A processing equipment for circuit board production

Abstract

The application discloses a kind of processing equipment for circuit board production, belong to printed wiring board manufacturing technical field.The device includes box, two spray heads, rotating mounting frame and multiple sets of mounting parts;Water circulation equipment is provided on the side of box;Two spray heads are symmetrically installed on the two sides of box, and each spray head is inclined downward in the box;Rotating mounting frame is rotatably installed in the middle position in the box, and is connected with external driving source;Multiple sets of mounting parts are evenly distributed and detachably installed on rotating mounting frame, and each mounting part can accommodate a circuit board.The present application sets up symmetrical inclined spray head and rotatable rotating mounting frame, so that the circuit board can reciprocate between the two spray heads when rotating with the rotating mounting frame, thereby realizing intermittent alternative flushing of both sides of the circuit board, completing double-sided cleaning without turning operation, greatly improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing, and more specifically to a processing equipment for circuit board production. Background Technology In the manufacturing process of printed circuit boards (PCBs), surface cleaning is a critical step in ensuring the quality of subsequent processes (such as electroplating, etching, and solder mask coating). If contaminants such as oxides, oil, and dust on the PCB surface are not thoroughly removed, it will directly lead to quality defects such as reduced plating adhesion, short circuits, or open circuits.

[0002] Currently, the industry primarily uses acid pickling solutions as the cleaning medium for cleaning the surface of circuit boards. Depending on the method of operation, it can be divided into two types: immersion cleaning and rinsing (spray cleaning). Long-term production practice has shown that immersion cleaning has significant drawbacks, including low reaction efficiency, high consumption of cleaning solutions, and difficulty in removing contaminants deep within holes and crevices. Therefore, in large-scale production, spray rinsing has become the mainstream technology.

[0003] However, existing spray rinsing equipment and methods still have the following significant technical shortcomings: Firstly, existing spraying equipment typically places circuit boards on a horizontally moving conveyor (such as conveyor rollers or a conveyor belt) during rinsing. The spraying mechanism (nozzles) is fixed above or to the side of the conveyor, with the spray direction perpendicular to the upper surface of the circuit board or at a certain angle. As the circuit board passes through the spraying area with the conveyor, only one side can be cleaned. If double-sided cleaning is required, one of two methods is usually needed: one is to manually or mechanically flip the circuit board after cleaning one side and send it back into the equipment for a second cleaning; the other is to set up two independent spraying mechanisms in the same equipment, but this requires complex modifications to the structure of the conveyor and often requires separate control. Regardless of the method used, there are problems such as lengthy processes, large equipment space occupation, and low production efficiency, making it difficult to meet the needs of continuous and efficient production.

[0004] Secondly, because the circuit board moves dynamically during transport, while the spraying mechanism remains relatively fixed, the time spent spraying and rinsing different areas of the circuit board surface varies. This is especially true for the edges and center of the board; even slight misalignment of the board on the conveyor belt can lead to uneven cleaning. In cases where both sides need separate cleaning, fluctuations in the time interval and process parameters between the two operations are more likely to cause inconsistencies in the cleanliness of the top and bottom surfaces, thus affecting the symmetry of subsequent processes (such as electroplating) and product quality.

[0005] Thirdly, in operation methods that employ horizontal conveying combined with single-sided or double-sided fixed spraying, to ensure that the circuit board does not shift when subjected to spray impact, it is usually necessary to rely on the conveying mechanism to apply clamping force to the board edges. For thin boards (such as those less than 0.3mm) or flexible circuit boards, the impact of high-pressure spraying can easily cause the board surface to warp, deform, or even jam or be damaged, limiting the applicability of the equipment.

[0006] In summary, existing circuit board surface cleaning technologies based on acid pickling spray rinsing still have significant shortcomings in terms of convenience of double-sided treatment, uniformity of cleaning, compact equipment structure, and adaptability to thin boards. Therefore, developing a new cleaning solution that can efficiently, stably, and uniformly achieve simultaneous double-sided cleaning of circuit boards, with a simple structure and wide applicability, has significant practical application value. Summary of the Invention

[0007] Based on this, the present invention aims to provide a processing equipment for circuit board production, so as to solve the technical problems of complex, inefficient and insufficient cleaning uniformity of double-sided cleaning of circuit boards in the prior art.

