A through-hole LED with built-in fixing and its manufacturing method

Abstract

This invention relates to the field of through-hole LEDs, specifically to a through-hole LED with an internal fixing component and its manufacturing method. It includes an LED bracket, a light-emitting component, a fixing component, and an encapsulating colloid. The LED bracket includes a positive and a negative electrode pin that are spaced apart and insulated from each other. Both the positive and negative electrode pins have a connection end at their upper ends, and a fixing portion is formed on the upper part of the positive and negative electrode pins. The fixing portions on the positive and negative electrode pins are connected as a whole by the fixing component to restrict stress release on the upper parts of the positive and negative electrode pins, thereby preventing gold wire breakage. The encapsulating colloid is used to encapsulate the light-emitting component and the fixing component as a whole and to guide the light emitted by the light-emitting component. By using an internal fixing component, the positive and negative electrode pins inside the LED are insulated from each other and tightly bonded together, effectively preventing changes in the spacing between the positive and negative electrode pins in the LED bracket, thus preventing gold wire breakage and effectively improving the product's lifespan.

Description

[Technical Field]

[0001] This invention relates to the field of through-hole LEDs, and more specifically to a through-hole LED with a built-in fixing component and a manufacturing method thereof. [Background Technology]

[0002] Conventional through-hole LEDs generally have similar internal structures, using epoxy resin to fix the LED bracket and protect the internal components of the light-emitting component. The diameter of the metal wire in the light-emitting component is approximately 0.8–1.0 mil (18–25.4 μm), and the tensile strength of the wire is approximately 6–10 g. Due to the relatively low tensile strength, the internal gold wire is prone to breakage when internal stress exists during LED product application. Because optical properties, heat dissipation, and sealing must be considered, high-hardness, high-strength ceramic or plastic encapsulation cannot be used; therefore, high-transmittance epoxy resin adhesive is used for encapsulation. The disadvantage of this type of epoxy resin is its glass transition temperature (TG point). When the ambient temperature of the LED operating environment exceeds the TG temperature (around 135–150°C), the epoxy resin will transform from a glassy state at room temperature to a highly elastic rubber state.

[0003] However, LED products are used differently. When using LED products, customers often find it difficult to fully consider the residual stress from assembly and the temperature limits of LEDs. After the oxy-resin colloid transforms from a glassy state at room temperature to a highly elastic rubber state, it becomes difficult for the oxy-resin colloid to fix the LED bracket. The stress existing in the LED bracket will be released, or due to environmental factors, such as when the LED pin spacing is greater or less than the PCB plug-in pin hole spacing, or when the front leg of the LED pin plug-in is bent at an angle greater than 90°, the stress will be unbalanced after installation. At high temperatures, the internal stress of the product will cause changes in the spacing between the positive and negative pins in the LED bracket, ultimately leading to gold wire breakage.

[0004] In view of the above-mentioned technical problems, this invention is proposed. [Summary of the Invention]

[0005] The technical problem to be solved by the present invention is to provide a through-hole LED with built-in fixing and a manufacturing method thereof. By using built-in fixing, the positive and negative leads inside the LED are insulated from each other and tightly bonded together, which solves the problem that in traditional through-hole LEDs, under high temperature conditions, the oxy-resin colloid softens, releasing the stress of the LED bracket, which causes the spacing between the positive and negative leads in the LED bracket to change, thus causing the gold wire to break.

[0006] To solve the above-mentioned technical problems, the present invention proposes a through-hole LED with a built-in fixing member, comprising:

[0007] LED bracket, the LED bracket includes positive and negative leads that are spaced apart and insulated from each other;

[0008] The light-emitting component has connection terminals formed on the upper ends of both the positive and negative leads. The light-emitting component includes a semiconductor chip disposed on one of the connection terminals and conductive silver paste for fixing the semiconductor chip to the corresponding connection terminal. It also includes a gold wire, one end of which is connected to the semiconductor chip and the other end of which is connected to the connection terminal where no semiconductor chip is disposed.

