Printed circuit board

By embedding bridging components in the printed circuit board and using intermetallic compounds for electrical connection, the process stability problem caused by the large aspect ratio of the cavity is solved, resulting in cost reduction and thinner printed circuit boards.

CN122160996APending Publication Date: 2026-06-05SAMSUNG ELECTRO MECHANICS CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date
2025-10-21
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In the manufacturing of multi-chip packaged printed circuit boards, the large aspect ratio of the cavity makes it difficult to guarantee process stability and requires the use of expensive chip attachment film (DAF), which increases costs.

Method used

A printed circuit board structure was designed, including first and second substrate portions, bridging components, and conductive connection portions. By embedding bridging components within the substrate and using intermetallic compounds for electrical connection, cavity manufacturing is avoided, simplifying the process and reducing costs.

Benefits of technology

It improves process stability, reduces costs, and enhances heat dissipation characteristics and design freedom through the use of intermetallic compounds, thus promoting the thinning of printed circuit boards.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122160996A_ABST
    Figure CN122160996A_ABST
Patent Text Reader

Abstract

A printed circuit board is provided. The printed circuit board includes a first substrate portion including a pad including a first metal, the pad disposed in an upper portion of the first substrate portion; a second substrate portion disposed on the first substrate portion; a bridge disposed at least partially within the second substrate portion and including a bridge pad including a second metal, the bridge pad disposed in a lower portion of the bridge; and a conductive connection disposed between the pad and the bridge pad. The conductive connection includes a first conductive layer including a third metal; a second conductive layer disposed below the first conductive layer and including the first metal and the third metal; and a third conductive layer disposed above the first conductive layer and including the second metal and the third metal.
Need to check novelty before this filing date? Find Prior Art