Intelligent control system for dry film photoresist storage environment

Abstract

The present application relates to the technical field of process control, in particular to a dry film photoresist storage environment intelligent regulation system, the system comprises: a photothermal environment sensing module, used for collecting the spectrum sensor signal arranged outside the intelligent warehouse and the infrared thermal image data of the dry film photoresist surface, performing differential operation on the process of converting light energy into heat energy, obtaining the dry film photoresist surface temperature change trend caused by illumination, and generating a photothermal conversion temperature rise rate index.In the present application, when active damping reaches the physical limit, based on the temperature-frequency equivalent principle of high polymer materials, the characteristics of temperature reduction equivalent to increasing the loading frequency are used to inversely deduce a lower temperature set point that can improve the energy storage modulus of the dry film photoresist, and the environmental temperature is forcibly reduced to physically increase the stiffness of the material to resist deformation, thereby prolonging the lossless storage period of the dry film photoresist in a complex vibration environment and preventing the creep or interlayer slip of the roll material caused by long-term micro-vibration.

Description

Technical Field

[0001] This invention relates to the field of process control technology, and in particular to an intelligent control system for the storage environment of dry film photoresist. Background Technology

[0002] Current process control technologies for dry film photoresist storage management primarily rely on a single temperature feedback regulation mechanism. Cooling or heating equipment is only triggered when the ambient temperature sensor detects a deviation from a set threshold. This lag in response inevitably leads to repeated fluctuations in the storage environment temperature around the set point. The resulting thermal expansion and contraction stress cycles accelerate the aging process of the polymer material. Furthermore, conventional technologies typically treat the storage environment as a static system, neglecting the impact of high-frequency micro-vibrations generated by automated storage and retrieval systems (AS / RS), AGVs, and high-power refrigeration units on sensitive roll materials, and lacking methods for monitoring and assessing these continuous mechanical stresses. Therefore, improvements are needed. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies and propose an intelligent control system for the storage environment of dry film photoresist.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an intelligent control system for dry film photoresist storage environment includes: The photothermal environment sensing module is used to collect spectral sensor signals and infrared thermal image data of the dry film photoresist surface deployed outside the smart warehouse, perform differential calculations on the process of light energy conversion into heat energy, obtain the temperature change trend of the dry film photoresist surface caused by light, and generate photothermal conversion temperature rise rate index. The light flux and cooling capacity decoupling module is used to retrieve the HD curve threshold of the photosensitive characteristics of the dry film photoresist according to the photothermal conversion temperature rise rate index, calculate and generate the light transmission blocking voltage of the photochromic glass, obtain the heat load brought by the remaining transmitted light under the action of the light transmission blocking voltage of the photochromic glass, calculate the additional cooling power required to maintain constant temperature, and generate a feedforward cooling load compensation command. The micro-vibration fatigue accumulation calculation module is used to activate the cooling action corresponding to the feedforward cooling load compensation command, and at the same time monitor the piezoelectric acceleration count value on the automated storage and retrieval system (AS / RS) and AGV transport unit to obtain the timing sequence of the piezoelectric acceleration count value. Based on the timing sequence of the piezoelectric acceleration count value, the material micro-fatigue accumulation index is calculated. The damping temperature stiffness coordinated control module is used to compare the material's micro-fatigue accumulation index with the set safe life threshold to obtain the electromagnetic damping deviation coefficient. If the electromagnetic damping deviation coefficient reaches the adjustment extreme value, the lower temperature set point required to improve the energy storage modulus of the dry film photoresist is calculated, and a temperature frequency stiffness enhancement control signal is generated.

[0005] Preferably, the step of obtaining the photothermal conversion temperature rise rate index is as follows: The system collects spectral sensor signals and infrared thermal image data from the surface of dry film photoresist outside the smart warehouse. It performs wavelength range filtering on the spectral sensor signals, locks the radiation energy value sequence corresponding to the ultraviolet band, and performs time synchronization and alignment on the radiation energy value sequence to form the ultraviolet band radiation energy value sequence. Read the current transmittance feedback of the electrochromic glass, perform transmission attenuation conversion on the ultraviolet band radiation energy value sequence according to the transmittance feedback, calculate the incident light flux intensity at each time step, and summarize to obtain the incident light flux intensity monitoring value. By calling the Stefan-Boltzmann constant and the light absorption coefficient of the dry film photoresist, the incident light flux intensity monitoring value and the light absorption coefficient are converted into absorbed power. The absorbed power is matched with the Stefan-Boltzmann constant for radiation heat dissipation. The absorbed power and radiation heat dissipation are substituted into the energy balance equation to output the temperature rise rate corresponding to the temperature change trend of the dry film photoresist surface, thus generating a photothermal conversion temperature rise rate index.

[0006] Preferably, the step of obtaining the light-blocking voltage of the photochromic glass is as follows: The time series sampling points of the photothermal conversion temperature rise rate index are analyzed, the extreme points and slope change points of the temperature rise rate are extracted, the HD curve threshold of the photosensitive characteristics of the dry film photoresist is retrieved, and the temperature rise rate and the HD curve threshold of the photosensitive characteristics are compared point by point to generate a safe light constraint difference sequence. A mapping table of transmittance to color change depth of electrochromic glass is constructed. The mapping table is searched item by item according to the safe lighting constraint difference sequence to determine the color change depth required for the electrochromic glass to maintain a safe lighting environment. The driving level calibration table is searched according to the color change depth, the corresponding driving level is selected, and the light transmission blocking voltage of the electrochromic glass is generated.

[0007] Preferably, the step of obtaining the feedforward cooling load compensation command is as follows: The remaining transmitted light flux under the action of the light-blocking voltage of the photochromic glass is read, the heat load brought by the remaining transmitted light is calculated according to the remaining transmitted light flux, the additional cooling power required to maintain constant temperature is generated according to the deviation between the heat load and the ambient temperature set point, the current signal is calculated according to the additional cooling power and the current control coefficient of the refrigeration unit, and the current signal is superimposed on the input terminal of the PID loop of the refrigeration unit to generate a feedforward cooling load compensation command.

