A complete assembly for a magnetron sputtering process chamber

Abstract

The application provides a complete assembly for a magnetron sputtering process cavity, which comprises an integrated cavity liner, a process adapter, a ceramic ring and a gas path pipeline assembly; an upper part of an outer wall of the integrated cavity liner is extended to form a boss, a plurality of first air holes are provided through the boss in a radial direction, and a plurality of second air holes are provided through the boss below the boss in the radial direction; a first step and a second step are formed on an inner wall of the process adapter; the process adapter is formed with a first gas path hole and a second gas path hole in the radial direction, and a second sealing ring is arranged on the second step; when the integrated cavity liner is assembled to the process adapter, a bottom surface of the boss is arranged on the second step, the first gas path hole is communicated with the first air hole, the second gas path hole is communicated with the second air hole, and the second sealing ring blocks the communication between the first gas path hole and the second gas path hole; the ceramic ring covers the boss and the first step; and the gas path pipeline assembly is connected with the first gas path hole and the second gas path hole respectively.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, and particularly relates to a supporting component for a magnetron sputtering process cavity. Background Technology

[0002] Wafer magnetron sputtering is a core thin-film fabrication technology in semiconductor manufacturing, display panels, photovoltaic cells, and precision electronic devices. It can efficiently prepare key thin films such as conductive metal films, dielectric insulating films, and semiconductor functional films. The quality of the coating directly determines the electrical performance, reliability, and lifespan of the end product. This process must be completed in a sealed vacuum magnetron sputtering chamber. High-energy plasma bombards a vanadium target, and the sputtered vanadium atoms react with oxygen in the chamber to form vanadium oxide, which is then deposited onto the wafer surface to form a thin film.

[0003] With the continuous iteration of semiconductor technology, the market has placed stringent requirements on thin film thickness uniformity (deviation <5%), composition consistency, and defect density. The cavity liner and external adapter, as core supporting components ensuring process stability, directly affect the vacuum environment, gas flow distribution, and plasma state within the cavity, making them crucial factors in determining thin film quality.

[0004] Figure 1 The diagram shows the structure of the existing supporting components. For the water circuit, the design of the internal water circuit of the outer adapter 100 is limited by traditional processing methods, allowing only a straight line. Therefore, the water circuit consists of four branches that are opened horizontally and vertically around the perimeter and connected. The ends of the four branches require sealing components 101, and the connection between the four water circuits requires a sealing structure. In the inlet and outlet sections, inlet and outlet flanges 102 are needed, also requiring a sealing structure. The overall structure is complex, with many parts, and assembly is cumbersome. For the gas circuit, to ensure sufficient reaction of the introduced gas, a specific... The gas exhaust pipe 200 has multiple exhaust holes to achieve uniform transmission of the reaction gas to the internal cavity. It is connected to the external gas interface 202 through the gas connector 201, across the outer adapter 100, to achieve gas transmission. The structure is relatively complex. As for the cavity liner 300, its main function is to protect the inner wall of the cavity. However, due to the limitations of the installation structure of the outer adapter 100 and the gas pipe 200 in the cavity, it consists of three parts: upper liner ring 301, middle liner 302 and lower liner 303. During the replacement process, many parts need to be disassembled, and the replacement operation is complicated and cumbersome, which affects efficiency.

[0005] Therefore, it is necessary to provide a matching component for the magnetron sputtering process cavity, which optimizes the structure, reduces the number of parts, simplifies the assembly and disassembly process, and improves efficiency. Summary of the Invention

[0006] This invention provides a supporting component for a magnetron sputtering process cavity, which optimizes the structure, reduces the number of parts, simplifies the assembly and disassembly process, and improves efficiency.

[0007] To achieve the above objectives, the present invention provides the following technical solution: A supporting component for a magnetron sputtering process cavity includes an integrated cavity liner, a process adapter, a ceramic ring, and a gas path assembly. The integrated cavity liner is cylindrical in shape, with a boss extending outward from the upper part of its outer wall. The boss has multiple first vent holes radially penetrating it, and multiple second vent holes radially penetrating it below the boss. The process adapter is also cylindrical in shape, with a first step extending inward from the upper part of its inner wall. A second step extends inward from below the first step, forming a first inner wall above the first step, a second inner wall between the first and second steps, and a third inner wall below the second step. The process adapter forms a third inner wall radially penetrating the second inner wall. A second air passage is formed by the process adapter radially penetrating the third inner wall, and a second sealing ring is provided on the second step. When the integrated cavity liner is assembled into the process adapter from above, the bottom surface of the boss is provided on the second step. The first air passage is connected to the first vent hole, and the second air passage is connected to the second vent hole. The second sealing ring blocks the connection between the first air passage and the second air passage. The ceramic ring covers the top surface of the boss and the first step to seal the top. The air passage pipeline assembly introduces a first gas into the integrated cavity liner through the first air passage and the first vent hole, and introduces a second gas into the integrated cavity liner through the second air passage and the second vent hole.