[0008] To achieve the above objectives, the present invention provides a processing equipment for circuit board production, including a housing, wherein a water circulation device for circulating pickling solution is provided on one side of the housing, and further comprising: Two nozzles are connected to the pickling solution supply equipment pipeline. The two nozzles are symmetrically installed on both sides of the box, and each nozzle is inclined downward inside the box. The rotating mounting bracket is rotatably installed in the middle position inside the housing and connected to an external drive source, enabling it to rotate under drive inside the housing. Multiple sets of mounting components for placing circuit boards are evenly distributed and detachably mounted on the rotating mounting frame. Each mounting component can hold one circuit board, and when the rotating mounting frame rotates, each mounting component can cause one circuit board to reciprocate between two nozzles, so that both sides of each circuit board can be intermittently rinsed by the pickling solution sprayed from the nozzles.

[0009] Furthermore, the rotating mounting bracket is provided with a plurality of slots for mounting the mounting components, each slot enabling a set of the mounting components to be mounted from one side of the rotating mounting bracket to its central position.

[0010] Furthermore, a positioning groove is provided on one side of the rotating mounting bracket, and a fixing plate is installed on the side of the rotating mounting bracket with the positioning groove. The fixing plate is provided with an alignment pin and a press-type positioning pin. When the fixing plate is installed, the alignment pin mates with the positioning groove to prevent positional displacement, and the press-type positioning pin is used to fix the fixing plate to one side of the rotating mounting bracket. The fixing plate can close multiple of the slots, so that the mounting component cannot be disassembled or assembled on the rotating mounting bracket.

[0011] Furthermore, the fixing plate is provided with a plurality of positioning rods, each of which is a threaded rod and is threadedly connected to the fixing plate. Each positioning rod can move left and right when it rotates on the fixing plate. A pad is provided at one end of each positioning rod located in the slot, and the positioning rod is in contact with the mounting component through the pad. A knob is provided on the other side of each positioning rod.

[0012] Furthermore, each set of mounting components includes a mounting block, a support plate, and a movable plate; the mounting block is mounted on the rotating mounting frame, the support plate is disposed on the mounting block, the support plate and the movable plate are spaced apart, and each side of the support plate and the movable plate is provided with a mounting groove for mounting a circuit board.

[0013] In one specific implementation, two mounting sleeves are symmetrically arranged on both sides of the support plate, and two mounting rods are symmetrically arranged on both sides of the movable plate. The two mounting rods are fixedly installed on the side of the movable plate near the support plate. Each mounting rod is slidably installed in one of the mounting sleeves. An elastic element is provided inside the mounting sleeve. When the mounting rod moves in the mounting sleeve, it squeezes the elastic element. When the mounting rod is not pulled by an external force, the elastic element drives the mounting rod to reset.

[0014] In another specific implementation, two sliding support rods are symmetrically arranged on both sides of the support plate, and the movable plate is slidably mounted on the two sliding support rods; each sliding support rod is provided with a positioning bolt, and each sliding support rod is provided with a threaded surface for threaded connection of the positioning bolt. Both positioning bolts are located on the side of the movable plate away from the support plate, and are used to abut and fix the movable plate after the movable plate moves to contact the circuit board.

[0015] Furthermore, the two nozzles are symmetrically arranged on the left and right sides of the housing, and the spraying direction of the two nozzles is towards the rotation center of the rotating mounting bracket.

[0016] Furthermore, the rotating mounting bracket is connected to an external drive source, which is used to drive the rotating mounting bracket to rotate.

[0017] In summary, the present invention has the following main beneficial effects: 1. This invention utilizes symmetrically installed inclined spray nozzles on both sides of the housing and a rotatable mounting frame in the middle of the housing. When the mounting frame rotates the mounting components and the circuit board on them, both sides of the circuit board can be sequentially and alternately rinsed by the pickling solution sprayed from the two spray nozzles. The circuit board can be cleaned on both sides during rotation, eliminating the need for manual flipping or complex flipping mechanisms. A single clamping operation completes the entire cleaning process, significantly shortening the workflow and improving production efficiency.

