A heat sink, a circuit board assembly, and an electronic device

Abstract

The application relates to the technical field of heat exchange, and discloses a radiator, a circuit board assembly and electronic equipment. The radiator comprises a shell, a jet plate and a fixing frame, the shell comprises a top wall; a first cavity and a second cavity are arranged in the shell; the jet plate and the fixing frame are arranged in the shell, and two ends of the fixing frame are connected with the top wall and the jet plate respectively; the first cavity comprises a space formed by the fixing frame, the jet plate and the top wall; the second cavity at least comprises a space on one side of the jet plate away from the top wall; a plurality of first radiating fins are arranged on the one side of the jet plate away from the top wall; the jet plate comprises a jet area, and the jet area is provided with jet holes communicating the first cavity and the second cavity. The first radiating fins can be arranged in a high-density mode on the jet plate, and the height of the first radiating fins is not limited, so that the radiator can realize excellent heat dissipation performance, the processing and assembling difficulty of the radiator is reduced, and the production efficiency of the radiator is improved.

Description

Technical Field

[0001] This application relates to the field of heat exchange technology, and in particular to a heat sink, circuit board assembly, and electronic device. Background Technology

[0002] The development of technologies such as artificial intelligence and autonomous driving has brought about a massive demand for data computing, resulting in an explosive growth of data in computing centers. This surge in data volume often requires higher-performance or more complex chips to process it, leading to continuous innovation in chip packaging and manufacturing processes. As higher computing power and more advanced chip manufacturing processes develop, high heat flux density in chips becomes inevitable, and jet liquid cooling, as a highly efficient heat dissipation technology, is increasingly being used in chip heat dissipation.

[0003] Jet cooling plates utilize jet nozzles to deliver cooling media point-to-point to the heat source of the chip, and their heat exchange efficiency can be improved through internal heat dissipation fins. Therefore, the key to maximizing the performance of a jet cooling plate lies in the rational arrangement of the jet nozzles and heat dissipation fins. In traditional jet cooling plates, the design of the jet nozzles and heat dissipation fins are mutually restrictive, resulting in excessive difficulty in the processing and assembly of the jet cooling plate, which is detrimental to the processing yield and production efficiency. Summary of the Invention

[0004] This application provides a heat sink, a circuit board assembly, and an electronic device to reduce the processing and assembly difficulty of the heat sink and improve the production efficiency of the heat sink.

[0005] In a first aspect, this application provides a heat sink, which includes a housing, a jet plate, and a fixing frame. The housing includes a top wall, and a first cavity and a second cavity are disposed within the housing. The jet plate and the fixing frame are disposed within the housing, with the jet plate and the top wall spaced apart. The two ends of the fixing frame are connected to the top wall and the jet plate, respectively. The first cavity includes a space enclosed by the fixing frame, the jet plate, and the top wall. The second cavity includes at least a space on the side of the jet plate facing away from the top wall, thus the second cavity is located on the side of the first cavity facing away from the top wall. A plurality of first heat dissipation fins are disposed on the side of the jet plate facing away from the top wall. The jet plate includes a jet region, and the jet region is provided with jet holes penetrating the jet plate along the thickness direction, the jet holes connecting the first cavity and the second cavity.

[0006] In this application, the second cavity of the heat sink is thermally connected to the chip to be cooled. The cooling medium in the first cavity enters the second cavity through jet holes in a jet manner, and then disperses and flows to other areas of the second cavity under the guidance of the first heat dissipation fins to exchange heat with the chip. Since the first heat dissipation fins and jet holes are jointly arranged on the jet plate, the positions of multiple first heat dissipation fins and jet holes are determined in the design stage. During the manufacturing process of the heat sink, there is no need to consider whether the first heat dissipation fins and jet holes will interfere with each other. The first heat dissipation fins can be set at any position except for the jet holes as needed, achieving a high-density layout on the jet plate. Furthermore, the height of the first heat dissipation fins is no longer limited, allowing the first heat dissipation fins to fully exert their heat exchange function. Therefore, this application can effectively reduce the processing and assembly difficulty of the heat sink and improve the production efficiency of the heat sink while ensuring the heat dissipation performance.

[0007] In some implementations, a boss is provided on the side of the jet zone facing away from the top wall, and the jet hole can penetrate the boss. This reduces the distance between the end of the jet hole and the bottom wall of the second cavity, thus shortening the jet distance of the cooling medium after it exits the jet hole. This increases the impact velocity of the cooling medium, which helps improve the heat exchange effect between the second cavity and the cooling medium. Additionally, some of the first heat dissipation fins are connected to the boss to achieve a higher density layout of the first heat dissipation fins, further improving the heat exchange efficiency of the cooling medium in the second cavity.

[0008] In some embodiments, the housing may further include a bottom wall. The bottom wall is located on the side of the jet plate facing away from the top wall and is spaced apart from the jet plate, thus the second cavity includes at least the space between the jet plate and the bottom wall. The side of the bottom wall facing away from the top wall is used for thermal connection of the chip. After absorbing heat from the chip, the bottom wall exchanges heat with the cooling medium, thereby achieving heat dissipation for the chip. At least a portion of the first heat dissipation fins are fixedly connected to the bottom wall at the end facing away from the jet plate to enhance the bottom wall's resistance to jet impact, helping to reduce the high thickness requirement of the bottom wall and thus reducing the thermal resistance of the bottom wall.

[0009] For example, the first heat dissipation fin can be fixedly connected to the bottom wall by welding processes such as brazing and diffusion welding.

[0010] In some implementations, the bottom wall is provided with a groove, and the top wall and the bottom wall are aligned in a first direction. The orthographic projection of the groove in the first direction covers the orthographic projection of the jet holes in the jet region in the first direction. By providing the groove, the thickness of the bottom wall can be locally reduced, which helps to further reduce the thermal resistance of the groove area and improve the heat exchange effect between this area and the chip.

[0011] In some implementations, one end of a portion of the first heat dissipation fin facing away from the jet plate can extend into the groove, and the end of the portion of the first heat dissipation fin facing away from the jet plate is fixedly connected to the bottom of the groove to improve the ability of the bottom of the groove to withstand the jet impact of the jet hole.

[0012] In some implementations, the bottom wall is provided with multiple second heat dissipation fins extending toward the jet plate. These second heat dissipation fins are positioned further away from the jet area than the multiple first heat dissipation fins. This allows for enhanced heat exchange through the second heat dissipation fins without affecting the high-density layout of the second and first heat dissipation fins, thereby reducing the processing and assembly difficulty of the radiator while ensuring its heat dissipation performance.

[0013] In some implementations, at least part of the second heat dissipation fins are fixedly connected to the jet plate at one end facing the jet plate to further improve the impact resistance of the bottom wall and reduce the high thickness requirement of the bottom wall, thereby helping to reduce the thermal resistance of the bottom wall.

[0014] For example, the second heat dissipation fin and the jet plate can be fixedly connected by welding processes such as brazing and diffusion welding.

[0015] In some implementations, the jet region may be provided with one or more jet holes. When the heat dissipation requirement of the chip's heat-generating area is low, the number of jet holes in the jet region can be reduced accordingly; when the heat dissipation requirement of the chip's heat-generating area is high, the number of jet holes in the jet region can be increased accordingly.

