A power converter

Abstract

This application provides a power converter. The power converter includes a housing, a heat-generating device, and a heat dissipation structure. The heat-generating device is located inside the housing. The heat dissipation structure includes a heat sink and a vapor chamber. The heat sink covers the housing, and heat dissipation fins are provided on one side of the heat sink outside the housing. The heat-generating device is attached to the heat sink. The vapor chamber at least partially covers the end of the heat dissipation fins away from the heat sink and is fixed to the heat sink. The vapor chamber has flow channels containing a cooling medium for absorbing heat from the heat dissipation fins and vaporizing within the flow channels. In this heat dissipation structure, the heat from the heat-generating device is transferred to the heat dissipation fins through the heat sink. The end of the heat dissipation fins away from the heat sink contacts the vapor chamber, transferring heat to the vapor chamber, causing the cooling medium to absorb heat and vaporize. The vaporized cooling medium diffuses within the flow channels, thereby uniformly distributing heat from the vapor chamber and dissipating it outwards. This vapor chamber can increase the heat dissipation area of ​​the power converter, thereby improving the heat dissipation efficiency of the heat dissipation structure.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a power converter. Background Technology

[0002] During the transmission of electrical energy, parameters such as voltage or current need to be converted or regulated. For example, in a photovoltaic power generation system, the direct current (DC) generated by the solar panels needs to be converted into alternating current (AC) before being output. This function can be achieved through an inverter. Electronic components such as chips and inductors in the inverter generate a large amount of heat during operation. This heat needs to be dissipated into the external environment in a timely manner through a heat dissipation device to prevent the electronic components from failing due to overheating.

[0003] As inverter power increases, the heat generated by the power components within the inverter also increases, placing higher demands on the inverter's heat dissipation capabilities. Currently, the heat-generating components of the inverter exchange heat with the outside environment through heat sinks, specifically through the heat sink fins using natural convection and thermal radiation. However, the heat dissipation capacity of heat sink fins relying on natural convection is limited, resulting in low overall heat dissipation efficiency and making it difficult to apply to high-power-density inverters. Summary of the Invention

[0004] This application provides a power converter that increases the heat dissipation area of ​​the heat dissipation structure, thereby improving the heat dissipation efficiency of the power converter.

[0005] In a first aspect, this application provides a power converter. The power converter includes a housing, a heat-generating device, and a heat dissipation structure, with the heat-generating device located within the housing. The heat dissipation structure includes a heat sink and at least one vapor chamber. Specifically, the housing has an opening, and the heat sink covers the opening; or, the heat sink is part of the housing. The heat-generating device is attached to the heat sink. A plurality of heat dissipation fins are disposed on the surface of the heat sink opposite to the heat-generating device. The at least one vapor chamber at least partially covers the end of the plurality of heat dissipation fins away from the heat sink, and the at least one vapor chamber is fixed relative to the heat sink. Each of the at least one vapor chamber has at least one flow channel disposed therein. Each of the at least one flow channel is used to contain a cooling medium, which absorbs heat from the plurality of heat dissipation fins and vaporizes within the corresponding flow channel.

[0006] In the power converter of this application, a heat dissipation structure is used to dissipate heat from heat-generating components. When the power converter is operating, the heat from the heat-generating components is transferred to the heat dissipation fins through the heat sink. The end of the heat dissipation fins furthest from the heat sink (hereinafter referred to as the end of the heat dissipation fins) contacts a vapor chamber, thereby transferring the heat from the heat dissipation fins to the vapor chamber. When the vapor chamber is heated, the cooling medium in the flow channel absorbs heat and vaporizes, allowing the vaporized cooling medium to diffuse within the flow channel, thus ensuring a uniform heat distribution on the vapor chamber and heat exchange with the external air. This vapor chamber increases the heat dissipation area of ​​the heat dissipation structure, thereby improving the heat dissipation efficiency of the power converter.