[0008] Preferably, the step of obtaining the timing of the piezoelectric acceleration count value is as follows: According to the feedforward refrigeration load compensation command, the refrigeration unit is triggered to enter the corresponding refrigeration operation state, and the piezoelectric acceleration count value of the automated storage and retrieval system (AS / RS) is read synchronously, and the piezoelectric acceleration count value of the AGV transport unit is read synchronously to form a piezoelectric acceleration count value sequence.

[0009] Preferably, the step of obtaining the material's micro-fatigue accumulation index is as follows: Frequency decomposition is performed on the timing of the piezoelectric acceleration count value to lock the frequency range corresponding to the inherent frequency of the dry film photoresist. The acceleration amplitude within the frequency range is extracted and converted into equivalent stress amplitude according to the material geometric parameters. The number of cycles corresponding to different equivalent stress amplitudes is counted to form a stress amplitude cycle count table. The cumulative micro-fatigue index of the material is calculated based on the stress amplitude cycle number table.

[0010] Preferably, the step of obtaining the electromagnetic damping deviation coefficient is as follows: Read the preset safe lifespan threshold, compare the material's micro-fatigue accumulation index with the safe lifespan threshold, mark the material's micro-fatigue accumulation index as exceeding the safe lifespan threshold, and generate a lifespan threshold exceeding judgment mark. The system filters out operating states that exceed the lifespan threshold, reads the current value of the electromagnetic coil in the active damping base, and adjusts the current value of the electromagnetic coil by step increment or decrement according to a preset current. It records the change in magnetorheological fluid shear yield strength corresponding to each electromagnetic coil current value, calculates the deviation ratio of the change in shear yield strength relative to the target shear yield strength, and generates an electromagnetic damping deviation coefficient.

[0011] Preferably, the step of obtaining the temperature frequency stiffness enhancement control signal is as follows: The electromagnetic damping deviation coefficient is determined to reach the extreme value state corresponding to the extreme value of the electromagnetic coil current adjustment. The target increase in the energy storage modulus of the dry film photoresist and the equivalent temperature and frequency parameters of the molecular material are read. The target increase in the energy storage modulus is converted into the equivalent frequency shift according to the equivalent temperature and frequency parameters. The required lower temperature set point is deduced from the equivalent frequency shift to obtain the temperature and frequency stiffness enhancement control signal.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are as follows: In this invention, signals from spectral sensors deployed outside the intelligent warehouse and infrared thermal image data from the surface of the dry film photoresist are collected. Differential calculations are performed on the process of light energy conversion into heat energy, enabling the capture of minute temperature change trends caused by light exposure, thus predicting heat load accumulation before the actual temperature rise. Based on the photothermal conversion temperature rise rate index and combined with the HD curve threshold of the photosensitive characteristics, the light-blocking voltage of the photochromic glass is dynamically calculated. While ensuring that the light exposure is within the safe photosensitive range, the heat generated by the remaining transmitted light is calculated. The cooling power required to maintain a constant temperature is converted into a feedforward signal and superimposed on the control loop, eliminating the lag of conventional feedback regulation and ensuring high temperature stability of the storage environment. Simultaneously monitoring the vibration data of the automated storage and retrieval system (AS / RS) and AGV transport units during refrigeration operation, a piezoelectric acceleration count time series including the operating disturbance of the refrigeration unit is constructed. Based on this, the material's micro-fatigue accumulation index is calculated, achieving real-time quantification of dynamic mechanical damage during storage. By comparing the fatigue accumulation index with the safe life threshold, the electromagnetic coil current is preferentially adjusted to change the shear yield strength of the magnetorheological fluid, achieving active vibration reduction. When active damping reaches its physical limit, based on the temperature-frequency equivalence principle of polymer materials, and utilizing the characteristic that cooling is equivalent to increasing the loading frequency, a lower temperature set point that can increase the energy storage modulus of dry film photoresist is deduced. The ambient temperature is forcibly reduced to physically increase the stiffness of the material against deformation, thereby extending the non-destructive storage period of dry film photoresist under complex vibration environments and preventing roll-to-roll creep or interlayer slippage caused by long-term micro-vibration. Attached Figure Description

[0013] Figure 1 This is a system flowchart of the present invention. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0015] Please see Figure 1 This invention provides a technical solution: an intelligent control system for dry film photoresist storage environment, comprising: The photothermal environment sensing module is used to collect spectral sensor signals and infrared thermal image data of the dry film photoresist surface deployed outside the smart warehouse, perform differential calculations on the process of light energy conversion into heat energy, obtain the temperature change trend of the dry film photoresist surface caused by light, and generate photothermal conversion temperature rise rate index. The light flux and cooling capacity decoupling module is used to retrieve the HD curve threshold of the photosensitive characteristics of the dry film photoresist based on the photothermal conversion temperature rise rate index, calculate and generate the light transmission blocking voltage of the photochromic glass, obtain the heat load brought by the remaining transmitted light under the action of the light transmission blocking voltage of the photochromic glass, calculate the additional cooling power required to maintain constant temperature, and generate feedforward cooling load compensation command. The micro-vibration fatigue accumulation calculation module is used to activate the cooling action corresponding to the feedforward cooling load compensation command, and at the same time monitor the piezoelectric acceleration count values ​​on the automated storage and retrieval system (AS / RS) and AGV transport unit to obtain the timing sequence of the piezoelectric acceleration count values. Based on the timing sequence of the piezoelectric acceleration count values, the material micro-fatigue accumulation index is calculated. The damping temperature stiffness coordinated control module is used to compare the material's micro-fatigue accumulation index with the set safe life threshold to obtain the electromagnetic damping deviation coefficient. If the electromagnetic damping deviation coefficient reaches the adjustment extreme value, the lower temperature set point required to improve the energy storage modulus of the dry film photoresist is calculated, and a temperature frequency stiffness enhancement control signal is generated.