[0016] In some embodiments, the housing further includes sidewalls, with at least a portion of the fixing frame spaced apart from the sidewalls. A third cavity is also provided within the housing, comprising the space between the fixing frame and the sidewalls; a second cavity, in addition to including the space on the side of the first cavity facing away from the top wall, also includes the space on the side of the third cavity facing away from the top wall, and the second and third cavities are in communication. The top wall is provided with an inlet and an outlet; the inlet connects the first cavity to the outside, and the outlet connects the third cavity to the outside. The heat sink receives a low-temperature cooling medium provided by the cooling equipment through the inlet. After entering the first cavity, the low-temperature cooling medium, under pressure within the first cavity, is sprayed into the second cavity through the jet holes of the jet plate. After exchanging heat with the chip in the second cavity, it enters the third cavity through the connecting port, and finally is delivered to the cooling equipment for cooling through the outlet. Therefore, by utilizing the circulating flow of the cooling medium among the three cavities of the heat sink, continuous heat dissipation of the chip can be achieved.

[0017] In some embodiments, the second cavity communicates with the third cavity via a connecting port. Exemplarily, the periphery of the jet plate is fixedly connected to a sidewall, and the connecting port may be located in an area of ​​the jet plate extending beyond the fixed frame. Alternatively, at least a portion of the jet plate is spaced apart from the sidewall, and the gap between the jet plate and the sidewall can be used to form the connecting port.

[0018] Secondly, this application also provides a radiator, which includes a housing, a jet plate, and a fixing frame. The housing includes a top wall and a bottom wall disposed opposite to each other, and the housing is provided with a first cavity and a second cavity. The jet plate and the fixing frame are disposed within the housing, with the jet plate and the top wall spaced apart, and the two ends of the fixing frame connected to the top wall and the jet plate respectively. The first cavity includes a space enclosed by the fixing frame, the jet plate, and the top wall, and the second cavity includes at least the space between the jet plate and the bottom wall. A plurality of first heat dissipation fins are provided on the side of the jet plate facing away from the top wall, and at least some of the first heat dissipation fins are fixedly connected to the bottom wall at the end facing away from the jet plate. The jet plate includes a jet region, and the jet region is provided with a jet hole penetrating the jet plate along the thickness direction, the jet hole connecting the first cavity and the second cavity. A plurality of second heat dissipation fins are provided on the side of the bottom wall facing the jet plate, and the plurality of second heat dissipation fins are disposed closer to the jet region than the plurality of first heat dissipation fins.

[0019] In this application, the bottom wall of the heat sink is thermally connected to the chip to be cooled. The cooling medium in the first cavity enters the second cavity through the jet holes in a jet manner, and then disperses and flows to other areas of the second cavity under the guidance of the first and second heat dissipation fins to exchange heat with the chip. The multiple first heat dissipation fins are located further away from the jet area of ​​the jet plate than the multiple second heat dissipation fins. This design not only enhances heat exchange through the multiple second heat dissipation fins, but also improves the impact resistance of the bottom wall by connecting the multiple first heat dissipation fins to the bottom wall. This allows the bottom wall to achieve strong impact resistance with a relatively small thickness, thereby helping to reduce the thermal resistance of the bottom wall and thus improving the heat dissipation efficiency of the chip.

[0020] Thirdly, this application also provides a circuit board assembly, which includes a substrate, a chip, and a heat sink as described in either the first or second aspect. The chip is disposed on the surface of the substrate, and a second cavity of the heat sink is thermally connected to the side of the chip facing away from the substrate. A heat-generating area is provided on the side of the chip facing the substrate, and the orthographic projection of the heat-generating area on the surface of the substrate at least partially coincides with the orthographic projection of the jet hole on the surface of the substrate. Based on the relative positional relationship between the jet hole and the heat-generating area, the cooling medium sprayed by the jet hole can be provided point-to-point to the heat-generating area of ​​the chip, thereby achieving efficient heat exchange between the cooling medium and the heat-generating area of ​​the chip.

[0021] Fourthly, this application also provides a chip, which includes a substrate and a circuit structure. The substrate has a cavity structure, and a first cavity and a second cavity are disposed within the substrate. The substrate includes a top wall and a bottom wall, which are disposed opposite to each other along a first direction. The circuit structure can be formed on the surface of the bottom wall facing away from the top wall. A jetting plate and a fixing frame are disposed within the substrate, with both ends of the fixing frame connected to the top wall and the jetting plate, respectively. The first cavity includes a space enclosed by the fixing frame, the jetting plate, and the top wall. The second cavity includes at least the space between the jetting plate and the bottom wall. A plurality of first heat dissipation fins are disposed on the side of the jetting plate facing away from the top wall. The jetting plate includes a jetting region, and the jetting region has jetting holes penetrating the jetting plate along the thickness direction, the jetting holes connecting the first cavity and the second cavity.

[0022] During chip operation, the second cavity of the substrate is thermally connected to the circuit structure. The cooling medium in the first cavity enters the second cavity through the jet holes in a jet manner, and then disperses and flows to other areas of the second cavity under the guidance of the first heat dissipation fins to exchange heat with the circuit structure. Since the first heat dissipation fins and jet holes are jointly arranged on the jet plate, and the positions of multiple first heat dissipation fins and jet holes are determined in the design stage, there is no need to consider whether the first heat dissipation fins and jet holes will interfere during chip fabrication. The first heat dissipation fins can be placed at any position except for the jet holes as needed to achieve a high-density layout on the jet plate, and the height of the first heat dissipation fins is no longer limited, allowing the first heat dissipation fins to fully exert their heat exchange function. Therefore, the chip provided in this application has a relatively simple manufacturing process while achieving good heat dissipation.

[0023] Fifthly, this application also provides a circuit board assembly, including a substrate and the chip mentioned in the fourth aspect above, with the substrate supporting the side of the chip where the circuit structure is disposed. Based on the chip's self-heating capability, the circuit board assembly has a relatively simple structure and high operational reliability.

[0024] Sixthly, this application also provides an electronic device comprising a housing and a circuit board assembly as described in the third or fifth aspect above, the circuit board assembly being disposed within the housing. This electronic device exhibits excellent heat dissipation performance and high operational reliability. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0026] Figure 2 This is a side sectional view of a circuit board assembly;

[0027] Figures 3a to 3d Here are schematic diagrams of the cross-sectional structures of several jet cooling plates in related technologies;

[0028] Figure 4 This is a cross-sectional schematic diagram of an assembly structure of a heat sink and a chip provided in an embodiment of this application;

[0029] Figure 5 This is a partial cross-sectional structural diagram of a heat sink provided in an embodiment of this application;

[0030] Figures 6a to 6b Schematic diagrams of partial cross-sectional structures of two other heat sinks provided in the embodiments of this application;

[0031] Figures 7a to 7b Schematic diagrams of partial cross-sectional structures of two other heat sinks provided in the embodiments of this application;

[0032] Figure 8 This is a partial cross-sectional structural diagram of another heat sink provided in an embodiment of this application;

[0033] Figure 9 This is a schematic diagram of the structure of a jet plate provided in an embodiment of this application;

[0034] Figure 10 A cross-sectional schematic diagram of another heat sink and chip assembly structure provided in an embodiment of this application;

[0035] Figures 11a to 11b Schematic diagrams of partial cross-sectional structures of two other heat sinks and chips provided in the embodiments of this application;

[0036] Figure 12 A cross-sectional schematic diagram of another heat sink and chip assembly structure provided in an embodiment of this application;

[0037] Figure 13a and Figure 13b Schematic diagrams of partial cross-sectional structures of two other heat sinks provided in the embodiments of this application;

[0038] Figure 14 This is a schematic diagram of the structure of a chip provided in an embodiment of this application.

