Packaging structure and packaging method

Abstract

A packaging structure and packaging method are disclosed. The packaging structure includes a molding compound extending through the side of a first component and located between the front side of a carrier board and a second component. Each conductive connection structure includes one or more first connection portions connected to the front side of the carrier board, and a second connection portion stacked on the first connection portions and connected to the second component. A step is formed at the interface between the second and first connection portions. Because a step is formed at the interface between the second and first connection portions, the cross-sectional area of ​​the conductive connection structure near the second component in the packaging structure is increased, correspondingly increasing the average cross-sectional area of ​​the conductive connection structure. This helps to reduce the thermal resistance of the packaging structure, improve the heat dissipation effect, and also helps to reduce the contact resistance between the second component and the carrier board, thereby improving the electrical performance of the packaging structure.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a packaging structure and packaging method. Background Technology

[0002] In recent years, the semiconductor integrated circuit (IC) industry has developed rapidly. Driven by Moore's Law, semiconductor technology continues to advance towards smaller process nodes, enabling integrated circuits to develop in the direction of smaller size, higher circuit precision, and higher circuit complexity.

[0003] With the rapid development of the semiconductor industry, integrated circuit packaging products are also continuously reducing the minimum feature size to increase the integration density of various semiconductor devices. Currently, with the rapid increase in integration and power consumption, overheating has become the primary factor affecting the performance of semiconductor devices.

[0004] Improving the performance of the packaging structure has become an urgent problem to be solved. Summary of the Invention

[0005] The problem addressed by the embodiments of the present invention is to provide a packaging structure and packaging method to improve the performance of the packaging structure.

[0006] To address the aforementioned problems, this invention provides a packaging method, comprising: providing a carrier board having a front side; providing a first component and one or more conductive connection structures, the conductive connection structure including one or more first connection portions and a second connection portion stacked on the first connection portions, wherein the outer contours of the second connection portion and the first connection portion are partially aligned vertically, and at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is greater than the sum of the cross-sectional areas of the first connection portions, thereby forming a step at the interface; and distributing the first component and the first connection portion electrically connected on the front side of the carrier board. The conductive connection structure is described above, and the first connection portion of the conductive connection structure is connected to the front side of the carrier plate; after the first component and the conductive connection structure are provided, a molding compound is formed on the front side of the carrier plate, the molding compound covering the top of the first component and the step, and exposing the side of the second connection portion on the back of the conductive connection structure on the side of the first connection portion; a second component is provided; after the second component is provided and the molding compound is formed, the second component is provided on the exposed surface of the conductive connection structure so that the second connection portion is connected to the second component, and the second component is electrically connected to the carrier plate through the conductive connection structure.

[0007] Accordingly, embodiments of the present invention also provide a packaging structure method, comprising: a carrier board having a front side; a first component located on the front side of the carrier board and electrically connected to the carrier board; a molding compound located on the front side of the carrier board and covering the top of the first component; a second component located above the first component; one or more conductive connection structures penetrating the molding compound on the side of the first component and located between the front side of the carrier board and the second component; the conductive connection structure is used to electrically connect the second component to the carrier board, including one or more first connection portions connected to the front side of the carrier board, and a second connection portion stacked on the first connection portions and connected to the second component, wherein the outer contours of the second connection portion and the first connection portion are aligned vertically, and at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is larger than that of the first connection portion. Accordingly, embodiments of the present invention also provide an electronic device, including the packaging structure described in the embodiments of the present invention.

[0008] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages: The packaging method provided in this embodiment of the invention includes: providing a conductive connection structure, the conductive connection structure including one or more first connection portions and a second connection portion stacked on the first connection portion, wherein at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is greater than the sum of the cross-sectional areas of the first connection portions, so that a step is formed at the interface; and after the first component and the conductive connection structure with electrical connection are disposed on the front side of the carrier board, a plastic encapsulation layer covering the step is formed on the front side of the carrier board. Compared to the previous method of forming conductive pillars and a molding compound layer exposing the tops of the conductive pillars on the front side of the substrate, and then forming a redistribution layer connected to the conductive pillars on the conductive pillars and the molding compound layer, the present invention allows the second connection portion of the conductive connection structure for connecting to the second component to also be located on the front side of the substrate during the step of connecting the first connection portion of the conductive connection structure to the front side of the substrate. This reduces the number of process steps and lowers packaging costs. Furthermore, since a step is formed at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the conductive connection structure near the second component in the packaging structure is increased, and the average cross-sectional area of ​​the conductive connection structure is correspondingly increased. This helps to reduce the thermal resistance of the packaging structure, improve the heat dissipation effect of the packaging structure, and also helps to reduce the contact resistance between the second component and the substrate in the packaging structure, thereby improving the electrical performance of the packaging structure.

[0009] The packaging structure provided in this embodiment of the invention includes one or more conductive connection structures that penetrate the plastic encapsulation layer through the side of the first component and are located between the front side of the carrier board and the second component. Each conductive connection structure includes one or more first connection portions connected to the front side of the carrier board, and a second connection portion stacked on the first connection portion and connected to the second component. At the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is greater than the sum of the cross-sectional areas of the first connection portions, so that the interface has a step, and the step is covered by the plastic encapsulation layer. Compared with the solution where the conductive connection structure includes conductive pillars penetrating the plastic encapsulation layer and a redistribution layer located on the plastic encapsulation layer and connected to the conductive pillars, the present invention increases the cross-sectional area of ​​the conductive connection structure near the second component in the packaging structure due to the step formed at the interface between the second connection portion and the first connection portion. This correspondingly increases the average cross-sectional area of ​​the conductive connection structure, thereby reducing the thermal resistance of the packaging structure, improving the heat dissipation effect of the packaging structure, and also reducing the contact resistance between the second component and the carrier board in the packaging structure, thus improving the electrical performance of the packaging structure. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a packaging structure; Figures 2 to 8 This is a schematic diagram of the structure corresponding to each step in one embodiment of the method for forming the packaging structure of the present invention. Detailed Implementation

[0011] Currently, the performance of packaging structures still needs improvement. This paper analyzes the reasons why the performance of a particular packaging structure needs further improvement, using an example. Figure 1 It is a type of encapsulation structure.

[0012] refer to Figure 1 The packaging structure includes: a carrier board 10 having a front surface 11; a first component 12 located on the front surface 11 and electrically connected to the carrier board 10; a molding compound 13 located on the front surface 11 and covering the top of the first component 12; a second component 14 located above the first component 12; and one or more conductive connection structures 15 penetrating the molding compound 13 on the side of the first component 12 and located between the front surface 11 and the second component 14. The conductive connection structure 15 is used to electrically connect the second component 14 to the carrier board, including one or more conductive posts 16 connected to the front surface 11, and a redistribution layer 17 located on the conductive posts 16 and connected to the second component 14.

[0013] Typically, conductive posts 16 are first placed on the carrier plate 10, and then a molding compound 13 is formed to cover the top of the conductive posts 16. The molding compound 13 exposes the side of the conductive connection structure facing away from the carrier plate 10. Then, a redistribution layer 17 connected to the conductive posts 16 is formed on the conductive posts 16 and the molding compound 13.

[0014] Research has shown that this method not only makes the process of forming the conductive connection structure more complicated, but also makes it easy for the cross-section of the conductive connection structure 15 in the molding layer 13 to be too small, which in turn makes the heat dissipation performance and electrical performance of the encapsulation structure need to be improved.

