Power conversion device

Abstract

A power conversion device includes a semiconductor module (12U, 12V, 12W), a first electrical component (20), a second electrical component (70), a housing (160), and a cooler (240). The semiconductor module has a signal terminal (11D) connected to a substrate (15). The housing has a bottom (171). A first arrangement portion (177) has the semiconductor module arranged on an inner bottom surface side and the second electrical component arranged on an outer bottom surface side. A second arrangement portion (173) is provided at a position farther from the substrate than the first arrangement portion and has the first electrical component arranged on the inner bottom surface side. The first arrangement portion internally includes a second flow path (204) on the semiconductor module side, a third flow path (207) on the second electrical component side, and a wall (211) that separates them. The semiconductor module is sandwiched between the cooler and the first arrangement portion.

Description

[0001] Mutual citation of related applications

[0002] This application is based on Japanese Patent Application No. 2023-191819, filed on November 9, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The disclosure described in this specification relates to power conversion devices. Background Technology

[0004] The power conversion device described in Patent Document 1 includes a switch, a smoothing capacitor, a noise filter, a control board, a cooler, and a housing that houses them.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2022-107381 Summary of the Invention

[0008] The switching unit is housed within the casing between the bottom wall and the control substrate. The gate terminal of the switching unit extends to and connects to the control substrate. The semiconductor module contained within the switching unit is held in place by a cooler and cooled by refrigerant flowing within the cooler. Furthermore, a cooling path for refrigerant flow is formed in the bottom wall. A capacitor is disposed on the inner bottom surface of the bottom wall, and a noise filter is disposed on the outer bottom surface of the bottom wall. The capacitor and the noise filter are cooled by refrigerant flowing in the cooling path.

[0009] If the semiconductor module of Patent Document 1 is placed on the bottom wall and cooling is attempted without a cooler, the gate terminal becomes longer. This can lead to poor connection between the gate terminal and the control substrate due to vibration or other factors. In the structure of Patent Document 1, it is difficult to efficiently dissipate heat from the semiconductor module, capacitors, and noise filter to the bottom while maintaining a good connection between the gate terminal and the control substrate.

[0010] The purpose of this disclosure is to provide a power conversion device that can efficiently dissipate heat to the bottom of multiple electrical components containing the semiconductor module while maintaining a good connection between the semiconductor module and the substrate.

[0011] One aspect of the power conversion device disclosed herein includes: A semiconductor module having a thickness in one direction and having signal terminals extending in one direction and connected to a substrate; The first electrical component is electrically connected to the semiconductor module; A conductive component that connects the battery and the first electrical component; The second electrical component is electrically or magnetically connected to the conductive component; A housing having a bottom that is thermally connected to a semiconductor module, a first electrical component, and a second electrical component, the bottom including an inner bottom surface facing a substrate and an outer bottom surface located on the back side of the inner bottom surface; and The cooler includes a first flow path for cooling the semiconductor module. The bottom has: The first configuration section has a semiconductor module disposed on the inner bottom surface and a second electrical component disposed on the outer bottom surface. The second configuration section is located further away from the substrate in one direction than the first configuration section, and a first electrical component is disposed on its inner bottom surface side; and The connecting part connects the first configuration part and the second configuration part. The first configuration section internally includes: A second flow path is provided on the semiconductor module side; a third flow path is provided on the second electrical component side; and a wall separating the second flow path and the third flow path. The semiconductor module is sandwiched between the cooler and the first configuration section.

[0012] The semiconductor module dissipates heat to the cooler and the first mounting section. The first electrical component dissipates heat to the second mounting section. The second electrical component dissipates heat to the first mounting section. Furthermore, since the semiconductor module is positioned near the substrate when mounted in the first mounting section, the connection between the signal terminals and the substrate can be well maintained relative to vibrations. This allows for efficient cooling of the multiple electrical components, including the semiconductor module, at the bottom while maintaining a good connection between the signal terminals and the substrate.

[0013] Furthermore, the reference numbers in parentheses in the appended claims only indicate the correspondence between the structures described in the following embodiments and do not limit the scope of the technology. Attached Figure Description

[0014] Figure 1 It is an electrical circuit diagram illustrating the vehicle's onboard system.

[0015] Figure 2 This is a top view of the power conversion device as seen from the side of the cover.

[0016] Figure 3 From Figure 2 Top view after removing the cover, substrate, and support.

[0017] Figure 4 This is a top view of the main body as seen from the side of the cover.

[0018] Figure 5 It is along Figure 2 A cross-sectional view of the VV line.

[0019] Figure 6 This is a top view of the first forming part as seen from the side of the cover.

[0020] Figure 7 This is a top view of the first forming part as seen from the side of the planar part.

[0021] Figure 8 It is along Figure 2 A cross-sectional view of line VIII-VIII.

[0022] Figure 9 This is a cross-sectional view of the second embodiment. Detailed Implementation

[0023] The following description, with reference to the accompanying drawings, illustrates various methods for implementing this disclosure. In each method, the same reference numerals are sometimes used for portions corresponding to matters described in prior methods, and repeated descriptions are omitted. In each method, where only a portion of the structure is described, other previously described methods can be referenced and applied to the remaining parts of the structure.

[0024] Not only can the parts that are explicitly combinable in each embodiment be combined with each other, but even if not explicitly stated, embodiments, embodiments and variations, and variations can be partially combined with each other, as long as there is no obstacle to the combination.

[0025] (First Implementation)

[0026] <In-vehicle System>

[0027] first, Figure 1 This is an electrical circuit diagram illustrating vehicle system 1. Vehicle system 1 constitutes a system for electric vehicles. Vehicle system 1 includes a battery 2 and an electromechanical unit. The electromechanical unit includes a power conversion device 10 and an electric motor 4.

[0028] Additionally, the vehicle system 1 has multiple ECUs (not shown). These ECUs communicate with each other via bus wiring. The multiple ECUs collaboratively control the electric vehicle. Through the control of these multiple ECUs, the drive operation and regeneration of the electric motor 4, corresponding to the state of charge (SOC) of the battery 2, are controlled.

[0029] In addition, the ECU has at least one processing unit (CPU) and at least one storage device (MMR) as a storage medium for storing programs and data. The ECU is provided by a microcomputer equipped with a storage medium readable by a computer and processor. The storage medium is a non-transitory tangible storage medium that non-temporarily stores programs readable by a computer and processor. The storage medium may be provided by semiconductor memory or a magnetic disk, etc. The constituent elements of the vehicle system 1 are described below.

[0030] Battery 2 has multiple secondary batteries. These multiple secondary batteries form a battery pack connected in series. The state of charge (SOC) of this battery pack is equivalent to that of battery 2. Lithium-ion secondary batteries, nickel-metal hydride secondary batteries, and organic radical batteries can be used as secondary batteries.

[0031] The power conversion device 10 performs power conversion between the battery 2 and the motor 4. The power conversion device 10 converts the DC power from the battery 2 into AC power. The power conversion device 10 also converts the AC power generated by the electric motor 4 (regeneration) into DC power.

[0032] The electric motor 4 is connected to the output shaft of an electric vehicle (not shown). The rotational energy of the electric motor 4 is transmitted to the driving wheels of the electric vehicle via the output shaft. Conversely, the rotational energy of the driving wheels is transmitted to the electric motor 4 via the output shaft. The electric motor 4 is driven by alternating current (AC) power supplied from the power conversion device 10. This applies propulsive force to the driving wheels. The electric motor 4 regenerates the rotational energy transmitted from the driving wheels. The AC power generated through this regeneration is converted into direct current (DC) power by the power conversion device 10. This DC power is supplied to the battery 2. Additionally, the DC power is also supplied to various electrical loads installed on the electric vehicle.

