Semiconductor processing apparatus and process
By evaporating hydrofluoric acid stock solution into hydrogen fluoride gas in a semiconductor processing device, and combining nitrogen control and buffer bottle recovery of unevaporated liquid, the problem of reduced HF solution concentration is solved, achieving efficient utilization and low-cost production of hydrogen fluoride gas.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUXI HUAYING MICROELECTRONICS TECH CO LTD
- Filing Date
- 2024-11-29
- Publication Date
- 2026-06-02
AI Technical Summary
When using HF solution or pure HF vapor, existing semiconductor etching equipment suffers from low acid concentration in the HF solution as the number of etched samples increases, resulting in poor etching effect, low HF utilization, and emission problems.
A semiconductor processing device is used, including a raw liquid storage bottle, a spray device, and an evaporation device. The hydrofluoric acid raw liquid is evaporated into hydrogen fluoride gas and water vapor through spraying and electric heating. Nitrogen is used to control the evaporation rate and concentration. Combined with spherical solid packing and a buffer bottle, the incompletely evaporated liquid is recovered, thus achieving efficient utilization of hydrofluoric acid.
It improves the accuracy of hydrogen fluoride gas concentration control, reduces chemical liquid consumption, lowers operational risks, increases the utilization rate of HF solution, and avoids the storage and transportation costs of pure hydrogen fluoride gas.
Smart Images
Figure CN122138637A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer fabrication, and more specifically to a semiconductor processing apparatus and process. Background Technology
[0002] Most existing semiconductor etching equipment uses HF solution or pure HF vapor for the etching process, and some equipment also uses a bubbling process with HF solution. However, with the increase in the number of etched samples, the acid concentration of the HF solution decreases, resulting in a deterioration in etching efficiency. Therefore, there is an urgent need to develop a new HF concentration method to further improve the utilization rate of HF solution and reduce HF emissions. Summary of the Invention
[0003] To address the technical problems existing in the prior art, the present invention discloses a semiconductor processing device, the specific technical solution of which is as follows:
[0004] This invention provides a semiconductor processing apparatus, including a stock solution storage bottle, a spraying device, and an evaporation device.
[0005] The stock solution of hydrofluoric acid is sealed and stored in the stock solution storage bottle.
[0006] The spraying device connects the stock solution storage bottle and the evaporation device. The spraying device transports the hydrofluoric acid stock solution from the stock solution storage bottle to the top of the evaporation device and sprays it downwards. The spraying range of the hydrofluoric acid stock solution extends to the inner wall of the evaporation device.
[0007] The lower middle part of the evaporation device is filled with solid filler, and an electric heating jacket is provided on the outer wall of the evaporation device. The electric heating jacket heats the inner cavity of the evaporation device and the solid filler. The hydrofluoric acid stock solution is completely evaporated into hydrogen fluoride gas and water vapor before falling from the top of the inner cavity of the evaporation device to the bottom of the inner cavity.
[0008] Furthermore, the spraying device includes a first nitrogen inlet pipe, a second nitrogen inlet pipe, and a first three-way valve.
[0009] The first port of the first three-way valve is connected to the first nitrogen inlet pipe, the second port of the first three-way valve is connected to the bottom of the raw liquid storage bottle via a pipe, and the third port of the first three-way valve is connected to the top of the evaporation device via a pipe.
[0010] The second nitrogen inlet pipe is connected to the top of the stock solution storage bottle.
[0011] The second nitrogen inlet pipe introduces nitrogen into the raw liquid storage bottle, increasing the internal pressure of the raw liquid storage bottle and forcing the hydrofluoric acid raw liquid in the raw liquid storage bottle through the first three-way valve into the evaporation device, where it is then blown into fine droplets by the nitrogen in the first nitrogen inlet pipe.
[0012] Furthermore, the spraying device includes a peristaltic pump, a first three-way valve, and a first nitrogen inlet pipeline.
[0013] The first port of the first three-way valve is connected to the first nitrogen inlet pipe, the second port of the first three-way valve is connected to one end of the peristaltic pump, the other end of the peristaltic pump is connected to the bottom of the stock solution storage bottle, and the third port of the first three-way valve is connected to the top of the evaporation device via a pipe.