[0015] To address the aforementioned technical problems, embodiments of the present invention provide an encapsulation method, comprising: providing a conductive connection structure, the conductive connection structure including one or more first connection portions and a second connection portion stacked on the first connection portions, wherein at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is greater than the sum of the cross-sectional areas of the first connection portions, so that a step is formed at the interface; and after the first component and the conductive connection structure, which are electrically connected, are disposed on the front side of the carrier board, a molding compound covering the step is formed on the front side of the carrier board. Compared to the previous method of forming conductive pillars and a molding compound layer exposing the tops of the conductive pillars on the front side of the substrate, and then forming a redistribution layer connected to the conductive pillars on the conductive pillars and the molding compound layer, the present invention allows the second connection portion of the conductive connection structure for connecting to the second component to also be located on the front side of the substrate during the step of connecting the first connection portion of the conductive connection structure to the front side of the substrate. This reduces the number of process steps and lowers packaging costs. Furthermore, since a step is formed at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the conductive connection structure near the second component in the packaging structure is increased, and the average cross-sectional area of ​​the conductive connection structure is correspondingly increased. This helps to reduce the thermal resistance of the packaging structure, improve the heat dissipation effect of the packaging structure, and also helps to reduce the contact resistance between the second component and the substrate in the packaging structure, thereby improving the electrical performance of the packaging structure.

[0016] To make the above-mentioned objects, features and advantages of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0017] Figures 2 to 8 This is a schematic diagram of the structure corresponding to each step of the method for forming the packaging structure of the present invention.

[0018] refer to Figure 2 A carrier plate 100 is provided, the carrier plate 100 having a carrier plate front side 101.

[0019] The carrier board 100 serves as a packaging carrier, providing support for the first component and the second component. Simultaneously, the carrier board 100 contains conductive lines (not shown), which are used to supply power or transmit electrical signals to the first and second components, thereby achieving the packaging and circuit integration of the first and second components.

[0020] In some embodiments, the carrier board 100 may include a printed circuit board (PCB), a package substrate, or an interposer. As an example, the carrier board 100 is a printed circuit board.

[0021] In some embodiments, during the step of providing the carrier plate 100, the carrier plate 100 further has a carrier plate back side 102 disposed opposite to the carrier plate front side 101.

[0022] refer to Figure 3 Figures 4(a) to 4(h) provide a first component 110 [e.g.] Figure 3 As shown in Figures 4(a) to 4(h)], and one or more conductive connection structures 120, each conductive connection structure 120 including one or more first connection portions 121 and a second connection portion 122 stacked on the first connection portion 121. The outer contours of the second connection portion 122 and the first connection portion 121 are partially aligned vertically. At the interface between the second connection portion 122 and the first connection portion 121, the cross-sectional area of ​​the second connection portion 122 is greater than the sum of the cross-sectional areas of the first connection portions 121, so that a step 123 is formed at the interface.

[0023] In this embodiment, Figure 4(a) is a cross-sectional view of the conductive connection structure 120, Figure 4(b) is a cross-sectional view of the frame structure 120', Figure 4(c) is a cross-sectional view of Figure 4(b) after the formation of the first groove 1223 and the second groove 1225'; Figure 4(d) is a cross-sectional view of Figure 4(c) after the formation of the metal plating layer 124, Figure 4(e) is a cross-sectional view of Figure 4(d) after bending and pressing, Figure 4(f) is a cross-sectional view of Figure 4(e) after bending and pressing, Figure 4(g) is a top view of a conductive connection structure 120 in the packaging structure method of this embodiment, and Figure 4(h) is a top view of another conductive connection structure 120 and the first component in the packaging structure method of this embodiment.

[0024] The first component is used to electrically connect with the carrier board 100, thereby providing a process basis for the subsequent formation of the corresponding packaging structure.

[0025] In some embodiments, the first component 110 includes a chip 111, or the first component 110 includes a chip 111 and a passive component 112.

[0026] Specifically, the passive element 112 includes one or both of a resistor and a capacitor.

[0027] It is understood that the number of the first component 110 can be one or more.

[0028] The conductive connection structure 120 is used to electrically connect the conductive lines in the carrier board 100 to the second component. Specifically, the side of the first connection portion 121 facing away from the second connection portion 122 is used to connect to the conductive lines on the front side 101 of the substrate, and the side of the second connection portion 122 facing away from the first connection portion 121 is used to connect to the second component. More specifically, the side of the first connection portion 121 facing away from the second connection portion 122 is used to bond to the conductive lines on the front side 101 of the substrate, and the side of the second connection portion 122 facing away from the first connection portion 121 is used to bond to the second component.

[0029] Since a step 123 is formed at the interface between the second connecting portion 122 and the first connecting portion 121, the cross-sectional area of ​​the conductive connection structure 120 on the side closer to the second component 122 in the packaging structure is increased, and the average cross-sectional area of ​​the conductive connection structure 120 is increased accordingly. This helps to reduce the thermal resistance of the packaging structure, improve the heat dissipation effect of the packaging structure, and increase the average cross-sectional area of ​​the conductive connection structure 120. It also helps to reduce the contact resistance between the second component and the carrier plate 100 in the packaging structure, and thus helps to improve the electrical performance of the packaging structure.

[0030] In some embodiments, during the step of providing the conductive connection structure 120, the number of conductive connection structures 120 is multiple, for example, the number of conductive connection structures 120 is two. In other embodiments, the number of conductive connection structures may be greater than two, for example, three, four, five, six, etc.

[0031] In some embodiments, during the step of providing the conductive connection structure 120, a metal plating layer 124 is formed on the surface of the first connection portion 121 facing away from the second connection portion 122 and on the surface of the second connection portion 122 facing away from the first connection portion 121, and the metal plating layer 124 exposes the sidewalls of the first connection portion 121 and the second connection portion 122.

[0032] The metal plating 124 improves solder wettability, thereby enhancing the bonding strength between the conductive connection structure and the front side 101 of the carrier board, and also improving the bonding strength between the conductive connection structure 120 and the second component. Furthermore, by exposing the sidewalls of the first connection portion 121 and the second connection portion 122, the metal plating 124 helps prevent it from affecting the bonding strength between either the first connection portion 121 or the second connection portion 122 and the molding compound 140.

[0033] As an example, metal plating 124 is a silver plating layer.

[0034] In some embodiments, the conductive connection structure 120 is made of a ductile metal.

[0035] When the material of the conductive connection structure 120 is a ductile metal material, the conductive connection structure 120 can be formed by bending and pressing the metal.

[0036] It should be noted that the elongation of the ductile metal is ≥10%.

[0037] As an example, the ductile metal includes one or more of copper, copper alloys, and iron-nickel alloys.

[0038] Copper, copper alloys, and iron-nickel alloys possess excellent ductility and are commonly used materials in semiconductor processes, which helps reduce process costs. In other embodiments, the ductile metal may also include other metallic materials with good elongation.