[0033] <Power Conversion Device>

[0034] Next, the power conversion device 10 will be described. The power conversion device 10 of this embodiment includes the components of an inverter 11. In addition to the components of the inverter 11, the power conversion device 10 may also include the components of a converter. Figure 2 This is a top view of the power conversion device 10 as seen from the 190-degree side of the cover. Figure 3 From Figure 2 Top view after removing cover 190, control board 15 and bracket 180. Figure 4 This is a top view of the main body 170 as seen from the side of the cover 190. Figure 5 It is along Figure 2 A cross-sectional view of the VV line power conversion device 10. Figure 6 This is a top view of the first forming part 184 as seen from the side of the cover 190. Figure 7 This is a top view of the first forming part 184 as seen from the side of the planar part 185. Figure 8 It is along Figure 2 A sectional view along line VIII-VIII. Additionally, in Figure 3 In the middle, in with Figure 2 The cutting lines are marked at the same locations.

[0035] As part of the wiring, the power conversion device 10 includes a high-potential side bus 110 and a low-potential side bus 120. The high-potential side bus 110 is electrically connected to the positive terminal of the battery 2. The low-potential side bus 120 is electrically connected to the negative terminal of the battery 2. Additionally, the power conversion device 10 includes a U-phase bus 130U, a V-phase bus 130V, and a W-phase bus 130W connected to the motor 4. The U-phase bus 130U, V-phase bus 130V, and W-phase bus 130W are sometimes collectively referred to as the connecting bus 130.

[0036] In addition to the wiring described above, the power conversion device 10 also includes an inverter 11, a control board 15, a smoothing capacitor 20, a noise filter 70, a heat sink 80, a motor connector 140, a terminal block 150, and a housing 160 for housing them. The noise filter 70 includes a Y capacitor 30 and a magnetic core 60. Although not shown, the power conversion device 10 may also include a current sensor, etc. Furthermore, the noise filter 70 may only include one of the Y capacitor 30 and the magnetic core 60. The smoothing capacitor 20 is sometimes referred to as the first electrical component. The noise filter 70 is sometimes referred to as the second electrical component. The control board 15 is sometimes simply referred to as the board.

[0037] An inverter 11, a smoothing capacitor 20, and a noise filter 70 are connected in parallel at the high-potential side bus 110 and the low-potential side bus 120. The high-potential side bus 110 has a first high-potential side connection 111, a second high-potential side connection 112, and a third high-potential side connection 113. The three high-potential side connections 111, 112, and 113 are connected sequentially. Similarly, the low-potential side bus 120 has a first low-potential side connection 121, a second low-potential side connection 122, and a third low-potential side connection 123. The low-potential side connections 121, 122, and 123 are connected sequentially.

[0038] The high-potential side first connection 111 and the low-potential side first connection 121 are sometimes collectively referred to as first connection 111, 121. The high-potential side second connection 112 and the low-potential side second connection 122 are sometimes collectively referred to as second connection 112, 122. The high-potential side third connection 113 and the low-potential side third connection 123 are sometimes collectively referred to as third connection 113, 123. The battery 2 and the noise filter 70 are connected via the first connection 111, 121. The noise filter 70 and the smoothing capacitor 20 are connected via the second connection 112, 122. The smoothing capacitor 20 and the inverter 11 are connected via the third connection 113, 123. The battery 2 and the smoothing capacitor 20 are electrically connected via the first connection 111, 121, the noise filter 70, and the second connection 112, 122. The first connection 111, 121 and the second connection 112, 122 are sometimes referred to as conductive members.

[0039] In this embodiment, specifically regarding the first connecting portions 111 and 121, the battery 2 and the Y capacitor 30 (described later) are connected via the first connecting portions 111 and 121. The magnetic core 60 (described later) surrounds the first connecting portions 111 and 121 in a ring shape. Specifically regarding the second connecting portions 112 and 122, the Y capacitor 30 and the smoothing capacitor 20 are connected via the second connecting portions 112 and 122. Furthermore, the location of the magnetic core 60 is not limited to the first connecting portions 111 and 121. As another example, the magnetic core 60 may also be located at the second connecting portions 112 and 122.

[0040] Inverter 11 has three-phase semiconductor modules 12U, 12V, and 12W. The three-phase semiconductor modules 12U, 12V, and 12W refer to the U-phase semiconductor module 12U, the V-phase semiconductor module 12V, and the W-phase semiconductor module 12W. The U-phase semiconductor module 12U is electrically connected to the U-phase winding of the motor 4 via the U-phase bus 130U. Similarly, the V-phase semiconductor module 12V and the W-phase semiconductor module 12W are also electrically connected to the windings of the corresponding motor 4 via their respective connecting buses 130.

[0041] Semiconductor modules 12U, 12V, and 12W each have two switching elements 13 and a diode 13A. The two switching elements 13 are connected in series between the high-potential side bus 110 and the low-potential side bus 120. A high-potential side input terminal 11A, connected to the high-potential side bus 110, is connected to the collector of one of the two switching elements 13 located on the high-potential side. A low-potential side input terminal 11B, connected to the low-potential side bus 120, is connected to the emitter of one of the two switching elements 13 located on the low-potential side. The anode of diode 13A is connected to the emitter of the corresponding switching element 13. The cathode of diode 13A is connected to the collector of the corresponding switching element 13.

[0042] Motor terminals 11C, which are connected to motor 4, are connected to the emitter of the high-potential side switching element 13 and the collector of the N-side switching element 13. Multiple switching elements 13 convert the DC power supplied from the battery 2 into AC power capable of driving motor 4. The converted power is then supplied to motor 4 via connecting bus 130.

[0043] Additionally, both switching elements 13 have signal terminals 11D that are electrically connected to the control board 15. The signal terminals 11D are connected to the gate electrode of the switching elements 13. On / off signals for the switching elements 13 are input from the control board 15 via the signal terminals 11D. Hereinafter, the high-potential side input terminal 11A, the low-potential side input terminal 11B, the motor terminal 11C, and the signal terminal 11D are sometimes collectively referred to as terminals 11A, 11B, 11C, and 11D.

[0044] In addition to the previously described switching element 13, diode 13A, and terminals 11A, 11B, 11C, and 11D, semiconductor modules 12U, 12V, and 12W also have a sealing member 14 that seals them. The sealing member 14 is primarily formed of resin. The sealing member 14 houses all of the switching element 13, all of the diodes 13A, and a portion of the terminals 11A, 11B, 11C, and 11D. The remaining portions of terminals 11A, 11B, 11C, and 11D are exposed from the sealing member 14. The mechanical structure of semiconductor modules 12U, 12V, and 12W will be described in detail later.

[0045] The control board 15 controls the on / off state of multiple switching elements 13. A control circuit for controlling the on / off state of the multiple switching elements 13 is mounted on the control board 15. Alternatively, the aforementioned ECU may also be mounted on the control board 15. The signal terminals 11D of the multiple switching elements 13 extend toward the control board 15. The signal terminals 11D of the multiple switching elements 13 are inserted into the control board 15 and soldered together.

[0046] The smoothing capacitor 20 primarily smooths the DC voltage supplied from the battery 2. The smoothing capacitor 20 includes a capacitor element 21, a capacitor housing 22, and a sealing resin 23. The capacitor element 21 and the sealing resin 23 are housed inside the capacitor housing 22. The capacitor element 21 is fixed to the inner surface of the capacitor housing 22 by the sealing resin 23. As an example, the capacitor element 21 is a film capacitor. A film capacitor is formed by placing metal vapor-deposited electrodes on a dielectric film and winding the dielectric film with the metal vapor-deposited electrodes facing each other. Metal-sprayed electrodes are formed by spraying metal onto both ends of the film capacitor. The metal vapor-deposited electrodes are electrically connected to one of the metal-sprayed electrodes.