[0007] Each of the aforementioned heat spreaders is bent toward the heat sink and forms at least one receiving groove. The opening of the aforementioned at least one receiving groove faces toward the heat sink. Each receiving groove includes a first side plate parallel to the heat sink, and a second side plate and a third side plate disposed opposite to each other on both sides of the first side plate, that is, the second side plate, the first side plate, and the third side plate are connected in sequence to form a heat spreader. The aforementioned at least one flow channel is located in the first side plate and extends to the second side plate and the third side plate. Each receiving groove accommodates at least one of the aforementioned plurality of heat sink fins. In this way, in addition to the heat exchange between the first side plate and the end of the heat sink fin, the second side plate and the third side plate can also exchange heat with the heat sink fin within the receiving groove. This not only increases the heat dissipation surface of the heat dissipation structure, but also allows the heat from the root of the heat sink fin (i.e., the end of the heat sink fin connected to the heat sink plate) to be transferred to the end of the heat sink fin through the second side plate and the third side plate, thereby improving the heat dissipation efficiency of the heat sink fin.

[0008] In this application, the number of vapor chambers is not limited. For example, the aforementioned at least one vapor chamber may include a single vapor chamber. This vapor chamber forms a plurality of receiving grooves arranged sequentially along a direction parallel to the heat sink, and the plurality of heat dissipation fins are received within these grooves; in other words, each receiving groove contains at least one heat dissipation fin. This technical solution uses a single vapor chamber, which can be bent multiple times to form multiple receiving grooves, thereby increasing the heat exchange area between the heat dissipation fins and the vapor chamber, and further improving heat dissipation efficiency.

[0009] In another technical solution, the aforementioned at least one heat spreader may include two heat spreaders. Each of the two heat spreaders forms a receiving groove, and the plurality of heat dissipation fins are accommodated within the receiving grooves of the two heat spreaders. When the heat spreader forms only one receiving groove, by setting multiple heat spreaders, the heat exchange area between the heat dissipation fins and the heat spreader can be increased, thereby further improving the heat dissipation efficiency.

[0010] In addition, a heat pipe is provided on the side of the vapor chamber near the heat sink. The heat pipe includes a first end and a second end arranged opposite each other, with the first end located near the heat source and the second end located near the cooling medium. The heat pipe is used to transfer heat from the heat source to the second end. Thus, after the power converter is installed, when the heat-generating device is located at a mid-to-high position along the direction of gravity of the power converter (i.e., the heat source is located at a mid-to-high position), the heat pipe can transfer heat from the mid-to-high position to the bottom of the vapor chamber, allowing the cooling medium at the bottom to exchange heat in a timely manner.

[0011] The aforementioned vapor chamber can have multiple flow channels arranged parallel to the direction of gravity. These multiple flow channels can divide the vapor chamber into multiple regions along the direction of gravity. These regions exchange heat separately, which not only improves heat dissipation efficiency but also accommodates the heat dissipation of heat-generating devices located in different positions.

[0012] The extension direction of at least one of the above-mentioned flow channels is set at an acute angle to the direction of gravity, so that the cooling medium flows along the inclined direction of the flow channel, which is conducive to the circulation of the cooling medium.

[0013] In addition, the flow channel is equipped with multiple protrusions. When the cooling medium is vaporized, the gaseous cooling medium diffuses upward along the direction of gravity. These protrusions can prevent the liquid cooling medium from following the gaseous cooling medium upward, thereby allowing the liquid cooling medium to fully absorb heat.

[0014] Furthermore, the aforementioned plurality of protrusions include a plurality of strip-shaped protrusions and a plurality of circular protrusions, and this application does not limit the specific shape of the protrusions.

[0015] At least one of the aforementioned flow channels is equipped with a Tesla valve, which is positioned along the direction of gravity to allow the cooling medium to flow upwards after being heated. Thus, when the heat source is located at a mid-to-high position, the Tesla valve can impede the downward flow of the gaseous cooling medium.

[0016] In addition, the vapor chamber has multiple openings. These openings can take full advantage of the self-heating chimney effect, replenishing cool air from the outside of the vapor chamber to the inside, thereby enhancing airflow around the heat dissipation fins.

[0017] Each of the above-mentioned multiple openings has fins on one side, and the fins are arranged facing the multiple heat dissipation fins to further increase the heat dissipation area between the heat spreader and the air.

