Multi-zone heat transfer system

Abstract

A heat transfer system includes: a fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant; a first radiator thermally connected to the fluid conduit at a first location on the internal portion of the fluid conduit, wherein the first radiator has a first flow resistance; a second radiator thermally connected to the fluid conduit at a second location on the internal portion of the fluid conduit, wherein the second radiator has a second flow resistance greater than the first flow resistance; and an electronic component thermally connected at the second location on the external portion of the fluid conduit adjacent to the second radiator.

Description

Technical Field

[0001] This disclosure generally relates to heat transfer systems constructed using additive manufacturing, and more specifically to custom heat transfer structures constructed using additive manufacturing, having multiple cooling zones configured to maximize heat transfer at critical locations while reducing pressure drop across the entire heat transfer system. Background Technology

[0002] Additive manufacturing (AM), also known as 3D printing, has revolutionized radiator technology by increasing design freedom, expanding material choices, and helping to reduce weight and cost. AM allows for the creation of complex and sophisticated radiator designs that are difficult or impossible to manufacture using traditional methods. This can lead to improved heat dissipation performance. AM can be used to manufacture radiators using a wide variety of materials, including metals, plastics, and composites. This allows for the selection of materials that best meet the specific needs of the application. AM can be used to manufacture radiators that are lighter than those made using traditional methods. This can be a major advantage in applications where weight is a critical factor, such as aerospace and defense.

[0003] AM (Microchannel) can be used to create microchannel heat sinks, which have a network of tiny channels that allow for efficient heat transfer. These heat sinks are commonly used in high-performance electronic devices where heat dissipation is critical. AM can also be used to create mesh structures, which are lightweight, porous structures with high surface areas. These structures are often used in heat sinks to improve heat dissipation performance. AM can be used to optimize heat sink designs for specific applications. This is achieved by using computer algorithms to find a design that provides the optimal balance between weight, cost, and heat dissipation performance. Overall, AM is a promising technology with the potential to revolutionize the design and manufacture of heat sinks. It has already been used to create innovative and efficient heat sinks for a wide range of applications. Therefore, it is desirable to provide an efficient heat transfer that balances surface area and coolant flow rate, thereby optimizing heat transfer between the heat transfer system and the coolant. Other desirable features and characteristics of this disclosure will become apparent from the following detailed description and the appended claims, which should be considered in conjunction with the accompanying drawings and the discussion of this background art. Summary of the Invention

[0004] In one embodiment, a heat transfer system includes: a fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant; a first radiator thermally connected to the fluid conduit at a first location on the internal portion of the fluid conduit, wherein the first radiator has a first flow resistance; a second radiator thermally connected to the fluid conduit at a second location on the internal portion of the fluid conduit, wherein the second radiator has a second flow resistance greater than the first flow resistance; and an electronic component thermally connected at the second location on the external portion of the fluid conduit adjacent to the second radiator.

[0005] In another embodiment, a method of manufacturing a heat transfer system includes: providing a fluid conduit having an internal portion for guiding a coolant and an external portion physically isolated from the coolant; forming a first radiator having a first flow resistance at a first location on the internal portion of the fluid conduit, such that the first radiator is thermally connected to the fluid conduit; forming a second radiator having a second flow resistance at a second location on the internal portion of the fluid conduit, such that the second radiator is thermally connected to the fluid conduit, wherein the second flow resistance is greater than the first flow resistance; and attaching electronic components to a second location on the external portion of the fluid conduit adjacent to the second radiator, such that the electronic components are thermally connected to the fluid conduit and the second radiator.