[0018] 2. In this invention, the circuit board continuously rotates with the rotating mounting bracket, and its surface is constantly changing relative to the fixed inclined spray head. The pickling solution impacts the board surface at varying angles, avoiding cleaning blind spots that may occur with fixed spraying. Simultaneously, the circuit board continuously receives alternating rinsing from the spray heads on both sides during rotation, ensuring that the spraying time and impact intensity received by each area of ​​the board surface are consistent, effectively guaranteeing cleaning uniformity.

[0019] 3. This invention integrates double-sided cleaning functionality into a single unit. Alternating double-sided rinsing is achieved by rotating the mounting bracket to move the circuit board between the two nozzles, eliminating the need for a separate flipping station or a vertical double-sided conveyor structure. The overall structure is more compact, the equipment occupies less space, and the manufacturing cost and maintenance difficulty are lower than existing solutions using flipping mechanisms or complex conveyor systems.

[0020] 4. This invention employs a detachable mounting component design, allowing for flexible replacement of suitable mounting components to accommodate circuit boards of different specifications and thicknesses. More importantly, this application provides two parallel mounting component structures: an elastic reset mounting component secures the circuit board through the clamping force of an elastic element, providing a uniform and gentle clamping force that avoids squeezing damage to thin boards; and a bolt-adjustable mounting component achieves stable fixation through mechanical locking, suitable for batch operations with relatively fixed dimensions. Both structures effectively prevent board warping and deformation caused by spray impact, and are particularly suitable for thin boards (e.g., less than 0.3mm) and flexible circuit boards.

[0021] 5. In this invention, the mounting component is inserted into the rotating mounting bracket via slots, and all slots are sealed at once by a fixing plate. An adjustable positioning rod is used to press and fix the mounting component, making assembly and disassembly simple and quick. Simultaneously, the fixing plate achieves precise positioning through the cooperation of the alignment pin and the positioning slot, ensuring the mounting component remains stable and does not wobble during high-speed rotation, effectively preventing circuit board detachment or uneven cleaning due to unstable fixing. Attached Figure Description

[0022] Figure 1 This is an overall structural diagram of the present invention; Figure 2 This is a schematic diagram of the assembly of the rotating mounting bracket and the mounting components in this invention; Figure 3 This is a schematic diagram showing the disassembly of the rotating mounting bracket and the fixing plate in this invention; Figure 4 This is a schematic diagram showing the disassembled rotating mounting frame, fixing plate, and mounting block in this invention; Figure 5 This is a schematic diagram of the overall structure of the first embodiment of the mounting component in this invention; Figure 6 This is a schematic diagram of the active state of the first embodiment of the mounting component in this invention; Figure 7 This is a schematic diagram of the overall structure of the second embodiment of the mounting component in this invention; Figure 8 This is a schematic diagram of the active state of the second embodiment of the mounting component in this invention.

[0023] In the diagram: 1. Housing; 2. Water circulation equipment; 3. Nozzle; 4. Rotating mounting bracket; 5. Mounting component; 6. Slot; 7. Positioning slot; 8. Fixing plate; 9. Alignment pin; 10. Press-type positioning pin; 11. Positioning rod; 12. Pad; 13. Knob; 14. Mounting block; 15. Support plate; 16. Movable plate; 17. Mounting slot; 18. Mounting sleeve; 19. Mounting rod; 20. Elastic element; 21. Sliding support rod; 22. Positioning bolt. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0025] The embodiments of the present invention will now be described. Example

[0026] like Figures 1 to 8 As shown, this embodiment provides a processing equipment for circuit board production, including a housing 1, two nozzles 3, a rotating mounting frame 4, and multiple sets of mounting components 5.

[0027] The housing 1 is a sealed structure, forming a clean chamber inside. A water circulation device 2 is installed on one side of the housing 1. This water circulation device 2 is connected to the bottom and top (or side) of the housing 1 via pipelines. It is used to collect the pickling solution at the bottom of the housing 1, and after filtration and temperature adjustment, it is circulated to the nozzle 3 to realize the recycling of the pickling solution. The specific structure of the water circulation device 2 (including pump body, filter, heater, liquid level sensor, etc.) adopts mature existing technology in this field, and will not be described in detail here.

