A manufacturing process of pollution-free electronic circuit board

Abstract

This invention relates to a pollution-free electronic circuit board manufacturing process. In the first protective layer coating step, a protective coating is applied to the substrate and dried to form a first protective film. In the substrate copper plating step, a copper base layer is formed on the first protective film through chemical copper plating. In the substrate copper circuit formation step, patterned electroplating is performed on the copper base layer to form copper circuits. In the substrate second protective layer coating step, a protective coating is applied to the copper circuits, and after drying, a second protective film is formed. In the substrate etching step, the copper circuits protected by the second protective film are retained, while the remaining copper layer is etched away. In the copper circuit repair step, copper paste is brushed onto the surface of the retained copper circuits. In the drying and strengthening step, the copper circuits with the applied copper paste are dried. In the polishing and grinding step, the surface of the dried copper circuits is polished and ground. This pollution-free electronic circuit board manufacturing process has minimal environmental pollution.

Description

Technical Field

[0001] This invention relates to the field of electronic circuit board processing, and in particular to a pollution-free manufacturing process for electronic circuit boards. Background Technology

[0002] A PCB, or Printed Circuit Board, is a crucial component of the electronics industry. Almost every electronic device, from small items like watches and calculators to large systems like computers, communication devices, and military weaponry, utilizes PCBs to enable electrical interconnection between integrated circuits and other electronic components. A PCB consists of an insulating substrate, connecting wires, and solder pads for mounting and soldering electronic components, serving the dual function of conductive lines and an insulating base. Circuit boards replace complex wiring, simplifying the assembly and soldering of electronic products, reducing the workload of traditional wiring methods, and significantly alleviating the labor intensity of workers. Furthermore, PCBs reduce the overall size of the device, lower product costs, and improve the quality and reliability of electronic equipment.

[0003] However, traditional plastic materials, such as the technical solutions disclosed in the patent application number CN201610059734.6 entitled "A Composite Plastic Material and Its Preparation Method", result in plastic parts made from plastic materials with low structural strength and poor structural stability. Summary of the Invention

[0004] Therefore, it is necessary to provide a pollution-free manufacturing process for electronic circuit boards to address the technical problems of low structural strength and poor structural stability of plastic parts made of traditional plastic materials.

[0005] A pollution-free manufacturing process for electronic circuit boards, the process comprising the following steps: Substrate cutting step: Cut the raw material board into a substrate of the preset shape and size; Substrate deburring step: Polish and grind the area around the substrate to remove the burrs formed during cutting. Substrate cleaning steps: Remove dust and impurities from the substrate surface; First protective layer coating step for substrate: A protective coating is applied to the substrate and dried to form the first protective film; Copper plating step on substrate: A copper base layer is formed on the first protective film by chemical copper plating; Steps for forming copper circuits on a substrate: Pattern electroplating is performed on a copper substrate to form copper circuits; The second protective layer coating process for the substrate involves coating a protective coating onto the copper lines and drying it to form a second protective film. Substrate etching step: The substrate is placed in an etching solution for etching, so that the copper lines protected by the second protective film are retained, while the rest of the copper layer is etched away. Copper trace restoration steps: Apply copper paste to the surface of the preserved copper traces; Drying and strengthening step: Dry the copper circuit with copper paste applied. Polishing and grinding steps: Polish and grind the surface of the dried copper circuit. Substrate drilling steps; Drilling positioning holes and mounting holes on the substrate; Substrate cleaning steps: Clean the substrate after drilling with a cleaning solution. Solder resist coating: Solder resist ink is applied to the surface of the polished copper circuit and dried to form a solder resist ink layer. Character printing steps: Print characters on the back of the substrate and then dry them.

[0006] In one embodiment, during the substrate cleaning step, a high-pressure jet gun is used to blow away dust and impurities from the substrate surface.

[0007] In one embodiment, during the solder resist ink coating, the drying temperature is 50 to 70 degrees Celsius, and the drying time is 20 to 40 minutes.

[0008] In one embodiment, the solder resist ink coating is dried at a temperature of 60 degrees Celsius for 30 minutes.

[0009] In one embodiment, during the character printing step, the drying temperature is 60 to 80 degrees Celsius, and the drying time is 30 to 40 minutes.

[0010] In one embodiment, during the character printing step, the drying temperature is 70 degrees Celsius and the drying time is 35 minutes.