[0006] A turbocharger system includes: an electric motor configured to be rotary mechanically coupled to a shaft of a compressor impeller; a controller for controlling the rotation of the electric motor, the controller including control circuitry and a MOSFET; a fluid conduit for removing heat from the controller, the fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant, wherein the controller is thermally coupled to the fluid conduit at the external portion of the fluid conduit; a first radiator thermally coupled to the fluid conduit at a first location on the internal portion of the fluid conduit adjacent to the control circuitry, wherein the first radiator has a first flow resistance; and a second radiator thermally coupled to the fluid conduit at a second location on the internal portion of the fluid conduit adjacent to the MOSFET, wherein the second radiator has a second flow resistance greater than the first flow resistance. Attached Figure Description

[0007] This disclosure will be described below in conjunction with the following drawings, wherein like reference numerals denote like elements, and wherein: Figure 1 This is a schematic illustration of an engine system having a fluid compression device including an integrated controller, according to exemplary embodiments of the present disclosure; Figure 2 An exemplary housing for a multi-zone heat transfer system constructed via additive manufacturing technology, according to an exemplary embodiment of the present disclosure, is shown. Figure 3 A cross-sectional view of a heat transfer system for a multi-zone heat transfer system constructed via additive manufacturing technology, according to an exemplary embodiment of the present disclosure, is shown. Figure 4 A cross-sectional view is shown of an alternative heat transfer system for a multi-zone heat transfer system constructed via additive manufacturing technology, according to exemplary embodiments of the present disclosure; and Figure 5 An exemplary method for manufacturing a heat transfer system according to an exemplary embodiment of the present disclosure is shown. Detailed Implementation

[0008] The following detailed description is exemplary in nature only and is not intended to limit this disclosure or its application and use. Furthermore, it is not intended to be bound by the foregoing background or any theories set forth in the following detailed description.

[0009] Airflow affects cooling in a radiator by increasing the rate of heat transfer from the radiator to the surrounding air; the faster the air flows over the radiator, the more heat it carries away. Similarly, the surface area of ​​a radiator affects cooling by increasing the amount of heat that can be transferred to the surrounding air. A larger surface area allows for more heat to be transferred through conduction and convection.

[0010] Increasing the surface area of ​​a heatsink typically yields better cooling performance. However, a larger surface area often restricts airflow across the heatsink, reducing the cooling system's ability to move heated coolant away from the heatsink structure. For example, the stringent space constraints imposed on power electronics surrounding an electric turbine motor can pose challenges to creating curved heatsinks and very small heatsinks for power electronics that provide pins with extremely high surface areas around MOSFETs (very high heat loss components) while also having relatively open "free-flow" regions in areas where significant heat transfer is not required. As MOSFET power density increases, conventional casting methods may not be able to provide the required high heat transfer, ultra-fine pin density.

[0011] AM metal printing can be used to provide ultra-fine geometry in precisely where needed and to manufacture cooling structures as single components, eliminating seals, welds, and material discontinuities. AM can be used to simplify radiators, reduce the risk of leaks by integrating multiple components into a single unit, and balance thermal performance and pressure drop in a better way compared to cast radiators.

[0012] Figure 1 This is a schematic diagram of an exemplary turbomachinery, such as a turbocharger 100, which is incorporated into an engine system 101 and includes one or more features of this disclosure. It should be understood that in other embodiments of this disclosure, the turbocharger 100 may be another type of turbomachinery (e.g., a supercharger, a turbo-free compressor, etc.). Furthermore, the turbomachinery of this disclosure may be incorporated into many systems other than engine systems without departing from the scope of this disclosure. For example, the turbomachinery of this disclosure may be incorporated into a fuel cell system to compress air supplied to the fuel cell stack, or the turbomachinery may be incorporated into another system without departing from the scope of this disclosure.

[0013] Typically, a turbocharger 100 may include a housing 103 and a rotating assembly 102 supported within the housing 103 by a bearing system 105 for rotation about an axis 104. The bearing system 105 can be of any suitable type, such as a rolling element bearing or an air bearing system. As shown, the housing 103 may include a turbine housing 106, a compressor housing 107, and an intermediate housing 109. The intermediate housing 109 may be axially disposed between the turbine housing and the compressor housings 106 and 107.

[0014] Furthermore, the rotating assembly 102 may include a turbine impeller 111, a compressor impeller 113, and a shaft 115. The turbine impeller 111 is substantially located within the turbine housing 106. The compressor impeller 113 is substantially located within the compressor housing 107. The shaft 115 extends along the axis of rotation 104, passing through the intermediate housing 109, to connect the turbine impeller 111 to the compressor impeller 113. Thus, the turbine impeller 111 and the compressor impeller 113 can rotate together as a single unit about the axis 104.