[0009] The insulating material is used as a fixing part. The upper part of the positive and negative leads is formed with a fixing part. The fixing parts on the positive and negative leads are connected as a whole by the fixing part to limit the stress release on the upper part of the positive and negative leads and thus prevent the gold wire from breaking.

[0010] Encapsulating colloids are used to encapsulate the light-emitting components and fixtures into a single unit and to guide the light emitted by the light-emitting components.

[0011] As described above, a through-hole LED with a built-in fixing component includes a middle partition and connecting parts located on the left and right sides of the middle partition and connected to the middle partition. The connecting parts wrap around the corresponding fixing parts together, and the middle partition creates a gap between the fixing parts of the positive and negative leads.

[0012] As described above, a through-hole LED with a built-in fixing component has a fixing groove formed on the fixing part.

[0013] As described above, in a through-hole LED with a built-in fixing component, the inner side of the fixing part has a flat surface, and the flat surfaces on the positive and negative leads are arranged in parallel.

[0014] As described above, a through-hole LED with a built-in fixing member has a deformation groove 52 on the inner side of the lower end of the fixing part.

[0015] As described above, the through-hole LED with a built-in fixing component has a trapezoidal cross-section that is wider at the top and narrower at the bottom.

[0016] As described above, a through-hole LED with a built-in fixing component is integrally formed with the positive and negative leads.

[0017] This application also provides a method for producing a through-hole LED with a built-in fixing component. In this through-hole LED with a built-in fixing component, fixing grooves are formed on both the positive and negative leads. The method for producing the through-hole LED includes the following steps:

[0018] S1, a fixing groove is pre-made on the fixing part of the positive and negative pins;

[0019] S2, fluid material is formed into a fixing part in the fixing groove of the positive electrode pin and the negative electrode pin by injection molding or dispensing process;

[0020] S3, After the fastener is shaped, the surface of the LED bracket is electroplated;

[0021] S4. After electroplating is completed, install the light-emitting components;

[0022] S5, and finally, the light-emitting components and fixing parts are wrapped together by encapsulating colloid.

[0023] In the above-described method for producing through-hole LEDs with built-in fixing components, the fixing groove is formed by stamping on the positive and negative leads.

[0024] The above-described method for producing through-hole LEDs with built-in fixing components uses ceramic paste or high-temperature resistant plastic as the fixing component material, and the fluid material is formed on the fixing groove through injection molding or drip molding process.

[0025] Compared with the prior art, the present invention provides a through-hole LED with an internal fixing component and a manufacturing method thereof, which has the following advantages:

[0026] 1. This invention provides a through-hole LED with a built-in fixing component. The built-in fixing component ensures that the positive and negative leads inside the LED are insulated from each other and tightly bonded together. This effectively prevents the softening of the epoxy resin colloid in traditional through-hole LEDs under high-temperature conditions, which releases stress on the LED bracket and causes changes in the spacing between the positive and negative leads, leading to gold wire breakage. This effectively improves the product's lifespan.

[0027] 2. The present invention provides a through-hole LED with a built-in fixing component. By forming a fixing groove on the fixing part, the fixing component connection can be made more stable, effectively solving the problem of gold wire breakage caused by changes in the spacing between the positive and negative leads during long-term use of the LED.

[0028] 3. The present invention provides a through-hole LED with a built-in fixing component, wherein the fixing component is integrally formed with the positive and negative leads, which makes the connection more stable.

[0029] 4. The present invention provides a method for producing through-hole LEDs with built-in fixing components. By pre-fabricating fixing grooves in the fixing part during the production of positive and negative leads, and by setting fixing components to insulate the positive and negative leads from each other and tightly connect them into one unit, the stress of the LED bracket can be prevented from being released, which would cause the spacing between the positive and negative leads in the LED bracket to change, thereby preventing the gold wire from breaking. This effectively improves the service life of the product. [Attached Image Description]

[0030] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, wherein:

[0031] Figure 1 This is a schematic diagram of the structure of the present invention.

[0032] Figure 2 This is a schematic diagram of the fixing part in this invention.

[0033] Figure 3 This is a structural schematic diagram of the fastener in this invention.

[0034] Figure 4 This is a schematic diagram showing the structure of gold wire breakage after installation when the spacing of LED pins is greater than the spacing of PCB plug-in pin holes.

