Integrated dual-phase direct chip cooling using r718

Abstract

This invention relates to integrated two-phase direct chip cooling using R718. A cooling system may include: a housing, a first condenser, a compressor, an evaporator fluidly coupled to the condenser, a first pump for circulating refrigerant through a plurality of cold plates, a heat exchanger fluidly coupled to the condenser, and a second pump for circulating refrigerant through the heat exchanger. The first pump may selectively pump refrigerant from the first condenser and / or the evaporator. The system may circulate refrigerant through the first condenser, compressor, evaporator, first pump, heat exchanger, second pump, or a combination thereof. The refrigerant may be deionized water or R718.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 726,482, filed November 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to cooling systems for use with data centers, and more specifically, to dual-phase direct chip cooling systems. Background Technology

[0004] Direct-chip cooling systems, such as those used in data centers, typically rely on a pumped refrigerant loop to supply engineered liquid refrigerant to the cold plates on which the chips are mounted. However, such systems have inherent limitations and problems. These systems often use chillers decoupled from the refrigerant loop. Vapor or vapor-mixture refrigerant from the cold plates is sent to a condenser for subcooling to feed liquid to the pump, thus preventing cavitation. To ensure a sufficient supply of liquid refrigerant to the pump, a low approach temperature is required at the condenser, which necessitates a lower evaporation temperature at the chiller. Furthermore, typical pumped refrigerant loops tend to overfeed liquid refrigerant to the cold plates to handle potential load surges. However, this often results in only partial evaporation, where liquid refrigerant is expelled from the cold plates, which can lead to lower condenser performance and wasted energy from the refrigerant pump. Summary of the Invention

[0005] The applicant has developed novel and practical apparatus, systems, and methods for two-phase direct chip cooling systems. In at least one embodiment, the cooling system according to this disclosure may include an integrated chiller and a refrigerant pumping unit that uses R718 as both the refrigerant in the chiller and the pumped refrigerant through a cold plate in a single hydraulic circuit. In at least one embodiment, this cooling system provides lower vapor flow, a more compact and efficient centrifugal compressor, and lower refrigerant usage compared to conventional cooling systems.

[0006] In at least one embodiment, the cooling system according to this disclosure may include: a housing, a first condenser for condensing refrigerant, at least partially disposed within the housing, a compressor for compressing refrigerant, at least partially disposed within the housing and / or fluidly coupled to the first condenser, a first pump for circulating refrigerant through a plurality of cold plates, at least partially disposed within the housing and / or fluidly coupled to the condenser, a second pump for circulating refrigerant through the heat exchanger, or any combination thereof, at least partially disposed within the housing.

[0007] In at least one embodiment, the first pump can selectively pump refrigerant from the first condenser and / or evaporator. In at least one embodiment, when the compressor is idle, such as when the cooling system is operating in natural cooling mode, the first pump can pump refrigerant from the first condenser to multiple cold plates. In at least one embodiment, when the compressor is in use, such as when the cooling system is operating in compression mode, the first pump can pump refrigerant from the evaporator to multiple cold plates.

[0008] In at least one embodiment, the system may circulate the same refrigerant through a first condenser, compressor, evaporator, first pump, heat exchanger, second pump, or any combination thereof. In at least one embodiment, the refrigerant may be deionized water and / or may conform to American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE) standards, such as Standard 34 for R718 refrigerant.

[0009] In at least one embodiment, the first condenser may be a direct-contact condenser. In at least one embodiment, the system may include a vacuum subsystem for extracting non-condensable gases and / or contaminants from the first condenser. In at least one embodiment, the vacuum subsystem may include a second condenser for condensing refrigerant, at least partially disposed within the housing, and / or a vacuum pump for drawing non-condensable gases into the second condenser or another component of the vacuum subsystem, at least partially disposed within the housing. In at least one embodiment, the first pump may pump liquid refrigerant from the second condenser to a plurality of cold plates.