[0014] The peristaltic pump transports the hydrofluoric acid stock solution from the bottom of the stock solution storage bottle to the top of the evaporation device, where it is dispersed into fine droplets by nitrogen gas in the first nitrogen gas inlet pipe.
[0015] Furthermore, the top of the evaporation device is connected to a third nitrogen inlet pipe. The nitrogen gas introduced through the third nitrogen inlet pipe serves as a carrier gas for hydrogen fluoride, transporting the hydrogen fluoride gas to the subsequent process.
[0016] The solid packing material inside the evaporation device has a spherical structure and the solid packing material is in close contact with each other.
[0017] The bottom of the evaporation device is equipped with a weighing device, which monitors the weight of the evaporation device in real time.
[0018] Furthermore, it also includes a first buffer bottle, which is connected to the top of the evaporation device. The hydrogen fluoride gas in the evaporation device passes through the first buffer bottle before entering the next process.
[0019] A reflux pipe is provided between the first buffer bottle and the original liquid storage bottle. The reflux pipe is connected to the bottom of the first buffer bottle and the top of the original liquid storage bottle, respectively. The reflux pipe recovers the condensate at the bottom of the first buffer bottle into the original liquid storage bottle.
[0020] Furthermore, the top of the first buffer bottle is connected to a fourth nitrogen inlet pipe, and the nitrogen gas introduced through the fourth nitrogen inlet pipe is at a temperature lower than the target temperature of hydrogen fluoride gas when processing wafer devices.
[0021] Furthermore, it also includes a second three-way valve, a second buffer bottle, and a wafer processing unit.
[0022] The first port of the second three-way valve is connected to the top of the first buffer bottle, the second port of the second three-way valve is connected to the second buffer bottle, the third port of the second three-way valve is connected to the air inlet of the wafer processing device in the subsequent process, and the air outlet of the wafer processing device is connected to the second buffer bottle.
[0023] Furthermore, it also includes a vacuum pumping device, which is connected to the second buffer bottle. The gas in the second buffer bottle is discharged outward through the vacuum pumping device and enters the exhaust gas emission channel.
[0024] Furthermore, it also includes a dehydration tube, which is disposed between the first buffer bottle and the second three-way valve. The dehydration tube absorbs water vapor from the hydrogen fluoride gas, thereby controlling the water vapor content entering the wafer processing device.
[0025] The present invention also discloses a semiconductor processing technology, comprising the following steps:
[0026] S1, open the first nitrogen inlet pipe and the third nitrogen inlet pipe to the appropriate inlet speed to purge the device;
[0027] S2, turn on the evaporation device to preheat to the set temperature, and at the same time turn on all other gases and supporting devices according to the set conditions to reach a stable state;
[0028] S3, after confirming that all parameters are correct, turn on the spray device to send the hydrofluoric acid stock solution in the stock solution storage bottle into the evaporation device, automatically adjust the power of the evaporation device to keep the inner cavity of the evaporation device at a constant temperature until the weighing module reading stabilizes.
[0029] S4, adjust the nitrogen flow rate of the first, third, and fourth nitrogen inlet pipes to control the concentration and flow rate of hydrogen fluoride gas in the wafer processing unit.
[0030] S5. After the wafer processing is completed, first turn off the spray device and stop transporting hydrofluoric acid stock solution into the evaporation device;
[0031] S5 automatically adjusts the power of the evaporator to maintain a constant temperature inside the evaporator until the weighing module reading stabilizes. Then, it shuts off all other gases, auxiliary devices, and heaters except for the first and third nitrogen inlet pipes.
[0032] S6, nitrogen gas continues to be introduced into the first nitrogen inlet pipe and the third nitrogen inlet pipe for purging until sufficient time is met and the evaporator is cooled to a safe temperature.
[0033] S7, shut off the first nitrogen inlet line and the third nitrogen inlet line.
[0034] The present invention has the following beneficial effects:
[0035] 1. The semiconductor processing technology provided by the present invention obtains the precise evaporation rate of hydrogen fluoride in the evaporation device by controlling the inlet volume and inlet speed of the hydrofluoric acid stock solution. In this way, the output of hydrogen fluoride gas in the wafer processing device can be actively, stably and accurately controlled, and the flow rate of nitrogen carrier gas can be adjusted in real time through the nitrogen inlet pipeline, thereby further controlling the concentration of hydrogen fluoride gas.