[0018] The specific shape of the aforementioned flow channel is not limited, and at least one of the aforementioned flow channels includes a honeycomb flow channel or a strip flow channel.

[0019] The specific type of vapor chamber in this application is not limited, and may include, for example, a thermosiphon vapor chamber, a pulsating heat pipe vapor chamber, a loop heat pipe vapor chamber, or a vacuum chamber vapor chamber.

[0020] The aforementioned heat dissipation structure can be manufactured independently and fixedly connected to the housing. In one technical solution, the housing includes a first front plate and a back plate disposed opposite to each other, and a plurality of side wall plates located between the first front plate and the back plate. The first front plate, the aforementioned plurality of side wall plates, and the back plate enclose a first receiving space. The heat-generating device is located within the first receiving space. The first front plate is provided with the aforementioned opening, and the heat sink is fixedly connected to the surface of the first front plate opposite to the back plate. Alternatively, in another technical solution, the heat sink of the heat dissipation structure can also be part of the housing. Specifically, the housing includes a second front plate, the aforementioned heat sink, and a plurality of side plates. The heat sink is disposed opposite to the second front plate, the aforementioned plurality of side wall plates are located between the second front plate and the heat sink, and the second front plate, the aforementioned plurality of side wall plates, and the heat sink enclose a second receiving space, within which the heat-generating device is located. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of an application scenario of a photovoltaic system provided in an embodiment of this application;

[0022] Figure 2 This is a side cross-sectional view of the inverter in its mounted state, as provided in an embodiment of this application.

[0023] Figure 3 A schematic diagram of the heating device and heat dissipation structure provided in the embodiments of this application;

[0024] Figure 4 This is another schematic diagram of the heating device and heat dissipation structure provided in the embodiments of this application;

[0025] Figure 5 A schematic diagram of a heat dissipation structure provided in an embodiment of this application;

[0026] Figure 6 Another schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0027] Figure 7 Another schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0028] Figure 8 A schematic diagram of a heat spreader provided in an embodiment of this application;

[0029] Figure 9 Another schematic diagram of the heat spreader provided in the embodiments of this application;

[0030] Figure 10 Another schematic diagram of the heat spreader provided in the embodiments of this application;

[0031] Figure 11 Another schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0032] Figure 12Another schematic diagram of the heat dissipation structure provided in the embodiments of this application;

[0033] Figure 13 Another schematic diagram of the heat spreader provided in the embodiments of this application;

[0034] Figure 14 This is another schematic diagram of the heating device and heat dissipation structure provided in the embodiments of this application;

[0035] Figure 15 This is another schematic diagram of the heating device and heat dissipation structure provided in the embodiments of this application.

[0036] Figure label:

[0037] 10-Photovoltaic System 11-Photovoltaic Module 12-Power Grid

[0038] 13-Load 14-Wall 20-Power Converter

[0039] 21-Outer casing 22-Heating element 30-Heat dissipation structure

[0040] 31-Heat dissipation fins 32-Heat dissipation plate 33-Pop-up plate

[0041] 34-Flow channel 35-Receiving tank 36-Heat pipe

[0042] 37-Tesla valve 33a-First heat spreader 33b-Second heat spreader

[0043] 36a - First end; 36b - Second end; 331 - First side plate

[0044] 332 - Second side panel; 333 - Third side panel; 334 - Opening

[0045] 335-fin 341-protrusion Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0047] It should be noted that the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0048] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0049] In this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0050] Furthermore, in this article, directional terms such as "top," "bottom," "upper," and "lower" are defined relative to the orientation of the structure as shown in the attached drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the structure.