[0015] The turbine housing 106 and turbine impeller 111 are fitted together to form a turbine stage (i.e., turbine section) configured to circumferentially receive a high-pressure, high-temperature exhaust gas flow 121 from the exhaust manifold 123 of the engine, specifically from the internal combustion engine 125. The high-pressure, high-temperature exhaust gas flow 121 drives the turbine impeller 111 and other components of the rotating assembly 102 to rotate about axis 104, and the exhaust gas flow 121 is transformed into a lower-pressure, lower-temperature exhaust gas flow 127, which is released into the downstream exhaust pipe 126.

[0016] The compressor housing 107 and the compressor impeller 113 form a compressor stage (i.e., a compressor section). The compressor impeller 113 is driven to rotate by an exhaust-driven turbine impeller 111, configured to compress received input air 131 (e.g., ambient air, or pressurized air from a preceding stage in a multi-stage compressor) into a pressurized airflow 133, which is circumferentially ejected from the compressor housing 107. The compressor housing 107 may have a shape (e.g., a vortex shape or other shape) configured to guide and pressurize the air blown out from the compressor impeller 113. Due to the compression process, the pressurized airflow is characterized by an increased temperature relative to the input air 131.

[0017] The pressurized airflow 133 can be directed through an air cooler 135 (i.e., an intercooler), such as a convection-cooled booster air cooler. The air cooler 135 can be configured to dissipate heat from the pressurized airflow 133, increasing its density. The resulting cooled and pressurized output airflow 137 is directed into the intake manifold 139 of the internal combustion engine 125, or alternatively, into a subsequent tandem compressor.

[0018] Furthermore, the turbocharger 100 may include an e-machine stage 112. The e-machine stage 112 may be defined by an intermediate housing 109 and a motor 114 housed therein. A shaft 115 may extend through the e-machine stage 112, and the motor 114 is operatively coupled to this shaft. The motor 114 may be an electric motor, a generator, or a combination of both. Thus, the motor 114 may be configured as a motor to convert electrical energy into mechanical (rotational) energy of the shaft 115 for driving the rotating assembly 102. Additionally, the motor 114 may be configured as a generator to convert the mechanical energy of the shaft 115 into electrical energy stored in a battery or the like. As previously described, the motor 114 may be configured as a motor / generator combination, and in some embodiments, the motor 114 may also be configured to switch between motor mode and generator mode.

[0019] For the purposes of discussion, motor 114 will be referred to as motor 116. Motor 116 may include a rotor component (e.g., a plurality of permanent magnets) supported on shaft 115 for rotation with rotating assembly 102. Motor 116 may also include a stator component (e.g., a plurality of windings, etc.) housed and supported within intermediate housing 109. In some embodiments, motor 116 may be axially disposed between a first bearing 141 and a second bearing 142 of bearing system 105. Alternatively, motor 116 may be housed by motor housing 118 of intermediate housing 109. Motor housing 118 may be a thin-walled or shell-like housing that encloses the stator component of motor 116. Motor housing 118 may also surround axis 104, and shaft 115 may extend through motor housing.

[0020] Furthermore, the turbocharger 100 may include an integrated controller 150. The integrated controller 150 typically includes a controller housing 152 and multiple internal components 154 (e.g., circuitry, electronic components, cooling components, support structures, etc.) housed within the controller housing 152. The integrated controller 150 can control various functions. For example, the integrated controller 150 can control the motor 116, thereby controlling certain parameters of the rotation assembly 102 (torque, angular velocity, start / stop, acceleration, etc.). In some embodiments, the integrated controller 150 may also communicate with a corresponding vehicle battery, electronic control unit (ECU), or other components. More specifically, the integrated controller 150 may receive DC power from the vehicle battery and may convert the power into AC power to control the motor 116. In other embodiments, where the motor 114 is a motor / generator combination, the integrated controller 150 may be operable to switch the motor 114 between its motor function and generator function.