[0011] In one embodiment, during the first protective layer coating step of the substrate, the drying temperature is 40 to 50 degrees Celsius and the drying time is 20 to 30 minutes.

[0012] In one embodiment, during the second protective layer coating step of the substrate, the drying temperature is 40 to 50 degrees Celsius and the drying time is 20 to 30 minutes.

[0013] In one embodiment, in the substrate cleaning step, high-pressure airflow is first used to blow off debris from the substrate, and then cleaning solution is used to clean the substrate.

[0014] In one embodiment, during the substrate drilling step, a lubricant is used to lubricate and dissipate heat from the drill bit. In the aforementioned pollution-free electronic circuit board manufacturing process, a substrate of a predetermined shape and size is obtained through a substrate cutting step. A substrate deburring step removes burrs around the substrate. A substrate cleaning step removes dust and impurities from the substrate surface. A first protective layer coating step coats a protective coating onto the substrate, which, after drying, forms a first protective film. A copper plating step forms a copper base layer on the first protective film using chemical copper plating. A copper circuit formation step forms copper circuits on the copper base layer through pattern electroplating. A second protective layer coating step coats a protective coating onto the copper circuits, which, after drying, forms a second protective film. A substrate etching step preserves the copper circuits protected by the second protective film, while the remaining copper layer is etched away. A copper circuit completion step applies copper paste to the surface of the preserved copper circuits. A drying and strengthening step dries the copper circuits coated with copper paste. A polishing step polishes the surface of the dried copper circuits. A substrate drilling step drills positioning holes and mounting holes on the substrate. A substrate cleaning step cleans the drilled substrate. Solder resist ink is applied to the polished copper circuit surface and dried to form a solder resist ink layer. Characters are then printed on the back of the substrate using a character printing step, followed by drying. This pollution-free electronic circuit board manufacturing process is simple, sophisticated, easy to control, highly environmentally friendly, and causes minimal environmental pollution. Attached Figure Description

[0015] Figure 1 This is a schematic flowchart of the manufacturing process of a pollution-free electronic circuit board in one embodiment. Detailed Implementation

[0016] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0017] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0018] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0019] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0020] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] Please see Figure 1 This invention provides a pollution-free manufacturing process for electronic circuit boards, the process comprising the following steps: Step 101: Substrate cutting step: Cut the raw material board into a substrate of the preset shape and size.

[0022] Specifically, cutting equipment is used to cut the circuit board substrate raw material into a substrate of a predetermined shape and size.

[0023] Step 102: Substrate Deburring Step: Polish and grind the perimeter of the substrate to remove the burrs formed during cutting. Use polishing equipment to polish the perimeter of the substrate to remove the burrs formed during cutting.

[0024] Step 103: Substrate cleaning step: Clean the dust and impurities from the surface of the substrate.

[0025] Specifically, in this embodiment, a high-pressure jet gun is used to blow away dust and impurities from the substrate surface.

[0026] Step 104: First protective layer coating step: A protective coating is applied to the substrate, and after drying, a first protective film is formed.

[0027] Specifically, a protective coating is applied to the substrate, and after drying, a first protective film is formed on the substrate. Further, the drying temperature is 40 to 50 degrees Celsius, and the drying time is 20 to 30 minutes.

[0028] Step 105: Copper plating on substrate: A copper base layer is formed on the first protective film by chemical copper plating.

[0029] Specifically, a copper base layer is formed on the first protective film through a chemical copper plating process.

[0030] Step 106: Forming copper circuits on substrate: Pattern electroplating is performed on the copper substrate to form copper circuits.

[0031] Specifically, copper circuits are formed on a copper substrate through a patterned electroplating process.

[0032] Step 107: Substrate Second Protective Layer Coating Step: A protective coating is applied to the copper circuit, and after drying, a second protective film is formed.

[0033] Specifically, a protective coating is applied to the copper circuit, and after drying, a second protective film is formed on the surface of the copper circuit. The drying temperature is 40 to 50 degrees Celsius, and the drying time is 20 to 30 minutes.

[0034] Step 108: Substrate etching step: Place the substrate into the etching solution for etching, so that the copper lines protected by the second protective film are retained, while the rest of the copper layer is etched away.

[0035] Specifically, the substrate is placed in an etching solution for etching, so that the copper traces protected by the second protective film are preserved, while the rest of the copper layer is etched away. In other words, only the copper traces are retained on the first protective film.

[0036] Step 109: Copper Circuit Repair Step: Apply copper paste to the surface of the remaining copper circuit.

