A method for producing an organic-inorganic composite coating article in the semiconductor field and an article
By forming an organic-inorganic composite coating on an inorganic substrate, the problem of easy peeling of electrostatic sprayed polymer coatings is solved, and the stability and low stress effect of the film layer are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 成都超纯应用材料股份有限公司
- Filing Date
- 2026-03-11
- Publication Date
- 2026-06-05
AI Technical Summary
In existing technologies, direct electrostatic spraying of polymer coatings onto glass or quartz substrates results in poor thermal expansion coefficients of the film layers, which can easily lead to the problem of the coating peeling off.
An inorganic primer film is formed by air spraying, and then an organic coating is formed by electrostatic spraying to form an organic-inorganic composite coating. The specific steps include spraying an organic primer onto the surface of the inorganic substrate and pre-curing it, then spraying an organic paint onto the primer film and melting it into a film until the target thickness is achieved.
The problem of membrane peeling was solved, the membrane stress was reduced to below 1.8 MPa, and no impurities were introduced.
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Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a method for preparing organic-inorganic composite coating products in the semiconductor field and the products thereof. Background Technology
[0002] In the semiconductor field, polymer coatings are formed by spraying polymer coatings onto the surface of glass and quartz substrates to meet the stringent requirements of advanced packaging and wafer manufacturing. The polymer coating is the core functional layer for enabling the precision application of glass substrates in the semiconductor field.
[0003] Currently, in the semiconductor field, the method of forming polymer coatings on glass and quartz substrates by electrostatic spraying is to directly electrostatically spray the polymer coating onto the glass or quartz substrate. This direct electrostatic spraying method results in a difference in the thermal expansion coefficients between the substrate and the film layer, which leads to the problem that the film layer is prone to being pulled apart and peeling off. Summary of the Invention
[0004] To address the above problems, this invention provides a method for preparing organic-inorganic composite coating products in the semiconductor field, as well as the product itself. This method solves the problem that polymer films are prone to peeling off.
[0005] A method for preparing an organic-inorganic composite coating product in the semiconductor field includes the following steps: S1, an organic primer is applied to the surface of an inorganic substrate by air spraying and pre-cured to form a primer film; S2 uses electrostatic spraying to spray an organic paint with a different composition from the organic primer of S1 onto the primer film to form an organic coating, thereby obtaining an organic-inorganic composite coating product for the semiconductor field.
[0006] Optionally, in S1, the organic primer is a PTFE primer, and in S2, the organic paint is a PFA paint.
[0007] Optionally, S2 includes the following steps: S21, PFA paint is sprayed onto the primer film using an electrostatic spray gun; S22, melt-forming film; S23, repeat S21-S22 until the organic coating thickness reaches the set target thickness.
[0008] Optionally, in S2, the parameters for electrostatic spraying are: electrostatic spraying voltage of 60 kV, electrostatic spraying current of 20 μA, and single electrostatic spraying time of 20 seconds.
[0009] Optionally, in S1, pre-curing is carried out at 35℃~60℃.
[0010] Optionally, in S1, the thickness of the primer film is 15 micrometers to 25 micrometers, and the thickness of the organic coating is 100 micrometers to 500 micrometers.
[0011] This invention also provides an organic-inorganic composite coating product for the semiconductor field.
[0012] An organic-inorganic composite coating product for the semiconductor field is prepared by the above-described method.
[0013] Optionally, the film stress of the organic-inorganic composite coating article in the semiconductor field is <1.8 MPa.
[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention solves the problem of polymer films easily peeling off, and does not introduce impurities into the product, reducing film stress to below 1.8 MPa. Detailed Implementation
[0015] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection via an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0016] In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In the description of this invention, "a plurality of" means two or more, unless otherwise precisely specified.
[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0018] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.
[0019] Example 1 A method for preparing an organic-inorganic composite coating product in the semiconductor field includes the following steps: S1, PTFE primer (PTFE refers to polytetrafluoroethylene, PTFE primer is purchased from the market, brand name EK) is sprayed onto the surface of a quartz substrate by air spraying, and pre-cured at 150℃ to form a PTFE primer film with a thickness of 20 micrometers.