[0047] The capacitor element 21 is a three-dimensional shape with a certain volume. The capacitor element 21 is sometimes provided in a three-dimensional shape such as a cylinder or elliptical cylinder. The capacitor element 21 has at least two end faces 24 and 25 and a side face 26. One end face of the capacitor element 21 is referred to as the first end face 24. A metal-plated electrode is provided on the first end face 24. The metal-plated electrode provided on the first end face 24 is connected to a first terminal 24A and a second terminal 24B. The other end face of the capacitor element 21 is referred to as the second end face 25. A metal-plated electrode is provided on the second end face 25. The metal-plated electrode provided on the second end face 25 is connected to a third terminal 25A and a fourth terminal 25B.

[0048] The second connection portion 112 on the high-potential side is connected to the first terminal 24A. The third connection portion 113 on the high-potential side is connected to the second terminal 24B. The second connection portion 122 on the low-potential side is connected to the third terminal 25A. The third connection portion 123 on the low-potential side is connected to the fourth terminal 25B. The capacitor element 21 and a portion of the first terminals 24A to the fourth terminals 25B are sealed with sealing resin 23, while the remaining portions of the first terminals 24A to the fourth terminals 25B are exposed from the sealing resin 23.

[0049] The noise filter 70 includes a Y capacitor 30 and a magnetic core 60. The Y capacitor 30 removes noise components caused by the current flowing in the first connections 111, 121 and the second connections 112, 122. The Y capacitor 30 has two capacitor elements 31, 32, two capacitor buses 41, 42, and a ground bus 50. One of the two capacitor elements 31, 32 on the high-potential side bus 110 is sometimes referred to as the high-potential side capacitor element 31. The one of the two capacitor elements 31, 32 on the low-potential side bus 120 is sometimes referred to as the low-potential side capacitor element 32.

[0050] Of the two capacitor buses 41 and 42, the one connected to the high-potential side capacitor element 31 is sometimes referred to as the high-potential side capacitor bus 41. The high-potential side capacitor element 31 is electrically connected to the high-potential side bus 110 via the high-potential side capacitor bus 41. Of the two capacitor buses 41 and 42, the one connected to the low-potential side capacitor element 32 is sometimes referred to as the low-potential side capacitor bus 42. The low-potential side capacitor element 32 is electrically connected to the low-potential side bus 120 via the low-potential side capacitor bus 42.

[0051] The ground bus 50 has: a high-potential-side GND terminal connected to the high-potential-side capacitor element 31; a low-potential-side GND terminal connected to the low-potential-side capacitor element 32; and a GND connection terminal connected to ground via the housing 160. The ground bus 50 extends in a manner that connects the high-potential-side GND terminal, the low-potential-side GND terminal, and the GND connection terminal. The ground bus 50 is connected to the capacitor elements 31 and 32 and is electrically connected to ground. The capacitor elements 31 and 32 are removed from the inverter 11 by allowing the aforementioned noise components to flow to the vehicle body ground via the ground bus 50.

[0052] The magnetic core 60 removes noise components caused by the current flowing through the first connection portions 111 and 121. The main material of the magnetic core 60 includes ferrite, electromagnetic steel sheet, and amorphous materials. The magnetic material is sealed by an insulating member to form the magnetic core 60. For example, the magnetic core 60 is formed in a ring shape. The high-potential side first connection portion 111 and the low-potential side first connection portion 121 pass through a hole surrounded by the magnetic core 60. Therefore, the magnetic core 60 can remove noise components caused by the current flowing through the first connection portions 111 and 121.

[0053] The heat dissipation component 80 is a heat sink, gap filler, or thermal grease. The heat dissipation component 80 has a higher thermal conductivity than air. The heat dissipation component 80 is insulating. The heat dissipation component 80 is disposed between the smoothing capacitor 20 and the lower base 173 (described later), between the smoothing capacitor 20 and the connecting portion 175 (described later), and between the noise filter 70 and the upper base 174 (described later). This efficiently dissipates heat from the smoothing capacitor 20 and the noise filter 70 to the bottom 171 (described later). The smoothing capacitor 20 and the lower base 173, the smoothing capacitor 20 and the connecting portion 175, and the noise filter 70 and the upper base 174 are in close contact via the heat dissipation component 80. The noise filter 70 is thermally connected to the upper base 174. The smoothing capacitor 20 is thermally connected to the lower base 173 and the connecting portion 175. Alternatively, the heat dissipation component 80 may not be disposed in all three locations. It is sufficient to be disposed in at least one of the three locations.

[0054] <Mechanical Structure of Power Conversion Device>

[0055] Hereinafter, the thickness direction of the bottom 171 of the housing 160 is defined as the Z direction, and a direction orthogonal to the Z direction is defined as the X direction. The Z direction is sometimes referred to as a direction. The X direction is sometimes referred to as the alignment direction. A direction orthogonal to both the Z and X directions is defined as the Y direction. A direction orthogonal to the Z direction is sometimes referred to as a planar direction. Unless otherwise specified, the shape viewed from the Z direction, in other words, the shape along the XY plane defined by the X and Y directions, is defined as a planar shape. In addition, the view from the Z direction is sometimes simplified to a top view.

[0056] The housing 160 has a main body 170, a support 180, and a cover 190. The main body 170, support 180, and cover 190 are, for example, made of die-cast aluminum. The main body 170 has a box-shaped form with a bottom 171 and side walls 172. The bottom 171 and side walls 172 divide the interior into storage spaces. The support 180 is positioned at the front end of the side wall 172 to block the opening defined by the side wall 172. The cover 190 is positioned on the opposite side of the main body 170, across the support 180. The support 180 is covered by the cover 190. A space is provided between the support 180 and the cover 190.

[0057] Hereinafter, the high-potential side bus 110, the low-potential side bus 120, and the connecting bus 130 are sometimes collectively referred to as buses 110, 120, and 130. The main body 170 houses: a smoothing capacitor 20, three semiconductor modules 12U, 12V, and 12W, a portion of a terminal block 150, a portion of a motor connector 140, and portions of buses 110, 120, and 130. A noise filter 70 and the remaining portions of buses 110, 120, and 130 are disposed on the outside of the main body 170's storage space. The noise filter 70, the high-potential side bus 110, and the remaining portions of the low-potential side bus 120 are fixed to the outer bottom surface 171B, described later. The remaining portion of the connecting bus 130 extends away from the bottom 171 and connects to the motor 4. A control board 15 is disposed within the space defined between the bracket 191 and the cover 192. The control board 15 is fixed to the bracket 191. Additionally, a through hole is provided on the bracket 191 for the signal terminal 11D to pass through. The signal terminal 11D passes through the through hole and is soldered to the control board 15.

[0058] The bottom 171 of the main body 170 has an inner bottom surface 171A and an outer bottom surface 171B arranged along the Z direction. The inner bottom surface 171A is the surface facing the control substrate 15 in the Z direction. A side wall 172 rises from the inner bottom surface 171A along the Z direction. At the same time, the side wall 172 forms a ring in the circumferential direction around the Z direction. The side wall 172 has a first side wall 172A, a second side wall 172B, a third side wall 172C, and a fourth side wall 172D. The first side wall 172A and the third side wall 172C are arranged separately in the X direction. The second side wall 172B and the fourth side wall 172D are arranged separately in the Y direction. The first side wall 172A to the fourth side wall 172D are arranged clockwise in the order of first side wall 172A, second side wall 172B, third side wall 172C, and fourth side wall 172D. The area that overlaps with the projection area of ​​the inner circumferential surface of the side wall 172 and the inner bottom surface 171A of the bottom 171 in the Z direction is equivalent to the storage space of the main body 170.