[0028] The pickling solution supply equipment (not shown in the figure) is connected to two nozzles 3 via pipelines. This equipment stores and supplies fresh pickling solution and typically includes components such as a storage tank, a transfer pump, and a flow control valve; this part also utilizes existing technology. During operation, fresh pickling solution can be added to the circulation system as needed to maintain a stable solution concentration.

[0029] Two nozzles 3 are symmetrically installed on the left and right sides of the housing 1, and each nozzle 3 is inclined downwards inside the housing 1. Specifically, the spray direction of both nozzles 3 is towards the rotation center of the rotating mounting bracket 4, that is, towards the central area of ​​the housing 1. This symmetrical and inclined downward arrangement allows the pickling solution sprayed by the nozzles 3 to impact the surface of the circuit board at a certain angle, ensuring sufficient impact force to remove contaminants while avoiding the splashing of the solution that may occur with vertical spraying.

[0030] The rotating mounting bracket 4 is rotatably mounted in the middle position inside the housing 1. The central shaft of the rotating mounting bracket 4 is mounted on the side wall of the housing 1 via a bearing seat, with one end extending out of the housing 1 and connected to an external drive source. The external drive source drives the rotating mounting bracket 4 to rotate within the housing 1. In this embodiment, the external drive source can be a servo motor or a stepper motor, directly connected to the central shaft of the rotating mounting bracket 4 via a coupling to precisely control the rotation speed and angle. The start / stop and speed control of the drive source are all centrally managed by a control device.

[0031] To achieve automated operation of the device, this embodiment also includes a central control unit (such as a PLC controller or a microcontroller control board) and several sensors. Specifically: Position sensor: Installed on the rotation path of the rotating mounting bracket 4, used to detect the rotation position of the rotating mounting bracket 4. When the sensor detects that the mounting part 5 has rotated to the position corresponding to the nozzle 3, the central control equipment can control the nozzle 3 to start spraying; when the mounting part 5 rotates to a non-spraying area, the nozzle 3 can be controlled to pause or reduce the spray flow to achieve intermittent spraying and save on pesticide consumption.

[0032] Liquid level sensor: installed at the bottom of the tank 1 and in the storage tank of the water circulation equipment 2, used to monitor the liquid level of the pickling solution in real time. When the liquid level is too low, the central control equipment controls the pickling solution supply equipment to automatically replenish fresh solution.

[0033] Temperature sensor: installed inside the housing 1 or in the pipeline of the water circulation equipment 2, used to monitor the temperature of the pickling solution, and control the heater in the water circulation equipment 2 through the central control equipment to keep the pickling solution within the optimal reaction temperature range.

[0034] Pressure sensor: Installed on the liquid inlet pipe of nozzle 3, used to monitor the spray pressure and ensure the consistency of the spray effect.

[0035] The aforementioned central control equipment, various sensors, and corresponding control logic (such as automatic liquid level replenishment, automatic temperature adjustment, intermittent spray control, etc.) all adopt mature automation control schemes in the existing technology. Those skilled in the art can select appropriate hardware models and control programs according to actual needs, and no detailed limitations are made here.

[0036] like Figures 2 to 4 As shown, the rotating mounting bracket 4 is provided with multiple slots 6 for mounting the mounting component 5. The slots 6 are evenly distributed around the circumference of the rotating mounting bracket 4, and each slot 6 opens from one side of the rotating mounting bracket 4, allowing the mounting component 5 to be inserted from that side to the middle position of the rotating mounting bracket 4. The internal dimensions of the slots 6 are adapted to the mounting block 14 of the mounting component 5 to ensure that the mounting component 5 has initial positioning after insertion.

