Laser press bonding apparatus and method

Abstract

A laser press bonding method is provided, including: placing a substrate on a carrier; preheating a press head to at least a predetermined temperature; placing an electronic component on the substrate via a solder material by the preheated press head; pressing the electronic component against the substrate by the preheated press head; and irradiating a laser beam from a laser source through the preheated press head to the substrate to bond the electronic component to the substrate via the solder material.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to laser pressure bonding apparatus and methods. Background Technology

[0002] Laser compression bonding (LCB), or welding process, has been used to replace conventional large-scale reflow soldering processes for forming semiconductor packages because thermal stress within the semiconductor package can be reduced during laser compression bonding. However, LCB tooling is typically made of transparent materials with low thermal conductivity and high heat capacity, such as sapphire. During the bonding process, heat can accumulate in the LCB tooling and may unnecessarily raise the temperature of the LCB tooling, which can affect warpage within the semiconductor package.

[0003] Existing patents propose several methods to cool LCB tools by dissipating the heat accumulated within them to the external environment, thereby reducing warpage problems caused by heat buildup. For example, patent publication KR1020140093086 discloses a cooling device, such as a cooling blower hole formed in the LCB tool. The LCB tool is cooled by air supplied through the cooling blower hole during the bonding process. However, due to the properties of the materials used in LCB tools, such as low thermal conductivity, the cooling of the LCB tool is not very effective. Therefore, the temperature of the LCB tool may increase depending on the number of LCB cycle processes, which is undesirable.

[0004] Therefore, a new laser pressure bonding device and method are needed. Summary of the Invention

[0005] The purpose of this application is to provide a laser pressure bonding method and apparatus to address undesirable temperature variations during the implementation of the LCB process.

[0006] According to one aspect of this application, a laser pressure bonding method is provided. The laser pressure bonding method includes: placing a substrate on a carrier; preheating a pressure head to at least a predetermined temperature; placing an electronic component on the substrate via the preheated pressure head and a bonding material; pressing the electronic component against the substrate via the preheated pressure head; and irradiating the substrate with a laser beam from a laser source through the preheated pressure head to bond the electronic component to the substrate via the bonding material.

[0007] According to another aspect of this application, a laser pressure bonding apparatus is provided. The apparatus includes: a carrier for placing a substrate, wherein electronic components are placed on the substrate via a bonding material; a pressure head for pressing the electronic components against the substrate via the bonding material; a heating platform for placing a dummy component and for heating the pressure head via the dummy component when the pressure head is placed on the heating platform via the dummy component; and a laser source for irradiating the heating platform with a laser beam through the pressure head to preheat the pressure head to at least a predetermined temperature, and for irradiating the carrier with the laser beam through the preheated pressure head after the pressure head has been preheated, so as to bond the electronic components to the substrate via the bonding material when the electronic components are pressed against the substrate.

[0008] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and do not limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with this specification, serve to explain the principles of the invention. Attached Figure Description

[0009] The accompanying drawings, which are referenced herein, form part of this specification. The features shown in the drawings are merely illustrative of some embodiments of this application, and not all embodiments of this application, unless the specific embodiments clearly indicate otherwise, and the reader of this specification should not infer the contrary.

[0010] Figure 1 The temperature changes of a conventional LCB tool and the electronic components carried by a conventional LCB tool are shown under different conditions.

[0011] Figures 2a to 2d A laser pressure bonding method according to an embodiment of this application is shown.

[0012] Figures 3a to 3b A laser pressure bonding apparatus according to an embodiment of this application is shown.

[0013] Figures 4a to 4c The illustration shows the temperature changes of an LCB tool and the electronic components carried by the LCB tool under different conditions, according to embodiments of this application.

[0014] Throughout the accompanying drawings, the same reference numerals will be used to refer to the same or similar parts. Specific Implementation

[0015] The following detailed description of exemplary embodiments of this application takes into account the accompanying drawings, which form a part of this specification. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art can further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiments of this application.