[0021] In some embodiments, the integrated controller 150 may be axially disposed between the compressor stage and the turbine stage of the turbocharger 100 relative to axis 104. Therefore, as shown, the integrated controller 150 may be disposed and integrated near the motor 116. For example, as shown, the integrated controller 150 may be disposed on the motor housing 118 and may be radially disposed above the motor housing. More specifically, the integrated controller 150 may extend and surround axis 104 to cover the motor 116, such that the motor 116 is radially disposed between axis 115 and the integrated controller 150. The integrated controller 150 may also extend circumferentially about axis 104 and may cover, overlap, and surround at least a portion of the motor housing 118. In some embodiments, the integrated controller 150 may surround axis 104 at a distance between approximately forty-five degrees (45°) and three hundred and sixty-five degrees (365°).

[0022] As shown, housing 152 may typically be arcuate to extend about axis 104 and generally conform to the circular profile of turbocharger 100. Housing 152 may also be a hollow, shell-like member enclosing internal components 154. Electrical connectors may extend through housing 152 to electrically connect to internal components 154. Additionally, openings for fluid connections (e.g., for connections to fluid coolant) may be provided. Furthermore, controller housing 152 may define a portion of the exterior of turbocharger 100. Outer surface 153 of controller housing 152 may extend about axis 104 and may be radially away from axis 104. As shown, outer surface 153 may be at least partially smoothly profiled about axis 104, or outer surface 153 may include one or more flat panels (e.g., a series of such flat panels arranged tangentially relative to axis 104). Outer surface 153 may typically be located at the same radius as its adjacent compressor housing 107 and / or turbine housing 106. Therefore, the overall size and profile of the turbocharger 100, including the controller 150, can be very compact.

[0023] Internal components 154 can be housed within the controller housing 152. Furthermore, as will be discussed below, at least some of the internal components 154 can extend in an arcuate shape, wrap around, and / or be arranged about axis 104. Additionally, as will be discussed below, the internal components 154 can be axially and tightly stacked along axis 104, making the controller 150 very compact. Therefore, the integrated controller 150 can be compactly arranged and integrated with other components of the turbine stage, compressor stage, and / or turbocharger 100. Furthermore, the internal components 154 of the controller 150 can be very close to the motor 116 to provide certain advantages. For example, due to this close proximity, noise can be reduced for more efficient control of the motor 116.

[0024] Furthermore, the controller 150 may include multiple components providing robust support and efficient cooling. Therefore, the turbocharger 100 can operate under extreme conditions due to high temperatures, mechanical loads, electrical loads, etc. In any case, the controller 150 can be tightly integrated into the turbocharger 100 without affecting performance.

[0025] Now for reference Figure 2 An exemplary housing 200 for a multi-zone heat transfer system constructed via additive manufacturing technology, according to an exemplary embodiment of the present disclosure, is shown. The exemplary housing 200 includes a thermally conductive structure 210, electronic circuitry 220, a first portion 230 of a heat sink, and a second portion 240 of a heat sink.

[0026] In some exemplary embodiments, housing 200 may include a thermally conductive metallic structure for providing protection for enclosed components and for providing mounting surfaces for internal and external components. Housing 200 may also provide conduits for coolants, lubricants, and other fluids or gases. Electronic circuitry 220 may be formed. Figure 1 This is part of the controller 150. Electronic circuitry 220 may include high-voltage, high-temperature components, such as metal-oxide-semiconductor field-effect transistors (MOSFETs), for supplying power to… Figure 1 The motor 116 in the motor provides the switching current. These high-pressure, high-temperature components require efficient cooling capabilities to operate effectively, especially in high-temperature environments, such as when used in conjunction with an internal combustion engine and / or a turbocharger.