[0008] Preferably, a water channel interface is provided on one side of the process adapter, and an internal water channel extends circumferentially inside the process adapter and communicates with the water channel interface. The internal water channel is staggered from the first air channel and the second air channel.

[0009] Preferably, the water interface is provided with an inlet and an outlet, both of which are provided with internal threads, and both the inlet and the outlet are threadedly connected to the water connector.

[0010] Preferably, the process adapter is made of stainless steel, and the process adapter and the water interface on one side are integrally formed by 3D printing.

[0011] Preferably, a first sealing ring is provided on the first step, and the first sealing ring achieves the sealing of the ceramic ring at the first step.

[0012] Preferably, the bottom surface of the process adapter is provided with a sealing surface, and the process adapter is sealed to the process cavity through the sealing surface.

[0013] Preferably, the bottom of the integrated cavity liner is bent inward and then upward, forming a central hole at the center that allows the wafer to enter.

[0014] Preferably, the material of the integrated cavity liner is aluminum alloy, and the integrated cavity liner is integrally formed by 3D printing.

[0015] Preferably, the gas pipeline assembly includes a first air inlet pipe, a first air inlet port, a second air inlet pipe, and a second air inlet port; the first air inlet pipe is connected to the first air inlet port through the first air inlet port to allow the first gas to pass through; the second air inlet pipe is connected to the second air inlet port through the second air inlet port to allow the second gas to pass through.

[0016] Preferably, both the top and bottom surfaces of the ceramic ring are polished to isolate it from the external environment while providing insulation.

[0017] Compared with the prior art, the technical solution of the present invention has beneficial effects.

[0018] For example, the supporting components for the magnetron sputtering process cavity feature an integrated cavity liner, an integrated reaction gas inlet microchannel, and integrated gas guiding function, simplifying the internal structure and enabling a stable supply of reaction gas inside the cavity. This solves the vacuum leakage problem that was easily caused by the previous separate assembly. The process adapter integrates an internal water channel to enhance the temperature control reaction inside the cavity, ensuring the purity of the prepared film and the uniformity of the coating. The optimized structure reduces the number of parts, eliminates the hidden dangers of traditional assembly gaps, and improves the overall sealing performance of the cavity, structurally ensuring the purity of the coating.

[0019] Furthermore, the integrated cavity liner and process adapter are both integrally printed, further reducing the sealing structure, making assembly simpler and sealing performance stronger; achieving a microporous structure for the liner that is difficult to achieve with traditional processing techniques. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the existing supporting components for the magnetron sputtering process cavity; Figure 2 This is a schematic diagram of the supporting components for the magnetron sputtering process cavity in an embodiment of the present invention; Figure 3 This is a partial cross-sectional view of the supporting components for the magnetron sputtering process cavity in an embodiment of the present invention; Figure 4 This is a cross-sectional view of the integrated cavity liner portion in an embodiment of the present invention; Figure 5This is a schematic diagram of the process adapter structure in an embodiment of the present invention; Figure 6 This is a schematic diagram of the process adapter from another angle in an embodiment of the present invention; Figure 7 This is a cross-sectional view of the process adapter in an embodiment of the present invention; Figure 8 This is a schematic diagram of the ceramic ring structure in an embodiment of the present invention; Figure 9 This is a schematic diagram of the gas pipeline assembly structure in an embodiment of the present invention. Detailed Implementation

[0021] To make the objectives, features, and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining the present invention and are not intended to limit the present invention. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0022] Figure 1 This is a schematic diagram of the existing supporting components for the magnetron sputtering process cavity; Figure 2 This is a schematic diagram of the supporting components for the magnetron sputtering process cavity in an embodiment of the present invention; Figure 3 This is a partial cross-sectional view of the supporting components for the magnetron sputtering process cavity in an embodiment of the present invention; Figure 4 This is a cross-sectional view of the integrated cavity liner portion in an embodiment of the present invention; Figure 5 This is a schematic diagram of the process adapter structure in an embodiment of the present invention; Figure 6 This is a schematic diagram of the process adapter from another angle in an embodiment of the present invention; Figure 7 This is a cross-sectional view of the process adapter in an embodiment of the present invention; Figure 8 This is a schematic diagram of the ceramic ring structure in an embodiment of the present invention; Figure 9 This is a schematic diagram of the gas pipeline assembly structure in an embodiment of the present invention.