[0035] Figure 5 This is a schematic diagram showing the structure of gold wire breakage after installation when the spacing of LED pins is smaller than the spacing of PCB plug-in pin holes.

[0036] Figure 6 This is a schematic diagram showing the structure of an LEDPIN plug-in where the gold wire breaks after installation when the front leg is bent at an angle greater than 90° (18°).

[0037] In the diagram: 1. LED bracket; 10. Positive lead; 11. Negative lead; 2. Light-emitting component; 20. Connecting end; 21. Semiconductor wafer; 22. Conductive silver paste; 23. Gold wire; 3. Fixing component; 30. Intermediate partition; 31. Connecting part; 4. Encapsulating colloid; 5. Fixing part; 50. Fixing groove; 51. Flat surface; 52. Deformation groove.

Detailed Implementation Methods

[0038] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0039] like Figure 1-6As shown, the present invention includes a through-hole LED with a built-in fixing component, comprising an LED bracket 1, a light-emitting component 2, a fixing component 3, and an encapsulating colloid 4. The LED bracket 1 includes a positive electrode pin 10 and a negative electrode pin 11 spaced apart and insulated from each other. A connection end 20 is formed at the upper end of both the positive electrode pin 10 and the negative electrode pin 11. The light-emitting component 2 includes a semiconductor chip 21 disposed on one of the connection ends 20 and conductive silver paste 22 for fixing the semiconductor chip 21 to the corresponding connection end 20. It also includes a gold wire 23, one end of which is connected to the semiconductor chip 21, and the other end of which is connected to the connection end 20 where the semiconductor chip 21 is not disposed. The fixing component 3 is made of insulating material. A fixing part 5 is formed on the upper part of the positive electrode pin 10 and the negative electrode pin 11. The fixing parts 5 on the positive electrode pin 10 and the negative electrode pin 11 are connected into one body by the fixing component 3 to limit the stress release on the upper part of the positive electrode pin 10 and the negative electrode pin 11, thereby preventing the gold wire 23 from breaking. The encapsulating colloid 4 is used to wrap the light-emitting component 2 and the fixing component 3 into one body and to guide the light emitted by the light-emitting component 2.

[0040] The internal structure of conventional through-hole LEDs is largely the same. They all use encapsulating colloid 4 to fix the LED bracket 1 and protect the internal components of the light-emitting component 2. The diameter of the metal wire in the light-emitting component 2 is approximately 0.8–1.0 mil (18–25.4 μm), and the tensile strength of the wire is approximately 6–10 g. Due to the relatively low tensile strength, the internal gold wire 23 is prone to breakage when internal stress exists during LED product application. Because optical properties, heat dissipation, and sealing must be considered, high-hardness, high-strength ceramic or plastic encapsulation cannot be used. Therefore, high-transmittance epoxy resin is used for encapsulation. The disadvantage of this type of epoxy resin is its glass transition temperature (TG point). When the ambient temperature of the LED exceeds the TG temperature (around 135–150°C), the epoxy resin will transform from a glassy state at room temperature to a highly elastic rubber state. This makes it difficult for the encapsulating colloid 4 to fix the LED bracket 1.

[0041] However, LED products are used in different ways. Customers often find it difficult to fully consider residual stress from assembly and the temperature limits of the LEDs when using them. After the epoxy resin colloid transforms from a glassy state at room temperature to a highly elastic rubber state, the encapsulating colloid 4 struggles to hold the LED bracket 1 in place. The stress within the LED bracket 1 may then be released, or due to environmental factors such as when the LED pin spacing is greater than or less than the PCB insertion pin hole spacing (e.g....). Figure 4 Figure 5 As shown), when the front pin of the LED PIN is bent, the angle is greater than 90° (e.g.). Figure 6 As shown, after installation, the force will be unbalanced. Under high temperature, the internal stress of the product will cause the spacing between the positive electrode pin 10 and the negative electrode pin 11 in the LED bracket 1 to change, which will eventually lead to the breakage of the gold wire 23.