[0051] To facilitate understanding of the power converter provided in this application embodiment, its application scenarios are described below. The power converter of this application can be applied to power supply systems and power generation systems. Taking a photovoltaic system as an example, a photovoltaic system can be used in two application scenarios: residential power stations and industrial photovoltaic power stations, to convert solar energy into electrical energy to supply the power grid or loads. Figure 1 This is a schematic diagram illustrating an application scenario of the photovoltaic system provided in an embodiment of this application. For example... Figure 1 As shown, the photovoltaic system 10 is applied in a home power station. Specifically, the photovoltaic module 11 is used to convert solar energy into electrical energy. The power converter 20 includes an inverter, whose input is connected to the photovoltaic module 11 as a DC power source, and whose output is connected to the power grid 12 / load 13 via a power line. The inverter is used to convert the DC power from the photovoltaic module 11 into AC power and deliver the AC power to the power grid 12 / load 13. Of course, the inverter can also be connected to an energy storage device. The AC power converted by the inverter can also be delivered to the energy storage device for energy storage.

[0052] As inverter power increases, the heat generated by the circuit board components inside the inverter chassis also increases, leading to a rise in the internal temperature of the chassis. This is particularly detrimental to heat-generating components located inside the chassis. For power modules with high heat density, the risk of failure increases significantly under sustained high temperatures.

[0053] Figure 2 This is a side cross-sectional view of the inverter in its mounted state, as provided in an embodiment of this application. Figure 2 As shown, taking the power converter as an inverter as an example, the power converter 20 includes a heat dissipation surface. When the power converter 20 is mounted on the wall 14, the heat dissipation surface of the power converter 20 is perpendicular to the ground and opposite to the wall 14. The heat dissipation surface of the power converter 20 is provided with a heat dissipation structure 30. The heat dissipation structure 30 includes a heat sink 32 and multiple heat dissipation fins 31, with the multiple heat dissipation fins 31 disposed on the outer surface of the heat sink 32. When air passes over the power converter 20 from bottom to top, it can carry away the heat from the heat dissipation fins 31.

[0054] However, the ability of natural convection to dissipate heat from heat sink fins is limited, resulting in low overall heat dissipation efficiency of multiple heat sink fins, making it difficult to apply to high power density inverters.

[0055] To address the aforementioned issues, this application embodiment improves the heat dissipation structure of the power converter, thereby increasing the heat dissipation area of ​​the power converter, thus improving the heat dissipation efficiency of the power converter, enhancing its reliability, and ultimately extending its service life.

[0056] like Figure 2 As shown, the power converter 20 of this application also includes a housing 21 and a heat-generating device 22. The heat dissipation structure 30 is at least partially located outside the housing 21, and the heat-generating device 22 is located inside the housing 21. In this application, the heat dissipation structure 30 can be manufactured independently and fixedly connected to the housing 21. Specifically, the housing 21 includes a first front plate and a back plate disposed opposite to each other, and a plurality of sidewalls located between the first front plate and the back plate. The first front plate, the aforementioned plurality of sidewalls, and the back plate enclose a first receiving space. The heat-generating device 22 is located within the first receiving space. The first front plate has an opening, and a heat dissipation plate 32 is fixedly connected to the surface of the first front plate opposite to the back plate, and the heat dissipation plate 32 covers the opening. Alternatively, the heat dissipation plate 32 of the heat dissipation structure 30 can also be part of the housing 21. Specifically, the housing 21 includes a second front plate, a heat dissipation plate 32, and a plurality of sidewalls. The heat sink 32 is disposed opposite to the second front panel. The aforementioned plurality of side wall panels are located between the second front panel and the heat sink 32, and the second front panel, the aforementioned plurality of side wall panels, and the heat sink 32 enclose a second receiving space, within which the heat-generating device 22 is located. Inside the housing 21, the heat-generating device 22 is attached to the heat sink 32.

[0057] Figure 3 This is a schematic diagram of the heat-generating device and heat dissipation structure provided in an embodiment of this application. Figure 3 As shown, a plurality of heat dissipation fins 31 are provided on the surface of the heat sink 32 facing away from the heat-generating device 22. These heat dissipation fins 31 can be arranged in a direction away from the heat sink 32. In this embodiment, the plurality of heat dissipation fins 31 can be perpendicular to the surface of the heat sink 32, or the plane on which the heat dissipation fins 31 are located can be arranged at an acute angle to the surface of the heat sink 32. In addition, these heat dissipation fins 31 can be arranged parallel to the first direction (parallel to the ground) or they can be arranged non-parallel.