[0036] 2. The semiconductor processing technology provided by the present invention uses nitrogen gas to disperse the liquid when extracting hydrofluoric acid stock solution, resulting in smaller liquid droplets. This increases the evaporation efficiency of hydrofluoric acid during the evaporation of the hydrofluoric acid stock solution, allowing the concentration of hydrogen fluoride vapor to be increased significantly and rapidly. It also significantly reduces the amount of chemical liquid consumed during single-wafer processing.
[0037] 3. The semiconductor processing technology provided by the present invention includes a spherical solid packing material in the evaporation device, which increases the surface area of the hydrofluoric acid stock solution in contact with the heat source and improves the evaporation rate of hydrofluoric acid.
[0038] 4. The semiconductor processing technology provided by this invention directly extracts hydrofluoric acid stock solution for evaporation during the process, avoiding the need to frequently replace the hydrofluoric acid in the chemical liquid bottle due to the continuous decrease of the stock solution concentration to below the lower limit of use, thus reducing operational risks. Furthermore, it can recover the hydrofluoric acid stock solution from the first buffer bottle, achieving a high utilization rate of the hydrofluoric acid stock solution.
[0039] 5. The semiconductor processing technology provided by the present invention includes a first buffer bottle and a dehydration tube before the wafer processing apparatus, which can effectively control the water vapor content entering the wafer processing apparatus, so that the hydrogen fluoride gas entering the wafer processing apparatus can achieve optimal combination with the water vapor.
[0040] 6. The semiconductor processing technology provided by this invention uses an aqueous solution of hydrogen fluoride to directly obtain hydrogen fluoride gas, thus eliminating the cost and risk associated with storing and transporting highly toxic pure hydrogen fluoride gas.
[0041] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0043] Figure 1This is a schematic diagram of the structure of the semiconductor processing device provided in the first embodiment of the present invention.
[0044] Figure 2 This is a schematic diagram of the structure of the semiconductor processing device provided in the second embodiment of the present invention.
[0045] Figure 3 This is a schematic diagram of the structure of the semiconductor processing device provided in the third embodiment of the present invention.
[0046] The attached figures are labeled as follows:
[0047] 10 stock solution storage bottle, 30 evaporation device, 40 first buffer bottle, 50 second three-way valve, 60 second buffer bottle, 70 wafer processing device, 80 dehydration tube, 90 vacuum device;
[0048] First nitrogen inlet pipe 21, second nitrogen inlet pipe 22, first three-way valve 23, peristaltic pump 24;
[0049] Third nitrogen inlet pipeline 31, weighing device 32;
[0050] Reflux pipe 41, fourth nitrogen inlet pipe 42. Detailed Implementation
[0051] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0052] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0053] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0054] This invention discloses a semiconductor processing apparatus, with reference to Figures 1 to 3 It includes a raw material storage bottle 10, a spraying device, an evaporation device 30, a first buffer bottle 40, a second three-way valve 50, a second buffer bottle 60, a wafer processing device 70, a dehydration pipe 80, and a vacuum device 90.
[0055] The stock solution of hydrofluoric acid is sealed and stored in the stock solution storage bottle 10. The spraying device is connected to the stock solution storage bottle 10 and the evaporation device 30. The spraying device transports the hydrofluoric acid stock solution in the stock solution storage bottle 10 to the top of the evaporation device 30 and sprays it downwards. The spraying range of the hydrofluoric acid stock solution extends to the inner cavity sidewall of the evaporation device 30.
[0056] The lower middle part of the evaporation device 30 is filled with solid filler, and an electric heating jacket is provided on the outer wall of the evaporation device 30. The electric heating jacket heats the inner cavity of the evaporation device 30 and the solid filler. The hydrofluoric acid stock solution is completely evaporated into hydrogen fluoride gas and water vapor before falling from the top of the inner cavity of the evaporation device 30 to the bottom of the inner cavity.
