A flip device for semiconductor precision component manufacturing

Abstract

The present application relates to the field of semiconductor element processing, specifically to a kind of turnover device for semiconductor precision component manufacturing, solve the problem of being convenient to element clamping, overturning and operation;The present application includes the clamping piece of left and right sides, the supporting plate for placing component board is arranged between the two clamping pieces, the push rod is connected to the clamping piece, the push rod is provided with the first screw thread telescopic piece along the left-right direction towards the outside and is provided with ball and elastic limiting piece A, and is provided with push plate at end portion, further including control mechanism for controlling the left-right movement of push plate, the front side of supporting plate is provided with limiting plate;When working, component board is placed on supporting plate, by controlling two push plates to be close to each other, using two clamping pieces to be close to each other and clamping component board, as two push plates continue to be close to each other, make the first screw thread telescopic piece overcome elastic limiting piece A and shorten, and drive push rod, clamping piece and component board to overturn forward, make clamping piece contact limiting with limiting plate;The present application is convenient to operate, can avoid falling off when operating component board.

Description

Technical Field

[0001] This invention relates to the field of semiconductor component processing technology, and more specifically to a flipping device for manufacturing precision semiconductor components. Background Technology

[0002] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, and amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium, or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other equipment. To distinguish them from integrated circuits, they are sometimes called discrete devices. Various types of crystal diodes with different functions and uses have been developed by using different semiconductor materials, different processes, and geometric structures. The frequency range of crystal diodes can range from low frequency, high frequency, microwave, millimeter wave, infrared to light wave.

[0003] Semiconductor components, especially component boards, require flipping devices for rotation during processing and production. Research indicates that existing flipping devices often combine clamping and rotating mechanisms. For example, Chinese utility model patent CN212934588U discloses a flipping device for manufacturing precision semiconductor components. This device includes a worktable with a first cylinder fixedly mounted on its top. A clamping mechanism is welded to the extended end of the first cylinder. A flipping mechanism is fixedly mounted on the bottom left side of the clamping mechanism. The worktable includes a cabinet with a platform fixedly mounted on its top. A support frame is welded to the top of the platform. The clamping mechanism includes a fixed plate. This design, by activating a second cylinder, moves the clamping plates inside two moving columns closer together, clamping the semiconductor component located at the center. Then, the rotation of a motor, through the engagement of a drive gear and a driven gear, drives a second rotating shaft, thereby flipping the clamping plates. This improves the clamping effect on the semiconductor component, preventing it from easily falling off during the flipping process, thus enhancing the practicality of the flipping mechanism.

[0004] In actual operation, the device clamps the component with an inner clamping plate and then controls its rotation to achieve flipping. Initially, the component needs to be held by hand during clamping, which is quite troublesome. In addition, the mechanism above the component will block the operation, making it inconvenient to operate the component.

[0005] Therefore, the present invention provides a flipping device for manufacturing precision semiconductor components to solve the above-mentioned problems. Summary of the Invention

[0006] In view of the above situation and to overcome the defects of the prior art, the present invention provides a flipping device for manufacturing precision semiconductor components. The problem to be solved is: to provide a flipping device for manufacturing precision semiconductor components that facilitates clamping, flipping and operation of components.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A flipping device for manufacturing precision semiconductor components includes clamps on the left and right sides, a tray for placing component boards between the two clamps, push rods connected to the clamps, a first threaded telescopic member in the left and right direction on the push rod facing outward and provided with a ball and an elastic limiting member A, and a push plate at the end, and also includes a control mechanism for controlling the left and right movement of the push plate, and a limiting plate on the front side of the tray. During operation, the component board is placed on the tray. By controlling the two push plates to move closer to each other, the two clamps move closer to each other and clamp the component board. As the two push plates continue to move closer to each other, the first threaded telescopic component overcomes the elastic limit component A and shortens, which drives the push rod, clamps and component board to flip forward, so that the clamps contact the limit plate and limit the movement.

[0008] Preferably, the first threaded telescopic component includes a first lead screw and a first sleeve rod, the first lead screw and the first sleeve rod are threadedly connected and provided with ball bearings, the first lead screw is fixedly connected to the push rod, and the first sleeve rod is fixedly connected to the push plate.

[0009] Preferably, the elastic limiting member A includes an annular member rotatably mounted on the push rod, the annular member being coaxial with the first threaded telescopic member, and a spring being provided between the annular member and the push plate.