[0039] In some embodiments, the step of providing the conductive connection structure 120 includes: as shown in FIG4(b), providing a frame structure 120', the frame structure 120' including: one or more first initial connection portions 121' and a second initial connection portion 122', the second initial connection portion 122' being located on the side of the first initial connection portion 121', the sum of the areas of the first initial connection portions 121' being less than the area of ​​the second initial connection portion 122'; as shown in FIG4(c) to FIG4(e), the end of the first initial connection portion 121' facing away from the second initial connection portion 122' is directed towards the initial second connection portion [i.e., the direction of the dashed arrow in FIG4(e)]. The bending and pressing process, as shown in Figure 4(f), forms a first initial connecting portion 121' and a second initial connecting portion 122' that are stacked and partially in contact with each other. A step 123 is formed at the pressing interface between the second initial connecting portion 122' and the first initial connecting portion 121', that is, there is a step 123 at the interface between the second initial connecting portion 122' and the first initial connecting portion 121'. The area of ​​the first initial connecting portion 121' that is not adjacent to the second initial connecting portion 122' is used as the first connecting portion 121, and the area of ​​the second initial connecting portion 122' that is not adjacent to the first initial connecting portion 121' is used as the second connecting portion 122'.

[0040] The frame structure 120' provides a technological basis for forming the conductive connection structure 120. The first initial connection portion 121' provides a technological basis for forming the first connection portion 121, and the second initial connection portion 122' provides a technological basis for forming the second connection portion 122.

[0041] Bending and pressing the end of the first initial connecting portion 121' that faces away from the second initial connecting portion 122' toward the second initial connecting portion 121' helps reduce the difficulty of forming the first initial connecting portion 121' and the second initial connecting portion 122' that are stacked and partially in contact with each other, and also helps reduce the difficulty of forming the first connecting portion 121 and the second connecting portion 122.

[0042] It is understood that the regions in the first initial connecting portion 121' adjacent to the second initial connecting portion 122', and the regions in the second initial connecting portion 122' adjacent to the first initial connecting portion 121', will be stretched and bent during the bending step, so that a portion of these regions is located on the side wall of the first connecting portion 121 and another portion is located on the side wall of the second connecting portion 122.

[0043] As an example, the frame structure 120' has a first face 128 and a second face 129 arranged opposite to each other.

[0044] The first surface 128 is used to connect with the front surface 101 of the carrier plate or the second component; the second surface 129 of the first initial connection portion 121' is used to press against the second surface 129 of the second initial connection portion 122'.

[0045] As another example, the frame structure 120' includes one or more frame units 125'. The frame units 125' are used as basic units in the frame structure 120'.

[0046] The frame structure 120' is typically provided in roll form; correspondingly, the frame structure 120' typically includes a plurality of frame units 125'. In other embodiments, the frame structure 120' may also include a single frame unit 125.

[0047] It should be noted that in the bending and pressing steps, the frame structure 120' is fixed in a special mold, and a portion of the first initial connecting part 121' and the second initial connecting part 122' are overlapped and pressed together.

[0048] It should also be noted that in the step of providing the frame structure 120', adjacent frame units 125' are connected by connecting ribs (not shown); correspondingly, after forming the conductive connection structure 120, the method further includes: removing the connecting ribs between adjacent frame units 125' so that each conductive connection structure 120 is separated from the others.

[0049] In a specific embodiment, in the step of providing the frame structure 120', the frame structure 120' has a first side 128 and a second side 129 disposed opposite to each other and includes: one or more frame units 125', each frame unit 125' including one or more first initial connecting portions 121' and a second initial connecting portion 122', the second initial connecting portion 122' including a first region 1221 for pressing with the first initial connecting portion 121', and a second region 1222 located on the side of the first region 1221 [as shown in Figure 4(b)]; after providing the frame structure 120', before bending and pressing the end of the first initial connecting portion 121' facing away from the second initial connecting portion 122' toward the second initial connecting portion 122', the frame structure 120' is provided with a first region 1221 for pressing with the second initial connecting portion 122'. The step of providing the conductive connection structure 120 further includes: [as shown in FIG4(c)], removing a portion of the thickness of the frame structure 120' from one side of the second surface 129, forming a first groove 1223 in the second region 1222, the first groove 1223 being used to accommodate the first component 110, and in the case where the frame structure 120' includes a plurality of frame units 125', forming the first groove 1223 in at least a portion of the frame units 125'; in the step of bending and pressing, the first initial connection portion 121' is bent toward the direction of the second initial connection portion 122' in the same frame unit 125', and the second surface 129 of the first initial connection portion 125' is pressed against the second surface 129 of the first region 1221.

[0050] The first groove 1223 is used to accommodate the first component 110, so that when the first component 110 and the conductive connection structure 120 are subsequently set on the front side 101 of the carrier board, the first component 110 can be located below the second connection portion 122, thereby helping to reduce the size of the packaging structure.

[0051] When the frame structure 120' includes a plurality of frame units 125', a first groove 1223 is formed in at least a portion of the frame units 125'. That is, in the same packaging structure, a portion of the conductive connection structure 120 may have the first groove 1223, while another portion of the conductive connection structure 120 may not have the first groove 1223; or all conductive connection structures in the same packaging structure may have the first groove.

[0052] It should be noted that the depth D of the first groove 1223 should not be too small or too large. If the depth D of the first groove 1223 is too large, the thickness of the second connecting portion 122 at the top of the first groove 1223 may be too small, thereby increasing the probability of damage to the second connecting portion 122 at the top of the first groove 1223. If the depth D of the first groove 1223 is too small, the first groove 1223 may not be able to accommodate the first component 110. Therefore, as an example, the depth of the first groove 1223 satisfies: 1 / 2H1≤D

[0053] In another specific embodiment, in the step of providing the frame structure 120', the frame structure 120' has a first surface 128 and a second surface 128 disposed opposite to each other and includes: one or more frame units 125', the frame unit 125' including one or more first initial connecting portions 121' and a second initial connecting portion 122', the second initial connecting portion 122' including a first region 1221 for pressing with the first initial connecting portion 121', and a second region 1222 located on the side of the first region 1221 [as shown in Figure 4(b)]; after providing the frame structure 120', before bending and pressing the end of the first initial connecting portion 121' facing away from the second initial connecting portion 122' towards the second initial connecting portion 122'. The step of providing the conductive connection structure 120 further includes: removing a portion of the thickness of the frame structure 120' from one side of the first surface 128, forming a first extension 1224 at the edge position of the second region 1222 [as shown in Figures 4(a), 4(g), and 4(h)], and forming the first extension 1224 in at least a portion of the frame units 125' when the frame structure 120' includes a plurality of frame units 125'; in the step of bending and pressing, the first initial connection portion 121' is bent toward the direction of the second initial connection portion 122' in the same frame unit 125', and the second surface 129 of the first initial connection portion 121' is pressed against the second surface 129 of the first region 1221.

[0054] ​From one side of the first surface 128, a portion of the thickness of the frame structure 120' is removed, and a first extension 1224 is formed at the edge of the second region 1222, i.e., in the direction from the second surface 129 to the first surface 128. The top of the first extension 1224 is lower than the top of the rest of the second connection portion 122, so that during the subsequent formation of the molding layer on the front surface 101 of the carrier plate, it is convenient for the molding layer to wrap the first extension 1224, thereby improving the bonding strength between the molding layer and the conductive connection structure.

