Multifunctional integrated interposer and photoelectric collaborative packaging module

By embedding silicon bridges and photonic integrated chips in the dielectric body and using embedded USR protocol processing, the problems of low integration and limited transmission rate in existing optoelectronic co-packaging technologies are solved, realizing high-density, low-loss optoelectronic co-packaging and supporting ultra-high-speed data transmission.

CN122161465AActive Publication Date: 2026-06-05SHANGHAI XIANFENG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202610612577.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-07
Publication Date
2026-06-05
Estimated Expiration
2046-05-07

AI Technical Summary

Technical Problem

Existing optoelectronic co-packaging technologies suffer from low integration of silicon bridges and photonic integrated chips, reliance on external modules for high-speed interface protocol processing, limited transmission rates, and unreasonable multi-chip collaborative layouts. These issues result in long interconnect paths, low integration, severe signal crosstalk and thermal interference, making it difficult to support ultra-high-speed transmission of 224Gbps PAM4 and above.

Method used

A multifunctional integrated interposer layer is adopted to embed silicon bridges and photonic integrated chips in the dielectric body in a coplanar manner. Through staggered distribution and rewiring structure, a high degree of integration of high-density, low-loss physical wiring channel circuits and photoelectric conversion functions is achieved. The USR ultra-high-speed interface protocol is embedded in the accelerated computing chip, and the layout of electronic integrated chips and photonic integrated chips is optimized.

Benefits of technology

It significantly shortens the interconnection path between chips, reduces transmission loss and latency, improves integration and signal integrity, simplifies system structure, supports ultra-high-speed transmission of 224Gbps and above, and reduces power consumption and signal attenuation.

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Abstract

The invention discloses a multifunctional integrated interposer and a photoelectric collaborative packaging module, and belongs to the technical field of integrated circuits. According to the multifunctional integrated interposer, the first embedded interconnection unit integrated with an ultra-high-density and ultra-low-loss physical wiring channel circuit and the second embedded interconnection unit with a photoelectric conversion function are embedded in the dielectric body in a coplanar manner, and the upper surfaces of the first embedded interconnection unit and the second embedded interconnection unit are flush with the upper surface of the dielectric body; the high integration of the two functional units in structure is realized, the interconnection path of high-speed electric signals and optical signals between chips is effectively shortened, and the transmission loss and delay are reduced. The embedded physical wiring channel circuit can directly provide ultra-high-speed physical signal direct connection in the first embedded interconnection unit, and a USR ultra-high-speed interface protocol processing function is transferred to an acceleration calculation core particle, so that the signal integrity is remarkably improved, an external special DSP chip is omitted, and the cost is reduced. Therefore, the system architecture is simplified, and the overall power consumption and the packaging complexity are reduced.
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