A rapid thermal and cold cycle system based on ultra-low temperature vacuum pump and application thereof
By using a rapid thermal-cooling cycle system for an ultra-low temperature vacuum pump, combined with a closed connection between a spiral micro-channel heat exchange tube and an external refrigerator, and an activated carbon filter layer, the stability and sealing issues of the vacuum pump under extremely low temperature and ultra-high vacuum conditions are solved, achieving efficient pumping and cooling integration, which is suitable for various high-precision applications such as quantum computing and semiconductor coating.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ANHUI GUOKE HANYI TECHNOLOGY CO LTD
- Filing Date
- 2026-04-10
- Publication Date
- 2026-06-05
AI Technical Summary
Existing vacuum pumps suffer from problems such as high-frequency electromagnetic interference, vibration transmission, insufficient vacuum sealing, and low gas capture efficiency under extremely low temperature and ultra-high vacuum conditions. In addition, the equipment is large in size and cannot be adapted to small spaces.
It adopts a rapid hot and cold cycle system based on an ultra-low temperature vacuum pump, and is connected to an external refrigerator in a closed loop through a spiral micro-channel heat exchange tube to achieve integrated pumping and cooling. Combined with an activated carbon filter layer and a high-precision sensor, it ensures temperature stability and vacuum level. A one-way valve is used to prevent gas backflow. The design is compact and functionally integrated.
It integrates the efficient pumping and cooling functions of cryogenic vacuum pumps, ensuring the stability of temperature and vacuum, reducing maintenance frequency, and improving the mechanical stability and versatility of the equipment, making it suitable for a variety of high-precision scenarios.
Smart Images
Figure CN122148530A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cryogenic vacuum pumps, and particularly to a rapid thermal and cold cycle system based on a cryogenic vacuum pump and its application. Background Art
[0002] The vacuum system supporting a dilution refrigerator needs to meet the dual requirements of extremely low temperature and ultra-high vacuum. Current vacuum pumps have problems such as high-frequency electromagnetic interference, vibration conduction, insufficient vacuum tightness, etc., and some devices are too large to fit into a narrow experimental space.
[0003] In the prior art, various defects are likely to occur, including that the external filtering device is difficult to completely eliminate the high-frequency signal coupling interference, resulting in the decoupling of the electronic temperature and the lattice temperature; the vibration during the operation of the vacuum pump affects the precision measurement accuracy through mechanical conduction; the sealing structure is prone to failure in a low-temperature environment, and the traditional cryogenic pump has low capture efficiency for light gases such as hydrogen and helium, and the regeneration operation is complex. Summary of the Invention
[0004] The purpose of the present invention is to provide a rapid thermal and cold cycle system based on a cryogenic vacuum pump and its application to solve the problems raised in the above background art.
[0005] To achieve the above purpose, the present invention provides the following technical solution: A rapid thermal and cold cycle system based on a cryogenic vacuum pump and its application, including a vacuum chamber. Inside the vacuum chamber, a sample stage is provided, which is used to carry samples. The upper end of the vacuum chamber is installed with a one-way valve through a flange. The upper end of the one-way valve is installed with a filtering chamber. The upper end of the filtering chamber is installed with a cryogenic vacuum pump. A buffer chamber is provided at one end of the vacuum pump close to the filtering chamber. Inside the cryogenic vacuum pump, there is an inner core, and a spiral micro-channel heat exchange tube is arranged outside the inner core. Two external interfaces are symmetrically arranged at the upper end of the cryogenic vacuum pump. The two ends of the micro-channel heat exchange tube are respectively connected to the two external interfaces, and the two external interfaces are connected to an external refrigerator.
[0006] Preferably, the outer end of the vacuum chamber is connected to a control box through a cable, and a control center is carried inside the control box.
[0007] Preferably, the control center includes a control main board, a processor and a storage unit. The control main board is connected to the inner wall of the control box by bolts. Various components are carried on the surface of the control main board. A processor is installed at the center position of the control main board. A plurality of storage units are equidistantly arranged at the edge position of the surface of the control main board, and the plurality of storage units are electrically connected to the processor.
[0008] Preferably, an activated carbon filter layer is installed at the center position inside the filtering chamber, and filter nets are installed at the positions inside the filtering chamber on both the upper and lower sides of the activated carbon filter layer.