[0010] Preferably, the control mechanism includes a sliding groove along the left and right direction, a push plate connected to a sliding rod, the sliding rod (71) being slidably disposed on the sliding groove, the sliding rod being provided with a rack along the left and right direction, the two racks being meshed together to connect to a gear, the axis of the gear being along the vertical direction, and the gear being connected to a drive motor.

[0011] Preferably, the drive motor is located below the gear, and a second threaded telescopic component is coaxially connected above the gear and is provided with ball bearings. The second threaded telescopic component includes a second lead screw and a second sleeve rod. The second lead screw and the second sleeve rod are threadedly connected and provided with ball bearings. The second lead screw is fixedly connected to the gear. The second sleeve rod moves in a vertical direction. A top rod is provided at the top of the second sleeve rod. The support plate is located above the top rod. The component also includes a bracket and a positioning rod. The support plate is rotatably mounted on the bracket, and the positioning rod is located below the support plate. In its natural state, the pallet is supported by a positioning rod. When the two clamps move away from each other, they cause the second threaded telescopic member to extend, which in turn causes the push rod to move upward. The push rod pushes the pallet to rotate forward, causing the pallet to tilt downward from front to back.

[0012] Preferably, an elastic limiting member B is provided between the pallet and the positioning rod.

[0013] Preferably, the bottom of the pallet is provided with a limiting groove, and the top rod is located in the limiting groove.

[0014] Preferably, the clamp is C-shaped.

[0015] Preferably, when the clamping member contacts the limiting plate, the limiting member is in a horizontal state. Preferably, it also includes a base plate.

[0016] The beneficial effects of this invention are as follows: 1. When fixing the component board and the clamping parts, this invention only requires placing the component board on the support plate. The operation is simple and requires low skill. Then, by controlling the two push plates to move closer to each other, the two clamping parts can be brought closer together and clamp the component board. After clamping, by continuing to control the two push plates to move closer to each other, the two clamping parts will cause the component board to rotate. When the clamping parts rotate to contact the limiting plate, that is, to rotate to the maximum angle, the component board is not obstructed before and after rotation, which facilitates operation. After the operation on the component board is completed, the two push plates are moved away from each other and reset.

[0017] 2. In this invention, the component board can be supported by a support plate before flipping and by a limiting plate after flipping, which can prevent it from falling off during operation.

[0018] 3. In this invention, only the movement of two push plates needs to be controlled throughout the entire process. The overall structure is simple and ingenious, and easy to control.

[0019] 4. In this invention, the component board is clamped from both sides by two clamps, which can clamp according to the specifications of the component board and can be used for flipping operation of component boards of different specifications. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention from another angle; Figure 3 This is a schematic diagram showing the positional relationship between the limiting groove and the push rod in this invention; Figure 4 for Figure 2 Enlarged view of point A in the middle; Figure 5 This is a schematic diagram of the drive motor driving the push rod 15 to move in this invention; Figure 6 This is a schematic diagram of the present invention when clamping the component plate; Figure 7 This is a schematic diagram showing the component board after being flipped in this invention; Figure 8 This is a schematic diagram of the component board being installed in this invention.

[0021] In the diagram: 1. Base plate, 2. Clamping piece, 3. Support plate, 4. Push rod, 5. Push plate, 6. Rack, 7. Slide groove, 71. Slide rod, 8. Drive motor, 9. Gear, 10. Second sleeve rod, 11. Second lead screw, 12. Positioning rod, 13. Bracket, 14. Limiting plate, 15. Top rod, 16. Limiting groove, 17. Ring part, 18. Spring, 19. First lead screw, 20. First sleeve rod. Detailed Implementation

[0022] The following will refer to the attached reference. Figures 1 to 8 The various embodiments of the present invention will be described in detail. Those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. A flipping device for manufacturing precision semiconductor components, as shown in the attached figure. Figure 1 As shown, it includes clamps 2 on the left and right sides. By moving the two clamps 2 closer to each other, the component board can be clamped. A tray 3 for placing the component board is provided between the two clamps 2. The tray 3 is used to place the component board. In actual use, the component board can be placed on the tray 3 first, and then the two clamps 2 can be controlled to move closer to each other until the component board is clamped.