[0037] A positioning groove 7 is provided on one side of the rotating mounting bracket 4 (i.e., the side with the opening of the slot 6), and a fixing plate 8 is installed on this side. Figure 3 As shown, the fixing plate 8 is equipped with an alignment pin 9 and a press-type positioning pin 10. When installing the fixing plate 8, first align the alignment pin 9 with the positioning groove 7 on the rotating mounting bracket 4 to ensure that the position of the fixing plate 8 is accurate; then, use the press-type positioning pin 10 to lock and fix the fixing plate 8 to one side of the rotating mounting bracket 4. After the fixing plate 8 is installed, its inner surface exactly closes the opening ends of multiple slots 6, thereby confining the mounting part 5 within the slots 6 and preventing it from coming out during rotation.

[0038] The fixed plate 8 is also equipped with multiple positioning rods 11, the number of which corresponds to the number of slots 6. Each positioning rod 11 is a threaded rod, threadedly connected to the fixed plate 8. One end of each positioning rod 11 within the slot 6 is equipped with a pad 12, and the other end is equipped with a knob 13. When the operator rotates the positioning rod 11 using the knob 13, the positioning rod 11 can move left and right on the fixed plate 8, causing the pad 12 to abut against the mounting block 14 of the mounting component 5. By adjusting the screw depth of the positioning rod 11, the mounting component 5 can be further pressed and fixed within the slot 6, eliminating installation gaps and ensuring that the mounting component 5 does not wobble during high-speed rotation. Furthermore, because the positioning rods 11 are adjustable, this device can adapt to mounting components 5 with different manufacturing tolerances or specifications, exhibiting good versatility.

[0039] like Figures 5-6 The mounting structure shown is a first embodiment. like Figure 4As shown, in this embodiment, the mounting component 5 adopts a resilient reset structure. Each set of mounting components 5 includes a mounting block 14, a support plate 15, and a movable plate 16. The mounting block 14 is used to insert into the slot 6 of the rotating mounting bracket 4, so as to realize the overall detachable installation of the mounting component 5. The support plate 15 is fixedly mounted on the mounting block 14, and the movable plate 16 is spaced apart from the support plate 15. Both of them have mounting slots 17 for mounting circuit boards on their opposite sides.

[0040] Two mounting sleeves 18 are symmetrically arranged on both sides of the support plate 15, and two mounting rods 19 are symmetrically arranged on both sides of the movable plate 16. The two mounting rods 19 are fixedly installed on the side of the movable plate 16 near the support plate 15. Each mounting rod 19 is slidably installed in a mounting sleeve 18, and an elastic element 20 (such as a compression spring) is provided inside the mounting sleeve 18. When it is necessary to install the circuit board, the operator pulls the movable plate 16 outward, so that the movable plate 16 is away from the support plate 15. The mounting rods 19 move outward in the mounting sleeves 18 and squeeze the elastic element 20. Then, the circuit board is placed between the support plate 15 and the movable plate 16, so that the two sides of the circuit board are respectively inserted into the mounting grooves 17 of the support plate 15 and the movable plate 16. After the movable plate 16 is released, the elastic element 20 returns to its original position, driving the mounting rods 19 to move inward, thereby making the movable plate 16 clamp the circuit board. This structure uses the clamping force of the elastic element 20 to fix the circuit board, which is convenient to install and remove, and the clamping force is uniform. It is suitable for circuit boards of various thicknesses, and has a good protective effect on thin boards.

[0041] like Figures 7 to 8 The mounting structure shown is the second embodiment. As another parallel implementation method, such as Figure 5 As shown, in this embodiment, the mounting component 5 adopts a bolt-adjustable structure. Unlike the first embodiment, two sliding support rods 21 are symmetrically arranged on both sides of the support plate 15, and the movable plate 16 is slidably mounted on the two sliding support rods 21. Each sliding support rod 21 has a threaded surface and is fitted with a positioning bolt 22, both of which are located on the side of the movable plate 16 away from the support plate 15.

[0042] When installing the circuit board, the operator places the circuit board between the movable plate 16 and the support plate 15, then moves the movable plate 16 to slide along the sliding support rod 21 until the movable plate 16 and the support plate 15 clamp the circuit board (the two sides of the circuit board are engaged in the mounting groove 17). Subsequently, the two positioning bolts 22 are rotated, moving inward along the threaded surface of the sliding support rod 21 until the ends of the positioning bolts 22 abut against the side of the movable plate 16, thereby locking the movable plate 16 in its current position. This structure achieves circuit board fixation through mechanical locking, providing stable and reliable clamping force, and is suitable for scenarios with relatively fixed dimensions and requiring batch operations.

