Workpiece handling device and workpiece moving method

Abstract

The workpiece work device (100) includes: a workpiece placement portion (221) that places a workpiece; a movement portion (23) that moves the workpiece placement portion by a movement axis system including one or more movement axes; a control portion (7) that controls a movement axis value of the movement axis system based on a virtual axis value of a virtual axis system including a virtual axis that is different from the movement axis system, moves the workpiece placement portion by the movement portion, and measures a movement state of the workpiece placement portion realized by the movement portion. The control portion moves the workpiece placement portion based on the virtual axis value of the virtual axis system, and acquires a correction value of the movement axis value of the movement axis system based on a measurement result obtained by measuring the movement state of the workpiece placement portion by the measurement portion.

Description

Technical Field

[0001] This invention relates to a workpiece handling device and a workpiece movement method. Background Technology

[0002] Previously, workpiece handling devices were known. For example, they were disclosed in Japanese Patent Application Publication No. 2007-038456.

[0003] Japanese Patent Application Publication No. 2007-038456 discloses a screen printing machine (workpiece operating device) comprising: a substrate holding device for holding a substrate (workpiece); a substrate position adjusting device for adjusting the position of the substrate by moving the substrate holding device; an imaging device for imaging a mark on the substrate held in the substrate holding device; and a control device for controlling the adjustment of the substrate position by the substrate position adjusting device based on the imaging result of the imaging device of the mark on the substrate. In this screen printing machine, the control device performs the following control: after adjusting the position of the substrate once by the substrate position adjusting device by the imaging device, after the imaging device images the mark on the substrate held in the substrate holding device to correct the movement error of the substrate position adjusting device, the imaging device images the mark on the substrate held in the substrate holding device again, and the substrate position adjusting device further adjusts the position of the substrate. In addition, in this screen printing machine, when the substrate (workpiece) is moved in the X direction, moved in the Y direction, and rotated in the R direction about the Z direction, the position of the substrate is adjusted by combining the driving of one X-direction drive unit and two Y-direction drive units.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2007-038456 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in the aforementioned Japanese Patent Application Publication No. 2007-038456, in a screen printing machine, when the substrate (workpiece) is moved along the X direction, moved along the Y direction, and rotated along the R direction, the position of the substrate is adjusted by combining the driving of one X-direction drive unit and two Y-direction drive units. Therefore, when the workpiece is rotated in the R direction, the driving direction of the drive unit is different from the movement direction of the workpiece, thus complicating the correction process for high-precision workpiece position adjustment. Therefore, it is desirable to suppress the complexity of the correction process for high-precision workpiece movement caused by the movement of the motion axis system through a virtual axis system different from the motion axis system.

[0009] The present invention was made to solve the problems mentioned above. One object of the present invention is to simplify the correction process when the workpiece is moved with high precision by suppressing the movement of the motion axis system through a virtual axis system of a system different from the motion axis system.

[0010] Methods for solving problems

[0011] To achieve the above objectives, the workpiece handling apparatus of the first aspect of the present invention comprises: a workpiece placing section for placing a workpiece; a moving section for moving the workpiece placing section via a motion axis system including one or more motion axes; a control section for controlling the motion axis values ​​of the motion axis system based on virtual axis values ​​of a virtual axis system including virtual axes, which is different from the motion axis system, and moving the workpiece placing section via the moving section; and a measuring section for measuring the movement state of the workpiece placing section implemented by the moving section, the control section for moving the workpiece placing section based on the virtual axis values ​​of the virtual axis system, and obtaining a correction value of the motion axis values ​​of the motion axis system based on the measurement results obtained by the measuring section for measuring the movement state of the workpiece placing section.

[0012] In the workpiece operating apparatus of the first aspect of the present invention, as described above, the control unit moves the workpiece mounting unit based on the virtual axis value of the virtual axis system, and obtains a correction value for the motion axis value of the motion axis system based on the measurement result obtained by the measuring unit measuring the movement state of the workpiece mounting unit. Therefore, when the motion axis value of the motion axis system is controlled based on the virtual axis value of the virtual axis system, which is a system different from the motion axis system, and the workpiece mounting unit is moved by the moving unit, even if an error occurs in the movement of the motion axis system based on the virtual axis system, the workpiece can be moved to the desired position with high precision by using the correction value. That is, when the motion axis value of the motion axis system is controlled relative to the virtual axis value of the virtual axis system, even if the error in the virtual axis system increases due to mechanical errors in the motion axis system, the motion axis value is corrected by the correction value, thus enabling the workpiece mounting unit to move with high precision relative to the virtual axis value in the virtual axis system. Furthermore, in order to eliminate the linearity error of the virtual axis system, by performing correction to the corresponding motion axis system, the correction effect can be applied to all positions of the virtual axis system that moves through the motion axis system, thus enabling the workpiece to move with high precision. As a result, by using a virtual axis system that is different from the motion axis system, it is possible to suppress the complex correction process that makes the workpiece move with high precision when the motion axis system is activated.

[0013] In the workpiece operating apparatus of the first aspect described above, it is preferable that the control unit determines the motion axis value based on the virtual axis value of the virtual axis system and the obtained correction value, and moves the workpiece mounting unit by means of the moving unit. If configured in this way, the motion axis value can be determined by adding the correction value to the virtual axis value, and the workpiece mounting unit can be moved by means of the motion axis system, thus enabling the workpiece to be moved to the desired position in the virtual axis system with high precision by means of the motion axis system.

[0014] In the workpiece operating apparatus of the first aspect described above, it is preferable that the control unit moves the workpiece mounting unit to multiple positions based on multiple virtual axis values, and obtains correction values ​​for the motion axis values ​​of the motion axis system at each of the multiple positions based on measurement results obtained by the measuring unit measuring the movement state of the workpiece mounting unit at the multiple positions. If configured in this way, appropriate correction values ​​corresponding to the multiple positions of the motion axis system can be obtained, thus enabling the workpiece to be moved with high precision at the multiple positions of the motion axis system.

[0015] In this case, it is preferable that the control unit obtains correction values ​​for the motion axis values ​​of the motion axis system at multiple positions, and generates a correction value map having multiple correction values ​​corresponding to the positions of the motion axes. If configured in this way, by pre-generating the correction value map, the motion axis values ​​of the motion axis system can be easily corrected based on the correction value map to move the workpiece.

[0016] In the workpiece operating apparatus with the aforementioned structure where the control unit generates a correction value mapping, it is preferable that the control unit, based on the correction value mapping, obtains the correction value in the motion axis corresponding to the virtual axis value through interpolation, determines the motion axis value, and moves the workpiece mounting unit via the moving unit. If configured in this way, the correction value can be obtained from the correction value mapping through interpolation, thus eliminating the need to obtain correction values ​​for all motion axis values ​​in the motion axis system. As a result, the complexity of the process when generating the correction value mapping can be suppressed. Furthermore, through interpolation from the correction value mapping, the correction value for the motion axis value when moving the workpiece can be easily obtained.

[0017] In the workpiece operating apparatus of the first aspect described above, preferably, the virtual axis system includes a first virtual axis in the horizontal direction, a second virtual axis in the horizontal direction orthogonal to the first virtual axis, and a third virtual axis in the rotational direction about the vertical direction. The motion axis system includes a first motion axis in the horizontal direction parallel to the first virtual axis, a second motion axis in the horizontal direction parallel to the first motion axis, and a third motion axis in the horizontal direction orthogonal to the first and second motion axes. The control unit moves the workpiece mounting unit based on the virtual axis values ​​of the first, second, and third virtual axes of the virtual axis system, and the measuring unit measures the movement state of the workpiece mounting unit to obtain correction values ​​for the motion axis values ​​of the first, second, and third motion axes of the motion axis system. If configured in this way, even if the error in the virtual axis system increases due to the movement directions of the multiple virtual axes of the virtual axis system being different from the movement directions of the multiple motion axes of the motion axis system, the motion axis values ​​can be corrected using the correction values. Therefore, the workpiece mounting unit can be moved with high precision relative to the virtual axis values ​​in the virtual axis system.

[0018] In the workpiece operating apparatus of the first aspect described above, it is preferable to further include a mask holding section that holds a mask for printing on a substrate, which is a workpiece, placed on a workpiece holding section. A control section moves the position of the workpiece holding section using virtual axis values ​​and correction values ​​of a virtual axis system, so that the position of the substrate is aligned with the mask held in the mask holding section. With this configuration, by correcting the operation axis values ​​using correction values, the substrate, which is a workpiece, can be aligned with the mask with high precision. As a result, printed matter can be printed on the substrate with high precision.