[0016] The steps for obtaining the photothermal conversion temperature rise rate index are as follows: The system collects spectral sensor signals and infrared thermal image data from the surface of dry film photoresist outside the smart warehouse. It performs wavelength range filtering on the spectral sensor signals, locks the radiation energy value sequence corresponding to the ultraviolet band, and performs time synchronization and alignment on the radiation energy value sequence to form the ultraviolet band radiation energy value sequence. Read the current transmittance feedback of the electrochromic glass, perform transmission attenuation conversion on the ultraviolet band radiation energy value sequence according to the transmittance feedback, calculate the incident light flux intensity at each time step, and summarize to obtain the incident light flux intensity monitoring value. By calling the Stefan-Boltzmann constant and the light absorption coefficient of the dry film photoresist, the absorbed power is converted from the incident light flux intensity monitoring value to the light absorption coefficient. The absorbed power is matched with the Stefan-Boltzmann constant for radiation heat dissipation. The absorbed power and radiation heat dissipation are substituted into the energy balance equation to output the temperature rise rate corresponding to the temperature change trend of the dry film photoresist surface, thus generating a photothermal conversion temperature rise rate index.

[0017] Specifically, the system collects signals from spectral sensors deployed outside the smart warehouse and infrared thermal image data from the surface of the dry film photoresist. A multi-channel data acquisition card is activated, setting the sampling frequency of the spectral sensors to 10 times per second to cover transient ambient light characteristics, and the frame rate of the infrared thermal imager to 30 frames per second to capture minute temperature fluctuations. The system reads the raw waveform data output from the spectral sensors via an industrial fieldbus. This data contains spectral intensity values ​​across the entire wavelength range from 200 nm to 800 nm. Simultaneously, surface temperature matrix data output from the infrared thermal imager is acquired via a gigabit Ethernet interface. Wavelength range filtering is performed on the spectral sensor signals. Based on the chemical characteristics of the dry film photoresist material's sensitivity to ultraviolet light, the effective wavelength filtering range is set to 365 nm to 405 nm. This range is determined based on the absorption peak characteristic curve of the photoresist photosensitizer. The system iterates through the raw spectral data array, setting values ​​outside this range to zero or removing them, retaining only the radiation energy intensity values ​​within the effective wavelength range. The system then locks the radiation energy value sequence corresponding to the ultraviolet band and performs radiation... The energy value sequence is time-synchronized and aligned. Given the potential slight deviations in the sampling clocks of the two sensors, a data buffer queue based on the first-in, first-out (FIFO) principle is established. The timestamp tag of each data packet is read, and a time synchronization tolerance threshold of 50 milliseconds is set. This threshold is calculated based on the minimum response time constant of heat conduction. If the difference between the timestamps of the two data sources is less than this threshold, the data is considered to be from the same moment. If the difference exceeds the threshold, a linear interpolation algorithm is used to interpolate the low-frequency spectral data, aligning it with the high-frequency infrared thermal imaging data on the time axis. Specifically, the interpolation calculation involves calculating the slope of the spectral values ​​between two consecutive moments to estimate the value at the target moment, ensuring that there is a corresponding spectral energy value at any thermal imaging frame. The aligned data is then repackaged in chronological order, removing duplicate data caused by communication jitter or empty data frames caused by packet loss. A moving average window is used to smooth the sequence, with the window size set to 5 sampling points to eliminate random noise interference, forming the ultraviolet band radiation energy value sequence.

[0018] The current transmittance feedback of the electrochromic glass is read. The real-time voltage feedback signal of the electrochromic glass driving circuit is read via an analog-to-digital converter interface. This voltage signal reflects the coloring state of the ion layer inside the glass. Transmission attenuation is calculated based on the transmittance feedback and the ultraviolet radiation energy value sequence. A pre-constructed voltage-transmittance characteristic mapping table is then called. This mapping table was obtained by adjusting the voltage stepwise and measuring transmittance under a standard laboratory light source environment. For example, the voltage is adjusted from -2V to +2V, and a transmittance value is recorded every 0.1V. Based on the read real-time voltage value, the corresponding transmittance coefficient is looked up in the mapping table. If the voltage value is between two calibration points, Lagrange interpolation is used. The method calculates the accurate transmittance coefficient by multiplying each radiation intensity value in the ultraviolet band radiation energy value sequence obtained in the previous step with the transmittance coefficient calculated at the current moment to simulate the energy attenuation process of light passing through glass. The incident light flux intensity is calculated moment by moment. Considering the influence of the incident angle on the transmittance, an angle correction coefficient is introduced. This coefficient is based on the azimuth information of the external light sensor of the smart warehouse. The cosine value of the incident angle is calculated by the cosine theorem as a correction factor. The attenuated radiation intensity is multiplied by this correction factor to obtain the actual light flux perpendicularly incident on the dry film photoresist surface. The calculation results in the continuous time are stored in the high-speed cache and summarized to obtain the incident light flux intensity monitoring value.

[0019] By calling the Stefan-Boltzmann constant and the light absorption coefficient of the dry film photoresist, the Stefan-Boltzmann constant is loaded from the physical parameter database. Its value is Simultaneously read the light absorption coefficient of the dry film photoresist in a specific wavelength band. The coefficient was set to 0.92, based on the average absorptivity in the 365nm band from the material's spectral absorptivity test report. The absorbed power was calculated by converting the incident light flux intensity monitoring value with the light absorption coefficient using the formula... Calculate the light absorption power, where, represent Light absorption power at any given time Represents the measured value of incident light flux intensity. Represents the light absorption coefficient. Representing the effective area of ​​the photoresist surface in dry film, the absorbed power is matched with the Stefan-Boltzmann constant for radiative heat dissipation, and the surface temperature is extracted from infrared thermal imaging data. and ambient temperature Calculate the radiative heat dissipation power The calculation formula is: ,in, The thermal emissivity of the dry film photoresist surface is set to 0.95. Represents the Stefan-Boltzmann constant. Represents the effective area. This represents the absolute temperature of the photoresist surface. Representing the absolute temperature of the environment, the absorbed power and radiative heat dissipation terms are substituted into the energy balance equation to construct a heat balance differential equation based on the lumped parameter method, namely... ,in, This represents the quality of the photoresist in the light-receiving area. The specific heat capacity of the representative material Represents the rate of temperature change. Represents the natural convection heat transfer coefficient, set to . The coefficient is set based on empirical values ​​under conditions of no forced air cooling in the warehouse. The above differential equation is discretized and solved to calculate the theoretical temperature rise rate at the current moment. The temperature rise rate corresponding to the temperature change trend of the dry film photoresist surface is output. Linear regression analysis is performed on the calculated instantaneous temperature rise rate sequence, and the slope of the regression line is extracted as a feature value characterizing the overall temperature rise trend to generate a photothermal conversion temperature rise rate index.