[0043] The working process of this device will be explained below in conjunction with the above structure: Board mounting: Select the appropriate mounting component 5 (elastic reset type or bolt adjustment type) according to the specifications of the circuit board. Install the circuit board onto the mounting component 5, ensuring that the two sides of the circuit board are engaged in the mounting grooves 17 of the support plate 15 and the movable plate 16 and are reliably clamped.

[0044] Installation: Insert the mounting component 5 with the circuit board installed into the slot 6 from one side of the rotating mounting bracket 4 through the mounting block 14 until the mounting block 14 is in place. After all mounting components 5 (4, 6, 8 or more sets can be set depending on the number of slots 6 on the rotating mounting bracket 4) are installed, install the fixing plate 8: First, accurately position it by aligning it with the positioning slot 7 using the alignment pin 9, and then fix the fixing plate 8 to the rotating mounting bracket 4 using the press-type positioning pin 10. Subsequently, rotate the knob 13 of each positioning rod 11 in sequence to make the pad 12 abut against and press the mounting block 14, ensuring that the mounting component 5 does not loosen during rotation.

[0045] Start-up: Start the water circulation equipment 2 and the pickling solution supply equipment to circulate the pickling solution and maintain a suitable temperature and pressure. Start the external drive source to drive the rotating mounting bracket 4 to rotate at a uniform speed (e.g., 5-20 rpm, which can be adjusted according to actual process requirements). The central control equipment controls the start and stop of the nozzle 3 according to the preset program to achieve intermittent spraying—for example, when the mounting bracket 5 rotates to the spraying area directly opposite the nozzle 3, the spraying starts and stops after it passes the spraying area, in order to save the solution.

[0046] Cleaning: As the rotating mounting bracket 4 rotates, the circuit boards on each mounting piece 5 continuously move back and forth between the two nozzles 3. The pickling solution sprayed by the left nozzle 3 washes the left side (front) of the circuit board, while the pickling solution sprayed by the right nozzle 3 washes the right side (back) of the circuit board, thus achieving synchronous, alternating, and uniform cleaning of both sides of the circuit board. Because the circuit board rotates continuously, the pickling solution can impact the board surface at varying angles, effectively avoiding cleaning dead corners, and providing excellent cleaning results, especially for holes and gaps on the circuit board.

[0047] Completion: After cleaning is completed (cleaning time can be set according to process requirements, such as 3-10 minutes), the central control equipment stops the drive source from rotating, shuts down the nozzle 3 and the water circulation equipment 2. After the rotating mounting bracket 4 has completely stopped, the operator releases the positioning rod 11 in sequence, removes the fixing plate 8, then removes the mounting part 5 from the slot 6, and finally removes the cleaned circuit board from the mounting part 5 to proceed to the next process.

[0048] It should be noted that the water circulation equipment 2, pickling solution supply equipment, external drive source (motor and its controller), central control equipment (PLC controller), various sensors (position sensor, liquid level sensor, temperature sensor, pressure sensor), and corresponding control logic and connecting pipelines used in this device are all mature existing technologies in the field. The specific structural selection, installation method, and control program of the above auxiliary systems can be selected and set by those skilled in the art according to actual production needs, without requiring creative effort. The innovation of this invention lies in the improvement of the mechanical structure, namely, the combination of symmetrical tilting nozzles, rotatable mounting brackets, and detachable mounting parts, which realizes the function of synchronous cleaning of both sides of the circuit board, solving the technical problems of low efficiency and uneven cleaning existing in the prior art.

