Sintering carrier for improving capacitance consistency of MLCC and sintering process thereof

By using an alumina convex-bottom saggar and a sintering carrier with a porous yttrium oxide coating, combined with an optimized sintering atmosphere control process, the problems of uneven heat distribution and atmosphere in the MLCC manufacturing process have been solved, resulting in a significant improvement in capacitance consistency and density, making it suitable for various specifications of MLCC products.

CN122145179APending Publication Date: 2026-06-05JINGDEZHEN XINSHENG ADVANCED CERAMIC MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JINGDEZHEN XINSHENG ADVANCED CERAMIC MATERIALS CO LTD
Filing Date
2026-01-29
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In the existing technology, traditional alumina flat-bottom sintering carriers have problems such as uneven heat distribution, uneven atmosphere flow field and carrier deformation contamination during MLCC preparation, resulting in MLCC capacitance dispersion and unstable performance.

Method used

An alumina convex-bottom sagger is used as the sintering carrier. The bottom surface is provided with a pyramidal protrusion and covered with a porous yttrium oxide coating. Combined with an optimized sintering atmosphere control process, including specific gas flow and temperature profiles, the atmosphere and heat distribution inside the furnace are improved.

Benefits of technology

It significantly reduces the capacitance standard deviation of MLCC products, improves the consistency of electrical performance and the density of ceramic dielectric, and reduces porosity to 0.25%-0.30%. It is suitable for MLCC products of different sizes, improving product yield and high-temperature reliability.

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Abstract

The application discloses a sintering carrier for improving consistency of capacitance of MLCC and a sintering process thereof, and relates to the technical field of electronic component materials. The sintering carrier is an alumina convex-bottom saggar, the bottom surface of which is provided with regularly arranged convex structures, the height of the convex structures is small, the convex structures are in the shape of pyramids, and the surfaces of the convex structures are covered with yttrium oxide coating. The structure can optimize airflow distribution in a sintering furnace, reduce the atmosphere and temperature difference between the edge and the center area, and improve the heating uniformity. The sintering process comprises the following steps: placing an MLCC green body in the convex-bottom saggar, and sintering the MLCC green body in a nitrogen-hydrogen mixed atmosphere, sequentially passing through a temperature rising zone, a temperature holding zone and a temperature falling zone. The application can significantly reduce the standard deviation of the capacitance of the MLCC from the conventional 6-10% to 1-2%, reduce the porosity of the product, improve the sintering consistency and the service life of the carrier.
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