Lifting device with double adsorption gas path and die bonding apparatus

Abstract

This invention discloses a lifting device and die bonding equipment with dual adsorption gas paths. The lifting device is fixed on a lifting base and includes two independent adsorption gas paths: a first adsorption gas path: the gas groove on the top cap communicates with the cavity inside the sleeve through the lifting hole, and the cavity communicates with an external suction device through an air extraction hole provided on the lifting base; a second adsorption gas path: the gas groove on the top cap communicates with the external suction device through a negative pressure channel provided between the top cap and the sleeve, and the negative pressure channel is opened inside the sleeve wall; the first and second adsorption gas paths operate independently or together, forming a negative pressure area at the gas groove on the top cap to adsorb the bottom film of the attached chip.

Description

Technical Field

[0001] This invention relates to the field of chip die bonding equipment technology, and specifically to a lifting device with dual adsorption gas paths and a die bonding device using the lifting device. Background Technology

[0002] Die bonding refers to a process in which a chip is bonded to a designated area on a substrate using an adhesive, forming a thermal or electrical path to facilitate subsequent wire bonding. Before being bonded to the substrate, the chip is attached to a substrate film. The die bonding process typically includes a suction nozzle and a lifting structure. The lifting structure lifts the chip to initially separate it from the substrate film, while the suction nozzle picks up the chip and completely separates it from the substrate film. In existing technology, the lifting structure usually includes a lifting block and a cylinder. The extension end of the cylinder is connected to the lifting block, allowing the cylinder to drive the lifting block to lift a portion of the substrate film from bottom to top, correspondingly lifting the chip on that substrate film to achieve initial separation of the chip from the substrate film. To accommodate chip handling, current die bonding equipment is categorized based on the lifting method: multi-stage lifting devices and single-stage lifting devices. See Chinese invention patent application with patent document number CN115954317A, which is an early application of the applicant and discloses a multi-stage lifting structure and a die-bonding device.

[0003] To ensure effective separation of the chip from the substrate, the lifting device employs negative pressure adsorption (vacuum adsorption) to firmly attach the substrate with the chip attached to the working platform surface. Conventional negative pressure adsorption typically involves creating evenly distributed air holes on the lifting device's working platform. An external air extraction device (such as an air pump) then creates negative pressure on the platform, thereby achieving stable adsorption of the substrate with the chip attached.

[0004] To reduce the number of components, current negative pressure adsorption air paths are usually limited to one and are located directly inside the lifting device. However, a single adsorption air path may result in insufficient adsorption force generated by the working platform due to obstruction or other reasons, making it impossible for the bottom film to be stably adsorbed.

[0005] To address the above problems, the inventors propose the following technical solutions. Summary of the Invention

[0006] The first technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and improve the existing die bonding equipment, thereby proposing a lifting device with dual adsorption gas paths, which forms a negative pressure area in the top cap by dual adsorption working independently or together to stably adsorb the bottom film of the attached chip.

[0007] To solve the first technical problem mentioned above, the present invention adopts the following technical solution: The lifting device is fixed on the lifting base and includes: a top cap, a pushing module, and a sleeve. The top cap is fixed at the top opening of the sleeve and has a lifting hole and air grooves distributed around and communicating with the lifting hole. The pushing module is installed in the cavity inside the sleeve and has a lifting block that is driven by a push rod and can be exposed from the lifting hole. The lifting device includes two independent adsorption air paths: a first adsorption air path: the air groove on the top cap communicates with the cavity inside the sleeve through the lifting hole, and the cavity communicates with an external air extraction device through an air extraction hole provided on the lifting base; a second adsorption air path: the air groove on the top cap communicates with the external air extraction device through a negative pressure channel provided between the top cap and the sleeve, and the negative pressure channel is opened inside the sleeve wall; the first adsorption air path and the second adsorption air path operate independently or together to form a negative pressure area at the air groove on the top cap to adsorb the bottom film of the attached chip.

[0008] Furthermore, in the above technical solution, in the first adsorption gas path, there is a gap between the lifting hole and the lifting block, through which the gas groove of the top cap and the cavity inside the sleeve are connected.

[0009] Furthermore, in the above technical solution, in the second adsorption gas path, the inner surface of the top cap is provided with a through hole or channel corresponding to the position of the negative pressure channel on the sleeve. The top opening of the negative pressure channel is connected to the gas groove through the through hole or channel; the bottom opening of the negative pressure channel is connected to an external air extraction device; when the external air extraction device is working, the gas groove uses the negative pressure channel to form negative pressure adsorption.