[0010] In at least one embodiment, the compressor may be a centrifugal compressor. In at least one embodiment, the compressor may receive refrigerant in vapor form from a cold plate and / or compress the refrigerant into a first condenser.

[0011] In at least one embodiment, the second pump can selectively pump refrigerant from the first condenser, for example, below the liquid level of the refrigerant in the first condenser, through a heat exchanger, and back to the first condenser, such as above the liquid level. In at least one embodiment, the system may include a plurality of nozzles, said nozzles being at least partially disposed within the first condenser above the liquid level, for dispersing the refrigerant entering the first condenser from the heat exchanger.

[0012] In at least one embodiment, the system may include an overpressure subsystem, at least partially disposed within the housing, for receiving excess refrigerant in liquid form from a cold plate, for example, upstream of the cold plate. In at least one embodiment, the overpressure subsystem may selectively direct the excess refrigerant to a first condenser and / or evaporator.

[0013] In at least one embodiment, the system may include a vapor collector, at least partially disposed within the housing, for receiving refrigerant in vapor form from the cold plate. In at least one embodiment, the vapor collector may selectively direct the refrigerant to a first condenser and / or a compressor.

[0014] In at least one embodiment, the system may include a filtration subsystem at least partially disposed within the housing for minimizing impurities within the refrigerant. In at least one embodiment, the filtration subsystem may include one or more media filters and / or one or more ultraviolet lamps. In at least one embodiment, the filtration subsystem may be fluidly coupled between the first pump and the cold plate.

[0015] In at least one embodiment, a heat exchanger can transfer heat from a refrigerant to a cooling fluid. In at least one embodiment, any or all of the cooling fluid can circulate through an external heat exchanger located outside the building housing the system. In at least one embodiment, the external heat exchanger can discharge any or all of the heat extracted from the cold plates to the environment outside the building. In at least one embodiment, any or all of the cooling fluid can circulate through a heat recovery device within the building housing the system. In at least one embodiment, the heat recovery device can discharge any or all of the heat extracted from the cold plates into the building, outside the system, for example, outside the shell and / or outside the room housing the system and / or the cold plates. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of one embodiment of a cooling system according to the present disclosure.

[0017] Figure 2 yes Figure 1A schematic diagram of the cooling system shows an exemplary flow configuration.

[0018] Figure 3 yes Figure 1 A schematic diagram of the cooling system shows another exemplary flow configuration.

[0019] Figure 4 This is a perspective view of another embodiment of a cooling system according to the present disclosure. Detailed Implementation

[0020] The accompanying drawings described above and the written description of specific structures and functions below are not intended to limit the scope of the applicant's invention or the appended claims. Rather, these drawings and written descriptions are provided to teach any person skilled in the art how to make and use the patent-protected invention. Those skilled in the art will understand that not all features of a commercial implementation of the invention are described or illustrated for clarity and understanding. They will also understand that the development of a practical commercial implementation incorporating various aspects of the invention will require numerous implementation-specific decisions to achieve the developer's ultimate goals for the commercial implementation. Such implementation-specific decisions may include, but are not limited to, compliance with system-related, business-related, governmental-related, and other constraints that may vary depending on the specific implementation, location, and time. While the developer's efforts may be complex and time-consuming in an absolute sense, such efforts will be routine for those skilled in the art who benefit from this disclosure. It must be understood that the invention disclosed and taught herein is susceptible to many and various modifications and alternatives.