[0020] The steps for obtaining the light-blocking voltage of photochromic glass are as follows: The time series sampling points of the photothermal conversion temperature rise rate index are analyzed, the extreme points and slope change points of the temperature rise rate are extracted, the threshold of the HD curve of the photosensitive characteristics of the dry film photoresist is retrieved, and the temperature rise rate and the HD curve threshold of the photosensitive characteristics are compared point by point to generate a safe light constraint difference sequence. A mapping table of transmittance to color change depth of electrochromic glass is constructed. The mapping table is searched item by item according to the safety lighting constraint difference sequence to determine the color change depth required for the electrochromic glass to maintain a safe lighting environment. The driving level calibration table is searched according to the color change depth, the corresponding driving level is selected, and the light transmission blocking voltage of the electrochromic glass is generated.

[0021] Specifically, the time series sampling points of the photothermal conversion temperature rise rate index were analyzed. A 600-second buffer of temperature rise rate data was read from memory, discretized at 100-millisecond intervals. A sliding window algorithm was used to traverse the time series, with a window length of 50 sampling points. Within each window, the first-order difference was calculated to identify the data trend. The second-order difference was used to determine the concavity / convexity of the curve to locate extreme points. Points where the absolute value of the first derivative exceeded 0.5 degrees Celsius per second were marked as slope change points. Extreme points and slope change points of the temperature rise rate were extracted. The HD curve threshold of the dry film photoresist was retrieved. HD characteristic curve data of this type of photoresist was loaded from the material database. This curve describes the nonlinear relationship between the optical density of the photoresist and the logarithmic change in exposure. The photosensitive threshold point at the bottom of the curve, i.e., the critical exposure level when the optical density increase reaches 0.02, was identified. This critical exposure level was set as... Its value is 15 millijoules per square centimeter. Based on the current ambient temperature, this threshold is thermally corrected using the Arrhenius equation. The correction formula is as follows: ,in This represents the corrected exposure threshold at the current temperature. This represents the exposure threshold at the standard reference temperature. The activation energy of the photoinitiator is set at 50 kilojoules per mole. The ideal gas constant is represented by 8.314 joules per mole Kelvin. Represents the current measured absolute temperature. Using a reference absolute temperature of 298.15 Kelvin, a point-by-point comparison is made between the temperature rise rate and the HD curve threshold of the photosensitive characteristics. The corrected exposure threshold is then converted into the corresponding maximum permissible light intensity threshold. The conversion is based on the integral time constant. The actual light intensity at the current moment is calculated by back-derived from the photothermal conversion temperature rise rate. The difference between the two is calculated, and a safe light constraint difference sequence is generated.

[0022] A mapping table of transmittance to color change depth for electrochromic glass was constructed. A test platform was set up in a standard darkroom environment in the laboratory. Electrochromic glass samples were illuminated using a standard D65 light source. The driving voltage was increased in increments of 0.05 volts from -2 volts to +2 volts. A spectrophotometer was used to simultaneously record the transmittance of the central region of the glass at the 365 nm wavelength at each step. Transmittance was defined as the independent variable, and color change depth (optical density) was defined as the dependent variable. A lookup table containing 81 sets of corresponding data was established. The mapping table was searched item by item according to the safety illumination constraint difference sequence, and the safety illumination constraint difference at the current moment in the sequence was read. If the difference is positive, it means the current illumination is within a safe range; if the difference is negative, the transmittance needs to be reduced, and the target transmittance needs to be calculated. The calculation formula is: ,in This represents the target light transmittance that needs to be achieved. This represents the current transmittance feedback value. This represents the absolute value of the light intensity difference that exceeds the safe range. Representing the maximum permissible light intensity threshold, the calculated target transmittance is used as the index key. A binary search method is used in the mapping table to locate the nearest transmittance node, determining the color change depth required for the electrochromic glass to maintain a safe lighting environment. The driving level calibration table is retrieved according to the color change depth. This calibration table records the correspondence between the color change depth and the steady-state driving voltage required to maintain that depth. Considering the hysteresis characteristics of electrochromic materials, the calibration table distinguishes the voltage curves of the coloring process and the fading process. The corresponding voltage column is selected according to whether a darker or lighter color change is needed. The accurate driving voltage value is calculated through linear interpolation, and the corresponding driving level is selected to generate the light-blocking voltage of the electrochromic glass.

[0023] The steps for obtaining the feedforward cooling load compensation command are as follows: The remaining transmitted light flux under the action of the light-blocking voltage of the photochromic glass is read, the heat load brought by the remaining transmitted light is calculated according to the remaining transmitted light flux, the additional cooling power required to maintain constant temperature is generated according to the deviation between the heat load and the ambient temperature set point, the current signal is calculated according to the additional cooling power and the current control coefficient of the refrigeration unit, and the current signal is superimposed on the input terminal of the PID loop of the refrigeration unit to generate a feedforward cooling load compensation command.

[0024] Specifically, the remaining transmitted light flux under the light-blocking voltage of the photochromic glass is read. The intensity of ultraviolet radiation transmitted through the glass is measured in real time using a light intensity sensor installed inside the glass. Alternatively, the theoretical transmitted light flux is calculated backwards using a transmittance model based on the applied blocking voltage. The heat load caused by the remaining transmitted light is calculated based on the remaining transmitted light flux. According to the law of conservation of energy, the light energy is converted into heat power. The calculation formula is as follows: ,in Represents the photothermal load power, measured in watts. Represents the remaining transmitted luminous flux density, measured in watts per square meter. Represents the light-receiving surface area of ​​the photoresist film. The photothermal absorption efficiency of the photoresist surface is set to 0.85. The additional cooling power required to maintain a constant temperature is generated based on the deviation between the heat load and the ambient temperature setpoint. The difference between the current ambient temperature and the set target temperature (e.g., 20 degrees Celsius) is calculated, and combined with the photoinduced heat load, the heat balance compensation formula is applied. ,in This represents the total cooling compensation power required. Representing the aforementioned photothermal load, The thermal capacity coefficient representing the storage space is set at 5000 joules per Kelvin. The rate of change of temperature error is used to convert the current signal according to the additional cooling power and the current control coefficient of the refrigeration unit. The performance curve of the refrigeration compressor is then consulted to obtain the power-current conversion coefficient. For example, 0.5 amperes per kilowatt, calculate the feedforward compensation current. The current signal is superimposed onto the input of the PID loop of the refrigeration unit, and the calculated value is directly added to the output value of the conventional temperature closed-loop PID control. As a feedforward quantity, it is used to synthesize the final inverter control command and generate a feedforward cooling load compensation command.

