A kind of flux automatic spraying device for flip chip

Abstract

The application discloses a kind of flux automatic spraying device for flip chip, and the application relates to flip chip processing technical field, including processing table, the inside of the processing table is slidably provided with conveying plate, the top of the conveying plate is fixedly provided with a plurality of lugs at both sides at equal intervals, the surface of the processing table is fixedly provided with mounting bracket, the mounting bracket is provided with push rod, the mounting bracket is also provided with power mechanism for driving push rod to move in vertical direction.The flux automatic spraying device for flip chip, through the cooperation of power mechanism, push rod and lug, realizes the automatic step-by-step conveying of conveying plate, without manual assistance to push chip, greatly improves the degree of automation of processing, while the sliding cooperation of connecting slide and connecting sliding groove guarantees the stability of conveying plate movement, avoids chip deviation in the conveying process, and provides a basis for uniform flux spraying.

Description

Technical Field

[0001] This invention relates to the field of flip chip fabrication technology, specifically to an automatic flux spraying device for flip chips. Background Technology

[0002] In the manufacturing process of flip chips, flux spraying is a crucial step, and its uniformity and degree of automation directly affect the soldering quality and production efficiency. Existing flux spraying devices often suffer from low automation, requiring manual assistance for chip loading, conveying, and unloading. This not only increases labor costs but also increases the risk of inaccurate chip positioning due to human error, leading to uneven flux spraying. Furthermore, some automated conveying spraying devices lack stable positioning and locking structures, making chips prone to shifting during transport. The unloading process also relies heavily on manual handling, resulting in low efficiency and making it difficult to meet the demands of large-scale flip chip production.

[0003] To address the aforementioned issues, this invention proposes an automatic flux spraying device for flip-chip circuits, which enables automatic chip delivery, precise positioning, and automatic unloading, thereby improving the automation level and processing accuracy of flux spraying. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an automatic flux spraying device for flip chips, which solves the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic flux spraying device for flip chips, comprising a processing table, a conveyor plate slidably disposed inside the processing table, a plurality of protrusions fixedly disposed at equal intervals on both sides of the top of the conveyor plate, a mounting frame fixedly disposed on the surface of the processing table, a push rod disposed on the mounting frame, and a power mechanism for driving the push rod to move vertically on the mounting frame, wherein when the power mechanism drives the push rod to move downward, the bottom end of the push rod contacts and abuts against the protrusions, and pushes the conveyor plate to move horizontally, a locking block is disposed on the processing table to limit the moving direction of the conveyor plate, and a feeding assembly is disposed on the processing table to eject the sprayed flip chip from the conveyor plate;

[0006] The conveyor plate has multiple equally spaced placement slots, and placement bosses for placing flip chips are slidably arranged inside the placement slots.

[0007] Preferably, the inner wall of the processing table is symmetrically provided with connecting grooves, and connecting slides are fixedly provided on both sides of the conveyor plate. The outer surface of the connecting slide is slidably connected to the inner surface of the connecting groove, and the protrusion is fixedly provided on the connecting slide. The cooperation between the connecting slide and the connecting groove enables the conveyor plate to slide stably and horizontally within the processing table, preventing the conveyor plate from deviating.

[0008] Preferably, guide grooves are symmetrically formed on the inner wall of the placement groove, and guide blocks are fixedly provided on both sides of the placement boss. The outer surface of the guide block is slidably connected to the inner surface of the guide groove, and a connecting spring is fixedly provided between the guide block and the inner wall of the guide groove. The connecting spring can drive the placement boss to elastically reset in the placement groove, which is suitable for placing flip chips of different thicknesses, and at the same time provides buffering during ejection to avoid damaging the chip.

[0009] Preferably, the bottom of the conveyor plate is provided with a plurality of locking grooves, wherein the locking block is engaged with the inner surface of the locking groove, and the engagement of the locking block and the locking groove realizes the precise positioning of the conveyor plate and prevents the conveyor plate from moving during the spraying process.

