High-temperature-resistant power supply hybrid circuit module

Abstract

This invention belongs to the field of oil and gas exploration and development technology, specifically relating to a high-temperature resistant power supply hybrid circuit module. It includes a housing, a modularly assembled power supply encapsulated within the housing, and a first thermally conductive adhesive. The modularly assembled power supply includes a motherboard and multiple thick-film encapsulated power modules connected to the motherboard. Each thick-film encapsulated power module is encapsulated with a second thermally conductive adhesive. This invention's hybrid circuit module, on the one hand, is small in size and can provide power to logging instruments with various voltages; on the other hand, it has the advantage of rapid heat conduction, enabling effective heat dissipation at high temperatures of 175℃ to 200℃, ensuring reliable and stable power output, and has a long service life.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of oil and gas exploration and development, and particularly relates to a high-temperature-resistant power supply combined hybrid circuit module. BACKGROUND

[0002] Well logging instruments are mainly used to measure various physical parameters in wells thousands of meters to tens of thousands of meters underground. As the well depth increases, the temperature of the underground environment increases by about 30 DEG C per 1000 meters, so the circuit modules and components of the well logging instrument need to be high-temperature-resistant.

[0003] The circuit module includes a power supply for supplying power to the well logging instrument. The power supply needs to provide stable and reliable power to the well logging instrument. Therefore, the power supply needs to stably and reliably output sufficient power under high temperature conditions to ensure that the well logging instrument successfully completes the well logging operation.

[0004] Chinese Patent Application CN102427292A discloses a high-temperature power supply method, CN107769561A discloses a high-temperature power supply module circuit, and CN105811769A discloses a high-temperature power supply for oil logging. However, the above power supplies have the defect of low service life.

[0005] At the same time, due to the limited space underground, the well logging instrument needs to be small in size. At the same time, the well logging instrument has different power supply requirements. Therefore, in addition to being high-temperature-resistant, the power supply used underground also needs to be small in size and meet the different power supply requirements of the well logging instrument.

[0006] Therefore, the present application is proposed. SUMMARY

[0007] In order to solve the technical problems existing in the prior art, the present application provides a high-temperature-resistant power supply combined hybrid circuit module. The hybrid circuit module of the present application can provide multiple different voltage power supplies for the well logging instrument on the basis of being small in size. On the other hand, it has the advantage of fast heat conduction, can effectively dissipate heat at a high temperature of 175 DEG C to 200 DEG C, ensures the reliable and stable output of the hybrid circuit module power supply, and has the advantage of long service life.

[0008] The present application includes the following technical solutions:

[0009] The present application provides a high-temperature-resistant power supply hybrid circuit module, which comprises an outer shell, a modularized combined power supply and a first heat-conducting adhesive encapsulated in the outer shell. The modularized combined power supply comprises a mother board and a plurality of thick film encapsulated power supply modules, the plurality of thick film encapsulated power supply modules are connected to the mother board, and the thick film encapsulated power supply modules encapsulate a second heat-conducting adhesive.

[0010] Furthermore, the second thermally conductive adhesive is a thermally conductive adhesive with a coefficient of thermal expansion of 10 to 30 μm / m℃ and a thermal conductivity of 6 W / (m*K) to 18 W / (m*K).

[0011] Furthermore, the thick-film packaged power module includes a housing and a thick-film packaged circuit structure, the thick-film packaged circuit structure being disposed within the housing, and the housing being connected to the motherboard.

[0012] Furthermore, the thick-film packaged circuit structure includes a ceramic PCB board, a main control chip, a transformer, power devices, a rectifier chip, an energy storage capacitor, pins, an input differential-mode inductor, an auxiliary winding rectifier chip, and an output industrial-mode inductor. The main control chip, transformer, power devices, rectifier chip, energy storage capacitor, pins, input differential-mode inductor, auxiliary winding rectifier chip, and output industrial-mode inductor are all arranged on the ceramic PCB board, and the pins pass through the housing and connect to the motherboard.