[0059] The bottom 171 has a lower bottom 173 and an upper bottom 174 with different positions of their outer bottom surfaces 171B. The outer bottom surface 171B of the upper bottom 174 is positioned closer to the control substrate 15 than the outer bottom surface 171B of the lower bottom 173. The inner bottom surface 171A of the lower bottom 173 is farther away from the control substrate 15 in the Z direction than the outer bottom surface 171B of the upper bottom 174. Furthermore, the bottom 171 has a connecting portion 175 that connects the lower bottom 173 and the upper bottom 174. The lower bottom 173 and the upper bottom 174 are integrally connected via the connecting portion 175. The lower bottom 173 is sometimes referred to as a second configuration portion. The connecting portion 175 may extend in the Z direction or not. The connecting portion 175 can extend in any direction as long as it connects the lower bottom 173 and the upper bottom 174.

[0060] Viewed from above, the upper base 174 extends in a roughly L-shape, surrounding the lower base 173. The space surrounded by the lower base 173 and the connecting portion 175 is a recess 176 that is recessed from the upper base 174. A smoothing capacitor 20 is housed in this recess 176. The upper base 174 has a flow path forming portion 177 and a continuous portion 178 that extends continuously from the flow path forming portion 177 in the planar direction. Viewed from above, the recess 176 is located at the corner between the third side wall 172C and the fourth side wall 172D at the bottom 171. The flow path forming portion 177 is provided on the upper base 174 adjacent to the recess 176 in the X direction. The flow path forming portion 177 is sometimes referred to as the first placement portion.

[0061] Viewed from above, the continuous portion 178 extends in a roughly L-shape, surrounding the recess 176 and the flow path forming portion 177. Three holes 181, 182, and 183 are provided in the continuous portion 178, penetrating the inner bottom surface 171A and the outer bottom surface 171B. The three holes 181, 182, and 183 are a busbar insertion hole 181, a motor connector mounting hole 182, and a terminal block mounting hole 183. The busbar insertion hole 181 is parallel to the recess 176 in the Y-direction. The motor connector mounting hole 182 is arranged in the X-direction opposite to the recess 176 and the flow path forming portion 177. The terminal block mounting hole 183 is located at the corner between the first sidewall 172A and the second sidewall 172B. The terminal block mounting hole 183 is located in the area where the projection area of ​​the busbar insertion hole 181 in the X-direction overlaps with the projection area of ​​the motor connector mounting hole 182 in the Y-direction. The three holes 181, 182, and 183 are not formed between the semiconductor modules 12U, 12V, and 12W and the smoothing capacitor 20 in the X direction. Additionally, the busbar through-hole 181 is sometimes simply referred to as through-hole 181.

[0062] Second connecting portions 112 and 122 pass through busbar insertion holes 181. Motor connector 140 passes through motor connector mounting holes 182. Motor connector 140 has connecting busbar 130 and sealing resin sealing the connecting busbar 130. Terminal block 150 passes through terminal block mounting holes 183. Terminal block 150 has first connecting portions 111 and 121 and sealing resin sealing the first connecting portions 111 and 121. Details will be described later.

[0063] In addition to the components described above, the power conversion device 10 also includes a first connecting pipe 220, a second connecting pipe 230, and a cooler 240. The first connecting pipe 220, the second connecting pipe 230, the cooler 240, and the flow path forming section 177 are sometimes collectively referred to as the cooling module 200. Hereinafter, the cooling module 200 and the components constituting the cooling module 200 will be described in detail.

[0064] <Cooling Module>

[0065] The cooling module 200 includes a flow path forming section 177, a first connecting pipe 220, a second connecting pipe 230, and a cooler 240. As will be described in detail later, the cooler 240 has a first flow path 205. The flow path forming section 177 has a second flow path 204, a third flow path 207, a fourth flow path 202, a supply flow path 201, and a discharge flow path 208. The first connecting pipe 220 has a first connecting flow path 203. The second connecting pipe 230 has a second connecting flow path 206.

[0066] The flow path forming section 177 has a first forming section 184 and a second forming section 187. The first forming section 184 is a continuous portion made of the same material as the continuous section 178. Alternatively, the first forming section 184 and the continuous section 178 may be separate. Or, a portion of the first forming section 184 may be integral with the continuous section 178, while the remaining portion of the first forming section 184 may be separate from the continuous section 178.

[0067] The first forming portion 184 has a planar portion 185 and a structural portion 188. As an example, the planar portion 185 and the structural portion 188 are continuous using the same material. Alternatively, the planar portion 185 and the structural portion 188 may not be continuous using the same material. The planar portion 185 and the structural portion 188 can be connected via a connecting member. The planar portion 185 is a flat shape with a thin thickness in the Z direction. The planar portion 185 is continuous with the continuous portion 178 in the planar direction. The plate thickness of the planar portion 185 is the same as the plate thickness of the continuous portion 178. Alternatively, the plate thickness of the planar portion 185 and the plate thickness of the continuous portion 178 may be different. The planar portion 185 has an outer bottom surface 171B. The outer bottom surface 171B of the planar portion 185 is flush with the outer bottom surface 171B of the continuous portion 178.

[0068] The structural portion 188 is the part that forms the second flow path 204, the third flow path 207, and the fourth flow path 202 through which the refrigerant flows. The second flow path 204, the third flow path 207, and the fourth flow path 202 will be described later. The structural portion 188 has a base portion 211, a first upright portion 186A, a second upright portion 186B, a partition wall 212, a supply pipe 200A, and a discharge pipe 200B. The base portion 211 is a flat plate-shaped portion in the Z direction. The base portion 211 is located closer to the control substrate 15 in the Z direction than the planar portion 185. The base portion 211 is sometimes simply referred to as a wall. The base portion 211 is disposed separately from the planar portion 185 in the Z direction. The base portion 211 has a surface 211A facing the control substrate 15 and a back surface 211B opposite to the planar portion 185.

[0069] like Figure 5 and Figure 8As shown, the first upright portion 186A is connected to the surface 211A. The first upright portion 186A extends along the Z direction away from the surface 211A. The first upright portion 186A extends in a ring shape around an axis along the Z direction. The base portion 211 and the first upright portion 186A divide a space where refrigerant can flow. A second forming portion 187 is provided at the front end of the first upright portion 186A.

[0070] The second forming portion 187 is a flat shape with a thin thickness in the Z direction. The second forming portion 187 is provided at the front end of the first upright portion 186A to block the opening defined by the first upright portion 186. The second forming portion 187 closes the space defined by the base portion 211 and the first upright portion 186A. The base portion 211, the first upright portion 186A, and the second forming portion 187 define a second flow path 204 through which refrigerant can flow.

[0071] The second forming portion 187 has an inner bottom surface 171A facing the control substrate 15. The inner bottom surface 171A of the continuous portion 178 and the inner bottom surface 171A of the second forming portion 187 are positioned differently in the Z direction. The inner bottom surface 171A of the second forming portion 187 is located further away from the outer bottom surface 171B of the upper bottom 174 than the inner bottom surface 171A of the continuous portion 178. The inner bottom surface 171A of the second forming portion 187 is located closer to the control substrate 15 than the inner bottom surface 171A of the continuous portion 178. In addition, the second forming portion 187 has a main surface 187A facing the base portion 211. A plurality of protrusions 189 extending away from the first main surface 187A are provided on the first main surface 187A. The protrusions 189 are sometimes referred to as fins. The protrusions 189 are in contact with the refrigerant, thereby allowing the second forming portion 187 to be cooled efficiently. Alternatively, the protrusion 189 may not be formed in the second forming part 187.