[0025] The steps for obtaining the timing sequence of piezoelectric acceleration counting values ​​are as follows: Based on the feedforward refrigeration load compensation command, the refrigeration unit is triggered to enter the corresponding refrigeration operation state, and the piezoelectric acceleration count value of the automated storage and retrieval system (AS / RS) rack and the piezoelectric acceleration count value of the AGV transport unit are read simultaneously to form the timing sequence of the piezoelectric acceleration count value.

[0026] Specifically, based on the feedforward cooling load compensation command, the refrigeration unit is triggered to enter the corresponding cooling operation state. The generated feedforward cooling load compensation command is sent to the refrigeration unit's programmable logic controller (PLC) via the Modbus TCP protocol. The PLC parses the current superimposed signal in the command and converts it into the frequency setpoint of the inverter, driving the compressor motor speed to dynamically adjust within the range of 1500 rpm to 3000 rpm. Simultaneously, the opening of the electronic expansion valve is adjusted to match the refrigerant flow, ensuring that the evaporator outlet superheat is maintained within the optimal heat exchange efficiency range of 5°C to 8°C. Simultaneously with the refrigeration unit's response, a multi-channel high-frequency data acquisition card is activated, setting the sampling frequency to 2048 Hz. This frequency is based on the Nyquist sampling timer. The system is configured with an oversampling margin of at least 5 times to prevent aliasing of high-frequency vibration signals. It synchronously reads the piezoelectric accelerometer count values ​​of the automated storage and retrieval system (AS / RS). These accelerometers are installed at key stress points on the beams of the AS / RS and utilize IEPE integrated circuit piezoelectric sensors to convert mechanical vibrations into voltage signals. These signals are amplified and subjected to anti-aliasing low-pass filtering by a signal conditioning circuit. The system also synchronously reads the piezoelectric accelerometer count values ​​of the AGV transport unit. Vertical and horizontal vibration data of the AGV during operation are transmitted in real-time via a wireless LAN or onboard data recorder. To ensure strict time synchronization of the two sets of data, an IEEE-based... The Precision Time Protocol (PTP) of the 1588 protocol provides time synchronization for the acquisition nodes. It quantizes the analog signals acquired from all channels into digital sequences via analog-to-digital converters and adds timestamps accurate to the microsecond level. The data stream is written into a circular buffer. When the amount of data in the buffer reaches the preset analysis frame length, such as 4096 points, the data is packaged and spliced ​​in chronological order. Invalid placeholders caused by communication packet loss are removed to form the timing sequence of piezoelectric acceleration count values.

[0027] The steps for obtaining the cumulative fatigue index of a material's microstructure are as follows: Frequency decomposition was performed on the timing of the piezoelectric acceleration count values ​​to lock the frequency range corresponding to the natural frequency of the dry film photoresist. The acceleration amplitude within the frequency range was extracted and converted into equivalent stress amplitude according to the material geometric parameters. The number of cycles corresponding to different equivalent stress amplitudes was counted to form a stress amplitude cycle number table. Based on the stress amplitude cycle count table, the material micro-fatigue cumulative index is calculated using the following formula: ; in, The material's micro-fatigue accumulation index. The stress amplitude is categorized into different levels. The total number of stress amplitude levels. For the first The number of cycles corresponding to each stress amplitude level For the first The equivalent stress amplitude corresponding to each stress amplitude level For dry film photoresist materials at a reference temperature Reference stress amplitude of SN fatigue curve under the condition, This represents the basic fatigue power exponent of the dry film photoresist material under reference temperature conditions. The current ambient absolute temperature. The reference absolute temperature used when calibrating the fatigue characteristics of materials. The absolute temperature of the glass transition of the polymer in the dry film photoresist substrate. It represents the thermal weakening coefficient of material fatigue strength as a function of temperature.

[0028] Specifically, the piezoelectric acceleration count time series is decomposed using frequency decomposition. A Fast Fourier Transform (FFT) algorithm is applied to convert the time-domain acceleration signal into a power spectral density function in the frequency domain. Peak regions with concentrated energy are identified in the spectrum, locking down the frequency range corresponding to the inherent frequency of the dry film photoresist. This inherent frequency range is pre-determined through modal hammering experiments on the photoresist. For example, for a fully rolled photoresist, its first-order bending inherent frequency is determined to be 25 Hz. The bandwidth of the frequency range is set to be 10% above and below the center frequency, i.e., 22.5 Hz to 27.5 Hz. A digital bandpass filter, such as a fourth-order Butterworth filter, is designed to filter out background noise and interference frequency components outside the specified frequency range, retaining only the time-domain waveform within the resonant response frequency band of the photoresist film. The acceleration amplitude within this frequency range is extracted, and a peak detection algorithm is used to scan the filtered time-domain waveform to identify the peak and trough values ​​for each vibration cycle. Half the difference between the peak and trough is calculated as the acceleration amplitude for that cycle. The acceleration amplitude is then converted into an equivalent stress amplitude according to the material's geometric parameters. Based on the cantilever beam bending theory in elasticity, a conversion factor is introduced. The calculation formula is: ,in Represents equivalent force, Represents the acceleration amplitude. The acquisition process is as follows: based on the density of the photoresist film... , roll diameter Width and suspension length Calculate the bending moment generated by its distributed mass, combined with the section modulus. The root stress value under unit acceleration is derived, for example, by calculation. The number of cycles corresponding to different equivalent stress amplitudes was counted. The rainflow counting method was applied to process the converted stress time series to identify complete stress cycle loops. The identified stress amplitudes were divided into several level intervals, for example, with an interval step size set to... The number of cycles falling into each stress amplitude range is counted, and a histogram data structure containing stress amplitude ranges, average stress, and corresponding counts is constructed to form a stress amplitude cycle count table.