[0057] In one embodiment, reference Figure 1 The spraying device includes a first nitrogen inlet pipe 21, a second nitrogen inlet pipe 22, and a first three-way valve 23. The first port of the first three-way valve 23 is connected to the first nitrogen inlet pipe 21, the second port of the first three-way valve 23 is connected to the bottom of the raw liquid storage bottle 10 via a pipe, and the third port of the first three-way valve 23 is connected to the top of the evaporation device 30 via a pipe. The second nitrogen inlet pipe 22 is connected to the top of the raw liquid storage bottle 10. Nitrogen gas is introduced into the raw liquid storage bottle 10 through the second nitrogen inlet pipe 22, increasing the internal pressure of the raw liquid storage bottle 10 and forcing the hydrofluoric acid raw liquid in the raw liquid storage bottle 10 through the first three-way valve 23 into the evaporation device 30, where it is dispersed into fine droplets by the nitrogen gas in the first nitrogen inlet pipe 21.
[0058] In one embodiment, reference Figure 2 The spraying device includes a peristaltic pump 24, a first three-way valve 23, and a first nitrogen inlet pipe 21. The first port of the first three-way valve 23 is connected to the first nitrogen inlet pipe 21, the second port of the first three-way valve 23 is connected to one end of the peristaltic pump 24, the other end of the peristaltic pump 24 is connected to the bottom of the stock solution storage bottle 10, and the third port of the first three-way valve 23 is connected to the top of the evaporation device 30 via a pipe. The peristaltic pump 24 transports the hydrofluoric acid stock solution from the bottom of the stock solution storage bottle 10 to the top of the evaporation device 30, where it is dispersed into fine droplets by nitrogen gas from the first nitrogen inlet pipe 21.
[0059] The top of the evaporator 30 is also connected to a third nitrogen inlet pipe 31. The nitrogen gas introduced through the third nitrogen inlet pipe 31 serves as the carrier gas for hydrogen fluoride gas, transporting the hydrogen fluoride gas to the next process. The solid packing inside the evaporator 30 has a spherical structure and the solid packing is in close contact with each other. A weighing device 32 is provided at the bottom of the evaporator 30, and the weighing device 32 detects the weight of the evaporator 30 in real time.
[0060] The first buffer bottle 40 is connected to the top of the evaporation device 30. The hydrogen fluoride gas in the evaporation device 30 passes through the first buffer bottle 40 before entering the next process. A reflux pipe 41 is provided between the first buffer bottle 40 and the raw liquid storage bottle 10. The reflux pipe 41 is connected to the bottom of the first buffer bottle 40 and the top of the raw liquid storage bottle 10, respectively. The reflux pipe 41 recovers the condensate at the bottom of the first buffer bottle 40 into the raw liquid storage bottle 10.
[0061] The top of the first buffer bottle 40 is connected to a fourth nitrogen inlet pipe 42. The nitrogen gas introduced through the fourth nitrogen inlet pipe 42 is at a temperature lower than the target temperature of the hydrogen fluoride gas when processing wafer devices. It is understood that replacing the fourth nitrogen inlet pipe 42 with a heat exchange device installed on the first buffer bottle 40 can also effectively reduce the temperature of the hydrogen fluoride gas, while also minimizing water vapor condensation in the first buffer bottle. Otherwise, as the hydrogen fluoride gas gradually cools down during its journey, water vapor will condense in the pipes or equipment, causing corrosion.
[0062] The first port of the second three-way valve 50 is connected to the top of the first buffer bottle 40, the second port of the second three-way valve 50 is connected to the second buffer bottle 60, the third port of the second three-way valve 50 is connected to the air inlet of the wafer processing device 70 in the subsequent process, and the air outlet of the wafer processing device 70 is connected to the second buffer bottle 60.
[0063] The vacuum device 90 is connected to the second buffer bottle 60. The gas in the second buffer bottle 60 is discharged to the outside through the vacuum device 90 and enters the exhaust gas discharge channel. The vacuum device 90 helps the gas flow and evaporate.
[0064] The dehydration tube 80 is disposed between the first buffer bottle 40 and the second three-way valve 50. The dehydration tube 80 absorbs water vapor from the hydrogen fluoride gas, thereby controlling the amount of water vapor entering the wafer processing apparatus 70.