[0072] like Figure 6 As shown, the first erected portion 186A is included within the projection area of ​​the base portion 211 in the Z direction. The first erected portion 186A is positioned closer to the center side than the edge of the base portion 211. Particularly in the Y direction, the first erected portion 186A is positioned significantly closer to the center side than the edge of the base portion 211. In the base portion 211, a first through hole 213 is formed between the edge at one end in the Y direction and the first erected portion 186A, penetrating the base portion 211 in the Z direction. In the base portion 211, a second through hole 214 is formed between the edge at the other end in the Y direction and the first erected portion 186A, penetrating the base portion 211 in the Z direction. Alternatively, the first through hole 213 can be described as being located at one end of the base portion 211 in the Y direction. Alternatively, the second through hole 214 can be described as being located at the other end of the base portion 211 in the Y direction.

[0073] like Figure 5 and Figure 8 As shown, the second upright portion 186B and the partition wall 212 are connected to the back surface 211B. The second upright portion 186B and the partition wall 212 extend in the Z direction away from the back surface 211B.

[0074] The inner bottom surface 171A of the second forming portion 187 and the inner bottom surface 171A of the flat portion 185 are connected by the side surface of the first upright portion 186A, the side surface of the second upright portion 186B, and the side surface of the second forming portion 187. The first upright portion 186A and the second upright portion 186B are sometimes collectively referred to as the upright portion 186. The upright portion 186 extends in the Z direction. The upright portion 186 corresponds to the side wall of the first forming portion 184.

[0075] In the upper base 174, the thickness of the continuous portion 178 in the Z direction is different from the thickness of the flow path forming portion 177 in the Z direction. The thickness of the flow path forming portion 177 is greater than the thickness of the continuous portion 178. The distance from the inner bottom surface 171A of the flow path forming portion 177 to the control substrate 15 is shorter than the distance from the inner bottom surface 171A of the continuous portion 178 to the control substrate 15.

[0076] like Figure 7 As shown, the second upright portion 186B extends annularly around an axis along the Z direction. The first through hole 213 and the second through hole 214 are surrounded by the second upright portion 186B. The base portion 211 and the second upright portion 186B divide the space where the refrigerant can flow.

[0077] Furthermore, the partition wall 212 is connected to the inner surface of the second upright portion 186B. The aforementioned space is divided by the partition wall 212 into a space overlapping with the first through hole 213 and a space overlapping with the second through hole 214. As an example, the two spaces are of different sizes. Alternatively, the two spaces may be of the same size. Additionally, the front ends of the second upright portion 186B and the front ends of the partition wall 212 face the flat portion 185.

[0078] The space overlapping the first through hole 213 and the space overlapping the second through hole 214 are closed by the planar portion 185. The space overlapping the first through hole 213 and closed by the planar portion 185 is sometimes referred to as the fourth flow path 202. The space overlapping the second through hole 214 and closed by the planar portion 185 is sometimes referred to as the third flow path 207. Refrigerant can flow in the third flow path 207 and the fourth flow path 202.

[0079] Viewed from above, a supply pipe 200A and a discharge pipe 200B are provided at one edge of the base portion 211 in the Y direction. The supply pipe 200A and the discharge pipe 200B are provided at one edge of the base portion 211 in the Y direction, crossing over the erected portion 186. Figure 6As shown, the supply pipe 200A and the discharge pipe 200B are hollow cylinders. The hollow part of the supply pipe 200A can also be referred to as the refrigerant supply path, i.e., the supply path 201. The hollow part of the discharge pipe 200B can also be referred to as the refrigerant discharge path, i.e., the discharge path 208. The supply pipe 200A and the discharge pipe 200B are arranged separately in the X direction.

[0080] A portion of the fourth flow path 202 and the third flow path 207 are arranged to overlap with the supply pipe 200A in the X direction. Viewed from above, the fourth flow path 202 is generally rectangular. The fourth flow path 202 is located at one end of the base portion 211 in the Y direction. The fourth flow path 202 is arranged adjacent to the supply pipe 200A in the X direction. The supply flow path 201 has two ends. Refrigerant is supplied from one end of the supply flow path 201. The other end of the supply flow path 201 is connected to the fourth flow path 202 in a manner that allows refrigerant to flow.

[0081] Viewed from above, the third flow path 207 is approximately Z-shaped. A portion of the third flow path 207 is located at the other end of the base portion 211 in the Y direction. The third flow path 207 includes: a first flow path piece 207A that overlaps with the supply pipe 200A in the X direction; a third flow path piece 207C that overlaps with the discharge pipe 200B in the X direction; and a second flow path piece 207B connecting them. The first flow path piece 207A and the third flow path piece 207C extend in the X direction. The second flow path piece 207B extends in the Y direction. The third flow path piece 207C is arranged adjacent to the discharge pipe 200B in the X direction. Refrigerant is discharged from one end of the discharge flow path 208. The other end of the discharge flow path 208 is connected to the third flow path piece 207C in a manner that allows refrigerant to flow.

[0082] The third flow path 207 and the fourth flow path 202 are separated by a partition 212. More specifically, the first flow path piece 207A and the fourth flow path 202 are separated in the X direction by a partition 212. The third flow path piece 207C and the fourth flow path 202 are separated in the Y direction by a partition 212. The second flow path piece 207B and the fourth flow path 202 are separated in both the X and Y directions by a partition 212.

[0083] Semiconductor modules 12U, 12V, and 12W are disposed on the inner bottom surface 171A of the second forming section 187. A cooler 240 is disposed on the opposite side of the second forming section 187, separated from the semiconductor modules 12U, 12V, and 12W. The semiconductor modules 12U, 12V, and 12W are sandwiched between the cooler 240 and the flow path forming section 177 in the Z direction. The cooler 240 is plate-shaped and has a first flow path 205 inside which refrigerant can flow.

[0084] Additionally, the first connecting pipe 220 passes through the first through hole 213. Alternatively, the first connecting pipe 220 can be described as connected to the first forming portion 184. The first connecting pipe 220 is a hollow cylinder. The first connecting pipe 220 extends along the Z direction. The hollow portion of the first connecting pipe 220 can also be referred to as the first connecting flow path 203 for refrigerant flow. The first connecting flow path 203 branches into three ends. One end of the first connecting flow path 203 is connected to the fourth flow path 202 in a manner that allows refrigerant flow. Another end of the first connecting flow path 203 is connected to the second flow path 204 in a manner that allows refrigerant flow. Yet another end of the first connecting flow path 203 is connected to the first flow path 205 in a manner that allows refrigerant flow.

[0085] The second connecting pipe 230 passes through the second through hole 214. Alternatively, the second connecting pipe 230 can be described as connected to the first forming part 184. The second connecting pipe 230 is a hollow cylinder. The second connecting pipe 230 extends in the Z direction. The hollow part of the second connecting pipe 230 can also be referred to as the second connecting flow path 206 for refrigerant flow. The second connecting flow path 206 branches into three ends. One end of the second connecting flow path 206 is connected to the third flow path 207 in a manner that allows refrigerant flow. Another end of the second connecting flow path 206 is connected to the second flow path 204 in a manner that allows refrigerant flow. Yet another end of the second connecting flow path 206 is connected to the first flow path 205 in a manner that allows refrigerant flow.