[0016] In this application, unless otherwise specified, the use of the singular includes the plural. In this application, unless otherwise specified, the use of "or" means "and / or". Furthermore, the use of the term "including" and other forms such as "includes" and "included" is not restrictive. Additionally, unless otherwise explicitly stated, terms such as "element" or "component" cover both elements and components comprising a single unit and elements and components comprising more than one subunit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0017] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “above,” “over,” “upper,” “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” and “side” are used to describe the relationship between an element or feature and another element (or feature) or feature (or feature), as shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein are similarly interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or there may be an intermediary element.

[0018] As previously mentioned, laser pressure bonding (LCB) tools are typically made of transparent materials with low thermal conductivity and high heat capacity, such as quartz, fused silica, sapphire, or ZnSe. Compared to conventional metal pressure heads or tools, the thermal properties of transparent materials increase the difficulty of heating and cooling LCB tools. In particular, the inventors of this application have noted that if multiple cycles of the LCB process are performed using the same LCB tool, the LCB tool may experience a slow and continuous temperature rise.

[0019] Figure 1This illustrates the temperature variations of a conventional LCB tool and the electronic components it carries under different conditions. For example... Figure 1 As shown, curve 12 depicts the temperature at the LCB tool surface increasing from approximately 30°C to 68°C before bonding, after 12 cycles of the LCB process; curve 14 depicts the peak temperature at the LCB tool surface increasing from approximately 130°C to approximately 180°C during bonding; curve 16 depicts the temperature of the electronic component increasing from 143°C to 174°C before bonding; and curve 18 depicts the peak temperature of the electronic component increasing from 287°C to 345°C during bonding. Significant temperature variations in the LCB tool and electronic components can adversely affect the performance of the LCB tool, particularly the stability or consistency of the LCB process performed by it, as the temperature of the solder material and the devices to be bonded together may also rise, introducing unintended deviations into the bonding process performed by the LCB tool. Furthermore, unintended temperature increases may make devices handled by the LCB tool more prone to warping, potentially leading to non-wetting or other problems.

[0020] To address the aforementioned issues, a laser pressure bonding method is proposed to preheat the LCB tool to a predetermined temperature before performing the LCB process using an LCB tool such as a pressure head. Specifically, the pressure head can be heated to a saturation temperature, thus maintaining the temperature of the LCB tool within an acceptable range for subsequent LCB processes. Unlike conventional methods of cooling the LCB tool during the LCB process (which presents significant challenges in terms of heat transfer and dissipation), preheating the LCB tool is easier to implement and exhibits greater consistency in temperature control.

[0021] Figures 2a to 2d A laser pressure bonding method according to an embodiment of this application is shown.

[0022] Figure 2a The steps for preheating the pressure head to a predetermined temperature before performing LCB processes on various electronic components and substrates using the pressure head are illustrated. For example... Figure 2aAs shown, a dummy component 204 can be placed on a heating platform 202 for performing a preheating step. Furthermore, a pressure head 206 can be placed on the heating platform 202 and heated via the dummy component 204. In some embodiments, the dummy component 204 may include a dummy substrate and dummy electronic components or metal sheets on the dummy substrate for absorbing energy from a laser beam. In other words, the dummy component 204 can simulate electronic components and a substrate that are expected to be bonded together by a soldering material such as solder paste. In this case, the thermal conditions, such as heat transfer and heat capacity, of the entire system including the pressure head 202 and the dummy component 204 can be similar to the thermal conditions of a system including the pressure head 202 and the electronic components and substrate. In some other embodiments, the dummy component 204 may be formed as a single component, provided it has thermal properties similar to the combination of the substrate and electronic components to be bonded together. In some embodiments, the heating platform 202 may be preheated using a heating wire embedded within the heating platform 202.

[0023] Laser pressure bonding typically involves a pressure head and a laser source 212, which emits a laser beam toward the electronic components and substrate to be bonded together. The absorption of the laser beam's energy causes a temperature rise in the pressure head 206. In other words, the laser source 212 also heats the pressure head 206. Therefore, in addition to the heating platform 202, the laser source 212 can also be used as a preheating device for the pressure head 206. Specifically, the laser source 212 can irradiate the heating platform 202 through the pressure head 206. The energy of the laser beam can be absorbed by the dummy component 204 and converted into heat, which can then be transferred to the pressure head 206. Therefore, the pressure head 206 can be heated by both the laser source 212 and the heating platform 202.