[0019] In this case, the preferred measuring unit includes an imaging unit that captures images of the marks provided on the workpiece mounting section, and the control unit obtains the position of the motion axis of the motion axis system based on the imaging results of the imaging unit. With this configuration, the movement state of the workpiece can be easily measured by using the imaging unit to capture images of the marks on the workpiece mounting section.

[0020] In the workpiece processing apparatus with the aforementioned measuring unit including an imaging unit, it is preferable that, during printing on the substrate, the imaging unit aligns the substrate with the mask. If configured in this way, the workpiece's movement state for obtaining correction values ​​of the motion axis can be measured using the imaging unit that aligns the substrate with the mask, thus eliminating the need for additional components for measuring the workpiece's movement state. As a result, the increase in the number of parts can be prevented, and the complexity of the apparatus structure can be prevented.

[0021] In the workpiece operating apparatus of the first aspect described above, it is preferable that the control unit moves the workpiece mounting unit within a predetermined range while the measuring unit measures the movement state of the workpiece mounting unit at multiple positions, obtaining correction values ​​for the movement axis values ​​of the movement axis system at each of the multiple positions. Based on the multiple correction values ​​within the predetermined range, a correction value for the movement axis values ​​outside the predetermined range is calculated by fitting an approximation formula. If configured in this way, correction values ​​outside the predetermined range can also be calculated by fitting an approximation formula by measuring the movement state within the predetermined range, thus eliminating the need to measure a large number of points. Furthermore, when obtaining correction values, even if movement outside the predetermined range is difficult due to device limitations, correction values ​​outside the predetermined range can be obtained through measurements within the predetermined range.

[0022] In this case, it is preferable that the control unit uses trigonometric functions to generate an approximation. If configured in this way, it is possible to approximate and easily obtain the periodically changing correction value using trigonometric functions that are periodic functions.

[0023] In the workpiece operating device described above, where the control unit uses trigonometric functions to generate an approximation, it is preferable that the moving part includes a ball screw mechanism, the control unit generates an approximation model based on parameters including the feed pitch of the ball screw mechanism, and determines the coefficients of the approximation model based on multiple obtained correction values, thereby obtaining the approximation. With this configuration, the error in the periodic variation of the ball screw mechanism that converts rotary motion into linear motion can be appropriately corrected using the correction values ​​obtained by approximating with an approximation model including the feed pitch parameter.

[0024] The workpiece movement method of the second aspect of the present invention includes the following steps: controlling the motion axis value of the motion axis system based on the virtual axis value of the virtual axis system including virtual axes to move a workpiece mounting part that holds the workpiece, wherein the virtual axis system is a different system from the motion axis system that includes one or more motion axes; measuring the movement state of the workpiece mounting part; and moving the workpiece mounting part based on the virtual axis value of the virtual axis system, and obtaining a correction value of the motion axis value of the motion axis system based on the measurement result obtained from measuring the movement state of the workpiece mounting part.

[0025] In the workpiece movement method of the second aspect of the present invention, as described above, the following steps are provided: the workpiece mounting part is moved based on the virtual axis value of the virtual axis system, and a correction value of the motion axis value of the motion axis system is obtained based on the measurement result obtained by measuring the movement state of the workpiece mounting part. Therefore, when the workpiece mounting part is moved by the moving part by controlling the motion axis value of the motion axis system based on the virtual axis value of the virtual axis system, which is a system different from the motion axis system, even if an error occurs in the movement of the motion axis system based on the virtual axis system, the workpiece can be moved to the desired position with high precision by using the correction value. That is, when the motion axis value of the motion axis system is controlled relative to the virtual axis value of the virtual axis system, even if the error in the virtual axis system increases due to the mechanical error of the motion axis system, the motion axis value is corrected by the correction value, thus enabling the workpiece mounting part to be moved with high precision relative to the virtual axis value in the virtual axis system. Furthermore, in order to eliminate the linearity error of the virtual axis system, by performing correction to the corresponding motion axis system, the correction effect can be applied to all positions of the virtual axis system that moves through the motion axis system, thus enabling the workpiece to be moved with high precision. As a result, by using a virtual axis system that is different from the motion axis system, it is possible to suppress the situation where the correction process becomes complicated when the workpiece is moved with high precision by moving the motion axis system.

[0026] Invention Effects

[0027] According to the present invention, as described above, by using a virtual axis system of a system different from the motion axis system, it is possible to suppress the situation where the correction process becomes complicated when the workpiece is moved with high precision by moving the motion axis system. Attached Figure Description

[0028] Figure 1 This is a front view showing the overall structure of the printing apparatus according to the first embodiment of the present invention.

[0029] Figure 2 This is a block diagram illustrating the control structure of the printing apparatus according to the first embodiment of the present invention.

[0030] Figure 3 This is a schematic top view showing the substrate holding portion of the printing apparatus according to the first embodiment of the present invention.

[0031] Figure 4 This is a perspective view showing the substrate holding portion of the printing apparatus according to the first embodiment of the present invention.

[0032] Figure 5 This is a top view showing the substrate holding section and the conveyor of the printing apparatus according to the first embodiment of the present invention.

[0033] Figure 6This is a diagram illustrating the movement of the substrate holding portion of the printing apparatus according to the first embodiment of the present invention.

[0034] Figure 7 This is a diagram showing the relationship between the target angle and the angle error of the substrate holding portion of the printing apparatus according to the first embodiment of the present invention.

[0035] Figure 8 This is a graph showing the relationship between the x-position and the deviation of the movement of the substrate holding part of the printing apparatus according to the first embodiment of the present invention.

[0036] Figure 9 This is a diagram illustrating an example of a correction value mapping for a printing apparatus according to a first embodiment of the present invention.

[0037] Figure 10 This is a flowchart illustrating the correction value acquisition process performed by the control unit of the printing apparatus according to the first embodiment of the present invention.

[0038] Figure 11 This is a flowchart illustrating the correction value mapping generation process performed by the control unit of the printing apparatus according to the first embodiment of the present invention.

[0039] Figure 12 This is a flowchart illustrating the calculation process performed by the control unit of the printing apparatus according to the first embodiment of the present invention.

[0040] Figure 13 This is a flowchart illustrating the correction value generation process performed by the control unit of the printing apparatus according to the first embodiment of the present invention.

[0041] Figure 14 This is a diagram illustrating the process of generating correction values ​​by approximation in the printing apparatus of the second embodiment of the present invention.

[0042] Figure 15 This is a flowchart illustrating the correction value generation process performed by the control unit of the printing apparatus according to the second embodiment of the present invention. Detailed Implementation

[0043] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0044] (First Implementation)

[0045] Reference Figures 1-9 The structure of the printing apparatus 100 according to the first embodiment of the present invention will be described.

[0046] The printing apparatus 100 of this embodiment has the function of printing solder on the surface of the substrate 200 with a predetermined pattern formed in the opening of the mask 300. For example... Figure 1As shown, the printing apparatus 100 includes: a base 1; a substrate holding portion 2 disposed on the base 1, holding the substrate 200 and aligning it relative to a mask 300; and a squeegee unit 3 disposed above the mask 300 positioned above the substrate holding portion 2. This printing apparatus 100 has the function of printing on the substrate 200 fed in by the infeed conveyor 4a and then removing the printed substrate 200 by the outfeed conveyor 4b. It should be noted that the printing apparatus 100 is an example of the "workpiece processing apparatus" in the claims. Furthermore, the substrate 200 is an example of the "workpiece" in the claims.

[0047] The substrate holding section 2 mainly consists of a pair of conveyors 22, a horizontal moving mechanism 23, a vertical moving mechanism 24, and a substrate lifting and supporting mechanism 25. The substrate 200, serving as a workpiece, is placed in the substrate clamp 221 of the substrate holding section 2. It should be noted that the substrate clamp 221 is an example of the "workpiece placing section" in the claims.

[0048] like Figure 2 As shown, the horizontal moving mechanism 23 includes an X1-axis drive unit 231, an X2-axis drive unit 232, and a Y-axis drive unit 233. The horizontal moving mechanism 23 is configured to move the substrate clamp 221 holding the substrate 200 horizontally in the X and Y directions, and to rotate the substrate clamp 221 about a rotation axis in the vertical direction (Z-axis direction). It should be noted that the horizontal moving mechanism 23 is an example of the "moving part" in the claims.