[0023] Reference Figures 1-9 This invention provides a supporting component for a magnetron sputtering process cavity.

[0024] Specifically, the supporting components for the magnetron sputtering process cavity include an integrated cavity liner 1, a process adapter 2, a ceramic ring 3, and a gas path assembly 4. The integrated cavity liner 1 is cylindrical in shape, with a boss 11 extending outward from the upper part of its outer wall. Multiple first vent holes 12 are radially connected to the boss 11, and multiple second vent holes 13 are radially connected to the bottom of the boss 11. The process adapter 2 is cylindrical in shape, with a first step extending inward from the upper part of its inner wall. A second step extends inward from the bottom of the first step, forming a first inner wall above the first step, a second inner wall between the first and second steps, and a third inner wall below the second step. The process adapter 2 forms a second inner wall that radially connects to the second inner wall. The first air passage 21, the process adapter 2 radially penetrates the third inner wall to form a second air passage 22, and a second sealing ring 24 is provided on the second step; when the integrated cavity liner 1 is assembled into the process adapter 2 from above, the bottom surface of the boss 11 is provided on the second step, the first air passage 21 is connected to the first vent 12, the second air passage 22 is connected to the second vent 13, and the second sealing ring 24 blocks the connection between the first air passage 21 and the second air passage 22; the ceramic ring 3 covers the top surface of the boss 11 and the first step to seal the top; the air passage assembly 4 introduces the first gas into the integrated cavity liner 1 through the first air passage 21 and the first vent 12, and introduces the second gas into the integrated cavity liner 1 through the second air passage 22 and the second vent 13.

[0025] Specifically, by setting multiple first vent holes 12 and multiple second vent holes 13 with microporous structures in different areas of the integrated cavity liner 1 to replace the original gas exhaust pipe 200, the structure is simplified and the efficiency is improved.

[0026] Specifically, the bottom surface of the boss 11, together with the second sealing ring 24 and the second step, achieves sealing and isolation between the two gas streams before they enter the inner liner 1 of the integrated cavity, ensuring that the gases are isolated from each other before entering the cavity and ensuring the purity of the gases.

[0027] Specifically, multiple first vent holes 12 are arranged in multiple rows and are spaced at equal intervals along the circumference; multiple second vent holes 13 are arranged in multiple rows and are spaced at equal intervals along the circumference.

[0028] In some embodiments, a water channel interface 23 is provided on one side of the process adapter 2, and an internal water channel 27 is provided inside the process adapter 2 along the circumferential direction and communicates with the water channel interface 23. The internal water channel 27 is staggered from the first air channel hole 21 and the second air channel hole 22.

[0029] In some embodiments, the water interface 23 is provided with an inlet and an outlet, both of which are provided with internal threads 28, and both the inlet and the outlet are threadedly connected to the water connector 29.

[0030] Specifically, the external circulating water system connects the inlet, internal water passage and outlet through the water connector 29, and introduces liquid at a specific temperature to control the temperature inside the cavity and achieve the purposes of heat dissipation, heating and constant temperature.

[0031] In some embodiments, the process adapter 2 is made of stainless steel, and the process adapter 2 and the water interface 23 on one side are integrally formed by 3D printing, so that the inlet and outlet of the water interface 23 in the internal water channel 27 are integrally connected without the need for additional seals and connectors.

[0032] In some embodiments, a first sealing ring 25 is provided on the first step, and the first sealing ring 25 achieves sealing of the ceramic ring 3 at the first step.

[0033] In some embodiments, the bottom surface of the process adapter 2 is provided with a sealing surface 26, and the process adapter 2 is sealed to the process cavity (not shown) through the sealing surface 26.

[0034] In some embodiments, the bottom of the integral cavity liner 1 is bent inward and then upward, forming a central hole in the center that allows the wafer 5 to enter.

[0035] In some embodiments, the one-piece cavity liner 1 is made of aluminum alloy and is integrally formed by 3D printing.