[0009] Preferably, the cryogenic vacuum pump has two symmetrically mounted connecting plates on its exterior. Each connecting plate has a support rod mounted on its lower end, and the lower ends of the two support rods are connected to the upper end of the vacuum chamber.
[0010] Preferably, multiple heat-conducting plates are inserted into the left and right side walls of the vacuum chamber. A protective plate is installed on the outside of the heat-conducting plates on the same side. A disassembly plate is installed on the upper end of the protective plate. A plug-in slot is installed on the upper end of the disassembly plate. The plug-in slot is connected to a power source through a cable. Multiple resistance wire tubes are equidistantly arranged on the lower end of the disassembly plate. The multiple resistance wire tubes and the multiple heat-conducting plates are arranged alternately.
[0011] Preferably, the cryogenic vacuum pump has two symmetrically arranged connecting pipes inside, one end of each connecting pipe is connected to a micro-channel heat exchange tube, and the other end is connected to an external interface.
[0012] Preferably, two vacuum sensors are symmetrically installed on the left and right side walls inside the vacuum chamber, a high-precision platinum resistance temperature sensor is installed at the center of the sample stage, thermocouple temperature sensors are installed at the pump core end and the outlet end of the microchannel heat exchange tube inside the low-temperature vacuum pump, an ionization gauge vacuum sensor is installed on the inner wall of the buffer chamber, and the control box is connected to multiple sensors via signals.
[0013] An application of a rapid thermal-cooling cycle system based on an ultra-low temperature vacuum pump is disclosed. The system is applied to low-temperature performance testing of quantum computing chips, vacuum coating processes for third-generation semiconductor materials, phase transition research of topological insulators, reliability testing of precision aerospace components under extreme environments, and vacuum melting of ultra-high purity metal materials.
[0014] Compared with the prior art, the beneficial effects of the present invention are: This rapid thermal-cooling cycle system based on an ultra-low temperature vacuum pump and its application, through the design of "a spiral microchannel heat exchange tube wound around the pump core + a closed connection with an external refrigerator," achieves the integration of the dual functions of "vacuuming + cooling" of the cryogenic vacuum pump, completely changing the structural defects of traditional discrete systems. The microchannel heat exchange tube is tightly fitted to the pump core, ensuring uniform and efficient cold transfer, enabling the pump core to rapidly drop to ultra-low temperatures below 10K. This not only improves the pumping efficiency through the adsorption-condensation effect but also acts as a built-in cold trap to reduce thermal load interference. Combined with a one-way valve to prevent gas backflow, it solves the problems of difficulty in balancing vacuum and temperature stability and severe thermal interference in traditional systems, providing an integrated solution for ultra-high vacuum-ultra-low temperature synergistic environments.
[0015] This rapid thermal cycling system based on an ultra-low temperature vacuum pump and its application uses a filter screen to intercept large particulate impurities and an activated carbon filter layer to adsorb tiny impurities, water vapor, and harmful gases, preventing them from clogging the microchannel heat exchange tubes or contaminating the pump core adsorption surface after entering the low temperature vacuum pump. This design significantly reduces the maintenance frequency of the vacuum pump, extends the service life of the pump core and heat exchange tubes, and avoids the reduction in pumping efficiency caused by impurities. It ensures that the system maintains stable ultra-high vacuum performance during long-term operation, solving the pain points of frequent equipment failures and high maintenance costs caused by gas impurities in traditional systems.
[0016] This rapid thermal cycling system based on an ultra-low temperature vacuum pump and its application achieve uniform heat conduction through the alternating arrangement of resistance wire tubes and heat-conducting plates. Combined with a high-precision platinum resistance temperature sensor on the sample stage, the temperature rise is more accurate. The efficient cooling of the microchannel heat exchange tube and the real-time feedback from the sensor form a rapid thermal cycling. The control center analyzes the sensor data in real time through the processor and dynamically adjusts the cooling and heating parameters. This solves the problems of uneven heating, large temperature fluctuations, and slow cycling rates in traditional systems, and is perfectly adapted to scenarios with stringent requirements for temperature accuracy and cycling efficiency, such as quantum computing chip testing and material phase transition research.