[0013] Furthermore, a first insulating pad is provided on the inner surface of the housing.

[0014] Furthermore, the ceramic PCB board comprises overlapping multilayer ceramic boards, and the main control chip, transformer, power device, rectifier chip, energy storage capacitor, pins, input differential mode inductor, auxiliary winding rectifier chip, and output industrial mode inductor are respectively arranged on the upper and lower surfaces of the multilayer ceramic boards.

[0015] Furthermore, a second insulating pad is provided on the inner surface of the outer casing.

[0016] Furthermore, in the height direction of the housing, the motherboard and the thick-film packaged power module are respectively connected to the upper second insulating pad and the lower second insulating pad.

[0017] Furthermore, a common-mode filter inductor is provided on the motherboard.

[0018] Furthermore, the mother plate is a ceramic plate.

[0019] By adopting the above technical solution, the present invention has the following advantages:

[0020] 1. The hybrid circuit module of the present invention, on the one hand, is small in size and can provide power supplies with a variety of different voltages for logging instruments; on the other hand, it has the advantage of fast heat conduction, which can meet the requirements of the hybrid circuit module to effectively dissipate heat at high temperatures of 175℃~200℃, ensuring reliable and stable power output of the hybrid circuit module and having the advantage of long service life.

[0021] 2. This invention rationally utilizes thermally conductive adhesive (including the first thermally conductive adhesive and the second thermally conductive adhesive) to compensate for heat dissipation in the thick-film packaged power module, thereby achieving the integration of the thick-film packaged power module. This not only meets the requirement of stable and reliable output of multiple power supplies, but also enables the design of a higher-temperature logging switching power supply.

[0022] 3. The power supply hybrid circuit module of the present invention not only has the advantage of miniaturization, but also can realize modular customization, and can realize arbitrary combination of outputs of various thick film packaged power modules, with the advantages of modularization, integration and universality.

[0023] 4. The power supply of the present invention is realized through a thick-film packaged power supply module, which makes the resulting high-temperature power supply hybrid circuit module small in size and can be used in small-diameter logging instruments, especially suitable for logging instruments with an outer diameter of 20mm-100mm.

[0024] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention can be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a high-temperature resistant power supply hybrid circuit module in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the modular power supply structure in an embodiment of the present invention;

[0028] Figure 3 This is a top view of the modularly combined power supply in an embodiment of the present invention;

[0029] Figure 4 This is a bottom view of the modularly combined power supply in an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of the thick-film packaged power module in an embodiment of the present invention;

[0031] Figure 6 This is a top view of the thick-film packaged circuit structure in an embodiment of the present invention;

[0032] In the diagram, 10 is the outer casing, 20 is the modular power supply, 21 is the motherboard, 22 is the thick-film packaged power module, 221 is the casing, 222 is the thick-film packaged circuit structure, 2221 is the PCB board, 2222 is the main control chip, 2223 is the transformer, 2224 is the power device, 2225 is the rectifier chip, 2226 is the energy storage capacitor, 2227 is the pin, 2228 is the input differential mode inductor, 2229 is the auxiliary winding rectifier chip, 2230 is the output common mode inductor, 30 is the first thermal conductive adhesive, 40 is the second thermal conductive adhesive, 50 is the first insulating pad, 60 is the second insulating pad, and 70 is the common mode filter inductor. Detailed Implementation

[0033] The following description provides many different embodiments or examples for implementing various features of the invention. The elements and arrangements described in the specific examples below are only for concise expression of the invention and are merely examples, not intended to limit the invention.