[0021] The use of singular terms such as, but not limited to, “a” is not intended as a limitation on the number of items. Furthermore, the use of relational terms such as, but not limited to, “top,” “bottom,” “left,” “right,” “upper,” “lower,” “downward,” “upward,” “side,” etc., in the written description is for clarity when specifically referring to the accompanying drawings and is not intended to limit the scope of the invention or the appended claims. The terms “comprising” and “such as” are illustrative, not restrictive. The terms “coupled,” “coupled,” “coupled,” “coupler,” and similar terms are used extensively herein and may include any method or means for fixing, joining, bonding, fastening, attaching, engaging, inserting therein, forming thereon or therein, communicating one or more components, or otherwise associating one or more components together, for example mechanically, magnetically, electrically, chemically, operatively, directly, or indirectly through intermediate elements, and may also include, but is not limited to, integrally forming one functional component with another functional component in a monolithic manner. Coupling can occur in any direction, including in the direction of rotation. Furthermore, all parts and components that can be physically inherently implemented in this disclosure include both virtual and real features, whether such features are explicitly described herein or not. These features include, but are not limited to, features such as shafts, ends, inner and outer surfaces, internal spaces, tops, bottoms, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume, and density.

[0022] The applicant has developed novel and practical apparatus, systems, and methods for two-phase direct chip cooling systems. In at least one embodiment, the cooling system according to this disclosure may include an integrated chiller and a refrigerant pumping unit that uses R718 as both the refrigerant in the chiller and the pumped refrigerant through a cold plate in a single hydraulic circuit. In at least one embodiment, this cooling system provides lower vapor flow, a more compact and efficient centrifugal compressor, and lower refrigerant usage compared to conventional cooling systems.

[0023] Figure 1 This is a schematic diagram of one embodiment of a cooling system according to the present disclosure. Figure 2 yes Figure 1 A schematic diagram of the cooling system shows an exemplary flow configuration. Figure 3 yes Figure 1 A schematic diagram of the cooling system shows another exemplary flow configuration. Figure 4 This is a perspective view of another embodiment of a cooling system according to the present disclosure. Figures 1 to 4 They are described in combination.

[0024] In at least one embodiment, the cooling system 100 according to the present disclosure may include one or more housings 110, one or more condensers 120 at least partially disposed within the housings 110 for condensing refrigerant, one or more compressors 130 at least partially disposed within the housings 110 for compressing refrigerant, one or more evaporators 140 at least partially disposed within the housings 110 and / or fluidly coupled to the condensers 120, one or more circulation pumps 150 at least partially disposed within the housings 110 for circulating refrigerant through one or more cold plates 210, one or more heat exchangers 160 at least partially disposed within the housings 110 and / or fluidly coupled to the condensers 120, one or more cooling pumps 170 at least partially disposed within the housings 110 for circulating refrigerant through the heat exchangers 160, or any combination thereof.

[0025] In at least one embodiment, the circulation pump 150 may selectively pump refrigerant from the condenser 120 and / or the evaporator 140. In at least one embodiment, when the compressor 130 is idle, for example when the cooling system 100 is operating in natural cooling mode, the circulation pump 150 may pump refrigerant from the condenser 120 to the plurality of cold plates 210. In at least one embodiment, when the compressor 130 is in use, for example when the cooling system 100 is operating in compression mode, the circulation pump 150 may pump refrigerant from the evaporator 140 to the plurality of cold plates 210.

[0026] In at least one embodiment, system 100 can avoid problems associated with engineering fluids, such as flammability, toxicity, inefficiency, high operating pressures, and cost. In at least one embodiment, the refrigerant may be deionized water and / or conform to American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE) standards, such as Standard 34 for R718 refrigerant.

[0027] In at least one embodiment, system 100 may circulate the same refrigerant through condenser 120, compressor 130, evaporator 140, circulation pump 150, heat exchanger 160, cooling pump 170, cold plate 210, or any combination thereof. In at least one embodiment, system 100 may circulate the same refrigerant through each of condenser 120, compressor 130, evaporator 140, circulation pump 150, heat exchanger 160, cooling pump 170, and cold plate 210. In at least one embodiment, circulation pump 150 and / or compressor 130 may circulate a portion of the refrigerant through compressor 130, evaporator 140, circulation pump 150, and cold plate 210, while simultaneously cooling pump 170 may pump another portion of the same refrigerant through condenser 120, heat exchanger 160, and cooling pump 170. In at least one embodiment, the circulating pump 150 can pump a portion of the refrigerant through the condenser 120, evaporator 140, circulating pump 150, and cold plate 210, while simultaneously, the cooling pump 170 can pump another portion of the same refrigerant through the condenser 120, heat exchanger 160, and cooling pump 170. In at least one embodiment, the condenser 120 can be a direct contact condenser.