[0010] Furthermore, in the above technical solution, the air groove on the top cap includes: an adsorption air groove distributed around the periphery of the lifting hole, and a connecting air groove; the connecting air groove connects all the adsorption air grooves to the lifting hole; the top opening of the negative pressure channel is connected to the connecting air groove.

[0011] Furthermore, in the above technical solution, at least two negative pressure channels are provided inside the sleeve wall.

[0012] Furthermore, in the above technical solution, the push module includes: a lifting block, a heating device, a base, and a push rod connected to the base; the lifting block is heated by the heat generated by the heating device; the upper end of the push rod is fixedly connected to the base, and a cable channel is opened in the push rod along the axial direction, through which the cable electrically connected to the heating device passes; the heating device is integrally formed in the lifting block, or the heating device is built into a heating block.

[0013] Furthermore, in the above technical solution, the push rod forms a hollow rod body through the cable channel, and the push rod air passages distributed around the cable channel are opened axially in the push rod wall, and push rod air passage vents communicating with the push rod air passages are respectively opened on the side wall surfaces at the upper and lower ends of the push rod.

[0014] Furthermore, in the above technical solution, the top rod is fixedly connected to the base body by fixing its upper end cold air block, and the top of the cold air block has a cold air block through hole corresponding to the cable channel; the side wall surface of the cold air block has a cold air block air hole corresponding to the air hole of the top rod air channel, and the base body has a connecting channel corresponding to the cold air block air hole.

[0015] Furthermore, in the above technical solution, the lifting device also includes two independent cooling air paths: the first cooling air path includes a push rod air passage opened inside the push rod, a cavity inside the sleeve, and a seat connecting air passage opened on the base. External cooling gas flows along the push rod air passage, the seat connecting air passage, the cavity, and the air extraction hole opened on the lifting base to achieve cooling of the flow area; the second cooling air path includes a sleeve channel opened in the inner wall of the sleeve, and the sleeve channel is connected to the air hole on the lifting base. External cooling gas flows through the second cooling air path to achieve cooling of the top cap and the sleeve.

[0016] The second technical problem to be solved by this invention is the crystal bonding equipment designed with the aforementioned dual-adsorption gas path lifting device. The crystal bonding equipment employs the dual-adsorption gas path lifting device described in the above technical solution.

[0017] By adopting the above technical solution, the present invention has the following advantages over the prior art: The present invention sets up two independent adsorption gas paths in the lifting device: a first adsorption gas path and a second adsorption gas path. The two adsorption gas paths can operate independently or together, forming a negative pressure area at the air groove on the top cap to adsorb the bottom film of the attached chip. Users can choose according to different working scenarios. For example, when the adsorption area is large, the two adsorption gas paths can work simultaneously; when the adsorption area is small, one of the adsorption gas paths can be selected to work. After the adsorption operation is completed, the external air extraction device stops working, and the negative pressure in the air groove returns to normal. Attached Figure Description

[0018] Figure 1 This is a perspective view of the die bonding device of the present invention;

[0019] Figure 2 This is an exploded perspective view of the lifting device and lifting base of the present invention.

[0020] Figure 3 This is a longitudinal sectional view of the lifting device in this invention;

[0021] Figure 4 yes Figure 2Exploded view of the 3D model after removing the sleeve and top cap;

[0022] Figure 5 This is a perspective view of the push-pull module in this invention;

[0023] Figure 6 This is a perspective view of the push rod in this invention;

[0024] Figure 7 This is a schematic diagram of the dual adsorption gas path in this invention;

[0025] Figure 8 This is an exploded perspective view of the sleeve and top cap parts in this invention. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0027] The die bonding equipment and lifting device provided in the embodiments of the present invention are described below with reference to the accompanying drawings.

[0028] See Figure 1 , Figure 2 As shown, this is the die bonding apparatus of the present invention. The die bonding apparatus includes, from top to bottom, a lifting device 100, a lifting base 200, and a driving device 300. Its working principle is the same as that of the prior art. The bottom film carrying the chip covers the top surface of the lifting device 100. The driving device 300 drives the push rod in the lifting device 100 to rise, thereby lifting the bottom film of the chip and separating the chip from the bottom film.