[0036] In some embodiments, the gas pipeline assembly 4 includes a first air inlet pipe 41, a first air inlet port 42, a second air inlet pipe 43, and a second air inlet port 44; the first air inlet pipe 41 is connected to a first air passage hole 21 through the first air inlet port 42 to allow the first gas to pass through; the second air inlet pipe 43 is connected to a second air passage hole 22 through the second air inlet port 44 to allow the second gas to pass through.

[0037] In some embodiments, both the top and bottom surfaces of the ceramic ring 3 are polished to isolate it from the external environment while providing insulation.

[0038] In summary, the supporting components for the magnetron sputtering process cavity provided by this invention feature an integrated cavity liner 1, an integrated reaction gas inlet microchannel, and integrated gas guiding function, simplifying the internal structure and enabling a stable supply of reaction gas to the cavity, thus solving the vacuum leakage problem easily caused by the previous separate assembly. The process adapter 2 integrates an internal water channel, enhancing the temperature control reaction inside the cavity and ensuring the purity and uniformity of the thin film preparation. The optimized structure reduces the number of parts, eliminates the hidden dangers of traditional assembly gaps, and improves the overall sealing performance of the cavity, structurally ensuring the purity of the coating.

[0039] Furthermore, the integrated cavity liner 1 and process adapter 2 are both integrally printed, further reducing the sealing structure, making assembly simpler and sealing performance stronger; achieving a microporous structure of the liner that is difficult to achieve with traditional processing techniques.

[0040] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the invention, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0041] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A supporting component for a magnetron sputtering process cavity, characterized in that, The system includes an integrated cavity liner, a process adapter, a ceramic ring, and a gas path assembly. The integrated cavity liner is cylindrical in shape. A boss extends outward from the upper part of the outer wall of the integrated cavity liner, and multiple first vent holes are radially connected to the boss. Multiple second vent holes are radially connected below the boss. The process adapter is also cylindrical in shape. A first step extends inward from the upper part of the inner wall of the process adapter. A second step extends inward from below the first step. A first inner wall is formed above the first step, a second inner wall is formed between the first step and the second step, and a third inner wall is formed below the second step. A first gas path hole is formed radially through the second inner wall of the process adapter. The process adapter has a second air passage hole formed radially through the third inner wall, and a second sealing ring is provided on the second step; when the integrated cavity liner is assembled into the process adapter from above, the bottom surface of the boss is provided on the second step, the first air passage hole communicates with the first vent hole, the second air passage hole communicates with the second vent hole, and the second sealing ring blocks the communication between the first air passage hole and the second air passage hole; the ceramic ring covers the top surface of the boss and the first step to seal the top; the air passage pipe assembly introduces a first gas into the integrated cavity liner through the first air passage hole and the first vent hole, and introduces a second gas into the integrated cavity liner through the second air passage hole and the second vent hole.

2. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, A water channel interface is provided on one side of the process adapter, and an internal water channel is provided inside the process adapter along the circumferential direction and communicates with the water channel interface. The internal water channel is staggered from the first air channel and the second air channel.

3. The supporting components for a magnetron sputtering process cavity according to claim 2, characterized in that, The water interface is provided with an inlet and an outlet, both of which are provided with internal threads and are threaded to the water connector.

4. The supporting components for a magnetron sputtering process cavity according to claim 2, characterized in that, The process adapter is made of stainless steel, and the process adapter and the water interface on one side are integrally formed by 3D printing.

5. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, A first sealing ring is provided on the first step, and the first sealing ring achieves the sealing of the ceramic ring at the first step.

6. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, The bottom surface of the process adapter is provided with a sealing surface, and the process adapter is sealed to the process cavity through the sealing surface.

7. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, The bottom of the integrated cavity liner is bent inward and then upward, forming a central hole in the center that allows the wafer to enter.

8. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, The integrated cavity liner is made of aluminum alloy and is formed in one piece by 3D printing.

9. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, The gas pipeline assembly includes a first air inlet pipe, a first air inlet port, a second air inlet pipe, and a second air inlet port; the first air inlet pipe is connected to the first air inlet port through the first air inlet port to allow the first gas to pass through; the second air inlet pipe is connected to the second air inlet port through the second air inlet port to allow the second gas to pass through.

10. The supporting components for a magnetron sputtering process cavity according to claim 1, characterized in that, Both the top and bottom surfaces of the ceramic ring are polished, which isolates it from the external environment while providing insulation.

Images