[0058] For ease of understanding, the following detailed description uses an example of multiple heat dissipation fins 31 arranged parallel to each other along a first direction. After the power converter 20 is mounted, the first direction can be parallel to the ground, allowing the heat dissipation fins 31 to be positioned along the direction of gravity and perpendicular to the heat sink 32. Thus, when air flows upwards through the power converter 20, the air flows over the larger surface area of ​​the heat dissipation fins 31 and carries away the heat from the fins, thereby achieving heat dissipation.

[0059] Figure 4 This is another schematic diagram of the heat-generating device and heat dissipation structure provided in an embodiment of this application. (See diagram below.) Figure 4 As shown, in the power converter 20 of this application, the heat dissipation structure 30 further includes a heat spreader 33. The heat spreader 33 at least partially covers the ends of the plurality of heat dissipation fins 31 (i.e., the ends away from the heat dissipation plate 32). A flow channel 34 is provided within the heat spreader 33, and the flow channel 34 contains a liquid cooling medium. When the power converter 20 is operating, the heat from the heat-generating device 22 is transferred to the heat dissipation fins 31 through the heat dissipation plate 32. The ends of the heat dissipation fins 31 contact the heat spreader 33, thereby transferring the heat from the root of the heat dissipation fins 31 (i.e., the position connected to the heat dissipation plate 32) to the heat spreader 33. When the heat spreader 33 is heated, the cooling medium in the flow channel 34 absorbs heat and vaporizes, causing the vaporized cooling medium to diffuse within the flow channel 34, thereby uniformly distributing the heat of the heat spreader 33 and exchanging heat with the external air. The heat spreader 33 can increase the heat dissipation area of ​​the power converter 20, thereby improving the heat dissipation efficiency of the power converter 20.

[0060] It should be noted that after the power converter 20 is installed, the heat exchanger 33 is perpendicular to the ground, and the liquid coolant accumulates at the bottom of the flow channel 34 under gravity. When the coolant is heated and vaporized, the gaseous coolant diffuses within the flow channel 34 and lies above the liquid coolant. At this point, the top layer of the flow channel 34 contains the gaseous coolant, and the bottom layer contains the liquid coolant, thus forming a two-phase heat exchanger.

[0061] Figure 5This is a schematic diagram of a heat dissipation structure provided in an embodiment of this application. Figure 5 As shown, the aforementioned heat spreader 33 can be bent and forms at least one receiving groove 35. The opening of the receiving groove 35 faces the heat dissipation plate 32. Each receiving groove 35 includes a first side plate 331, a second side plate 332, and a third side plate 333. The first side plate 331 is parallel to the heat dissipation plate 32 of the outer casing 21. The second side plate 332 and the third side plate 333 are arranged opposite to each other and connected to both sides of the first side plate 331. That is, the second side plate 332, the first side plate 331, and the third side plate 333 are sequentially connected to form an integral structure, thereby forming the heat spreader 33. The flow channel 34 of the heat spreader 33 is located in the first side plate 331 and extends to the second side plate 332 and the third side plate 333. In other words, the first side plate 331, the second side plate 332, and the third side plate 333 are all provided with flow channels 34. Each receiving groove 35 of the heat spreader 33 accommodates at least one of the plurality of heat dissipation fins 31. Within the receiving groove 35, in addition to the end of the heat dissipation fin 31 contacting the heat exchange plate 33, the larger surfaces of the heat dissipation fins 31 located on both sides along the first direction can also exchange heat with the second side plate 332 and the third side plate 333 of the heat exchange plate 33, further increasing the heat dissipation area. Furthermore, when the heat dissipation fin 31 dissipates heat, the temperature at the root of the heat dissipation fin 31 is higher than the temperature at the end of the heat dissipation fin 31. The bending structure of the heat exchange plate 33 can transfer the heat near the root of the heat dissipation fin 31 to the end of the heat dissipation fin 31, so as to make full use of the heat dissipation performance of the heat dissipation fin 31 and improve the overall heat dissipation efficiency of the heat dissipation fin 31.