[0086] In the cooling module 200, the refrigerant first flows from the supply flow path 201 to the fourth flow path 202. Next, the refrigerant flows from the fourth flow path 202 to the first connecting flow path 203. Then, the refrigerant separates from the first connecting flow path 203 and flows to the second flow path 204 and the first flow path 205. Next, the refrigerant flows from the second flow path 204 and the first flow path 205 to the second connecting flow path 206. The refrigerant flowing through the second flow path 204 and the first flow path 205 merges in the second connecting flow path 206. Next, the refrigerant flows from the second connecting flow path 206 to the first flow path piece 207A of the third flow path 207. Next, the refrigerant flows from the first flow path piece 207A to the third flow path piece 207C via the second flow path piece 207B. Next, the refrigerant flows from the third flow path piece 207C to the discharge flow path 208. The refrigerant flowing through the discharge flow path 208 is discharged to the outside. In this way, the refrigerant circulates within the cooling module 200. The refrigerant supplied from the supply port flows through the flow path and exits from the discharge port, thus ensuring a continuous flow of cold refrigerant through the flow path.

[0087] <Configuration of electrical components within the housing>

[0088] Semiconductor modules 12U, 12V, and 12W are each sealed by a sealing member 14. Each semiconductor module 12U, 12V, and 12W has two main surfaces 14A and a side surface connecting the two main surfaces 14A. The length between the two main surfaces 14A is sometimes referred to as the thickness of the semiconductor modules 12U, 12V, and 12W. The three semiconductor modules 12U, 12V, and 12W are arranged in the flow path forming section 177 such that the main surfaces 14A of the sealing member 14 overlap with the second forming section 187. The three semiconductor modules 12U, 12V, and 12W are thermally connected to the flow path forming section 177. Alternatively, the semiconductor modules 12U, 12V, and 12W may be described as having a thickness in the Z direction.

[0089] As an example, the three semiconductor modules 12U, 12V, and 12W are arranged from the fourth sidewall 172D toward the second sidewall 172B in the order of U-phase semiconductor module 12U, V-phase semiconductor module 12V, and W-phase semiconductor module 12W. However, their arrangement order is not limited to this. As sides, the semiconductor modules 12U, 12V, and 12W have a first sidewall 14B on the side of the smoothing capacitor 20 and a second sidewall 14C on the side of the motor connector 140.

[0090] A high-potential input terminal 11A, a low-potential input terminal 11B, and a signal terminal 11D are exposed from the first side panel 14B. The high-potential input terminal 11A and the low-potential input terminal 11B extend toward the smoothing capacitor 20 in the X direction. The signal terminal 11D has a first extension 11E extending toward the smoothing capacitor 20, and a second extension 11F extending from the front end of the first extension 11E toward the control board 15. For example, the first extension 11E extends in the X direction. The second extension 11F extends in the Z direction. A motor terminal 11C is exposed from the second side panel 14C. The motor terminal 11C extends toward the motor connector 140 in the X direction.

[0091] The motor connector 140 has a connecting bus 130 and a sealing resin for sealing the connecting bus 130. One end of the connecting bus 130 is electrically and mechanically connected to the motor terminal 11C via bolts or similar means. The connecting bus 130 extends outward through the motor connector mounting hole 182 into the receiving space. The other end of the connecting bus 130 is connected to the winding of the corresponding motor 4.

[0092] The smoothing capacitor 20 is housed in the recess 176 of the main body 170. Viewed from above, the semiconductor modules 12U, 12V, 12W and the smoothing capacitor 20 are arranged in the housing 160 in the X direction. The upper surface 20A of the smoothing capacitor 20 facing the control substrate 15 is positioned closer to the control substrate 15 in the Z direction than the main surface 14A of the semiconductor modules 12U, 12V, 12W facing the control substrate 15. Furthermore, as an example, the smoothing capacitor 20 is positioned such that the second end face 25 of the capacitor element 21 faces the bottom of the capacitor housing 22, and the first end face 24 of the capacitor element 21 faces the opening of the capacitor housing 22. The main surface 14A is sometimes referred to as the first upper surface. The upper surface 20A is sometimes referred to as the second upper surface.

[0093] like Figure 3 As shown, in the smoothing capacitor 20, one end of a first terminal 24A and one end of a second terminal 24B are provided on the first end face 24. The first terminal 24A extends toward the busbar insertion hole 181 in the Y direction. The second terminal 24B extends toward the semiconductor modules 12U, 12V, and 12W in the X direction. One end of a third terminal 25A and one end of a fourth terminal 25B are provided on the second end face 25. The third terminal 25C extends along the bottom and side surfaces of the capacitor element 21 and then extends toward the busbar insertion hole 181 in the Y direction. The fourth terminal 25B extends along the bottom and side surfaces of the capacitor element 21 and then extends toward the semiconductor modules 12U, 12V, and 12W in the X direction. One end of the high-potential side second connection portion 112 is connected to the other end of the first terminal 24A. The high-potential side input terminal 11A is connected to the other end of the second terminal 24B. One end of the low-potential side second connection portion 122 is connected to the other end of the third terminal 25A. The other end of the low-potential side input terminal 11B is connected to the fourth terminal 25B.

[0094] A noise filter 70 is disposed on the opposite side of semiconductor modules 12U, 12V, and 12W, across the flow path forming portion 177. The noise filter 70 is fixed to the outer bottom surface 171B of the flow path forming portion 177. The noise filter 70 overlaps with the flow path forming portion 177 in the Z direction and with the connecting portion 175 in the X direction. The noise filter 70 is disposed in the overlapping region where the projection area of ​​the flow path forming portion 177 in the Z direction overlaps with the projection area of ​​the connecting portion 175 in the X direction. In this embodiment, more precisely, the noise filter 70 overlaps entirely with the flow path forming portion 177 in the X direction. Alternatively, the noise filter 70 may not overlap entirely with the flow path forming portion 177 in the X direction.

[0095] As an example, in the noise filter 70, the Y capacitor 30 is positioned adjacent to the busbar insertion hole 18 in the X direction, and the magnetic core 60 is adjacent to the motor connector configuration hole 182 in the X direction. Both the Y capacitor 30 and the magnetic core 60 are fixed to the outer bottom surface 171B of the flow path forming part 177.

[0096] The other ends of the second connecting portions 112 and 122 are connected to one end of the Y capacitor 30. The second connecting portions 112 and 122 extend toward the busbar insertion hole 181 and pass through the busbar insertion hole 181 to be electrically connected to terminals 24A and 24B. The first connecting portions 111 and 121 are connected to the other end of the Y capacitor 30. The first connecting portions 111 and 121 extend toward the terminal block mounting hole 183. The terminal block 150 passes through the terminal block mounting hole 183. The terminal block 150 has the first connecting portions 111 and 121 and a sealing resin that seals the first connecting portions 111 and 121.

[0097] One end of the first connecting portions 111 and 121 is electrically and mechanically connected to the other end of the second connecting portions 112 and 122 via bolts or similar means. The first connecting portions 111 and 121 extend into the housing space through the terminal block mounting hole 183 and the sealing resin. The other end of the first connecting portions 111 and 121 is electrically connected to the battery connector 2A connected to the battery 2 inside the housing space. In addition, the magnetic core 60 is configured to annularly cover the portion of the first connecting portions 111 and 121 between the connection portion with the Y capacitor 30 and the terminal block 150.

[0098] <Effects>

[0099] The power conversion device 10 includes semiconductor modules 12U, 12V, and 12W, a noise filter 70, a smoothing capacitor 20, a high-potential side bus 110, a low-potential side bus 120, a housing 160, and a cooler 240. The semiconductor modules 12U, 12V, and 12W have a thickness in the Z direction and have signal terminals 11D extending in the Z direction and connected to a control board 15. The smoothing capacitor 20 is electrically connected to the semiconductor modules 12U, 12V, and 12W. The smoothing capacitor 20 is connected to the battery 2 via the high-potential side bus 110 and the low-potential side bus 120. The noise filter 70 is electrically or magnetically connected to the high-potential side bus 110 and the low-potential side bus 120. More specifically, the noise filter 70 is electrically or magnetically connected to first connection portions 111 and 121 and second connection portions 112 and 122.