[0029] In the formula for calculating the cumulative fatigue index of materials, a temperature correction factor is introduced to quantify the thermal weakening effect of rising ambient temperature on the fatigue strength of polymer photoresist materials. This enables accurate assessment of the cumulative fatigue damage of materials under varying temperature conditions, avoiding the limitation that traditional SN curves are only applicable to constant temperature environments. Representing the The number of cycles corresponding to each stress amplitude level is a dimensionless integer value. This parameter is directly obtained from the stress amplitude cycle count table generated in the previous stage. For example, if the rainflow counting method shows that the vibration cycle corresponding to the first stress amplitude level has occurred 500 times within the current calculation cycle, then... This value reflects the frequency with which the material is subjected to this specific stress level during the current monitoring period, and is the linear accumulation basis for cumulative damage calculation; Representing the The equivalent stress amplitude corresponding to each stress amplitude range is expressed in megapascals (MPa). This parameter is obtained from the center value of the range in the stress amplitude cycle number table. For example, if the stress amplitude is divided into intervals such as 0-2MPa and 2-4MPa, the median value of 3MPa is taken as the midpoint of the second range (2-4MPa). Substituting this value into the calculation, it represents the magnitude of the periodic stress generated inside the material by the applied load, which directly determines the degree of damage caused by a single cycle. Represents the dry film photoresist material at the reference temperature The reference stress amplitude of the SN fatigue curve under the given conditions, in megapascals (MPa), is obtained as follows: Tensile fatigue tests are performed on dry film photoresist samples from the same batch under a standard laboratory environment (reference temperature). Different amplitudes of sinusoidal alternating loads are applied, and the number of cycles at fracture is recorded. The SN curve equation is then fitted, and the value corresponding to the fatigue life is selected. The stress amplitude at this time was used as a reference value, and the value was measured to be 45 MPa. The fundamental fatigue exponent of the dry film photoresist material under reference temperature conditions is a dimensionless constant. This parameter reflects the sensitivity of the material's fatigue life to stress changes. It is obtained by conducting fatigue experiments at at least five different stress levels at the reference temperature, plotting the experimental data on a log-log coordinate system, and performing linear regression analysis. The negative reciprocal of the slope of the regression line is the exponent. For the photoresist used in this application, the value was experimentally determined to be 4.2; This represents the current absolute temperature, measured in Kelvin (K). This parameter is acquired in real-time by high-precision temperature sensors deployed within the smart warehouse. The sensors collect temperature data once per second, and the arithmetic mean over the calculation period is added to 273.15 to convert it to absolute temperature. For example, if the collected ambient temperature is 28.5 degrees Celsius, then... ; The reference absolute temperature used when calibrating the fatigue characteristics of materials is expressed in Kelvin (K). This parameter is the standard ambient temperature used in the laboratory for calibrating the SN curve of materials, and is usually set to the international standard room temperature of 25 degrees Celsius. ; The absolute glass transition temperature (Kelvin K) represents the polymer matrix of the dry film photoresist, and is the critical temperature at which the polymer material transitions from a glassy state to a rubbery state. It marks the turning point where the material's mechanical properties undergo a dramatic change. The steps to obtain this temperature are as follows: Dynamic thermomechanical analysis is used to perform a temperature scan on the photoresist sample, and the temperature point corresponding to the peak loss modulus is measured. The glass transition temperature of this type of photoresist was determined to be 85 degrees Celsius. ; The thermal weakening coefficient, representing the change in fatigue strength of a material with temperature, is a dimensionless empirical coefficient ranging from 0 to 1. This parameter characterizes the degree of decrease in the material's fatigue resistance for each unit increase in temperature. It is obtained by: applying heat to a reference temperature... and close to the glass transition temperature The reference fatigue strength of the material was measured at (e.g., 60 degrees Celsius), and the ratio of the decrease in strength to the increase in temperature was calculated. After fitting multiple sets of variable temperature fatigue experiments, the coefficient was determined to be 0.85. Calculations based on parameters: Within the current calculation cycle, the stress amplitude cycle count table contains only one primary vibration component. ); Get the number of loops for this tier. Second-rate; Obtain the equivalent stress amplitude for this range. MPa; Known reference stress amplitude MPa; Known basic fatigue power exponent ; Known ambient absolute temperature K; Known reference absolute temperature K; Known absolute temperature of glass transition K; Known thermal weakening coefficient ; The first step is to calculate the relative temperature rise ratio. : ; The second step is to calculate the temperature-corrected denominator attenuation factor. : ; The third step is to calculate the corrected reference fatigue strength. : MPa; The fourth step is to calculate the stress ratio. : ; Step 5: Calculate the damage amount per cycle. : ; Step 6: Calculate the total micro-fatigue cumulative index. : ; The results indicate that during the current monitoring period, due to the combined effects of micro-vibration and ambient temperature, the dry film photoresist material accumulated a micro-fatigue damage index of 9.72. This index is a relative value and needs to be compared with a set safe lifespan threshold (e.g., an accumulated index of 1000 is considered a high-risk zone). The current result of 9.72 is much lower than the threshold, indicating that the material structure is safe under the current condition. However, if the temperature... A further increase will lead to a decrease in the denominator's decay factor. Reduce, thereby reducing the amount of damage per incident. It increases exponentially, thus accelerating the fatigue accumulation process.

[0030] The steps for obtaining the electromagnetic damping deviation coefficient are as follows: Read the preset safe life threshold, compare the material micro-fatigue accumulation index with the safe life threshold, mark the material micro-fatigue accumulation index exceeding the safe life threshold as an out-of-limit state, and generate a life threshold exceeding judgment mark. The system identifies operating states that exceed the lifespan threshold and reads the current value of the electromagnetic coil in the active damping base. It then adjusts the current value of the electromagnetic coil by stepwise increments or decrements according to a preset current setting. The system records the change in magnetorheological fluid shear yield strength corresponding to each electromagnetic coil current value and calculates the deviation ratio of the change in shear yield strength relative to the target shear yield strength, generating an electromagnetic damping deviation coefficient.