[0010] Preferably, an installation block is fixedly installed on the inner bottom wall of the processing table, and the locking block is slidably installed on the installation block. A tension spring is fixedly installed between the locking block and the inner wall of the installation block to push the locking block into the locking groove. The top of the locking block near the mounting frame is set as an inclined surface. When the conveyor plate moves, the protrusion pushes the push rod down, and the bottom of the conveyor plate squeezes the inclined surface of the locking block, so that the locking block compresses the tension spring and separates from the locking groove. The conveyor plate can move smoothly. After moving into place, the tension spring resets and drives the locking block to engage with the corresponding locking groove, completing the automatic positioning.

[0011] Preferably, the unloading assembly includes an electric push rod fixedly mounted on the processing table, and an ejector plate is fixedly mounted on the output end of the electric push rod. The electric push rod is positioned directly below one of the placement slots. The electric push rod drives the ejector plate to move upward, which can eject the flip-chip coated on the placement boss from the placement slot, thereby realizing automatic unloading.

[0012] Preferably, the power mechanism includes a connecting plate slidably disposed inside the mounting frame, and hydraulic rods are symmetrically and fixedly disposed through the mounting frame. The output end of the hydraulic rod is fixedly connected to the connecting plate, and a driving block is fixedly disposed at the bottom of the hydraulic rod. The push rod is rotatably disposed on the driving block. The hydraulic rod provides stable power for the vertical movement of the push rod, ensuring accurate contact between the push rod and the protrusion.

[0013] Preferably, a drive shaft is rotatably mounted through the drive block, and the push rod is fixedly sleeved on the end of the drive shaft. A torsion spring is fixedly mounted between the outer surface of the drive shaft and the drive block. The end of the push rod and the side of one of the protrusions near the mounting bracket are on the same vertical plane. The torsion spring can drive the push rod to rotate and reset around the drive shaft, so that the push rod returns to its initial position after completing one push, which facilitates cooperation with the next protrusion and realizes the step-by-step conveying of the conveyor plate.

[0014] Beneficial effects

[0015] This invention provides an automatic flux spraying device for flip-chip circuits. Compared with the prior art, it has the following advantages:

[0016] (1) The automatic flux spraying device for flip chips achieves automatic step-by-step conveying of the conveyor plate through the cooperation of the power mechanism, push rod and bump, without the need for manual assistance to push the chip, which greatly improves the automation level of the processing. At the same time, the sliding cooperation between the connecting slide bar and the connecting slide groove ensures the stability of the conveyor plate movement and avoids the chip from shifting during the conveying process, which provides a basis for uniform flux spraying.

[0017] (2) The automatic flux spraying device for flip chips has a positioning structure consisting of a locking block, a locking groove and a tension spring. After the conveyor plate moves into place, it can automatically lock and prevent the conveyor plate from shifting during the spraying process, thus ensuring the positioning accuracy of the flip chip and effectively improving the spraying quality of the flux. In addition, the inclined surface design of the locking block allows the conveyor plate to be automatically unlocked when it moves, realizing the linkage between conveying and positioning.

[0018] (3) The automatic flux spraying device for flip chips automatically ejects and unloads the coated chips through the unloading component, replacing the traditional manual unloading method and improving unloading efficiency. At the same time, the cooperation between the placement boss and the connecting spring not only accommodates flip chips of different thicknesses, but also provides buffering during the unloading process, preventing damage to the chips due to hard pushing and protecting the integrity of the chip processing. Attached Figure Description

[0019] Figure 1 This is a first-view schematic diagram of the external structure of the present invention;

[0020] Figure 2 This is a second-view schematic diagram of the external structure of the present invention;

[0021] Figure 3 This is a schematic diagram showing the installation of the conveyor plate and the processing table according to the present invention;

[0022] Figure 4 This is a schematic diagram of the conveyor plate structure of the present invention;

[0023] Figure 5 This is a top view of the conveyor plate of the present invention;

[0024] Figure 6 This is a schematic diagram of the feeding assembly structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the installation of the internal power mechanism of the present invention;

[0026] Figure 8 This is a schematic diagram of the power mechanism structure of the present invention.