[0049] The horizontal moving mechanism 23 moves the substrate clamp 221 through a motion axis system including one or more motion axes. Specifically, the horizontal moving mechanism 23 moves the substrate clamp 221 (substrate 200) through a motion axis system, which includes a first motion axis (X1 axis) in the horizontal direction, a second motion axis (X2 axis) in the horizontal direction parallel to the first motion axis, and a third motion axis (Y1 axis) in the horizontal direction orthogonal to the first and second motion axes.

[0050] Furthermore, the horizontal movement mechanism 23 performs actions based on the virtual axis values ​​of a virtual axis system that is a system different from the motion axis system and includes virtual axes (Vx axis, Vy axis, Vr axis), controlling the motion axis values ​​of the motion axis system. Specifically, as... Figure 3As shown, the horizontal movement mechanism 23 moves the substrate clamp 221 (substrate 200) along the X direction (the Vx axis direction of the virtual axis) via the X1 axis drive unit 231 and the X2 axis drive unit 232. Additionally, the horizontal movement mechanism 23 moves the substrate clamp 221 (substrate 200) along the Y1 direction (the Vy axis direction of the virtual axis) via the Y axis drive unit 233. Furthermore, the horizontal movement mechanism 23 rotates the substrate clamp 221 (substrate 200) about the vertical rotation axis (the Vr direction of the virtual axis) via the X1 axis drive unit 231, the X2 axis drive unit 232, and the Y axis drive unit 233.

[0051] For example, when the virtual axis Vx is moved to the right (left) by a virtual axis value, the control unit 7 controls the driving of the X1 axis drive unit 231 and the X2 axis drive unit 232 by the motion axis values ​​that move the X1 axis and X2 axis to the right (left). Similarly, when the virtual axis Vy is moved forward (backward) by a virtual axis value, the control unit 7 controls the driving of the Y-axis drive unit 233 by the motion axis value that moves the Y1 axis forward (backward). Furthermore, when the virtual axis Vr is rotated to the left by a virtual axis value, the control unit 7 controls the driving of the X1 axis drive unit 231, the X2 axis drive unit 232, and the Y-axis drive unit 233 by the motion axis values ​​that move the X1 axis to the right, the X2 axis to the left, and the Y1 axis to the forward. In addition, when the virtual axis value of the Vr axis, which is used as a virtual axis, is rotated to the right, the control unit 7 controls the driving of the X1 axis drive unit 231, the X2 axis drive unit 232 and the Y axis drive unit 233 by the motion axis value that moves the X1 axis of the motion axis to the left, the motion axis value that moves the X2 axis of the motion axis to the right and the motion axis value that moves the Y1 axis of the motion axis backward.

[0052] like Figure 3 As shown, the horizontal movement mechanism 23 includes ball screw mechanisms 231a, 232a, and 233a. Specifically, the X1 axis drive unit 231 moves the substrate clamp 221 (substrate 200) in the X1 direction via the ball screw mechanism 231a. Additionally, the X2 axis drive unit 232 moves the substrate clamp 221 (substrate 200) in the X2 direction via the ball screw mechanism 232a. Furthermore, the Y-axis drive unit 233 moves the substrate clamp 221 (substrate 200) along the Y1 direction via the ball screw mechanism 233a.

[0053] In addition, such as Figure 4As shown, the horizontal movement mechanism 23 includes a sliding portion 231b. The sliding portion 231b moves in the X direction driven by the X1 axis drive unit 231 (ball screw mechanism 231a). Furthermore, the sliding portion 231b follows the drive of other drive units in the Y direction. Additionally, the horizontal movement mechanism 23 includes a sliding portion 232b. The sliding portion 232b moves in the X direction driven by the X2 axis drive unit 232 (ball screw mechanism 232a). Furthermore, the sliding portion 232b follows the drive of other drive units in the Y direction. Additionally, the horizontal movement mechanism 23 includes a sliding portion 233b. The sliding portion 233b moves in the Y direction driven by the Y-axis drive unit 233 (ball screw mechanism 233a). Furthermore, the sliding portion 233b follows the drive of other drive units in the X direction. Finally, the horizontal movement mechanism 23 includes a sliding portion 234. The sliding part 234 follows the drive of the X1 axis drive part 231, the X2 axis drive part 232 and the Y axis drive part 233, and is driven in the X and Y directions respectively.

[0054] like Figure 2 As shown, the up-down moving mechanism 24 has a Z-axis drive unit 241. The up-down moving mechanism 24 is configured to move the substrate clamp 221 (substrate 200) in the up-down direction (Z-axis direction).

[0055] like Figure 2 As shown, the substrate lifting support mechanism 25 includes a support shaft drive unit 251 and a plurality of support pins 252 (see reference). Figure 1 ).

[0056] The substrate holding section 2 holds the transported substrate 200 at a predetermined position on the substrate clamp 221. Then, the substrate is viewed through the substrate camera 111 (see reference 111). Figure 2 The position of the substrate 200 relative to the substrate holding portion 2 is identified in advance by the mask camera 112 (see reference). Figure 2 The position of the mask 300 is identified. Furthermore, the substrate holding part 2 is configured such that the substrate 200 is moved by a horizontal moving mechanism 23 (X1 axis drive unit 231, X2 axis drive unit 232, and Y axis drive unit 233), and while positioned relative to the mask 300, the substrate 200 is raised to a predetermined position where it is in close contact with the lower surface of the mask 300 by a vertical moving mechanism 24 (Z axis drive unit 241). It should be noted that the substrate camera 111 and the mask camera 112 are respectively configured such that, during the imaging of substrate markings and mask markings, the camera axis drive unit 11 (see reference 233) drives the substrate camera 200 to move the substrate camera 200 to move the mask camera 200 to a predetermined position where it is in close contact with the lower surface of the mask 300. Figure 2 It moves into the space between the substrate holding part 2 and the mask 300. It should be noted that the substrate camera 111 is an example of the "measuring part" and "image capturing part" in the claims.

[0057] In addition, such as Figure 5As shown, when the pair of conveyors 22 are lowered towards the transfer substrate 200, a gap Da separates them from the infeed conveyor 4a. Similarly, when the pair of conveyors 22 are lowered towards the transfer substrate 200, a gap Db separates them from the outfeed conveyor 4b. That is, when the pair of conveyors 22 are lowered, the substrate holding unit 2 can move and rotate horizontally by the amounts of gaps Da and Db. It should be noted that when the pair of conveyors 22 are raised, the conveyors 22 do not interfere with the infeed conveyor 4a and the outfeed conveyor 4b, and therefore can move and rotate horizontally within a range larger than the gaps Da and Db.

[0058] The substrate camera 111 is configured to photograph the markings Ma and Mb provided on the substrate clamp 221. The markings Ma and Mb are, for example, circular through-holes provided on the upper surface of the substrate clamp 221. Furthermore, during printing on the substrate 200, the substrate camera 111 photographs the substrate 200 (substrate markings) to align the substrate 200 with the mask 300. Additionally, the substrate camera 111 is configured to measure the movement state of the substrate clamp 221 (substrate 200) implemented by the horizontal movement mechanism 23 when generating the correction value described later.

[0059] like Figure 1 As shown, a pair of conveyors 22 are arranged extending along the conveying direction of the substrate 200. Furthermore, the pair of conveyors 22 are arranged parallel to each other, spaced a predetermined distance apart in the front-to-back direction (Y direction). Additionally, the pair of conveyors 22 are configured such that the Y-direction spacing can be adjusted according to the width of the substrate 200 being conveyed. Specifically, it is configured to be driven by a substrate width axis drive unit 26 (see reference 26). Figure 2 The drive is used to adjust the spacing (width) of a pair of conveyors 22.

[0060] Additionally, the pair of conveyors 22 are configured to be driven by the substrate conveying shaft drive unit 27 (see reference). Figure 2 The substrate 200 is transported along the X direction by the drive of the conveyor 4a. Furthermore, the pair of conveyors 22 are configured to move in the vertical direction (Z direction) via the vertical movement mechanism 24. Additionally, the pair of conveyors 22 have the function of receiving the substrate 200 before printing from the receiving conveyor 4a and transporting the printed substrate 200 to the output conveyor 4b.

[0061] Additionally, a plurality of support pins 252 are provided in the substrate holding section 2. These support pins 252 are configured to support the substrate 200 from below. Specifically, the substrate 200, conveyed by a pair of conveyors 22, is moved upwards by the plurality of support pins 252 from the pair of conveyors 22 to a predetermined height. Then, the substrate 200, having risen to a predetermined height position relative to the pair of conveyors 22, is held in place by the substrate clamp 221 (see reference 221). Figure 2Clamping. In this state, the substrate 200 is aligned relative to the mask 300 and raised to fit tightly against the lower surface of the mask 300 as described above, and the substrate 200 is held at a predetermined printing position on the lower surface of the mask 300.