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] This embodiment provides a high-temperature resistant power supply hybrid circuit module, such as... Figure 1 As shown, it includes a housing 10 and a modular assembly of a power supply 20 and a first thermally conductive adhesive 30 encapsulated within the housing 10; as Figure 2 , Figure 3 As shown, the modular power supply 20 includes a motherboard 21 and multiple thick-film packaged power modules 22. The multiple thick-film packaged power modules 22 are connected to the motherboard 21, and the thick-film packaged power modules 22 are encapsulated with a second thermally conductive adhesive 40.

[0036] It should be noted that, for those skilled in the art, thick-film packaging is a packaging method in this field. Due to the special characteristics of thick-film packaging, the thick-film packaged power module 22 can be guaranteed to have the advantage of miniaturization. However, if multiple power structures are packaged into a single thick-film packaged power module 22, this is not only detrimental to heat dissipation, resulting in a short service life, but also makes it difficult to switch and select between various power modes (different voltages).

[0037] This invention, by incorporating multiple thick-film packaged power modules 22, not only achieves a compact size but also meets the diverse voltage requirements of logging instruments. Furthermore, the combined action of the first thermally conductive adhesive 30 and the second thermally conductive adhesive 40 rapidly dissipates heat from the multiple thick-film packaged power modules 22, effectively cooling even when the thick-film packaged modules reach high temperatures of 175℃ to 200℃. This ensures reliable and stable power output from the hybrid circuit module and offers the advantage of a long service life.

[0038] The multiple thick-film packaged power modules 22 not only have the advantages of modularity, easy replacement and selection, but also have the advantage of rapid heat dissipation due to the gaps between the modules. At the same time, the heat dissipation effect is further improved by the combination of the first thermal conductive adhesive 30 and the second thermal conductive adhesive 40.

[0039] It should be noted that the first thermally conductive adhesive 30 and the second thermally conductive adhesive 40 are for heat conduction and dissipation, and their heat dissipation effect is better than that of radiation heat dissipation.

[0040] In some embodiments, the second thermally conductive adhesive 40 is a thermally conductive adhesive with a coefficient of thermal expansion of 10 to 30 μm / m℃ and a thermal conductivity of 6 W / (m*K) to 18 W / (m*K). This not only protects the mechanical properties of the thick-film packaged power module 22, but also quickly transfers heat to the housing 221 of the thick-film packaged power module 22, preventing the thick-film packaged power module 22 from overheating and burning out, which could lead to abnormal operation of the component.

[0041] In some embodiments, such as Figure 5 As shown, the thick-film packaged power module 22 includes a housing 221 and a thick-film packaged circuit structure 222. The thick-film packaged circuit structure 222 is disposed inside the housing 221, and the housing 221 is connected to the motherboard 21.

[0042] In some embodiments, such as Figure 5 , Figure 6 As shown, the thick-film packaged circuit structure 222 includes a ceramic PCB board 2221, a main control chip 2222, a transformer 2223, a power device 2224, a rectifier chip 2225, an energy storage capacitor 2226, pins 2227, an input differential mode inductor 2228, an auxiliary winding rectifier chip 2229, and an output mechanical mode inductor 2230. The main control chip 2222, transformer 2223, power device 2224, rectifier chip 2225, energy storage capacitor 2226, pins 2227, input differential mode inductor 2228, auxiliary winding rectifier chip 2229, and output mechanical mode inductor 2230 are all arranged on the ceramic PCB board 2221. The pins 2227 pass through the housing 221 and connect to the motherboard 21.

[0043] Compared to existing high-temperature polyimide boards, ceramic PCBs offer advantages such as better thermal conductivity, insulation, and high-temperature stability. They can quickly transfer heat from localized individual heat-generating components on the ceramic PCB to the entire ceramic PCB, and then conduct it to a larger area and volume through thermally conductive adhesives (including the first thermally conductive adhesive 30 and the second thermally conductive adhesive 40). This ensures that the temperature difference between the localized heat-generating point and the entire outer casing 10 is always kept within 5°C, making them particularly suitable for heat dissipation in high-temperature conditions.