[0027] An exemplary heat transfer system may include two or more parts, each with a different configuration, allowing for customized cooling characteristics and airflow resistance. Parts requiring lower heat transfer may have a heatsink with a smaller surface area and lower airflow resistance. Within the heatsink, increasing the surface area and increasing airflow results in more heat being removed from the heatsink. However, increasing the surface area of ​​the heatsink restricts airflow and leads to increased airflow resistance. In a heat transfer system, a balance between surface area and airflow is desired to achieve optimal cooling efficiency.

[0028] To achieve this optimal cooling efficiency, multiple cooling zones are proposed. These cooling zones can be manufactured to provide the required surface area and airflow resistance, thereby providing the desired heat transfer for each cooling zone. For example, an exemplary heat transfer system includes a first portion 230 and a second portion 240 of a radiator. In some exemplary embodiments, the first cooling zone corresponding to the first portion 230 of the radiator may require less cooling performance, and therefore the surface area of ​​the first portion 230 of the radiator can be reduced, thereby reducing the airflow resistance in the first portion 230 of the radiator. Conversely, the second cooling zone corresponding to the second portion 240 of the radiator may require higher cooling performance. Corresponding to the increased cooling demand, the second portion 240 of the radiator can be manufactured with an increased surface area to accommodate the increased heat transfer. This increased surface area may result in reduced airflow. It is desirable to minimize airflow resistance in areas requiring less heat transfer to reduce the overall airflow resistance of the heat transfer system, thereby maintaining sufficient airflow in areas requiring increased heat transfer.

[0029] In some exemplary embodiments, a cold cooling fluid 250, such as a gas or liquid, is introduced into the heat transfer system, such that heat from a first portion 230 and a second portion 240 of the radiator is transferred to the cooling fluid 250 through the radiator fins. The increased surface area of ​​the radiator allows heat to be transferred more efficiently into the air. Convection transfers heat through the movement of the fluid. As the cold cooling fluid 250 flows through the radiator structure, it carries away heat. The faster the cold cooling fluid 250 flows, the more heat it carries away. The resulting heated cooling fluid 275 then leaves the heat transfer system, either released into the environment, such as in an air-cooled system, or directed to another heat transfer system to remove some of the heat from the cooling fluid, and then returned to the heat transfer system as cold cooling fluid 250.

[0030] Thermal control systems can be manufactured using AM (Advanced Processing) techniques to provide complex structures with maximum surface area while minimizing airflow limitations. In some exemplary embodiments, one or more portions of the integral housing 200 can be manufactured using AM techniques suitable for situations requiring complex structures, and then assembled with other cast, stamped, or machined parts. For example, the internal portion 270 of the housing 200, including a first portion 230 and a second portion 240 of a radiator, can be formed using AM techniques because the complex structure of the second portion 240 of the radiator can only be achieved using AM. The external portion 275 of the housing 200 can be formed using conventional stamping or casting manufacturing techniques, and then the two portions can be combined to manufacture the complete housing 200.

[0031] Low-flow-resistance radiator structures can be located in areas of the heat transfer system requiring lower heat transfer capacity, while high-flow-resistance radiator structures can be located in areas requiring higher heat transfer capacity. As shown in the exemplary housing 200 employing a multi-zone heat transfer system, the first portion 230 of the radiator is created using fins oriented parallel to the direction of cooling fluid flow. These fins result in minimal flow resistance to the cooling fluid but with reduced heat transfer capacity. This helps maintain the cooling fluid flow rate as it reaches the second portion 240 of the radiator. The second portion 240 of the radiator has a more complex mesh structure to increase the heat transfer capacity of the second portion 240, but this results in increased flow resistance. In this exemplary embodiment, the increased heat transfer capacity is required to cool the electronic circuitry 220 located in the same area. Overall, the total flow resistance of the exemplary heat transfer system is less than that of a heat transfer system where the radiator is entirely composed of a more complex mesh structure.

[0032] Now for reference Figure 3 This illustration shows a cross-sectional view of a heat transfer system 300 for a multi-zone heat transfer system constructed via additive manufacturing technology, according to an exemplary embodiment of the present disclosure. The exemplary heat transfer system 300 includes a plurality of high-temperature electronic components 310, a first cooling zone 320, and a second cooling zone 330. The heat transfer system 300 is configured to guide coolant 340 through the first cooling zone 320 and the second cooling zone 330 within a housing including an upper thermally conductive surface 315 and a lower thermally conductive surface 317.