[0024] Figure 2b The temperature change of the pressure head over time during the preheating step is shown. Before the preheating step, the pressure head is close to room temperature, approximately 30°C. When preheating begins, the pressure head is heated by a heating platform 202, such as a heating block, for a predetermined period of time, e.g., 30 seconds, raising the temperature of the pressure head to 40°C. During this period, the laser source can be left off for preheating. After this, for a period of time, platform heating and laser heating can be performed simultaneously on the pressure head. For example, the laser source can be repeatedly switched on to apply pulsed or cyclic heating to the pressure head. Figure 2b As shown, the pulsed or cyclic heating process can be repeated 10 times or 10 cycles. Specifically, laser heating by the laser source is turned on for 10 seconds, followed by a 3-second interval during which the laser source is turned off and only heating by the heating platform is performed. After 10 cycles of this process, the temperature of the pressure head can rise to a predetermined temperature, which in this embodiment is approximately 125°C. Figure 2bThe saturation temperature is indicated in the image. The saturation temperature refers to the temperature at which the pressure head can be maintained under the same preheating conditions. That is, when the pressure head reaches its saturation temperature, its temperature may not change significantly even with multiple cycles of pulsed or cyclic heating from the laser source. Subsequently, the heating block and laser heating cease, allowing the pressure head to cool to a predetermined temperature, such as 60 to 70°C, preferably 65°C. The pressure head can be maintained at this predetermined temperature before the start of each heating cycle, as shown in the image. Figure 4a As shown, this will be explained in detail below. From Figure 2b As can be seen, the heating platform can continuously heat the pressure head throughout the preheating process except for the final cooling step, wherein in this embodiment, laser heating is applied intermittently during the preheating process.

[0025] After the preheating step, the pressure head reaches the desired temperature, and the laser pressure bonding method continues. For example... Figure 2c As shown, substrate 205 can be placed on carrier 203. Furthermore, electronic component 208 can be picked up by pressure head 206, for example, by attaching it to the central portion of pressure head 206. Soldering material 210 can be formed on the rear surface of electronic component 208 or on the front surface of substrate 205. Pressure head 206 is movable to place electronic component 208 onto substrate 205 via soldering material 210.

[0026] Next, as Figure 2d As shown, the laser source 212 can be moved to a position above the pressure head 206. When the electronic component 208 is in place on the substrate 205, the pressure head 206 can press the electronic component 208 against the substrate 205. Furthermore, a laser beam 214 can be emitted from the laser source 212 onto the carrier 203. The laser beam 214 can pass through the pressure head 206 to bond the electronic component 208 to the substrate 205 via the welding material 210. The emission of the laser beam 214 can be configured or adjusted based on the amount and composition of the welding material 210 to provide sufficient energy to the welding material 210, which will not be described in detail here.

[0027] In some embodiments, Figure 2a The heating platform 202 shown can be used during the bonding process. Figure 2d The carrier 203 is shown in the diagram. For example, the carrier may include a heater or heating block operable to be switched on or off in preheating and subsequent heating or bonding processes, so the carrier can be used as a heating platform in the preheating process by switching on the heater. In some other embodiments, the heating platform 202 may be a different device from the carrier 203.

[0028] Figure 3a and 3bA laser pressure bonding apparatus according to an embodiment of this application is shown. Specifically, as Figure 3a As shown, the laser pressure bonding apparatus operates in preheating mode, preheating the pressure head to saturation temperature via both the laser beam and the heating platform. Figure 3b As shown, the laser pressure bonding apparatus is in bonding mode to generate a laser beam that can be used to bond one or more electronic components, such as semiconductor chips, to a substrate, such as a printed circuit board or an interposer, by heating the solder material between the electronic components and the substrate. The solder material can be deposited onto either or both of the electronic components and the substrate prior to the bonding process. Then, during the bonding process, the solder material is melted by the energy delivered by the laser beam and subsequently solidified into solder bumps to bond the electronic components to the substrate. In addition to delivering laser energy to the solder material, the laser pressure bonding apparatus also applies pressure to the solder material to facilitate bonding between the electronic components and the substrate.