[0027] In the diagram: 1. Processing table; 101. Connecting slide; 2. Conveyor plate; 201. Placement slot; 202. Connecting slide bar; 203. Locking slot; 3. Thrust; 4. Mounting bracket; 5. Push rod; 6. Power mechanism; 601. Connecting plate; 602. Hydraulic rod; 603. Drive block; 604. Drive shaft; 605. Torsion spring; 7. Locking block; 8. Unloading assembly; 801. Electric push rod; 802. Ejector plate; 9. Placement boss; 901. Guide slot; 902. Guide block; 903. Connecting spring; 10. Mounting block. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1-8 This invention provides a technical solution: an automatic flux spraying device for flip-chip devices, including a processing table 1. The processing table 1 is the basic support structure of the entire device, integrally formed from hard metal, and has a rectangular frame structure. This ensures the structural stability and load-bearing capacity of the device installation, while reserving internal working space for conveying, positioning, and unloading. It also provides precise installation benchmarks for all functional structures such as the conveyor plate 2, mounting bracket 4, unloading assembly 8, and mounting block 10, ensuring the matching accuracy between various structures and preventing equipment malfunction due to installation deviations. The processing table 1 has a sliding conveyor plate 2, which is the core structure for chip conveying and bearing. It is made of lightweight, high-strength metal, effectively reducing the driving load on the power mechanism 6 while ensuring its own structural strength and preventing deformation from long-term reciprocating movement.

[0030] The inner wall of the processing table 1 is symmetrically provided with connecting grooves 101. These grooves are through-grooves with polished and lubricated inner walls to reduce sliding friction resistance. Connecting strips 202 are integrally formed on both sides of the conveyor plate 2. The outer surface of the connecting strips 202 matches the inner surface of the connecting grooves 101, and wear-resistant pads are embedded in the outer surface of the connecting strips 202. The connecting strips 202 and the connecting grooves 101 together constitute a horizontal sliding guide mechanism, strictly limiting the linear movement trajectory of the conveyor plate 2. This ensures that the conveyor plate 2 can only move in a reciprocating stepping motion in the horizontal direction, completely preventing the conveyor plate 2 from malfunctioning during movement. The presence of left-right offset, up-down sway, or jamming provides structural assurance for the accuracy of chip delivery. Several protrusions 3 are fixedly arranged at equal intervals on the connecting slide 202. The protrusions 3 are hard metal block structures that are welded and fixed to the connecting slide 202, making the structure firm and not easy to fall off. The protrusions 3 serve as the force contact points of the push rod 5, and their vertical sides are the force-bearing surfaces. The spacing of the several protrusions 3 is matched with the spacing of the placement slots 201 on the conveyor plate 2. This allows the push rod 5 to achieve equidistant step-by-step movement of the conveyor plate 2, ensuring that the chips in each placement slot 201 can be accurately moved to the spraying station and the unloading station.

[0031] A mounting frame 4 is bolted to the surface of the processing table 1. The mounting frame 4 is a gantry frame structure, welded and then precision machined. Its bottom fits tightly to the surface of the processing table 1, with high connection strength. The mounting frame 4 provides a stable high-altitude fixed mounting carrier for the power mechanism 6 and the push rod 5, placing the power mechanism 6 and the push rod 5 above the moving path of the conveyor plate 2, ensuring that the push rod 5 can accurately abut against the protrusion 3 to apply force. At the same time, the interior of the mounting frame 4 has reserved sliding space for the connecting plate 601, and its inner wall has a guide groove adapted to the connecting plate 601 to ensure the horizontality of the connecting plate 601 during the lifting and lowering process. The push rod 5 is installed on the mounting frame 4. The push rod 5 is a hard metal rod structure with rounded corners at its bottom to avoid scratching the force-bearing surface of the protrusion 3. The mounting frame 4 is also equipped with a power mechanism 6 that drives the push rod 5 to move vertically.