[0033] In the exemplary heat transfer system 300, a plurality of high-temperature electronic components 310 are thermally coupled to an upper thermally conductive surface 315. In some exemplary embodiments, the high-temperature electronic components 310 may include MOSFETs for controlling the current flowing to the motor windings of a three-phase motor, such as a motor for driving an electric turbocharger. MOSFETs are used in three-phase motor applications because they can handle high current and high voltage. During switching operations, these MOSFETs generate high levels of heat, which must be efficiently transferred away from the MOSFETs. In this exemplary heat transfer system 300, heat from the MOSFETs is coupled to a second cooling zone 330 via the upper thermally conductive surface 315. The second cooling zone 330 is configured as a high surface area structure, such as a mesh structure, to maximize the heat energy transferred to the coolant 340. The second cooling zone 330 is disposed directly adjacent to the high-temperature electronic components 310 to maximize the heat transfer efficiency between the high-temperature electronic components 310 and the coolant 340.

[0034] The first cooling zone 320 is configured for low coolant flow resistance. Low coolant flow resistance radiator structures can have smooth, unobstructed surfaces and large flow channel areas. Some of the most common low airflow resistance radiator structures include smooth plate fins or needle fins, or low-density mesh structures. Radiators with smooth fins have lower coolant flow resistance than those with sharp edges or grooved fins because smooth fins reduce turbulence in the coolant flow, thus reducing pressure drop. Radiators with wide flow channels also have lower coolant flow resistance than those with narrow flow channels. This is because wider flow channels allow the coolant to flow more freely, thus reducing pressure drop.

[0035] The second cooling zone 330 can be manufactured with a greater surface area concentration than the first cooling zone 320. This greater surface area concentration provides the heat sink structure with more surface area to transfer heat to the coolant, but also results in higher coolant flow resistance due to the narrower flow channels. Advantageously, the heat sink structure of the second cooling zone 330 can be manufactured using AM technology to create complex three-dimensional structures that maximize surface area and minimize coolant flow resistance. Exemplary structures include mesh structures, such as microchannels, grids, or three-period minimal surface structures. In some exemplary embodiments, the reduced coolant flow resistance of the first cooling zone 320 allows for minimized overall coolant flow resistance across the combined first and second cooling zones 320, while facilitating maximum heat transfer between the high-temperature electronic component 310 and the coolant 340.

[0036] Now for reference Figure 4 This illustration shows a cross-sectional view of an alternative heat transfer system 400 for a multi-zone heat transfer system constructed via additive manufacturing technology, according to exemplary embodiments of the present disclosure. The exemplary heat transfer system 400 includes a low surface density radiator structure region 410 and a high-density radiator structure region 420. Coolant 440 flows through each region, and heat is transferred from the radiator structures 410, 420 to the coolant 440. Although the coolant flow direction is illustrated as top-to-bottom, the coolant flow can be guided to flow from bottom to top through the heat transfer system 400 according to engineering design requirements.

[0037] In some exemplary embodiments, the heat transfer system 400 may include high-resistance portions 430 having a higher flow resistance than the high-density radiator structure 420. In some exemplary embodiments, these high-resistance portions 430 may be solid portions that do not allow coolant to flow through them, but instead redirect the coolant flow to their surroundings. The high-resistance portions 430 may be thermally conductive structures that transfer heat from the solid portions 430 to the coolant 440 on the outer surface of the high-resistance portions 430. In some exemplary embodiments, these high-resistance portions 430 may be positioned such that the coolant flow is directed to one or more high-density radiator structures 420, reducing the cross-sectional area of ​​the heat transfer system 400 at the high-density radiator structure 420, thereby increasing the coolant flow rate through the high-density radiator structure 420.