[0029] exist Figure 3a In the preheating mode shown, the pressure head 306 is placed on the heating platform 302 and heated via the dummy component 304. Preferably, a laser beam emitted from the laser source 312 can be guided through the pressure head 306 to the heating platform 302. The pressure head 306 may be made of a transparent material, such as quartz, fused silica, sapphire, or ZnSe, which has low thermal conductivity, which is detrimental to the dissipation of heat accumulated in the pressure head 306 during the laser pressure bonding process. In some embodiments, the heating platform 302 may include a temperature sensor to monitor the temperature in real time and feed it back to a control system (not shown) to precisely adjust the preheating process.

[0030] Furthermore, the material used for the heating platform is critical, as it needs to provide good thermal conductivity while remaining stable at high temperatures and resisting deformation or degradation, such as ceramics. The dummy component 304 also plays an important role in the preheating process. The dummy component 304 can be made of materials with high thermal conductivity and high light absorption, such as graphite or graphite-coated copper, to facilitate uniform and consistent heat transfer from the heating platform 302 to the pressure head 306 during the preheating process. The dummy component 304 is also designed to simulate the thermal properties of the materials used in the actual bonding process, thereby ensuring that the pressure head reaches the appropriate temperature before bonding. In addition, the dummy component 304 can be used for the calibration and optimization of the heating platform and laser source during the preheating process.

[0031] exist Figure 3bIn the bonding mode shown, a laser pressure bonding apparatus can be used to perform the bonding process. Specifically, the laser pressure bonding apparatus includes a carrier 303, such as a carrier platform for placing a substrate 305, and a preheated pressure head 306 that can carry and move an electronic component 308 to be bonded to the substrate 305. Specifically, the pressure head 306 may include a rear surface on which the electronic component 308 is attached. When the pressure head 306 moves the electronic component 308 onto the substrate 305 via the bonding material 310, the rear surface may face the substrate 305 and the carrier 303 below it. In some examples, the electronic component 308 may have a first set of conductive patterns, such as contact pads, on its rear surface, and the substrate 305 may have a second set of conductive patterns, such as contact pads, on its front surface. The layout of the second set of conductive patterns may be the same as or similar to the layout of the first set of conductive patterns of the electronic component 308. The soldering material 310 may be pre-formed on one or both of the two sets of conductive patterns, such that the soldering material 310 can bond the two sets of conductive patterns together during the bonding process, and thus electrically and mechanically connect the electronic component 308 to the substrate 305. In some embodiments, the electronic component 308 may be a semiconductor chip, while in some other embodiments, the electronic component 308 may be a semiconductor package or other similar device or module.

[0032] exist Figure 3b In the embodiment shown, the pressure head 306 has a convex rear surface. Specifically, compared to the rear surface in the peripheral portion 306b surrounding the central portion 306a, the rear surface of the pressure head 306 in the central portion 306a (i.e., the location where the electronic component 308 is attached) is lower and closer to the carrier 303. In this case, when the pressure head 306 presses the electronic component 308 against the substrate 305 via the soldering material 310, the rear surface in the central portion 306a can contact the electronic component 308, while the rear surface in the peripheral portion 306b can be further away from the substrate 305 and the carrier 303, thereby leaving sufficient space between the carrier 303 and the pressure head 306, which avoids undesirable conflicts that could contaminate or even damage the pressure head 306. However, it is understood that the pressure head 306 may have a rear surface of other shapes. For example, the rear surface of the pressure head 306 may be flat in both the central and peripheral portions.

[0033] In some embodiments, at least one through-hole 322 may be formed in the pressure head 306, the through-hole 322 passing through the central portion 306a to apply vacuum pressure to the electronic component 308, thereby securely holding the electronic component 308. For example, a vacuum source may be fluidly coupled to the through-hole 322 to supply vacuum pressure. The vacuum pressure may be applied during the movement of the electronic component 308 with the pressure head 306, but may be released when the electronic component 308 is in place on the substrate 305, for example during a bonding process.

[0034] The pressure head 306 may be mechanically coupled to a driver or actuator (not shown) that can automatically move the pressure head 306 under the control of a controller, host device, or server, or manually move the pressure head under the control of a user. Furthermore, when the electronic component 308 is placed on the substrate 305 via the solder material 310, the driver or actuator can apply force to the pressure head 306, which in turn provides pressure at the solder material 310 to assist the bonding process.