[0017] This rapid thermal cycling system based on an ultra-low temperature vacuum pump and its application features a stable installation of the cryogenic vacuum pump at the top of the vacuum chamber, evenly distributing the pump's weight and preventing loose connections and seal failures caused by operational vibrations. This ensures the system's mechanical stability and vacuum sealing. Simultaneously, the system integrates functions such as integrated refrigeration and pumping, precise temperature control, and deep purification, making it flexibly adaptable to various high-precision scenarios such as quantum computing, semiconductor coating, and aerospace component testing. This design not only solves the problems of loose structure and poor sealing reliability of traditional equipment but also broadens the application scope through functional integration, enhancing the equipment's versatility and market competitiveness, and providing standardized solutions for extreme environmental requirements in different fields. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the protective plate of the present invention; Figure 3 This is a schematic diagram of the internal structure of the cryogenic vacuum pump of the present invention; Figure 4 This is a schematic diagram of the control center structure of the present invention; Figure 5 This is a schematic diagram of the internal structure of the filter chamber of the present invention.
[0019] In the diagram: 1. Vacuum chamber; 2. Protection plate; 3. Control box; 4. One-way valve; 5. Filter chamber; 6. Cryogenic vacuum pump; 7. Connecting plate; 8. Heat-conducting plate; 9. Disassembly plate; 10. Insertion slot; 11. Resistance wire tube; 12. Inner core; 13. Microchannel heat exchange tube; 14. Buffer chamber; 15. Connecting pipe; 16. External interface; 17. Control center; 1701. Control motherboard; 1702. Processor; 1702. Storage unit; 18. Support rod; 19. Activated carbon filter layer; 20. Filter screen; 21. Thermocouple temperature sensor; 22. Ionization gauge vacuum sensor. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0022] like Figures 1 to 5As shown, this embodiment is based on a rapid thermal cycling system and its application using an ultra-low temperature vacuum pump 6. It includes a vacuum chamber 1, inside which is a sample stage for holding samples. The vacuum chamber 1 serves as the core working space for carrying samples, and the sample stage inside is used to stably hold the samples to be tested or processed, ensuring the sample's position is fixed during experiments or production. It should be noted that the sample stage and samples need to be customized according to the specific application; the materials and functions will produce different effects depending on the application. A one-way valve 4 is installed at the upper end of the vacuum chamber 1 via a flange. This one-way valve 4 effectively prevents gas backflow and avoids disrupting the vacuum environment. A filter chamber 5 is installed above the one-way valve 4. The filter chamber 5 at the upper end of the one-way valve 4 is used to pre-treat the gas entering the cryogenic vacuum pump 6, reducing the impact of impurities on the pump's internal structure. The cryogenic vacuum pump is installed above the filter chamber 5. 6. The cryogenic vacuum pump 6 has an inner core 12 inside, and a spiral micro-channel heat exchange tube 13 is arranged outside the inner core 12. As the core execution unit of the system for "vacuuming + cooling", the inner core 12 is a key component for gas adsorption and condensation. The spiral micro-channel heat exchange tube 13 can maximize the contact area with the inner core 12, ensuring uniform transfer of cold energy. The upper end of the cryogenic vacuum pump 6 is symmetrically provided with two external interfaces 16. The two ends of the micro-channel heat exchange tube 13 are respectively connected to the two external interfaces 16. The two external interfaces 16 are connected to an external refrigerator. The two external interfaces 16 form a closed-loop cold energy circulation loop through the connection with the external refrigerator, realizing continuous cooling of the pump core. Through the integrated design of the micro-channel heat exchange tube 13 and the pump core, the cryogenic vacuum pump 6 can simultaneously have the dual functions of vacuuming and cooling, reducing heat load interference from the source and solving the pain point of traditional discrete systems where vacuum degree and temperature stability are difficult to balance.
[0023] Specifically, the outer end of the vacuum chamber 1 is connected to the control box 3 via a cable. The control box 3 houses the control center 17. As the control carrier of the system, the control box 3, which is connected to the outer end of the vacuum chamber 1 via a cable, can provide physical protection for the internal control center 17 and prevent the external environment from interfering with the control components. The control center 17 inside the control box 3 is responsible for receiving feedback signals from various components, parsing instructions, and issuing control commands to achieve coordinated operation of functions such as vacuuming, cooling, and heating.