[0039] Related technology reference numerals:

[0040] 01-Jet cooling plate; 011-Jet cavity; 012-Heat exchange cavity; 0121-Bottom wall; 013-Jet plate; 0131-Jet hole; 0132-Boss;

[0041] 014 - Heat dissipation fins;

[0042] Reference numerals in the embodiments of this application:

[0043] 1000 - Electronic equipment; 1100 - Housing; 1200 - Circuit board assembly; 1210 - Circuit board; 1220 - Chip packaging structure; 100 - Substrate;

[0044] 200 - Chip; 210 - Substrate; 220 - Circuit structure; 221 - Heating area; 300 - Heat sink; 310, 210 - Housing; 3101 / 2101 - First cavity;

[0045] 3102 / 2102 - Second cavity; 3103 / 2102 - Third cavity; 311 / 211 - Top wall; 3111 / 2111 - Liquid inlet; 3112 / 2112 - Liquid outlet;

[0046] 312 / 212 - Sidewall; 313 / 213 - Bottom wall; 3131 - Groove; 320 / 230 - Jet plate; 321 / 231 - Jet zone; 322 / 232 - Jet hole;

[0047] 323 / 233 - Connecting port; 330 / 240 - Fixing frame; 340 / 250 - First heat dissipation fin; 350 - Second heat dissipation fin; 400 - Thermal interface material. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.

[0049] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0050] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. (Reference) Figure 1As shown in this embodiment, the electronic device 1000 can be an artificial intelligence device, a cloud computing device, a server, a communication device (e.g., a router), a storage device, an in-vehicle device, a mobile phone, a tablet computer, a computer, or a wearable device, etc. The electronic device 1000 includes a housing 1100 and a circuit board assembly 1200. The circuit board assembly 1200 is disposed within the housing 1100 to provide protection for the circuit board assembly 1200. The circuit board assembly 1200 may include a circuit board 1210 and various electronic components or functional modules disposed on the circuit board to support the electronic device 1000 in performing corresponding functions.

[0051] Figure 2 This is a side sectional view of a circuit board assembly. (Reference) Figure 2 As shown, the circuit board assembly 1200 includes a circuit board 1210 and a chip packaging module 1220, with the chip packaging module 1220 disposed on the circuit board 1210. The chip packaging module 1220 includes a substrate 100, a chip 200, and a heat sink 300. The chip 200 is disposed on the surface of the substrate 100, and the heat sink 300 is disposed on the side of the chip 200 facing away from the substrate 100. The substrate 100 serves as the packaging carrier for the chip 200, providing electrical connection, protection, support, and assembly functions. The heat sink 300 dissipates heat from the chip 200 to ensure that the chip 200 remains within a normal temperature range during operation, thereby improving the operational reliability of the chip packaging structure 1220.

[0052] The substrate 100 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board, etc. In some other embodiments, the substrate 100 can also be a direct bonding copper (DBC) ceramic substrate. In addition to providing electrical connections for the chip 200, the DBC ceramic substrate has excellent thermal conductivity, so it can also absorb some of the heat generated by the chip 200, enabling the chip 200 to achieve double-sided heat dissipation through the substrate 100 on the upper and lower sides and the heat sink 300.

[0053] Chip 200 can be a baseband chip, a graphics processing unit (GPU), a central processing unit (CPU), a system on chip (SoC), or other chips with logic operation capabilities. It can also be other types of application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof.

[0054] Chip 200 includes a substrate 210 and a circuit structure 220, with the circuit structure 200 disposed on one side surface of the substrate 210. The substrate 210 can be made of silicon (Si) or silicon carbide (SiC), etc. The circuit structure 220 can be formed on the surface of the substrate 210 using integrated circuit processes such as photolithography, etching, thin film deposition, and doping. The circuit structure 220 is the core of chip 200; all functions of chip 200 are implemented based on the circuit structure, and the heat generated by chip 200 originates from the circuit structure 220. Different regions of the circuit structure 220 have different heat generation levels, therefore, the heat dissipation requirements of different regions will also differ. In this embodiment, the region in the circuit structure 220 with relatively high heat dissipation requirements can be referred to as a heat-generating region 221, and there can be one or more heat-generating regions. Exemplarily, the heat-generating region can be, but is not limited to, the active region of the circuit structure.

[0055] In one implementation, the circuit structure 220 is formed on the surface of the substrate 210 facing the substrate 100, and the heat generated by the circuit structure 200 can be transferred to a heat sink through the substrate 100. In this case, the chip 200 and the substrate 100 can be connected using flip chip technology. Flip chip technology has advantages such as high pin count and high signal density, and can achieve excellent electrical performance with low capacitance, low inductance, and low resistance.

[0056] Given the different heat dissipation requirements of different areas of the circuit structure 220, in this embodiment, the heat sink 300 can adopt a jet cooling plate structure. The jet cooling plate can provide point-to-point cooling medium to the heat-generating area of ​​the circuit structure and distribute the cooling medium in a targeted manner, thereby achieving efficient flow heat exchange with limited cooling medium.

[0057] Figures 3a to 3d This is a schematic diagram of the cross-sectional structure of several jet cooling plates 01 in related technologies. For example... Figures 3a to 3dAs shown, the jet cooling plate 01 includes a jet cavity 011 and a heat exchange cavity 012, which are separated by a jet plate 013. The jet plate 013 is provided with multiple jet holes 0131 for connecting the jet cavity 011 and the heat exchange cavity 012. The cooling medium in the jet cavity 011 enters the heat exchange cavity 012 in a jet manner through the jet holes 0131, and then disperses to other areas of the heat exchange cavity 012. Multiple heat dissipation fins 014 are provided on the side of the bottom wall 0121 of the heat exchange cavity 012 facing the jet plate 0131. The heat dissipation fins 014 can enhance the heat exchange between the cooling medium and the heat exchange cavity 012, and also manage the flow direction of the cooling medium in the heat exchange cavity 012, reduce the flow resistance of the cooling medium, and thus improve the heat exchange efficiency of the jet cooling plate 01.

[0058] like Figures 3a to 3c As shown, a boss 0132 is provided on the side of the jet plate 013 facing the bottom wall 0121. The orthographic projection of the boss 0132 on the surface of the jet plate 013 covers the orthographic projection of the jet hole 0131 on the surface of the jet plate 013, or in other words, the jet hole 0131 penetrates the boss 0132. The distance between the end of the jet hole 0131 and the bottom wall 0121 can be understood as the jet distance of the cooling medium after it is ejected from the jet hole 0131. It is easy to understand that the smaller the jet distance, the greater the velocity of the cooling medium when it reaches the surface of the bottom wall 0121, and the better the heat exchange effect between the bottom wall 0121 and the cooling medium. It can be seen that with the boss 0132, the jet distance of the cooling medium is smaller, thus achieving a better heat exchange effect. However, during the manufacturing process of the jet cooling plate 01, considering installation tolerances, to avoid interference between the boss 0132 or the jet hole 0131 and the heat dissipation fin 014 below, the heat dissipation fin 014 is usually placed in an area relatively far from the jet hole 0131, such as... Figure 3a As shown; or the heat dissipation fins 014 can be designed with a relatively small height, such as Figure 3b As shown; alternatively, the distance from the heat dissipation fin 014 can be designed as a stepped height, so that the height of the heat dissipation fin 014 closer to the boss 0132 is less than the height of the heat dissipation fin 014 farther from the boss 0132, such as... Figure 3c As shown. While these design methods can reduce the risk of interference between the boss 0132 and the heat dissipation fins 014, they cannot effectively achieve the high heat dissipation performance of the heat sink 01.