[0028] In at least one embodiment, the cold plate 210 may be thermally coupled to one or more electrical devices (e.g., information technology (IT) devices) for use in cooling devices, such as in one or more computer device cabinets 220 that can be separated from and / or independent of the housing 110. In at least one embodiment, the cold plate 210 may be a pool-boiling cold plate with water level regulation. In at least one embodiment, the housing 110 may be juxtaposed with or coupled to one or more cabinets 220, or disposed away from the cabinets 220. In at least one embodiment, the housing 110 and / or cabinets 220 may be located within another part of the computer room and / or building 200.

[0029] In at least one embodiment, system 100 may include a vacuum subsystem 180 for selectively maintaining the interior of tank 110 and / or any associated piping or other components at a pressure below the ambient pressure surrounding tank 110. In at least one embodiment, vacuum subsystem 180 may include a condenser 182 for condensing refrigerant 120 and / or a vacuum pump 184, for example, for evacuating the interior of system 100 before charging the system with refrigerant and / or extracting non-condensable gases. In at least one embodiment, vacuum subsystem 180 may be at least partially housed within housing 160. In at least one embodiment, condenser 182 and / or vacuum pump 184 may be at least partially housed within housing 160. In at least one embodiment, vacuum subsystem 180 may extract non-condensable gases and / or contaminants leaking into tank 110, for example, due to tank 110 operating at sub-ambient and / or sub-atmospheric pressure. In at least one embodiment, if water vapor is accidentally collected by vacuum pump 184, the water vapor may be condensed by condenser 182. In at least one embodiment, the circulation pump 150 can pump refrigerant in liquid form from the condenser 182 of the vacuum subsystem 180. In at least one embodiment, the circulation pump 150 can supply refrigerant to the cold plate 210 at near, equal to, or above atmospheric pressure, while the condenser 120 can be maintained at sub-atmospheric pressure.

[0030] In at least one embodiment, compressor 130 may be or include one or more centrifugal compressors operating in single-stage and / or multi-stage mode. In at least one embodiment, compressor 130 may receive refrigerant in vapor form from cold plate 210 and / or compress refrigerant into condenser 120. In at least one embodiment, system 100 may include one or more additional compression stages (not shown), which may, but do not necessarily, occur in a shell or housing separate from condenser 120. For example, in at least one embodiment, system 100 may include a flash evaporator to which refrigerant from condenser 120 may be directed, and the resulting refrigerant vapor may then undergo another compression stage. As another example, in at least one embodiment, system 100 may include an intercooler to which refrigerant from compressor 130 may be directed (e.g., via compressor discharge line), and the resulting refrigerant vapor may then undergo another compression stage.

[0031] In at least one embodiment, the cooling pump 170 may selectively pump refrigerant from the condenser 120, for example, below the liquid level 122 in the condenser 120, through the heat exchanger 160, and back to the condenser 120, such as above the liquid level 122. In at least one embodiment, the system 100 may include one or more nozzles 124, which are at least partially disposed within the condenser 120, for example above the liquid level 122, to disperse the refrigerant entering the condenser 120 from the heat exchanger 160.

[0032] In at least one embodiment, system 100 may include an overpressure subsystem 152, at least partially disposed within housing 110, for receiving excess refrigerant in liquid form from, for example, upstream of cold plate 210. In at least one embodiment, system 100 may allow cold plate 210 to overflow and ensure that only the required amount of refrigerant enters cold plate 210 and / or that refrigerant discharged from cold plate 210 is in vapor form for return to compressor 130. In at least one embodiment, overpressure subsystem 152 may selectively direct excess refrigerant to condenser 120 and / or evaporator 140. In at least one embodiment, overpressure subsystem 152 may reduce energy waste via circulation pump 150. In at least one embodiment, overpressure subsystem 152 may include one or more valves, such as one or more pressure relief valves 156 and / or other valves, one or more manifolds, piping between condenser 120, evaporator 140 and cold plate 210, or any combination thereof.