[0029] The lifting device 100 is fixed on the lifting base 200, combined with Figure 2 As shown, the lifting device 100 includes: a top cap 1, a pushing module 2, and a sleeve 3. The top cap 1 is fixed to the top opening of the sleeve 3, and a lifting hole 11 is provided on the top cap 1.

[0030] Combination Figures 3 to 8 As shown, the push-up module 2 is installed in the cavity 30 inside the sleeve 3. The entire push-up module 2 is fixed to the upper end of the push rod 20. The drive device 300 is connected to the lower end of the push rod 20, driving the push rod 20 to rise, thereby driving the entire push-up module 2 to rise, causing the lifting block 21 to extend from the lifting hole 11 on the top cap 1, thereby completing the lifting action of the corresponding chip, lifting the bottom film of the chip, and realizing the separation of the chip on the bottom film from the bottom film.

[0031] The push module 2 includes a lifting block 21, which is located at the top of the entire push module 2 and has a boss 211 that is adapted to the lifting hole 11.

[0032] In a preferred embodiment of the present invention, the push-up module 2 may be provided with a heating block 22, which is fixed below the lifting block 21. A heating device and a temperature sensing element are disposed within the heating block 22. The heating device and the temperature sensing element are electrically connected to the electronic control unit of the die bonding equipment of the present invention via a cable 220, and the heating temperature of the heating block 22 is controlled by the electronic control unit. When the heating block 22 is working, the heat it generates is directly conducted to the upper lifting block 21, and finally heats the chip area above through the boss 211. Alternatively, the heating block 22 may be integrally manufactured with the lifting block 21, directly integrating the heating device and the temperature sensing element inside the lifting block 21.

[0033] In a preferred embodiment of the present invention, a transfer cavity seat 24 is provided below the lifting block 21. Specifically, the lifting block 21, the heating block 22, and the transfer cavity seat 24 can be integrally fixed by bolts. The transfer cavity seat 24 is hollow, forming a transfer cavity 240 inside, and a wire hole 241 is provided on the side wall of the transfer cavity seat 24. The cable 220 of the heating block 22 can extend into the transfer cavity 240 through the wire hole 241, and finally pass through the hollow top rod 20 to be electrically connected to the electrical control unit of the die bonding equipment.

[0034] The adapter cavity 24 of this invention can not only serve as a channel for the cable 220, but its hollow structure can also provide heat insulation, thus isolating the heating block 22 from other components below and preventing the heat generated by the heating block 22 from being transferred downwards rapidly.

[0035] To further improve the heat insulation effect, a heat insulation block 25 can be provided between the bottom of the adapter cavity seat 24 and the seat body 23. The heat insulation block 25 can be made of high-temperature resistant plastic material. The heat insulation block 25 further isolates the temperature. A connecting hole 250 is provided on the heat insulation block 25 to connect to the adapter cavity 240. After the cable 220 extending into the adapter cavity 240 is inserted through the connecting hole 250, it continues downward into the hollow top rod 20.

[0036] The push-up module 2 includes a base 23, which is fixed below the heat insulation block 25. Specifically, the adapter cavity seat 24, the heat insulation block 25, and the base 23 can be integrally fixed from top to bottom using bolts, connecting rods, and other components. The base 23 has a hollow structure, with a base connecting channel 231 on its side wall that horizontally connects to its internal cavity. Simultaneously, a base through hole 230 is vertically formed at the top of the base 23, communicating with the connecting hole 250 on the heat insulation block 25. The cable 220 extending into the adapter cavity 240 passes through the connecting hole 250 and continues downward, passing through the base through hole 230 before finally entering the hollow push rod 20.

[0037] Combination Figure 6 As shown, the top rod 20 has a hollow structure, with a through cable channel 202 extending axially inside. The cable electrically connected to the heating block 22 will ultimately pass through the cable channel 202 to connect to the electrical control unit of the die bonding equipment. In this way, the cable 220 is routed from inside the lifting device through the cable channel 202 without affecting the lifting operation of the lifting device.

[0038] The push rod 20 has several push rod air channels 201 formed along the axial direction on its side wall. These push rod air channels 201 are distributed around the cable channel 202, and push rod air channel vents 2011 communicating with the push rod air channels 201 are respectively formed on the side wall surfaces at the upper and lower ends of the push rod 20. In actual production, at least a countersunk hole channel can be machined along the axial direction on the side wall of the push rod 20 first, then the push rod air channel vents 2011 can be formed at appropriate positions on the side wall of the push rod 20, and finally the open end of the countersunk hole channel can be sealed.