[0024] Furthermore, the control center 17 includes a control motherboard 1701, a processor 1702, and storage units 1702. The control motherboard 1701 is connected to the inner wall of the control box 3 by bolts. Various components are mounted on the surface of the control motherboard 1701. The processor 1702 is installed at the center of the control motherboard 1701. Multiple storage units 1702 are equidistantly arranged at the edges of the control motherboard 1701 surface. The multiple storage units 1702 are electrically connected to the processor 1702. The control motherboard 1701 is fixed to the inner wall of the control box 3 by bolts, providing a stable mounting carrier for various components and ensuring the reliability of circuit connections. The processor 1702 at the center serves as the core of the control hub 17, possessing data processing, instruction calculation, and issuance functions. It can precisely regulate the operating status of components such as the refrigerator and heating elements based on preset programs and sensor feedback signals. Multiple storage units 1702 at the edge are electrically connected to the processor 1702 and are used to store system operating parameters, experimental or production data, and control programs, facilitating subsequent data traceability and program recall. It should be noted that the processor 1702 is externally equipped with multiple storage units 1702, and the contents of the multiple storage units 1702 are identical. They are stacked together to increase fault tolerance.
[0025] Furthermore, an activated carbon filter layer 19 is installed at the center of the filter chamber 5. Filter screens 20 are installed on both the upper and lower sides of the activated carbon filter layer 19 within the filter chamber 5. The activated carbon filter layer 19 at the center of the filter chamber 5 utilizes the high adsorption properties of activated carbon to effectively adsorb minute impurities, water vapor, and harmful gases in the gas, preventing them from clogging the microchannel heat exchange tubes or contaminating the pump core adsorption surface after entering the low-temperature vacuum pump 6. The filter screens 20 on both sides of the activated carbon filter layer 19, as a primary filtration structure, can intercept large particulate impurities in the gas, reducing the clogging rate of the activated carbon filter layer 19 and extending its service life. This design, through a three-stage filtration structure of "double-layer filter screen 20 + activated carbon filter layer 19," achieves deep purification of the incoming air, solving the problem of reduced vacuum pump efficiency and shortened maintenance cycles caused by gas impurities in traditional systems, and providing a clean guarantee for the system's ultra-high vacuum environment.
[0026] Furthermore, two connecting plates 7 are symmetrically installed on the outside of the cryogenic vacuum pump 6. Support rods 18 are installed at the lower ends of the two connecting plates 7. The lower ends of the two support rods 18 are connected to the upper end of the vacuum chamber 1. The two connecting plates 7 symmetrically installed on the outside of the cryogenic vacuum pump 6 serve as force transmission components. They cooperate with the support rods 18 at the lower ends to form a stable support structure, which evenly transmits the weight of the cryogenic vacuum pump 6 to the upper end of the vacuum chamber 1, and avoids deformation of the connection parts due to the weight of the pump body.
[0027] Furthermore, multiple heat-conducting plates 8 are inserted into the left and right side walls of the vacuum chamber 1. A protective plate 2 is installed on the outside of the heat-conducting plates 8 on the same side. A disassembly plate 9 is installed on the upper end of the protective plate 2. A connector slot 10 is installed on the upper end of the disassembly plate 9. The connector slot 10 is connected to the power supply via a cable. Multiple resistance wire tubes 11 are equidistantly arranged at the lower end of the disassembly plate 9. The multiple resistance wire tubes 11 and the multiple heat-conducting plates 8 are arranged alternately. The multiple heat-conducting plates 8 inserted into the left and right side walls of the vacuum chamber 1 are made of high thermal conductivity material, which can evenly transfer heat to the interior of the vacuum chamber 1 and avoid local overheating or underheating. The protective plate 2 outside the heat-conducting plates 8 can prevent the external environment from damaging the heating components and reduce heat loss. The design of the disassembly plate 9 facilitates the maintenance or replacement of the resistance wire tubes 11, improving the maintainability of the equipment. The connector slot 10 is connected to the power supply via a cable to provide a stable power supply to the resistance wire tubes 11. The multiple resistance wire tubes 11 and the heat-conducting plates 8 are arranged alternately to increase the heating area and improve the heating rate.