[0032] The power mechanism 6 includes a connecting plate 601 slidably disposed inside the mounting frame 4. The connecting plate 601 is a rectangular metal plate, and its two sides are slidably connected to the internal sliding grooves of the mounting frame 4, serving to connect the two hydraulic rods 602 and ensure their synchronous action. Hydraulic rods 602 are symmetrically and fixedly disposed on the mounting frame 4. The hydraulic rods 602 are double-acting hydraulic push rods, powered by hydraulic oil, providing stable, controllable, and uniform power output for the vertical lifting and lowering of the push rods 5. Their symmetrical layout ensures that the connecting plate 601 remains horizontal during lifting and lowering, preventing the push rods 5 from becoming skewed, resulting in uneven force application or misalignment with the protrusion 3. The fixed end of the hydraulic rod 602 is connected to the mounting frame 4 via a flange, ensuring a secure connection and easy assembly / disassembly. The output end of the hydraulic rod 602 is fixedly connected to the connecting plate 601 via bolts. A drive block 603 is welded and fixed to the bottom of the hydraulic rod 602. The drive block 603 is a hollow metal block structure, providing installation space for the drive shaft 604 and the torsion spring 605. A drive shaft 604, a rigid metal shaft, is rotatably mounted on the drive block 603. It is connected to the drive block 603 via bearings to reduce rotational friction and provide a stable rotational support for the push rod 5, allowing it to rotate flexibly around its base. The push rod 5 is fixedly sleeved on the end of the drive shaft 604. A torsion spring 605, a cylindrical helical torsion spring, is fixedly mounted between the outer surface of the drive shaft 604 and the drive block 603. Its two ends are respectively engaged and fixed to the drive shaft 604 and the drive block 603. The core function is elastic reset, which can quickly drive the push rod 5 to rotate around the drive shaft 604 to the initial vertical position after the push rod 5 completes one pushing action, so as to facilitate precise engagement with the next protrusion 3. At the same time, the elastic force of the torsion spring 605 is moderate, which avoids the push rod 5 from resetting too quickly and causing impact. The end of the push rod 5 and the side of one of the protrusions 3 near the mounting bracket 4 are on the same vertical plane. This structural design ensures that the push rod 5 can accurately abut against the vertical force-bearing surface of the protrusion 3 when it moves down, so as to achieve effective force application and avoid slippage and empty push.

[0033] A mounting block 10 is bolted to the inner bottom wall of the processing table 1. The mounting block 10 is a solid metal block with a vertical sliding through hole adapted to the locking block 7. The inner wall of the through hole is polished to provide a vertical sliding mounting and guiding foundation for the locking block 7, ensuring that the locking block 7 can only slide up and down in the vertical direction without horizontal offset. The locking block 7 is slidably mounted through the mounting block 10. The locking block 7 is a stepped metal block with an upper engaging end that matches the locking groove 203 and a lower sliding end that slides through the through hole of the mounting block 10. The bottom of the conveyor plate 2 has several locking grooves 203 adapted to the engaging end of the locking block 7. The spacing of the locking grooves 203 is consistent with the spacing of the protrusions 3 and the spacing of the placement grooves 201. The locking block 7 engages with the inner surface of the locking groove 203. A tension spring is fixedly installed between the locking block 7 and the inner wall of the mounting block 10. The tension spring is made of stainless steel, which has strong fatigue resistance and always provides a continuous and stable upward elastic force to the locking block 7, pushing the locking end of the locking block 7 to always maintain an upward trend and form a stable engagement with the locking groove 203, so as to achieve precise positioning of the conveyor plate 2 and prevent the conveyor plate 2 from shifting due to vibration, external force and other factors during the spraying process. The top of the side of the locking block 7 near the mounting frame 4 is set with a slope structure. This slope is the core structure of automatic unlocking. Its tilt angle is precisely designed so that when the conveyor plate 2 moves horizontally, its bottom can smoothly squeeze the locking block 7 through the slope, allowing the locking block 7 to overcome the tension of the tension spring and slide downward, so as to achieve automatic unlocking without additional drive structure. It perfectly cooperates with the conveying action to complete the linkage, and the unlocking process is smooth and without jamming.

[0034] Multiple equally spaced placement slots 201 are provided through the conveyor plate 2. The placement slots 201 are rectangular through slots with smooth inner walls, providing dedicated installation and vertical movement space for the placement bosses 9. The equidistant spacing perfectly matches the spacing of the bosses 3 and locking slots 203, precisely cooperating with the stepping movement of the conveyor plate 2 to ensure that the chips on each placement boss 9 can move sequentially and accurately to the loading station, spraying station, and unloading station. The placement bosses 9 are slidably arranged inside the placement slots 201. The placement bosses 9 are rectangular boss structures adapted to the placement slots 201. Their top surfaces are chip placement surfaces with a matte anti-slip treatment, which not only avoids scratching the surface of the flip chips, but also uses a small amount of friction to prevent the chips from sliding and shifting during conveying and spraying. This provides a dedicated and stable placement bearing surface for the flip chips, adapting to the lightweight characteristics of flip chips, and ensuring the stability of chip placement without the need for additional clamping structures.