[0039] Combination Figure 3 , Figure 4 As shown, to facilitate the connection of the air passage, a cooling block 26 is fixed to the upper end of the push rod 20. The cooling block 26 fixes the base 23 to the push rod 20, and simultaneously connects the push rod air passage 201 to the base communication channel 231. Specifically, the cooling block 26 is sleeved on the upper end of the push rod 20, and its top has a cooling block through hole 260 that corresponds to and communicates with the cable channel 202 in the push rod 20. The base 23 is sleeved on the cooling block 26.

[0040] The side wall surface of the cold air block 26 is provided with a cold air block air hole 261 corresponding to the air hole 2011 of the top rod air passage, and the position of the cold air block air hole 261 corresponds to the position of the seat body connecting channel 231, so that the top rod air passage 201 passes through the top rod air passage air hole 2011, the cold air block air hole 261, and the seat body connecting channel 231 in sequence, and then connects with the cavity 30 inside the sleeve 3.

[0041] The side wall surface of the cooling block 26 is provided with a threaded hole 263. The fastening screw passes through the side wall of the seat 23 and the threaded hole 263 in sequence and then abuts against the surface of the central top rod 20, so that the seat 23, the cooling block 26 and the rod 20 are connected without relative rotation. Finally, the seat 23 is fixed to the rod 20 by a locking nut 27.

[0042] To ensure a good seal, a sealing groove 262 is provided on the surface of the air block 26. A sealing ring is provided in the sealing groove 262 to seal the surface of the air block 26 and the inner cavity of the seat 23, ensuring that gas will not leak from the air block 26 and the inner cavity of the seat 23.

[0043] Combination Figure 7 As shown, in this embodiment, the top cap 1 is a circular plate with air grooves 12 on its surface. A countersunk hole 311 is formed on the wall of the sleeve 3, and the top cap 1 is fixed to the top surface of the sleeve 3 by screws connected to the countersunk hole 311. The bottom of the sleeve 3 is fixed to the lifting base 200, combined with... Figure 4 As shown, the lifting base 200 includes: a base sleeve 5 through which the lifting rod 20 passes, and a locking nut 6 for fixing the lower part of the sleeve 3 to the base sleeve 5. The base sleeve 5 is provided with an air extraction hole 51, which is connected to an external air extraction device to realize the vacuuming operation of the internal cavity 30 of the sleeve 3.

[0044] The sleeve 3 also has a negative pressure channel 312 and a sleeve channel 313 on its cylindrical wall. An air hole is made on the bottom surface of the top cap 1 at the position corresponding to the negative pressure channel 312, and the air hole is connected to the air groove 12. During operation, the air passage for evacuation is connected to the internal cavity 30 of the sleeve 3, so that the air groove 12 forms a negative pressure area, thereby adsorbing the chip.

[0045] The sleeve channel 313 serves as an air passage for cooling the sleeve 3 and the top cap 1. An air passage is opened at the position of the sleeve channel 313 corresponding to the bottom surface of the top cap 1. Corresponding air holes are opened on the base sleeve 5 at the positions corresponding to the negative pressure channel 312 and the sleeve channel 313.

[0046] The adsorption method and cooling method in this invention will be described below.

[0047] The adsorption principle of this invention is to create a negative pressure zone on the surface of the top cap 1 using the air grooves 12, thereby achieving the adsorption of the chip. Combined with... Figure 7 As shown, the lifting device of the present invention includes two independent adsorption gas paths:

[0048] First adsorption gas path:

[0049] The air groove 12 on the top cap 1 is connected to the cavity 30 inside the sleeve 3 through the lifting hole 11. The cavity 30 is connected to an external suction device through an air extraction hole on the lifting base 200. Specifically, the path of the first adsorption air path is: air groove 12 – lifting hole 11 – cavity 30 – air extraction hole 51. Its working principle is as follows: there is a certain gap between the lifting hole 11 and the lifting block 21, and the air groove 12 is connected to the lifting hole 11. When the suction device starts to evacuate, the air extraction hole 51 on the base sleeve 5 evacuates the cavity 30 inside the sleeve 3. The air groove 12 forms a negative pressure adsorption through the lifting hole 11.