[0038] Now for reference Figure 5 An exemplary method 500 for manufacturing a heat transfer system according to an exemplary embodiment is shown. The method is first configured to provide a fluid conduit 510 having an internal portion for guiding coolant and an external portion physically isolated from the coolant. In some exemplary embodiments, the fluid conduit may form part of a turbocharger housing.

[0039] Next, the method operates to form a first heat sink 520 having a first flow resistance at a first location on the internal portion of the fluid conduit, such that the first heat sink is thermally connected to the fluid conduit. The first heat sink can be formed on or inside the fluid conduit using an additive manufacturing process. Next, the method operates to form a second heat sink 530 having a second flow resistance at a second location on the internal portion of the fluid conduit, such that the second heat sink is thermally connected to the fluid conduit, and wherein the second flow resistance is greater than the first flow resistance. In some exemplary embodiments, the first heat sink may be formed from a first mesh structure having a first plurality of channels, and the second heat sink may be formed from a second mesh structure having a second plurality of channels, wherein the second plurality of channels are narrower than the first plurality of channels. The first and second heat sinks may have different heat sink structures, including pins, plates, meshes, and other three-dimensional structures. For example, the first heat sink may be formed from a plurality of pins, and the second heat sink may be formed from a mesh structure having a plurality of channels.

[0040] Next, the method operates to attach the electronic component 540 to the second location on the outer portion of the fluid conduit adjacent to the second heat sink, such that the electronic component is thermally connected to the fluid conduit and the second heat sink. In some exemplary embodiments, the first and second heat sinks are formed using an additive manufacturing system. For example, the first and second heat sinks are formed using a laser sintering process. Alternatively, the first and second heat sinks are formed using a fused deposition modeling process. In some exemplary embodiments, the fluid conduit, the first heat sink, and the second heat sink may be formed during the same additive manufacturing process. Alternatively, the fluid conduit may be formed using alternative manufacturing processes, such as casting or stamping, and the first and second heat sinks may be formed during the same additive manufacturing process, using the fluid conduit as a substrate for the additive manufacturing process.

[0041] In some exemplary embodiments, the method may be configured to form a connection portion for connecting a first heat sink and a second heat sink, wherein the first heat sink is configured to remove heat from a fluid conduit and the second heat sink is configured to remove heat from electronic components. The connection portion may then be configured to equalize the heat flow between the first and second heat sinks. Similarly, the connection portion allows heat from the electronic components to be thermally coupled from the second heat sink to the first heat sink, thereby further improving the heat transfer capability of the heat transfer system.

[0042] While at least one exemplary embodiment has been presented in the foregoing detailed description, it should be understood that numerous variations exist. It should also be understood that the exemplary embodiments are merely examples and are not intended to limit the scope, applicability, or configuration of this disclosure in any way. Rather, the foregoing detailed description will provide those skilled in the art with a convenient roadmap for implementing exemplary embodiments of this disclosure. It should be understood that various changes can be made to the function and arrangement of the elements described in the exemplary embodiments without departing from the scope of this disclosure set forth in the appended claims.

Claims

1. A heat transfer system, comprising: A fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant; A first radiator is thermally connected to the fluid conduit at a first location on the internal portion of the fluid conduit, wherein the first radiator has a first flow resistance. A second radiator is thermally connected to the fluid conduit at a second location on the internal portion of the fluid conduit, wherein the second radiator has a second flow resistance greater than the first flow resistance; as well as An electronic component, thermally connected to the second location on the outer portion of the fluid conduit adjacent to the second heat sink.

2. The heat transfer system according to claim 1, characterized in that, The coolant is a liquid coolant that flows through the first radiator and the second radiator in the fluid conduit.

3. The heat transfer system according to claim 1 or 2, characterized in that, The electronic component is a MOSFET.

4. The heat transfer system according to any one of the preceding claims, characterized in that, The coolant is air flowing through the first radiator and the second radiator in the fluid conduit.

5. The heat transfer system according to any one of the preceding claims, characterized in that, The fluid conduit, the first radiator, and the second radiator are manufactured using additive manufacturing.

6. The heat transfer system according to any one of the preceding claims, characterized in that, The first heat sink includes multiple fins, and the second heat sink includes a mesh structure.