[0065] The present invention also discloses a semiconductor processing technology, comprising the following steps:
[0066] S1, open the first nitrogen inlet pipe and the third nitrogen inlet pipe to the appropriate inlet speed to purge the device;
[0067] S2, turn on the evaporation device to preheat to the set temperature, and at the same time turn on all other gases and supporting devices according to the set conditions to reach a stable state;
[0068] S3, after confirming that all parameters are correct, turn on the spray device to send the hydrofluoric acid stock solution in the stock solution storage bottle into the evaporation device, automatically adjust the power of the evaporation device to keep the inner cavity of the evaporation device at a constant temperature until the weighing module reading stabilizes.
[0069] S4, adjust the nitrogen flow rate of the first, third, and fourth nitrogen inlet pipes to control the concentration and flow rate of hydrogen fluoride gas in the wafer processing unit.
[0070] S5. After the wafer processing is completed, first turn off the spray device and stop transporting hydrofluoric acid stock solution into the evaporation device;
[0071] S5 automatically adjusts the power of the evaporator to maintain a constant temperature inside the evaporator until the weighing module reading stabilizes. Then, it shuts off all other gases, auxiliary devices, and heaters except for the first and third nitrogen inlet pipes.
[0072] S6, nitrogen gas continues to be introduced into the first nitrogen inlet pipe and the third nitrogen inlet pipe for purging until sufficient time is met and the evaporator is cooled to a safe temperature.
[0073] S7, shut off the first nitrogen inlet line and the third nitrogen inlet line.
[0074] The weighing device monitors the change in the weight of the hydrofluoric acid stock solution in the evaporation device in real time. If the weight of the hydrofluoric acid stock solution exceeds the set value, the heating temperature of the evaporation device is increased to improve the evaporation rate of the hydrofluoric acid.
[0075] When the wafer processing unit requires maintenance, close the interface on the second three-way valve connected to the wafer processing unit, and open the interface on the second three-way valve to the second buffer bottle to allow gas to escape without passing through the wafer processing unit.
[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0077] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications and variations to the above embodiments within the scope of the present invention.
Claims
1. A semiconductor processing apparatus, characterized in that, Includes raw material storage bottles, spraying devices, and evaporation devices. The stock solution of hydrofluoric acid is sealed and stored in the stock solution storage bottle. The spraying device connects the stock solution storage bottle and the evaporation device. The spraying device transports the hydrofluoric acid stock solution from the stock solution storage bottle to the top of the evaporation device and sprays it downwards. The spraying range of the hydrofluoric acid stock solution extends to the inner wall of the evaporation device. The lower middle part of the evaporation device is filled with solid filler, and an electric heating jacket is provided on the outer wall of the evaporation device. The electric heating jacket heats the inner cavity of the evaporation device and the solid filler. The hydrofluoric acid stock solution is completely evaporated into hydrogen fluoride gas and water vapor before falling from the top of the inner cavity of the evaporation device to the bottom of the inner cavity.
2. The semiconductor processing apparatus according to claim 1, characterized in that, The spraying device includes a first nitrogen inlet pipe, a second nitrogen inlet pipe, and a first three-way valve. The first port of the first three-way valve is connected to the first nitrogen inlet pipe, the second port of the first three-way valve is connected to the bottom of the raw liquid storage bottle via a pipe, and the third port of the first three-way valve is connected to the top of the evaporation device via a pipe. The second nitrogen inlet pipe is connected to the top of the stock solution storage bottle. The second nitrogen inlet pipe introduces nitrogen into the raw liquid storage bottle, increasing the internal pressure of the raw liquid storage bottle and forcing the hydrofluoric acid raw liquid in the raw liquid storage bottle through the first three-way valve into the evaporation device, where it is then blown into fine droplets by the nitrogen in the first nitrogen inlet pipe.