[0049] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A processing equipment for circuit board production, comprising a housing (1), wherein a water circulation device (2) for circulating pickling solution is provided on one side of the housing (1), characterized in that, Also includes: Two nozzles (3) are connected to the pickling solution supply equipment pipeline. The two nozzles (3) are symmetrically installed on both sides of the box (1), and each nozzle (3) is inclined downward inside the box (1). The rotating mounting bracket (4) is rotatably installed in the middle position inside the housing (1) and connected to an external drive source, so that it can be driven to rotate inside the housing (1); Multiple sets of mounting components (5) for placing circuit boards are evenly distributed and detachably mounted on the rotating mounting frame (4). Each mounting component (5) can hold a circuit board, and when the rotating mounting frame (4) rotates, each mounting component (5) can make a circuit board move back and forth between two nozzles (3), so that both sides of each circuit board can be intermittently rinsed by the pickling solution sprayed by the nozzles (3).

2. The processing equipment for circuit board production according to claim 1, characterized in that, The rotating mounting bracket (4) is provided with a plurality of slots (6) for installing the mounting components (5), and each slot (6) can allow a set of mounting components (5) to be installed from one side of the rotating mounting bracket (4) to its middle position.

3. The processing equipment for circuit board production according to claim 2, characterized in that, The rotating mounting bracket (4) has a positioning groove (7) on one side, and a fixing plate (8) is installed on the side of the rotating mounting bracket (4) with the positioning groove (7). The fixing plate (8) is provided with an alignment pin (9) and a press-type positioning pin (10). When the fixing plate (8) is installed, the alignment pin (9) is engaged with the positioning groove (7) to prevent positional deviation, and the pressing positioning pin (10) is used to fix the fixing plate (8) on one side of the rotating mounting bracket (4). The fixing plate (8) can close the multiple slots (6), so that the mounting part (5) cannot be disassembled or assembled on the rotating mounting bracket (4).

4. The processing equipment for circuit board production according to claim 3, characterized in that, The fixing plate (8) is provided with a plurality of positioning rods (11), each of the positioning rods (11) is a threaded rod, each of the positioning rods (11) is threadedly connected to the fixing plate (8), and each of the positioning rods (11) can move left and right when rotating on the fixing plate (8); Each of the positioning rods (11) has a pad (12) at one end located in the slot (6), and the positioning rod (11) is connected to the mounting part (5) through the pad (12). Each of the positioning rods (11) has a knob (13) on the other side.

5. The processing equipment for circuit board production according to claim 1, characterized in that, Each set of mounting components (5) includes a mounting block (14), a support plate (15), and a movable plate (16); The mounting block (14) is mounted on the rotating mounting frame (4), and the support plate (15) is disposed on the mounting block (14). The support plate (15) and the movable plate (16) are spaced apart, and the support plate (15) and the movable plate (16) are each provided with a mounting groove (17) for mounting the circuit board on the opposite side.

6. The processing equipment for circuit board production according to claim 5, characterized in that, Two mounting sleeves (18) are symmetrically arranged on both sides of the support plate (15), and two mounting rods (19) are symmetrically arranged on both sides of the movable plate (16). The two mounting rods (19) are fixedly installed on the side of the movable plate (16) near the support plate (15). Each of the mounting rods (19) is slidably mounted in a mounting sleeve (18), and an elastic element (20) is provided inside the mounting sleeve (18). When the mounting rod (19) moves in the mounting sleeve (18), it squeezes the elastic element (20), and when the mounting rod (19) is not pulled by an external force, the elastic element (20) drives the mounting rod (19) to reset.

7. The processing equipment for circuit board production according to claim 5, characterized in that, Two sliding support rods (21) are symmetrically arranged on both sides of the support plate (15), and the movable plate (16) is slidably mounted on the two sliding support rods (21); Each of the sliding support rods (21) is provided with a positioning bolt (22), and each of the sliding support rods (21) is provided with a threaded surface for threaded connection of the positioning bolt (22). The two positioning bolts (22) are located on the side of the movable plate (16) away from the support plate (15), and are used to abut and fix the movable plate (16) after the movable plate (16) moves to contact the circuit board.

8. The processing equipment for circuit board production according to claim 1, characterized in that, The two nozzles (3) are symmetrically arranged on the left and right sides of the housing (1), and the spraying direction of the two nozzles (3) is towards the rotation center of the rotating mounting bracket (4).

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