[0062] An opening with a prescribed pattern is formed in the mask 300. Furthermore, the mask 300 has a rectangular shape when viewed from above, and a frame 301 is mounted on its outer periphery. Additionally, as... Figure 1 As shown, the mask 300 is fixedly held above the substrate holding part 2 by the clamping frame 301 of the mask holding part 5. That is, the mask holding part 5 holds the mask 300 for printing on the substrate 200, which is a workpiece placed on the substrate holding part 2 (substrate clamp 221).

[0063] like Figure 1 As shown, the scraper unit 3 is disposed above the mask 300. The scraper unit 3 has the function of scraping the solder supplied to the upper surface of the mask 300 onto the upper surface of the mask 300 by reciprocating along the front-back direction (Y direction). Thus, solder is printed onto the surface of the substrate 200 through the opening of the mask 300. Specifically, as... Figure 1 and Figure 2 As shown, the scraper unit 3 includes a printing head 31 and a scraper Z-axis motor 32 that drives the printing head 31 to rise and fall. It should be noted that, instead of the scraper Z-axis motor 32, a cylinder that drives the printing head 31 to rise and fall by air pressure can also be provided.

[0064] like Figure 1 As shown, the printing head 31 is supported by a pair of tracks 6, enabling it to move in the front-to-back direction (Y direction). Specifically, it is configured to be driven by a scraper Y-axis motor 3a (see reference). Figure 2 The printing head 31 is moved in the Y direction by the drive of the squeegee Y-axis motor 3a. That is, the squeegee 311 is moved in a predetermined direction (Y direction). In addition, the printing head 31 is configured to be able to move up and down in the vertical direction (Z direction). Specifically, it is configured to be moved by the squeegee Z-axis motor 32 (see reference 32). Figure 2 Driven by the Z-axis, the printing head 31 moves along the Z-direction.

[0065] like Figure 1 As shown, the scraper 311 is formed to extend along the X direction. Furthermore, the scraper 311 is configured to abut against the upper surface of the mask 300, which has an opening, and moves along the Y direction to print solder supplied to the mask 300 onto the substrate 200 through the opening of the mask 300. Additionally, the scraper 311 is mounted so that it can rotate relative to the scraper support bracket about a support shaft extending in the X direction orthogonal to the Y direction. Specifically, the scraper 311 is configured to be driven by a scraper-rotating motor 312 (see reference). Figure 2Driven by the bearing shaft, it rotates around the support shaft.

[0066] In addition, such as Figure 2 As shown, a solder supply unit 33 is provided in the scraper unit 3. The solder supply unit 33 is configured to automatically supply solder to the mask 300.

[0067] like Figure 2 As shown, a control unit 7 is provided in the printing apparatus 100 to control the printing apparatus 100. The control unit 7 includes a main control unit 7a, a drive control unit 7b, and a valve control unit 7c. The main control unit 7a is composed of a CPU and has the function of controlling each part based on the printing program stored in the storage unit 10. In addition, the main control unit 7a is configured to control the squeegee unit, the conveyor unit, and the camera unit via the drive control unit 7b and the valve control unit 7c. Specifically, the drive control unit 7b controls the drive of the squeegee Y-axis motor 3a, the squeegee Z-axis motor 32, and the squeegee rotation motor 312, so that the squeegee 311 moves in the Y and Z directions and rotates around the support shaft 317. That is, the control unit 7 controls the movement of the squeegee 311 implemented by the squeegee Y-axis motor 3a, the squeegee Z-axis motor 32, and the squeegee rotation motor 312.

[0068] Furthermore, the drive control unit 7b controls the drive of the solder supply unit 33 to supply solder onto the mask 300. Specifically, the control unit 7b controls the supply of solder onto the mask 300 at predetermined printing intervals. Additionally, the control unit 7 uses the laser measurement unit 12 (see reference...) Figure 2 The amount of solder on the mask 300 is obtained, and if it is determined that the amount of solder is less than the specified amount, the solder supply unit 33 controls the supply of solder to the mask 300.

[0069] Furthermore, the drive control unit 7b controls the drive of the X1-axis drive unit 231, X2-axis drive unit 232, Y-axis drive unit 233, and Z-axis drive unit 241, causing the substrate 200 held by the substrate clamp 221 of the conveyor unit to move in the X, Y, and Z directions, and to rotate in the R-axis direction with the Z-axis as the rotation center. Additionally, the drive control unit 7b controls the drive of the support shaft drive unit 251, causing the support pin 252 to move in the vertical direction (Z direction). Furthermore, the drive control unit 7b controls the drive of the camera shaft drive unit 11 of the camera unit, which is used to identify the position and orientation of the mask 300 (see reference). Figure 2 )move.

[0070] Additionally, the drive of the substrate width axis drive unit 26 is controlled by the drive control unit 7b to adjust the Y-direction spacing (width) of the conveyor 22. Furthermore, the drive of the substrate transport axis drive unit 27 is controlled by the drive control unit 7b to transport the substrate 200 along the X-direction via the conveyor 22. Additionally, the opening and closing of the substrate 200 clamp is controlled by the air drive of the substrate clamp 221 via the valve control unit 7c. Furthermore, the drive of the camera axis drive unit 11 of the camera unit is controlled by the drive control unit 7b to enable the substrate camera 111 (see reference) for recognizing the position and orientation of the substrate 200. Figure 2 )move.

[0071] It should be noted that the camera unit is equipped with an upward-facing mask camera 112 and a downward-facing substrate camera 111. In addition, the substrate clamp 221 clamps the substrate 200 from both sides of the substrate 200 in the Y direction. When the substrate 200 is clamped, the upper surface of the substrate clamp 221 is at the same height (Z direction position) as the upper surface of the substrate 200, and is configured to support the load from the scraper 311 via the mask 300 in the same way as the substrate 200.

[0072] Furthermore, the main control unit 7a is configured to display the operating status of the printing apparatus 100 on the display unit 8. Additionally, the main control unit 7a is configured to receive various information input by the operator via the input unit 9.

[0073] Additionally, the main control unit 7a controls the amount of solder on the mask 300 measured by the laser measurement unit 12. Furthermore, the main control unit 7a controls the imaging of the position and orientation of the substrate 200 obtained by the substrate camera 111. Additionally, the main control unit 7a controls the imaging of the position and orientation of the mask 300 obtained by the mask camera 112.

[0074] In this embodiment, the control unit 7 controls the motion axis values ​​of the motion axis system based on the virtual axis values ​​of the virtual axis system, which are different from the motion axis system and include virtual axes, and moves the substrate clamp 221 (substrate 200) via the horizontal movement mechanism 23. Furthermore, the control unit 7 moves the substrate clamp 221 (substrate 200) based on the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr), and obtains correction values ​​for the motion axis values ​​of the motion axis system (X1, X2, Y1) based on the measurement results obtained by the substrate camera 111 measuring the movement state of the substrate clamp 221 (substrate 200).

[0075] The correction value obtained by the control unit 7 is performed, for example, during the manufacturing process of the printing apparatus 100 after the horizontal movement mechanism 23 has been adjusted. Additionally, the correction value obtained by the control unit 7 is also performed after the printing apparatus 100 has been installed and the horizontal movement mechanism 23 has been adjusted. Furthermore, the correction value obtained by the control unit 7 can also be performed periodically after the printing apparatus 100 has been installed.

[0076] In addition, the control unit 7 determines the action axis value based on the virtual axis value of the virtual axis system and the obtained correction value, and moves the substrate clamp 221 (substrate 200) through the horizontal movement mechanism 23.

[0077] That is, the control unit 7 moves the substrate 200 based on the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr). The virtual axis system (Vx, Vy, Vr) corresponds to the X direction, Y direction, and rotation direction about the Z axis of the printing apparatus 100. Moreover, the operation axis system (X1, X2, Y1) of the horizontal movement mechanism 23 does not have a mechanism to directly rotate the substrate 200 about the Z axis, but rotates the substrate 200 about the Z axis by combining horizontal movement.

[0078] That is, when the position of the substrate 200 is adjusted, the control unit 7 transforms the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr) into the motion axis values ​​of the motion axis system (X1, X2, Y1), and then adds or subtracts the obtained correction value to make the motion axis system move.