[0059] Figure 3d The image shows an example where the jet plate 013 does not have a boss 0132. This design can avoid interference between the boss 0132 and the heat dissipation fins 014. However, it will result in an excessive jet distance of the cooling medium, which will also affect the heat dissipation performance of the jet cold plate 01.

[0060] To address the issue of the inability to simultaneously achieve satisfactory installation tolerances and heat dissipation performance in the aforementioned jet-cooled plate 01, this application provides a heat sink in the form of a jet-cooled plate. This reduces the processing and assembly difficulty of the heat sink and improves its production efficiency while ensuring its heat dissipation performance. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0061] Figure 4 This is a cross-sectional schematic diagram of an assembly structure of a heat sink 300 and a chip 200 provided in an embodiment of this application. (See reference...) Figure 4 As shown, the radiator 300 includes a housing 310, a jet plate 320, and a fixing frame 330. The housing 310 includes a top wall 311, and a first cavity 3101 and a second cavity 3102 are disposed within the housing 310. The jet plate 320 and the fixing frame 330 are disposed within the housing 310, with the jet plate 320 spaced apart from the top wall 311. The two ends of the fixing frame 330 are fixedly connected to the top wall 311 and the jet plate 320, respectively. Thus, the fixing frame 330, the jet plate 320, and the top wall 311 can enclose a cavity, which is the first cavity 3101. The second cavity 3102 may at least include the space on the side of the jet plate 320 facing away from the top wall 311, or the space located below the first cavity 3101. The second cavity 3102 and the first cavity 3101 are separated by the jet plate 320. The chip 200 is located on the side of the heat sink 300 facing away from the top wall 311, and the chip is thermally connected to the second cavity 3102 of the heat sink 300.

[0062] The region opposite the jet plate 320 and the first cavity 3101 includes a jet region 321. The jet region 321 is provided with jet holes 322 penetrating the jet plate 320, allowing the jet holes 322 to connect the first cavity 3101 and the second cavity 3102. There can be one or more jet regions 321; this application does not limit this. In practical applications, the number and distribution of jet regions 321 can be designed based on the number and distribution of heat-generating areas 221 in the chip 200. For example, jet regions 321 and heat-generating areas 221 can be configured in a one-to-one correspondence, or each jet region 321 can correspond to multiple heat-generating areas 221, or multiple jet regions 321 can correspond to one heat-generating area 221. The stacking direction of the heat sink 300 and the chip 200 is defined as the first direction, and the orthographic projection of the jet hole 322 of the jet region 321 in the first direction at least partially overlaps with the orthographic projection of the corresponding heat-generating area in the first direction.

[0063] Additionally, the housing 310 includes a sidewall 312, which has a first end connected to the fixing frame 330 on the same side surface of the top wall 311. In one implementation, there can be multiple sidewalls 312, which are sequentially connected along the periphery of the top wall 311 to form an annular frame structure to enclose the jet plate 320 and the fixing frame 330. For example, there can be four sidewalls 312, which are sequentially connected to form a rectangular frame structure. In another implementation, the sidewall 312 can be an integral annular frame structure, with the jet plate 320 and the fixing frame 330 located inside the annular sidewall 312. For example, the sidewall 312 can be a circular annular frame.

[0064] The sidewall 312 also includes a second end. Along the first direction, the second end of the sidewall 312 is disposed opposite to the first end of the sidewall 312, and the second end of the sidewall 312 extends in a direction away from the top wall 311. Furthermore, along the first direction, there is a gap between the second end of the sidewall 312 and the jet plate 320, so that a certain space can be left below the jet plate 320 to form a second cavity 3102.

[0065] In some embodiments, at least a portion of the fixing frame 330 is spaced apart from the side wall 312, meaning a certain space is formed between the fixing frame 330 and the side wall 312. This space can serve as a third cavity 3103 within the housing 310. In one implementation, the fixing frame 330 is entirely spaced apart from the side wall 312, thus forming an annular third cavity 3103 between the fixing frame 330 and the side wall 312. It is easily understood that the third cavity 3103 surrounds the first cavity 3101, and the third cavity 3103 and the first cavity 3101 are separated by the fixing frame 330. In another implementation, a portion of the fixing frame 330 is spaced apart from the side wall 312, while another portion of the fixing frame 330 is in contact with the side wall 312. The space between the portion of the fixing frame 330 and the side wall 312 forms the third cavity 3103.

[0066] In this embodiment, the second cavity 3102 may include not only the space below the first cavity 3101, but also the space below the third cavity 3103 (i.e., the space on the side of the third cavity 3103 facing away from the top wall 311). In other words, the upper space inside the housing 310 is divided into the first cavity 3101 and the third cavity 3103 by the fixing frame 330, and the lower space inside the housing 310 is entirely used to form the second cavity 3102.

[0067] The second cavity 3102 and the third cavity 3103 can be connected through a connecting port 323. In one implementation, the periphery of the jet plate 320 is fixedly connected to the side wall 312, and the connecting port 323 is disposed in the area of ​​the jet plate 320 extending beyond the fixing frame 330. There can be one or more connecting ports 323. When there are multiple connecting ports 323, they can be evenly distributed in the area of ​​the jet plate 320 extending beyond the fixing frame 330. In another implementation, at least a portion of the jet plate 320 and the side wall 312 can be spaced apart, and the gap between the jet plate 320 and the side wall 312 can be formed as a connecting hole 323.

[0068] Please continue to refer to this. Figure 4 As shown, the jet plate 320 has multiple first heat dissipation fins 340 on the side facing away from the top wall 311. It is easy to understand that these multiple first heat dissipation fins 340 are all located within the second cavity 3102. By rationally designing the shape, position, and arrangement of the multiple first heat dissipation fins 340, the flow direction of the cooling medium within the second cavity 3102 can be planned, reducing the flow resistance of the cooling medium within the second cavity 3102, and enabling effective heat exchange in all areas of the cooling medium within the second cavity 3102.

[0069] In this embodiment, the top wall 311 is provided with an inlet hole 3111 and an outlet hole 3112, which penetrate the top wall. The inlet hole 3111 connects the first cavity 3101 to the outside of the radiator, and the outlet hole 3112 connects the third cavity 3103 to the outside of the radiator. In one implementation, the inlet hole 3111 and the outlet hole 3112 can be connected to an external cooling device via pipes. Exemplarily, the external cooling device includes a heat exchanger, a refrigerator, or an air conditioner.