3. The semiconductor processing apparatus according to claim 1, characterized in that, The spraying device includes a peristaltic pump, a first three-way valve, and a first nitrogen inlet pipeline. The first port of the first three-way valve is connected to the first nitrogen inlet pipe, the second port of the first three-way valve is connected to one end of the peristaltic pump, the other end of the peristaltic pump is connected to the bottom of the stock solution storage bottle, and the third port of the first three-way valve is connected to the top of the evaporation device via a pipe. The peristaltic pump transports the hydrofluoric acid stock solution from the bottom of the stock solution storage bottle to the top of the evaporation device, where it is dispersed into fine droplets by nitrogen gas in the first nitrogen gas inlet pipe.
4. The semiconductor processing apparatus according to claim 2 or 3, characterized in that, The top of the evaporation device is also connected to a third nitrogen inlet pipe. The nitrogen gas introduced through the third nitrogen inlet pipe serves as a carrier gas for hydrogen fluoride gas, transporting the hydrogen fluoride gas to the subsequent process. The solid packing material inside the evaporation device has a spherical structure and the solid packing material is in close contact with each other. The bottom of the evaporation device is equipped with a weighing device, which monitors the weight of the evaporation device in real time.
5. The semiconductor processing apparatus according to claim 1, characterized in that, It also includes a first buffer bottle, which is connected to the top of the evaporation device. The hydrogen fluoride gas in the evaporation device passes through the first buffer bottle before entering the next process. A reflux pipe is provided between the first buffer bottle and the original liquid storage bottle. The reflux pipe is connected to the bottom of the first buffer bottle and the top of the original liquid storage bottle, respectively. The reflux pipe recovers the condensate at the bottom of the first buffer bottle into the original liquid storage bottle.
6. The semiconductor processing apparatus according to claim 5, characterized in that, The top of the first buffer bottle is connected to a fourth nitrogen inlet pipe, and the nitrogen gas introduced through the fourth nitrogen inlet pipe is at a temperature lower than the target temperature of hydrogen fluoride gas when processing wafer devices.
7. The semiconductor processing apparatus according to claim 5, characterized in that, It also includes a second three-way valve, a second buffer bottle, and a wafer processing unit. The first port of the second three-way valve is connected to the top of the first buffer bottle, the second port of the second three-way valve is connected to the second buffer bottle, the third port of the second three-way valve is connected to the air inlet of the wafer processing device in the subsequent process, and the air outlet of the wafer processing device is connected to the second buffer bottle.
8. The semiconductor processing apparatus according to claim 7, characterized in that, It also includes a vacuum pumping device. The vacuum pumping device is connected to the second buffer bottle, and the gas in the second buffer bottle is discharged outward through the vacuum pumping device into the exhaust gas emission channel.
9. The semiconductor processing apparatus according to claim 7, characterized in that, It also includes a dehydration tube, which is disposed between the first buffer bottle and the second three-way valve. The dehydration tube absorbs water vapor from the hydrogen fluoride gas to control the amount of water vapor entering the wafer processing device.
10. A semiconductor processing process employing the semiconductor processing apparatus as described in any one of claims 1-9, characterized in that, Includes the following steps: S1, open the first nitrogen inlet pipe and the third nitrogen inlet pipe to the appropriate inlet speed to purge the device; S2, turn on the evaporation device to preheat to the set temperature, and at the same time turn on all other gases and supporting devices according to the set conditions to reach a stable state; S3, after confirming that all parameters are correct, turn on the spray device to send the hydrofluoric acid stock solution in the stock solution storage bottle into the evaporation device, and automatically adjust the power of the evaporation device to keep the inner cavity of the evaporation device at a constant temperature until the weighing module reading stabilizes. S4, adjust the nitrogen flow rate of the first, third, and fourth nitrogen inlet pipes to control the concentration and flow rate of hydrogen fluoride gas in the wafer processing unit. S5. After the wafer processing is completed, first turn off the spray device and stop transporting hydrofluoric acid stock solution into the evaporation device; S5 automatically adjusts the power of the evaporator to maintain a constant temperature inside the evaporator until the weighing module reading stabilizes. Then, it shuts off all other gases, auxiliary devices, and heaters except for the first and third nitrogen inlet pipes. S6, nitrogen gas continues to be introduced into the first nitrogen inlet pipe and the third nitrogen inlet pipe for purging until sufficient time is met and the evaporator is cooled to a safe temperature. S7, shut off the first nitrogen inlet line and the third nitrogen inlet line.