[0079] Here, when the horizontal moving mechanism 23 is moved by the motion axis values ​​of the motion axis system (X1, X2, Y1) based on the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr), such as Figure 7 As shown, an angular error occurs relative to the target angle. Furthermore, this angular error varies periodically depending on the positions of the X1, X2, and Y1 axes of the motion system. Additionally, for example, as... Figure 8 As shown, when the horizontal moving mechanism 23 is moved by the motion axis values ​​of the motion axis system (X1, X2, Y1) based on the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr), a periodically changing deviation is generated according to the position of the motion axis system X1, X2, Y1. The period xa of this deviation corresponds to the feed pitch of the ball screw.

[0080] Additionally, correction values ​​are used to correct the linearity error of the motion axis system (X1, X2, Y1) relative to the virtual axis system (Vx, Vy, Vr). The virtual axis system includes a first virtual axis (Vx axis) in the horizontal direction, a second virtual axis (Vy axis) orthogonal to the first virtual axis in the horizontal direction, and a third virtual axis (Vr axis) about the rotation direction in the vertical direction. The motion axis system includes a first motion axis (X1 axis) parallel to the first virtual axis in the horizontal direction, a second motion axis (X2 axis) parallel to the first motion axis in the horizontal direction, and a third motion axis (Y1 axis) orthogonal to the first and second motion axes in the horizontal direction.

[0081] The control unit 7 moves the substrate clamp 221 (substrate 200) to multiple positions based on multiple virtual axis values, and obtains correction values ​​for the motion axis values ​​of the motion axis system at each of the multiple positions based on the measurement results obtained by the substrate camera 111 measuring the movement state of the substrate clamp 221 (substrate 200) at the multiple positions. In other words, while obtaining the correction values, the control unit 7 moves the substrate clamp 221 to multiple positions, obtains the actual movement position at each movement position, and calculates the correction value at each movement position.

[0082] like Figure 6 As shown, the control unit 7 moves the substrate 200 from the initial position to the measurement position. At this time, the control unit 7 captures images of the markings Ma and Mb on the substrate clamp 221 using the substrate camera 111, obtaining the positions of the markings Ma and Mb. That is, the control unit 7 obtains the position of the motion axis of the motion axis system based on the image captured by the substrate camera 111. Figure 6 In the example shown, at the initial position of substrate 200, markers Ma and Mb are located at positions Pa1 and Pb1, respectively. Furthermore, marker Ma, initially located at position Pa1, moves to position Pa2 at the measured position of substrate 200, and marker Mb, initially located at position Pb1, moves to position Pb2 at the measured position of substrate 200.

[0083] For example, the initial position of the force point on the X1 axis of the motion axis system is FX1 (FX X1 FY X1 The initial position of the force point on the X2 axis of the motion axis system is FX2 (FX X2 FY X2 The initial position of the force point on the Y1 axis of the motion system is FY1 (FX). Y1 FY Y1 At this point, the center of rotation (X) RC Y RC ) is ((FX) X1 +FX X2 ) / 2, (FY Y1 +FY X2 ) / 2).

[0084] Additionally, the position of the first marker (marker Ma) is set to M1 (X). M1 Y M1 ), set the position of the second marker (marker Mb) to M2 (X M2 Y M2 Additionally, the position of the first marker after the movement is set to M1a(X). M1a Y M1a ), set the position of the second marker to M2a (X M2a Y M2aFurthermore, based on the positional changes of the first and second markers, the scale α, angle θ, and offsets ΔVX, ΔVY, and ΔVR of the rotation center are calculated.

[0085] Then, the positions of the motion axes X1, X2, and Y1 are calculated based on the displacements ΔVX, ΔVY, and ΔVR of the center of rotation. For example, the displacement of the center of rotation (VR, VX, VY) = (θ, Xoff, Yoff) is obtained from the position change of the marked position 2. The displacements of the motion axis positions X1, X2, and Y1 are shown below. X1 is calculated based on dXR of parallel VX + angular change VR. X1 X2 is represented by dXR based on parallel VX + angle variation VR. X2 Y1 is represented by dYR based on the parallel VY + angle change VR. Y1 express.

[0086] The amount of movement (n = X1, X2, Y1) based on the angle change VR is represented by the following equation (1).

[0087] [Mathematical Expression 1]

[0088] That is, the calculation is X1 = VX + dXR X1 Additionally, the calculation is X2 = VX + dXR. X2 Additionally, the calculation is Y1 = VY + dXR. Y1 .

[0089] In addition, such as Figure 9 As shown, the control unit 7 obtains correction values ​​for the motion axis values ​​of the motion axis system at multiple positions, and generates a correction value mapping with multiple correction values ​​corresponding to the positions of the motion axes. That is, the control unit 7 obtains correction values ​​at each of the multiple discontinuous movement positions and generates a correction value mapping.

[0090] Furthermore, the control unit 7, based on the correction value mapping, obtains the correction value on the motion axis corresponding to the virtual axis value through interpolation, determines the motion axis value, and moves the substrate clamp 221 (substrate 200) via the horizontal movement mechanism 23. That is, the generated correction value mapping stores correction values ​​at multiple discontinuous positions. The correction values ​​for the positions between these stored correction values ​​are obtained by interpolating the correction values ​​of the preceding and following positions using linear interpolation.

[0091] In addition, the control unit 7 moves the substrate clamp 221 (substrate 200) based on the virtual axis values ​​of the first virtual axis (Vx axis), the second virtual axis (Vy axis), and the third virtual axis (Vr axis) of the virtual axis system, and measures the movement state of the substrate clamp 221 (substrate 200) by the substrate camera 111 to obtain the correction values ​​of the motion axis values ​​of the first motion axis (X1 axis), the second motion axis (X2 axis), and the third motion axis (Y1 axis) of the motion axis system.

[0092] The control unit 7 moves the position of the substrate clamp 221 (substrate 200) by using the virtual axis value and correction value of the virtual axis system, so that the position of the substrate 200 is aligned with the mask 300 held in the mask holding unit 5.

[0093] The control unit 7 generates an approximate model based on the parameters of the feed pitch of the ball screw mechanisms 231a, 232a, and 233a, and determines the coefficients of the approximate model based on the obtained multiple correction values ​​to obtain the approximate formula.

[0094] (Processing for obtaining correction values)

[0095] Next, refer to Figure 10 The outline of the correction value acquisition process based on the control unit 7 will be explained.

[0096] exist Figure 10 In step S1, the process of generating correction values ​​for each of the multiple positions of the motion axis begins. In step S2, the substrate clamp 221 (substrate 200) is moved based on the command values ​​of the virtual axis system (Vx, Vy, Vr).

[0097] In step S3, the displacement of the reference marks 2 points (markers Ma and Mb) from the initial position of the substrate is obtained based on the image captured by the substrate camera 111. In step S4, the scale, angle, and offset XY are obtained based on the displacement of the reference marks 2 points. For example, the scale, angle, and offset XY are obtained through Helmert transform.

[0098] In step S5, the displacement ΔVX of the substrate in the virtual axis system is calculated. M ΔVY M ΔVR M In step S6, the displacement ΔX1 of the substrate in the motion axis system is calculated using the formulas for the motion axis and the virtual axis. M ΔX2 M ΔY M Then, in step S7, the position X1 of the substrate is obtained. M X2 M Y M .

[0099] Parallel to steps S3-S7, in step S8, the positions X1, X2, and Y1 of the substrate in the motion axis system are calculated using the formulas for the virtual axis and the motion axis. In steps S9 and S10, the axis position X1 of the motion axis when the substrate moves to (X1, X2, Y1) is obtained. R X2 R Y R .

[0100] In step S11, the position X1 of the substrate obtained by the substrate camera 111 is... M X2 M Y M The axis position X1 of the drive based on the motion axis R X2 R Y R The values ​​are compared to generate correction values ​​for each motion axis. Specifically, the correction value is based on the position X1 of the substrate obtained by the substrate camera 111. M X2 M Y M The axis position X1 of the drive based on the motion axis R X2 R Y R The difference is used to obtain the correction value.

[0101] In step S12, the measurement position VX is changed. M VY M VR M Repeat steps S1 to S12.

[0102] Next, refer to Figures 11-13 The details of the processing of the correction value acquisition based on the control unit 7 are explained.

[0103] (Correction value mapping generation process)

[0104] First, refer to Figure 11 The correction value mapping generation process based on the control of the control unit 7 will be explained.