[0044] The pins 2227 of the thick-film packaged circuit structure 222 are connected to the motherboard 21 by soldering, such as... Figure 4 As shown in the figure, the circular holes on the motherboard 21 are for soldering the pins 2227.

[0045] In a thick-film packaged circuit structure 222, components (main control chip 2222, transformer 2223, power device 2224, rectifier chip 2225, energy storage capacitor 2226, pins 2227, input differential mode inductor 2228, auxiliary winding rectifier chip 2229, and output die-mode inductor 2230, etc.) are typically arranged on one side of a ceramic PCB board 2221. The other side of the ceramic PCB board 2221 contacts the housing 221 for heat dissipation. However, this structure has poor heat dissipation performance. Preferably, such as... Figure 5 As shown, in some embodiments, the ceramic PCB board 2221 includes overlapping multilayer ceramic boards. The main control chip 2222, transformer 2223, power device 2224, rectifier chip 2225, energy storage capacitor 2226, pins 2227, input differential mode inductor 2228, auxiliary winding rectifier chip 2229, and output die-mode inductor 2230 are respectively arranged on the upper and lower surfaces of the multilayer ceramic boards. Thus, a second thermally conductive adhesive 40 is encapsulated above and below the thick-film packaged circuit structure 222. The second thermally conductive adhesive 40 enables heat conduction between the thick-film packaged circuit structure 222 and the housing 221, giving the thick-film packaged circuit structure 222 better heat dissipation, ensuring reliable and stable output, and providing a long service life.

[0046] For example, such as Figure 5 As shown, the upper surface of the multilayer ceramic plate is provided with a main control chip 2222, a transformer 2223, a power device 2224, a rectifier chip 2225, an energy storage capacitor 2226, and pins 2227, as follows. Figure 6 As shown, the main control chip 2222 and the transformer 2223 are located on one side of the transformer 2223, the rectifier chip 2225 and the energy storage capacitor 2226 are located on the other side of the transformer 2223, the pin 2227 is connected to the transformer 2223, and the other end is used to connect to the motherboard 21; Figure 5As shown, the lower surface of the multilayer ceramic plate is provided with the input differential mode inductor 2228, the auxiliary winding rectifier chip 2229, and the output working mode inductor 2230; the input differential mode inductor 2228 and the auxiliary winding rectifier chip 2229 are located on the same side as the main control chip 2222, and the output working mode inductor 2230 is located on the same side as the rectifier chip 2225.

[0047] In some embodiments, preferably, the housing 221 is a metal housing 221, as metal has higher thermal conductivity and better heat dissipation effect.

[0048] In some embodiments, such as Figure 5 As shown, a first insulating pad 50 is provided on the inner surface of the housing 221. The first insulating pad 50 provides electrical insulation between the thick film packaged circuit structure 222 and the housing 221, ensuring the electrical characteristics of the thick film packaged circuit structure 222 and preventing it from short-circuiting.

[0049] In some embodiments, preferably, the outer casing 10 is a metal casing 221, as metal has higher thermal conductivity and better heat dissipation.

[0050] In some embodiments, such as Figure 1 As shown, a second insulating pad 60 is provided on the inner surface of the outer casing 10. The second insulating pad 60 provides electrical insulation between the motherboard 21 and the outer casing 10, ensuring the electrical characteristics of the motherboard 21 and preventing short circuits.

[0051] In some embodiments, such as Figure 1 As shown, in the height direction of the housing 10 (indicated by the arrow), the motherboard 21 and the thick-film packaged power module 22 are respectively connected to the upper and lower second insulating pads 60. This reduces the size of the hybrid circuit module, offering the advantage of miniaturization.

[0052] It should be noted that the connection between the motherboard 21, the thick film packaged power module 22 and the second insulating pad 60 can be a fixed connection or a nested package connection.