[0100] The housing 160 has a bottom 171 that is thermally connected to the semiconductor modules 12U, 12V, 12W, the noise filter 70, and the smoothing capacitor 20. A cooler 240 cools the semiconductor modules 12U, 12V, and 12W. The bottom 171 has an inner bottom surface 171A on the control substrate 15 side and an outer bottom surface 171B on its back side. The bottom 171 has a flow path forming portion 177, a lower bottom 173, and a connecting portion 175. The lower bottom 173 is located further away from the control substrate 15 in the Z direction than the flow path forming portion 177. The connecting portion 175 connects the flow path forming portion 177 and the lower bottom 173. The flow path forming portion 177 internally includes: a second flow path 204 provided on the semiconductor modules 12U, 12V, and 12W side; a third flow path 207 provided on the noise filter 70 side; and a base portion 211 separating these flow paths. Semiconductor modules 12U, 12V, and 12W are sandwiched between the cooler 240 and the flow path forming section 177.

[0101] The entire bottom 171 is cooled by a refrigerant. More specifically, the flow path forming section 177 and the lower bottom 173 are cooled by a refrigerant. The heat from the semiconductor modules 12U, 12V, and 12W is dissipated to the inner bottom surface 171A of the flow path forming section 177 and the cooler 240. The heat from the noise filter 70 is dissipated to the outer bottom surface 171B of the flow path forming section 177. The heat from the smoothing capacitor 20 is dissipated to the inner bottom surface 171A of the lower bottom 173. Furthermore, since the semiconductor modules 12U, 12V, and 12W are disposed near the control board 15 when in the flow path forming section 177, the connection between the signal terminal 11D and the control board 15 can be well maintained, even if vibration occurs during use. While maintaining the connection between the signal terminal 11D and the control board 15, the three components—the semiconductor modules 12U, 12V, 12W, the smoothing capacitor 20, and the noise filter 70—can efficiently dissipate heat to the bottom 171. Furthermore, the semiconductor modules 12U, 12V, and 12W, which are the main heat-generating components, can dissipate heat from both sides, thus enabling efficient cooling of the semiconductor modules 12U, 12V, and 12W. In addition, the dead space between the flow path forming section 177 and the control substrate 15 can be reduced, suppressing the increase in size in the Z direction.

[0102] In this embodiment, the noise filter 70 includes a Y capacitor 30 and a magnetic core 60. The Y capacitor 30 and the magnetic core 60 remove noise components caused by the current flowing in the first connection portions 111, 121 and the second connection portions 112, 122. This suppresses radiated noise from the first connection portions 111, 121 and the second connection portions 112, 122. The propagation of radiated noise to the semiconductor modules 12U, 12V, 12W and the control board 15 is also suppressed.

[0103] The power conversion device 10 also includes a heat dissipation member 80 with a higher thermal conductivity than air. In this embodiment, the heat dissipation member 80 is disposed between the noise filter 70 and the outer bottom surface 171B of the flow path forming portion 177, and between the smoothing capacitor 20 and the inner bottom surface 171A of the lower bottom 173. As a result, the heat from the noise filter 70 and the smoothing capacitor 20 can be efficiently dissipated to the bottom 171.

[0104] In the X direction, the noise filter 70 overlaps entirely with the connecting portion 175. In other words, the noise filter 70 is disposed entirely within the projection area of ​​the connecting portion 175 in the X direction. As a result, it is possible to suppress the increase in the size of the power conversion device 10 in the Z direction.

[0105] A busbar insertion hole 181 is formed in the continuous portion 178, penetrating the inner bottom surface 171A and the outer bottom surface 171B. The busbar insertion hole 181 is a hole through which the second connecting portions 112 and 122 pass. The busbar insertion hole 181 is not formed between the semiconductor modules 12U, 12V, 12W and the smoothing capacitor 20 in the X direction. In addition, a heat dissipation member 80 is provided between the connecting portion 175 and the smoothing capacitor 20. The connecting portion 175 and the smoothing capacitor 20 are in close contact via the heat dissipation member 80. As a result, the heat of the smoothing capacitor 20 can be efficiently dissipated to the connecting portion 175. Furthermore, it is possible to suppress the increase in the size of the power conversion device 10 in the X direction. It is also possible to suppress the complexity of the shape of the lower base 173.

[0106] The power conversion device 10 has two connecting pipes 220 and 230 connected to the first forming section 184. The flow path forming section 177 has a fourth flow path 202 that is not continuous with the third flow path 207 and supplies refrigerant first. The first connecting pipe 220 internally includes a first connecting flow path 203 that communicates with the first flow path 205, the second flow path 204, and the fourth flow path 202. Thus, heat from the semiconductor modules 12U, 12V, and 12W is dissipated to both the refrigerant flowing in the first flow path 205 and the refrigerant flowing in the second flow path 204. This allows for efficient heat dissipation from the semiconductor modules 12U, 12V, and 12W.

[0107] The second connecting pipe 230 internally includes a second connecting flow path 206 communicating with the first flow path 205, the second flow path 204, and the third flow path 207. The flow path for the refrigerant flowing through the cooling semiconductor modules 12U, 12V, and 12W is positioned upstream of the third flow path 207 of the cooling noise filter 70. In the power conversion device 10, the semiconductor modules 12U, 12V, and 12W are the main heat-generating components. Because the first flow path 205 and the second flow path 204 are positioned upstream of the third flow path 207, the heat from the semiconductor modules 12U, 12V, and 12W can be dissipated efficiently.

[0108] The flow path forming section 177 includes a supply pipe 200A and a discharge pipe 200B. The supply pipe 200A is connected to the fourth flow path 202 and supplies refrigerant. The discharge pipe 200B is connected to the third flow path 207 and discharges refrigerant. The supply pipe 200A and the discharge pipe 200B are located at the edge of one end of the base section 211 in the Y direction. This allows the refrigerant inlet and outlet to be concentrated in one place. In addition, it helps to prevent the size of the flow path forming section 177 from increasing.

[0109] (Second Implementation)

[0110] Figure 9 This is a cross-sectional view of the power conversion device 10 according to the second embodiment. Semiconductor modules 12U, 12V, and 12W have a main surface 14A facing the control substrate 15. The smoothing capacitor 20 has an upper surface 20A facing the control substrate 15. In the second embodiment, the main surface 14A is positioned closer to the control substrate 15 in the Z direction than the upper surface 20A. To achieve this, in the second embodiment, for example, a smoothing capacitor 20 with a smaller dimension in the Z direction than in the first embodiment is used. Additionally, although not shown, as another method, the first end face 24 and the second end face 25 are configured to be opposite each other in the X or Y direction. According to these structures, the second embodiment also achieves the same effect as the first embodiment. Furthermore, it is possible to suppress the increase in the size of the power conversion device 10 in the Z direction.

[0111] While this disclosure has described embodiments, it should be understood that this disclosure is not limited to these embodiments or structures. This disclosure also includes various modifications and equivalent variations. Furthermore, although this disclosure discloses various combinations and methods, other combinations and methods containing only one element, more elements, or fewer elements also fall within the scope and concept of this disclosure.

[0112] (Disclosure of technical concepts)

[0113] This specification discloses several technical concepts as listed below. Some claims are sometimes set in a multiple dependent form, where a later claim alternatively references an earlier claim. Furthermore, some claims are sometimes set in a multiple dependent form, referring to another multiple dependent form. These claims set in multiple dependent forms define multiple technical concepts.