[0062] In the embodiments of this application, the specific number of heat spreaders 33 is not limited. For example... Figure 5 As shown, in one embodiment, the power converter 20 is provided with a heat spreader 33. The heat spreader 33 is bent to form a receiving groove 35. The receiving groove 35 can accommodate the aforementioned plurality of heat dissipation fins 31.

[0063] Figure 6 Another schematic diagram of the heat dissipation structure provided in an embodiment of this application. For example... Figure 6 As shown, in another embodiment, the power converter 20 is provided with two heat exchangers 33, namely a first heat exchanger 33a and a second heat exchanger 33b. The structure of each heat exchanger 33 can be as follows: Figure 5The heat spreader 33 shown has the same structure. The first heat spreader 33a and the second heat spreader 33b are arranged adjacent to each other. The receiving groove 35 of the first heat spreader 33a accommodates a portion of the plurality of heat dissipation fins 31, and the receiving groove 35 of the second heat spreader 33b accommodates another portion of the plurality of heat dissipation fins 31. In this embodiment, in addition to the side plates of the heat spreader 33 provided at both ends of the plurality of heat dissipation fins 31 along the first direction, a side plate of the heat spreader 33 is also provided between two adjacent heat dissipation fins 31, which can further increase the heat dissipation area between the heat dissipation fins 31 and the heat spreader 33, thereby improving heat dissipation efficiency.

[0064] Furthermore, in the embodiments of this application, the number of receiving grooves 35 formed by the temperature distribution plate 33 is not limited. For example... Figure 5 and Figure 6 As shown, each heat spreader 33 can form a receiving groove 35. Figure 7 Another schematic diagram of the heat dissipation structure provided in an embodiment of this application. For example... Figure 7 As shown, in other embodiments, the heat spreader 33 can be bent multiple times to form two receiving grooves 35. The two receiving grooves 35 are arranged sequentially along the first direction. The heat spreader 33 is formed by six bends, and the flow channels 34 of the two receiving grooves 35 can be connected according to specific needs. The connected flow channels 34 can effectively reduce the contact thermal resistance and thermal conductivity resistance between the heat spreader 33 and the heat sink 32.

[0065] The heat spreader 33 of this application can be bent, or it can remain unbent. Figure 8 This is a schematic diagram of a heat spreader provided in an embodiment of this application. Figure 8 As shown, the heat spreader 33 is in an unfolded state. The heat spreader 33 includes multiple flow channels 34 arranged sequentially along the direction of gravity, with adjacent flow channels 34 isolated from each other. In this embodiment, the interior of the heat spreader 33 is divided into multiple regions, each region having one flow channel 34. In practical applications, the heating device 22 can be located at the top inside the housing 21, concentrating the heat of the heat sink 32 in the middle to high position. The heat spreader 33 uses a partitioned flow channel 34 arrangement. When the heat spreader 33 is heated, the cooling medium in the top flow channel 34 can absorb heat and vaporize first, thereby improving heat dissipation efficiency and achieving uniform temperature performance of the heat spreader 33. Similarly, when the heating device 22 is located at the bottom of the housing 21, the cooling medium in the bottom flow channel 34 of the heat spreader 33 can absorb heat and vaporize first. Therefore, the partitioned flow channel 34 arrangement of the heat spreader 33 is suitable for different placement positions of the heating device 22.

[0066] Within the heat exchanger 33, a flow channel 34 extends from one end of the heat exchanger 33 to the other along a first direction. Furthermore, the extension direction of the flow channel 34 is set at an acute angle to the first direction, and this extension direction is also set at an acute angle to the direction of gravity. That is, the flow channel 34 is inclined towards the direction of gravity, which facilitates the circulation of the cooling medium.

[0067] like Figure 8 As shown, multiple protrusions 341 can also be provided within the flow channel 34. When the cooling medium is vaporized, the gaseous cooling medium diffuses upward along the direction of gravity. These protrusions 341 can prevent the liquid cooling medium from following the gaseous cooling medium upward, thereby allowing the liquid cooling medium to fully absorb heat. In the above embodiment, the position, shape, and number of the multiple protrusions 341 are not limited. The multiple protrusions 341 include multiple strip-shaped protrusions and multiple circular protrusions. Among the aforementioned multiple strip-shaped protrusions, some strip-shaped protrusions can be parallel to the extension direction of the flow channel 34, while others can be parallel to the direction of gravity.