[0055] When the frame structure 120' includes a plurality of frame units 125', the first extension 1224 is formed in at least a portion of the frame units 125'. That is, in the same packaging structure, a portion of the conductive connection structure 120 may have the first extension 1224, while another portion of the conductive connection structure 120 may not have the first extension 1224; or all conductive connection structures in the same packaging structure may have the first extension 1224.

[0056] Specifically, in the step of forming the first extension 1224, the entire thickness of the frame structure 120' at a portion of the edge position in the second region 1222 is removed by etching or punching to give the first extension 1224 a serrated edge.

[0057] The first extension 1224 has serrated edges, which helps to further improve the bonding strength between the molding layer and the conductive connection structure 120.

[0058] It should be noted that, in the step of forming the first extension 1224, the thickness of the first extension 1224 should not be too small or too large. If the thickness of the first extension 1224 is too small, it will easily increase the difficulty of forming the first extension 1224; if the thickness of the first extension 1224 is too large, it will easily lead to poor effect of the plastic sealant wrapping the first extension 1224. Therefore, as an example, the thickness of the first extension satisfies: 1 / 2H1≤H2

[0059] ​It should also be noted that, in the step of forming the first extension 1224, a portion of the thickness of the frame structure 120' is removed from the second surface 129 side, and a first groove 1223 for accommodating the first component 110 is formed in the second region 1222 of the second initial connection portion 122; wherein, when the frame structure 120' includes a plurality of frame units 125', the first groove 1223 is formed in at least a portion of the frame units 120'; when the first groove 1223 and the first extension 1224 are formed in the same frame unit 125', the first groove 1223 and the first extension 1224 are staggered [as shown in Figures 4(g) and 4(h)], which helps to reduce the difficulty of simultaneously forming the first groove 1223 and the first extension 1224 in the same frame unit 125', and also helps to reduce the probability that forming the first groove 1223 will have an adverse effect on the first extension 1224, and also helps to reduce the probability that forming the first extension 1224 will have an adverse effect on the first groove 1223.

[0060] In another specific embodiment, in the step of providing the frame structure 120', the frame structure has a first surface 128 and a second surface 129 arranged opposite to each other [as shown in Figure 4(b)]; after providing the frame structure 120', before bending and pressing the end of the first initial connecting portion 121' facing away from the second initial connecting portion 122' toward the second initial connecting portion 122', the step of providing the conductive connection structure 120 further includes: [as shown in Figure 4(c)], removing a portion of the thickness of the frame structure 120 from the first surface 128 side. A second groove 1225' is formed in the boundary region between the first initial connecting portion 121' and the second initial connecting portion 122'; after bending and pressing, the frame structure 120' at the bottom of the second groove 1225' undergoes plastic deformation and serves as the bending portion 1225. The remaining first initial connecting portions 121' connected to the bending portion 1225 serve as the first connecting portion 121, and the remaining second initial connecting portions 122' connected to the bending portion 1225 serve as the second connecting portion 122 [as shown in Figure 4(f)].

[0061] Before bending, removing part of the thickness of the frame structure 120' from the first surface 128 side helps to reduce the lateral dimension of the bent portion 1225 formed by bending, thereby increasing the effective lateral dimension of the conductive connection structure 120, and further reducing the size of the packaging structure.

[0062] The lateral dimension of the bent portion 1225 refers to the dimension of the bent portion 1225 in the direction from the first connecting portion 121 to the second connecting portion 122.

[0063] In other embodiments, the second groove may not be formed before the bending is performed.

[0064] In some embodiments, the step of removing a portion of the thickness of the frame structure 120' includes: forming a mask layer 126 on a first surface 128 and a second surface 129 of the frame structure 120', the mask layer 126 exposing a region of the frame structure 120' [as shown in FIG. 4(b)]; using the mask layer 126 as a mask, removing a portion of the thickness of the frame structure 120' in the region exposed by the mask layer 126; and providing the conductive connection structure 120 after removing a portion of the thickness of the frame structure 120' further includes: removing the mask layer 126.

[0065] It should be noted that the material of the mask layer 126 includes photoresist. After photoresist is coated onto the first surface 128 and the second surface 129 of the frame structure 120', a patterned mask layer is formed by exposure and development. In other embodiments, the material of the mask layer can also be other mask materials.

[0066] It should also be noted that after forming the mask layer 126, a chemical etching solution is used to etch away the portion of the frame structure 120' that is not protected by the photoresist. Using a chemical etching solution improves the etching precision of the frame structure 120', thereby improving the dimensional and morphological accuracy of the conductive connection structure. In other embodiments, plasma dry etching or mechanical processing can also be used to remove a portion of the frame structure.

[0067] It should also be noted that, after removing the mask layer 126, the step of providing the conductive connection structure 120 further includes: cleaning and micro-etching the remaining frame structure 120', thereby providing a more understandable interface for subsequent processes (e.g., electroplating).

[0068] As an example, when forming the metal plating 124, after removing a portion of the thickness of the frame structure 120', the metal plating 124 is formed on the surface of the first initial connection portion 121' facing away from the second initial connection portion 122', and on the surface of the second initial connection portion 122' initially facing away from the first initial connection portion 121'.

[0069] It should be noted that during the formation of the metal plating layer 124, a baffle can be used to shield the area of ​​the frame structure 120' where part of the thickness has been removed, as well as the sidewalls of the first initial connection portion 121' and the second initial connection portion 122', to avoid the formation of the metal plating layer 124 in the aforementioned areas.

[0070] In other embodiments, a metal plating layer may be formed on the first and second surfaces of the frame structure first; after the metal plating layer is formed, the metal plating layer in a portion of the conductive connection structure may be removed.

[0071] In another specific embodiment, in the step of providing the frame structure 120', the frame structure 120' has a first surface 128 and a second surface 129 disposed opposite to each other and includes: one or more frame units 125', the frame unit 125' including one or more first initial connecting portions 121', a second initial connecting portion 122', and one or more second initial extension portions 127', the second initial extension portion 127' is located on the side wall of the first initial connecting portion 121' facing away from the second initial connecting portion 122', and at least a portion of the side wall of the first initial connecting portion 121' has the second initial extension portion 127', the first region 1221 of the second initial connecting portion 122' is also used for pressing with the second initial extension portion 127', when the frame structure 120' includes multiple frame units 125', at least a portion of the frame structure 120' has the second initial extension portion 127'; In the bending and pressing step, the first initial connecting portion 121' is bent toward the second initial connecting portion 122' in the same frame unit, and the second surface 129 of the first initial connecting portion 121' is pressed with the second surface 129 of the first region 1221, and the second surface 129 of the second initial extension portion 127' is pressed with the second surface 129 of the first region 1221; after bending and pressing, the second initial extension portion 127' becomes the second extension portion 127.

[0072] The second extension 127 helps to increase the cross-sectional area of ​​the conductive connection structure on the side of the package structure closest to the first component 110, thereby helping to further increase the average cross-sectional area of ​​the conductive connection structure 120.

[0073] Specifically, the thickness of the second extension 127 is equal to the thickness of the first connection 121, which is beneficial to increasing the cross-sectional area of ​​the conductive connection structure on the side of the package structure closest to the first component 110.

[0074] refer to Figure 5 The first component 110 and the conductive connection structure 120 are electrically connected on the front side 101 of the carrier board, and the first connection portion 121 of the conductive connection structure 120 is connected to the front side 101 of the carrier board, which provides a process basis for the subsequent connection of the second component to the front side 101 of the carrier board.