[0105] exist Figure 11 In step S21, the measurement begins. In step S22, the substrate clamp 221 (substrate 200) is moved to the initial position. That is, the substrate clamp 221 (substrate 200) is moved to the initial position of the virtual axis system (Vx, Vy, Vr) = (0, 0, 0).

[0106] In step S23, the position of the motion axis (X1) at the initial position is recorded. F X2 F Y1 FIn step S24, the reference mark 2 at the initial position is identified by the image captured by the substrate camera 111.

[0107] In step S25, the substrate clamp 221 (substrate 200) is moved to the measurement position (VX). M VY M VR M In step S26, the position of the motion axis (X1) at the measurement location is recorded. M X2 M Y1 M ).

[0108] In step S27, reference mark 2 at the measurement location is identified by capturing images with the substrate camera 111. In step S28, the measurement location VX is changed. M VY M VR M Repeat steps S21 to S28. In step S29, calculations are performed. After that, the correction value mapping generation process ends.

[0109] (Calculation and processing)

[0110] Next, refer to Figure 12 ,right Figure 11 The calculation process of step S29 will be explained.

[0111] In step S291, calculations for each measurement position begin. In step S292, based on the positional displacement of reference mark 2, the displacement (ΔVX) of the substrate clamp 221 (substrate 200) is calculated. R ΔVY R ΔVR R ).

[0112] In step S293, the displacement of the substrate clamp 221 (substrate 200) is converted into an action axis displacement (ΔX1). R ΔX2 R ΔY R In step S294, the axis positions of the motion axes (X1, X2, Y1) are calculated. That is, X1 passes through X1... R =X1 F +ΔX1 R To calculate. Additionally, X2 is calculated using X2. R =X2 F +ΔX2 R To calculate. Additionally, Y1 is obtained through Y R =Y F +ΔY R To calculate.

[0113] In step S295, the linearity of each motion axis is calculated. That is, the linearity of the X1 axis through X1 M -X1 R Calculation. Additionally, the X2 axis passes through X2. M -X2 R Calculation. Additionally, the Y1 axis passes through the Y... M -Y R Calculation. In step S296, the measurement positions are changed until the calculation processing of all measurement positions is completed, and the processing of steps S291 to S296 is repeated.

[0114] In step S297, the correction value is generated. Afterwards, the calculation process ends.

[0115] (Processing to generate correction values)

[0116] Next, refer to Figure 13 ,right Figure 12 The step S297, which involves generating a correction value, will be explained.

[0117] In step S2971, the linearity results of each motion axis are approximated using theoretical formulas. In step S2972, the correction value for the position of each motion axis is generated.

[0118] In step S2973, the correction amount for the position of the motion axis is calculated based on the linearity of the measurement results. In step S2974, the position of the motion axis is changed until the correction value generation process for all motion axis positions is completed, and steps S2972 to S2974 are repeated.

[0119] In step S2975, a correction value mapping is generated for each motion axis, storing correction values ​​for the motion axis position (see reference). Figure 9 After that, the correction value generation process ends.

[0120] In the first embodiment, the following effects can be obtained.

[0121] In the first embodiment, as described above, the control unit 7 moves the substrate clamp 221 (substrate 200) based on the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr), and obtains correction values ​​for the motion axis values ​​of the motion axis system (X1, X2, Y) based on the measurement results obtained by measuring the movement state of the substrate clamp 221 (substrate 200) through the substrate camera 111. Therefore, when working on the substrate 200, the correction values ​​can be used to correct the motion axis values ​​of the motion axis system, thus enabling high-precision adjustment of the substrate 200's position even without performing more than two adjustment operations. As a result, when working on the substrate 200, the time required to adjust the position of the substrate 200 can be prevented from becoming excessive. Furthermore, when the base plate clamp 221 (base plate 200) is moved by the horizontal moving mechanism 23 to control the motion axis values ​​of the motion axis system based on virtual axis values ​​of a system different from the motion axis system, even if errors occur in the movement of the motion axis system based on the virtual axis system, correction values ​​can be used to correct these errors, allowing the base plate 200 to be moved to the desired position with high precision. That is, when controlling the motion axis values ​​of the motion axis system relative to the virtual axis values ​​of the virtual axis system, even if the errors in the virtual axis system increase due to mechanical errors in the motion axis system, the motion axis values ​​are corrected by correction values, thus enabling high-precision movement of the workpiece mounting portion relative to the virtual axis values ​​in the virtual axis system. Additionally, by correcting the motion axis system, it is not necessary to have correction mappings for each virtual axis system individually, thus preventing the correction process from becoming complex. Furthermore, since these are actual motion axes, approximate formulas can be generated using correction models. Furthermore, to eliminate linearity errors in the virtual axis system, corrections are made to the corresponding motion axis system. This ensures the correction effect is applied across all positions of the virtual axis system that moves via the motion axis system, enabling high-precision workpiece movement. As a result, by using a virtual axis system different from the motion axis system, the complexity of correction processing when moving the workpiece with high precision via the motion axis system can be suppressed. Additionally, in systems where multiple virtual axes are used for commanded actions, corrections are made for the motion axis values ​​rather than the virtual axis values, thus requiring only correction of the movement direction of the motion axis. In other words, when moving via virtual axes (VX, VY, VR), the error of the VR axis correction value relative to the VR axis command value varies depending on the positions of VX and VY, necessitating the generation of a three-dimensional correction mapping for VX, VY, and VR. Moreover, when correcting the motion axes (X1, X2, Y), corrections can be made using only correction values ​​for each axis, preventing the correction process from becoming complex.

[0122] Furthermore, in the first embodiment, as described above, the control unit 7 determines the motion axis value based on the virtual axis value of the virtual axis system and the obtained correction value, and moves the substrate clamp 221 (substrate 200) via the horizontal movement mechanism 23. Thus, by taking the correction value into account when determining the motion axis value for the virtual axis value, and moving the substrate clamp 221 (substrate 200) via the motion axis system, the substrate 200 can be moved with high precision to the desired position in the virtual axis system via the motion axis system.

[0123] Furthermore, in the first embodiment, as described above, the control unit 7 moves the substrate clamp 221 (substrate 200) to multiple positions based on multiple virtual axis values, and obtains correction values ​​for the motion axis values ​​of the motion axis system at each of the multiple positions based on measurement results obtained by the substrate camera 111 measuring the movement state of the substrate clamp 221 (substrate 200) at the multiple positions. Therefore, appropriate correction values ​​corresponding to the multiple positions of the motion axis system can be obtained, and thus the substrate 200 can be moved with high precision at the multiple positions of the motion axis system.

[0124] Furthermore, in the first embodiment, as described above, the control unit 7 obtains correction values ​​for the motion axis values ​​of the motion axis system at multiple positions and generates a correction value map having multiple correction values ​​corresponding to the positions of the motion axes. Therefore, by pre-generating the correction value map, the motion axis values ​​of the motion axis system can be easily corrected based on the correction value map, and the substrate 200 can be moved.

[0125] Furthermore, in the first embodiment, as described above, the control unit 7 obtains the correction value in the motion axis corresponding to the virtual axis value through interpolation based on the correction value mapping, determines the motion axis value, and moves the substrate clamp 221 (substrate 200) via the horizontal movement mechanism 23. Therefore, the correction value can be obtained from the correction value mapping through interpolation, thus eliminating the need to obtain correction values ​​for all motion axis values ​​in the motion axis system. As a result, it is possible to suppress situations where the processing of generating the correction value mapping becomes complex. Additionally, through interpolation from the correction value mapping, the correction value for the motion axis value when moving the substrate 200 can be easily obtained.

[0126] Furthermore, in the first embodiment, as described above, the virtual axis system includes a first virtual axis (Vx axis) in the horizontal direction, a second virtual axis (Vy axis) orthogonal to the first virtual axis in the horizontal direction, and a third virtual axis (Vr axis) about the rotation direction in the vertical direction. The motion axis system includes a first motion axis (X1 axis) parallel to the first virtual axis in the horizontal direction, a second motion axis (X2 axis) parallel to the first motion axis in the horizontal direction, and a third motion axis (Y axis) orthogonal to the first and second motion axes in the horizontal direction. The control unit 7 moves the substrate clamp 221 (substrate 200) based on the virtual axis values ​​of the first, second, and third virtual axes of the virtual axis system, and measures the movement state of the substrate clamp 221 (substrate 200) by the substrate camera 111 to obtain correction values ​​for the motion axis values ​​of the first, second, and third motion axes of the motion axis system. Therefore, even if the error in the virtual axis system increases due to the different movement directions of the multiple virtual axes of the virtual axis system and the multiple movement directions of the movement axes of the movement axis system, the movement axis value can be corrected using the correction value. Thus, the substrate clamp 221 (substrate 200) can be moved with high precision relative to the virtual axis value in the virtual axis system.