[0035] Symmetrical guide grooves 901 are formed on the inner wall of the placement groove 201. The guide grooves 901 are vertical through grooves, and their inner walls are polished and lubricated. Guide blocks 902 are integrally formed on both sides of the placement boss 9. The outer surface of the guide block 902 is adapted to the inner surface of the guide groove 901. The guide groove 901 and the guide block 902 together constitute the vertical sliding guide mechanism of the placement boss 9, which strictly limits the linear movement trajectory of the placement boss 9, ensuring that the placement boss 9 can only move up and down in the vertical direction, and completely avoiding tilting, jamming or misalignment with the placement groove 201 during the movement of the placement boss 9. The outer surface of the guide block 902 is slidably connected to the inner surface of the guide groove 901. A connecting spring 903 is fixedly installed between the guide block 902 and the inner wall of the guide groove 901. The cylindrical helical compression spring is in a naturally extended state under normal conditions. Its two ends are respectively engaged and fixed to the bottom of the guide block 902 and the inner bottom wall of the guide groove 901. Because the flip chip is relatively light, it cannot exert a downward pressure on the placement boss 9. The connecting spring 903 provides a stable elastic support force for the placement boss 9 under normal conditions, so that the placement boss 9 is always kept in the initial high position in the placement groove 201, ensuring that the placement height of all chips is uniform and providing a height benchmark for the uniformity of flux spraying. At the same time, the connecting spring 903 has a good elastic buffering effect. During the unloading and pushing process, it can buffer the upward pushing force of the ejector plate 802 on the placement boss 9, avoiding hard contact that could damage the chip or placement boss 9. After unloading is completed, it can quickly drive the placement boss 9 back to the initial high position, waiting for the next loading.

[0036] A feeding assembly 8 is provided on the processing table 1. The feeding assembly 8 includes an electric push rod 801 fixed to the processing table 1 by bolts. The electric push rod 801 is a precision stepper electric push rod, and its extension stroke can be precisely adjusted by the electronic control system to provide precise, controllable, and stable linear drive power for the feeding action. It is suitable for ejecting flip chips of different thicknesses and specifications. Its fixed end is firmly connected to the inner bottom wall of the processing table 1, and there is no shaking during operation. An ejection plate 802 is fixed to the output end of the electric push rod 801 by bolts. The ejection plate 802 is made of lightweight and rigid material. The plastic plate has a smooth top surface, which increases the contact area with the bottom of the placement boss 9, so that the ejection force is evenly applied to the bottom of the placement boss 9, and avoids the placement boss 9 from tilting or getting stuck due to uneven force. On the other hand, the plastic material can effectively prevent scratches on the bottom of the placement boss 9 during the ejection process, and also plays a certain role in cushioning. The electric push rod 801 is precisely set directly below one of the placement slots 201, ensuring that the ejector plate 802 can be accurately aligned with the bottom of the placement boss 9 in the vertical direction, so as to realize the vertical ejection action and avoid the chip falling or being damaged due to skewed ejection.

[0037] All content not described in detail in this specification belongs to the prior art known to those skilled in the art. The hydraulic rod 602 and electric push rod 801 used in this device are all standard parts available on the market, and the corresponding models and specifications can be selected according to actual processing needs. The hydraulic station of the hydraulic rod 602 and the electrical control system of the electric push rod 801 can be installed in the reserved space on the side of the processing table 1. Their power supply method, control switch installation and debugging method are all existing conventional technologies, and will not be described in detail here. According to actual production needs, existing flux spraying nozzles, feeding systems, etc. can be added to the spraying station. The installation height of the nozzle can be flexibly adjusted according to the initial height of the placement boss 9 to achieve seamless cooperation with this device.