[0075] Compared to the previous method of forming a redistribution layer connected to the conductive pillars on the conductive pillars and the plastic encapsulation layer after forming conductive pillars and exposing the top of the conductive pillars on the front side of the substrate, the present invention enables the second connection portion 122 of the conductive connection structure 120 for connecting to the second component to also be located on the front side of the substrate 101 during the step of connecting the first connection portion 121 of the conductive connection structure 120 to the front side of the substrate 101, thereby reducing the number of process steps and lowering the packaging cost.

[0076] Accordingly, in some embodiments, in the step of providing an electrically connected conductive connection structure 120 on the front side 101 of the carrier plate, the first surface 128 of the first connection portion 121 is connected to the front side 101 of the carrier plate.

[0077] In one specific embodiment, after bending and pressing, the second initial extension 127' serves as the second extension 127. Correspondingly, in the step of providing the conductive connection structure 120 for electrical connection on the front surface 101 of the carrier plate, the first surfaces 128 of both the first connection portion 121 and the second extension 127 are connected to the front surface 101 of the carrier plate.

[0078] In some embodiments, during the step of providing the conductive connection structure 120, a metal plating layer 124 is formed on both the surface of the first connection portion 121 facing away from the second connection portion 122 and the surface of the second connection portion 122 facing away from the first connection portion 121, and the metal plating layer 124 exposes the sidewalls of the first connection portion 121 and the second connection portion 122. Correspondingly, during the step of providing the conductive connection structure 120 with electrical connections on the front surface 101 of the carrier board, the first connection portion 121 with the metal plating layer 124 formed is bonded to the front surface 101 of the carrier board by solder 130.

[0079] refer to Figure 6 After the first component 110 and the conductive connection structure 120 are set, a molding compound 140 is formed on the front side 101 of the carrier board. The molding compound 140 covers the top of the first component 110 and the step 123, and exposes the side of the second connection portion 122 on the back of the conductive connection structure 120 on the side of the first connection portion 121.

[0080] The molding layer 140 can play a protective role during the use of the package structure, such as providing support for the chip and isolating it from moisture or corrosive gases in the external environment.

[0081] In some embodiments, during the step of forming the molding layer 140, the thickness of the molding layer 140 is less than the thickness of the conductive connection structure 120, so that the second connection portion 122 protrudes from the molding layer.

[0082] During the formation of the molding compound 140, a thin film is typically attached to the exposed surface of the conductive interconnect structure 120 (i.e., the side of the second connection portion 122 facing away from the first connection portion 121), such that a portion of the conductive interconnect structure 120 is embedded within the thin film, thereby preventing material from the molding compound 140 from overflowing onto the conductive interconnect structure 120. Accordingly, the thickness of the molding compound 140 is less than the thickness of the conductive connection structure 120, and the second connection portion 122 protrudes from the molding compound 140.

[0083] It should be noted that the thickness difference between the conductive connection structure 120 and the molding compound 140 should not be too small or too large. If the thickness difference between the conductive connection structure 120 and the molding compound 140 is too large, it will increase the difficulty of forming the molding compound 140. If the thickness between the conductive connection structure 120 and the molding compound 140 is too small, it will be difficult to prevent the material of the molding compound 140 from overflowing onto the conductive interconnect structure 120 and affecting the components. Therefore, as an example, the thickness difference between the conductive connection structure 120 and the molding compound 140 is 5 micrometers to 20 micrometers.

[0084] In another specific embodiment, the step of providing the frame structure 120' includes: removing a portion of the thickness of the frame structure 120' from one side of the first surface 108, and forming a first extension 1224 at the edge of the second region 1222. Accordingly, in the step of forming the molding compound 140, the molding compound 140 covers the first extension 1224.

[0085] refer to Figure 7 Provide a second component 150.

[0086] The second component is used to electrically connect with the carrier board 100 to form a corresponding package structure to achieve the corresponding function.

[0087] In some embodiments, the first component includes a chip, or the first component includes a chip and a passive component, and the second component includes an inductor, to facilitate the formation of a package structure for power management.

[0088] In other embodiments, the first component includes a chip, or the first component includes a chip and a passive component, and the second component includes a chip and an inductor. In still other embodiments, one of the first component and the second component includes at least a chip, and the other includes at least one of a chip and a passive component.

[0089] refer to Figure 8After providing the second component 150 and forming the molding layer 140, the second component 150 is disposed on the exposed surface of the conductive connection structure 120 so that the second connection part 122 is connected to the second component 150, and the second component 150 is electrically connected to the carrier board 100 through the conductive connection structure 120 to form a corresponding encapsulation structure and realize the corresponding function.

[0090] As an example, the packaging structure is used to implement power management.

[0091] Accordingly, in some embodiments, during the step of setting the second component 150, the first surface 128 of the second connecting portion 122 is connected to the second component 150.

[0092] In some embodiments, during the step of providing the conductive connection structure 120, a metal plating layer 124 is formed on both the surface of the first connection portion 121 facing away from the second connection portion 122 and the surface of the second connection portion 122 facing away from the first connection portion 121, and the metal plating layer 124 exposes the sidewalls of the first connection portion 121 and the second connection portion 122. Correspondingly, during the step of setting the second component 150 on the exposed surface of the conductive connection structure 120, the second connection portion 122 with the metal plating layer 124 formed thereon is bonded to the second component 150 by solder 130.

[0093] In some embodiments, after the second component 150 is provided on the exposed surface of the conductive connection structure 120, a heat sink (not shown) may also be provided on the surface of the second component 150 facing away from the carrier plate 100.

[0094] Accordingly, the present invention also provides a packaging structure.

[0095] Referring to Figures 4(f), 4(g), and 4(h), and Figure 8The encapsulation structure includes: a carrier board 100 having a front surface 101; a first component 110 located on the front surface 101 and electrically connected to the carrier board 100; a molding compound 140 located on the front surface 101 and covering the top of the first component 110; a second component 150 located above the first component 110; and one or more conductive connection structures penetrating the molding compound 140 on the side of the first component 110 and located between the front surface 101 and the second component 150; the conductive connection structure 120 is used to connect the second component 150 to... The carrier board 100 is electrically connected, including one or more first connecting portions 121 connected to the front side 101 of the carrier board, and a second connecting portion 122 stacked on the first connecting portion 121 and connected to the second component 150. The outer contours of the second connecting portion 122 and the first connecting portion 121 are partially aligned vertically. At the interface between the second connecting portion 122 and the first connecting portion 121, the cross-sectional area of ​​the second connecting portion 122 is greater than the sum of the cross-sectional areas of the first connecting portions 121, so that there is a step 123 at the interface, and the step 123 is covered by the molding layer 140.

[0096] The carrier board 100 serves as a packaging carrier, providing support for the first component 110 and the second component 150. Simultaneously, the carrier board 100 contains conductive lines (not shown) for supplying power or transmitting electrical signals to the first component 110 and the second component 150, thereby achieving the packaging and circuit integration of the first component 110 and the second component 150.

[0097] In some embodiments, the carrier board 100 may include a printed circuit board (PCB), a package substrate, or an interposer. As an example, the carrier board 100 is a printed circuit board.

[0098] In some embodiments, the carrier plate 100 further has a carrier plate back side 102 disposed opposite to the carrier plate front side 101.