[0053] The common-mode filter inductor 70 can filter out input mode noise of the thick-film packaged power module 22, and also filter out output mode noise of the thick-film packaged power module 22. In some embodiments, preferably, such as Figure 2 , Figure 3 As shown, a common-mode filter inductor 70 is provided on the motherboard 21, which simplifies the structure and reduces the size. Of course, the common-mode filter inductor 70 can also be set inside the thick-film packaged power module 22, in which case each thick-film packaged power module 22 needs to be equipped with a common-mode filter inductor, which not only increases the size but also increases the cost.

[0054] In some embodiments, the mother plate 21 is a ceramic plate.

[0055] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0056] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of multiple components or the interaction between multiple components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0057] In the description of this invention, it should be understood that all terms used to indicate orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as a limitation of this invention.

[0058] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-temperature resistant power supply hybrid circuit module, characterized in that, The power supply (20) includes a housing (10) and a modular assembly encapsulated within the housing (10), and a first thermally conductive adhesive (30); the modular assembly power supply (20) includes a motherboard (21) and a plurality of thick-film encapsulated power modules (22), the plurality of thick-film encapsulated power modules (22) being connected to the motherboard (21), and a second thermally conductive adhesive (40) being encapsulated within the thick-film encapsulated power modules (22).

2. The high-temperature resistant power supply hybrid circuit module according to claim 1, characterized in that, The second thermally conductive adhesive (40) is a thermally conductive adhesive with a coefficient of thermal expansion of 10 to 30 μm / m℃ and a thermal conductivity of 6 W / (m*K) to 18 W / (m*K).

3. The high-temperature resistant power supply hybrid circuit module according to claim 1, characterized in that, The thick-film packaged power module (22) includes a housing (221) and a thick-film packaged circuit structure (222). The thick-film packaged circuit structure (222) is disposed inside the housing (221), and the housing (221) is connected to the motherboard (21).

4. A high-temperature resistant power supply hybrid circuit module according to claim 3, characterized in that, The thick-film packaged circuit structure (222) includes a ceramic PCB board (2221), a main control chip (2222), a transformer (2223), a power device (2224), a rectifier chip (2225), an energy storage capacitor (2226), pins (2227), an input differential mode inductor (2228), an auxiliary winding rectifier chip (2229), and an output industrial mode inductor (2230). The main control chip (2222), transformer (2223), power device (2224), rectifier chip (2225), energy storage capacitor (2226), pins (2227), input differential mode inductor (2228), auxiliary winding rectifier chip (2229), and output industrial mode inductor (2230) are all arranged on the ceramic PCB board (2221). The pins (2227) pass through the housing (221) and connect to the motherboard (21).

5. A high-temperature resistant power supply hybrid circuit module according to claim 3 or 4, characterized in that, The inner surface of the housing (221) is provided with a first insulating pad (50).

6. A high-temperature resistant power supply hybrid circuit module according to claim 4, characterized in that, The ceramic PCB board (2221) includes overlapping multilayer ceramic boards. The main control chip (2222), transformer (2223), power device (2224), rectifier chip (2225), energy storage capacitor (2226), pin (2227), input differential mode inductor (2228), auxiliary winding rectifier chip (2229), and output industrial mode inductor (2230) are respectively arranged on the upper and lower surfaces of the multilayer ceramic boards.

7. A high-temperature resistant power supply hybrid circuit module according to claim 1, characterized in that, The inner surface of the outer casing (10) is provided with a second insulating pad (60).

8. A high-temperature resistant power supply hybrid circuit module according to claim 7, characterized in that, In the height direction of the outer casing (10), the motherboard (21) and the thick film packaged power module (22) are respectively connected to the upper second insulating pad (60) and the lower second insulating pad (60).

9. A high-temperature resistant power supply hybrid circuit module according to claim 1, characterized in that, A common-mode filter inductor (70) is provided on the motherboard (21).

10. A high-temperature resistant power supply hybrid circuit module according to claim 1, characterized in that, The mother plate (21) is a ceramic plate.

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