[0114] (Technical Concept 1)

[0115] A power conversion device, comprising: A semiconductor module (12U, 12V, 12W) has a thickness in one direction (Z) and has a signal terminal (11D) extending along said one direction and connected to a substrate (15). A first electrical component (20) is electrically connected to the semiconductor module; Conductive components (111, 121, 112, 122) connect the battery (2) and the first electrical component; A second electrical component (70) is electrically or magnetically connected to the conductive member; A housing (160) having a bottom (171) thermally connected to the semiconductor module, the first electrical component, and the second electrical component, the bottom including an inner bottom surface (171A) facing the substrate and an outer bottom surface (171B) located on the back side of the inner bottom surface; and Cooler (240) includes a first flow path (205) for cooling the semiconductor module. The bottom has: A first configuration unit (177) has the semiconductor module disposed on the inner bottom surface side and the second electrical component disposed on the outer bottom surface side; A second configuration unit (173) is disposed at a position more distant from the substrate in one direction than the first configuration unit, and the first electrical component is disposed on the inner bottom surface side; and The connecting part (175) connects the first configuration part and the second configuration part. The first configuration unit internally includes: A second flow path (204) is provided on the semiconductor module side; a third flow path (207) is provided on the second electrical component side; and a wall (211) separating the second flow path from the third flow path. The semiconductor module is sandwiched between the cooler and the first configuration unit.

[0116] (Technical Concept 2)

[0117] According to the power conversion device of technical concept 1, the second electrical component includes at least one of a capacitor (30) and a magnetic core (60) for removing noise flowing through the conductive member.

[0118] (Technical Concept 3)

[0119] According to the power conversion device described in technical concept 1 or 2, wherein, It also includes heat dissipation components (80) with a higher thermal conductivity than air. The heat dissipation component is disposed between the outer bottom surface of the first configuration part and the second electrical component, and between the inner bottom surface of the second configuration part and the first electrical component.

[0120] (Technical Concept 4)

[0121] According to the power conversion device described in technical concept 3, in the arrangement direction (X) of the first electrical component and the second electrical component, the second electrical component overlaps the connecting portion in its entirety.

[0122] (Technical Concept 5)

[0123] According to any one of technical concepts 1 to 4, in the power conversion device, wherein... It also has two connecting pipes (220, 230) that are connected to the first configuration unit. The first configuration unit, on the side closer to the third flow path than the wall, also has a fourth flow path (202) that is discontinuous with the third flow path and supplies refrigerant first. One of the two connecting pipes internally includes a connecting flow path (203) that connects the first flow path, the second flow path, and the fourth flow path, and supplies the refrigerant from the fourth flow path to the first flow path and the second flow path.

[0124] (Technical Concept 6)

[0125] According to the power conversion device described in technical concept 5, one of the two connecting pipes internally includes a second connecting flow path (206), which is different from the first connecting flow path, and connects the first flow path, the second flow path and the third flow path, and discharges the refrigerant from the first flow path and the second flow path to the third flow path.

[0126] (Technical Concept 7)

[0127] According to the power conversion device described in technical concept 5 or 6, it comprises: Supply pipe (200A), which is connected to the fourth flow path to supply the refrigerant; and The discharge pipe (200B) is connected to the third flow path to discharge the refrigerant. The supply pipe and the discharge pipe are provided on the same edge of the first configuration section.

[0128] (Technical Concept 8)

[0129] According to the power conversion device described in technical concept 4, wherein... A through hole (181) is provided at the bottom for the conductive member to pass through. The insertion hole is not formed between the first electrical component and the second electrical component in the arrangement direction. The heat dissipation component is also disposed between the connecting part and the first electrical component. The connecting portion is in close contact with the first electrical component via the heat dissipation member.

[0130] (Technical Concept 9)

[0131] According to any one of technical concepts 1 to 8, in the power conversion device, the second upper surface (20A) of the first electrical component facing the substrate is farther away from the substrate in one direction than the first upper surface (14A) of the semiconductor module facing the substrate.

Claims

1. A power conversion device, comprising: A semiconductor module (12U, 12V, 12W) has a thickness in one direction (Z) and has a signal terminal (11D) extending along said one direction and connected to a substrate (15). A first electrical component (20) is electrically connected to the semiconductor module; Conductive components (111, 121, 112, 122) connect the battery (2) and the first electrical component; A second electrical component (70) is electrically or magnetically connected to the conductive member; A housing (160) having a bottom (171) thermally connected to the semiconductor module, the first electrical component, and the second electrical component, the bottom including an inner bottom surface (171A) facing the substrate and an outer bottom surface (171B) located on the back side of the inner bottom surface; and A cooler (240) includes a first flow path (205) for cooling the semiconductor module. The bottom has: A first configuration unit (177) has the semiconductor module disposed on the inner bottom surface side and the second electrical component disposed on the outer bottom surface side; The second configuration unit (173) is disposed at a position that is farther away from the substrate in one direction than the first configuration unit, and the first electrical component is disposed on the inner bottom surface side; as well as The connecting part (175) connects the first configuration part and the second configuration part. The first configuration unit internally includes: a second flow path (204) disposed on the semiconductor module side; A third flow path (207) disposed on the side of the second electrical component; and a wall (211) separating the second flow path from the third flow path. The semiconductor module is sandwiched between the cooler and the first configuration unit.

2. The power conversion device according to claim 1, characterized in that, The second electrical component includes at least one of a capacitor (30) and a magnetic core (60) for removing noise flowing through the conductive member.

3. The power conversion device according to claim 2, characterized in that, It also includes heat dissipation components (80) with a higher thermal conductivity than air. The heat dissipation component is disposed between the outer bottom surface of the first configuration part and the second electrical component, and between the inner bottom surface of the second configuration part and the first electrical component.

4. The power conversion device according to claim 3, characterized in that, In the arrangement direction (X) of the first electrical component and the second electrical component, the second electrical component overlaps entirely with the connecting portion.

5. The power conversion device according to any one of claims 1 to 4, characterized in that, It also has two connecting pipes (220, 230) that are connected to the first configuration unit. The first configuration unit also has a fourth flow path (202) that is discontinuous with the third flow path and supplies refrigerant first on the side closer to the third flow path than the wall. One of the two connecting pipes internally includes a connecting flow path (203) that connects the first flow path, the second flow path, and the fourth flow path, and supplies the refrigerant from the fourth flow path to the first flow path and the second flow path.

6. The power conversion device according to claim 5, characterized in that, The other of the two connecting pipes internally includes a second connecting flow path (206), which is different from the first connecting flow path, and connects the first flow path, the second flow path and the third flow path, and discharges the refrigerant from the first flow path and the second flow path to the third flow path.

7. The power conversion device according to claim 6, characterized in that, have: Supply pipe (200A), which is connected to the fourth flow path to supply the refrigerant; and The discharge pipe (200B) is connected to the third flow path to discharge the refrigerant. The supply pipe and the discharge pipe are provided on the same edge of the first configuration section.

8. The power conversion device according to claim 4, characterized in that, A through hole (181) is provided at the bottom for the conductive member to pass through. The insertion hole is not formed between the first electrical component and the second electrical component in the arrangement direction. The heat dissipation component is also disposed between the connecting part and the first electrical component. The connecting portion is in close contact with the first electrical component via the heat dissipation member.

9. The power conversion device according to any one of claims 1 to 4, characterized in that, Compared to the first upper surface (14A) of the semiconductor module facing the substrate, the second upper surface (20A) of the first electrical component facing the substrate is farther away from the substrate in one direction.

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