[0099] The first component is used to electrically connect to the carrier board 100, thereby providing a process basis for forming the corresponding packaging structure.

[0100] In some embodiments, the first component 110 includes a chip 111, or the first component 110 includes a chip 111 and a passive component 112.

[0101] Specifically, the passive element 112 includes one or both of a resistor and a capacitor.

[0102] The molding layer 140 can play a protective role during the use of the package structure, such as providing support for the chip and isolating it from moisture or corrosive gases in the external environment.

[0103] The second component 150 is used to electrically connect with the carrier board 100 to form a corresponding package structure to achieve the corresponding function.

[0104] In some embodiments, the first component includes a chip, or the first component includes a chip and a passive component, and the second component includes an inductor, to facilitate the formation of a package structure for power management.

[0105] In other embodiments, the first component includes a chip, or the first component includes a chip and a passive component, and the second component includes a chip and an inductor. In still other embodiments, one of the first component and the second component includes at least a chip, and the other includes at least one of a chip and a passive component.

[0106] As an example, the packaging structure is used to implement power management.

[0107] Compared with the conductive connection structure of the present invention, which includes conductive pillars penetrating the molding layer and a redistribution layer located on the molding layer and connected to the conductive pillars, the present invention increases the cross-sectional area of ​​the conductive connection structure 120 near the second component 150 in the packaging structure due to the step 123 formed at the interface between the second connection portion 122 and the first connection portion 121. This increases the average cross-sectional area of ​​the conductive connection structure 120, thereby reducing the thermal resistance of the packaging structure, improving its heat dissipation, and increasing the average cross-sectional area of ​​the conductive connection structure. Furthermore, it also helps to reduce the contact resistance between the second component 150 and the carrier plate 100 in the packaging structure, thus improving the electrical performance of the packaging structure.

[0108] In some embodiments, the conductive connection structure 120 is made of a ductile metal.

[0109] When the material of the conductive connection structure 120 is a ductile metal material, the conductive connection structure 120 can be formed by bending and pressing the metal.

[0110] It should be noted that the elongation of the ductile metal is ≥10%.

[0111] In some embodiments, the second connecting portion 122 includes a first region 1221 for pressing against the first connecting portion 121, and a second region 1222 located on the side of the first region 1221. The surface of the second region 1222 facing the carrier plate 100 has a first groove 1223 for accommodating the first component 110. When there are multiple conductive connection structures 120, at least some of the conductive connection structures 120 have the first groove 1223.

[0112] The first groove 1223 is used to accommodate the first component 110, so that when the first component 110 and the conductive connection structure 120 are disposed on the front side 101 of the carrier board, the first component 110 can be located below the second connection portion 122, thereby helping to reduce the size of the packaging structure.

[0113] When there are multiple conductive connection structures 120, at least some of the conductive connection structures 120 have the first groove 1223. That is, in the same packaging structure, some of the conductive connection structures 120 may have the first groove 1223, while other conductive connection structures 120 may not have the first groove 1223; or all conductive connection structures in the same packaging structure may have the first groove.

[0114] It should be noted that the depth D of the first groove 1223 should not be too small or too large. If the depth D of the first groove 1223 is too large, the thickness of the second connecting portion 122 at the top of the first groove 1223 may be too small, thereby increasing the probability of damage to the second connecting portion 122 at the top of the first groove 1223; if the depth D of the first groove 1223 is too small, the first groove 1223 may not be able to accommodate the first component 110. Therefore, as an example, the depth of the first groove 1223 satisfies: 1 / 2H1≤D

[0115] In some embodiments, the second connection portion 122 includes a first region 1221 for pressing against the first connection portion 121, and a second region 122 located on the side of the first region 1221. The second region 1222 has a first extension 1224 at its edge position. Along the direction from the carrier plate 100 to the second component 150, the top of the first extension 1224 is lower than the top of the rest of the second connection portion 122, so that the first extension 1223 is covered by the molding layer 140, which helps to improve the bonding strength between the molding layer and the conductive connection structure.

[0116] ​When there are multiple conductive connection structures 120, at least some of the conductive connection structures 120 have the first extension 121. That is, in the same packaging structure, some conductive connection structures 120 may have the first extension 1224, while other conductive connection structures 120 may not have the first extension 1224; or all conductive connection structures in the same packaging structure may have the first extension 1224.

[0117] Specifically, the first extension 1224 has serrated edges, which helps to further improve the bonding strength between the molding layer 140 and the conductive connection structure 120.

[0118] It should be noted that the thickness of the first extension 1224 should not be too small or too large. If the thickness of the first extension 1224 is too small, it will be difficult to form the first extension 1224; if the thickness of the first extension 1224 is too large, it will be difficult for the molding layer to wrap the first extension 1224 effectively. Therefore, as an example, the thickness of the first extension 1224 satisfies: 1 / 2H1≤H2

[0119] It should also be noted that the second region 1222 has a first groove 1223 for accommodating the first component 110 on the side facing the carrier plate 100; when there are multiple conductive connection structures 120, at least some of the conductive connection structures 120 have the first groove 1223; when the first groove 1223 and the first extension 1224 are located in the same conductive connection structure 120, the first groove 1223 and the first extension 1224 are staggered, which helps to reduce the difficulty of simultaneously forming the first groove 1223 and the first extension 1224 in the same frame unit 125', and also helps to reduce the probability that forming the first groove 1223 will have an adverse effect on the first extension 1224, and also helps to reduce the probability that forming the first extension 1224 will have an adverse effect on the first groove 1223.

[0120] In some embodiments, at least a portion of the sidewall of the first connection portion 121 has a second extension portion 127 that contacts the second connection portion 122; when there are multiple conductive connection structures 120, at least a portion of the conductive connection structures 120 have the second extension portion 127.

[0121] ​The second extension 127 helps to increase the cross-sectional area of ​​the conductive connection structure on the side of the package structure closest to the first component 110, thereby helping to further increase the average cross-sectional area of ​​the conductive connection structure 120.

[0122] Specifically, the thickness of the second extension 127 is equal to the thickness of the first connection 121, which is beneficial to increasing the cross-sectional area of ​​the conductive connection structure on the side of the package structure closest to the first component 110.

[0123] In some embodiments, the conductive connection structure 120 further includes a bending portion 1225 located on the sidewalls of the first connection portion 121 and the second connection portion 122. A portion of the bending portion 1225 contacts the first connection portion 121, and the remaining portion of the bending portion 1225 contacts the second connection portion 122. This helps to reduce the lateral dimension of the bending portion 1225 formed by bending, thereby increasing the effective lateral dimension of the conductive connection structure 120 and further reducing the size of the packaging structure.

[0124] The lateral dimension of the bent portion 1225 refers to the dimension of the bent portion 1225 in the direction from the first connecting portion 121 to the second connecting portion 122.

[0125] In other embodiments, a portion of the bend is located on all the sidewalls of the first connecting portion, and the remaining portion of the bend is located on all the sidewalls of the second connecting portion.

[0126] The molding layer 140 can play a protective role during the use of the package structure, such as providing support for the chip and isolating it from moisture or corrosive gases in the external environment.

[0127] In some embodiments, the thickness of the conductive connection structure 120 is greater than the thickness of the molding layer 140, so that the second connection portion 122 protrudes from the molding layer 140.