[0068] Figure 9 This is another schematic diagram of the heat spreader provided in the embodiments of this application. Figure 10 Another schematic diagram of a heat spreader provided in an embodiment of this application. (See diagram below.) Figure 9 and Figure 10 As shown, the specific shape of the flow channel 34 is not limited; for example, it can be... Figure 9 The honeycomb-shaped flow channel in the middle, or, it can also be Figure 10 The strip-shaped flow channel in the middle.

[0069] Figure 11 This is another schematic diagram of the heat dissipation structure provided in an embodiment of this application, wherein the heat spreader is in an unfolded state. Figure 11As shown, a heat pipe 36 is provided on the side of the heat spreader 33 near the heat sink 32. The heat pipe 36 includes a first end 36a and a second end 36b disposed opposite each other. The first end 36a is disposed near the heating element 22, and the second end 36b is disposed near the cooling medium. The heat pipe 36 is used to transfer heat from the first end 36a to the second end 36b. The heat pipe 36 includes a shell and a core located inside the shell. The core has a capillary structure and is impregnated with a liquid working medium. The first end 36a of the heat pipe 36 is the evaporation section, and the second end 36b is the condensation section. When the evaporation section of the heat pipe 36 is heated, the liquid working medium inside the core evaporates, carrying away heat. The vapor flows along the core from the first end 36a to the second end 36b, and condenses into liquid at the second end 36b, releasing heat to the heat spreader 33. Under the action of capillary force, the liquid flows back from the second end 36b along the gap between the tube core and the shell to the first end 36a, thus completing a closed loop and transferring a large amount of heat from the first end 36a to the second end 36b. In this embodiment, the heat pipe 36 is not affected by gravity and transfers the heat from the top heat source to the bottom, thereby heating and vaporizing the cooling medium of the heat spreader 33. This structural design is also applicable to mid-to-high heat sources and backward-tilted installation scenarios. It should be noted that, in this embodiment, the mid-to-high position refers to the position located at or above the center of the power converter 20 along the direction of gravity after the power converter 20 is installed.

[0070] Figure 12 This is another schematic diagram of the heat dissipation structure provided in an embodiment of this application, wherein the heat spreader is in an unfolded state. Figure 12 As shown, a Tesla valve 37 is provided inside the flow channel 34. The Tesla valve 37 is arranged along the direction of gravity so that the cooling medium flows from bottom to top after being heated. In this way, when the heat source is located at a medium to high position, the Tesla valve 37 can prevent the gaseous cooling medium from flowing from top to bottom.

[0071] Figure 13 This is another schematic diagram of the heat spreader provided in the embodiments of this application. Figure 14 This is another schematic diagram of the heat-generating device and heat dissipation structure provided in the embodiments of this application. Figure 15 This is another schematic diagram of the heat-generating device and heat dissipation structure provided in an embodiment of this application. (See diagram below.) Figure 13 and, Figure 14 and Figure 15 As shown, the heat spreader 33 may have multiple openings 334. These openings 334 can make full use of the self-heating chimney effect to replenish cold air from the outside of the heat spreader 33 to the inside, thereby enhancing the airflow around the heat dissipation fins 31.

[0072] like Figure 13 and, Figure 14 and Figure 15As shown, in the plurality of openings 334, each opening 334 has a fin 335 on one side, and the fin 335 is positioned facing the plurality of heat dissipation fins 31. The fin 335 can further increase the heat dissipation area between the heat spreader 33 and the air.

[0073] Furthermore, the specific type of the heat spreader 33 in this application is not limited, and may include, for example, a thermosiphon heat spreader, a pulsating heat pipe heat spreader, a loop heat pipe heat spreader, or a vacuum chamber heat spreader.