[0038] Work process:

[0039] Material preparation: The flip chips to be coated with flux are placed one by one on the top surface of the placement bosses 9 in the placement slots 201 on the conveyor plate 2 by manual or external automated material feeding mechanism. Because the flip chips are light, their own weight cannot form an effective downward pressure on the placement bosses 9. At this time, the connecting springs 903 at the bottom of the placement bosses 9 remain in their naturally extended initial state, providing stable elastic support for the placement bosses 9, so that the placement bosses 9 are always in the initial high position in the placement slots 201. The placement height of all chips is kept uniform, and the anti-slip treatment on the top surface of the placement bosses 9 can effectively prevent the chips from sliding or shifting during subsequent conveying, thus completing the material feeding operation.

[0040] Stepping conveying and automatic positioning: The hydraulic rod 602 is activated, and its output end extends downwards, causing the connecting plate 601 to move horizontally downwards along the internal guide groove of the mounting frame 4. This, in turn, causes the drive block 603, drive shaft 604, and push rod 5 to move vertically downwards synchronously until the bottom end of the push rod 5 precisely abuts against the vertical force-bearing surface of the protrusion 3. The hydraulic rod 602 continues to extend downwards, and the push rod 5 applies a horizontal thrust to the protrusion 3. The protrusion 3 transmits this thrust to the connecting slide bar 202, causing it to slide horizontally along the connecting slide groove 101 of the processing table 1, thus achieving the horizontal movement of the conveying plate 2. During the movement of the conveying plate 2, its bottom contacts and smoothly presses against the inclined structure at the top of the locking block 7. Under the action of the pressing force, the locking block 7 overcomes the upward tension of the tension spring and slides vertically downwards along the sliding through hole of the mounting block 10. Its engaging end is in contact with the current locking groove at the bottom of the conveying plate 2. Separation of 203 enables automatic unlocking. When the hydraulic rod 602 drives the push rod 5 to complete one horizontal push, the conveyor plate 2 moves one protrusion 3 distance, and then the output end of the hydraulic rod 602 retracts upward to reset, driving the push rod 5 to move vertically upward in sync. The push rod 5 separates from the protrusion 3. At this time, the torsion spring 605 on the drive shaft 604 releases its elastic potential energy, driving the push rod 5 to rotate quickly around the drive shaft 604 to the initial vertical position, which facilitates precise engagement with the next protrusion 3. At the same time, the tension spring releases its elastic potential energy, driving the locking block 7 to slide vertically upward. Its engaging end precisely engages with the locking groove 203 at the corresponding position on the bottom of the conveyor plate 2, realizing the automatic and precise positioning of the conveyor plate 2 and preventing displacement of the conveyor plate 2 during the spraying process, thus completing one step-by-step conveying. By repeating the above extension and retraction action of the hydraulic rod 602, the continuous step-by-step movement of the conveyor plate 2 can be realized, driving the chips to move sequentially to the spraying station.

[0041] Flux spraying: After the conveyor plate 2 is precisely positioned by the locking block 7 engaging with the locking groove 203, the flux spraying equipment installed at the spraying station is started. The spray nozzle sprays flux onto the flip-chip placed on the boss 9 according to the initial height of the boss 9. Because the conveyor plate 2 is precisely locked and the chip placement height is uniform and without deviation, the spraying equipment can achieve uniform and precise flux spraying, ensuring the spraying quality.