[0128] During the formation of the molding compound 140, a thin film is typically attached to the exposed surface of the conductive interconnect structure 120 (i.e., the side of the second connection portion 122 facing away from the first connection portion 121), such that a portion of the conductive interconnect structure 120 is embedded within the thin film, thereby preventing material from the molding compound 140 from overflowing onto the conductive interconnect structure 120. Accordingly, the thickness of the molding compound 140 is less than the thickness of the conductive connection structure 120, and the second connection portion 122 protrudes from the molding compound 140.

[0129] It should be noted that the thickness difference between the conductive connection structure 120 and the molding layer 140 should not be too small or too large. If the thickness difference between the conductive connection structure 120 and the molding layer 140 is too large, it will increase the difficulty of forming the molding layer 140. If the thickness between the conductive connection structure 120 and the molding layer 140 is too small, it will be difficult to prevent the material of the molding layer 140 from overflowing onto the conductive interconnect structure 120 and affecting the components. Therefore, as an example, the thickness difference between the conductive connection structure 120 and the molding layer 140 is 5 micrometers to 20 micrometers.

[0130] In some embodiments, the conductive connection structure further includes: a metal plating layer located on the surface where the first connection portion is connected to the front side of the carrier plate, and on the surface where the second connection portion is connected to the second component, and the metal plating layer exposes the sidewalls of the first connection portion and the second connection portion.

[0131] The metal plating 124 improves solder wettability, thereby enhancing the bonding strength between the conductive connection structure and the front side 101 of the carrier plate, as well as the bonding strength between the conductive connection structure and the second component. Furthermore, by exposing the sidewalls of the first connection portion 121 and the second connection portion 122, the metal plating 124 helps prevent it from affecting the bonding strength between either the first connection portion 121 or the second connection portion 122 and the molding compound 140.

[0132] As an example, metal plating 124 is a silver plating layer.

[0133] Specifically, the packaging structure also includes: solder 131, located between the conductive connection structure 120 and the front side of the carrier board, and between the conductive connection structure 120 and the second component.

[0134] Accordingly, the present invention also provides an electronic device.

[0135] Referring to Figures 4(f), 4(g), and 4(h), and Figure 8 The electronic device includes the packaging structure described in any embodiment of the present invention.

[0136] The packaging structure can be assembled into various electronic devices. As can be seen from the foregoing analysis, since a step 123 is formed at the interface between the second connecting portion 122 and the first connecting portion 121, the cross-sectional area of ​​the conductive connection structure 120 on the side closer to the second component 150 in the packaging structure is increased. Consequently, the average cross-sectional area of ​​the conductive connection structure 120 is increased, which helps to reduce the thermal resistance of the packaging structure, improve the heat dissipation effect of the packaging structure, and increase the average cross-sectional area of ​​the conductive connection structure 120. It also helps to reduce the contact resistance between the second component 150 and the carrier plate 100 in the packaging structure, which in turn helps to improve the electrical performance of the packaging structure.

[0137] It should be noted that the encapsulation structure can be formed using the forming method described in the foregoing embodiments, or it can be formed using other forming methods. For a detailed description of the encapsulation structure in this embodiment, please refer to the corresponding descriptions in the foregoing embodiments; these descriptions will not be repeated here.

[0138] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A packaging structure, characterized in that, include: A carrier plate having a front side; The first component is located on the front side of the carrier board and is electrically connected to the carrier board; A molding compound is located on the front side of the carrier board and covers the top of the first component; The second component is located above the first component; One or more conductive connection structures extend through the molding compound on the side of the first component and are located between the front side of the carrier board and the second component; the conductive connection structures are used to electrically connect the second component to the carrier board, including one or more first connection portions connected to the front side of the carrier board, and a second connection portion stacked on the first connection portions and connected to the second component, wherein the outer contours of the second connection portion and the first connection portion are aligned vertically, and at the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is greater than the sum of the cross-sectional areas of the first connection portions, so that the interface has a step, and the step is covered by the molding compound.

2. The packaging structure as described in claim 1, characterized in that, The second connecting portion includes a first region for pressing against the first connecting portion, and a second region located on the side of the first region, wherein the surface of the second region facing the carrier plate has a first groove for accommodating the first component; When there are multiple conductive connection structures, at least some of the conductive connection structures have the first groove.

3. The packaging structure as described in claim 2, characterized in that, The depth of the first groove satisfies: 1 / 2H1≤D<H1; Where D is the depth of the first groove and H1 is the total thickness of the second connecting part.

4. The packaging structure as described in claim 1, characterized in that, The second connection portion includes a first area for pressing against the first connection portion and a second area located on the side of the first area. The second area has a first extension at its edge. Along the direction from the carrier plate to the second component, the top of the first extension is lower than the top of the rest of the second connection portion, so that the first extension is covered by the molding layer. When there are multiple conductive connection structures, at least some of the conductive connection structures have the first extension.

5. The packaging structure as described in claim 4, characterized in that, The first extension has serrated edges.

6. The packaging structure as described in claim 4, characterized in that, The second region has a first groove in the side facing the carrier plate for accommodating the first component; When there are multiple conductive connection structures, at least some of the conductive connection structures have the first groove; When the first groove and the first extension are located in the same conductive connection structure, the first groove and the first extension are staggered.

7. The packaging structure as described in claim 4, characterized in that, The thickness of the first extension satisfies: 1 / 2H1≤H2<H1; Wherein, H2 is the thickness of the first extension and H1 is the total thickness of the second connection.

8. The packaging structure as described in claim 1, characterized in that, At least a portion of the sidewall of the first connecting portion has a second extension that contacts the second connecting portion; When there are multiple conductive connection structures, at least some of the conductive connection structures have the second extension.

9. The packaging structure as described in claim 8, characterized in that, The thickness of the second extension is equal to the thickness of the first connecting portion.

10. The packaging structure as described in claim 1, characterized in that, The thickness of the conductive connection structure is greater than the thickness of the encapsulation layer, so that the second connection portion protrudes from the encapsulation layer.

11. The packaging structure as described in claim 10, characterized in that, The thickness difference between the conductive connection structure and the molding layer is 5 micrometers to 20 micrometers.

12. The packaging structure as described in claim 1, characterized in that, The conductive connection structure further includes: a metal plating layer located on the surface where the first connection part is connected to the front side of the carrier plate, and on the surface where the second connection part is connected to the second component, and the metal plating layer exposes the sidewalls of the first connection part and the second connection part.

13. The packaging structure as described in claim 1, characterized in that, The conductive connection structure further includes a bending portion located on the sidewalls of the first connection portion and the second connection portion, wherein a portion of the bending portion is in contact with the first connection portion and the remaining portion of the bending portion is in contact with the second connection portion.

14. A packaging method, characterized in that, include: A carrier plate is provided, the carrier plate having a carrier plate front side; A first component and one or more conductive connection structures are provided. The conductive connection structure includes one or more first connection portions and a second connection portion stacked on the first connection portion. The outer contours of the second connection portion and the first connection portion are aligned vertically. At the interface between the second connection portion and the first connection portion, the cross-sectional area of ​​the second connection portion is greater than the sum of the cross-sectional areas of the first connection portions, so that a step is formed at the interface. The first component and the conductive connection structure are electrically connected on the front side of the carrier plate, and the first connection part of the conductive connection structure is connected to the front side of the carrier plate. After the first component and the conductive connection structure are set, a molding layer is formed on the front side of the carrier board. The molding layer covers the top of the first component and the step, and exposes the side of the first connection portion on the back side of the second connection portion in the conductive connection structure. Provide a second component; After providing the second component and forming the molding layer, the second component is disposed on the exposed surface of the conductive connection structure so that the second connection portion is connected to the second component, and the second component is electrically connected to the carrier plate through the conductive connection structure.