[0033] In at least one embodiment, system 100 may include one or more vapor collectors 132, at least partially disposed within housing 110, for receiving refrigerant in vapor form from cold plate 210. In at least one embodiment, vapor collectors 132 may selectively direct refrigerant to condenser 120, compressor 130, evaporator 140, or any combination thereof. In at least one embodiment, vapor collectors 132 may include one or more vapor conduits and / or one or more valves, such as butterfly valves. In at least one embodiment, system 100 may efficiently supply refrigerant in liquid form to cold plate 210, thereby minimizing supply flow and / or maximizing refrigerant evaporation in cold plate 210 using a small supply line, and receiving refrigerant in vapor form downstream of cold plate 210. In at least one embodiment, system 100 may utilize the high latent heat of water, thereby maximizing efficient cooling of cold plate 210.

[0034] In at least one embodiment, system 100 may include one or more filtration subsystems 190, at least partially disposed within housing 110, for minimizing impurities within the refrigerant. In at least one embodiment, filtration subsystem 190 may include one or more media filters 192 and / or one or more ultraviolet lamps 194. In at least one embodiment, filtration subsystem 190 may be fluidly coupled between circulation pump 150 and cold plate 210.

[0035] In at least one embodiment, heat exchanger 160 may be a brazed plate heat exchanger. In at least one embodiment, heat exchanger 160 may transfer heat from refrigerant to one or more cooling fluids. In at least one embodiment, any or all of the cooling fluid may be circulated, for example, through one or more drain pumps 240 through one or more external heat exchangers 230, wherein any or both may be located outside the building 200 housing the system 100. In at least one embodiment, external heat exchanger 230 may be or include a dry cooler, chiller, condenser, or any combination thereof. In at least one embodiment, external heat exchanger 230 may discharge any or all of the heat extracted from cold plate 210 to the environment outside the building 200. In at least one embodiment, any or all of the cooling fluid may be circulated through one or more heat recovery devices 250 located inside the building 200 housing the system 200. In at least one embodiment, the heat recovery device 250 may be or include one or more heat exchangers, such as one or more fluid-air heat exchangers, and / or may discharge any or all of the heat extracted from the cold plate 210 into the building 200, for example outside the shell 110 and / or outside the room housing the system 100 and / or the cold plate 210 (e.g., for using the recovered heat to heat another part of the building).

[0036] In at least one embodiment, system 100 may include one or more controllers 300 for controlling any or all of the following: compressor 130, pump 150, pump 170, pump 184, pump 240, and one or more valves, such as one or more diverter valves 310, and / or one or more other components required or desired as per a particular implementation of this disclosure. In at least one embodiment, controller 300 may be included in or communicate with one or more monitoring systems to maintain the refrigerant supply temperature of cold plate 210, and / or be included in or communicate with one or more building management systems to control one or more functions of external heat exchanger 230, drain pump 240, heat recovery device 250, or any combination thereof. In at least one embodiment, controller 300 may include one or more user interfaces for communicating with one or more users, for example, for setting the refrigerant supply temperature of cold plate 210 and / or the building temperature to be maintained by heat recovery device 250.