[0042] In this application, the built-in fixing component 3 makes the positive electrode pin 10 and negative electrode pin 11 inside the LED form an insulated and tightly integrated whole. This prevents the problem of the oxygen resin colloid softening under high temperature conditions in traditional through-hole LEDs, which would release the stress on the LED bracket 1 and cause the spacing between the positive electrode pin 10 and negative electrode pin 11 in the LED bracket 1 to change, thus causing the gold wire 23 to break. Therefore, this invention can prevent the gold wire 23 from breaking and effectively improve the service life of the product.

[0043] like Figures 1 to 3 As shown, as a further embodiment, the fixing member 3 includes a middle partition 30 and connecting portions 31 located on the left and right sides of the middle partition 30 and connected to the middle partition 30. The connecting portions 31 wrap around the corresponding fixing portions 5 together, and the middle partition 30 creates a gap between the fixing portions 5 of the positive electrode pin 10 and the negative electrode pin 11. In this embodiment, the fixing member 3 is integrally formed with the positive electrode pin 10 and the negative electrode pin 11, which makes the connection more stable. Furthermore, the cross-section of the fixing member 3 is a trapezoid with a wider top and a narrower bottom, which makes the overall structure more compact.

[0044] like Figures 1 to 3 As a further embodiment of this invention, the fixing part 5 is formed with a fixing groove 50. By setting the fixing groove 50, the connection of the fixing member 3 can be made more stable.

[0045] like Figures 1 to 3 As a further embodiment of this invention, the inner side of the fixing part 5 has a flat surface 51, and the flat surfaces 51 on the positive electrode pin 10 and the negative electrode pin 11 are arranged in parallel. By setting the flat surface 51, the positive and negative electrode pins 11 can be kept in a set distance, reducing the distance between them caused by environmental changes.

[0046] like Figures 1 to 3 As a further embodiment of this invention, the fixing part 5 has a deformation groove 52 on the inner side of its lower end. By setting the deformation groove 52, it is possible to prevent the force from being transmitted to the upper part of the positive electrode pin 10 and the negative electrode pin 11 when the force is unbalanced at the lower part of the reduced positive electrode pin 10 and the negative electrode pin 11. At the same time, it is also convenient to insert the entire LED into the mounting position.

[0047] This application also provides a method for producing a through-hole LED with a built-in fixing member 3. In this through-hole LED using the aforementioned method with a built-in fixing member 3, fixing grooves 50 are formed on the fixing portions 5 of both the positive electrode pin 10 and the negative electrode pin 11. The method for producing the through-hole LED includes the following steps:

[0048] S1, a fixing groove 50 is pre-made on the fixing part 5 of the positive electrode pin 10 and the negative electrode pin 11. The fixing groove 50 is formed by stamping the positive electrode pin 10 and the negative electrode pin 11, which can reduce the subsequent processing procedures.

[0049] S2, the fluid material is formed into a fixing component 3 in the fixing groove 50 of the positive electrode pin 10 and the negative electrode pin 11 by injection molding or dispensing process. The fixing component 3 is made of ceramic paste or high temperature resistant plastic, and the fluid material is formed on the fixing groove 50 by injection molding or dispensing process.

[0050] S3, After the fixing part 3 is shaped, the surface of the LED bracket 1 is electroplated.

[0051] S4. After electroplating is completed, install the light-emitting component 2.

[0052] S5, and finally the light-emitting component 2 and the fixing component 3 are wrapped together by the encapsulating colloid 4.

[0053] It should be noted that the electroplating process, the installation of the light-emitting component 2, and the encapsulating colloid 4 are all existing technologies that can be completed using traditional LED manufacturing processes, and will not be described in detail here.

[0054] The through-hole LED manufacturing method with built-in fixing member 3 in this embodiment, by pre-fabricating fixing grooves 50 on fixing part 5 during the production of positive electrode pin 10 and negative electrode pin 11, and by setting fixing member 3 to insulate the positive electrode pin 10 and negative electrode pin 11 from each other and tightly combine them into one, can prevent the stress of LED bracket 1 from being released, which would cause the spacing between the positive electrode pin 10 and negative electrode pin 11 in LED bracket 1 to change, thereby causing the gold wire 23 to break. Therefore, the through-hole LED produced by this invention can prevent the gold wire 23 from breaking, effectively improving the service life of the product.