[0031] Specifically, the system reads a pre-set safe lifetime threshold and retrieves a pre-set fatigue lifetime safety limit value for the dry film photoresist from non-volatile memory. This threshold is set based on a combination of Miner's linear cumulative damage theory and the SN curve, and the fatigue lifetime limit of the dry film photoresist under standard stress is obtained by consulting the material handbook. for Next, set a safety factor. The threshold is set to 2.0, and the maximum allowed cumulative equivalent number of loops is calculated as the threshold. This value represents the total amount of micro-damage allowed to accumulate before entering the potential failure risk zone. The material's micro-fatigue accumulation index is compared with the safe life threshold, and the real-time material micro-fatigue accumulation index calculated in the previous steps is used as the reference value. With safe life threshold The data is fed into the digital comparator logic unit to perform a subtraction operation. Determine the difference If the difference is positive, it indicates that the current accumulated micro-damage has exceeded the designed safety redundancy range, and micro-cracks may have started inside the material. This marks the material's micro-fatigue accumulation index as exceeding the safe lifespan threshold, sets the corresponding alarm bit to 1 in the system's status register, and records the time of the exceedance and the current temperature and humidity parameters as the basis for subsequent fault tracing, generating a lifespan threshold exceedance judgment mark.

[0032] The system identifies operating states that exceed the lifespan threshold as exceeding the limit. It periodically scans the status register and extracts alarm bit status using a mask operation. Only when an alarm bit is detected as 1 is the subsequent active vibration damping adjustment process triggered. The system reads the current value of the electromagnetic coil in the active vibration damping base, acquires the real-time output current of the drive circuit through a Hall current sensor, and obtains the current reading after analog-to-digital conversion. For example, if the current value is 1.2 amps, the current value of the electromagnetic coil is increased or decreased in a preset current adjustment step. Based on the negative feedback control strategy, the current adjustment step is set. The initial current is 0.1 amperes. If the vibration trend does not converge, an incremental operation is performed to calculate the new set current. Record the change in shear yield strength of the magnetorheological fluid corresponding to each electromagnetic coil current value. Using the BH characteristic model and shear yield strength formula of the magnetorheological fluid, calculate the theoretically achievable increase in shear yield strength for that current increment. The calculation formula is as follows: ,in Represents the change in shear yield strength. The material coefficient related to the concentration of magnetorheological fluid particles is taken as 15000 Pa / A. , The magnetization index is 1.5. The adjusted set current, Given the current, calculate the deviation ratio of the change in shear yield strength relative to the change in target shear yield strength. First, based on the current excess fatigue index... With target safety value The difference is used to back-calculate the required ideal damping force increment using a PID algorithm, and then converted into the change in target shear yield strength. For example, it is calculated that a shear stress of 2000 Pa is needed to suppress vibration, and then the deviation factor is calculated. This coefficient reflects whether current regulation alone can meet the current vibration reduction requirements, generating the electromagnetic vibration reduction deviation coefficient.

[0033] The steps for obtaining the temperature-frequency stiffness enhancement control signal are as follows: The electromagnetic damping deviation coefficient is determined to reach the extreme value state corresponding to the extreme value of the electromagnetic coil current adjustment. The target increase in the energy storage modulus of the dry film photoresist and the equivalent temperature and frequency parameters of the molecular material are read. The target increase in the energy storage modulus is converted into the equivalent frequency shift according to the equivalent temperature and frequency parameters. The required lower temperature set point is deduced from the equivalent frequency shift to obtain the temperature and frequency stiffness enhancement control signal.

[0034] Specifically, once the electromagnetic damping deviation coefficient reaches the extreme value corresponding to the extreme value of the electromagnetic coil current adjustment, the current driving current is adjusted accordingly. With the rated maximum current of the electromagnetic coil (For example, 5.0 amperes) are compared, and the deviation coefficient is detected simultaneously. If the current is still greater than the tolerance threshold (e.g., 0.05), and the current has reached the saturation limit while the deviation coefficient still indicates insufficient damping, then simple electromagnetic damping is deemed insufficient to meet the protection requirements. Temperature-based stiffness enhancement measures must be introduced. The target increase in the energy storage modulus of the dry film photoresist and the equivalent temperature-frequency parameters of the molecular material are read. Based on the residual vibration energy that has not been eliminated, the increase in the material's energy storage modulus required to resist this vibration is calculated. For example, if an increase of 500 MPa is required, the time-temperature equivalent equation parameters need to be read from the material database. and Regarding the photoresist material in this embodiment, , K, the target increase in energy storage modulus is converted into an equivalent frequency shift according to the temperature-frequency equivalent parameters, and the power-law dependence of the energy storage modulus of polymer materials on frequency is utilized. Calculate the required equivalent frequency shift factor The calculation formula is: ,in This is the logarithm of the equivalent frequency shift. The frequency sensitivity index for the material modulus was measured to be 0.15. The basic energy storage modulus at the current temperature, for example, 2500 MPa. To achieve a target increase of 500 MPa, the required lower temperature setpoint is calculated by inversely estimating the equivalent frequency shift. Based on the inverse transform of the WLF equation, the target low temperature capable of producing the aforementioned equivalent frequency shift is calculated using the following formula: ,in To obtain a lower temperature setpoint, The reference temperature (usually the glass transition temperature) (or standard reference temperature) and For the aforementioned material constants, As an equivalent frequency shift factor, this calculation process utilizes the principle of "freezing" the movement of molecular chain segments at low temperatures, which is equivalent to increasing the loading frequency of external loads, thereby improving the dynamic stiffness of the material and obtaining a temperature-frequency stiffness enhancement control signal.