[0042] Automatic unloading: When the coated flip chip moves precisely above the unloading assembly 8 via the stepping movement of the conveyor plate 2, the electric push rod 801 is activated. The output end of the electric push rod 801 extends precisely upward, driving the ejector plate 802 to move vertically upward. The ejector plate 802 makes precise contact with the bottom of the placement boss 9 and applies a steady upward pushing force, pushing the placement boss 9 to move vertically upward along the guide groove 901. At this time, the guide block 902 compresses the connecting spring 903, and the placement boss 9 moves upward until the coated chip on its top surface is ejected from the placement groove 201. The operator can then proceed as scheduled. This workstation is equipped with a receiving trough, conveyor belt, and other collection structures to automatically collect chips and complete the unloading operation. After unloading, the output end of the electric push rod 801 retracts downward to reset, and the ejector plate 802 separates from the placement boss 9. At this time, the compressed connecting spring 903 releases its elastic potential energy, driving the guide block 902 to slide vertically downward along the guide groove 901, thereby pushing the placement boss 9 to quickly reset to its initial high position in the placement groove 201, waiting for the next loading operation. The conveyor plate 2 continues to move step by step, carrying the next coated chip to the unloading station, and the automatic unloading is realized in a cycle.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic flux spraying device for flip chips, comprising a processing table (1), characterized in that: The processing table (1) is equipped with a conveyor plate (2) that slides inside. Several protrusions (3) are fixedly arranged at equal intervals on both sides of the top of the conveyor plate (2). The surface of the processing table (1) is fixedly equipped with a mounting frame (4). A push rod (5) is provided on the mounting frame (4). A power mechanism (6) is also provided on the mounting frame (4) to drive the push rod (5) to move in the vertical direction. When the power mechanism (6) drives the push rod (5) to move down, the bottom end of the push rod (5) contacts and abuts against the protrusions (3), and pushes the conveyor plate (2) to move in the horizontal direction. A locking block (7) is provided on the processing table (1) to limit the movement direction of the conveyor plate (2). A feeding assembly (8) is provided on the processing table (1) to push the coated flip chip out from the conveyor plate (2). The conveyor plate (2) has multiple placement slots (201) that are equidistantly arranged, and the placement slots (201) have placement bosses (9) for placing flip chips that are slidably arranged inside.

2. The automatic flux spraying device for flip chips according to claim 1, characterized in that: The inner wall of the processing table (1) is symmetrically provided with connecting grooves (101), and connecting slides (202) are fixedly provided on both sides of the conveying plate (2). The outer surface of the connecting slide (202) is slidably connected to the inner surface of the connecting groove (101), and the protrusion (3) is fixedly provided on the connecting slide (202).

3. The automatic flux spraying device for flip chips according to claim 1, characterized in that: The inner wall of the placement groove (201) is symmetrically provided with guide grooves (901), and guide blocks (902) are fixedly provided on both sides of the placement boss (9). The outer surface of the guide block (902) is slidably connected to the inner surface of the guide groove (901), and a connecting spring (903) is fixedly provided between the guide block (902) and the inner wall of the guide groove (901).

4. The automatic flux spraying device for flip chips according to claim 1, characterized in that: The bottom of the conveyor plate (2) is provided with a plurality of locking grooves (203), wherein the locking block (7) is engaged with the inner surface of the locking groove (203).

5. The automatic flux spraying device for flip chips according to claim 4, characterized in that: An installation block (10) is fixedly installed on the inner bottom wall of the processing table (1). The locking block (7) is slidably installed on the installation block (10). A tension spring is fixedly installed between the locking block (7) and the inner wall of the installation block (10) to push the locking block (7) to engage with the locking groove (203). The top of the side of the locking block (7) near the mounting frame (4) is set as an inclined surface.

6. The automatic flux spraying device for flip chips according to claim 1, characterized in that: The feeding assembly (8) includes an electric push rod (801) fixedly mounted on the processing table (1). The output end of the electric push rod (801) is fixedly mounted with a top plate (802). The electric push rod (801) is located directly below one of the placement slots (201).

7. The automatic flux spraying device for flip chips according to claim 1, characterized in that: The power mechanism (6) includes a connecting plate (601) that is slidably disposed inside the mounting frame (4). A hydraulic rod (602) is symmetrically and fixedly disposed through the mounting frame (4). The output end of the hydraulic rod (602) is fixedly connected to the connecting plate (601). A drive block (603) is fixedly disposed at the bottom of the hydraulic rod (602). The push rod (5) is rotatably disposed on the drive block (603).

8. An automatic flux spraying device for flip chips according to claim 7, characterized in that: A drive shaft (604) is rotatably mounted through the drive block (603). The push rod (5) is fixedly sleeved on the end of the drive shaft (604). A torsion spring (605) is fixedly mounted between the outer surface of the drive shaft (604) and the drive block (603). The end of the push rod (5) and one of the protrusions (3) are on the same vertical plane as the side of the mounting bracket (4).

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