[0028] Furthermore, the cryogenic vacuum pump 6 has two symmetrically arranged connecting pipes 15 inside. One end of each connecting pipe 15 is connected to the microchannel heat exchange tube 13, and the other end is connected to an external interface 16. The two connecting pipes 15 inside the cryogenic vacuum pump 6 serve as transitional connection components between the microchannel heat exchange tube and the external interface 16. One end of each pipe is connected to the spiral microchannel heat exchange tube, and the other end is connected to the external interface 16, realizing a closed-loop connection between the microchannel heat exchange tube and the external refrigerator. The connecting pipes 15 are made of a material with high thermal conductivity and low leakage, which can reduce the loss of cold energy during transmission and prevent gas leakage from affecting the vacuum environment.
[0029] Furthermore, two vacuum sensors are symmetrically installed on the left and right side walls inside the vacuum chamber 1. A high-precision platinum resistance temperature sensor is installed at the center of the sample stage. Thermocouple temperature sensors 21 are installed inside the cryogenic vacuum pump 6 at the end of the pump core 12 and at the outlet of the microchannel heat exchange tube. An ionization gauge vacuum sensor 22 is installed on the inner wall of the buffer chamber 14. The control box 3 is connected to multiple sensors. The two vacuum sensors symmetrically installed on the left and right side walls inside the vacuum chamber 1 can monitor the changes in vacuum level in the chamber in real time, ensuring that the vacuum environment meets the requirements of experiments or production. The high-precision platinum resistance temperature sensor installed at the center of the sample stage can accurately collect the temperature around the sample. Temperature data provides a core reference for temperature control. The thermocouple temperature sensor 21 at the end of the pump core inside the low-temperature vacuum pump 6 is used to monitor the actual cooling temperature of the pump core to ensure adsorption and condensation effects. The thermocouple temperature sensor 21 at the outlet of the microchannel heat exchange tube can provide feedback on the cooling cycle status. The ionization gauge vacuum sensor 22 on the inner wall of the buffer chamber 14 can monitor the gas state inside the pump body and determine whether the pump core is adsorbed to saturation. The control box 3 is connected to the signals of all sensors to realize the real-time transmission of monitoring data. Based on this data, the control center 17 can dynamically adjust the operating parameters of components such as the refrigerator and heating elements, and at the same time detect abnormal states and issue early warnings in a timely manner.
[0030] This embodiment is based on the application of a rapid thermal cycling system for ultra-low temperature vacuum pumps. The system is applied to low-temperature performance testing of quantum computing chips, vacuum coating processes for third-generation semiconductor materials, phase transition research of topological insulators, reliability testing of precision aerospace components in extreme environments, and vacuum melting of ultra-high purity metal materials.
[0031] The usage method of this embodiment is as follows: Before use, check the tightness of the connection between the vacuum chamber 1, the cryogenic vacuum pump 6, and the control box 3; clean the flange sealing surface; fix the sample to be processed on the sample stage inside the vacuum chamber 1 and lock the chamber door; confirm that the filter screen 20 and the activated carbon filter layer 19 in the filter chamber 5 are installed in place; connect the power supply to the resistance wire tube 11 through the insertion slot 10; ensure that the signal connection between various sensors and the control box 3 is normal; the control center 17 automatically initializes and calls the preset parameters in the storage unit 1702; the cryogenic vacuum pump 6 is started to pre-pump the vacuum chamber 1; the gas enters the filter chamber 5 through the one-way valve 4; after three-stage filtration and purification, it enters the cryogenic vacuum pump 6; the vacuum sensor provides real-time feedback data until the cavity vacuum degree reaches the target set range; after the pre-pumping is completed, the control... The central control unit 17 starts the external refrigerator, and the cooling energy is transferred to the spiral micro-channel heat exchange tube 13 outside the inner core 12 through the external interface 16 and connecting pipe 15 to quickly cool the pump core. Thermocouple temperature sensor 21 monitors the temperature in real time and feeds it back to the control central control unit 17 to maintain the ultra-high vacuum and target low temperature environment. When the temperature needs to be raised, the control box 3 adjusts the heating of the resistance wire tube 11, which is evenly conducted to the vacuum chamber 1 through the heat conduction plate 8. With the help of the sensor, precise temperature control is achieved to complete the thermal cooling cycle. After the experiment, the refrigerator is turned off first, and the system is heated to room temperature through the resistance wire tube 11. Then the vacuum pump is turned off. If the ionization gauge vacuum sensor 22 detects that the pump core adsorption is saturated, the regeneration program can be started to discharge the adsorbed gas. After replacing the filter components, the power of the control box 3 is turned off, and the operating data is recorded for traceability.