[0050] In a preferred embodiment of the present invention, in the first adsorption gas path, there is a gap between the lifting hole 11 and the boss 211 of the lifting block 21, that is, the two adopt a gap fit, and the air groove of the top cap and the cavity inside the sleeve are connected through the gap. Of course, several grooves can also be formed directly on the inner wall of the lifting hole 11 or the side wall of the boss 211 to form a channel connecting the air groove and the cavity inside the sleeve.

[0051] Second adsorption gas path:

[0052] The air groove 12 of the top cap 1 is connected to an external air extraction device through a negative pressure channel 312 located between the top cap 1 and the sleeve 3. The negative pressure channel 312 is located inside the sleeve 3. Specifically, the path of the second adsorption air path is: air groove 12 – negative pressure channel 312. Its working principle is as follows: a through hole or channel is provided on the inner surface of the top cap 1 corresponding to the position of the negative pressure channel 312 on the sleeve 3. The top opening of the negative pressure channel 312 is connected to the air groove 12 through this through hole or channel. The bottom opening of the negative pressure channel 312 is directly connected to the external air extraction device through an air path. When the external air extraction device starts working, the air groove 12 utilizes the negative pressure channel 312 to form negative pressure adsorption.

[0053] Combination Figure 8 As shown, the air groove 12 on the top cap includes: adsorption air grooves 121 distributed around the periphery of the lifting hole 11, and a connecting air groove 122; the connecting air groove 122 connects all the adsorption air grooves 121 to the lifting hole 11; the top opening of the negative pressure channel 312 is connected to the connecting air groove 122. In actual production, in order to achieve this, a through hole 1220 can be opened at the end of the connecting air groove 122 corresponding to the position of the top opening of the negative pressure channel 312.

[0054] The first and second adsorption gas paths described above can operate independently or together, creating a negative pressure area at the gas groove on the top cap to adsorb the bottom film of the attached chip, thus adapting to different working scenarios. After the adsorption operation is completed, the external air extraction device stops working, and the negative pressure in the gas groove 12 returns to normal.

[0055] The present invention cools and dissipates heat from the lifting device through the first cooling air path and the second cooling air path, so as to eliminate the heat generated by the heating block 22 during operation.

[0056] First cooling air path:

[0057] The first cooling air path is mainly for cooling and dissipating heat from the top cap 1. Combined with... Figure 8 As shown, it includes sleeve channels 313 disposed on the sleeve 3. Typically, a plurality of sleeve channels 313 can be formed in the inner wall of the sleeve 3. These sleeve channels 313 can be connected in series to form a channel, or at least two sleeve channels 313 can be connected in parallel to form several channels. During operation, the cooling medium enters from the bottom opening of the sleeve channel 313 at the beginning, passes through the sleeve channel 313 connected to it, and exits from the bottom opening of the sleeve channel at the end. After passing through the sleeve channel, the cooling medium carries away heat, thereby cooling and dissipating heat from the top cap 1.

[0058] To allow the cooling medium to flow directly through the top cap 1, the structure of the second adsorption gas path described above is adopted. Specifically, a through hole or channel is provided on the inner surface of the top cap 1 at the position corresponding to the sleeve channel 313. The top opening of the sleeve channel 313 is connected in series or parallel through this through hole or channel. During operation, after passing through the sleeve channel 313, the cooling medium also flows through the through hole or channel through the top cap 1, thereby directly carrying away the heat from the top cap 1 and thus cooling and dissipating heat.

[0059] The cooling medium is typically compressed air, but liquid cooling media can also be used. The operation of the liquid cooling medium is controlled by an externally installed pump.

[0060] Preferably, the cooling medium in this invention is compressed air, and it can share an air extraction device with the second adsorption gas path described above. The first cooling gas path and the second adsorption gas path are controlled by electronic valves.

[0061] Of course, the first cooling air path mentioned above not only cools and dissipates heat from the top cap 1, but also dissipates heat from the sleeve 3.

[0062] Second cooling air path:

[0063] The second cooling air path is used to dissipate heat from the cavity 30 and related internal components. It includes: a push rod air passage 201 opened inside the push rod 20, the cavity 30, and a seat connecting channel 231 opened on the seat 23. During operation, the external vacuum device starts working, and the air extraction hole 51 on the base sleeve 5 evacuates the cavity 30 inside the sleeve 3. Externally cooled compressed gas enters from the push rod air passage 2011 below the push rod 20, passes through the push rod air passage 201, and then enters the cavity 30 through the push rod air passage 2011 above the push rod 20 and the seat connecting channel 231. The air extraction hole 51 discharges the gas into the cavity 30 inside the sleeve 3. The cooling gas cools the area it flows through, effectively reducing the internal temperature of the entire cavity 30.