[0127] Furthermore, in the first embodiment, as described above, a mask holding portion 5 is provided to hold a mask 300 for printing on a substrate 200, which is a workpiece placed on a substrate jig 221 (substrate 200). The control unit 7 moves the position of the substrate jig 221 (substrate 200) using virtual axis values ​​and correction values ​​of a virtual axis system, so that the position of the substrate 200 is aligned with the mask 300 held in the mask holding portion 5. Therefore, by correcting the operation axis values ​​using correction values, the substrate 200, as a workpiece, can be aligned with the mask 300 with high precision. As a result, printed materials can be printed on the substrate with high precision.

[0128] Furthermore, in the first embodiment, as described above, the substrate camera 111 is configured to capture images of the marks Ma and Mb provided on the substrate clamp 221. The control unit 7 obtains the position of the motion axis of the motion axis system based on the image capture results of the substrate camera 111. Thus, by capturing images of the marks Ma and Mb on the substrate clamp 221 using the substrate camera 111, the movement state of the substrate 200 can be easily measured.

[0129] Furthermore, in the first embodiment, as described above, during printing on the substrate 200, the substrate camera 111 photographs the substrate 200 to align its position relative to the mask 300. Therefore, the substrate camera 111, which photographs the substrate 200 for alignment relative to the mask 300, can be used to measure the movement state of the substrate 200 for obtaining correction values ​​of the motion axis, eliminating the need for additional components for measuring the movement state of the substrate 200. Consequently, the increase in the number of components is suppressed, and the complexity of the device structure is prevented.

[0130] (Second Implementation)

[0131] Next, refer to Figure 14 and Figure 15 The printing apparatus 100 according to the second embodiment of the present invention will be described below. It should be noted that the same reference numerals are used for structures that are the same as those in the first embodiment described above, and the description is omitted.

[0132] In the second embodiment, an example of the following structure will be described: while moving the substrate within a specified range, the movement state of the substrate at multiple locations is measured to obtain correction values, and correction values ​​outside the specified range are calculated by fitting an approximation formula.

[0133] like Figure 5 As shown, when the pair of conveyors 22 have descended, the substrate holding part 2 can move and rotate the gaps Da and Db in the horizontal direction by an amount. Therefore, when obtaining a correction value, the amount by which the substrate holding part 2 moves the gaps Da and Db in the horizontal direction is adjusted to obtain a correction value within a specified range.

[0134] In this embodiment, the control unit 7 controls the motion axis values ​​of the motion axis system based on the virtual axis values ​​of the virtual axis system, which is different from the motion axis system, and moves the substrate clamp 221 (substrate 200) via the horizontal movement mechanism 23. Furthermore, the control unit 7 moves the substrate clamp 221 (substrate 200) based on the virtual axis values ​​of the virtual axis system (Vx, Vy, Vr), and obtains correction values ​​for the motion axis values ​​of the motion axis system (X1, X2, Y1) based on the measurement results obtained by the substrate camera 111 measuring the movement state of the substrate clamp 221 (substrate 200).

[0135] In addition, while moving the substrate clamp 221 (substrate 200) within a specified range, the control unit 7 uses the substrate camera 111 to measure the movement state of the substrate clamp 221 (substrate 200) at multiple positions, obtains the correction value of the motion axis value of the motion axis system at multiple positions, and calculates the correction value for the motion axis value outside the specified range by fitting the multiple correction values ​​within the specified range through an approximation formula.

[0136] Specifically, control unit 7 uses trigonometric functions to generate an approximation. Therefore, periodically changing correction values ​​can be easily obtained by approximating them using trigonometric functions, which are periodic functions.

[0137] The control unit 7 generates an approximate model based on the parameters of the feed pitch of the ball screw mechanisms 231a, 232a, and 233a, and determines the coefficients of the approximate model based on the obtained multiple correction values ​​to obtain the approximate formula.

[0138] For example, control unit 7 obtains the correction value dX1 by approximating the formula dX1 = Asin(BX1 + C) + DX1 + E. It should be noted that A, B, C, D, and E are parameters, and the approximation formula is obtained by determining these parameters. Furthermore, control unit 7 obtains the correction values ​​dX2 and dY using the same approximation formula.

[0139] In the approximation of dX1 = Asin(BX1 + C) + DX1 + E, Asin(BX1 + C) is the periodic part, which varies periodically according to the feed pitch of the ball screw. A is the amplitude of the periodic function, which depends on the maximum feed error of the ball screw. B is the period of the periodic function, which depends on the feed pitch of the ball screw. For example, if the feed pitch is set to P, then B is 2π / P. C is the initial phase of the periodic function, which depends on the initial position of the ball screw.

[0140] In the approximation of dX1=Asin(BX1+C)+DX1+E, DX1+E is the cumulative error part, which is caused by the cumulative error of the ball screw.

[0141] Within the specified range of the measurement, the cumulative error is extracted from the measurement results to determine D and E. Then, the cumulative error DX1+E is subtracted from the measurement results. Based on the subtracted value, Asin(BX1+C) is approximated using the nonlinear least squares method to determine A, B, and C. Thus, correction values ​​outside the specified range can be obtained as estimates. For example, based on the measurement results within the specified range, such as... Figure 14 As shown, the linearity error (correction value) is obtained.

[0142] (Processing to generate correction values)

[0143] Next, refer to Figure 15 Regarding the structure of the second embodiment Figure 12 The step S297, which involves generating a correction value, will be explained.

[0144] In step S2971, the linearity results of each motion axis are approximated using theoretical formulas. In step S2972, the correction value for the position of each motion axis is generated.

[0145] In step S2976, it is determined whether the position is measurable. If it is a measurable position, proceed to step S2973; otherwise, proceed to step S2977. In step S2977, the correction amount for the position of the motion axis is calculated using an approximation formula.

[0146] In step S2973, the correction amount for the position of the motion axis is calculated based on the linearity of the measurement results. In step S2974, the position of the motion axis is changed until the correction value generation process for all motion axis positions is completed, and steps S2972~S2974, S2976, and S2977 are repeated.

[0147] In step S2975, a correction value mapping is generated for each motion axis, storing correction values ​​for the motion axis position (see reference). Figure 9 After that, the correction value generation process ends.

[0148] It should be noted that the other structures of the second embodiment are the same as those of the first embodiment.

[0149] In the second embodiment, the following effects can be obtained.

[0150] In the second embodiment, similar to the first embodiment, when working on the substrate 200, it is possible to suppress the time required to adjust the position of the substrate 200 from becoming longer, and to enable the substrate 200 to move with higher precision.

[0151] Furthermore, in the second embodiment, as described above, the control unit 7 moves the substrate clamp 221 (substrate 200) within a predetermined range while measuring the movement state of the substrate clamp 221 (substrate 200) at multiple locations using the substrate camera 111. It then obtains correction values ​​for the motion axis values ​​of the motion axis systems at each of the multiple locations. Based on these correction values ​​within the predetermined range, it calculates correction values ​​for motion axis values ​​outside the predetermined range using an approximate fitting method. Therefore, by measuring the movement state within the predetermined range, correction values ​​outside the predetermined range can also be calculated using an approximate fitting method, eliminating the need to measure a large number of points. Additionally, when obtaining correction values, even if movement outside the predetermined range is difficult due to device limitations, correction values ​​outside the predetermined range can be obtained through measurements within the predetermined range.

[0152] Furthermore, in the second embodiment, as described above, the control unit 7 uses trigonometric functions to generate an approximation. Therefore, periodically changing correction values ​​can be easily obtained by approximating using trigonometric functions, which are periodic functions.

[0153] Furthermore, in the first embodiment, as described above, the horizontal movement mechanism 23 includes ball screw mechanisms 231a, 232a, and 233a. The control unit 7 generates an approximate model based on parameters of the feed pitch of the ball screw mechanisms 231a, 232a, and 233a, and determines the coefficients of the approximate model based on multiple obtained correction values, thereby obtaining an approximate formula. Thus, by utilizing the correction values ​​obtained through approximation using an approximation formula incorporating the feed pitch parameters, errors in the periodic variations of the ball screw mechanisms 231a, 232a, and 233a, which convert rotary motion into linear motion, can be appropriately corrected.