[0023] As attached Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, the clamp 2 is connected to the push rod 4. The push rod 4 is provided with a first threaded telescopic component in the left-right direction facing outward, and is provided with a ball and an elastic limiting component A. That is, in the natural state, the first threaded telescopic component maintains a certain length under the action of the elastic limiting component A. When the first thread is extended or compressed, the two parts of the first threaded telescopic component rotate relative to each other under the action of the thread and the ball. The end of the first threaded telescopic component is provided with a push plate 5. The movement of the first threaded telescopic component and the clamp 2 is controlled by the push plate 5. It also includes a control mechanism for controlling the left and right movement of the push plate 5. A limiting plate 14 is provided on the front side of the support plate 3.

[0024] During operation, the component board is placed on the support plate 3. By controlling the two push plates 5 to move closer to each other, the two clamps 2 are brought closer together to secure the component board. The clamped state can be referred to the attached document. Figure 6As shown, after clamping, the component plate can be operated. As the two push plates 5 continue to move closer to each other, since the distance between the two clamps 2 remains unchanged and the part of the first threaded telescopic member connected to the push plate 5 does not rotate, the first threaded telescopic member shortens against the elastic limit member A. At the same time as shortening, the part of the first threaded telescopic member connected to the push rod 4 rotates, thereby driving the push rod 4, clamps 2, and component plate to flip forward, so that clamps 2 contact and limit the limit plate 14, realizing the flipping of the component plate and keeping the component plate stable. The state after flipping can be seen in the attached figure. Figure 7 As shown, this allows for operation on the flipped component board.

[0025] In this embodiment, when fixing the component board to the clamp 2, it is only necessary to place the component board on the support plate 3. The operation is simple, the requirements are low, and the work efficiency can be improved. The component board is not obstructed before and after rotation, making it easy to operate. After the operation of the component board is completed, the two push plates 5 are moved away and reset, and then the component board can be removed. In this embodiment, the support plate 3 can be used for auxiliary support before flipping, and the limiting plate 14 can be used for auxiliary support after flipping, which can prevent the component board from falling off during operation and ensure stable operation. In this embodiment, only the movement of the two push plates 5 needs to be controlled throughout the process, which is convenient for setting up a control mechanism. The overall structure is simple and ingenious and easy to control. In this embodiment, the component board is clamped from both sides by the two clamps 2, which can clamp according to the specifications of the component board. It can be used for flipping operation of component boards of different specifications, making it flexible and practical.

[0026] As attached Figure 2 , Figure 4 As shown, in this embodiment, the first threaded telescopic component includes a first lead screw 19 and a first sleeve rod 20. The first lead screw 19 and the first sleeve rod 20 are threadedly connected and equipped with ball bearings. When the first sleeve rod 20 and the first lead screw 19 approach or move away from each other, they will also rotate relative to each other. The first lead screw 19 is fixedly connected to the push rod 4, and the first sleeve rod 20 is fixedly connected to the push plate 5. The first sleeve rod 20 does not rotate, so that the first lead screw 19 can drive the push rod 4, the clamp 2 and the component plate to flip.

[0027] As attached Figure 4 As shown, in this embodiment, the elastic limiting member A includes an annular member 17 rotatably mounted on the push rod 4. The annular member 17 is coaxial with the first threaded telescopic member. A spring 18 is provided between the annular member 17 and the push plate 5. When the push rod 4 rotates, the annular member 17 can be relatively stable, that is, there will be no large angle change between it and the push plate 5, which can prevent the spring 18 from twisting and allow the spring 18 to extend and retract normally.

[0028] As attached Figure 1 , Figure 2 , Figure 5As shown, in this embodiment, the control mechanism includes a slide groove 7 along the left and right direction. In this embodiment, two slide grooves 7 are provided. The push plate 5 is connected to a slide rod 71. The slide rod 71 is slidably disposed on the corresponding slide groove 7 to realize the movement of the slide rod 71. The slide rod 71 is provided with a rack 6 along the left and right direction. The two racks 6 are meshed with a gear 9. The axis of the gear 9 is along the vertical direction. By rotating the gear 9, the two racks 6 are controlled to move closer or further away from each other, thereby driving the two push plates 5 to move closer or further away from each other. The gear 9 is connected to a drive motor 8. By precisely controlling the rotation of the gear 9 through the drive motor 8, the flipping of the control element plate is controlled.