[0064] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent changes or modifications made to the structure, features and principles described in the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A lifting device with dual adsorption gas paths, the lifting device being fixed on a lifting base, comprising: The sleeve comprises a top cap, a pushing module, and a sleeve. The top cap is fixed to the top opening of the sleeve and has a lifting hole and air grooves distributed around and communicating with the lifting hole. The pushing module is installed in a cavity inside the sleeve and has a lifting block driven by a push rod and visible from the lifting hole. The sleeve is characterized by: The lifting device includes two independent adsorption gas paths: First adsorption gas path: The gas groove on the top cap is connected to the cavity inside the sleeve through the lifting hole, and the cavity is connected to the external air extraction device through the air extraction hole provided on the lifting base. Second adsorption gas path: The gas groove of the top cap is connected to the external air extraction device through a negative pressure channel set between the top cap and the sleeve. The negative pressure channel is opened inside the sleeve wall. The first and second adsorption gas paths can operate independently or together, forming a negative pressure area at the gas groove on the top cap to adsorb the bottom film of the attached chip.

2. The lifting device with dual adsorption gas paths according to claim 1, characterized in that: In the first adsorption gas path, there is a gap between the lifting hole and the lifting block, through which the gas groove of the top cap and the cavity inside the sleeve are connected.

3. The lifting device with dual adsorption gas paths according to claim 1, characterized in that: In the second adsorption gas path, the inner surface of the top cap is provided with a through hole or channel corresponding to the position of the negative pressure channel on the sleeve. The top opening of the negative pressure channel is connected to the gas groove through the through hole or channel. The bottom opening of the negative pressure channel is connected to the external air extraction device. When the external air extraction device is working, the gas groove uses the negative pressure channel to form negative pressure adsorption.

4. The lifting device with dual adsorption gas paths according to claim 3, characterized in that: The air grooves on the top cap include: adsorption air grooves distributed around the periphery of the lifting hole, and connecting air grooves; the connecting air grooves connect all the adsorption air grooves to the lifting hole; the top opening of the negative pressure channel is connected to the connecting air grooves.

5. The lifting device with dual adsorption gas paths according to claim 3, characterized in that: At least two negative pressure channels are provided inside the sleeve wall.

6. The lifting device with dual adsorption gas paths according to claim 1, characterized in that: The aforementioned push module includes: a lifting block, a heating device, a base, and a push rod connected to the base; the lifting block is heated by the heat generated by the heating device. The upper end of the top rod is fixedly connected to the base body, and a cable channel is provided in the top rod along the axial direction. The cable electrically connected to the heating device passes through the cable channel. The heating device is integrally formed within the lifting block, or the heating device is built into a heating block.

7. The lifting device with dual adsorption gas paths according to claim 6, characterized in that: The push rod forms a hollow rod body through the cable channel. The push rod air passages distributed around the cable channel are opened axially in the push rod wall, and push rod air passage vents communicating with the push rod air passages are respectively opened on the side wall surfaces at the upper and lower ends of the push rod.

8. The lifting device with dual adsorption gas paths according to claim 6, characterized in that: The top rod is fixedly connected to the base by fixing its upper end cold air block. The top of the cold air block has a cold air block through hole corresponding to the cable channel. The side wall surface of the cold air block has a cold air block air hole corresponding to the air hole of the top rod air channel. The base has a connecting channel corresponding to the cold air block air hole.

9. The lifting device with dual adsorption gas paths according to claim 1, characterized in that: The lifting device also includes two independent cooling air paths: The first cooling air path includes the push rod air passage opened inside the push rod, the cavity inside the sleeve, and the seat connecting air passage opened on the seat body. External cooling gas flows along the push rod air passage, the seat connecting air passage, the cavity, and the air extraction hole opened on the lifting base to achieve cooling of the flow area. The second cooling air passage includes a sleeve channel opened in the inner wall of the sleeve, and the sleeve channel is connected to the air hole on the lifting base. External cooling gas flows through the second cooling air passage to cool the top cap and the sleeve.

10. A die bonding apparatus, including a lifting device, characterized in that: The lifting device is the lifting device with dual adsorption air passages as described in any one of claims 1-9.

Images