[0035] Still referencing Figure 3b The laser source 312 generates a laser beam 314 to provide laser energy for reflow soldering of the welding material 310. Specifically, the laser source 312 is positioned above the pressure head 306 and facing the front surface of the pressure head 306. During the laser pressure bonding process, the laser beam 314 is emitted from the laser source 312 toward the carrier 303, passing at least through the central portion 306a of the pressure head 306 to heat the welding material 310. The laser source 312 can apply sufficient laser energy to the welding material 310 during the bonding process to melt and reflow the welding material 310. When the laser source 312 is turned off, the molten welding material 310 can solidify into solder bumps between the substrate 305 and the electronic component 308. In this way, the electronic component 308 can be bonded to the substrate 305 via solder bumps after the bonding process.

[0036] Figures 4a to 4c The illustration shows the temperature changes of an LCB tool and the electronic components carried by the LCB tool under different conditions, according to embodiments of this application. The LCB tool has used, for example... Figure 2a and 2b The method shown is for preheating.

[0037] like Figure 4a As shown, after a preheating process that heats an LCB tool, such as a pressure head, to its saturation temperature, the pressure head can be cooled down to 67°C. The temperature change of the pressure head from second 0 to second 200 corresponds to the pressure head at... Figure 2b The process involves a preheating process to reach saturation temperature. Then, 12 cycles of laser heating are executed from the 200th to the 800th second. During each laser heating cycle, the temperature of the pressure head may initially rise as the laser source is turned on, and then decrease as the laser source is turned off. However, the temperature changes within all cycles are essentially the same.

[0038] Figure 4b and 4cThe temperature changes of the pressure head and the electronic components are shown separately. It can be seen that the pressure head temperature changes by only 4.1°C before bonding, and the electronic component temperature changes by only 3°C. Therefore, the pressure head temperature can be maintained substantially the same at the beginning of each bonding cycle, and all electronic components processed by the laser pressure bonding device can experience similar temperature profiles, thereby improving the reliability of the bonding process.

[0039] As mentioned above, the pressure head reaches its saturation temperature after being heated by both the laser beam and the heating platform. The saturation temperature is affected by the material and size of the pressure head, as well as the heating method and parameters, or other factors. In the above embodiment, the saturation temperature of the pressure head is approximately 120°C to 130°C, preferably approximately 125°C. Correspondingly, the temperature of the heating platform can be maintained at, for example, 120°C to 130°C or slightly higher. In the example, during the preheating process, the laser source power is 140W, and it has a diameter of 19×17mm. 2 The beam size.

[0040] Specifically, the preheating process rapidly raises the pressure head temperature to a higher, stable state to achieve thermal equilibrium. In contrast, conventional LCB methods do not employ a preheating step, preventing the pressure head from achieving thermal equilibrium before the bonding process, resulting in a continuous temperature rise during subsequent bonding cycles. Furthermore, a preheated pressure head retains more heat compared to one that has not undergone this preheating process, meaning it is better resistant to external temperature variations and maintains temperature stability. Additionally, the preheating process improves the heat distribution within the pressure head, which helps prevent unwanted thermal stress caused by uneven heat distribution within the substrate handled by the pressure head.

[0041] As mentioned above, the inventors further analyzed the temperature changes during the laser 'on' and 'off' cycles of the preheating step to determine when the pressure head temperature could saturate. Specifically, if the temperature increment from one cycle to the end of the next cycle was less than 2%, or the temperature increment within three cycles was less than 5% (e.g., in...), the temperature could saturate. Figure 2b From the temperature change between the 130th and 160th seconds, it can be concluded that after an appropriate number of heating cycles, the pressure head and electronic components can experience the same heating or temperature profile before and during the bonding process.

[0042] The discussion herein includes numerous illustrative figures illustrating various parts of a laser pressure bonding apparatus and the laser pressure bonding method implemented therethrough. For clarity, such figures do not show all aspects of each exemplary method. Any example method provided herein may share any or all characteristics with any or all other methods provided herein.