[0070] During operation, the heat sink 300 receives the low-temperature cooling medium cooled by the cooling equipment through the inlet 3111. After entering the first cavity 3101, the low-temperature cooling medium is sprayed into the second cavity 3102 through the jet holes 322 of the jet plate 320 under the pressure inside the first cavity 3101. Based on the relative positional relationship between the jet holes 322 and the heat-generating area 221 of the chip 200, the spraying area of ​​the jet holes 322 in the second cavity 3102 is relatively close to the heat-generating area 221 of the chip 200. Therefore, the cooling medium sprayed by the jet holes 322 can be supplied point-to-point to the heat-generating area 221 of the chip 200, thereby achieving efficient heat exchange between the cooling medium and the heat-generating area 221 of the chip 200. Subsequently, guided by the first heat dissipation fins 340, the cooling medium flows to other areas of the second cavity 3102 to dissipate heat from other areas of the chip 200 that require cooling. During this process, the heat transferred from the chip 200 to the first heat dissipation fins 340 through the housing 310 of the heat sink 300 is also continuously transferred to the cooling medium. The cooled medium, after heat exchange and heating, enters the third cavity 3103 through the connecting port 323 and is finally transported to the cooling device for cooling through the outlet port 3112. In this way, by utilizing the circulating flow of the cooling medium among the three cavities of the heat sink 300, continuous heat dissipation of the chip 200 can be achieved.

[0071] Furthermore, in this embodiment, multiple first heat dissipation fins 340 and jet holes 322 are jointly disposed on the jet plate 320. The positions of the multiple first heat dissipation fins 340 and jet holes 322 are determined during the design phase. During the manufacturing process of the radiator 300, there is no need to consider whether the first heat dissipation fins 340 and jet holes 322 will interfere with each other. The first heat dissipation fins 340 can be disposed at any position except for the jet holes 322 as required, achieving a high-density layout on the jet plate 320. Moreover, the height of the first heat dissipation fins 340 is no longer limited. For example, the first heat dissipation fins 340 can extend to be flush with the second end of the side wall 312, so that the first heat dissipation fins 340 can fully exert their heat exchange function. Therefore, the embodiments of this application can effectively reduce the processing and assembly difficulty of the radiator 300 and improve the production efficiency of the radiator 300 while ensuring the heat dissipation performance of the radiator 300.

[0072] Continue to refer to Figure 4As shown in this embodiment, the housing further includes a bottom wall 313, located on the side of the jet plate 320 facing away from the top wall 311. The bottom wall 313 and the top wall 311 are arranged opposite each other along a first direction, and the bottom wall 313 is fixedly connected to the second end of the side wall 312. Thus, the top wall 311, the side wall 312, and the bottom wall 313 connect the housing to form a relatively closed structure. The second cavity includes the space enclosed by the bottom wall 313, the jet plate 320, and the side wall 312. The jet hole 322 sprays cooling medium onto the surface of the bottom wall 313 facing the jet plate 320. The surface of the bottom wall 313 facing away from the jet plate 320 is used for thermally conductive connection with the chip 200. After absorbing the heat from the chip 200, the bottom wall 313 exchanges heat with the cooling medium, thereby continuously transferring the heat of the chip 200 to the cooling medium, achieving heat dissipation for the chip.

[0073] A thermal interface material (TIM) 400 can be disposed between the bottom wall 313 and the chip. The TIM 400 can be used to fill the interface gap between the chip 200 and the bottom wall 313, thereby improving the thermal conductivity between the chip 200 and the bottom wall 313. For example, the thermal interface material 400 includes, but is not limited to, materials with good thermal conductivity such as silicone grease, carbon-based thermal pads, or phase change materials (PCMs).

[0074] A protrusion 324 is provided on the side of the jet zone facing away from the top wall 311. The orthographic projection of the protrusion 324 in the first direction covers the orthographic projection of the jet hole 322 in the first direction, so the jet hole 322 can pass through the protrusion 324. With this design, the distance between the end of the jet hole 322 and the bottom wall 313 is reduced. Therefore, the jet distance of the cooling medium after being ejected from the jet hole 322 is reduced, which increases the velocity of the cooling medium impacting the surface of the bottom wall 313 and improves the heat exchange effect between the bottom wall 313 and the cooling medium.

[0075] When the jet plate 320 includes multiple jet regions 321, correspondingly, there can also be multiple bosses 324. The bosses 324 of the multiple jet regions 321 can be spaced apart from each other or connected as a whole; this application does not specifically limit this. In addition, the height of the multiple bosses 324 can be the same, or at least two of the multiple bosses 324 can have different heights; this application also does not limit this, and the specific choice can be determined according to the heat dissipation requirements of different areas of the chip 200.

[0076] Figure 5 This is a partial cross-sectional structural diagram of a heat sink 300 provided in an embodiment of this application. (Reference) Figure 5As shown in this embodiment, the jet region 321 may be provided with one or more jet holes 322 according to the heat dissipation requirements of the chip's heat-generating area. For example, the figure shows an example where the jet region 321 is provided with two jet holes 322. When the heat dissipation requirements of the chip's heat-generating area are small, the number of jet holes 322 in the jet region 321 can be reduced accordingly; when the heat dissipation requirements of the chip's heat-generating area are large, the number of jet holes 322 in the jet region 321 can be increased accordingly.

[0077] Furthermore, among the multiple first heat dissipation fins 340, some of the first heat dissipation fins 340 are connected to the boss 324. This allows for a higher density arrangement of the first heat dissipation fins 340, thereby helping to further improve the heat exchange efficiency of the cooling medium in the second cavity 3102. Exemplarily, some of the first heat dissipation fins 340 can also be disposed on the boss 324, and these first heat dissipation fins 340 can be arranged around the jet hole 322. For each first heat dissipation fin 340 disposed on the boss 324, the first heat dissipation fin 340 can be entirely disposed on the boss 324, or partially disposed on the boss 324 and partially disposed on the jet plate 320; this application does not limit this.

[0078] Figure 6a and Figure 6b Schematic diagrams of partial cross-sectional structures of two other heat sinks 300 provided in embodiments of this application. (See reference...) Figure 6a and Figure 6b As shown, in this embodiment, in addition, at least some of the first heat dissipation fins 340 have their ends facing away from the jet plate 320 fixedly connected to the bottom wall 313. Figure 6a In one example shown, the ends of all the first heat dissipation fins 340 facing away from the jet plate 320 are fixedly connected to the bottom wall 313; as shown Figure 6b In another example shown, one end of the first heat dissipation fin 340 facing away from the jet plate 320 is connected to the bottom wall 313. Since the bottom wall 313 must withstand the impact of the cooling medium ejected from the jet holes 322, it often needs to meet certain strength requirements. In the prior art, the impact resistance of the bottom wall 313 is generally improved by increasing its thickness; however, this increases the thermal resistance of the bottom wall 313, which is detrimental to heat dissipation from the chip. In this embodiment, the bottom wall 313 can be fixedly connected to the jet plate 320 via the first heat dissipation fin 340, thus improving its impact resistance and reducing the high thickness requirement for the bottom wall 313, thereby reducing its thermal resistance.

[0079] In one implementation, the end of the first heat dissipation fin 340 facing away from the jet plate 320 can be welded to the bottom wall 313 to improve the connection strength between the first heat dissipation fin 340 and the bottom wall 313. For example, the first heat dissipation fin 340 and the bottom wall 313 can be fixedly connected by welding processes such as brazing and diffusion welding.