7. The heat transfer system according to any one of the preceding claims, characterized in that, The first heat sink includes multiple pins, and the second heat sink includes a mesh structure.

8. The heat transfer system according to any one of the preceding claims, characterized in that, It also includes a solid portion for reducing the cross-sectional area of ​​the fluid conduit between the first radiator and the second radiator.

9. The heat transfer system according to any one of the preceding claims, characterized in that, The fluid conduit has a first cross-sectional area at the first radiator and a second cross-sectional area at the second radiator, wherein the first cross-sectional area is larger than the second cross-sectional area.

10. A method for manufacturing a heat transfer system, comprising: A fluid conduit is provided, the fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant; A first radiator with a first flow resistance is formed at a first location on the inner portion of the fluid conduit, such that the first radiator is thermally connected to the fluid conduit. A second heat sink with a second flow resistance is formed at a second location on the inner portion of the fluid conduit, such that the second heat sink is thermally connected to the fluid conduit, and wherein the second flow resistance is greater than the first flow resistance; as well as The electronic component is attached to the second location on the outer portion of the fluid conduit adjacent to the second heat sink, such that the electronic component is thermally connected to the fluid conduit and the second heat sink.

11. The method for manufacturing a heat transfer system according to claim 10, characterized in that, The first heat sink and the second heat sink are formed using an additive manufacturing system.

12. The method for manufacturing a heat transfer system according to claim 10 or 11, characterized in that, The first heat sink and the second heat sink are formed using a laser sintering process.

13. The method for manufacturing a heat transfer system according to claim 10, 11, or 12, characterized in that, The first heat sink and the second heat sink are formed using a fused deposition modeling process.

14. The method for manufacturing a heat transfer system according to any one of claims 10 to 13, characterized in that, It also includes a connection portion for connecting the first heat sink and the second heat sink, wherein the first heat sink is configured to remove heat from the fluid conduit, the second heat sink is configured to remove heat from the electronic component, and the connection portion is configured to balance the heat flow between the first electronic component and the second electronic component.

15. The method for manufacturing a heat transfer system according to any one of claims 10 to 14, characterized in that, The first heat sink is formed by a first mesh structure having a first plurality of channels, and the second heat sink is formed by a second mesh structure having a second plurality of channels, wherein the second plurality of channels are narrower than the first plurality of channels.

16. The method for manufacturing a heat transfer system according to any one of claims 10 to 15, characterized in that, The first heat sink is formed of carbon fiber reinforced polymer, and the second heat sink is formed of silicon carbide reinforced polymer.

17. The method for manufacturing a heat transfer system according to any one of claims 10 to 16, characterized in that, The first heat sink is formed of a polymer-based composite material, and the second heat sink is formed of one of an aluminum-based composite material, a copper-based composite material, and a metal-based composite material.

18. The method for manufacturing a heat transfer system according to any one of claims 10 to 17, characterized in that, The fluid conduit has a first cross-sectional area at the first radiator and a second cross-sectional area at the second radiator, wherein the first cross-sectional area is larger than the second cross-sectional area.

19. A turbocharger system, comprising: An electric motor, the electric motor being configured to be rotary mechanically coupled to a shaft of a compressor impeller; A controller for controlling the rotation of the electric motor, the controller including a control circuit and a MOSFET; A fluid conduit for removing heat from the controller, the fluid conduit having an internal portion for guiding coolant and an external portion physically isolated from the coolant, wherein the controller is thermally coupled to the fluid conduit on the external portion of the fluid conduit; A first heat sink is thermally connected to the fluid conduit at a first location on the internal portion of the fluid conduit adjacent to the control circuit, wherein the first heat sink has a first flow resistance. as well as A second heat sink is thermally connected to the fluid conduit at a second location on the internal portion of the fluid conduit adjacent to the MOSFET, wherein the second heat sink has a second flow resistance greater than the first flow resistance.

20. The turbocharger system according to claim 19, characterized in that, The fluid conduit, the first radiator, and the second radiator are formed using an additive manufacturing system.

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