the other end of the flow guiding pipe (506) extends to the middle area of ​​the lower cover plate (508).

3. The high thermal conductivity toothed heat spreader according to claim 2, characterized in that, The guide plate (502) has an opening (503) around its periphery, and one end of the drainage pipe (506) has a liquid inlet hole (507). The drainage pipe (506) is connected to the opening (503) through the liquid inlet hole (507).

4. The high thermal conductivity toothed heat spreader according to claim 2, characterized in that, A plurality of support columns (510) are provided between the upper cover plate (501) and the lower cover plate (508); one end of the support column (510) is disposed on the lower cover plate (508); the other end of the support column (510) passes through the through hole (504) and is disposed on the upper cover plate (501); the flow guide is disposed on the support column (510).

5. The high thermal conductivity toothed heat spreader according to claim 4, characterized in that, The flow guide includes a first flow guide ring (511) and a second flow guide ring (513). The first flow guide ring (511) and the second flow guide ring (513) are respectively sleeved and fixed on the support column (510). The first flow guide ring (511) and the second flow guide ring (513) are connected by a connecting frame (512). There is a gap between the first flow guide ring (511) and the second flow guide ring (513). There is a gap between the flow guide plate (502) and the second flow guide ring (513).

6. The high thermal conductivity toothed heat spreader according to claim 5, characterized in that, The outer diameter of the second guide ring (513) is larger than the outer diameter of the through hole (504); the through hole (504) is provided with a retaining ring (505) in the circumferential direction.

7. The high thermal conductivity toothed heat spreader according to any one of claims 1 to 6, characterized in that, The vacuum chamber is also provided with a capillary mesh (509), which is attached to the lower cover plate (508).

8. A heat dissipation device, comprising a heat spreader; characterized in that, The heat spreader is the high thermal conductivity toothed structure heat spreader described in any one of claims 1 to 7.

9. The heat dissipation device according to claim 8, characterized in that, The heat dissipation device also includes a heat dissipation component (3), on which a cooling pipe assembly (4) is provided; the upper cover plate (501) of the heat spreader (5) is joined together with the cooling pipe assembly (4); the lower cover plate (508) of the heat spreader (5) is joined together with the heat-generating component.

10. The heat dissipation device according to claim 9, characterized in that, The heat dissipation device also includes a heat dissipation housing (1), on which a fan (2) is provided; the heat dissipation component (3) is disposed on the heat dissipation housing (1).

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