[0080] Figure 7a and Figure 7b Schematic diagrams of partial cross-sectional structures of two other heat sinks 300 provided in embodiments of this application. (See reference...) Figure 7a and Figure 7b As shown in this embodiment, a plurality of second heat dissipation fins 350 are provided on the side of the bottom wall 313 facing the jet plate 320, and the plurality of second heat dissipation fins 350 extend toward the jet plate 320 respectively. The orthographic projection of the plurality of second heat dissipation fins 350 in the first direction does not coincide with the orthographic projection of the plurality of first heat dissipation fins 340 in the first direction, and the orthographic projection of the plurality of second heat dissipation fins 350 in the first direction does not coincide with the orthographic projection of the jet region 321 in the first direction. For example, the plurality of second heat dissipation fins 350 are located further away from the jet region 321 of the jet plate 320 than the plurality of first heat dissipation fins 340. This avoids the problem of interference between the second heat dissipation fins 350 and the jet hole 322, and does not affect the high-density layout of the second heat dissipation fins 350 and the first heat dissipation fins 340, thereby reducing the processing and assembly difficulty of the radiator 300 while ensuring the heat dissipation performance of the radiator 300.

[0081] Furthermore, among the plurality of second heat dissipation fins 350, at least a portion of the second heat dissipation fins 350 are fixedly connected to the jet plate 320 at the end facing the jet plate 320. For example, Figure 7a The image shows a case where one end of all the second heat dissipation fins 350 facing the jet plate 320 is fixedly connected to the jet plate 320; Figure 7b This illustration shows a case where one end of the second heat dissipation fin 350 facing the jet plate 320 is fixedly connected to the jet plate 320. By using the second heat dissipation fin 350 to fix the bottom wall 313 to the jet plate 320, the impact resistance of the bottom wall 313 can be improved, thus reducing the high thickness requirement of the bottom wall 313 and helping to reduce the thermal resistance of the bottom wall 313.

[0082] In one implementation, the end of the second heat dissipation fin 350 facing the jet plate 320 can be welded to the bottom wall 313 to improve the connection strength between the second heat dissipation fin 350 and the jet plate 320. Exemplarily, the second heat dissipation fin 350 and the jet plate 320 can be fixedly connected by welding processes such as brazing and diffusion welding.

[0083] Figure 8 A partial cross-sectional structural diagram of another heat sink 300 provided in an embodiment of this application. (See reference...) Figure 8As shown, in this embodiment, the bottom wall 313 is provided with a groove 3131, and the orthographic projection of the groove 3131 in the first direction covers the orthographic projection of the jet hole 322 in the first direction. Furthermore, when the jet plate 320 is provided with a boss 324, the orthographic projection of the groove 3131 in the first direction can cover the orthographic projection of the boss 324 in the first direction. By providing the groove 3131, the thickness of the bottom wall 313 can be locally reduced, thereby further reducing the thermal resistance of the groove 3131 area and improving the heat exchange effect between this area and the chip.

[0084] In one embodiment, one end of the first heat dissipation fin 340 facing away from the jet plate 320 extends into the groove 3131 and is fixedly connected to the bottom of the groove 3131 to improve the ability of the bottom of the groove 3131 to withstand the jet impact of the jet hole 322. Exemplarily, the first heat dissipation fin 340 and the bottom of the groove 3131 can be fixedly connected by welding processes such as brazing and diffusion welding.

[0085] Figure 9 This is a schematic diagram of the structure of a jet plate 320 provided in an embodiment of this application. (Reference) Figure 9 As shown, in this embodiment, the jet hole 322 can be circular, elliptical, oriented, rectangular, polygonal, or other regular or irregular shapes. When the jet plate 320 includes multiple jet regions 321 and / or the jet regions 321 are provided with multiple jet holes 322, the shapes of each jet hole 322 can be the same, or at least two jet holes 322 can have different shapes.

[0086] The first heat dissipation fin 340 can be a regular or irregular integral columnar structure such as a cylinder, cube, or prism, or it can be a columnar structure made of multiple layers of thin plates stacked together. The shapes of each first heat dissipation fin 340 can be the same, or at least two first heat dissipation fins 340 can have different shapes.

[0087] In addition, when a second heat dissipation fin is provided on the bottom wall, the second heat dissipation fin can also be a regular or irregular integral columnar structure such as a cylinder, cube, or prism, or it can be a columnar structure made of multiple layers of thin plates stacked together. The shapes of each second heat dissipation fin can be the same, or at least two second heat dissipation fins can have different shapes.

[0088] Figure 10 This is a cross-sectional schematic diagram of another assembly structure of a heat sink 300 and a chip 200 provided in an embodiment of this application. (See reference...) Figure 10As shown in the embodiment of this application, the structure and connection method of the heat sink 300 are basically the same as those of the previous embodiments. The difference is that the housing 310 in this embodiment does not include a bottom wall, and the second end of the side wall 312 can be connected to the surface of the chip 200, so that the chip 200 seals the other side of the housing 310. The second cavity 3101 includes the space formed by the side wall 312, the jet plate 320, and the chip 200. The jet hole 322 sprays cooling medium onto the surface of the chip 200. Since the bottom wall is eliminated, this solution can further reduce the thermal resistance between the chip 200 and the cooling medium, thereby improving the heat dissipation effect on the chip 200.

[0089] Figure 11a and 11b This is a partial cross-sectional structural diagram of two other heat sinks 300 and chip 200 provided in embodiments of this application. In this embodiment, the housing 310 also does not include a bottom wall, as described above. Figure 10 The difference in the illustrated embodiment is that the first fin 340 is disposed on the side surface of the chip 200 facing the jet plate 320, and the end of the first heat dissipation fin facing away from the chip 200 can be in contact with the surface of the jet plate 320 or spaced apart, for example... Figure 11a In one example shown, the ends of all the first heat dissipation fins 340 facing away from the chip 200 are in contact with the surface of the jet plate 320; as shown Figure 11b In one example shown, one end of a portion of the first heat dissipation fin 340 facing away from the chip 200 is in contact with the surface of the jet plate 320, while the other end of a portion of the first heat dissipation fin 340 facing away from the chip 200 is spaced apart from the surface of the jet plate 320.

[0090] Figure 12 This is a cross-sectional schematic diagram of another assembly structure of a heat sink 300 and a chip 200 provided in an embodiment of this application. (See reference...) Figure 12As shown in this embodiment, the radiator 300 includes a housing 310, a jet plate 320, and a fixing frame 330. The housing 310 includes a top wall 311 and a bottom wall 313. The height direction of the radiator 300 is defined as a first direction, and the top wall 311 and the bottom wall 313 of the housing 310 are arranged opposite each other along the first direction. A first cavity 3101 and a second cavity 3102 are provided inside the housing 310. The jet plate 320 and the fixing frame 330 are disposed inside the housing 310. The jet plate 320 is spaced apart from the top wall 311 and the bottom wall 313, respectively. The two ends of the fixing frame 330 are fixedly connected to the top wall 311 and the jet plate 320, respectively. The fixing frame 330, the jet plate 320, and the top wall 311 can be enclosed to form the first cavity 3101. The second cavity 3102 includes at least the space between the jet plate 320 and the bottom wall 313, or the space located below the first cavity 3101. The second cavity 3102 and the first cavity 3101 are separated by the jet plate 320. The chip 200 is disposed on the side of the bottom wall 313 facing away from the top wall 311, and the chip 200 is thermally connected to the bottom wall 313.