[0037] In at least one embodiment, controller 300 may control diverter valve 310 and circulation pump 150 to draw refrigerant from evaporator 140 and / or condenser 120 and return excess refrigerant to evaporator 140 and / or condenser 120. In at least one embodiment, controller 300 may control diverter valve 310 and circulation pump 150 to draw refrigerant from evaporator 140 and return excess refrigerant to evaporator 140, for example, when demand is high and system 100 is operating in direct expansion or compression mode, such as when compressor 130 is used and is compressing (vapor phase) refrigerant in condenser 120. In at least one embodiment, controller 300 may control diverter valve 310 and circulation pump 150 to draw refrigerant from condenser 120 and return excess refrigerant to condenser 120, for example, when demand is low and system 100 is operating in natural cooling mode, such as when compressor 130 is idle. In at least one embodiment, the controller 300 may control the diversion valve 310 and the cooling pump 170 to draw refrigerant from the condenser 120, for example, below the liquid level 122, and to direct refrigerant, such as in vapor form, to the condenser 120 and / or the compressor 130.

[0038] As those skilled in the art who benefit from this disclosure will understand, one or more aspects of this disclosure may be embodied as a system, method, or computer program product. Therefore, aspects of this disclosure may take the form of a completely hardware implementation, a completely software implementation (including firmware, resident software, microcode, etc.), or an implementation combining software and hardware aspects, which herein may generally be referred to in their entirety as a “circuit,” “module,” or “system.” Furthermore, aspects of this disclosure may take the form of a computer program product embodied in one or more non-transitory computer-readable media on which computer-readable program code is embodied. Any combination of one or more computer-readable media may be utilized. A computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination thereof. More specific examples of such computer-readable storage media include, but are not limited to, the following: an electrical connection having one or more wires, a portable computer floppy disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable optical disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In the context of this document, a computer-readable storage medium can be any tangible medium that can contain or store a program for use by or connected to an instruction execution system, apparatus, or device.

[0039] Program code included on a computer-readable medium may be transmitted using any suitable medium or media, including but not limited to wireless, wired, fiber optic cable, radio frequency (RF), or any suitable combination thereof. Computer program code used to perform operations of aspects of this disclosure may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" programming language or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, partially on the user's computer as a standalone software package, and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer, for example, via the Internet through an Internet service provider or via short-range wireless interconnection such as Bluetooth.

[0040] Aspects of this disclosure may be described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (devices and systems), and computer program products according to embodiments of this disclosure. Each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus to generate a machine, such that the instructions, which execute via one or more processors, create a method for implementing the functions / actions specified in the flowchart and / or block diagram blocks or blocks. The computer program instructions can be stored in a computer-readable medium that can direct a computer, other programmable data processing apparatus, or other device to operate in a particular manner, such that the instructions stored in the computer-readable medium generate an article comprising instructions for implementing the functions / actions specified in the flowchart and / or block diagram blocks or blocks. Computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to trigger a series of operational steps to be performed on the computer, other programmable apparatus, or other device, thereby generating a computer-implemented flow, such that the instructions, which execute on the computer or other programmable apparatus, provide a flow for implementing the functions / actions specified in the flowchart and / or block diagram boxes or blocks. Each box in the flowchart and / or block diagram may be broken down into multiple boxes and / or combined with other boxes to form a single box.

[0041] In at least one embodiment, the cooling system according to this disclosure may include: a housing, a first condenser for condensing refrigerant and at least partially disposed within the housing, a compressor for compressing refrigerant and at least partially disposed within the housing, an evaporator for circulating refrigerant through a plurality of cold plates and at least partially disposed within the housing, a heat exchanger for circulating refrigerant through the heat exchanger and at least partially disposed within the housing, or any combination thereof.

[0042] In at least one embodiment, the first pump can selectively pump refrigerant from the first condenser and / or evaporator. In at least one embodiment, when the compressor is idle, such as when the cooling system is operating in natural cooling mode, the first pump can pump refrigerant from the first condenser to multiple cold plates. In at least one embodiment, when the compressor is in use, such as when the cooling system is operating in compression mode, the first pump can pump refrigerant from the evaporator to multiple cold plates.

[0043] In at least one embodiment, the system may circulate the same refrigerant through a first condenser, compressor, evaporator, first pump, heat exchanger, second pump, or any combination thereof. In at least one embodiment, the refrigerant may be deionized water and / or may conform to American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE) standards, such as Standard 34 for R718 refrigerant.