15. The packaging method as described in claim 14, characterized in that, The conductive connection structure is made of a ductile metal, and the steps of providing the conductive connection structure include: A frame structure is provided, the frame structure including: one or more first initial connecting parts and a second initial connecting part, the second initial connecting part being located on the side of the first initial connecting parts, and the sum of the areas of the first initial connecting parts being less than the area of ​​the second initial connecting part; The end of the first initial connecting part that is opposite to the second initial connecting part is bent and pressed towards the second initial connecting part; After bending and pressing, a first initial connecting portion and a second initial connecting portion are formed, which are stacked and partially in contact with each other. A step is formed at the pressing interface between the second initial connecting portion and the first initial connecting portion. The area of ​​the first initial connecting portion that is not adjacent to the second initial connecting portion is the first connecting portion, and the area of ​​the second initial connecting portion that is not adjacent to the first initial connecting portion is the second connecting portion.

16. The packaging method as described in claim 15, characterized in that, In the step of providing the frame structure, the frame structure has a first side and a second side disposed opposite to each other and includes: one or more frame units, the frame unit including one or more first initial connecting parts and a second initial connecting part, the second initial connecting part including a first area for pressing with the first initial connecting part and a second area located on the side of the first area; After providing the frame structure, before bending and pressing the end of the first initial connection portion away from the second initial connection portion toward the second initial connection portion, the step of providing the conductive connection structure further includes: From one side of the second surface, a portion of the thickness of the frame structure is removed to form a first groove in the second region. The first groove is used to accommodate the first component. In the case where the frame structure includes multiple frame units, the first groove is formed in at least a portion of the frame units. In the bending and pressing step, the first initial connection part is bent toward the direction of the second initial connection part in the same frame unit, and the second surface of the first initial connection part is pressed with the second surface of the first area; In the step of setting an electrically connected conductive connection structure on the front side of the carrier plate, the first surface of the first connecting part is connected to the front side of the carrier plate. In the step of setting the second component, the first surface of the second connecting part is connected to the second component.

17. The packaging method as described in claim 15, characterized in that, In the step of providing the frame structure, the frame structure has a first side and a second side disposed opposite to each other and includes: one or more frame units, the frame unit including one or more first initial connecting parts and a second initial connecting part, the second initial connecting part including a first area for pressing with the first initial connecting part and a second area located on the side of the first area; After providing the frame structure, before bending and pressing the end of the first initial connection portion away from the second initial connection portion toward the second initial connection portion, the step of providing the conductive connection structure further includes: From one side of the first surface, a portion of the thickness of the frame structure is removed, and a first extension is formed at the edge of the second region. In the case where the frame structure comprises multiple frame units, the first extension is formed in at least a portion of the frame units. In the bending and pressing step, the first initial connection part is bent toward the direction of the second initial connection part in the same frame unit, and the second surface of the first initial connection part is pressed with the second surface of the first area; In the step of setting an electrically connected conductive connection structure on the front side of the carrier plate, the first surface of the first connecting part is connected to the front side of the carrier plate. In the step of forming the molding layer, the molding layer covers the first extension; In the step of setting the second component, the first surface of the second connecting part is connected to the second component.

18. The packaging method as described in claim 17, characterized in that, In the step of forming the first extension, a portion of the thickness of the frame structure is removed from one side of the second surface, and a first groove for accommodating the first component is formed in the second region of the second initial connection portion. Wherein, when the frame structure includes multiple frame units, a first groove is formed in at least a portion of the frame units; where the first groove and the first extension are formed in the same frame unit, the first groove and the first extension are staggered.

19. The packaging method as described in claim 17, characterized in that, In the step of forming the first extension, the entire thickness of the frame structure at a portion of the edge location in the second region is also removed to give the first extension a serrated edge.

20. The packaging method as described in claim 15, characterized in that, In the step of providing the frame structure, the frame structure has a first side and a second side arranged opposite to each other; After providing the frame structure, before bending and pressing the end of the first initial connection portion away from the second initial connection portion toward the second initial connection portion, the step of providing the conductive connection structure further includes: From one side of the first surface, a portion of the thickness of the frame structure is removed to form a second groove in the boundary region between the first initial connection portion and the second initial connection portion; After bending and pressing, the frame structure at the bottom of the second groove undergoes plastic deformation and serves as a bending portion. The remaining first initial connecting portions connected to the bending portion serve as first connecting portions, and the remaining second initial connecting portions connected to the bending portion serve as second connecting portions.

21. The packaging method as described in claim 16, 17, 18, or 20, characterized in that, The steps of removing a portion of the thickness of the frame structure include: A mask layer is formed on the first and second surfaces of the frame structure, the mask layer exposing a portion of the frame structure. Using the mask layer as a mask, a portion of the frame structure thickness is removed in the area exposed by the mask layer; The step of providing the conductive connection structure after removing a portion of the frame structure further includes removing the mask layer.

22. The packaging method as described in claim 15, characterized in that, In the step of providing the frame structure, the frame structure has a first side and a second side disposed opposite to each other and includes: one or more frame units, each frame unit including one or more first initial connecting portions, a second initial connecting portion, and one or more second initial extension portions, the second initial extension portions being located on the sidewall of the first initial connecting portion facing away from the second initial connecting portion, and at least a portion of the sidewall of the first initial connecting portion having the second initial extension portions, a first area of ​​the second initial connecting portion being further used for pressing with the second initial extension portions, and in the case where the frame structure includes multiple frame units, at least a portion of the frame structure having the second initial extension portions; In the bending and pressing step, the first initial connecting part is bent toward the direction of the second initial connecting part in the same frame unit, and the second surface of the first initial connecting part is pressed with the second surface of the first area, and the second surface of the second initial extension is pressed with the second surface of the first area; After bending and pressing, the second initial extension becomes the second extension. In the step of setting an electrically conductive connection structure on the front side of the carrier plate, the first surfaces of the first connecting portion and the second extension portion are both connected to the front side of the carrier plate. In the step of setting the second component, the first surface of the second connecting part is connected to the second component.

23. The packaging method as described in claim 14 or 15, characterized in that, In the step of providing the conductive connection structure, a metal plating layer is formed on the surface of the first connection portion facing away from the second connection portion and on the surface of the second connection portion facing away from the first connection portion, and the metal plating layer exposes the sidewalls of the first connection portion and the second connection portion. In the step of setting the conductive connection structure with electrical connection on the front side of the carrier plate, the first connection portion with metal plating is bonded to the front side of the carrier plate by solder; In the step of setting a second component on the exposed surface of the conductive connection structure, the second connection portion with a metal plating layer is bonded to the second component by solder.

24. The packaging method as described in claim 14, characterized in that, In the step of forming the encapsulation layer, the thickness of the encapsulation layer is less than the thickness of the conductive connection structure, so that the second connection portion protrudes from the encapsulation layer.

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