[0091] A thermal interface material 400 may be disposed between the bottom wall 313 and the chip 200. The thermal interface material 400 can be used to fill the interface gap between the chip 200 and the bottom wall 313, thereby improving the thermal conduction efficiency between the chip 200 and the bottom wall 313. For example, the thermal interface material 400 includes, but is not limited to, materials with good thermal conductivity such as silicone grease, carbon-based thermal pads, or phase change materials.

[0092] The region opposite the jet plate 320 to the first cavity 3101 includes a jet region 321. The jet region 321 is provided with a jet hole 322 penetrating the jet plate 320, so the jet hole 322 can connect the first cavity 3101 and the second cavity 3102. The orthographic projection of the jet hole 322 in the jet region 321 in the first direction at least partially coincides with the orthographic projection of the heating region 221 in the first direction.

[0093] A plurality of first heat dissipation fins 340 are provided on the side of the jet plate 320 facing away from the top wall 311, and at least some of the first heat dissipation fins 340 are fixedly connected to the bottom wall 313 at the end facing away from the jet plate 320. Exemplarily, the first heat dissipation fins 340 and the bottom wall 313 can be fixedly connected by welding processes such as brazing and diffusion welding. A plurality of second heat dissipation fins 350 are provided on the side of the bottom wall 313 facing the jet plate 320. The plurality of first heat dissipation fins 340 are located further away from the jet region 320 of the jet plate 320 than the plurality of second heat dissipation fins 350. This allows for enhanced heat transfer through the plurality of second heat dissipation fins 350, and also improves the impact resistance of the bottom wall 313 by connecting the plurality of first heat dissipation fins 340 to it. The shapes of the first heat dissipation fins 340 and the second heat dissipation fins 350 can be the same or different; this application does not impose any limitations on this.

[0094] The housing 310 also includes a side wall 312, the first end of which is fixedly connected to the top wall 311, and the second end of which is fixedly connected to the bottom wall 313, thereby connecting the top wall 311, the side wall 312, and the bottom wall 313 to form a relatively closed structure. At least a portion of the fixing frame 330 is spaced apart from the side wall 312, and the space between the fixing frame 330 and the side wall 312 can form a third cavity 3103, which communicates with the second cavity 3102 through a communication port 323.

[0095] In addition, the top wall 311 is provided with an inlet hole 3111 and an outlet hole 3112. The inlet hole 3111 and the outlet hole 3112 respectively penetrate the top wall 311. The inlet hole 3111 can connect the first cavity 3101 to the outside of the radiator 300, and the outlet hole 3112 can connect the third cavity 3103 to the outside of the radiator 300.

[0096] During operation, the heat sink 300 receives the low-temperature cooling medium cooled by the cooling equipment through the liquid inlet 3111. After entering the first cavity 3101, the low-temperature cooling medium is sprayed onto the surface of the bottom wall 313 through the jet holes 322 of the jet plate 320 under the pressure inside the first cavity 3101. Based on the relative positional relationship between the jet holes 322 and the heat-generating area 221 of the chip 200, the spraying area of ​​the jet holes 322 on the surface of the bottom wall 313 is the area directly opposite the heat-generating area 221 of the chip 200. Therefore, the cooling medium sprayed by the jet holes 322 can be provided point-to-point to the heat-generating area 221 of the chip 200, thereby achieving efficient heat exchange between the cooling medium and the heat-generating area 221 of the chip 200. Subsequently, guided by the first and second heat dissipation fins 340 and 350, the cooling medium flows to other areas of the second cavity 3102 to dissipate heat from other areas of the chip 200 that require cooling. During this process, the heat transferred from the chip 200 to the first and second heat dissipation fins 340 and 350 through the housing 310 of the heat sink 300 is also continuously transferred to the cooling medium. The cooled medium, after heat exchange and heating, enters the third cavity 3103 through the connecting port 323 and is finally transported to the cooling device for cooling through the outlet port 3112. In this way, by utilizing the circulating flow of the cooling medium among the three cavities of the heat sink 300, continuous heat dissipation of the chip 200 can be achieved.

[0097] In addition, compared with the existing technology that increases the thickness of the bottom wall 313 to improve its impact resistance, this embodiment uses the first heat dissipation fin 340 to fix the bottom wall 313 to the jet plate 320, so that the bottom wall 313 can achieve strong impact resistance with a relatively small thickness, thereby helping to reduce the thermal resistance of the bottom wall 313 and thus improving the heat dissipation efficiency of the chip 200.

[0098] Figure 13a and Figure 13b Schematic diagrams of partial cross-sectional structures of two other heat sinks 300 provided in embodiments of this application. (See reference...) Figure 13a As shown, the ends of the plurality of second heat dissipation fins 350 facing the jet plate 320 can be spaced apart from the surface of the jet plate 320; Reference Figure 13b As shown, at least one end of the second heat dissipation fin 350 facing the jet plate 320 is fixedly connected to the surface of the jet plate 320. Exemplarily, the second heat dissipation fin 350 and the jet plate 320 may be fixedly connected by welding processes such as brazing and diffusion welding.

[0099] Figure 14 This is a schematic diagram of the structure of a chip 200 provided in an embodiment of this application. (Reference) Figure 14 As shown in the embodiment of this application, the chip 200 includes a substrate 210 and a circuit structure 220. The substrate 210 is a cavity structure, and can be used to form a heat sink. The substrate 210 can also have... Figures 4 to 9 The heat sink shown has the same structure, or has the same structure as the heat sink shown. Figures 12 to 13b The heat sink shown has the same structure.

[0100] In one embodiment, a first cavity 2101 and a second cavity 2102 are disposed within a substrate 210. The substrate 210 includes a top wall 211 and a bottom wall 213. The thickness direction of the chip 200 is defined as a first direction, and the top wall 211 and the bottom wall 213 of the substrate 210 are disposed opposite each other along the first direction. A jet plate 230 and a fixing frame 240 are disposed within the substrate 210. The two ends of the fixing frame 240 are fixedly connected to the top wall 211 and the jet plate 230, respectively. The fixing frame 240, the jet plate 230, and the top wall 211 can enclose and form the first cavity 2101. The second cavity 2102 includes at least the space between the jet plate 230 and the bottom wall 213, and the second cavity 2102 is separated from the first cavity 2101 by the jet plate 230. A circuit structure 220 is formed on the side surface of the bottom wall 213 facing away from the top wall 211. The circuit structure 220 may include one or more heat-generating areas 221.

[0101] The region opposite the jet plate 230 to the first cavity 2101 includes a jet region 231, which is provided with jet holes 232 connecting the first cavity 2101 and the second cavity 2102. The orthographic projection of the jet holes 232 in the first direction at least partially coincides with the orthographic projection of the heating zone 221 in the first direction. Multiple first heat dissipation fins 250 are provided on the side of the jet plate 230 facing away from the top wall 211. The first heat dissipation fins 250 can guide the flow direction of the cooling medium in the second cavity 2102, reduce the flow resistance of the cooling medium in the second cavity 2102, and enable effective heat exchange of the cooling medium in all areas of the second cavity 2102.