Claims

1. A through-hole LED with a built-in fixing member (3), characterized in that... include: LED bracket (1), the LED bracket (1) includes a positive electrode pin (10) and a negative electrode pin (11) that are spaced apart and insulated from each other; The light-emitting component (2) has a connection terminal (20) formed on the upper end of the positive electrode pin (10) and the negative electrode pin (11). The light-emitting component (2) includes a semiconductor chip (21) disposed on one of the connection terminals (20) and conductive silver paste (22) for fixing the semiconductor chip (21) on the corresponding connection terminal (20). It also includes a gold wire (23), one end of which is connected to the semiconductor chip (21) and the other end is connected to the connection terminal (20) where the semiconductor chip (21) is not disposed. The insulating material fixing member (3) has a fixing part (5) formed on the upper part of the positive electrode pin (10) and the negative electrode pin (11). The fixing parts (5) on the positive electrode pin (10) and the negative electrode pin (11) are connected into one piece by the fixing member (3) to limit the stress release of the upper part of the positive electrode pin (10) and the negative electrode pin (11) and thus prevent the gold wire (23) from breaking. The encapsulating colloid (4) is used to encapsulate the light-emitting component (2) and the fixing component (3) into one piece and to guide the light emitted by the light-emitting component (2).

2. A through-hole LED with an internal fixing member (3) according to claim 1, characterized in that... The fixing member (3) includes a middle partition (30) and a connecting part (31) located on the left and right sides of the middle partition (30) and connected to the middle partition (30). The connecting part (31) wraps the corresponding fixing part (5) together. The middle partition (30) forms a gap at the fixing part (5) of the positive electrode pin (10) and the negative electrode pin (11).

3. A through-hole LED with an internal fixing member (3) according to claim 2, characterized in that... The fixing part (5) has a fixing groove (50) formed on it.

4. A through-hole LED with an internal fixing member (3) according to claim 2, characterized in that... The inner side of the fixing part (5) has a flat surface (51), and the flat surfaces (51) on the positive electrode pin (10) and the negative electrode pin (11) are arranged in parallel.

5. A through-hole LED with an internal fixing member (3) according to claim 2, characterized in that... The lower end of the fixing part (5) has a deformation groove (52).

6. A through-hole LED with an internal fixing member (3) according to claim 2, characterized in that... The cross-section of the fastener (3) is a trapezoid that is wider at the top and narrower at the bottom.

7. A through-hole LED with an internal fixing member (3) according to any one of claims 1 to 6, characterized in that... The fixing part (3) is integrally formed with the positive terminal pin (10) and the negative terminal pin (11).

8. A method for producing through-hole LEDs with built-in fixing components (3), characterized in that... A through-hole LED using a built-in fixing member (3) as described in any one of claims 1 to 7, wherein fixing grooves (50) are formed on the fixing portions (5) of both the positive electrode pin (10) and the negative electrode pin (11), and a through-hole LED manufacturing method. Includes the following steps: S1, a fixing groove (50) is pre-made on the fixing part (5) of the positive electrode pin (10) and the negative electrode pin (11); S2, the fluid material is formed into a fixing part (3) in the fixing groove (50) of the positive electrode pin (10) and the negative electrode pin (11) by injection molding or dispensing process; S3, After the fixing part (3) is shaped, the surface of the LED bracket (1) is electroplated; S4, After electroplating is completed, install the light-emitting component (2); S5, and finally the light-emitting component (2) and the fixing component (3) are wrapped together by the encapsulating colloid (4).

9. A method for producing a through-hole LED with an internal fixing member (3) according to claim 8, characterized in that... The fixing groove (50) is formed by stamping on the positive electrode pin (10) and the negative electrode pin (11).

10. A method for producing a through-hole LED with an internal fixing member (3) according to claim 8, characterized in that... The material of the fastener (3) is ceramic paste or high-temperature resistant plastic, and the fluid material is formed on the fixing groove (50) by injection molding or dripping process.

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