[0029] Additionally, it should be noted that when precisely controlled by the drive motor 8, the specifications of the component board to be processed must be kept consistent, so that the motion parameters of the drive motor 8 can be accurately set. If the device needs to be more flexible to be applicable to component boards of various specifications, certain sensors, such as pressure sensors, can be set on the clamp 2. When contact with the limit plate 14 is detected, the drive motor 8 will stop moving without adjusting the parameters of the drive motor 8, thus achieving flexible use.

[0030] As attached Figure 2 , Figure 3 , Figure 5 , Figure 8 As shown, in this embodiment, the drive motor 8 is located below the gear 9. A second threaded telescopic component is coaxially connected above the gear 9 and is provided with ball bearings. The second threaded telescopic component includes a second lead screw 11 and a second sleeve rod 10. The second lead screw 11 and the second sleeve rod 10 are threadedly connected and are provided with ball bearings. That is, the first threaded telescopic component has the same structural principle as the first threaded telescopic component. The second lead screw 11 is fixedly connected to the gear 9. The second sleeve rod 10 moves in the vertical direction, that is, the second lead screw 11 can rotate with the gear 9. The second sleeve rod 10 moves up and down without rotating. A top rod 15 is provided at the top of the second sleeve rod 10. The top rod 15 can move up and down with the second sleeve rod 10. The support plate 3 is located above the top rod 15. It also includes a bracket 13 and a positioning rod 12. The support plate 3 is rotatably mounted on the bracket 13. Specifically, the rotating shaft is located near the rear side of the support plate 3, and the positioning rod 12 is located below the support plate 3.

[0031] In its natural state, the support plate 3 is supported by the positioning rod 12. When the two clamps 2 move away from each other, they cause the second threaded telescopic member to extend, which in turn causes the push rod 15 to move upward. The push rod 15 pushes the support plate 3 to rotate forward, causing the support plate 3 to tilt downward from front to back. The tilted state is shown in the attached figure. Figure 8As shown, in actual use, initially, the push rod 15 does not contact the support plate 3. At this time, the component board is placed on the support plate 3, and the two clamps 2 are controlled to move closer to each other to clamp the component board. During this period, the push rod 15 moves closer to the support plate 3 and does not act on the support plate 3. When the support plate 3 is reset, as the two clamps 2 move away from each other, the push rod 15 gradually moves closer to the support plate 3 and finally contacts the support plate 3, pushing the support plate 3 so that the support plate 3 can be in an inclined state, and the component board slides down, realizing automatic unloading, thereby improving work efficiency.

[0032] Additionally, it should be noted that in practical use, a conveying mechanism can be set at the corresponding position on the rear side of the device so that the processed component board falls onto the transmission mechanism for direct conveying.

[0033] Additionally, it should be noted that in this embodiment, an elastic limiting member B (not shown in the figure) is provided between the tray 3 and the positioning rod 12. Specifically, the elastic limiting member B can be an elastic rope, in which the tray 3 is stable in its natural state, or a torsion spring can be provided between the tray 3 and the bracket 13.

[0034] As attached Figure 2 , Figure 3 , Figure 4 As shown, in this embodiment, the bottom of the support plate 3 is provided with a limiting groove 16, which is composed of two plates. The top rod 15 is located in the limiting groove 16, that is, between the two plates. Specifically, the top rod 15 can contact the two plates through ball bearings, so that the top rod 15 will not rotate, and can reduce the friction between the two plates when lifting and lowering.

[0035] In addition, in this embodiment, the clamp 2 is C-shaped. When the component board is clamped by the clamp 2, even if it becomes loose during the flipping operation, the component board will not easily fall off.

[0036] In addition, in this embodiment, when the clamp 2 contacts the limiting plate 14, the clamp 2 is in a horizontal state, that is, the component board is in a horizontal state, and the component board is rotated at an angle of 180°, which conforms to the user habit and makes the operation more convenient. In addition, the limiting plate 14.

[0037] Additionally, it should be noted that this embodiment also includes a base plate 1, which is used to fix the entire device. The slide 7, drive motor 8, positioning rod 12, bracket 13 and limiting plate 14 are all mounted on the base plate 1.

[0038] In addition, in specific use, this embodiment can also be used with a certain operating mechanism. First, the device is fixed in a specific position by the base plate 1, and the drive motor 8 is rotated in both forward and reverse directions. When rotating forward to the maximum angle, the clamp 2 contacts the limiting plate 14. When rotating in reverse to the maximum angle, the support plate 3 tilts. In the initial state, the support plate 3 is horizontal. The support plate 3 cycles between the initial state, the maximum forward rotation angle, and the reverse rotation angle, and stays in each of the three states for a period of time. Thus, the component board can be manually placed in the initial state. Then, the operating mechanism automatically operates on the component board. After the operation is completed, the component board is flipped over, and the operating mechanism continues to operate on the component board. After the operation is completed, the component board is automatically transferred to the conveying mechanism. The overall working process has a high degree of automation.