[0044] In at least one embodiment, the first condenser may be a direct-contact condenser. In at least one embodiment, the system may include a vacuum subsystem for extracting non-condensable gases and / or contaminants from the first condenser. In at least one embodiment, the vacuum subsystem may include a second condenser for condensing refrigerant, at least partially disposed within the housing, and / or a vacuum pump for drawing non-condensable gases into the second condenser or another component of the vacuum subsystem, at least partially disposed within the housing. In at least one embodiment, the first pump may pump liquid refrigerant from the second condenser to a plurality of cold plates.

[0045] In at least one embodiment, the compressor may be a centrifugal compressor. In at least one embodiment, the compressor may receive refrigerant in vapor form from a cold plate and / or compress the refrigerant into a first condenser.

[0046] In at least one embodiment, the second pump can selectively pump refrigerant from the first condenser, for example, below the liquid level of the refrigerant in the first condenser, through a heat exchanger, and back to the first condenser, such as above the liquid level. In at least one embodiment, the system may include a plurality of nozzles, said nozzles being at least partially disposed inside the first condenser above the liquid level, for dispersing the refrigerant entering the first condenser from the heat exchanger.

[0047] In at least one embodiment, the system may include an overpressure subsystem, at least partially disposed within the housing, for receiving excess refrigerant in liquid form from a cold plate, for example, upstream of the cold plate. In at least one embodiment, the overpressure subsystem may selectively direct the excess refrigerant to a first condenser and / or evaporator.

[0048] In at least one embodiment, the system may include a vapor collector, at least partially disposed within the housing, for receiving refrigerant in vapor form from the cold plate. In at least one embodiment, the vapor collector may selectively direct the refrigerant to a first condenser and / or a compressor.

[0049] In at least one embodiment, the system may include a filtration subsystem at least partially disposed within the housing for minimizing impurities within the refrigerant. In at least one embodiment, the filtration subsystem may include one or more media filters and / or one or more ultraviolet lamps. In at least one embodiment, the filtration subsystem may be fluidly coupled between the first pump and the cold plate.

[0050] In at least one embodiment, the heat exchanger can transfer heat from the refrigerant to the cooling fluid. In at least one embodiment, any or all of the cooling fluid can circulate through an external heat exchanger located outside the building housing the system. In at least one embodiment, the external heat exchanger can discharge any or all of the heat extracted from the cold plates to the environment outside the building. In at least one embodiment, any or all of the cooling fluid can circulate through a heat recovery device inside the building housing the system. In at least one embodiment, the heat recovery device can discharge any or all of the heat extracted from the cold plates into the building, outside the system, such as outside the shell and / or outside the room housing the system and / or the cold plates.

[0051] Without departing from the spirit of the applicant's disclosure, other and additional implementations utilizing one or more aspects of this disclosure are conceivable. For example, apparatus, systems, and methods can be implemented for many different types and sizes across many different industries. Furthermore, various methods and implementations of apparatus, systems, and methods can be combined with each other to produce variations of the disclosed methods and implementations. Discussion of singular elements can include plural elements, and vice versa. Unless otherwise specifically limited, the order of steps can occur in various sequences. The individual steps described herein can be combined with other steps, interspersed with described steps, and / or broken down into multiple steps. Similarly, elements have been functionally described and can be implemented as individual components or combined into components with multiple functions.

[0052] This invention has been described in the context of preferred and other embodiments, and not every embodiment of the invention has been described. Obvious modifications and alterations to the described embodiments will be useful to those skilled in the art who will benefit from this disclosure. The disclosed and undisclosed embodiments are not intended to limit or constrain the scope or applicability of the invention as envisioned by the applicant, but rather, in accordance with patent law, the applicant intends to fully protect all such modifications and improvements that fall within the scope or range of equivalents of the appended claims.