[0037] It should be noted that the etching solution during the substrate etching process may cause some corrosion to the copper traces beneath the second protective film, making the surface of the copper traces rough and thus affecting their performance. Therefore, it is necessary to smooth the surface of the copper traces.

[0038] Specifically, copper paste is brushed onto the surface of the preserved copper circuitry.

[0039] Step 110: Drying and strengthening step: Dry the copper circuit with copper paste applied.

[0040] Specifically, the copper circuitry coated with copper paste undergoes a drying process. The drying temperature is between 80 and 100 degrees Celsius, and the drying time is between 30 and 50 minutes.

[0041] Step 111: Polishing and grinding: Polish and grind the surface of the dried copper circuit.

[0042] Specifically, polishing equipment is used to polish the surface of the dried copper circuit.

[0043] Step 112: Substrate drilling. Drill positioning holes and mounting holes on the substrate.

[0044] Specifically, drilling equipment is used to drill positioning holes and mounting holes on the substrate.

[0045] Step 113: Substrate cleaning step. Clean the substrate after drilling using a cleaning solution.

[0046] Specifically, use a cleaning solution to clean the substrate after drilling to remove grease and dirt from the substrate.

[0047] Step 114: Solder resist ink coating: Solder resist ink is coated onto the surface of the polished copper circuit and dried to form a solder resist ink layer.

[0048] Specifically, after polishing and grinding, a solder resist ink layer is formed by coating and drying the surface of the copper circuit. The drying temperature is 50 to 70 degrees Celsius, and the drying time is 20 to 40 minutes. Alternatively, the drying temperature is 60 degrees Celsius, and the drying time is 30 minutes.

[0049] Step 115: Character Printing Step: Print characters on the back of the substrate and then dry it.

[0050] Specifically, characters are printed on the back of the substrate, and then dried at a temperature of 60 to 80 degrees Celsius for 30 to 40 minutes. Alternatively, the drying temperature is set to 70 degrees Celsius for 35 minutes.

[0051] In the aforementioned pollution-free electronic circuit board manufacturing process, a substrate of a predetermined shape and size is obtained through a substrate cutting step. A substrate deburring step removes burrs around the substrate. A substrate cleaning step removes dust and impurities from the substrate surface. A first protective layer coating step coats a protective coating onto the substrate, which, after drying, forms a first protective film. A copper plating step forms a copper base layer on the first protective film using chemical copper plating. A copper circuit formation step forms copper circuits on the copper base layer through pattern electroplating. A second protective layer coating step coats a protective coating onto the copper circuits, which, after drying, forms a second protective film. A substrate etching step preserves the copper circuits protected by the second protective film, while the remaining copper layer is etched away. A copper circuit completion step applies copper paste to the surface of the preserved copper circuits. A drying and strengthening step dries the copper circuits coated with copper paste. A polishing step polishes the surface of the dried copper circuits. A substrate drilling step drills positioning holes and mounting holes on the substrate. A substrate cleaning step cleans the drilled substrate. Solder resist ink is applied to the polished copper circuit surface and dried to form a solder resist ink layer. Characters are then printed on the back of the substrate using a character printing step, followed by drying. This pollution-free electronic circuit board manufacturing process is simple, sophisticated, easy to control, highly environmentally friendly, and causes minimal environmental pollution.

[0052] To provide effective protection for copper traces, the solder resist ink comprises the following components in parts by weight: 10 to 20 parts acrylic resin, 15 to 30 parts epoxy resin, 1 to 2 parts dicyandiamide, 0.5 to 1 part tetraethylenetriamine, 5 to 10 parts calcium carbonate powder, 4 to 8 parts aluminum hydroxide powder, 3 to 5 parts vermiculite powder, 40 to 60 parts ethylene glycol ethyl ether, 0.5 to 1 part defoamer, 0.1 to 0.5 parts leveling agent, 0.2 to 0.8 parts dispersant, and 0.05 to 0.1 parts antioxidant. The solder resist ink composed of the above components can provide effective protection for copper traces.

[0053] To protect copper traces and substrates, the protective coating comprises the following components in parts by weight: 30 to 50 parts trimethyltoluene, 10 to 20 parts dimethylformamide, 10 to 20 parts dimethylacetamide, 15 to 20 parts polyimide, 5 to 10 parts benzocyclobutene, 0.2 to 0.8 parts defoamer, 0.2 to 0.4 parts leveling agent, and 0.1 to 0.3 parts dispersant. The protective coating composed of the above components can protect copper traces and substrates.