[0074] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power converter, characterized by, It includes a housing, a heating element, and a heat dissipation structure, wherein the heating element is located inside the housing, wherein: The heat dissipation structure includes a heat dissipation plate and at least one heat spreader. The housing has an opening, and the heat sink covers the opening; or, the heat sink is part of the housing; The heating element is attached to the heat sink, and the surface of the heat sink opposite to the heating element is provided with a plurality of heat dissipation fins; the at least one heat spreader at least partially covers the end of the plurality of heat dissipation fins away from the heat sink and is fixed relative to the heat sink; each of the at least one heat spreader is provided with at least one flow channel, each of the at least one flow channel is used to contain a cooling medium, and the cooling medium is used to absorb the heat of the plurality of heat dissipation fins and vaporize in each flow channel.

2. The power converter of claim 1, wherein, Each heat spreader plate is bent toward the heat dissipation plate to form at least one receiving groove; the opening of the at least one receiving groove is oriented toward the heat dissipation plate; Each receiving slot includes a first side plate parallel to the heat sink, and a second side plate and a third side plate disposed opposite to each other on both sides of the first side plate; the at least one flow channel is located in the first side plate and extends to the second side plate and the third side plate; each receiving slot accommodates at least one heat sink fin among the plurality of heat sink fins.

3. The power converter of claim 2, wherein, The at least one heat spreader includes a heat spreader plate; the heat spreader plate forms a plurality of receiving grooves arranged sequentially along a direction parallel to the heat dissipation plate; the plurality of heat dissipation fins are received in the plurality of receiving grooves.

4. The power converter of claim 2, wherein, The at least one heat spreader includes two heat spreaders; each of the two heat spreaders forms a receiving groove; the plurality of heat dissipation fins are received in the receiving grooves of the two heat spreaders.

5. The power converter of any one of claims 2 to 4, wherein, Each heat spreader is provided with a heat pipe on the side near the heat sink; the heat pipe includes a first end and a second end arranged opposite to each other, the first end being arranged near the heat source and the second end being arranged near the cooling medium; the heat pipe is used to transfer heat from the heat source from the first end to the second end.

6. The power converter of any one of claims 1 to 5, wherein, Each heat spreader plate is provided with multiple flow channels arranged parallel to the direction of gravity.

7. The power converter of any one of claims 1 to 6, wherein, The extension direction of at least one flow channel is set at an acute angle to the direction of gravity.

8. The power converter as described in any one of claims 1 to 7, characterized in that, Each flow channel has multiple protrusions.

9. The power converter as described in claim 8, characterized in that, The plurality of protrusions includes a plurality of strip-shaped protrusions and a plurality of circular protrusions.

10. The power converter as described in any one of claims 1 to 9, characterized in that, At least one flow channel is provided with a Tesla valve, which is arranged along the direction of gravity.

11. The power converter according to any one of claims 1 to 10, characterized in that, Each heat spreader has multiple openings.

12. The power converter as claimed in claim 11, characterized in that, Each of the plurality of openings has a fin on one side, and the fin is positioned toward the plurality of heat dissipation fins.

13. The power converter as described in any one of claims 1 to 12, characterized in that, The at least one flow channel includes a honeycomb flow channel or a strip flow channel.

14. The power converter according to any one of claims 1 to 13, characterized in that, The at least one heat spreader includes a thermosiphon heat spreader, a pulsating heat pipe heat spreader, a loop heat pipe heat spreader, or a vacuum chamber heat spreader.

15. The power converter according to any one of claims 1 to 14, characterized in that, The housing includes a first front panel and a back panel disposed opposite to each other, and a plurality of side panels located between the first front panel and the back panel. The first front panel, the plurality of side panels, and the back panel enclose a first receiving space, and the heating device is located within the first receiving space. The first front panel has the opening, and the heat sink is fixedly connected to the surface of the first front panel opposite to the back panel; or... The housing includes a second front panel, the heat sink, and a plurality of side panels. The heat sink is disposed opposite to the second front panel, and the plurality of side panels are located between the second front panel and the heat sink. The second front panel, the plurality of side panels, and the heat sink form a second accommodating space, and the heat-generating device is located within the second accommodating space.

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