[0154] Furthermore, the other effects of the second embodiment are the same as those of the first embodiment.

[0155] It should be noted that the embodiments disclosed herein are illustrative rather than restrictive in all respects. The scope of the invention is defined not by the description of the embodiments above but by the claims, and includes all modifications within the meaning and scope equivalent to the claims.

[0156] For example, the above embodiments illustrate an example of applying the present invention to a printing apparatus for printing solder on a substrate, but the invention is not limited thereto. The present invention can also be applied to devices other than printing apparatuses. For example, the present invention can also be applied to an apparatus for positioning a workpiece mounting section on which a workpiece to be worked is placed.

[0157] Furthermore, the above embodiments illustrate an example where the motion axis system includes three motion axes and the virtual axis system includes three virtual axes, but the present invention is not limited thereto. In the present invention, the motion axis system may include one, two, or more than four motion axes, and the virtual axis system may also include one, two, or more than four virtual axes. Additionally, the number of motion axes and the number of virtual axes may differ.

[0158] Furthermore, while the above embodiments illustrate an example where the workpiece being processed is a substrate, the present invention is not limited thereto. In the present invention, the workpiece being processed can also be a workpiece other than a substrate. For example, the workpiece can also be a component. Additionally, the workpiece can also be a processing object to be processed.

[0159] Furthermore, the above embodiment illustrates an example of a structure that uses a substrate camera to capture and obtain the movement state of the workpiece mounting portion when a correction value is obtained, but the present invention is not limited thereto. In the present invention, the movement state of the workpiece mounting portion can also be obtained by measuring distance using a distance measuring sensor or the like.

[0160] Furthermore, in the above embodiment, an example was shown of a structure in which the position of the motion axis of the motion axis system is obtained by photographing the mark on the workpiece mounting part using the imaging unit when obtaining the correction value; however, the present invention is not limited to this. In the present invention, the position of the motion axis of the motion axis system can also be obtained by photographing the mark provided outside the workpiece mounting part using the imaging unit. For example, the position of the motion axis of the motion axis system can also be obtained by photographing the mark provided on the substrate, fixture, etc., placed on the workpiece mounting part using the imaging unit.

[0161] Furthermore, the above embodiment illustrates an example of a structure in which a squeegee moves in both the forward and backward directions (Y direction) for printing, but the present invention is not limited thereto. In the present invention, a structure may also be provided with two squeegees: one moving forward for printing and the other moving backward for printing.

[0162] Furthermore, the above embodiments illustrate an example of printing solder onto a substrate using a contact printing method where the substrate and mask are in close contact. However, the present invention is not limited to this. In the present invention, a gap printing (non-contact printing) method can also be used, in which a gap (void) is provided between the substrate and the mask, and printing (scraping) and plate separation processes are performed simultaneously, to print solder onto the substrate.

[0163] Furthermore, the above embodiment illustrates an example of a printing apparatus with a single-channel structure having one channel for transporting the substrate in the front-to-back direction (Y direction), but the present invention is not limited thereto. In the present invention, a multi-channel structure may also be provided, where multiple channels for transporting the substrate are provided in the front-to-back direction (Y direction).

[0164] Furthermore, in the above embodiments, for ease of explanation, a process-driven flowchart that processes sequentially according to the processing flow was used to describe the processing actions of the control unit, but the present invention is not limited thereto. In the present invention, the processing actions of the control unit can also be performed through event-driven (event-based) processing that executes processing on an event-by-event basis. In this case, it can be performed entirely as an event-driven process, or it can be performed by combining event-driven and process-driven processes.

[0165] Explanation of reference numerals in the attached figures

[0166] 5. Mask holding section

[0167] 7 Control Department

[0168] 23. Horizontal moving mechanism (moving part)

[0169] 100 Printing Equipment (Workpiece Handling Device)

[0170] 111 substrate camera (measurement section, imaging section)

[0171] 200 substrate (workpiece)

[0172] 221 Substrate clamp (workpiece mounting section)

[0173] 231a, 232a, 233a ball screw mechanisms

[0174] 300 mask.

Claims

1. A workpiece operating device, comprising: Workpiece placement section, for placing workpieces; The moving part moves the workpiece mounting part through a motion shaft system that includes one or more motion shafts; The control unit, based on the virtual axis values ​​of a virtual axis system including virtual axes, controls the motion axis values ​​of the motion axis system, and moves the workpiece mounting unit via the moving unit. The virtual axis system is a system different from the motion axis system. The measuring unit measures the movement state of the workpiece mounting unit implemented by the moving unit. The control unit moves the workpiece mounting part based on the virtual axis value of the virtual axis system, and obtains a correction value of the motion axis value of the motion axis system based on the measurement result obtained by the measurement unit measuring the movement state of the workpiece mounting part.

2. The workpiece operating device according to claim 1, wherein, The control unit determines the motion axis value based on the virtual axis value of the virtual axis system and the obtained correction value, and moves the workpiece mounting unit through the moving unit.

3. The workpiece operating device according to claim 1, wherein, The control unit moves the workpiece mounting unit to multiple positions based on multiple virtual axis values, and obtains correction values ​​for the motion axis values ​​of the motion axis system at multiple positions based on measurement results obtained by the measurement unit measuring the movement state of the workpiece mounting unit at multiple positions.

4. The workpiece operating device according to claim 3, wherein, The control unit obtains the correction values ​​of the motion axis values ​​of the motion axis system at multiple positions, and generates a correction value mapping having multiple correction values ​​corresponding to the positions of the motion axes.

5. The workpiece operating device according to claim 4, wherein, The control unit obtains the correction value in the motion axis corresponding to the virtual axis value by interpolation based on the correction value mapping, determines the motion axis value, and moves the workpiece loading unit by the moving unit.

6. The workpiece operating device according to claim 1, wherein, The virtual axis system includes a first virtual axis in the horizontal direction, a second virtual axis in the horizontal direction orthogonal to the first virtual axis, and a third virtual axis about the rotation direction in the vertical direction. The motion axis system includes a first motion axis in a horizontal direction parallel to the first virtual axis, a second motion axis in a horizontal direction parallel to the first motion axis, and a third motion axis in a horizontal direction orthogonal to the first motion axis and the second motion axis. The control unit moves the workpiece mounting unit based on the virtual axis values ​​of the first, second, and third virtual axes of the virtual axis system, and measures the movement state of the workpiece mounting unit by the measuring unit to obtain the correction value of the motion axis values ​​of the first, second, and third motion axes of the motion axis system.

7. The workpiece operating device according to claim 1, wherein, The workpiece operating device further includes a mask holding section, which holds a mask for printing on a substrate, which is a workpiece, placed on the workpiece mounting section. The control unit moves the position of the workpiece mounting part by using the virtual axis value of the virtual axis system and the correction value, so that the position of the substrate is aligned with the mask held in the mask holding part.

8. The workpiece operating device according to claim 7, wherein, The measuring unit includes a photographing unit for photographing the marks provided on the workpiece mounting unit. The control unit obtains the position of the motion axis of the motion axis system based on the shooting results of the shooting unit.

9. The workpiece operating device according to claim 8, wherein, During printing on the substrate, the imaging unit photographs the substrate to align its position relative to the mask.

10. The workpiece operating device according to claim 1, wherein, While moving the workpiece mounting part within a specified range, the control unit measures the movement state of the workpiece mounting part at multiple positions using the measuring unit, obtains correction values ​​for the motion axis values ​​of the motion axis system at multiple positions, and calculates correction values ​​for the motion axis values ​​outside the specified range by fitting an approximation formula based on the multiple correction values ​​within the specified range.

11. The workpiece operating device according to claim 10, wherein, The control unit uses trigonometric functions to generate the approximation.

12. The workpiece operating device according to claim 11, wherein, The moving part includes a ball screw mechanism. The control unit generates the approximate model based on parameters including the feed pitch of the ball screw mechanism, and determines the coefficients of the approximate model based on the obtained multiple correction values, thereby obtaining the approximate formula.

13. A method for moving a workpiece, comprising the following steps: Based on the virtual axis values ​​of a virtual axis system that includes virtual axes, the motion axis values ​​of the motion axis system are controlled to move the workpiece mounting part that holds the workpiece. The virtual axis system is a different system from a motion axis system that includes more than one motion axis. Measure the movement state of the workpiece mounting section; and Based on the virtual axis value of the virtual axis system, the workpiece mounting part is moved, and based on the measurement result obtained by measuring the movement state of the workpiece mounting part, the correction value of the motion axis value of the motion axis system is obtained.

Images