[0032] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A rapid thermal cycling system based on an ultra-low temperature vacuum pump, comprising a vacuum chamber (1), wherein a sample stage is disposed inside the vacuum chamber (1) for mounting a sample, characterized in that: A one-way valve (4) is installed at the upper end of the vacuum chamber (1) via a flange. A filter chamber (5) is installed at the upper end of the one-way valve (4). A low-temperature vacuum pump (6) is installed at the upper end of the filter chamber (5). A buffer chamber (14) is provided at one end of the vacuum pump (6) near the filter chamber (5). An inner core (12) is provided inside the low-temperature vacuum pump (6). A spiral micro-channel heat exchange tube (13) is provided outside the inner core (12). Two external interfaces (16) are symmetrically provided at the upper end of the low-temperature vacuum pump (6). The two ends of the micro-channel heat exchange tube (13) are respectively connected to the two external interfaces (16). The two external interfaces (16) are connected to an external dilution refrigerator.
2. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 1, characterized in that: The outer end of the vacuum chamber (1) is connected to the control box (3) via a cable, and the control box (3) contains a control center (17).
3. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 2, characterized in that: The control center (17) includes a control motherboard (1701), a processor (1702) and a storage unit (1702). The control motherboard (1701) is connected to the inner wall of the control box (3) by bolts. Various components are mounted on the surface of the control motherboard (1701). The processor (1702) is installed at the center of the control motherboard (1701). Multiple storage units (1702) are equidistantly arranged at the edge of the surface of the control motherboard (1701). The multiple storage units (1702) are electrically connected to the processor (1702).
4. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 1, characterized in that: An activated carbon filter layer (19) is installed at the center of the filter chamber (5), and filter screens (20) are installed at the positions inside the filter chamber (5) on both the upper and lower sides of the activated carbon filter layer (19).
5. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 1, characterized in that: The cryogenic vacuum pump (6) has two symmetrical connecting plates (7) installed on its exterior. The lower ends of the two connecting plates (7) are each equipped with a support rod (18), and the lower ends of the two support rods (18) are connected to the upper end of the vacuum chamber (1).
6. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 1, characterized in that: Multiple heat-conducting plates (8) are inserted into the left and right side walls of the vacuum chamber (1). A protective plate (2) is installed on the outside of the heat-conducting plate (8) on the same side. A disassembly plate (9) is installed on the upper end of the protective plate (2). A plug-in slot (10) is installed on the upper end of the disassembly plate (9). The plug-in slot (10) is connected to the power supply through a cable. Multiple resistance wire tubes (11) are equidistantly arranged on the lower end of the disassembly plate (9). The multiple resistance wire tubes (11) and the multiple heat-conducting plates (8) are arranged alternately.
7. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 1, characterized in that: The cryogenic vacuum pump (6) has two symmetrically arranged connecting pipes (15) inside. One end of each connecting pipe (15) is connected to the micro-channel heat exchange tube (13), and the other end is connected to an external interface (16).
8. The rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump according to claim 2, characterized in that: Two vacuum sensors are symmetrically installed on the left and right side walls inside the vacuum chamber (1). A high-precision platinum resistance temperature sensor is installed in the center of the sample stage. Thermocouple temperature sensors (21) are installed at the pump core end and the outlet end of the microchannel heat exchange tube inside the low-temperature vacuum pump (6). An ionization gauge vacuum sensor (22) is installed on the inner wall of the buffer chamber (14). The control box (3) is connected to multiple sensors.
9. An application of a rapid thermal cooling cycle system based on an ultra-low temperature vacuum pump, characterized in that: The system is applied to low-temperature performance testing of quantum computing chips, vacuum coating processes for third-generation semiconductor materials, research on phase transitions of topological insulators, reliability testing of precision aerospace components in extreme environments, and vacuum melting of ultra-high purity metal materials.