[0043] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made to the embodiments, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of the description and practice of one or more embodiments of the invention disclosed herein. Therefore, it is intended that this application and the examples herein be considered exemplary only, wherein the true scope and spirit of the invention are indicated by the list of exemplary claims appended.

Claims

1. A laser pressure bonding method, characterized in that, The method includes: Place the substrate on the carrier; Preheat the pressure head to at least the predetermined temperature; Electronic components are placed on the substrate via soldering material using the preheated pressure head; The electronic components are pressed against the substrate by the preheated pressure head; and A laser beam is irradiated from a laser source through the preheated pressure head onto the substrate to bond the electronic components to the substrate via the welding material.

2. The laser pressure bonding method according to claim 1, characterized in that, The steps of preheating the pressure head to at least a predetermined temperature include: The pressure head is placed on the heating platform via a dummy component; and The pressure head is heated via the dummy component through the heating platform.

3. The laser pressure bonding method according to claim 2, characterized in that, The step of preheating the pressure head to at least a predetermined temperature further includes: A laser beam is emitted from the laser source through the pressure head and directed onto the heating platform.

4. The laser pressure bonding method according to claim 3, characterized in that, Irradiating a laser beam from the laser source through the pressure head onto the heating platform further includes: A laser beam is cyclically irradiated from the laser source onto the heating platform a predetermined number of times to preheat the pressure head to at least the predetermined temperature.

5. The laser pressure bonding method according to claim 4, characterized in that, The predetermined number of cyclic irradiations is equal to or greater than 5.

6. The laser pressure bonding method according to claim 3, characterized in that, The step of heating the pressure head via the dummy component through the heating platform begins before and is performed during the step of irradiating the laser beam from the laser source through the pressure head onto the heating platform.

7. The laser pressure bonding method according to claim 3, characterized in that, The dummy component includes a dummy substrate and dummy electronic components or metal sheets on the dummy substrate configured to absorb the energy of a laser beam.

8. The laser pressure bonding method according to claim 2, characterized in that, The heating platform serves as the carrier, and the carrier includes a heater operable to be switched on or off.

9. The laser pressure bonding method according to claim 1, characterized in that, The predetermined temperature is 60 to 70°C.

10. A laser pressure bonding device, characterized in that, The device includes: A carrier for holding a substrate, wherein electronic components are placed on the substrate via soldering material; A pressure head for pressing the electronic component against the substrate via the welding material; A heating platform, the heating platform being used to place a dummy component, and also for heating the pressure head via the dummy component when the pressure head is placed on the heating platform via the dummy component; and A laser source is provided for irradiating the heating platform with a laser beam through the pressure head to preheat the pressure head to at least a predetermined temperature, and is also used to irradiate the carrier with a laser beam through the preheated pressure head after the pressure head has been preheated, so as to bond the electronic components to the substrate via the welding material when the electronic components are pressed against the substrate.

11. The laser pressure bonding apparatus according to claim 10, characterized in that, The laser source is also used to circulate a laser beam from the laser source onto the heating platform a predetermined number of times to preheat the pressure head to at least the predetermined temperature.

12. The laser pressure bonding apparatus according to claim 11, characterized in that, The predetermined number of cycles is equal to 10 cycles, to preheat the pressure head to 120°C to 130°C, and the pressure head is allowed to continue cooling to the predetermined temperature.

13. The laser pressure bonding apparatus according to claim 11, characterized in that, The predetermined number of cycles is equal to or greater than 3, so that the pressure head is directly heated to the predetermined temperature.

14. The laser pressure bonding apparatus according to claim 10, characterized in that, The laser source is also used to irradiate a laser beam through the pressure head onto the heating platform after the heating platform begins to heat the pressure head via the dummy component.

15. The laser pressure bonding apparatus according to claim 10, characterized in that, The dummy component includes a dummy substrate and dummy electronic components or metal sheets on the dummy substrate configured to absorb the energy of a laser beam.

16. The laser pressure bonding apparatus according to claim 10, characterized in that, The heating platform serves as the carrier, and the carrier includes a heater operable to be switched on or off.

17. The laser pressure bonding apparatus according to claim 10, characterized in that, The predetermined temperature is 60 to 70°C.

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