[0102] The substrate 210 also includes a sidewall 212, the first end of which is fixedly connected to the top wall 211, and the second end of which is fixedly connected to the bottom wall 213. At least a portion of the fixing frame 240 is spaced apart from the sidewall 212, and the space between the fixing frame 240 and the sidewall 212 can form a third cavity 2103, which is connected to the second cavity 2102 through a communication port 233.

[0103] In addition, the top wall 211 is provided with an inlet hole 2111 and an outlet hole 2112. The inlet hole 2111 and the outlet hole 2112 respectively penetrate the top wall 211. The inlet hole 2111 can connect the first cavity 2101 with the outside of the radiator, and the outlet hole 2112 can connect the third cavity 2103 with the outside of the radiator.

[0104] During the operation of chip 200, substrate 210 receives low-temperature cooling medium cooled by cooling equipment through liquid inlet 2111. After entering the first cavity 2101, the low-temperature cooling medium is sprayed onto the surface of bottom wall 213 through jet holes 232 of jet plate 230 under the pressure inside the first cavity 2101. Based on the relative position of jet holes 232 and heat generation area 221, the spraying area of ​​jet holes 232 on the surface of bottom wall 213 is the area where heat generation area 221 is located. The cooling medium sprayed by jet holes 232 can be provided point-to-point to heat generation area 221, thereby achieving efficient heat exchange between cooling medium and heat generation area 221. Subsequently, the cooling medium flows to other areas of second cavity 2102 under the guidance of first heat dissipation fins 250, so as to achieve heat dissipation for other areas of circuit structure 220 that have heat dissipation requirements. During this process, the heat transferred from circuit structure 220 to first heat dissipation fins 250 through substrate 210 is also continuously transferred to cooling medium. After the heat exchange medium is heated, it enters the third cavity 2103 through the connecting port 233, and is finally transported to the cooling equipment for cooling through the liquid outlet 2112. In this way, by utilizing the circulation of the cooling medium among the three cavities of the substrate 210, continuous heat dissipation of the chip 200 can be achieved.

[0105] In this embodiment, the structure of components such as the jet plate 230, the first heat dissipation fin 250, and the bottom wall 213 can be referred to Figures 5 to 9 The design of the embodiments shown will not be repeated here.

[0106] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radiator, characterized in that, The device includes a housing, a jet plate, and a fixing frame. The housing includes a top wall. The housing contains a first cavity and a second cavity. The jet plate and the fixing frame are disposed within the housing, and the two ends of the fixing frame are respectively connected to the top wall and the jet plate. The first cavity includes a space enclosed by the fixed frame, the jet plate, and the top wall; The second cavity includes at least the space on the side of the jet plate facing away from the top wall; The jet plate has a plurality of first heat dissipation fins on the side facing away from the top wall; the jet plate includes a jet region, and the jet region is provided with jet holes that connect the first cavity and the second cavity.

2. The radiator as described in claim 1, characterized in that, A boss is provided on the side of the jet region facing away from the top wall, and the jet hole passes through the boss; Part of the first heat dissipation fin is connected to the boss.

3. The radiator as described in claim 1 or 2, characterized in that, The housing also includes a bottom wall, which is located on the side of the jet plate facing away from the top wall and is spaced apart from the jet plate. The side of the bottom wall facing away from the top wall is used for thermal connection with the chip. At least one end of the first heat dissipation fin facing away from the jet plate is fixedly connected to the bottom wall.

4. The radiator as described in claim 3, characterized in that, The bottom wall is provided with a groove, and the orthographic projection of the groove in the first direction covers the orthographic projection of the jet hole in the jet region in the first direction. The first direction is the arrangement direction of the top wall and the bottom wall.

5. The radiator as described in claim 4, characterized in that, One end of the first heat dissipation fin facing away from the jet plate extends into the groove and is fixedly connected to the bottom of the groove.

6. The radiator according to any one of claims 3-5, characterized in that, The bottom wall is provided with a plurality of second heat dissipation fins extending toward the jet plate, and the plurality of second heat dissipation fins are disposed further away from the jet area than the plurality of first heat dissipation fins.

7. The radiator as described in claim 6, characterized in that, At least one end of the second heat dissipation fin facing the jet plate is fixedly connected to the jet plate.

8. The radiator according to any one of claims 1-7, characterized in that, The jet zone is provided with one or more jet holes.

9. The radiator according to any one of claims 1-8, characterized in that, The housing also includes a sidewall, and at least a portion of the fixing frame is spaced apart from the sidewall; The housing also includes a third cavity, which comprises the space between the fixing frame and the side wall; The second cavity also includes a space on the side of the third cavity facing away from the top wall, and the second cavity is in communication with the third cavity; The top wall is provided with an inlet hole and an outlet hole. The inlet hole connects the first cavity to the outside, and the outlet hole connects the third cavity to the outside.

10. A radiator, characterized in that, The device includes a housing, a jet plate, and a fixing frame. The housing includes a top wall and a bottom wall that are disposed opposite to each other. A first cavity and a second cavity are provided inside the housing. The jet plate and the fixing frame are disposed inside the housing, and the two ends of the fixing frame are respectively connected to the top wall and the jet plate. The first cavity includes a space enclosed by the fixed frame, the jet plate, and the top wall; The second cavity includes at least the space between the jet plate and the bottom wall; The jet plate has a plurality of first heat dissipation fins on the side facing away from the top wall, and at least some of the first heat dissipation fins are fixedly connected to the bottom wall at the end facing away from the jet plate; the jet plate includes a jet region, and the jet region is provided with jet holes that connect the first cavity and the second cavity; The bottom wall is provided with a plurality of second heat dissipation fins on the side facing the jet plate, and the plurality of second heat dissipation fins are positioned closer to the jet area than the plurality of first heat dissipation fins.

11. A circuit board assembly, characterized in that, The device includes a substrate, a chip, and a heat sink as described in any one of claims 1-10. The chip is disposed on the surface of the substrate, and a second cavity of the heat sink is thermally connected to the side of the chip facing away from the substrate. A heating area is disposed on the side of the chip facing the substrate, and the orthographic projection of the heating area on the surface of the substrate at least partially overlaps with the orthographic projection of the jet hole on the surface of the substrate.

12. A chip, characterized in that, The device includes a substrate and a circuit structure. The substrate has a cavity structure and a first cavity and a second cavity are disposed within the substrate. The substrate includes a top wall and a bottom wall disposed opposite to each other, and the circuit structure is formed on the side surface of the bottom wall facing away from the top wall. A jet plate and a fixing frame are disposed inside the substrate, and the two ends of the fixing frame are respectively connected to the top wall and the jet plate; The first cavity includes a space enclosed by the fixed frame, the jet plate, and the top wall; The second cavity includes at least the space between the jet plate and the bottom wall; The jet plate has a plurality of first heat dissipation fins on the side facing away from the top wall; the jet plate includes a jet region, and the jet region is provided with jet holes that connect the first cavity and the second cavity.

13. A circuit board assembly, characterized in that, It includes a substrate and a chip as described in claim 12, wherein the substrate is mounted on the side of the chip on which the circuit structure is disposed.

14. An electronic device, characterized in that, It includes a housing and a circuit board assembly as described in claim 11 or 13, the circuit board assembly being disposed within the housing.

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