Claims

1. A cooling system, comprising: case; A first condenser is at least partially disposed within the housing and configured to condense the refrigerant; A compressor that is at least partially disposed within the housing and configured to selectively compress the refrigerant; An evaporator is at least partially disposed within the housing; A first pump, which is at least partially disposed within the housing and configured to: The refrigerant is selectively pumped from the first condenser to multiple cold plates; as well as The refrigerant is selectively pumped from the evaporator to the plurality of cold plates; A heat exchanger that is at least partially disposed within the housing and fluidly coupled to the first condenser; as well as A second pump, which is at least partially disposed within the housing and configured to selectively pump the refrigerant from the first condenser to the heat exchanger for cooling the refrigerant.

2. The cooling system according to claim 1, wherein, The system is configured to circulate the refrigerant through the first condenser, the compressor, the evaporator, the first pump, the heat exchanger, and the second pump.

3. The cooling system according to claim 1, wherein, The refrigerant is deionized water.

4. The cooling system according to claim 1, wherein, The refrigerant conforms to ASHRAE Standard 34 of the American Society of Heating, Refrigerating and Air-Conditioning Engineers for R718 refrigerant.

5. The cooling system according to claim 1, wherein, The first condenser is a direct contact condenser.

6. The cooling system of claim 1 further includes a vacuum subsystem configured to extract non-condensable gases and / or contaminants from the first condenser.

7. The cooling system according to claim 6, wherein, The vacuum subsystem includes: A second condenser, at least partially disposed within the housing and configured to condense the refrigerant; and A vacuum pump is at least partially disposed within the housing and configured to draw the non-condensable gas into the second condenser.

8. The cooling system according to claim 1, wherein, When the compressor is idle and the cooling system is operating in natural cooling mode, the first pump is configured to pump the refrigerant from the first condenser to the plurality of cold plates; And wherein, when the compressor is used and the cooling system operates in compression mode, the first pump is configured to pump the refrigerant from the evaporator to the plurality of cold plates.

9. The cooling system according to claim 1, wherein, The compressor is a centrifugal compressor.

10. The cooling system according to claim 1, wherein, The compressor is configured to receive the refrigerant in vapor form from the plurality of cold plates and to compress the refrigerant upstream of the first condenser.

11. The cooling system according to claim 1, wherein, The second pump is configured to selectively pump the refrigerant from a first point below the liquid level of the refrigerant in the first condenser through the heat exchanger and to a second point above the liquid level of the refrigerant in the first condenser.

12. The cooling system of claim 11 further includes a plurality of nozzles, said plurality of nozzles being disposed at least partially within the first condenser, above the liquid level, and configured to disperse the refrigerant entering the first condenser from the heat exchanger.

13. The cooling system of claim 1, further comprising an overpressure subsystem, the overpressure subsystem being at least partially disposed within the housing and configured to receive excess refrigerant in liquid form from upstream of the plurality of cold plates and to selectively direct the excess refrigerant to the first condenser or the evaporator.

14. The cooling system of claim 1, further comprising a vapor collector at least partially disposed within the housing and configured to receive the refrigerant in vapor form from the plurality of cold plates and to selectively direct the refrigerant to the first condenser or the compressor.

15. The system of claim 1, further comprising a filter subsystem at least partially disposed within the housing.

16. The system according to claim 15, wherein, The filtration subsystem includes at least one media filter and at least one ultraviolet lamp.

17. The system according to claim 15, wherein, The filtration subsystem is fluidly coupled between the first pump and the plurality of cold plates.

18. The system according to claim 1, wherein, The heat exchanger is configured to transfer heat from the refrigerant to the cooling fluid.

19. The system of claim 18 further includes an external heat exchanger configured to discharge at least a portion of the heat from the refrigerant via the cooling fluid to the environment outside the building housing the casing.

20. The system of claim 18 further includes a heat recovery device configured to discharge at least a portion of the heat from the refrigerant to the building housing the casing via the cooling fluid.

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