[0020] S2, using electrostatic spraying, a PFA topcoat (PFA refers to tetrafluoroethylene-perfluoroalkoxy ether copolymer, the PFA topcoat is purchased from the market, brand name AC) is sprayed onto a PTFE primer film to form a PFA polymer coating with a thickness of 180 micrometers, thus obtaining an organic-inorganic composite coating product for the semiconductor field.
[0021] S2 includes the following steps: S21, PFA topcoat is sprayed onto the PTFE primer film using an electrostatic spray gun.
[0022] S22, high-temperature melting to form a film.
[0023] S23, repeat S21-S22 until the PFA polymer coating thickness reaches the set target thickness.
[0024] The electrostatic spraying parameters are shown in Table 1.
[0025] The film stress of organic-inorganic composite coating products in the semiconductor field was tested, and the results are shown in Table 2 below.
[0026] Comparative Example 1 The only difference between this comparative example and Example 1 is that: In this comparative example, S1 is omitted, there is no primer film, and in S2, the thickness of the PFA polymer coating is 200 micrometers.
[0027] The film stress of organic-inorganic composite coating products in the semiconductor field was tested, and the results are shown in Table 2 below.
[0028] Comparative Example 2 The only difference compared to Example 1 is: In this comparative example, in S1, the air-sprayed primer is PFA primer (PFA primer purchased from the market, brand name TC), and the resulting film is a PFA primer film.
[0029] The film stress of organic-inorganic composite coating products in the semiconductor field was tested, and the results are shown in Table 2 below.
[0030] Example 2 The only difference from Example 1 is that in S2, the thickness of the PFA polymer coating is 280 micrometers.
[0031] Comparative Example 3 Compared to Comparative Example 1, the only difference is that in S2, the PFA polymer coating thickness is 300 micrometers.
[0032] Comparative Example 4 Compared to Comparative Example 2, the only difference is that the PFA polymer coating thickness is 280 micrometers.
[0033] In this comparative example, the thickness of the PFA polymer coating is 180 micrometers.
[0034] Table 1 Electrostatic spraying parameters Table 2 Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A method for preparing an organic-inorganic composite coating product in the semiconductor field, characterized in that, Includes the following steps: S1, an organic primer is applied to the surface of an inorganic substrate by air spraying and pre-cured to form a primer film; S2 uses electrostatic spraying to spray an organic paint with a different composition from the organic primer of S1 onto the primer film to form an organic coating, thereby obtaining an organic-inorganic composite coating product for the semiconductor field.
2. The method for preparing an organic-inorganic composite coating product in the semiconductor field according to claim 1, characterized in that, In S1, the organic primer is PTFE primer, and in S2, the organic paint is PFA paint.
3. The method for preparing an organic-inorganic composite coating product in the semiconductor field according to claim 2, characterized in that, S2 includes the following steps: S21, PFA paint is sprayed onto the primer film using an electrostatic spray gun; S22, melt-forming film; S23, repeat S21-S22 until the organic coating thickness reaches the set target thickness.
4. The method for preparing an organic-inorganic composite coating product in the semiconductor field according to claim 3, characterized in that, In S2, the parameters for electrostatic spraying are: electrostatic spraying voltage of 60 kV, electrostatic spraying current of 20 microamps, and single electrostatic spraying time of 20 seconds.
5. The method for preparing an organic-inorganic composite coating product in the semiconductor field according to claim 1, characterized in that, In S1, pre-curing is carried out at 35℃~60℃.
6. The method for preparing an organic-inorganic composite coating product in the semiconductor field according to claim 1, characterized in that, In S1, the thickness of the primer film is 15 micrometers to 25 micrometers, and the thickness of the organic coating is 100 micrometers to 500 micrometers.
7. An organic-inorganic composite coating product for the semiconductor field, characterized in that, The organic-inorganic composite coating product in the semiconductor field is prepared by the method described in any one of claims 1-6.
8. The method for preparing an organic-inorganic composite coating product in the semiconductor field according to claim 7, characterized in that, The film stress of the organic-inorganic composite coating product in the semiconductor field is <1.8 MPa.