[0054] To improve the cleaning effect on the substrate, in one embodiment, during the substrate cleaning step, high-pressure airflow is first used to blow off debris from the substrate, followed by cleaning the substrate with a cleaning solution. The cleaning solution comprises the following components in parts by weight: 20 to 40 parts propylene glycol, 1 to 3 parts sodium citrate, 3 to 6 parts polyethylene glycol, 2 to 4 parts alkenyl succinic acid, 2 to 3 parts sodium polyacrylate, 1 to 2 parts sodium petroleum sulfonate, 0.5 to 1 part sodium dodecylbenzenesulfonate, 2 to 3 parts sodium silicate, 1 to 2 parts sodium hexametaphosphate, and 50 to 70 parts water. The cleaning solution composed of the above components can effectively remove oil and impurities from the substrate.

[0055] To prevent damage to the substrate during drilling, in one embodiment, a lubricant is used to lubricate and dissipate heat from the drill bit during the substrate drilling step. The lubricant comprises the following components in parts by weight: 15 to 35 parts ethanol, 3 to 6 parts polyethylene glycol, 1 to 3 parts diglyceride, 1 to 2 parts sodium dodecylbenzenesulfonate, 0.5 to 1 part fumed silica, and 40 to 60 parts water. This lubricant reduces friction between the drill bit and the substrate, preventing damage during drilling. The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A pollution-free manufacturing process for electronic circuit boards, characterized in that, The process includes the following steps: Substrate cutting step: Cut the raw material board into a substrate of the preset shape and size; Substrate deburring step: Polish and grind the area around the substrate to remove the burrs formed during cutting. Substrate cleaning steps: Remove dust and impurities from the substrate surface; First protective layer coating step for substrate: A protective coating is applied to the substrate and dried to form the first protective film; Copper plating step on substrate: A copper base layer is formed on the first protective film by chemical copper plating; Steps for forming copper circuits on a substrate: Pattern electroplating is performed on a copper substrate to form copper circuits; The second protective layer coating process for the substrate involves coating a protective coating onto the copper lines and drying it to form a second protective film. Substrate etching step: The substrate is placed in an etching solution for etching, so that the copper lines protected by the second protective film are retained, while the rest of the copper layer is etched away. Copper trace restoration steps: Apply copper paste to the surface of the preserved copper traces; Drying and strengthening step: Dry the copper circuit with copper paste applied. Polishing and grinding steps: Polish and grind the surface of the dried copper circuit. Substrate drilling steps; Drilling positioning holes and mounting holes on the substrate; Substrate cleaning steps: Clean the substrate after drilling with a cleaning solution. Solder resist coating: Solder resist ink is applied to the surface of the polished copper circuit and dried to form a solder resist ink layer. Character printing steps: Print characters on the back of the substrate and then dry them.

2. The process according to claim 1, characterized in that, In the substrate cleaning step, a high-pressure jet gun is used to blow away dust and impurities from the substrate surface.

3. The process according to claim 1, characterized in that, In the solder resist ink coating process, the drying temperature is 50 degrees Celsius to 70 degrees Celsius, and the drying time is 20 minutes to 40 minutes.

4. The process according to claim 3, characterized in that, In the solder resist ink coating process, the drying temperature is 60 degrees Celsius and the drying time is 30 minutes.

5. The process according to claim 1, characterized in that, In the character printing step, the drying temperature is 60 to 80 degrees Celsius, and the drying time is 30 to 40 minutes.

6. The process according to claim 5, characterized in that, In the character printing step, the drying temperature is 70 degrees Celsius and the drying time is 35 minutes.

7. The process according to claim 1, characterized in that, In the first protective layer coating step of the substrate, the drying temperature is 40 degrees Celsius to 50 degrees Celsius, and the drying time is 20 minutes to 30 minutes.

8. The process according to claim 1, characterized in that, In the second protective layer coating step of the substrate, the drying temperature is 40 degrees Celsius to 50 degrees Celsius, and the drying time is 20 minutes to 30 minutes.

9. The process according to claim 1, characterized in that, In the substrate cleaning step, high-pressure airflow is first used to blow off the debris on the substrate, and then cleaning solution is used to clean the substrate.

10. The process according to claim 1, characterized in that, In the substrate drilling step, a lubricant is used to lubricate and dissipate heat from the drill bit.

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