[0039] It should be noted that in the description of this invention, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] The technical solution of the present invention has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A flipping device for manufacturing precision semiconductor components, comprising clamps (2) on the left and right sides, characterized in that, A tray (3) for placing component boards is provided between the two clamps (2). The clamps (2) are connected to a push rod (4). The push rod (4) is provided with a first threaded telescopic component in the left and right direction facing outward, and is provided with a ball and an elastic limiting component A. A push plate (5) is provided at the end. It also includes a control mechanism for controlling the left and right movement of the push plate (5). A limiting plate (14) is provided on the front side of the tray (3). During operation, the component board is placed on the support plate (3). By controlling the two push plates (5) to move closer to each other, the two clamps (2) are used to move closer to each other and clamp the component board. As the two push plates (5) continue to move closer to each other, the first threaded telescopic component overcomes the elastic limit component A and shortens, and drives the push rod (4), clamp (2) and component board to flip forward, so that the clamp (2) contacts and limits the limit plate (14).

2. The flipping device for manufacturing precision semiconductor components according to claim 1, characterized in that, The first threaded telescopic component includes a first lead screw (19) and a first sleeve rod (20). The first lead screw (19) and the first sleeve rod (20) are threadedly connected and equipped with ball bearings. The first lead screw (19) is fixedly connected to the push rod (4), and the first sleeve rod (20) is fixedly connected to the push plate (5).

3. The flipping device for manufacturing precision semiconductor components according to claim 1, characterized in that, The elastic limiting member A includes an annular member (17) rotatably mounted on the push rod (4), the annular member (17) being coaxial with the first threaded telescopic member, and a spring (18) being provided between the annular member (17) and the push plate (5).

4. The flipping device for manufacturing precision semiconductor components according to claim 1, characterized in that, The control mechanism includes a slide groove (7) along the left and right direction, a push plate (5) connected to a slide rod (71), the slide rod (71) is slidably disposed on the slide groove (7), the slide rod (71) is provided with a rack (6) along the left and right direction, the two racks (6) are meshed together to connect to a gear (9), the axis of the gear (9) is along the vertical direction, and the gear (9) is connected to a drive motor (8).

5. The flipping device for manufacturing precision semiconductor components according to claim 4, characterized in that, The drive motor (8) is located below the gear (9). A second threaded telescopic component is coaxially connected above the gear (9) and is provided with ball bearings. The second threaded telescopic component includes a second lead screw (11) and a second sleeve rod (10). The second lead screw (11) is threadedly connected to the second sleeve rod (10) and is provided with ball bearings. The second lead screw (11) is fixedly connected to the gear (9). The second sleeve rod (10) moves in the vertical direction. A top rod (15) is provided at the top of the second sleeve rod (10). The support plate (3) is located above the top rod (15). It also includes a bracket (13) and a positioning rod (12). The support plate (3) is rotatably mounted on the bracket (13). The positioning rod (12) is located below the support plate (3). In its natural state, the pallet (3) is supported by the positioning rod (12). When the two clamps (2) move away from each other, the second threaded telescopic member extends, causing the top rod (15) to move upward. The top rod (15) pushes the pallet (3) to rotate forward, causing the pallet (3) to tilt downward from front to back.

6. The flipping device for manufacturing precision semiconductor components according to claim 5, characterized in that, An elastic limiting element B is provided between the pallet (3) and the positioning rod (12).

7. The flipping device for manufacturing precision semiconductor components according to claim 5, characterized in that, The bottom of the pallet (3) is provided with a limiting groove (16), and the top rod (15) is located in the limiting groove (16).

8. A flipping device for manufacturing precision semiconductor components according to any one of claims 1-7, characterized in that, The clamp (2) is C-shaped.

9. A flipping device for manufacturing precision semiconductor components according to any one of claims 1-7, characterized in that, When the clamp (2) contacts the limiting plate (14), the clamp (2) is in a horizontal state.

10. A flipping device for manufacturing precision semiconductor components according to claims 1-7, characterized in that, It also includes a base plate (1).

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