Claims

1. A smart control system for the storage environment of dry film photoresist, characterized in that, The system includes: The photothermal environment sensing module is used to collect spectral sensor signals and infrared thermal image data of the dry film photoresist surface deployed outside the smart warehouse, perform differential calculations on the process of light energy conversion into heat energy, obtain the temperature change trend of the dry film photoresist surface caused by light, and generate photothermal conversion temperature rise rate index. The light flux and cooling capacity decoupling module is used to retrieve the HD curve threshold of the photosensitive characteristics of the dry film photoresist according to the photothermal conversion temperature rise rate index, calculate and generate the light transmission blocking voltage of the photochromic glass, obtain the heat load brought by the remaining transmitted light under the action of the light transmission blocking voltage of the photochromic glass, calculate the additional cooling power required to maintain constant temperature, and generate a feedforward cooling load compensation command. The micro-vibration fatigue accumulation calculation module is used to activate the cooling action corresponding to the feedforward cooling load compensation command, and at the same time monitor the piezoelectric acceleration count value on the automated storage and retrieval system (AS / RS) and AGV transport unit to obtain the timing sequence of the piezoelectric acceleration count value. Based on the timing sequence of the piezoelectric acceleration count value, the material micro-fatigue accumulation index is calculated. The damping temperature stiffness coordinated control module is used to compare the material's micro-fatigue accumulation index with the set safe life threshold to obtain the electromagnetic damping deviation coefficient. If the electromagnetic damping deviation coefficient reaches the adjustment extreme value, the lower temperature set point required to improve the energy storage modulus of the dry film photoresist is calculated, and a temperature frequency stiffness enhancement control signal is generated.

2. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the photothermal conversion temperature rise rate index are as follows: The system collects spectral sensor signals and infrared thermal image data from the surface of dry film photoresist outside the smart warehouse. It performs wavelength range filtering on the spectral sensor signals, locks the radiation energy value sequence corresponding to the ultraviolet band, and performs time synchronization and alignment on the radiation energy value sequence to form the ultraviolet band radiation energy value sequence. Read the current transmittance feedback of the electrochromic glass, perform transmission attenuation conversion on the ultraviolet band radiation energy value sequence according to the transmittance feedback, calculate the incident light flux intensity at each time step, and summarize to obtain the incident light flux intensity monitoring value. By calling the Stefan-Boltzmann constant and the light absorption coefficient of the dry film photoresist, the incident light flux intensity monitoring value and the light absorption coefficient are converted into absorbed power. The absorbed power is matched with the Stefan-Boltzmann constant for radiation heat dissipation. The absorbed power and radiation heat dissipation are substituted into the energy balance equation to output the temperature rise rate corresponding to the temperature change trend of the dry film photoresist surface, thus generating a photothermal conversion temperature rise rate index.

3. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the light-blocking voltage of the photochromic glass are as follows: The time series sampling points of the photothermal conversion temperature rise rate index are analyzed, the extreme points and slope change points of the temperature rise rate are extracted, the HD curve threshold of the photosensitive characteristics of the dry film photoresist is retrieved, and the temperature rise rate and the HD curve threshold of the photosensitive characteristics are compared point by point to generate a safe light constraint difference sequence. A mapping table of transmittance to color change depth of electrochromic glass is constructed. The mapping table is searched item by item according to the safe lighting constraint difference sequence to determine the color change depth required for the electrochromic glass to maintain a safe lighting environment. The driving level calibration table is searched according to the color change depth, the corresponding driving level is selected, and the light transmission blocking voltage of the electrochromic glass is generated.

4. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the feedforward cooling load compensation command are as follows: The remaining transmitted light flux under the action of the light-blocking voltage of the photochromic glass is read, the heat load brought by the remaining transmitted light is calculated according to the remaining transmitted light flux, the additional cooling power required to maintain constant temperature is generated according to the deviation between the heat load and the ambient temperature set point, the current signal is calculated according to the additional cooling power and the current control coefficient of the refrigeration unit, and the current signal is superimposed on the input terminal of the PID loop of the refrigeration unit to generate a feedforward cooling load compensation command.

5. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the timing sequence of the piezoelectric acceleration count value are as follows: According to the feedforward refrigeration load compensation command, the refrigeration unit is triggered to enter the corresponding refrigeration operation state, and the piezoelectric acceleration count value of the automated storage and retrieval system (AS / RS) is read synchronously, and the piezoelectric acceleration count value of the AGV transport unit is read synchronously to form a piezoelectric acceleration count value sequence.

6. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the material's micro-fatigue accumulation index are as follows: Frequency decomposition is performed on the timing of the piezoelectric acceleration count value to lock the frequency range corresponding to the inherent frequency of the dry film photoresist. The acceleration amplitude within the frequency range is extracted and converted into equivalent stress amplitude according to the material geometric parameters. The number of cycles corresponding to different equivalent stress amplitudes is counted to form a stress amplitude cycle count table. The cumulative micro-fatigue index of the material is calculated based on the stress amplitude cycle number table.

7. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the electromagnetic damping deviation coefficient are as follows: Read the preset safe lifespan threshold, compare the material's micro-fatigue accumulation index with the safe lifespan threshold, mark the material's micro-fatigue accumulation index as exceeding the safe lifespan threshold, and generate a lifespan threshold exceeding judgment mark. The system filters out operating states that exceed the lifespan threshold, reads the current value of the electromagnetic coil in the active damping base, and adjusts the current value of the electromagnetic coil by step increment or decrement according to a preset current. It records the change in magnetorheological fluid shear yield strength corresponding to each electromagnetic coil current value, calculates the deviation ratio of the change in shear yield strength relative to the target shear yield strength, and generates an electromagnetic damping deviation coefficient.

8. The intelligent control system for dry film photoresist storage environment according to claim 1, characterized in that, The steps for obtaining the temperature frequency stiffness enhancement control signal are as follows: The electromagnetic damping deviation coefficient is determined to reach the extreme value state corresponding to the extreme value of the electromagnetic coil current adjustment. The target increase in the energy storage modulus of the dry film photoresist and the equivalent temperature and frequency parameters of the molecular material are read. The target increase in the energy storage modulus is converted into the equivalent frequency shift according to the equivalent temperature and frequency parameters. The required lower temperature set point is deduced from the equivalent frequency shift to obtain the temperature and frequency stiffness enhancement control signal.

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